CN118270532A - Automatic chip distributing machine and distributing method thereof - Google Patents

Abstract

The invention relates to the field of chip processing, and discloses an automatic chip distributor, which comprises a material taking mechanism and an X-axis linear module, wherein one end of the material taking mechanism is provided with a carrying module, and the output end of the carrying module is connected with a clamping jaw mechanism; one end of the X-axis linear module is provided with a rotatable mechanism; the clamping jaw mechanism comprises a plurality of clamping jaw parts, and the distance between the clamping jaw parts can be changed along the Y-axis direction; under the drive of transport module, clamping jaw mechanism erects the transport to the tray in after the chip letter sorting of tiling in the charging tray cooperation rotary mechanism to just accomplish the adjustment of chip interval at clamping jaw mechanism's in-process of getting the material, the rethread location guiding mechanism guarantees that every chip gets the material position unanimously on rotary mechanism, makes it can directly put into the tray, thereby solves traditional feed process inefficiency, the loaded down with trivial details problem of mechanism, improves the efficiency and the precision of chip letter sorting.

Description

Automatic chip distributing machine and distributing method thereof

Technical Field

The invention relates to the field of chip processing, in particular to an automatic chip distributing machine and a distributing method thereof.

Background

In an automobile part assembly factory, the chips are required to be sorted and palletized after welding test, the chips to be separated are often tiled in a tray, and in order to be filled with more materials, the chips are required to be kept in an upright state during boxing; and the distribution of chips in the boxing tray is different from that of the incoming chips, namely, the distance between two adjacent products is greatly different.

To the above needs, the chip is generally distributed by the distributing device in the market, but two main disadvantages exist in the existing automatic chip distributing mode at present: (1) The efficiency is slow, the mechanism is tedious, products need to be transported to the overturning station one by one (the tool spacing of the overturning station is consistent with the product spacing in the blanking tray), the chips are rearranged, and the blanking tray is arranged after the overturning process is carried out and the transporting mechanism is used for positioning for the second time; (2) When empty tray material loading and full charging tray unloading, the condition of terminating the operation waiting can appear in equipment, has influenced the efficiency of dividing the material greatly.

Therefore, the existing material distributing equipment of most factories is low in speed and complex in mechanism, and after discharging, the equipment is additionally stopped by manually carrying the full material tray.

Disclosure of Invention

The invention aims to solve the problem of providing an automatic chip distributing machine, which utilizes a clamping jaw mechanism capable of changing the distance to clamp chips, so that the chips are distributed at intervals in the process of taking the chips, and a positioning guide mechanism is arranged between a rotating mechanism and the clamping jaw mechanism, so that the taking position of each chip on the rotating mechanism is ensured to be the same, and the chips can be directly fed into a tray; therefore, the problems of low efficiency and complicated mechanism of the traditional material distribution process are solved, and the material distribution efficiency and accuracy are improved.

In order to achieve the above purpose, the invention adopts the following technical scheme:

The automatic chip distributor comprises a material taking mechanism and an X-axis linear module, wherein the material taking mechanism and the X-axis linear module are respectively used for bearing a material tray and a tray, one end of the material taking mechanism is provided with a carrying module, and the output end of the carrying module is connected with a clamping jaw mechanism capable of moving along the X-axis direction and the Y-axis direction;

One end of the X-axis linear module, which is close to the clamping jaw mechanism, is provided with a rotating mechanism capable of lifting along the Z-axis direction, the other end of the X-axis linear module extends into the upper machine, and a positioning guide mechanism is arranged between the clamping jaw mechanism and the rotating mechanism;

The clamping jaw mechanism comprises a plurality of clamping jaw parts for grabbing chips, and the distances among the clamping jaw parts can be changed along the Y-axis direction; the rotary mechanism comprises material taking heads which are corresponding to the clamping jaw parts in number and can absorb chips, and the material taking heads can also be turned over longitudinally.

In a preferred embodiment of the invention, the clamping jaw mechanism further comprises a vertical plate, one side of the vertical plate is connected with the output end of the carrying module, and the other side of the vertical plate is provided with a driving plate and a plurality of connecting plates which can move along the Z axis and the Y axis respectively; the driving plate is provided with a plurality of guide grooves with inconsistent inclination angles, the upper part of the connecting plate is slidably embedded in the guide grooves through rollers, and the clamping jaw part is fixedly arranged on the lower part of the connecting plate.

In a preferred embodiment of the present invention, the handling module includes a Y-axis linear module parallel to the Y-axis direction, an output end of the Y-axis linear module is connected to a Z-axis linear module parallel to the Z-axis direction, and the vertical plate is connected to an output end of the Z-axis linear module.

In a preferred embodiment of the present invention, the rotating mechanism further includes a lifting support, one end of the X-axis linear module passes through the support, a support plate parallel to the Y-axis direction is rotatably mounted on the top of the support, and the plurality of material taking heads are fixedly mounted on one side of the support plate at equal intervals.

In a preferred embodiment of the present invention, the positioning guide mechanism includes a positioning plate, the positioning plate is disposed between the clamping jaw component and the material taking head, and the positioning plate is provided with guide holes whose number and positions correspond to the material taking head.

In a preferred embodiment of the invention, the feeding machine comprises a frame, one end of the X-axis linear module extends into the frame, and two stacking mechanisms for feeding and discharging the tray are oppositely arranged in the frame.

In a preferred embodiment of the invention, the stacking mechanism comprises two top plates which are oppositely arranged at two sides of the X-axis linear module and can be lifted, a plurality of guide plates for guiding the tray to move up and down are arranged above the top plates, a supporting component for supporting the tray is arranged at one side of the guide plates, and the output end of the supporting component can stretch out and draw back.

In a preferred embodiment of the invention, the material taking mechanism comprises a frame, wherein a material taking belt line for conveying the material tray is arranged on the inner side of the frame, and a jacking mechanism for jacking the chip on the material tray is further arranged in the frame.

In a preferred embodiment of the present invention, the jacking mechanism includes a lifting module fixedly installed on the inner side of the frame, an output end of the lifting module is connected with a jacking plate, and a plurality of suckers capable of adsorbing chips are arranged on top of the jacking plate.

A material distributing method of an automatic chip material distributing machine comprises the following steps:

S1, carrying an empty tray at the bottommost layer to the output end of an X-axis linear module by using a stacking mechanism for tray blanking in a feeding machine, carrying the empty tray below a rotating mechanism by using the X-axis linear module, and waiting for blanking by the rotating mechanism; meanwhile, chips paved in the material tray are conveyed to one end close to the clamping jaw mechanism by utilizing a material taking belt line of the material taking mechanism, and then a row of chips at the forefront end in the material tray are jacked up by the jacking mechanism to wait for the clamping jaw mechanism to clamp the chips;

S2, adjusting the space between the clamping jaw parts through the guide groove by utilizing the movement of the driving plate relative to the vertical plate along the Z-axis direction so as to align the chip jacked by the jacking mechanism; then the carrying module drives the clamping jaw mechanism to the upper part of the jacking mechanism, and the corresponding chip is clamped by the clamping jaw part;

s3, after the clamping jaw mechanism takes away the chips, reversely adjusting the distance and the position of the clamping jaw components, aligning the tiled chips into guide holes on the positioning plate, and then placing the chips on a material taking head of the rotating mechanism; in the process, the jacking mechanism moves to the lower part of the material tray, the material taking belt line moves forwards for one lattice, then the jacking mechanism stretches out again to jack up the chips in the next row in the material tray, and the chips are waited for being clamped by the next clamping jaw mechanism;

s4, after the material taking head sucks the chip, the support plate rotates 90 degrees along the longitudinal direction, the chip is adjusted to be in an upright state from a flat state, and the support moves downwards along the Z-axis direction until the chip is placed in the tray in the upright state; then the bracket and the material taking head move reversely, and the material taking head is positioned right below the guide hole again to wait for the next feeding of the clamping jaw mechanism;

S5, after the chips are longitudinally inserted into the tray, the tray is driven by the X-axis linear module to move forwards for one frame, and the next chip blanking is waited; after the tray is fully loaded, the X-axis linear module drives the fully loaded tray to a stacking mechanism for tray loading in the loading machine, the tray is stacked layer by utilizing the stacking mechanism, then the empty tray is moved to the position below the rotating mechanism through the X-axis linear module, and the unloading of the rotating mechanism is waited again.

Advantageous effects

(1) According to the invention, the clamping jaw mechanism is driven by the carrying module, the chips tiled in the tray can be vertically carried into the tray after being sorted by matching with the rotating mechanism, the chip spacing can be adjusted in the process of taking materials by the clamping jaw mechanism, and the material taking position of each chip on the rotating mechanism is ensured to be consistent by the positioning guide mechanism, so that each chip can be directly placed into the tray, the problems of low efficiency and complicated mechanism of the traditional material distributing process are solved, and the efficiency and the precision of chip sorting are improved.

(2) According to the invention, the guide groove on the driving plate can be used for driving the connecting plate to adjust the distance in the horizontal direction, so that the material distributor can be compatible with different arrangement conditions of most chips after being distributed, and the applicability is wider.

(3) According to the invention, the X-axis linear module can complete loading and unloading of the tray through the two stacking mechanisms of the loading machine, so that loading and unloading work is completed under the condition that equipment is not stopped, and the equipment stopping time is greatly reduced.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic diagram of a handling module according to the present invention;

FIG. 4 is a schematic view of the jaw mechanism of the present invention;

FIG. 5 is a schematic diagram of the front view of the jaw mechanism of the present invention;

FIG. 6 is a schematic view of the positioning guide mechanism of the present invention;

FIG. 7 is a schematic view of the rotary mechanism of the present invention;

FIG. 8 is a schematic diagram of the position structure of the X-axis linear module and the feeder of the present invention;

FIG. 9 is a schematic view of the structure of the feeder of the present invention;

FIG. 10 is a schematic view of the structure of the take off mechanism of the present invention;

FIG. 11 is a schematic view of the structure of the lifting mechanism of the present invention;

Wherein, 1, a material taking mechanism; 11. a frame; 12. a material taking belt line; 2. a jaw mechanism; 21. a vertical plate; 22. a driving plate; 23. a connecting plate; 24. a guide groove; 25. a roller; 26. a jaw member; 27. a telescoping assembly; 28. a limit part; 29. a baffle; 3. a carrying module; 31. a Y-axis linear module; 32. a Z-axis straight line module; 4. a rotation mechanism; 41. a bracket; 42. a support plate; 43. a material taking head; 44. a driving section; 5. a positioning guide mechanism; 51. a positioning plate; 52. a guide hole; 53. a portal frame; 6. an X-axis linear module; 7. a feeding machine; 71. a frame; 72. a guide plate; 73. a top plate; 74. a support assembly; 8. a jacking mechanism; 81. a lifting module; 82. a jacking plate; 83. a suction cup; 9. a tray; 10. and a material tray.

Detailed Description

The invention will now be described in further detail with reference to the drawings and examples, which are simplified schematic illustrations of the basic structure of the invention, which are presented only by way of illustration, and thus show only the structures that are relevant to the invention.

Example 1

As shown in fig. 1-2, fig. 4-5 and fig. 7, an automatic chip distributor comprises a material taking mechanism 1 and an X-axis linear module 6, wherein the material taking mechanism 1 and the X-axis linear module 6 are respectively used for bearing a material tray 10 and a tray 9, one end of the material taking mechanism 1 is provided with a carrying module 3, and the output end of the carrying module 3 is connected with a clamping jaw mechanism 2 capable of moving along the X-axis and the Y-axis directions; one end of the X-axis linear module 6, which is close to the clamping jaw mechanism 2, is provided with a rotating mechanism 4 capable of lifting along the Z-axis direction, the other end of the X-axis linear module extends into the upper machine 7, and a positioning guide mechanism 5 is arranged between the clamping jaw mechanism 2 and the rotating mechanism 4; the clamping jaw mechanism 2 comprises a plurality of clamping jaw parts 26 for grabbing chips, and the distances among the clamping jaw parts 26 can be changed along the Y-axis direction; the rotation mechanism 4 includes the pick heads 43 corresponding in number to the jaw members 26 capable of sucking chips, and the pick heads 43 are also capable of being turned in the longitudinal direction.

Above-mentioned, the output direction of feeding mechanism 1 and X axle straight line module 6 is all parallel to X axle direction, and the chip on the charging tray 10 is in the state of tiling, and tray 9 is then used for depositing the chip of erect state to make things convenient for subsequent vanning work, under the circumstances that does not damage the chip, once accomodate more chips in the same space.

Specifically, after the material taking mechanism 1 conveys the tray 10 carrying the tiled chips to the material taking station (i.e. near one end of the conveying module 3), the X-axis linear module 6 conveys the empty tray 9 to the position below the rotating mechanism 4; the carrying module 3 drives the clamping jaw mechanism 2 to adjust positions along the Y axis and the Z axis, after clamping chips at the forefront row on the material taking disc 10 through the clamping jaw parts 26, the clamping jaw mechanism 2 moves reversely to the position above the positioning guide mechanism 5, and in the process, the distance between the clamping jaw parts 26 is adjusted so as to correspond to the material taking head 43 of the rotating mechanism 4; the clamping jaw mechanism 2 is used for blanking the chips in the positioning guide mechanism 5, the pick-up head 43 of the rotary mechanism 4 is used for sucking the chips, then the pick-up head 43 is turned over for 90 degrees along the longitudinal direction, the chips are adjusted from a flat state to an upright state and move downwards along the Z axis, and the chips are directly inserted into corresponding clamping grooves of the tray 9, so that the sorting of the chips is completed; therefore, the problems of low efficiency and complicated mechanism of the traditional material separation process are solved, and the efficiency and the precision of chip sorting are improved.

As shown in fig. 4-5, the clamping jaw mechanism 2 further comprises a vertical plate 21, one side of the vertical plate 21 is connected with the output end of the carrying module 3, and the other side of the vertical plate 21 is provided with a driving plate 22 and a plurality of connecting plates 23 which can move along the directions of the Z axis and the Y axis respectively; the driving plate 22 is provided with a plurality of guide grooves 24 with inconsistent inclination angles, the upper part of the connecting plate 23 is slidably embedded in the guide grooves 24 through rollers 25, and the clamping jaw parts 26 are fixedly arranged on the lower part of the connecting plate 23.

The vertical plate 21 and the driving plate 22 are parallel to each other, the vertical plate 21 and the driving plate 22 can synchronously move along the Y-axis and the Z-axis under the action of the carrying module 3, and the driving plate 22 can also move along the Z-axis relative to the vertical plate 21 under the action of the telescopic assembly 27; the telescopic assembly 27 is here fixedly mounted on the riser 21, with its output end connected to the drive plate 22 and its direction of movement parallel to the Z-axis direction.

The connecting plate 23 adopts an L-shaped structure, and the connecting plate 23 and the driving plate 22 are interactively connected with the vertical plate 21 by adopting a slide block guide rail structure, and the difference is that the connecting plate 23 can only translate along the Y-axis direction relative to the vertical plate 21, and the driving plate 22 can only move along the Z-axis direction relative to the vertical plate 21.

The guide grooves 24 have equal heights and are distributed at intervals along the Y-axis direction; the inclination angles of the guide grooves 24 are different, the upper part of each connecting plate 23 is slidably embedded in the corresponding guide groove 24 through the idler wheel 25, when the telescopic assembly 27 drives the driving plate 22 to move along the Z-axis direction, the guide grooves 24 move synchronously with the driving plate 22, but as the connecting plates 23 can only move along the Y-axis direction, the inner side surfaces of the guide grooves 24 can squeeze the idler wheels 25, and meanwhile, the idler wheels 25 are rotatably arranged on the connecting plates 23, so that the friction force is reduced, and the driving connecting plates 23 are equidistantly distributed along the Y-axis direction; the distance between the connecting plates 23 can be controlled by adjusting the height of the roller 25 in the guide groove 24, so that the distance between the clamping jaw parts 26 connected with the connecting plates 23 can be adjusted, and the material distributor can be compatible with different arrangement conditions of most chips after being distributed, and the applicability of the material distributor is improved.

Wherein the jaw member 26 employs an existing pneumatic jaw to effect gripping of the chip; the telescopic assembly 27 preferably employs an air cylinder to effect lifting and lowering movement of the drive plate 22 in the Z-axis direction.

In addition, two baffles 29 are oppositely arranged on one side of the vertical plate 21 along the Z-axis direction, a limiting part 28 is fixedly connected to one side of the driving plate 22, and the limiting part 28 is positioned between the two baffles 29, so that the limitation of the movement range of the driving plate 22 can be realized, and the movement derailment accident of the driving plate is avoided.

As shown in fig. 3, the carrying module 3 includes a Y-axis linear module 31 parallel to the Y-axis direction, the output end of the Y-axis linear module 31 is connected with a Z-axis linear module 32 parallel to the Z-axis direction, and the vertical plate 21 is connected with the output end of the Z-axis linear module 32.

The X-axis linear module 6, the Y-axis linear module 31 and the Z-axis linear module 32 are mutually perpendicular, the Y-axis linear module 31 can drive the Z-axis linear module 32 to move along the Y-axis direction, the Z-axis linear module 32 can drive the clamping jaw mechanism 2 to move along the Z-axis direction, and the two mutually cooperate to realize the free movement of the clamping jaw mechanism 2 in the Y-axis direction and the Z-axis direction.

The above-mentioned X-axis linear module 6, Y-axis linear module 31 and Z-axis linear module 32 all adopt the linear modules in the prior art, and preferably adopt the electric cylinder, and the control precision is higher.

As shown in fig. 6-7, the rotating mechanism 4 further includes a support 41 capable of lifting, one end of the x-axis linear module 6 passes through the support 41, a support plate 42 parallel to the Y-axis direction is rotatably mounted on the top of the support 41, and a plurality of material taking heads 43 are fixedly mounted on one side of the support plate 42 at equal intervals.

The bracket 41 realizes lifting movement through the existing linear module, and is arranged at the bottom of the bracket 41; the rotation axis of the support plate 42 is parallel to the Y axis, the material taking head 43 is provided with air holes, and the adsorption grabbing of the chip can be realized after the air source is connected, so that the chip is ensured not to fall off in the vertical state; and the inside of the bracket 41 is also provided with a driving part 44 for driving the support plate 42 to turn over, the driving part 44 adopts the existing belt transmission mechanism, the input end of the driving part is connected with a servo motor, and the output end of the driving part is connected with the support plate 42.

As shown in fig. 6, the positioning guide mechanism 5 includes a positioning plate 51, the positioning plate 51 is disposed between the clamping jaw member 26 and the material taking head 43, and the positioning plate 51 is provided with guide holes 52 corresponding to the material taking head 43 in number and position.

The locating plate 51 is fixedly arranged between the clamping jaw part 26 and the material taking head 43 through the portal frame 53, the X-axis linear module 6 passes through the portal frame 53, the locating plate 51 is fixedly arranged at the top of the portal frame 53, the position of the guide hole 52 corresponds to the position of the clamping groove in the tray 9, and a notch for avoiding the clamping jaw of the clamping jaw part 26 is formed in the inner side of the locating plate, so that interference between the clamping jaw part 26 and the locating plate 51 is avoided, and meanwhile, the clamping jaw part 26 can directly put a chip on the material taking head 43.

After the clamping jaw mechanism 2 loads the chip into the guide hole 52 of the positioning plate 51 from the upper end, the chip is just sucked from the middle by the material taking head 43 positioned at the lower end of the guide hole 52, then the material taking head 43 is turned over for 90 degrees, the bracket 41 moves downwards, and the chip in the vertical state is inserted into the corresponding clamping groove.

As shown in fig. 1-2 and 8-9, the feeding machine 7 comprises a frame 71, one end of the x-axis linear module 6 extends into the frame 71, and two stacking mechanisms for feeding and discharging the tray 9 are arranged in the frame 71. Namely, an empty tray feeding area and a full tray discharging area are arranged in the feeding machine 7, empty trays 9 are stacked in the feeding area, and full trays 9 are stacked in the discharging area.

The X-axis linear module 6 can complete loading and unloading of the tray 9 through two stacking mechanisms of the loading machine 7, so that loading and unloading work is completed under the condition that equipment is not stopped, and the equipment stopping time is greatly reduced; the loading and unloading refers to loading and unloading of the tray 9, namely, the loading of the tray 9 is to carry an empty tray 9 to the output end of the X-axis linear module 6, and the unloading of the tray 9 is to stack and stack the trays 9 filled with chips layer by layer through a stacking mechanism; based on this, the inside of the apparatus is still operating normally during the manual loading of the empty and the full loading of the disc.

The stacking mechanism comprises two top plates 73 which are oppositely arranged on two sides of the X-axis linear module 6 and can be lifted, a plurality of guide plates 72 used for guiding the tray 9 to move up and down are arranged above the top plates 73, a supporting component 74 used for supporting the tray 9 is arranged on one side of each guide plate 72, and the output end of each supporting component 74 can stretch out and draw back.

The top plate 73 is also lifted and lowered through the existing linear module, the top plate 73 is arranged at the bottom of the top plate 73, the lifting and lowering of the top plate 73 cannot interfere with the X-axis linear module 6, and both can move independently; four guide plates 72 are provided and distributed at four corners of the tray 9, and the guide plates 72 are fixedly installed at the inner sides of the frames 71, which can ensure that the circumferential positions of the stacked trays 9 do not change when the stacked trays move up and down; the support assembly 74 comprises a cylinder and a support block arranged at the output end of the cylinder, wherein the support block is positioned at the bottom of the bottommost tray 9 and plays a supporting role.

When the trays 9 are loaded, the output end of the X-axis linear module 6 moves to the loading area, the top plate 73 moves upwards to jack up the stacked empty trays 9 from the bottom, then the supporting blocks are retracted, the support of the trays 9 is released, the top plate 73 moves downwards by the height of one tray 9, the supporting blocks extend again to support the trays 9, and the tray 9 separated at the bottommost layer moves downwards along with the top plate 73 until falling to the output end of the X-axis linear module 6.

When the tray 9 is fed, the X-axis linear module 6 carries the full tray 9 to the feeding area, the top plate 73 jacks up the tray 9 from two sides until the tray 9 at the bottommost layer stacked in the feeding area is connected with the tray 9 at the bottommost layer stacked in the feeding area, the supporting blocks are retracted, the top plate 73 continues to rise by the height of one tray 9, and then the supporting blocks stretch out again to support the tray 9, so that the feeding of the full tray 9 is completed.

The replenishment of the empty trays 9 in the feeding area and the transportation of the full trays 9 in the discharging area can be completed manually, and the process does not affect the chip sorting work.

As shown in fig. 10-11, the material taking mechanism 1 comprises a frame 11, a material taking belt line 12 for conveying the material tray 10 is arranged on the inner side of the frame 11, a jacking mechanism 8 for jacking the chip on the material tray 10 is further arranged in the frame 11, and the jacking mechanism 8 is located below the material taking belt line 12.

The material taking belt line 12 is oppositely arranged at the top of the inner side of the frame 11, which is in the prior art, two ends of the material tray 10 are respectively lapped on the material taking belt lines 12 at two sides, the material tray 10 can be conveyed through the rotation of the belt lines, the frame 11 is opposite to one end of the carrying module 3, a stacking mechanism for automatically feeding the material tray 10 is also arranged, namely, the material tray 10 filled with chips enters the material taking mechanism 1 from one end, and after the chips are taken out, the chips flow out of the device from the other end.

In order to facilitate the clamping jaw mechanism 2 to clamp and take the chip, the corresponding chip can be lifted up to the discharging disc 10 through the lifting mechanism 8; the lifting mechanism 8 comprises a lifting module 81 fixedly mounted on the inner side of the frame 11, the output end of the lifting module 81 is connected with a lifting plate 82, and the top of the lifting plate 82 is provided with a plurality of suckers 83 capable of adsorbing chips.

The bottom of the groove on the material tray 10 for laying chips is communicated with the material tray 10, and the upper end of the sucking disc 83 penetrates through the groove to adsorb the chips and simultaneously ejects the chips to the upper part of the material tray 10 under the drive of the lifting module 81, so that the clamping jaw mechanism 2 is convenient to clamp; after the clamping jaw mechanism 2 takes away the chip, the sucking disc 83 moves down to the lower side of the material tray 10, and the material taking belt line 12 moves one lattice in the direction close to the carrying module 3, that is, the material tray 10 moves one lattice forward, so that the groove carrying the chip is aligned with the sucking disc 83 of the lifting mechanism 8, and the next lifting is facilitated.

Wherein, the lifting module 81 adopts the existing linear module, such as an electric cylinder; and a plurality of sucking discs 83 are equidistantly distributed on the top of the jacking plate 82 and correspond to the positions of the grooves on the tray 10 for placing chips.

Example two

On the basis of the first embodiment, the clamping jaw mechanism 2, the carrying module 3, the rotating mechanism 4, the positioning guide mechanism 5, the X-axis linear module 6 and the feeding machine 7 are all provided with two groups and symmetrically distributed on two sides of the material taking mechanism 1 (as shown in fig. 1-2), so that the number of chips which are sorted by the equipment at the same time can be increased, and the sorting efficiency is further improved.

If the number of the jaw members 26 of each group of jaw mechanisms 2 is 4, the number of the material taking heads 43 of the rotating mechanism 4 and the number of the guide holes 52 of the positioning guide mechanism 5 are correspondingly 4, meanwhile, the number of the clamping grooves of the same row on the tray 9 is 4, and at least 8 chips are required to be placed on the same row on the tray 10 so that the two groups of jaw mechanisms 2 can clamp at the same time, thereby improving the sorting efficiency of the equipment.

Example III

On the basis of the first embodiment and the second embodiment, the invention also provides a distributing method of the automatic chip distributing machine, which comprises the following steps:

S1, carrying an empty tray 9 at the bottommost layer to the output end of an X-axis linear module 6 by using a stacking mechanism for blanking the tray 9 in a feeding machine 7, carrying the empty tray 9 to the lower part of a rotating mechanism 4 by using the X-axis linear module 6, and waiting for blanking by the rotating mechanism 4; meanwhile, chips paved in the material tray 10 are conveyed to one end close to the clamping jaw mechanism 2 by utilizing a material taking belt line 12 of the material taking mechanism 1, and then the forefront row of chips in the material tray 10 are jacked up by the jacking mechanism 8 to wait for the clamping jaw mechanism 2 to clamp the chips;

S2, adjusting the space between the clamping jaw parts 26 through the guide grooves 24 by utilizing the movement of the driving plate 22 relative to the vertical plate 21 along the Z-axis direction so as to align the chip jacked by the jacking mechanism 8; then the carrying module 3 is used for driving the clamping jaw mechanism 2 to the upper part of the jacking mechanism 8, and the corresponding chip is clamped by the clamping jaw part 26;

s3, after the clamping jaw mechanism 2 takes away the chips, the distance and the position of the clamping jaw parts 26 are reversely adjusted, and the tiled chips are aligned and placed into the guide holes 52 on the positioning plate 51 and then fall on the material taking head 43 of the rotating mechanism 4; in the process, the jacking mechanism 8 moves to the lower part of the material tray 10, the material taking belt line 12 moves forwards for one lattice, then the jacking mechanism 8 stretches out again to jack up the chips in the next row in the material tray 10, and the next time the clamping jaw mechanism 2 clamps the chips;

S4, after the chip is sucked by the material taking head 43, the support plate 42 is rotated for 90 degrees along the longitudinal direction, the chip is adjusted to be in an upright state from a flat state, and meanwhile, the support 41 is moved downwards along the Z-axis direction until the chip is placed in the tray 9 in an upright state; then the bracket 41 and the material taking head 43 move reversely, and the material taking head 43 is positioned right below the guide hole 52 again to wait for the next material taking of the clamping jaw mechanism 2;

S5, after the chips are longitudinally inserted into the tray 9, the tray 9 is driven by the X-axis linear module 6 to move forwards for one lattice, and the chips are waited for the next time for blanking; after the tray 9 is fully loaded, the X-axis linear module 6 drives the fully loaded tray 9 to a stacking mechanism for feeding the tray 9 in the feeding machine 7, the tray 9 is stacked layer by utilizing the stacking mechanism, then the empty tray 9 is moved to the position below the rotating mechanism 4 through the X-axis linear module 6, and the feeding of the rotating mechanism 4 is waited again.

The empty trays 9 required by the tray loading are manually loaded into an empty tray loading area of the loading machine 7, a stacking mechanism in the loading machine 7 can convey the bottommost empty tray to the output end of the X-axis linear module 6, and the X-axis linear module 6 conveys the empty tray to the lower part of the rotating mechanism 4 to wait for chip unloading; after the chips are fully distributed into a whole disc, the X-axis linear module 6 can convey the tray 9 to a full-disc blanking area of the feeding machine 7, and the discs are stacked layer by the stacking mechanism. The inside of the equipment still normally operates in the process of manually emptying the disc and filling the disc; the jacking mechanism 8 below the material taking belt line 12 jacks up the chips in the material tray 10, the two groups of clamping jaw mechanisms 2 (each group of four clamping jaw parts 26) can grab up the jacked chips, the two groups of clamping jaw mechanisms respectively move left and right to the positioning guide mechanism 5 (the product arrangement distance is adjusted through the variable-distance structure in the moving process), the clamping jaw mechanisms 2 discharge the products into the positioning guide mechanism 5, the products directly fall into the rotating mechanism 4 after being subjected to the positioning and guiding process, and the rotating mechanism 4 directly discharges the chips into the empty tray 9. In the process of carrying the chips by the clamping jaw mechanism 2, the jacking mechanism 8 below the material taking belt line 12 descends, the material taking belt line 12 moves forwards for one lattice, and the jacking mechanism 8 ascends again to jack up the second row of chips in the material tray 10 and wait for next material taking.

In summary, the present invention has at least the following advantages: (1) The clamping jaw mechanism 2 capable of changing the distance can be compatible with different arrangement conditions of most chips after being divided into discs, and the applicability is wider; (2) The three mechanisms of the clamping jaw mechanism 2, the positioning guide mechanism 5 and the rotating mechanism 4 are combined, so that the design of traditional conveying redundancy is simplified, and meanwhile, the efficiency of equipment is greatly improved due to the fact that multiple groups of clamping jaws are used for taking and discharging materials; (3) By adopting the form of the feeding machine 7, the full trays 9 outside the conveying line are automatically piled together, the full trays 9 can be manually conveyed outside the conveying line in the automatic material distributing process of the equipment, the empty trays 9 are supplemented, and the automatic discharging function without stopping is realized.

The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the person skilled in the art without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.

Claims (10)

1. The utility model provides an automatic feed divider of chip, includes feeding mechanism (1) and X axle straight line module (6) that are used for bearing charging tray (10) and tray (9) respectively, its characterized in that: one end of the material taking mechanism (1) is provided with a carrying module (3), and the output end of the carrying module (3) is connected with a clamping jaw mechanism (2) capable of moving along the X-axis and Y-axis directions;

one end of the X-axis linear module (6) close to the clamping jaw mechanism (2) is provided with a rotating mechanism (4) capable of ascending and descending along the Z-axis direction, the other end of the X-axis linear module extends into the feeding machine (7), and a positioning guide mechanism (5) is further arranged between the clamping jaw mechanism (2) and the rotating mechanism (4);

The clamping jaw mechanism (2) comprises a plurality of clamping jaw parts (26) for grabbing chips, and the distance between the clamping jaw parts (26) can be changed along the Y-axis direction; the rotary mechanism (4) comprises material taking heads (43) which correspond to the clamping jaw parts (26) in number and can absorb chips, and the material taking heads (43) can also be turned over longitudinally.

2. The automatic chip dispenser according to claim 1, wherein: the clamping jaw mechanism (2) further comprises a vertical plate (21), one side of the vertical plate (21) is connected with the output end of the carrying module (3), and the other side of the vertical plate is provided with a driving plate (22) and a plurality of connecting plates (23) which can move along the Z axis and the Y axis respectively;

A plurality of guide grooves (24) with inconsistent inclination angles are formed in the driving plate (22), the upper portion of the connecting plate (23) is slidably embedded in the guide grooves (24) through rollers (25), and the clamping jaw parts (26) are fixedly mounted on the lower portion of the connecting plate (23).

3. The automatic chip dispenser according to claim 2, wherein: the carrying module (3) comprises a Y-axis linear module (31) parallel to the Y-axis direction, the output end of the Y-axis linear module (31) is connected with a Z-axis linear module (32) parallel to the Z-axis direction, and the vertical plate (21) is connected with the output end of the Z-axis linear module (32).

4. The automatic chip dispenser according to claim 1, wherein: the rotary mechanism (4) further comprises a support (41) capable of lifting, one end of the X-axis linear module (6) penetrates through the support (41), a support plate (42) parallel to the Y-axis direction is rotatably arranged at the top of the support (41), and a plurality of material taking heads (43) are fixedly arranged on one side of the support plate (42) at equal intervals.

5. The automatic chip dispenser according to claim 1, wherein: the positioning guide mechanism (5) comprises a positioning plate (51), the positioning plate (51) is arranged between the clamping jaw part (26) and the material taking head (43), and guide holes (52) with the number and the positions corresponding to the material taking head (43) are formed in the positioning plate (51).

6. The automatic chip dispenser according to claim 1, wherein: the feeding machine (7) comprises a frame (71), one end of the X-axis linear module (6) extends into the frame (71), and two stacking mechanisms respectively used for feeding and discharging the tray (9) are arranged in the frame (71).

7. The automatic chip dispenser according to claim 6, wherein: the stacking mechanism comprises two top plates (73) which are oppositely arranged on two sides of the X-axis linear module (6) and can be lifted, a plurality of guide plates (72) used for guiding the tray (9) to move up and down are arranged above the top plates (73), one side of each guide plate (72) is provided with a supporting component (74) used for supporting the tray (9), and the output end of each supporting component (74) can stretch out and draw back.

8. The automatic chip dispenser according to claim 1, wherein: the material taking mechanism (1) comprises a frame (11), a material taking belt line (12) for conveying a material disc (10) is arranged on the inner side of the frame (11), and a jacking mechanism (8) for jacking the chip on the material disc (10) is further arranged in the frame (11).

9. The automatic chip dispenser of claim 8, wherein: the lifting mechanism (8) comprises a lifting module (81) fixedly mounted on the inner side of the frame (11), the output end of the lifting module (81) is connected with a lifting plate (82), and the top of the lifting plate (82) is provided with a plurality of suckers (83) capable of adsorbing chips.

10. A method of dispensing an automatic chip dispenser according to any one of claims 1 to 9, comprising the steps of:

S1, carrying an empty tray (9) at the bottommost layer to the output end of an X-axis linear module (6) by using a stacking mechanism for blanking the tray (9) in a feeding machine (7), carrying the empty tray (9) to the lower part of a rotating mechanism (4) by using the X-axis linear module (6), and waiting for blanking by the rotating mechanism (4); simultaneously, chips paved in a material tray (10) are conveyed to one end close to a clamping jaw mechanism (2) by using a material taking belt line (12) of a material taking mechanism (1), and then a row of chips at the forefront end in the material tray (10) are jacked up by a jacking mechanism (8) to wait for the clamping jaw mechanism (2) to clamp chips;

S2, adjusting the interval between the clamping jaw parts (26) through the guide grooves (24) by utilizing the movement of the driving plate (22) relative to the vertical plate (21) along the Z-axis direction so as to align the chip jacked by the jacking mechanism (8); then the carrying module (3) is used for driving the clamping jaw mechanism (2) to the upper part of the jacking mechanism (8), and the corresponding chip is clamped by the clamping jaw part (26);

S3, after the clamping jaw mechanism (2) takes away the chips, the distance and the position of the clamping jaw parts (26) are reversely adjusted, the tiled chips are aligned and placed into the guide holes (52) on the positioning plate (51), and then the chips fall on the material taking heads (43) of the rotating mechanism (4); in the process, the jacking mechanism (8) moves to the lower part of the material tray (10), the material taking belt line (12) moves forwards for a certain time, then the jacking mechanism (8) stretches out again to jack up the chips in the next row in the material tray (10) and wait for the next clamping jaw mechanism (2) to clamp the chips;

S4, after the material taking head (43) sucks the chip, the support plate (42) rotates 90 degrees along the longitudinal direction, the chip is adjusted to be in an upright state from a flat state, and the bracket (41) moves downwards along the Z-axis direction until the chip is placed in the tray (9) in an upright state; then the bracket (41) and the material taking head (43) move reversely, and the material taking head (43) is positioned right below the guide hole (52) again to wait for the next discharging of the clamping jaw mechanism (2);

S5, after the chips are longitudinally inserted into the tray (9), the tray (9) is driven by the X-axis linear module (6) to move forwards for one frame, and the chips are waited for the next time to be discharged; after the tray (9) is fully loaded, the X-axis linear module (6) drives the fully loaded tray (9) to a stacking mechanism for feeding the tray (9) in the feeding machine (7), the tray (9) is stacked layer by utilizing the stacking mechanism, then the empty tray (9) is moved to the lower part of the rotating mechanism (4) through the X-axis linear module (6), and the feeding of the rotating mechanism (4) is waited again.