CN118215283A - Die bonder with chip ejector pins running stably - Google Patents
Die bonder with chip ejector pins running stably Download PDFInfo
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- CN118215283A CN118215283A CN202410462680.2A CN202410462680A CN118215283A CN 118215283 A CN118215283 A CN 118215283A CN 202410462680 A CN202410462680 A CN 202410462680A CN 118215283 A CN118215283 A CN 118215283A
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- thimble
- die bonder
- chip
- ejector pins
- seat
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- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 230000001681 protective effect Effects 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims abstract description 10
- 239000007787 solid Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 11
- 241000252254 Catostomidae Species 0.000 claims description 4
- 238000012937 correction Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001232346 Gymnosperma glutinosum Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a die bonder with a chip ejector pin stably running, which relates to the technical field of die bonders and comprises a protective box, a workbench and a positioning table, wherein the workbench is arranged in the middle of the protective box, two groups of parallel transverse linear guide rails are symmetrically fixed at the top of the workbench, and two groups of forward linear guide rails are connected to the upper side of the transverse linear guide rails through magnet block tracks. This chip thimble steady operation's solid brilliant machine drives lead screw and magnet mechanism screw thread transmission through starting drive motor for magnet mechanism pushes away the installation cover upwards and the thimble body is upwards jacked the base plate chip, guarantees through the cooperation of drive motor and lead screw that the thimble subassembly has stable and accurate lift operation effect, can stabilize the wafer when the ejecting wafer of thimble subassembly, makes things convenient for solid brilliant mechanism to inhale the operation that brilliant snatch, guarantees that this solid brilliant machine has the operation effect of the ejecting chip of thimble stability.
Description
Technical Field
The invention relates to the technical field of die bonders, in particular to a die bonder with a chip thimble running stably.
Background
The die bonder is used for realizing high-speed and high-precision full-automatic mounting of components and parts, and is the most critical and complex equipment in the whole SMT production. The ejector pin of the die bonder mainly plays a role in fixing and supporting components in the process of mounting, and ensures that the components can be accurately mounted at the designated position on the PCB.
When the die bonder is used, the ejector pin assembly is required to push the wafer assembly of the patch, the conventional die bonder can generate abrupt pushing when the ejector pin assembly is pushed by the air cylinder to eject the wafer assembly, the ejection is heavy, and the operation stability of the ejector pin can be affected when the vibration is overlarge, so that the die bonder with the stable operation of the chip ejector pin is provided.
Disclosure of Invention
The invention aims to provide a die bonder with a chip ejector pin stably operated, so as to solve the problems of the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a die bonder with a chip thimble running stably, which comprises a protective box, a workbench and a positioning table,
The middle part of the protective box is provided with a workbench, two groups of parallel transverse linear guide rails are symmetrically fixed at the top of the workbench, two groups of forward linear guide rails are connected to the upper side of the transverse linear guide rails through magnet block tracks, the tops of the forward linear guide rails are respectively and slidably connected with a movable seat, and a dispensing mechanism and a die bonding mechanism are respectively arranged at one sides of the two groups of movable seats, which are close to each other;
The wafer box is installed to the upside of workstation, the upside of locating bench is installed to the upside, the downside of locating bench is provided with a perpendicular crisscross track and No. two tracks, the slip module is all installed to the bottom of locating bench and the orbital bottom of No. one, the locating bench passes through slip module and a track sliding connection, a track passes through slip module and No. two track sliding connection.
Preferably, a rotating motor is embedded in the middle of the workbench, a transmission motor is arranged on the side face of the rotating motor through a bracket, the output end of the transmission motor is connected with a screw rod through a coupling, and the outer side of the screw rod is in threaded connection with a magnet mechanism.
Preferably, the rotating turret is installed to the top output of rotating electrical machines, the both sides of rotating turret are connected with the installation cover, the thimble body is installed at the top of installation cover, and the thimble body includes two thimble and No. two thimbles of equidimension difference.
Preferably, a material box is arranged on one side of the outer wall of the protection box, the material box is used for storing a tray for loading the substrate, a supporting table is fixed on the lower side of the material box, the supporting table is installed with a lifting frame on the surface of the protection box, and a material pushing frame is installed on the side face of the material box.
Preferably, the overview camera is installed on one side of the movable seat, which is close to the dispensing mechanism and the die bonding mechanism, and the correction camera is installed on one side of the positioning table, which is close to the wafer box.
Preferably, two groups of straight rails and one group of toothed rails are parallelly arranged on the upper side of the workbench close to the storage box, and a front conveying table and a rear conveying table are connected to the upper side of the straight rails in a sliding manner.
Preferably, the side surfaces of the front conveying table and the rear conveying table are respectively provided with a movable motor, the bottom output end of the movable motor is provided with a gear disc, and the gear disc is meshed with the toothed rail.
Preferably, the upper sides of the front conveying table and the rear conveying table are respectively provided with two groups of fixed suckers, the upper sides of the front conveying table and the rear conveying table are respectively provided with a conveyor, and the lower sides of the conveyors are respectively provided with an arch-shaped seat.
Preferably, the middle part of back transport platform has been seted up the inner chamber, and is provided with the mount pad in the inner chamber, is located preceding transport platform top the conveyer is installed with preceding transport platform through the arch seat of bottom, is located the back transport platform top the conveyer is pegged graft with the inner chamber of back transport platform through the arch seat of bottom, the inner wall both sides of arch seat are fixed with the sliding sleeve.
Preferably, a driving motor is arranged at the bottom of the mounting seat through a screw, guide rails connected with the sliding sleeve are arranged at two sides of the driving motor, two groups of belt wheels are arranged at one side of the driving motor, one belt wheel is fixed with the output end of the driving motor, and toothed belts are sleeved at the outer sides of the two belt wheels;
The clamping seat is installed on one side of the toothed belt, and one end, away from the toothed belt, of the clamping seat is fixed with the arched seat inserted into the inner cavity of the rear conveying table.
Compared with the prior art, the invention has the beneficial effects that:
1. According to the die bonder with the chip ejector pins stably running, the transmission motor is started to drive the screw rod and the magnet mechanism to conduct thread transmission, so that the magnet mechanism pushes the mounting sleeve upwards and the ejector pin body pushes the substrate chip upwards, the ejector pin assembly is guaranteed to have stable and accurate lifting operation through the cooperation of the transmission motor and the screw rod, the wafer can be stabilized when the ejector pin assembly ejects the wafer, the die bonder is convenient to conduct die sucking and grabbing operation, and the die bonder is guaranteed to have the operation effect of the ejector pins stably ejecting the chip;
2. this chip thimble steady operation's die bonder drives two sets of pulleys through starting driving motor and just reverses to make the toothed belt in two sets of pulleys outside carry out forward and reverse operation, make the toothed belt drive the holder push-and-pull arch seat from top to bottom, thereby the arch seat slides from top to bottom along the guide rail of driving motor side through inboard sliding sleeve, and then make the arch seat reciprocate along the inner chamber of back transport platform, make the arch seat finely tune the lift to the conveyer on the back transport platform, conveniently drive the support charging tray and carry out the displacement fine setting on the height, realize holding the location adjustment of components and parts base plate.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of a workbench according to the invention;
FIG. 3 is a schematic view of a perspective structure of a workbench according to the present invention after viewing angle conversion;
FIG. 4 is a schematic perspective view of a positioning table according to the present invention;
FIG. 5 is a schematic view of a perspective view of the positioning table of the present invention after viewing angle conversion;
FIG. 6 is a schematic view of a positioning table of the present invention in front elevation and in cross-section;
FIG. 7 is a schematic view of a three-dimensional exploded structure of the present invention;
FIG. 8 is a schematic perspective view of the front and rear transfer tables of the present invention;
FIG. 9 is a schematic perspective exploded view of the front and rear conveyor tables of the present invention;
Fig. 10 is a schematic perspective cutaway view of the rear conveyor table of the present invention.
In the figure: 1. a protective box; 2. a work table; 3. a stock box; 301. a support; 302. a lifting frame; 303. a pushing frame; 4. a straight rail; 401. a toothed rail; 402. a front conveying table; 403. a rear conveying table; 403a, a mounting base; 403b, an arched seat; 403c, sliding sleeve; 403d, a drive motor; 403e, guide rails; 403f, pulleys; 403g, toothed belt; 403h, clamping seat; 404. a moving motor; 405. a gear plate; 406. fixing a sucker; 407. a conveyor; 5. a tray; 6. a transverse linear guide rail; 7. a forward linear guide rail; 701. a movable seat; 702. a dispensing mechanism; 703. a die bonding mechanism; 704. an overview camera; 8. a positioning table; 801. a wafer cassette; 802. correcting the camera; 803. a first track; 804. a sliding module; 805. a second track; 9. a rotating electric machine; 901. a drive motor; 902. a screw rod; 903. a magnet mechanism; 904. a rotating frame; 905. a mounting sleeve; 906. a thimble body; 906a, a first thimble; 906b, second ejector pin.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, the present invention provides a technical solution: the die bonder comprises a protective box 1, a workbench 2 and a positioning table 8, wherein the workbench 2 is arranged in the middle of the protective box 1, two groups of parallel transverse linear guide rails 6 are symmetrically fixed at the top of the workbench 2, two groups of forward linear guide rails 7 are connected to the upper side of the transverse linear guide rails 6 through magnet block tracks, movable seats 701 are slidably connected to the tops of the forward linear guide rails 7, and a dispensing mechanism 702 and a die bonder 703 are respectively arranged at one sides of the two groups of movable seats 701, which are close to each other;
The upper side of workstation 2 still is provided with locating platform 8, and wafer box 801 is installed to the upside of locating platform 8, and the downside of locating platform 8 is provided with a perpendicular crisscross track 803 and No. two tracks 805, and sliding module 804 is all installed to the bottom of locating platform 8 and the bottom of a track 803, and locating platform 8 passes through sliding module 804 and track 803 sliding connection, and a track 803 passes through sliding module 804 and No. two tracks 805 sliding connection.
Referring to fig. 5 and 7, a rotary motor 9 is embedded in the middle of the workbench 2, a transmission motor 901 is mounted on the side surface of the rotary motor 9 through a bracket, the output end of the transmission motor 901 is connected with a screw rod 902 through a coupling, and the outer side of the screw rod 902 is in threaded connection with a magnet mechanism 903;
The rotating turret 904 is installed to the top output of rotating electrical machines 9, and the both sides of rotating turret 904 are connected with installation cover 905, and thimble body 906 is installed at the top of installation cover 905, and thimble body 906 includes two different size thimble 906a and No. two thimble 906b, and magnet mechanism 903 and installation cover 905 constitute electromagnet structure.
In specific implementation, after the wafer and the substrate placed on the positioning table 8 are subjected to surface mounting, the driving motor 901 is started to drive the screw rod 902 to rotate forward, so that the screw rod 902 and the middle part of the magnet mechanism 903 are in threaded driving, the upper end of the magnet mechanism 903 pushes the mounting sleeve 905, the magnet mechanism 903 and the mounting sleeve 905 are magnetically combined together, and the mounting sleeve 905 drives the thimble body 906 to jack up the substrate chip upwards, so that the jacking state of thimble operation is realized;
The screw rod 902 is driven by the transmission motor 901 to rotate reversely, so that the screw rod 902 and the middle part of the magnet mechanism 903 are in reverse thread transmission, the magnet mechanism 903 moves downwards along a matched vertical slideway, when the installation sleeve 905 is hung on the rotating frame 904, the magnet mechanism 903 and the installation sleeve 905 are separated from electromagnetic attraction, the magnet mechanism 903 and the thimble body 906 are convenient to reset, and the thimble is in a recovery state of thimble operation;
Can drive rotating turret 904 and carry out the angle rotation when starting rotating electrical machines 9, conveniently switch two different size thimble 906a, no. two thimble 906b to realize the selection dress to thimble body 906 and use, can guarantee through the cooperation of drive motor 901 and lead screw 902 that this die bonder's thimble subassembly has stable and accurate lift operation, can stabilize the wafer when the ejecting wafer of thimble subassembly, make things convenient for die bonder 703 to inhale the operation that brilliant snatch.
Referring to fig. 2 and 3, a material box 3 is disposed on one side of the outer wall of the protection box 1, a tray 5 for storing and loading substrates is disposed on the material box 3, a supporting table 301 is fixed on the lower side of the material box 3, the supporting table 301 is mounted on a lifting frame 302 on the surface of the protection box 1, and a material pushing frame 303 is mounted on the side surface of the material box 3.
During the implementation, the lifting frame 302 and the pushing frame 303 are driven by the motor to operate, so that the lifting frame 302 and the pushing frame 303 have the lifting and forward and backward movement capabilities, when the lifting frame 302 drives the supporting platform 301 to drive the storage box 3 to move up and down, the position adjustment of the storage box 3 can be completed, the storage box 3 can be conveniently flush and butt-jointed with the front conveying table 402 on the workbench 2 when being positioned at different heights, the feeding of the storage tray 5 is facilitated, and the pushing frame 303 is started to push the storage tray 5 containing the component substrates to be conveyed onto the front conveying table 402.
Referring to fig. 2, an overview camera 704 is mounted on a side of the moving base 701 close to the dispensing mechanism 702 and the die attach mechanism 703, and a calibration camera 802 is mounted on a side of the positioning table 8 close to the wafer cassette 801.
During the implementation, through installing overview camera 704 on two removal seats 701, when two removal seats 701 follow horizontal linear guide 6, advance to linear guide 7 and carry out position adjustment, can make things convenient for the accurate point gum of point gum mechanism 702 and solid brilliant mechanism 703 to glue and solid brilliant operation through the assistance of overview camera 704, can assist positioning table 8 to follow track 803 and track 805 and carry out the position adjustment No. two through correction camera 802 simultaneously, guarantee that positioning table 8 carries out the correction of paster position.
Referring to fig. 2, 8 and 9, two sets of straight rails 4 and a set of toothed rails 401 are installed on the upper side of the workbench 2 close to the storage box 3 in parallel, and a front conveying table 402 and a rear conveying table 403 are connected to the upper side of the straight rails 4 in a sliding manner; the sides of the front conveying table 402 and the rear conveying table 403 are respectively provided with a movable motor 404, the bottom output end of the movable motor 404 is provided with a gear plate 405, and the gear plate 405 is meshed with the toothed rail 401.
In specific implementation, when the pushing frame 303 pushes the tray 5 in the storage box 3 onto the front conveying table 402, the gear plate 405 is driven to be meshed with the toothed rail 401 by starting the moving motor 404, so that the front conveying table 402 moves towards the rear conveying table 403, and when the front conveying table and the rear conveying table are abutted, the tray 5 is conveyed onto the conveyor 407 of the rear conveying table 403 by starting the conveyor 407 on the front conveying table 402, so that feeding is facilitated.
Referring to fig. 8 and 9, two groups of fixing suckers 406 are mounted on the upper sides of the front conveying table 402 and the rear conveying table 403, a conveyor 407 is disposed on the upper sides of the front conveying table 402 and the rear conveying table 403, an arch base 403b is mounted on the lower side of the conveyor 407, and when the positions of the front conveying table 402 and the rear conveying table 403 are adjusted along the straight rail 4, the fixing suckers 406 are started to adsorb the tray 5, so that the feeding stability is ensured.
Referring to fig. 8-10, an inner cavity is formed in the middle of the rear conveying table 403, a mounting seat 403a is disposed in the inner cavity, a conveyor 407 above the front conveying table 402 is mounted with the front conveying table 402 through an arch seat 403b at the bottom, the conveyor 407 above the rear conveying table 403 is inserted into the inner cavity of the rear conveying table 403 through an arch seat 403b at the bottom, and sliding sleeves 403c are fixed on two sides of the inner wall of the arch seat 403 b;
A driving motor 403d is arranged at the bottom of the mounting seat 403a through screws, guide rails 403e connected with the sliding sleeve 403c are arranged at two sides of the driving motor 403d, two groups of belt wheels 403f are arranged at one side of the driving motor 403d, one belt wheel 403f is fixed with the output end of the driving motor 403d, and toothed belts 403g are sleeved outside the two belt wheels 403 f; one side of the toothed belt 403g is provided with a clamping seat 403h, and one end of the clamping seat 403h away from the toothed belt 403g is fixed with an arch-shaped seat 403b inserted into the inner cavity of the rear conveying table 403.
In specific implementation, the driving motor 403d is started to drive the two groups of belt pulleys 403f to rotate positively and reversely, so that the toothed belt 403g on the outer sides of the two groups of belt pulleys 403f runs positively and reversely, the clamping seat 403h arranged on the toothed belt 403g can push and pull the arched seat 403b up and down, the arched seat 403b can slide up and down along the guide rail 403e on the side face of the driving motor 403d through the sliding sleeve 403c on the inner side, and then the arched seat 403b is driven to move up and down along the inner cavity of the rear conveying table 403, so that the arched seat 403b can finely adjust and lift the conveyor 407 on the rear conveying table 403, and the tray 5 is conveniently driven to finely adjust the displacement on the height, so that the positioning adjustment of the substrate for containing the components is realized.
In summary, through setting up the protective housing 1 in the outside of workstation 2 to set up the viewing aperture with the outside of protective housing 1, thereby can also make things convenient for the staff to observe the operation of die bonder when protective housing 1 carries out die bonder equipment for workstation 2, when the tray 5 that holds components and parts base plate sent to the inside of protective housing 1, can drive two sets of removal seats 701 and carry out horizontal and forward reciprocating motion through starting horizontal linear guide 6 and forward linear guide 7, thereby can carry out the point gum to the base plate through the point gum head of point gum mechanism 702, can absorb the chip bonding processing on the wafer that the base plate in base plate and the wafer box 801 was carried to location platform 8 through the suction nozzle of die bonder 703 simultaneously, the content that does not make detailed description in this description belongs to the prior art that the expert in this field knows.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (10)
1. The utility model provides a chip thimble steady operation's solid brilliant machine, includes protective housing (1), workstation (2) and locating bench (8), its characterized in that:
The middle part of the protective box (1) is provided with a workbench (2), two groups of parallel transverse linear guide rails (6) are symmetrically fixed at the top of the workbench (2), two groups of forward linear guide rails (7) are connected to the upper side of the transverse linear guide rails (6) through magnet block tracks, movable seats (701) are slidably connected to the tops of the forward linear guide rails (7), and a dispensing mechanism (702) and a die bonding mechanism (703) are respectively arranged at one sides, close to each other, of the two groups of movable seats (701);
The wafer box is characterized in that a positioning table (8) is further arranged on the upper side of the workbench (2), a wafer box (801) is arranged on the upper side of the positioning table (8), a first track (803) and a second track (805) which are perpendicularly crossed are arranged on the lower side of the positioning table (8), sliding modules (804) are arranged at the bottoms of the positioning table (8) and the first track (803), the positioning table (8) is in sliding connection with the first track (803) through the sliding modules (804), and the first track (803) is in sliding connection with the second track (805).
2. The die bonder with stable operation of chip ejector pins according to claim 1, wherein: the middle part embedding of workstation (2) is installed rotating electrical machines (9), the side of rotating electrical machines (9) is through support mounting has drive motor (901), the output of drive motor (901) is connected with lead screw (902) through the shaft coupling, the outside threaded connection of lead screw (902) has magnet mechanism (903).
3. The die bonder with stable operation of the chip ejector pins according to claim 2, wherein: rotating electrical machines (9)'s top output installs rotating turret (904), the both sides of rotating turret (904) are connected with installation cover (905), thimble body (906) is installed at the top of installation cover (905), and thimble body (906) include two thimble (906 a) and thimble (906 b) of a size difference.
4. The die bonder with stable operation of chip ejector pins according to claim 1, wherein: one side of protective housing (1) outer wall is provided with magazine (3), magazine (3) are used for storing tray (5) of loading the base plate, the downside of magazine (3) is fixed with saddle (301), saddle (301) are installed with crane (302) on protective housing (1) surface, side-mounting of magazine (3) has and pushes away work or material rest (303).
5. The die bonder with stable operation of chip ejector pins according to claim 1, wherein: an overview camera (704) is arranged on one side, close to the dispensing mechanism (702) and the die bonding mechanism (703), of the movable seat (701), and a correction camera (802) is arranged on one side, close to the wafer box (801), of the positioning table (8).
6. The die bonder with stable operation of chip ejector pins according to claim 1, wherein: two groups of straight rails (4) and a group of toothed rails (401) are parallelly arranged on the upper side of the workbench (2) close to the storage box (3), and a front conveying table (402) and a rear conveying table (403) are connected to the upper side of the straight rails (4) in a sliding mode.
7. The die bonder with stable operation of the chip ejector pins according to claim 6, wherein: the side of preceding transport platform (402) and back transport platform (403) are all installed mobile motor (404), gear disc (405) are installed to the bottom output of mobile motor (404), gear disc (405) meshes with rack (401).
8. The die bonder with stable operation of the chip ejector pins according to claim 7, wherein: two groups of fixed suckers (406) are arranged on the upper sides of the front conveying table (402) and the rear conveying table (403), a conveyor (407) is arranged on the upper sides of the front conveying table (402) and the rear conveying table (403), and an arch-shaped seat (403 b) is arranged on the lower side of the conveyor (407).
9. The die bonder with stable operation of chip ejector pins according to claim 8, wherein: the middle part of back transport platform (403) has seted up the inner chamber, and is provided with mount pad (403 a) in the inner chamber, is located preceding transport platform (402) top conveyer (407) are installed with preceding transport platform (402) through arch seat (403 b) of bottom, are located the back transport platform (403) top conveyer (407) are pegged graft with the inner chamber of back transport platform (403) through arch seat (403 b) of bottom, the inner wall both sides of arch seat (403 b) are fixed with sliding sleeve (403 c).
10. The die bonder with stable operation of chip ejector pins according to claim 9, wherein: a driving motor (403 d) is arranged at the bottom of the mounting seat (403 a) through a screw, guide rails (403 e) connected with the sliding sleeve (403 c) are arranged at two sides of the driving motor (403 d), two groups of belt wheels (403 f) are arranged at one side of the driving motor (403 d), one belt wheel (403 f) is fixed with the output end of the driving motor (403 d), and toothed belts (403 g) are sleeved at the outer sides of the two belt wheels (403 f);
One side of the toothed belt (403 g) is provided with a clamping seat (403 h), and one end, far away from the toothed belt (403 g), of the clamping seat (403 h) is fixed with an arch-shaped seat (403 b) inserted into the inner cavity of the rear conveying table (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410462680.2A CN118215283A (en) | 2024-04-17 | 2024-04-17 | Die bonder with chip ejector pins running stably |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410462680.2A CN118215283A (en) | 2024-04-17 | 2024-04-17 | Die bonder with chip ejector pins running stably |
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| Publication Number | Publication Date |
|---|---|
| CN118215283A true CN118215283A (en) | 2024-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410462680.2A Pending CN118215283A (en) | 2024-04-17 | 2024-04-17 | Die bonder with chip ejector pins running stably |
Country Status (1)
| Country | Link |
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| CN (1) | CN118215283A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119212372A (en) * | 2024-10-12 | 2024-12-27 | 无锡伟鸿基电子有限公司 | SMT (surface mounted technology) adhesive curing device and method |
-
2024
- 2024-04-17 CN CN202410462680.2A patent/CN118215283A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119212372A (en) * | 2024-10-12 | 2024-12-27 | 无锡伟鸿基电子有限公司 | SMT (surface mounted technology) adhesive curing device and method |
| CN119212372B (en) * | 2024-10-12 | 2025-03-21 | 无锡伟鸿基电子有限公司 | A SMT patch adhesive curing device and method |
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