CN118305669A - Handling system, method and device for wafer thinning equipment and wafer thinning equipment - Google Patents
Handling system, method and device for wafer thinning equipment and wafer thinning equipment Download PDFInfo
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- CN118305669A CN118305669A CN202410518938.6A CN202410518938A CN118305669A CN 118305669 A CN118305669 A CN 118305669A CN 202410518938 A CN202410518938 A CN 202410518938A CN 118305669 A CN118305669 A CN 118305669A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本申请公开了一种用于晶圆减薄设备的搬运系统、方法、装置及晶圆减薄设备，用于晶圆减薄设备的搬运系统，包括搬运装置和控制器；搬运装置包括：基座；第一驱动组件和第二驱动组件，分别设置在基座上；吸盘，设置在基座下方，用于在第一驱动组件的驱动下，吸附磨削前的晶圆；夹持部，对称分布在吸盘的外侧，用于在第二驱动组件的驱动下夹持磨削后的晶圆；控制器用于控制第一驱动组件，以令吸盘吸附磨削前的晶圆；令搬运装置将晶圆搬运至磨削模块；控制第二驱动组件，驱动夹持部夹持磨削后的晶圆，并令搬运设备将晶圆搬出磨削模块。本申请的方案，可以尽量避免晶渣对真空吸盘造成损伤，也尽量避免了吸盘上的晶渣导致的晶圆损伤，提高了晶圆质量。
The present application discloses a handling system, method, device and wafer thinning equipment for wafer thinning equipment, the handling system for wafer thinning equipment includes a handling device and a controller; the handling device includes: a base; a first drive assembly and a second drive assembly, respectively arranged on the base; a suction cup, arranged below the base, for adsorbing the wafer before grinding under the drive of the first drive assembly; a clamping part, symmetrically distributed on the outside of the suction cup, for clamping the wafer after grinding under the drive of the second drive assembly; the controller is used to control the first drive assembly to make the suction cup adsorb the wafer before grinding; make the handling device carry the wafer to the grinding module; control the second drive assembly, drive the clamping part to clamp the wafer after grinding, and make the handling device move the wafer out of the grinding module. The scheme of the present application can avoid the damage of the vacuum suction cup caused by the crystal slag as much as possible, and also avoid the damage of the wafer caused by the crystal slag on the suction cup as much as possible, thereby improving the quality of the wafer.
Description
Technical Field
The application belongs to the technical field of wafer processing, and particularly relates to a conveying system, a method and a device for wafer thinning equipment and the wafer thinning equipment.
Background
In ultra-precise wafer thinning equipment, ultra-precise grinding, CMP and cleaning modules, thickness deviation and surface defect control technologies are mainly integrated, so that the requirements of the ultra-precise wafer thinning technology in the fields of 3D I C manufacturing, advanced packaging and the like are met.
In the ultra-precise wafer thinning apparatus, a wafer is generally transported to an adsorption device in a carry-in/out area by a transport robot, and is polished and thinned by rotating the wafer carried by the adsorption device on a turntable to a grinding processing area. The thin rotary disk is polished and then rotated again, so that the wafer is returned to the carrying-in and carrying-out area, and the wafer is carried out from the adsorption device by the carrying manipulator.
However, the wafer is generally transported by using a vacuum chuck adsorption mode, and particles such as wafer residues after grinding exist on the surface of the wafer after thinning, and the wafer residues are adsorbed to the vacuum chuck during vacuum adsorption, so that the wafer residues damage the vacuum chuck and the wafer during the wafer transportation process, thereby affecting the wafer quality and reducing the yield of wafer production.
Disclosure of Invention
The embodiment of the application provides a carrying system, a method and a device for wafer thinning equipment and the wafer thinning equipment, which aim to at least solve one of the technical problems in the prior art.
A first aspect of an embodiment of the present application provides a handling system for a wafer thinning apparatus, including a handling device and a controller; the carrying device includes: a base; the first driving assembly and the second driving assembly are respectively arranged on the base; the sucker is arranged below the base and is used for sucking the wafer before grinding under the drive of the first driving assembly; the clamping parts are symmetrically distributed on the outer sides of the suckers and are used for clamping the ground wafer under the drive of the second driving assembly; the controller is used for: controlling the first driving assembly to enable the sucker to absorb the wafer before grinding; the carrying device carries the wafer to a grinding module; and controlling the second driving assembly to drive the clamping part to clamp the ground wafer, and enabling the carrying equipment to carry the wafer out of the grinding module.
A second aspect of an embodiment of the present application provides a handling apparatus for a wafer thinning apparatus, including: a base; the first driving assembly and the second driving assembly are respectively arranged on the base; the sucker is arranged below the base and is used for sucking the wafer before grinding under the drive of the first driving assembly; and the clamping parts are symmetrically distributed on the outer sides of the suckers and are used for clamping the ground wafer under the driving of the second driving assembly.
A third aspect of an embodiment of the present application provides a handling method for a wafer thinning apparatus, including: the first driving assembly is controlled to drive the sucker to adsorb the wafer before grinding; the carrying device carries the wafer to a grinding module; and controlling a second driving assembly of the conveying device, driving the clamping part to clamp the ground wafer through the second driving assembly, and enabling the conveying equipment to convey the wafer out of the grinding module.
A fourth aspect of the embodiments of the present application provides a wafer thinning apparatus including a handling device as described above.
The application has the beneficial effects that: according to the technical scheme, the wafer which is not ground can be conveyed through the sucker, the ground wafer is conveyed through the clamping part, on the premise that a mechanical arm is not added, the ground wafer residues on the sucker are avoided as much as possible, the damage of the wafer residues to the vacuum sucker is avoided, the wafer damage caused by the wafer residues on the sucker on the surface of the wafer which is not ground is avoided as much as possible, and the wafer quality is improved.
Drawings
The advantages of the present application will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the application, wherein:
FIG. 1 is a schematic view of a wafer thinning apparatus;
FIG. 2 is a schematic view of a handling device;
FIG. 3 is a schematic view of a wafer being held by a chuck;
FIG. 4 is a schematic view of a wafer being transported by a clamping portion;
FIG. 5 is a schematic view of a handling device including a rotation mechanism, a lifting mechanism;
FIG. 6 is a schematic diagram of a wafer handling system;
fig. 7 is a schematic flow chart of a handling method.
1. A device front end module;
2. A polishing module; 21. a second transmission unit; 22. a third transmission unit; 23. a chemical mechanical polishing unit; 24. a post-processing unit;
3. A grinding module; 31. a grinding unit; 311. a base; 312. a work table; 313. a wafer adsorption device; 314. a loading and unloading station;
32. a cleaning unit; 33. a fourth transmission unit;
40. A cleaning device; 50. an adsorption type wafer carrying device;
60. a base; 601. an end arm; 602. a guide rail;
61. a first drive assembly; 62. a second drive assembly; 621. a gas claw; 622. a support arm; 623. a connecting arm; 6231. a first fixed section; 6232. a second fixed section; 6233. a transition section;
63. A suction cup; 64. a clamping part; 641. a clamping column; 642. a claw; 70. a rotation mechanism; 80. and a lifting mechanism.
Detailed Description
The following describes the technical scheme of the present application in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present application for illustrating the concept of the present application; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the application in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present application, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present application, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.
In the application, thinning the back surface of the wafer (Gri nd i ng) refers to high-precision grinding of the semiconductor material before packaging, so that the appearance of the semiconductor material is reduced to a proper form, and the purposes of reducing the packaging mounting height, reducing the packaging volume of a chip, improving the thermal diffusion efficiency, the electrical property, the mechanical property and the like of the chip are realized.
In the present application, the Wafer (W) is also called a Substrate (Substrate), a Wafer, a die, etc., and the meaning and actual function are equivalent.
In ultra-precise thinning equipment, ultra-precise grinding, CMP and cleaning modules, thickness deviation and surface defect control technology are mainly integrated, so that the requirements of the ultra-precise thinning technology for wafers in the fields of 3D I C manufacturing, advanced packaging and the like are met.
Fig. 1 exemplarily shows a schematic structural view of an ultra-precise thinning apparatus, which includes:
the equipment front end module 1 is used for realizing the in-out of the wafer, and the equipment front end module 1 is arranged at the front end of the wafer thinning equipment. The front end module 1 is a transition module for transferring wafers from outside to inside of the equipment platform, and is used for realizing wafer in-and-out so as to realize 'dry in-and-dry out' of the wafers.
The grinding module 3 is used for grinding the wafer, the grinding comprises rough grinding and finish grinding, and the grinding module 3 is arranged at the tail end of the wafer thinning equipment;
And a polishing module 2 for performing chemical mechanical polishing on the wafer after the completion of the grinding, and having a function of transferring the wafer between the three modules (the equipment front-end module 1, the grinding module 3 and the polishing module 2), the polishing module 2 being disposed between the equipment front-end module 1 and the grinding module 3.
It will be appreciated that the wafer thinning apparatus shown in fig. 1 is only an example, and that the polishing module 2 may be omitted in other implementations, leaving only the apparatus front end module 1 and the grinding module 3, and that the grinding module 3 may include multiple grinding passes, such as 3 passes, 4 passes, 5 passes, etc. Embodiments like these modifications should fall within the scope of the present application as long as the thinning function of the wafer can be achieved.
Device front end module 1:
The equipment front-end module 1 comprises a wafer storage unit and a first transmission unit. The wafer storage unit is arranged at one side of the front end of the wafer thinning device, and the first transmission unit is arranged between the wafer storage unit and the polishing module 2 and is used for realizing the transmission of the wafer between the wafer storage unit and the polishing module 2.
The wafer storage unit is composed of a plurality of front opening unified pods (Front Openi ng Uni fied Pod, FOUPs), specifically two, three, etc.
The first transmission unit comprises a pick-and-place slice manipulator. The picking and placing manipulator can rotate, stretch or fold and shrink and can also move along the conveying track. The wafer taking and placing manipulator can take out wafers to be processed from the wafer storage unit through the door structure of the wafer conveying box and send the wafers to the polishing module 2, and can also receive the processed wafers from the polishing module 2 and place the wafers into the wafer conveying box.
Polishing module 2:
The polishing module 2 includes a second transfer unit 21, a third transfer unit 22, a chemical mechanical polishing unit 23, and a post-processing unit 24. The second transfer unit 21, the chemical mechanical polishing unit 23 and the post-processing unit 24 occupy respective edges of the polishing module 2, and the third transfer unit 22 is located at the center.
Specifically, the second transmission units 21 are located at the edge side in the polishing module 2 and distributed along the machine length direction, and can communicate the machine front end module 1 and the grinding module 3. The chemical mechanical polishing unit 23 is located at the other side edge of the polishing module 2 and adjacent to the grinding module 3 and the second transfer unit 21, respectively. The post-processing unit 24 is located at the edge of the polishing module 2 at the other side and adjacent to the equipment front-end module 1, the second transfer unit 21, and the chemical mechanical polishing unit 23, respectively. The third transfer unit 22 is surrounded by the second transfer unit 21, the chemical mechanical polishing unit 23, and the post-processing unit 24 near the center of the polishing module 2, for accomplishing the mutual transfer of the wafers among the second transfer unit 21, the chemical mechanical polishing unit 23, and the post-processing unit 24.
In one embodiment, the second transfer unit 21 includes a temporary storage section and a moving buffer section for temporarily storing and shipping wafers. The temporary storage part is arranged at a position close to the front end module 1 of the equipment and is used for temporarily storing or transferring the wafer. The movement buffer part is arranged along the direction from the equipment front end module 1 to the grinding module 3 and can move bidirectionally.
In one embodiment, the third transfer unit 22 includes a central robot for transferring the ground wafer from the mobile buffer to the chemical mechanical polishing unit 23, transferring the polished wafer from the chemical mechanical polishing unit 23 to the post-processing unit 24, and transferring the cleaned wafer from the post-processing unit 24 to the temporary storage.
The wafer is taken out from the front end module 1 of the equipment and then conveyed to the grinding module 3 for grinding through the second transmission unit 21; after finishing grinding in the grinding module 3, the wafer is conveyed to a chemical mechanical polishing unit 23 for polishing through a second conveying unit 21 and a third conveying unit 22; after polishing and cleaning, the wafer is transferred back to the equipment front-end module 1 via the third transfer unit 22 and the second transfer unit 21.
The post-processing unit 24 is used to clean and dry the polished wafer, and may include a horizontal brushing device and a single chamber cleaning device.
Grinding module 3:
The grinding module 3 includes a grinding unit 31, a cleaning unit 32, a fourth transfer unit 33, and a cleaning device 40.
The grinding unit 31 is used to achieve wafer grinding and thickness measurement. As shown in fig. 1, the grinding unit 31 includes a base 311, a table 312 mounted on the base 311, a wafer suction device 313 provided on the table, and a grinding wheel corresponding to the station position. The workbench is used for bearing the wafer and can rotate around the vertical central axis of the workbench. In one embodiment, as shown in fig. 1, the wafer chucking apparatus 313 is provided with three, rotatable between a rough grinding station, a fine grinding station, and a loading and unloading station 314. The two grinding wheels respectively realize rough grinding and finish grinding. It should be understood that fig. 1 is only an example, and the number of the wafer sucking devices 313 and the grinding wheels may be other values, for example, the number of the wafer sucking devices is 1,2, 4, 5, 6, etc., and the number of the grinding wheels is 1,3, 4, etc.
The fourth transfer unit 33 includes a suction type wafer handling device 50 for transferring wafers, and the suction type wafer handling device 50 refers to a robot used in the grinding module 3 for transferring wafers between the grinding unit 31 and the second transfer unit 21, specifically, for transferring wafers between suction cups and a moving buffer portion corresponding to the loading and unloading stations. The suction type wafer handling device 50 takes the wafer from the moving buffer portion of the second transfer unit 21 and sends the wafer to the grinding unit 31 for grinding, and after grinding and cleaning are completed, the suction type wafer handling device 50 takes the wafer from the grinding unit 31 and then places the wafer in the moving buffer portion for subsequent transfer of the wafer.
However, in the above process, the adsorption type wafer conveying device 50 adopts a vacuum chuck adsorption type wafer conveying method, and particles such as wafer residues after grinding exist on the surface of the wafer after the wafer is thinned, and the wafer residues are adsorbed to the vacuum chuck during vacuum adsorption, so that the wafer residues damage the vacuum chuck and the wafer during the wafer conveying process, thereby affecting the wafer quality and reducing the yield of wafer production.
In order to solve or alleviate the above problems, the present application provides a handling device for a wafer thinning apparatus.
As shown in fig. 2, the carrying device includes: a base 60; a first driving assembly 61 and a second driving assembly 62 respectively provided on the base 60; a suction cup 63 disposed below the base 60, for sucking the wafer before grinding under the driving of the first driving assembly 61; the clamping parts 64 are symmetrically distributed on the outer side of the suction cup 63 and are used for clamping the ground wafer under the drive of the second driving assembly 62.
In this embodiment, the base 60 is a cross-shaped base 60, the first driving component 61 is disposed at the center of the cross-shaped base 60, and the second driving component 62 is disposed on the end arm 601 of the cross-shaped base 60; the clamping portion 64 includes four notches, each located at four notches of the cross-shaped base 60.
By the cross-shaped base 60, the first driving assembly 61 and the second driving assembly 62 can be reasonably arranged, and enough avoiding space can be provided for the clamping part 64.
Specifically, the cross-shaped base 60 includes four end arms 601, which are a first end arm, a second end arm, a third end arm, and a fourth end arm, respectively, and among the four end arms 601, the first end arm and the fourth end arm are symmetrical, and the second end arm and the third end arm are symmetrical.
Optionally, in this embodiment, the second driving assembly 62 includes: the air claw 621 is arranged on the first end arm of the cross-shaped base 60, and the fourth end arm symmetrical to the first end arm can be empty or connected with a subsequent lifting mechanism; two support arms 622 disposed on the second end arm and the third end arm of the cross-shaped base 60, and two clamping posts 641 are disposed on each support arm 622, wherein the second end arm and the third end arm are two end arms on the cross-shaped base 60 that are symmetrical to each other; two connecting arms 623 for connecting the air claw 621 and the two support arms 622, respectively, and driving the support arms 622 to move with the driving of the air claw 621.
Through first end arm, second end arm and third end arm, can set up second drive assembly 62 rationally, can provide sufficient driving force through the gas claw 621 of second drive assembly 62, guarantee the stability of linking arm 623 through second end arm and third end arm to guaranteed the stability when centre gripping wafer through clamping part 64, prevented the condition of falling the piece.
Alternatively, in the present embodiment, the connection arm 623 includes: a first fixed segment 6231 for fixedly connecting with the air jaw 621; a second fixed segment 6232 for fixedly coupling with the support arm 622; a transition section 6233, located between the first and second fixed sections 6231, 6232, provides a relief space for the first drive assembly 61.
As shown in the figure, the two connecting arms 623 are symmetrically arranged and have a splayed structure, the first fixing section 6231 and the second fixing section 6232 are both rectangular structures, the transition section 6233 is a trapezoid structure, and the first fixing section 6231 and the second fixing section 6232 are connected through the transition section 6233 of the trapezoid structure, so that a sufficient avoiding space can be provided for the first driving component 61, and the strength of the connecting arms 623 can be ensured.
In this embodiment, one end of the connecting arm 623 is connected to the air claw 621, the other end is connected to the supporting arm 622, the supporting arm 622 is a T-shaped arm, the connecting arm 623 is fixedly connected to the short side of the T-shaped arm, and two ends of the T-shaped arm in the length direction are respectively provided with a clamping part 64; the second end arm and the third end arm are respectively provided with a guide rail 602 perpendicular to the length direction of the T-shaped arm for guiding the T-shaped arm. Thus, four clips 64 may be provided by two T-arms.
The number of the clamping parts 64 can be increased through the T-shaped arms, and enough stable support is provided for the clamping parts 64 as much as possible, and errors existing in the movement process of the T-shaped arms can be reduced through the guide rails 602, so that the movement precision of the T-shaped arms is ensured, and the precision of clamping wafers is also improved.
In this embodiment, as shown in fig. 2, the clamping portion 64 includes a clamping column 641 and a clamping jaw 642, one end of the clamping column 641 is fixedly connected with the supporting arm 622, the clamping jaw 642 is fixed at the other end, and the clamping jaw 642 can clamp the edge of the wafer without damaging the wafer.
In this embodiment, a chuck 63 is disposed below the base 60, and the first driving assembly 61 can drive the chuck 63 to extend or retract toward the wafer. When the wafer is sucked by the suction cup 63, the suction cup 63 is extended, and when the wafer is clamped by the clamping portion 64, the suction cup 63 is retracted.
The surface of the suction cup 63 on the side far from the base 60 is at a first distance from the base 60, and the surface of the clamping part 64 on the side far from the base 60 is at a second distance from the base 60; when the suction cup 63 is extended, the first distance is greater than the second distance; when the suction cup 63 is retracted, the first distance is less than the second distance.
The first drive assembly 61 may also be connected with a vent passage for providing negative pressure to the suction cup 63.
As shown in fig. 3, when the wafer is sucked by the suction cup 63, the suction cup 63 is protruded, and the susceptor 60 is driven to move downward, so that the suction cup 63 is then moved to abut against the upper surface of the wafer, and then the wafer can be sucked by the suction cup 63.
As shown in fig. 4, when the wafer is transported by the clamping portion 64, the chuck 63 is retracted, the clamping portion 64 may be driven to move outwards by the second driving assembly 62 in a direction parallel to the surface of the wafer, and then the base 60 may be driven to move downwards, so that the claw 642 of the clamping portion 64 moves downwards below the wafer, and then the clamping portion 64 may be driven to move inwards by the second driving assembly 62 in a direction parallel to the surface of the wafer, so as to drive the claw 642 of the clamping portion 64 to clamp the wafer.
Referring to fig. 5, in this embodiment, the handling device may further include: comprises a supporting frame body (not shown in the figure), a rotating mechanism 70 and a lifting mechanism 80; the supporting frame body can be installed on the base 311 of the grinding unit, the rotating mechanism 70 is fixedly connected with the supporting frame body, the lifting mechanism 80 is installed on the rotating mechanism 70, and the base 60 is installed on the lifting mechanism 80. The rotation mechanism 70 can drive the lifting mechanism 80 and the base 60 to rotate together around the axial direction. The lifting mechanism 80 can drive the base 60 to move up and down. The first driving component 61 on the base 60 can drive the sucking disc 63 to move up and down in a telescopic manner, and the second driving mechanism can drive the clamping part 64 to move in an opening and closing manner, so that the controllable movement of the sucking disc 63 and the clamping part 64 with multiple degrees of freedom is realized, the sucking disc 63 can accurately and controllably place the wafer w on the transfer workbench 4 or the clamping part 64 can accurately grasp the wafer w from the transfer workbench 4, and the accurate and controllable movement position of the wafer w in the transmission process is further ensured.
Specifically, when the wafer is clamped by the clamping portion 64, the rotating mechanism 70 drives the base 60 to move to the station where the wafer is located, the lifting mechanism 80 drives the base 60 to wholly descend to the set point, the air claw 621 retracts to drive the claw 642 and the clamping post 641 connected with the air claw to approach inwards, then the lifting mechanism 80 drives the base 60 to wholly ascend, the edge of the wafer is supported by the claw 642 below the clamping post 641, and the rotating assembly drives the base 60 to move to the next station. When the next station is reached and the release operation is required, the lifting mechanism 80 drives the base 60 to wholly descend to the set point, the wafer is lifted, the air claw 621 stretches out to drive the claw 642 and the clamping column 641 connected with the claw to open outwards, and the manipulator wholly ascends to complete the release operation.
When the wafer needs to be adsorbed, the rotating mechanism 70 drives the base 60 to move to the station where the wafer is located, the lifting mechanism 80 drives the base 60 to wholly descend to the set point, the cylinder drives the sucker 63 to descend to contact with the wafer, vacuum is opened, after the wafer is adsorbed to the sucker 63, the lifting mechanism 80 drives the base 60 to wholly ascend, and the rotating mechanism 70 drives the base 60 to move to the next station. When the next station is reached and the adsorbed wafer needs to be released, the lifting mechanism 80 drives the whole base 60 to descend to the set point position, the vacuum is turned off, the cylinder retracts to drive the sucker 63 to retract, and the lifting mechanism 80 drives the whole base 60 to ascend to complete the release action.
According to the carrying device provided by the application, the wafer which is not ground can be carried through the sucker 63, and the ground wafer is carried through the clamping part 64, so that the ground wafer residue on the sucker 63 is avoided as much as possible on the premise of not increasing a mechanical arm, the damage of the wafer residue on the vacuum sucker 63 is avoided, the wafer damage caused by the wafer residue on the sucker 63 on the surface of the wafer which is not ground is also avoided as much as possible, and the wafer quality is improved.
Another embodiment of the present application also provides a wafer handling system, see fig. 7, comprising a handling device and a controller 90; the carrying device comprises: a base 60; a first driving assembly 61 and a second driving assembly 62 respectively provided on the base 60; a suction cup 63 disposed below the base 60, for sucking the wafer before grinding under the driving of the first driving assembly 61; the clamping parts 64 are symmetrically distributed on the outer sides of the suckers 63 and are used for clamping the ground wafer under the drive of the second driving assembly 62; the controller 90 is electrically connected to the handling device, and is used for controlling the first driving component 61 to enable the sucker 63 to absorb the wafer before grinding; the carrying device carries the wafer to the grinding module; the second driving unit 62 is controlled to drive the clamping portion 64 to clamp the ground wafer, and the carrying device carries the wafer out of the grinding module.
The controller can also be used for controlling the lifting assembly, the rotating assembly and the like, and the controller is within the protection scope of the application.
The structure of the handling device may refer to the above embodiments, and will not be described herein.
Another embodiment of the present application provides a method for carrying a wafer using the carrying device, as shown in fig. 7, which includes:
S1, controlling a first driving assembly of the conveying device, and driving a sucker to adsorb a wafer before grinding through the first driving assembly.
S2, enabling the conveying device to convey the wafer to the grinding module.
S3, controlling a second driving assembly of the conveying device, driving the clamping part to clamp the ground wafer through the second driving assembly, and enabling the conveying equipment to convey the wafer out of the grinding module.
Another embodiment of the present application provides a wafer thinning apparatus using the above-mentioned handling device, and a specific structure of the wafer thinning apparatus may refer to fig. 1.
Another embodiment of the present application also provides a computer-readable storage medium having stored thereon executable instructions for causing a processor to perform a method as above.
Another embodiment of the present application also provides a computer program product or computer program comprising executable instructions stored in a computer readable storage medium; the method as above is implemented when a processor of an electronic device reads executable instructions from a computer readable storage medium and executes the executable instructions.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410518938.6A CN118305669A (en) | 2024-04-28 | 2024-04-28 | Handling system, method and device for wafer thinning equipment and wafer thinning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119381320A (en) * | 2024-12-30 | 2025-01-28 | 华海清科股份有限公司 | Wafer processing method and wafer processing device |
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