CN118276648A

CN118276648A - Server and cabinet system

Info

Publication number: CN118276648A
Application number: CN202410688399.0A
Authority: CN
Inventors: 郇伟伟
Original assignee: Suzhou Metabrain Intelligent Technology Co Ltd
Current assignee: Suzhou Metabrain Intelligent Technology Co Ltd
Priority date: 2024-05-30
Filing date: 2024-05-30
Publication date: 2024-07-02
Anticipated expiration: 2044-05-30
Also published as: CN118276648B; WO2025246578A1

Abstract

The invention discloses a server and a cabinet system, which relate to the technical field of servers, wherein the server comprises: the chassis comprises a top plate and a bottom plate; the main board is arranged in the middle of the chassis, a first layout space is formed between the front surface of the main board and the top plate, a second layout space is formed between the back surface of the main board and the bottom plate, and the first component is arranged on the back surface of the main board and is positioned in the second layout space; the first radiator is arranged on at least one first component and is positioned in the second layout space. In the embodiment of the invention, the front and the back of the main board are provided with enough space layout components, so that the size of the main board can be reduced, the power density of the main board is improved, and the size of a chassis in the server is correspondingly reduced under the same configuration after the size of the main board is reduced.

Description

Server and cabinet system

Technical Field

The present invention relates to the field of server technologies, and in particular, to a server and a cabinet system.

Background

The server includes a server chassis and a motherboard, and at present, the motherboard is disposed at the bottom of the server chassis.

Key components such as a CPU (Central Processing Unit, a central processing unit), a PCH (Platform Controller Hub, an integrated south bridge) chip, a memory module, a BMC (Baseboard Management Controller, a baseboard management controller) and the like are all arranged on the front surface of the motherboard.

However, the size of the motherboard in the above-mentioned server is larger, the power density of the motherboard is lower, and the size of the server is larger.

Disclosure of Invention

The invention provides a server and a cabinet system, which aim to at least solve the technical problems of larger size of a main board, lower power density of the main board and larger size of the server in the prior art.

In a first aspect of the present invention, there is provided a server, comprising:

the chassis comprises a top plate and a bottom plate;

The main board is arranged in the middle of the chassis, a first layout space is formed between the front surface of the main board and the top board, a second layout space is formed between the back surface of the main board and the bottom board,

The first component is arranged on the back surface of the main board and is positioned in the second layout space;

The first radiator is arranged on at least one first component and is positioned in the second layout space.

Optionally, the first radiator includes a first fin portion, one end of the first fin portion away from the first component is provided with at least one first accommodating groove, and the at least one first accommodating groove is used for embedding a first liquid cooling tube;

The first fin portion is detachably connected with at least one first filling piece, and at least one first filling piece is used for filling at least one first accommodating groove respectively.

The first radiator comprises a first fin portion, the first fin portion comprises a plurality of first fins, the first fins comprise at least two first main body plates which are distributed at intervals along a first direction, and two adjacent first main body plates are connected through a first connecting plate;

Each first fin has at least one cavity, and at least one first body plate in each first fin extends into the cavity of an adjacent first fin.

Optionally, two adjacent first fins enclose a first heat dissipation channel, the first heat dissipation channel includes a plurality of first main channels that follow the first direction interval distribution, two adjacent first main channels in the first heat dissipation channel are linked together through first connecting channel, two adjacent first connecting channels in the first heat dissipation channel are located respectively the both sides of first main channel.

Optionally, the fan circuit board is flush with the main board, and the front and the back of the fan circuit board are respectively connected with a first fan module and a second fan module.

Optionally, the first component includes at least one voltage regulation module, and the first heat sink is disposed on at least one of the voltage regulation modules;

The front of the main board is provided with a second component, the second component is located in the first layout space, the second component comprises a central processing unit, and at least one voltage regulating module is located below the central processing unit.

Optionally, a second radiator is further disposed on the central processor, and the structure of the second radiator is the same as that of the first radiator.

Optionally, the first component further includes at least one of an integrated south bridge chip, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

Optionally, when the first component includes the integrated south bridge chip, the server further includes a third heat sink disposed on the integrated south bridge chip, and the third heat sink is located in the second layout space.

Optionally, the cross section of the first liquid cooling pipe is circular, and the cross section of the first accommodating groove is semicircular.

Optionally, the front and the back of the fan circuit board are respectively provided with a first fan connector set and a second fan connector set, and the first fan module and the second fan module are respectively connected to the first fan connector set and the second fan connector set in a pluggable manner.

Optionally, the second fan connector set includes at least one second fan connector, and the second fan module includes at least one second fan;

the second fan connector comprises a second buckle, and a second clamping groove corresponding to the second buckle is formed in the second fan; or a second clamping groove is formed in the second fan connector, and a second buckle corresponding to the second clamping groove is arranged on the second fan.

Optionally, the first fan connector set includes at least one first fan connector, and the first fan module includes at least one first fan;

the first fan connector comprises a first buckle, and a first clamping groove corresponding to the first buckle is formed in the first fan; or the first fan connector is provided with a first clamping groove, and the first fan is provided with a first buckle corresponding to the first clamping groove.

In a second aspect of the present invention, there is also provided a rack system comprising a rack and a server as described in any one of the above.

Optionally, the server further comprises a liquid cooling device, wherein the liquid cooling device is connected with a first liquid cooling pipe in the server and is used for providing cooling liquid for the first liquid cooling pipe.

In the embodiment of the invention, the front and the back of the main board are provided with enough space layout components, so that the size of the main board can be reduced, and the power density of the main board is improved. After the size of the main board is reduced, the size of the chassis in the server is correspondingly reduced under the same configuration, so that the occupied area of the data center is reduced, the operation cost of the data center is reduced, and the development trend of miniaturization and portability is met. In addition, after the size of the main board is reduced, more devices such as a space layout hard disk and PCIE equipment can be released in the chassis with the same size so as to adapt to larger and more various configurations. In addition, because the first component and the first radiator are located in the second layout space, the heat dissipation effect of the first component is not affected by the components laid out on the front surface of the main board, and the heat dissipation effect of the first component is good.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

FIG. 1 is a schematic diagram of a server in the prior art;

fig. 2 is a schematic structural diagram of a server according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of another server according to an embodiment of the present invention;

Fig. 4 is a schematic structural view of a first fin portion in a first heat sink provided in an embodiment of the present invention;

FIG. 5 is a schematic diagram of a first accommodating groove on a first fin portion and a first liquid cooling tube in cooperation with each other according to an embodiment of the present invention;

FIG. 6 is a schematic view of a first receiving groove on a first fin portion mated with a first packing in accordance with an embodiment of the present invention;

Fig. 7 is a schematic structural view of a first filling member according to an embodiment of the present invention.

Reference numerals:

1-server chassis, 2-motherboard, 3-CPU radiator;

11-motherboard, 111-front, 112-back, 12-chassis, 121-top, 122-bottom, 123-first layout space, 124-second layout space, 13-first component, 131-voltage regulation module, 132-integrated south bridge chip, 14-first radiator, 141-first fin portion, 142-first receiving slot, 143-first fin, 1431-first body plate, 1432-first connection plate, 144-first heat dissipation channel, 1441-first main channel, 1442-first connection channel, 145-first filler, 1451-connection portion, 1452-filler, 1453-attachment portion, 1454-mounting portion, 15-first liquid cooling tube, 16-fan circuit board, 17-first fan module, 18-second fan module, 19-second component, 191-central processing unit, 20-second radiator, 21-third radiator, 22-power supply module.

Detailed Description

The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention.

The examples of the present invention are only for explaining the present invention and are not intended to limit the scope of the present invention. The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.

Referring to fig. 1, the server includes a server chassis 1 and a main board 2, and the main board 2 is currently disposed at the bottom of the server chassis 1. The key components such as CPU, PCH chip, memory module, BMC are all arranged on the front surface of the motherboard 2. The CPU is provided with a CPU heat sink 3. However, the motherboard 2 of the above-mentioned server has a larger size, the motherboard 2 has a lower power density, and the server has a larger size. In order to solve the above-mentioned problems, embodiments of the present invention provide a server and a cabinet system, and the server and the cabinet system are specifically described below.

In a first aspect, referring to fig. 2, a server provided in an embodiment of the present invention includes: chassis 12, including top plate 121 and bottom plate 122; the main board 11 is arranged in the middle of the chassis 12, a first layout space 123 is formed between the front 111 of the main board 11 and the top plate 121, a second layout space 124 is formed between the back 112 of the main board 11 and the bottom plate 122, and the first component 13 is arranged on the back 112 of the main board 11 and is positioned in the second layout space 124; the first heat sink 14 is disposed on at least one first component 13 and is located in the second layout space 124.

Specifically, the main board 11 is disposed in the middle of the chassis 12 along the height direction thereof, a first layout space 123 is formed between the front 111 of the main board 11 and the top plate 121, and a second layout space 124 is formed between the back 112 of the main board 11 and the bottom plate 122, so that the front 111 and the back 112 of the main board 11 have enough space to layout chips, heat sinks, resistors, capacitors and other electronic components. In the embodiment of the invention, the front and back surfaces 112 of the main board 11 can be used for arranging components, so that the current situation that the main board can only be used for arranging components in a front-side tiling mode is changed.

The chassis 12 may be a 2U chassis. Front 111 of motherboard 11 specifically refers to the side of motherboard 11 that faces upward when disposed within chassis 12, and back 112 of motherboard 11 specifically refers to the side of motherboard 11 that faces downward when disposed within chassis 12. After the first component 13 and the first heat sink 14 are disposed on the back surface 112 of the motherboard 11, a certain gap is formed between the first heat sink 14 and the bottom plate 122.

The first component 13 generates heat during operation, and the first radiator 14 can radiate heat to the first component 13, and when radiating heat, the first component 13 and the first radiator 14 are positioned in the second layout space 124, so that the radiating effect of the first component 13 is not affected by the components laid out on the front 111 of the main board 11, and the radiating effect of the first component 13 is good. The first component 13 may include at least one of a voltage regulation module 131, an integrated south bridge chip 132, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

With the increasing demands of high-performance applications such as artificial intelligence, machine learning, big data mining and the like, the demands on servers are higher and higher. In order to provide high-performance and high-reliability computational power support for mass data, the performance of processors such as a CPU (central processing unit), a GPU (Graphics Processing Unit, a graphics processor) and the like is continuously upgraded, and the signal design, the power supply design, the heat dissipation design, the storage capacity and the configuration diversity of a server are also continuously improved. The server clusters form a data center, and the operation cost of the large data center comprises site renting, heat radiation equipment maintenance, electric energy consumption and the like, and is limited by various factors such as the size of the server body, heat radiation efficiency, power conversion efficiency and the like.

In the embodiment of the invention, the front surface 111 and the back surface 112 of the motherboard 11 have enough space layout components, so that the size of the motherboard 11 can be reduced, and the power density of the motherboard 11 is improved. After the size of the main board 11 is reduced, the size of the chassis 12 in the server is correspondingly reduced under the same configuration, so that the occupied area of the data center is reduced, the operation cost of the data center is reduced, and the development trend of miniaturization and portability is met. In addition, after the size of the motherboard 11 is reduced, more devices such as a spatially laid out hard disk, PCIE (PERIPHERAL COMPONENT INTERCONNECT EXPRESS ) device, etc. can be released in the chassis 12 of the same size to adapt to larger and more diverse configurations. Further, since the first component 13 and the first heat sink 14 are located in the second layout space 124, the heat dissipation effect of the first component 13 is not affected by the components laid out on the front surface 111 of the main board 11, and the heat dissipation effect of the first component 13 is good.

After the size of the motherboard 11 is reduced, the size of the chassis 12 in the server may be reduced by at least 1/3 of the size of the existing server chassis under the same configuration.

At present, the upper space of the server case is only used for planning a heat dissipation and ventilation path, a cable plug-in travel, an after-sales maintenance operation space and the like, cannot provide effective contribution to the configuration upgrading of the server, and has low space utilization rate. In the embodiment of the invention, the upper space and the lower space of the case 12 can be used for distributing components, thereby improving the space utilization rate of the case 12.

In a preferred embodiment of the present invention, referring to fig. 5 and 6, the first heat sink 14 includes a first fin portion 141, and an end of the first fin portion 141 remote from the first component 13 is provided with at least one first receiving groove 142, where the at least one first receiving groove 142 is used for embedding the first liquid cooling tube 15; at least one first filling member 145 is detachably connected to the first fin portion 141, and the at least one first filling member 145 is respectively used for filling the at least one first receiving groove 142.

Specifically, the first fin portion 141 includes a plurality of first fins 143, and the first receiving groove 142 penetrates the plurality of first fins 143 in the first fin portion 141. The extending direction of the first receiving groove 142 is parallel to the first direction. The first direction may be referred to as the direction indicated by the arrow a in fig. 4. The number of the first receiving grooves 142 may be one, two, three, etc. The number of the first receiving grooves 142 is preferably two, and both the first receiving grooves 142 are used for embedding the first liquid cooling pipe 15. The first liquid cooling pipe 15 includes two parallel liquid cooling sections, the ends of the two liquid cooling sections are communicated, and the two first accommodating grooves 142 are respectively used for embedding the two liquid cooling sections.

The first liquid-cooled tube 15 is for the passage of a cooling liquid. The case 12 is provided with a liquid inlet and a liquid outlet, and the first liquid cooling pipe 15 is connected with the liquid inlet and the liquid outlet. When the first liquid-cooled tube 15 is fitted into the first receiving groove 142, the first liquid-cooled tube 15 is brought into close contact with the first fin portion 141, thereby effectively transferring heat of the first fin portion 141 to the first liquid-cooled tube 15. The first fin portion 141 is made of a metal such as copper or aluminum.

The number of the first filling members 145 is equal to the number of the first receiving grooves 142. The shape and size of the first packing 145 matches the shape and size of the first receiving groove 142. The material of the first filler 145 is the same as that of the first fin portion 141. In the air cooling scenario, the first filling member 145 is connected with the first fin portion 141, and the first filling member 145 fills the first accommodating groove 142, so as to ensure the integrity of the first fin portion 141, and further ensure the heat dissipation effect of the first radiator 14.

In a liquid cooled scenario, the first filler 145 may be removed and the first liquid cooled tube 15 may be inserted into the first receiving groove 142. In the embodiment of the present invention, the first filling member 145 is detachably connected to the first fin portion 141, so that the first radiator 14 can adapt to two heat dissipation modes, namely air cooling and liquid cooling. The user can flexibly disassemble and assemble the first packing 145 according to different heat dissipation modes.

In a preferred embodiment of the present invention, referring to fig. 7, the first packing 145 includes a connection portion 1451 and a plurality of packing portions 1452 connected to the connection portion 1451. The plurality of filling portions 1452 are spaced apart in the first direction. The number of the filling portions 1452 is equal to the number of the first fins 143, the plurality of filling portions 1452 corresponds to the plurality of first fins 143 one by one, and the plurality of filling portions 1452 are used for filling the first accommodating grooves 142 penetrating the plurality of first fins 143. Two attaching portions 1453 are connected to two ends of the connecting portion 1451 along the first direction, one end of each attaching portion 1453, which is far away from the connecting portion 1451, is connected to a mounting portion 1454, and the two attaching portions 1453 are respectively used for contacting two sides of the first fin portion 141. The first heat sink 14 further includes a base plate, and the mounting portion 1454 contacts the base plate when the first packing 145 is attached to the first fin portion 141. The mounting portion 1454 is provided with a slot, the substrate is provided with a buckle corresponding to the slot, or the substrate is provided with a slot, and the mounting portion 1454 is provided with a buckle corresponding to the slot. In the embodiment of the invention, the mounting portion 1454 contacts the substrate and the clamping groove is matched with the buckle, so that the first filling member 145 is limited in the up-down direction, and the two attaching portions 1453 are respectively contacted with the two sides of the first fin portion 141, so that the first filling member 145 is limited in the first direction.

In a preferred embodiment of the present invention, referring to fig. 4, the first heat sink 14 includes a first fin portion 141, the first fin portion 141 including a plurality of first fins 143, the first fins 143 including at least two first body plates 1431 spaced apart in a first direction; each first fin 143 has at least one cavity, and at least one first body plate 1431 in each first fin 143 extends into the cavity of an adjacent first fin 143.

Specifically, the first fin portion 141 is a main portion of the first heat sink 14. The first body plate 1431 is preferably perpendicular to the first connection plate 1432. The plurality of first fins 143 includes edge first fins located at both edges of the first fin portion 141 in the first direction, and the edge first fins may include two first body plates 1431 and a first connection plate 1432 connected to the two first body plates 1431. The plurality of first fins 143 further include an intermediate first fin between the two edge first fins, and the intermediate first fin may include three first body plates 1431 and two first connection plates 1432, and two adjacent first connection plates 1432 in the intermediate first fin are located at both sides of the first body plates 1431, respectively.

Two first body plates 1431 of the first fins 143 and a first connection plate 1432 connecting the two first body plates 1431 enclose a cavity. The edge first fin has a cavity. The middle first fin has two cavities. In the embodiment of the invention, by the arrangement, the specific surface area of the first radiator 14 is increased, the heat dissipation efficiency and the heat dissipation effect of the first radiator 14 are improved, and the working performance of the first component 13 is further improved.

In a preferred embodiment of the present invention, referring to fig. 4, two adjacent first fins 143 enclose a first heat dissipation channel 144, the first heat dissipation channel 144 includes a plurality of first main channels 1441 spaced apart along a first direction, two adjacent first main channels 1441 in the first heat dissipation channel 144 are communicated through a first connecting channel 1442, and two adjacent first connecting channels 1442 in the first heat dissipation channel 144 are located at two sides of the first main channel 1441, respectively.

Specifically, the first heat dissipation channel 144 is a space surrounded by two adjacent first fins 143, and the first heat dissipation channel 144 is used for guiding air flow. One side of the first fin portion 141 along the second direction is close to the second fan module 18, and the second direction is perpendicular to the first direction. The first heat sink 14 may include at least one first fin portion 141. The first heat dissipation path 144 preferably includes three first main paths 1441 and two first connection paths 1442.

In a preferred embodiment of the present invention, referring to fig. 3, the server further includes a fan circuit board 16, the fan circuit board 16 is flush with the main board 11, and a first fan module 17 and a second fan module 18 are connected to the front and back sides of the fan circuit board 16, respectively.

Specifically, when the first fan module 17 and the second fan module 18 rotate, the first layout space 123 and the second layout space 124 both have air flows through. The fan circuit board 16 is located on one side of the main board 11 in the length direction of the server. The space in the chassis 12 further includes a front window and a rear window respectively located at two sides of the main board 11 along the length direction of the server, and the first fan module 17 and the second fan module 18 are located at the front windows.

The fan circuit board 16 is electrically connected to the first fan module 17 and the second fan module 18, and the fan circuit board 16 is used for controlling the operation of the first fan module 17 and the second fan module 18. When the fan circuit board 16 is flush with the motherboard 11, the front and back sides of the fan circuit board 16 have a space layout fan module. The front side of the fan circuit board 16 refers to the side of the fan circuit board 16 that faces upward when installed in the chassis 12, and the back side of the fan circuit board 16 refers to the side of the fan circuit board 16 that faces downward when installed in the chassis 12.

The first fan module 17 includes a plurality of first fans, and the second fan module 18 includes a plurality of second fans. The first fan module 17 and the second fan module 18 are independent, and the control modes of the first fan module 17 and the second fan module 18 may be different, for example, the rotation speed of the first fan module 17 may be controlled according to the temperature of the second component 19, and the rotation speed of the second fan module 18 may be controlled according to the temperature of the first component 13. The rotational speed of the first fan module 17 and the rotational speed of the second fan module 18 may be different.

In the embodiment of the invention, the front and back sides of the fan circuit board 16 are respectively connected with the first fan module 17 and the second fan module 18, so that the overall heat dissipation requirement of the server is met, and meanwhile, the first fan module 17 and the second fan module 18 are mutually independent, so as to meet different heat dissipation requirements of the first layout space 123 and the second layout space 124 in the chassis 12. In addition, the first fan module 17 and the second fan module 18 can be replaced independently.

In a preferred embodiment of the present invention, the server further comprises a wind scooper assembly comprising a first wind scooper located within the first layout space 123 and a second wind scooper located within the second layout space 124.

In a preferred embodiment of the invention, referring to fig. 3, the first component 13 comprises at least one voltage regulation module 131, the first heat sink 14 being arranged on the at least one voltage regulation module 131; the front 111 of the motherboard 11 is provided with a second component 19, the second component 19 is located in the first layout space 123, the second component 19 includes a central processing unit 191, and at least one voltage adjustment module 131 is located below the central processing unit 191.

Specifically, at least one voltage adjustment module 131 is configured to adjust the input voltage to provide a stable operating voltage for the cpu 191. The number of the voltage adjusting modules 131 provided on the rear surface 112 of the main board 11 may be one, two, three, four, or the like. The first heat sink 14 is used for heat dissipation of the at least one voltage regulation module 131. The second component 19 may also include a memory module, a baseboard management controller, at least one voltage regulation module 131, and the like.

Currently, cpus gradually exhibit trends of high current, high current slope, high power density, low voltage, and the like. The high power consumption and the high current can lead to higher and higher transmission loss and lower conversion efficiency. In the embodiment of the invention, when the at least one voltage adjusting module 131 is disposed on the back surface 112 of the motherboard 11 and the at least one voltage adjusting module 131 is located below the cpu 191, a power supply architecture of vertical power supply (VerticalPower Delivery, VPD) can be implemented, and the power supply architecture of vertical power supply can meet the power supply requirements of the cpu with high current, high current slope, high power density and low voltage. In addition, at least one voltage regulating module 131 directly supplies power to the central processor 191 vertically along the height direction of the server, shortening a power supply path, reducing transmission impedance, and thus improving conversion efficiency.

In a preferred embodiment of the present invention, referring to fig. 3, a second heat sink 20 is further provided on the central processor 191, and the second heat sink 20 has the same structure as the first heat sink 14.

Specifically, the second radiator 20 includes a second fin portion, and one end of the second fin portion, which is far away from the central processing unit 191, is provided with at least one second accommodating groove, where the second accommodating groove is used for embedding a second liquid cooling tube; the second fin portion is detachably connected with at least one second filling piece, and the at least one second filling piece is used for filling at least one second accommodating groove respectively.

The second fin portion comprises a plurality of second fins, each second fin comprises at least two second main body plates which are distributed at intervals along the first direction, two adjacent second main body plates are connected through a second connecting plate, two adjacent second connecting plates in the second fins are respectively located at two sides of each second main body plate, and two adjacent second fins enclose a second heat dissipation channel.

The second heat dissipation channels comprise a plurality of second main channels which are distributed at intervals along the first direction, two adjacent second main channels in the second heat dissipation channels are communicated through a second connecting channel, and two adjacent second connecting channels in the second heat dissipation channels are respectively positioned at two sides of the second main channels.

In the embodiment of the invention, the structure of the second radiator 20 is the same as that of the first radiator 14, so that the specific surface area of the second radiator 20 is increased, the heat dissipation efficiency and the heat dissipation effect of the second radiator 20 are improved, and the working performance of the central processing unit 191 is further improved. In addition, the second radiator 20 can also adapt to two heat dissipation modes, namely air cooling and liquid cooling.

In a preferred embodiment of the present invention, referring to fig. 3, the first component 13 further includes at least one of an integrated south bridge chip 132, a memory module, a baseboard management controller, a complex programmable logic device (Complex Programmable Logic Device, CPLD), a Flash memory (Flash) chip, and a battery module.

In particular, the memory module may be a DIMM (Dual Inline Memory Modules, dual in-line memory module). The battery module is used for supplying power to the main board 11 when power is off. When the server is powered off, the battery module can ensure that the server continues to work for a certain time so as to ensure that the data of the server cannot be lost.

In a preferred embodiment of the present invention, referring to fig. 3, when the first component 13 includes the integrated south bridge chip 132, the server further includes a third heat sink 21 disposed on the integrated south bridge chip 132, and the third heat sink 21 is located in the second layout space 124. Specifically, the third radiator 21 may have the same structure as the first radiator 14 or may have a different structure from the first radiator 14. By the provision of the third heat sink 21, the heat dissipation effect of the integrated south bridge chip 132 can be improved. When the structure of the third radiator 21 is the same as that of the first radiator 14, the specific surface area of the third radiator 21 is increased, the heat dissipation efficiency and the heat dissipation effect of the third radiator 21 are improved, and the working performance of the integrated south bridge chip 132 is further improved. In addition, the third radiator 21 can also adapt to two heat dissipation modes, namely air cooling and liquid cooling.

In a preferred embodiment of the present invention, referring to fig. 5, the first liquid cooling pipe 15 has a circular cross-sectional shape, and the first receiving groove 142 has a semicircular cross-sectional shape. The radius of the first receiving groove 142 is preferably equal to the radius of the first liquid-cooled tube 15. Through the cross section shape of the first liquid cooling tube 15 being circular, the cross section shape of the first accommodating groove 142 is a semicircular arrangement, sufficient contact between the first liquid cooling tube 15 and the first fin portion 141 is ensured, and thereby the heat dissipation effect is improved.

In a preferred embodiment of the present invention, the front and back sides of the fan circuit board 16 are provided with a first fan connector set and a second fan connector set, respectively, to which the first fan module 17 and the second fan module 18 are detachably connected, respectively.

Specifically, the first fan connector set includes a plurality of first fan connectors, and the first fan module 17 includes a plurality of first fans, which are respectively connected to the plurality of first fan connectors in a pluggable manner. The second fan connector set includes a plurality of second fan connectors, and the second fan module 18 includes a plurality of second fans, which are respectively connected to the plurality of second fan connectors in a pluggable manner. The type of the first fan may be determined based on the heat loss of the second component 19 and the upper space of the cabinet 12. The model of the second fan may be determined based on heat loss of the first component 13 and the lower space of the cabinet 12. In the embodiment of the invention, the first fan module 17 and the second fan module 18 are respectively connected to the first fan connector set and the second fan connector set in a pluggable manner, so that the first fan module 17 and the second fan module 18 are convenient to maintain and replace.

In a preferred embodiment of the present invention, the second fan connector set includes at least one second fan connector and the second fan module 18 includes at least one second fan; the second fan connector comprises a second buckle, and a second clamping groove corresponding to the second buckle is formed in the second fan; or the second fan connector is provided with a second clamping groove, and the second fan is provided with a second buckle corresponding to the second clamping groove.

Specifically, the second fan module 18 preferably includes five second fans, and in this case, the second fan connector set includes five second fan connectors. The second clip engages the second slot when the second fan is mounted on the fan circuit board 16. In the embodiment of the invention, the second fan can be prevented from falling off by the arrangement of the second buckle and the second clamping groove, and the connection between the second fan and the second fan connector can be kept stable even if the second fan is reversely suspended on the fan circuit board 16.

In a preferred embodiment of the invention, the first fan connector set comprises at least one first fan connector and the first fan module 17 comprises at least one first fan; the first fan connector comprises a first buckle, and a first clamping groove corresponding to the first buckle is formed in the first fan; or the first fan connector is provided with a first clamping groove, and the first fan is provided with a first buckle corresponding to the first clamping groove.

Specifically, the first fan module 17 preferably includes five first fans, and in this case, the first fan connector set includes five first fan connectors. When the first fan is mounted on the fan circuit board 16, the first buckle is matched with the first clamping groove. In the embodiment of the invention, the first buckle and the first clamping groove are arranged, so that the looseness of the joint of the first fan and the first fan connector can be avoided.

In a specific embodiment of the present invention, the server is a 2U server, and the configuration of the server includes: the server comprises a central processing unit 191, 16 dual in-line memory modules, 12 NVMe (NVM Express, nonvolatile memory host controller interface Specification) HDDs (HARD DISK DRIVE, hard disk drives), 8 PCIE devices, 10 fans and a power supply module (PowerSupplyUnit, PSU), and is required to adapt to two heat dissipation modes of air cooling and liquid cooling. According to the configuration, the board card is decomposed, and the server needs to include a motherboard 11, a 12-port hard disk backboard, an adapter board with three PCIE slots, and an adapter board with two PCIE slots.

The connectors of the 111,8 dip memory modules disposed on the front surface of the motherboard 11 of the cpu 191 may be disposed on the front surface 111 of the motherboard 11, the baseboard management controller may be disposed on the front surface 111 of the motherboard 11, at least one voltage regulation module is disposed on the front surface 111 of the motherboard 11, the connector of the hard disk back plate is disposed on the front surface 111 of the motherboard 11, and the connector of the interposer is disposed on the front surface 111 of the motherboard 11. The main board 11 is also provided with PSU connectors.

The connectors of the 8 dual in-line memory modules may be disposed on the back surface 112 of the motherboard 11, the integrated south bridge chip 132 is disposed on the back surface 112 of the motherboard 11, the flash memory chip is disposed on the back surface 112 of the motherboard 11, the battery module is disposed on the back surface 112 of the motherboard 11, and the at least one voltage regulation module is disposed on the back surface 112 of the motherboard 11. The third heat sink 21 for dissipating heat from the integrated south bridge chip 132 and the first heat sink 14 for dissipating heat from the at least one voltage regulation module are both disposed on the back surface 112 of the motherboard 11. The size of the motherboard 11 is significantly reduced compared to that of the prior art, and the power density is improved.

Five first fan connectors are provided on the front side of the fan circuit board 16, and five second fan connectors are provided on the back side of the fan circuit board 16. The second fan connector comprises a second buckle, and a second clamping groove corresponding to the second buckle is formed in the second fan; or the second fan connector is provided with a second clamping groove, and the second fan is provided with a second buckle corresponding to the second clamping groove. The first fan connector comprises a first buckle, and a first clamping groove corresponding to the first buckle is formed in the first fan; or the first fan connector is provided with a first clamping groove, and the first fan is provided with a first buckle corresponding to the first clamping groove.

The first radiator 14 includes a first fin portion 141, one end of the first fin portion 141 away from the first component 13 is provided with at least one first accommodating groove 142, and the at least one first accommodating groove 142 is used for embedding the first liquid cooling tube 15; at least one first filling member 145 is detachably connected to the first fin portion 141, and the at least one first filling member 145 is respectively used for filling the at least one first receiving groove 142.

Based on the above configuration and design, when the server is assembled, the main board 11 is placed in the middle position of the chassis 12 and fixed; then, installing five first fans and five second fans on the front and back sides of the fan circuit board 16, respectively, and placing the fan circuit board 16, the first fans and the second fans on the front window; then placing the 12-port hard disk back plate between the main board 11 and the fan circuit board 16; then placing the adapter plate on the rear window; the power module 22 is then inserted from the rear window and the power module 22 is connected to the PSU connector on the motherboard 11.

In a second aspect, referring to fig. 4, an embodiment of the present invention provides a rack system, the rack system including a rack and a server provided in any one of the first aspects. The server comprises: chassis 12, including top plate 121 and bottom plate 122; the main board 11 is arranged in the middle of the chassis 12, a first layout space 123 is formed between the front 111 of the main board 11 and the top plate 121, a second layout space 124 is formed between the back 112 of the main board 11 and the bottom plate 122, and the first component 13 is arranged on the back 112 of the main board 11 and is positioned in the second layout space 124; the first heat sink 14 is disposed on at least one first component 13 and is located in the second layout space 124.

In the embodiment of the invention, the front surface 111 and the back surface 112 of the motherboard 11 have enough space layout components, so that the size of the motherboard 11 can be reduced, and the power density of the motherboard 11 is improved. After the size of the main board 11 is reduced, the size of the chassis 12 in the server is correspondingly reduced under the same configuration, so that the occupied area of the data center is reduced, the operation cost of the data center is reduced, and the development trend of miniaturization and portability is met. In addition, after the size of the motherboard 11 is reduced, more devices such as a space layout hard disk and PCIE devices can be released in the chassis 12 with the same size, so as to adapt to larger and more diverse configurations. Further, since the first component 13 and the first heat sink 14 are located in the second layout space 124, the heat dissipation effect of the first component 13 is not affected by the components laid out on the front surface 111 of the main board 11, and the heat dissipation effect of the first component 13 is good.

In a preferred embodiment of the present invention, the cabinet system further comprises a liquid cooling device connected to the first liquid cooling pipe 15 in the server, and the liquid cooling device is configured to provide cooling liquid to the first liquid cooling pipe 15.

The liquid cooling device comprises a water collector positioned in the cabinet. The water separator-collector is also connected to a CDU (Coolant Distribution Unit, liquid-cooled distribution unit) that is external to the racks, the CDU being configured to distribute cooling fluid to the individual racks of the data center. The liquid separating and collecting device is provided with a main inlet, a main outlet, a plurality of first diversion openings and a plurality of first reflux openings, wherein the first diversion openings are communicated with the main inlet, and the first reflux openings are communicated with the main outlet. The first shunt port is connected with a liquid inlet in the server, and the first reflux port is connected with a liquid outlet in the server. The cooling liquid flows into the liquid separating and collecting device from the main inlet, flows into the liquid inlet of the server from the first diversion port, flows into the first liquid cooling pipe 15 from the liquid inlet of the server, flows into the liquid outlet of the server from the first liquid cooling pipe 15 after heat exchange, flows back to the liquid separating and collecting device through the first backflow port, and flows out of the liquid separating and collecting device through the main outlet. The coolant is preferably a non-conductive solution to avoid damage to the server in the event of leakage. The cooling liquid may be water.

In a preferred embodiment of the present invention, referring to fig. 3, the first component 13 further includes at least one of an integrated south bridge chip 132, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

In a preferred embodiment of the present invention, referring to fig. 3, when the first component 13 includes the integrated south bridge chip 132, the server further includes a third heat sink 21 disposed on the integrated south bridge chip 132, and the third heat sink 21 is located in the second layout space 124.

In a preferred embodiment of the present invention, referring to fig. 5, the first liquid cooling pipe 15 has a circular cross-sectional shape, and the first receiving groove 142 has a semicircular cross-sectional shape.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.

The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

The server and cabinet system provided by the invention are described in detail, and specific examples are applied to illustrate the principles and embodiments of the invention, and the description of the above examples is only used to help understand the structure and core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

Claims

1.A server, comprising:

the chassis comprises a top plate and a bottom plate;

2. The server of claim 1, wherein the first heat sink comprises a first fin portion, wherein one end of the first fin portion away from the first component is provided with at least one first accommodating groove, and the at least one first accommodating groove is used for embedding a first liquid cooling pipe;

3. The server according to claim 1 or 2, wherein the first heat sink includes a first fin portion including a plurality of first fins including at least two first body plates spaced apart in a first direction, adjacent two first body plates being connected by a first connection plate;

4. A server according to claim 3, wherein two adjacent first fins enclose a first heat dissipation channel, the first heat dissipation channel includes a plurality of first main channels that are spaced apart along the first direction, two adjacent first main channels in the first heat dissipation channel are communicated through a first connection channel, and two adjacent first connection channels in the first heat dissipation channel are respectively located at two sides of the first main channel.

5. The server of claim 1 or 2, further comprising a fan circuit board, the fan circuit board being flush with the motherboard, a front side and a back side of the fan circuit board being connected with a first fan module and a second fan module, respectively.

6. The server according to claim 1 or 2, wherein the first component comprises at least one voltage regulation module, the first heat sink being provided on at least one of the voltage regulation modules;

7. The server of claim 6, wherein a second heat sink is further disposed on the central processing unit, the second heat sink having a structure identical to the structure of the first heat sink.

8. The server of claim 6, wherein the first component further comprises at least one of an integrated south bridge chip, a memory module, a baseboard management controller, a complex programmable logic device, a flash memory chip, and a battery module.

9. The server of claim 8, wherein when the first component includes the integrated south bridge chip, the server further includes a third heat sink disposed on the integrated south bridge chip, the third heat sink being located within the second layout space.

10. The server of claim 2, wherein the first liquid-cooled tube has a circular cross-sectional shape and the first receiving slot has a semicircular cross-sectional shape.

11. The server of claim 5, wherein the front and back sides of the fan circuit board are provided with a first fan connector set and a second fan connector set, respectively, and the first fan module and the second fan module are connected to the first fan connector set and the second fan connector set in a pluggable manner, respectively.

12. The server of claim 11, wherein the second set of fan connectors comprises at least one second fan connector, the second fan module comprising at least one second fan;

13. The server of claim 11, wherein the first set of fan connectors comprises at least one first fan connector, the first fan module comprising at least one first fan;

14. A rack system comprising a rack and the server of any one of claims 1 to 13.

15. The cabinet system of claim 14, further comprising a liquid cooling device coupled to a first liquid cooling duct in the server, the liquid cooling device configured to provide cooling liquid to the first liquid cooling duct.