CN118139268B - A multi-layer circuit board with high efficiency in heat dissipation - Google Patents
A multi-layer circuit board with high efficiency in heat dissipation Download PDFInfo
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- CN118139268B CN118139268B CN202410133880.3A CN202410133880A CN118139268B CN 118139268 B CN118139268 B CN 118139268B CN 202410133880 A CN202410133880 A CN 202410133880A CN 118139268 B CN118139268 B CN 118139268B
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- heat conduction
- heat
- heat dissipation
- multilayer circuit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 51
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000000872 buffer Substances 0.000 claims abstract description 20
- 238000007791 dehumidification Methods 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000003779 heat-resistant material Substances 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 3
- 230000035939 shock Effects 0.000 claims 3
- 239000011435 rock Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 18
- 230000009471 action Effects 0.000 description 5
- 238000013016 damping Methods 0.000 description 5
- 241000883990 Flabellum Species 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/263—Drying gases or vapours by absorption
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a multilayer circuit board with efficient heat dissipation, and relates to the technical field of multilayer circuit boards. The heat dissipation device comprises a multilayer circuit board, two supporting frames, two mounting plates, a heat dissipation device, a heat conduction device, a buffer device, a heat conduction device and a plurality of ceramic heat dissipation fins, wherein the heat dissipation device is arranged on the outer wall of the multilayer circuit board, the heat dissipation device is arranged on the back surface of the heat dissipation device, the heat conduction device is arranged on the right side of the heat dissipation device, the buffer device is respectively arranged on the opposite surfaces of the two supporting frames, the heat dissipation device further comprises a rectangular heat conduction frame, four heat conduction feet, four hollow heat conduction pipes, a heat conduction circular ring, a fan device and the plurality of ceramic heat dissipation fins, and the rectangular heat conduction frame is fixedly arranged on the outer wall of the multilayer circuit board. The fan device provided by the invention can uniformly discharge heat, and prevent the damage of electronic elements of the multilayer circuit board caused by overhigh local heat, so that the problem of local high-temperature damage caused by uneven heat dissipation effect of the multilayer circuit board is avoided.
Description
Technical Field
The invention relates to the technical field of multilayer circuit boards, in particular to a high-efficiency heat dissipation multilayer circuit board.
Background
The multilayer circuit board is a circuit board structure with a plurality of layers and internal interconnection, and is generally composed of a plurality of copper foil layers, insulating material layers and silk screen printing layers, the number of layers can be varied from two layers to tens of layers, different layers are connected through electric holes, and the wiring density and the signal transmission speed of the circuit board can be improved, so that higher circuit functions and performances are realized, and the multilayer circuit board is widely applied to high-speed digital circuits, microprocessors and communication equipment.
The invention discloses a high-efficiency heat-dissipation multilayer circuit board, which comprises a lower layer plate, wherein a first prepreg is arranged at the upper end of the lower layer plate, a first ceramic heat-conducting plate, a core plate and a second ceramic heat-conducting plate are arranged at the upper end of the first prepreg, a yielding groove is formed in the upper side of the middle of the core plate, a heat dissipation device is fixed in the yielding groove, a first circuit layer is arranged at the upper end of the core plate, a chip is welded on the first circuit layer, and the chip is positioned right below the heat dissipation device. The multilayer circuit board of this patent welds the chip on the sandwich plate upper end to offer a groove of stepping down that is used for holding heat abstractor, can reduce the holistic volume of circuit board.
However, the existing high-efficiency heat-dissipation multi-layer circuit board has the following problems that when the high-efficiency heat-dissipation multi-layer circuit board dissipates heat, the heat is accumulated on the part of the multi-layer circuit board, so that the multi-layer circuit board is easy to cause local high-temperature damage, and the heat dissipation of the multi-layer circuit board is uneven.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the high-efficiency heat-dissipation multilayer circuit board, and solves the problems that the heat is accumulated on the part of the multilayer circuit board and is easy to cause local high-temperature damage, so that the multilayer circuit board is unevenly and locally damaged in heat dissipation.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a high-efficient radiating multilayer circuit board, includes multilayer circuit board, two support frames and two mounting panels, two the support frames are inlayed and are fixed in multilayer circuit board left and right sides, two the mounting panel is fixed respectively in two support frames and is kept away from multilayer circuit board's one end, two round holes have been seted up to the mounting panel surface, still include heat abstractor, dehydrating unit, heat conduction device and buffer, heat abstractor sets up on multilayer circuit board outer wall, dehydrating unit sets up at the heat abstractor rear side, heat conduction device sets up on dehydrating unit and is located the dehydrating unit right side, buffer sets up between two support frames, wherein, heat abstractor still includes back shape heat pipe, four heat conduction feet, four hollow heat conduction pipes, heat conduction ring, fan device, a plurality of ceramic fin, back shape heat pipe fixed mounting is on multilayer circuit board outer wall, four the heat conduction pipe is fixed respectively in four corners department of back shape heat conduction frame, four hollow heat conduction pipes are fixed respectively at four foot ring, the heat conduction ring is fixed respectively at four heat conduction ring and is kept away from the heat dissipation device, thereby is close to the heat dissipation device and is led to the high temperature and is led to the fact the multilayer circuit board to the high heat dissipation device to cause the local heat dissipation problem, and is avoided the heat dissipation device to be close to one side to the heat dissipation device to heat dissipation part to heat dissipation device to heat evenly to the multilayer circuit board to heat.
Preferably, the front surface of the multilayer circuit board is welded with a plurality of resistors, the front surface of the multilayer circuit board is welded with a plurality of semiconductor chips, the semiconductor chips of the multilayer circuit board are used for controlling the fan device to be turned on and off through wires, the front surface of the multilayer circuit board is welded with a plurality of wire interfaces, the rectangular heat conducting frame is made of non-conductive heat-resistant materials, and a plurality of heat conducting gaps are arranged between the ceramic radiating fins.
Preferably, the dehumidification device comprises two bar boxes, two motors, two rollers, a U-shaped plate, a dehumidification box and a silica gel dehumidification block, wherein the two bar boxes are respectively fixed on the top surface and the bottom surface of a return heat conduction frame, the two bar boxes are respectively provided with sliding grooves towards the back surface, the two bar boxes are respectively provided with sliding rails at the back surfaces, the two motors are respectively and slidably mounted inside the two bar boxes, the two rollers are respectively fixed at the back surfaces of two motor rotating shafts, the two rollers are respectively and slidably mounted in the sliding rails of the two bar boxes, the U-shaped plate is fixed at the back surfaces of the two motors, the dehumidification box is fixed in the middle of the front surface of the U-shaped plate, the front surface of the dehumidification box is provided with an air inlet, the silica gel dehumidification block is fixedly mounted on the inner wall of the dehumidification box, and the silica gel dehumidification block absorbs moisture in gas, so that electronic components on a multilayer circuit board are prevented from being corroded by gas with moisture, and the problem that electronic components of the multilayer circuit board are damaged by moisture is avoided.
Preferably, two motors are fixed with sliding pads respectively opposite to each other, semiconductor chips of the multilayer circuit board are used for controlling the motors to be opened and closed through wires, rubber films are respectively fixed on the outer walls of the two rollers, and a filter screen is fixedly installed at an air inlet of the dehumidification box.
Preferably, the heat conduction device comprises an L-shaped plate, a fan plate, two rubber strips and a damping component, wherein the L-shaped plate is fixed in the middle of the back of the U-shaped plate, the fan plate is rotationally arranged on the front of the L-shaped plate, a torsion spring is arranged between the fan plate and the L-shaped plate, the two rubber strips are respectively fixed on the left side and the right side of the fan plate, the damping component is respectively arranged on the top surface and the bottom surface of the L-shaped plate, the air flow blows the back of the multilayer circuit board, heat is prevented from accumulating on the back of the multilayer circuit board, and the problem that the back of the multilayer circuit board is damaged due to overhigh heat is avoided.
Preferably, the damping assembly comprises two laths and two U-shaped connecting plates, wherein the two laths are respectively hinged to the top surface and the bottom surface of the U-shaped plate, the two U-shaped connecting plates are respectively hinged to the top surface and the bottom surface of the support frame, the two laths are respectively rotatably arranged inside the U-shaped connecting plates at one ends of the laths far away from the U-shaped plate, torsion springs are arranged between the two laths and the two U-shaped connecting plates, and the laths and the U-shaped connecting plates are used for buffering the dehumidification boxes, so that vibration caused by movement of the dehumidification boxes in the dehumidification process is reduced, and the problem that electronic elements are damaged due to vibration caused by dehumidification of the multilayer circuit board is avoided.
Preferably, the buffer device comprises four cushion strips, two arc-shaped elastic sheets and a protection component, wherein two cushion strips are respectively fixed on the left side and the right side of the return-shaped heat conducting frame, the other two cushion strips are respectively fixed on the inner wall of the support frame, the two arc-shaped elastic sheets are respectively fixed between the two cushion strips, the protection component is arranged on the front sides of the four cushion strips, the arc-shaped elastic sheets on the cushion strips buffer the return-shaped heat conducting frame, and the multilayer circuit board on the return-shaped heat conducting frame in the carrying process is prevented from shaking to cause damage to electronic elements, so that the problem of easy damage caused by shaking of the multilayer circuit board in the carrying process is avoided.
Preferably, the protection component comprises four supporting plates, a grid plate and two baffles, wherein two supporting plates are respectively fixed on the top surfaces of four backing strips, the other two supporting plates are respectively fixed on the bottom surfaces of four backing strips, the grid plate is fixedly arranged on the front surfaces of the four supporting plates, two baffles are respectively fixed on the top surfaces and the bottom surfaces of the grid plate, two baffles are respectively provided with two back-shaped heat conducting frames, the grid plate and the baffles prevent foreign matters from entering or colliding with the multilayer circuit board, and the foreign matters are prevented from damaging the multilayer circuit board, so that the problem that the multilayer circuit board is accidentally damaged by the foreign matters is avoided.
The invention provides a multilayer circuit board with efficient heat dissipation. The beneficial effects are as follows:
(1) According to the invention, through the arrangement of the heat dissipation device, the heat conduction frame, the heat conduction feet, the hollow heat conduction pipe, the heat conduction circular ring and the fan device are matched with the ceramic heat dissipation plate, the ceramic heat dissipation plate absorbs heat in the middle of the multi-layer circuit board, the ceramic heat dissipation plate transfers the heat into the heat conduction circular ring, the hollow heat conduction pipe transfers the heat at the edge of the multi-layer circuit board into the heat conduction circular ring, the fan device uniformly discharges the heat, and the damage of electronic elements of the multi-layer circuit board caused by overhigh local heat is prevented, so that the problem of local high-temperature damage caused by uneven heat dissipation effect of the multi-layer circuit board is avoided.
(2) According to the invention, through the arrangement of the dehumidifying device, the strip-shaped box, the motor, the roller, the U-shaped plate and the dehumidifying box are matched with the silica gel dehumidifying block, so that the contact area between the silica gel dehumidifying block and gas is increased in the process of reciprocating left and right, the silica gel dehumidifying block absorbs moisture in the gas, and the electronic components on the multilayer circuit board are prevented from being corroded by the gas with moisture, thereby avoiding the problem that the electronic components of the multilayer circuit board are damaged by moisture.
(3) According to the invention, through the arrangement of the heat conducting device, the L-shaped plate, the fan plate, the rubber strips and the ribbon board are matched with the U-shaped connecting plate, the fan plate is in reciprocating fanning in the L-shaped plate, the rubber strips on the fan plate prevent collision damage, the fan plate fanns air flow, the air flow blows the back of the multi-layer circuit board, heat is prevented from accumulating on the back of the multi-layer circuit board, the problem that the back of the multi-layer circuit board is damaged due to overhigh heat is avoided, the ribbon board and the U-shaped connecting plate buffer the dehumidifying box, vibration caused by movement of the dehumidifying box in the dehumidifying process is reduced, and the problem that electronic elements are damaged due to vibration caused by dehumidification of the multi-layer circuit board is avoided.
(4) According to the invention, through the arrangement of the buffer device, the cushion strip, the arc-shaped elastic sheet, the supporting plate and the grid plate are matched with the baffle plate, the arc-shaped elastic sheet on the cushion strip buffers the back-shaped heat conduction frame, and the damage of electronic elements caused by shaking of the multi-layer circuit board on the back-shaped heat conduction frame in the carrying process is prevented, so that the problem of easy damage caused by shaking of the multi-layer circuit board in the carrying process is avoided, in addition, the grid plate and the baffle plate prevent foreign matters from entering or colliding with the multi-layer circuit board, the foreign matters are prevented from damaging the multi-layer circuit board, and the problem that the multi-layer circuit board is accidentally damaged by the foreign matters is avoided.
Drawings
FIG. 1 is a schematic diagram of the overall invention;
FIG. 2 is a schematic view of the invention in overall left side cross-section;
FIG. 3 is a schematic diagram of a front side of a heat dissipating device according to the present invention;
FIG. 4 is a schematic view of a left side cross-section of a heat dissipating device according to the present invention;
FIG. 5 is a schematic view of a front cross-section of a dehumidification device of the present disclosure;
FIG. 6 is a schematic view of the back of the dehumidification device of the present disclosure;
FIG. 7 is a schematic view of a backside cross-section of a heat transfer device of the present invention;
FIG. 8 shows a buffer device according to the present invention schematic drawing of a cross-section of the bottom surface.
The heat-conducting device comprises a multi-layer circuit board (1), a supporting frame (2), a mounting plate (3), a heat-radiating device (4), a heat-radiating device (5), a dehumidifying device (6), a heat-conducting device (7), a buffer device (41), a loop-shaped heat-conducting frame (42), heat-conducting feet (43), hollow heat-conducting pipes (44), a heat-conducting circular ring (45), a fan device (46), a ceramic heat-radiating sheet (51), a strip-shaped box (52), a motor (53), a roller, 54, a U-shaped plate (55), a dehumidifying box (56), a silica gel dehumidifying block (61), an L-shaped plate (62), a fan plate (63), a rubber strip (64), a slat (65), a U-shaped connecting plate (71), a filler strip (72), an arc-shaped elastic sheet (73), a supporting plate (74), a grid plate (75) and a baffle plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Example 1
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a high-efficient radiating multilayer circuit board, including multilayer circuit board 1, two support frames 2 and two mounting panels 3, two support frames 2 are inlayed and are fixed in multilayer circuit board 1 left and right sides, two mounting panels 3 are fixed respectively in two support frames 2 and keep away from multilayer circuit board 1's one end, the round hole has been seted up on two mounting panels 3 surfaces, still include heat abstractor 4 and dehydrating unit 5, wherein heat abstractor 4 sets up on multilayer circuit board 1 outer wall, heat abstractor 4 still includes the heat conduction frame of returning shape 41, four heat conduction feet 42, four hollow heat conduction pipes 43, heat conduction ring 44, fan unit 45, a plurality of ceramic fin 46, the heat conduction frame of returning shape 41 fixed mounting is on multilayer circuit board 1 outer wall, four heat conduction feet 42 are fixed respectively in four corners of returning shape heat conduction frame 41, four hollow heat conduction pipes 43 are fixed respectively in four heat conduction feet 42 in the front, the heat conducting ring 44 is fixed at one end of the four hollow heat conducting pipes 43 far away from the four heat conducting pins 42 respectively, the fan device 45 is fixedly arranged in the middle of the inner wall of the heat conducting ring 44, the ceramic radiating fins 46 are respectively fixed at one side of the heat conducting ring 44 close to the circular heat conducting frame 41, the front surface of the multilayer circuit board 1 is welded with a plurality of resistors, the front surface of the multilayer circuit board 1 is welded with a plurality of semiconductor chips, the semiconductor chips of the multilayer circuit board 1 are used for controlling the fan device 45 to be opened and closed through wires, the front surface of the multilayer circuit board 1 is welded with a plurality of wire interfaces, the circular heat conducting frame 41 is made of non-conductive heat-resistant materials, heat conducting gaps are arranged among the ceramic radiating fins 46, the ceramic radiating fins 46 absorb heat in the middle of the multilayer circuit board 1, the ceramic radiating fins 46 transfer the heat into the heat conducting ring 44, the hollow heat conducting pipe 43 transfers the heat at the edge of the multilayer circuit board 1 to the heat conducting circular ring 44, and the fan device 45 uniformly discharges the heat, so that the damage of electronic components of the multilayer circuit board 1 caused by overhigh local heat is prevented, and the problem of local high-temperature damage caused by uneven heat dissipation effect of the multilayer circuit board 1 is avoided.
The dehumidification device 5 is arranged at the rear side of the heat dissipation device 4, the dehumidification device 5 comprises two strip-shaped boxes 51, two motors 52, two rollers 53, a U-shaped plate 54, a dehumidification box 55 and a silica gel dehumidification block 56, the two strip-shaped boxes 51 are respectively fixed at the top surface and the bottom surface of the rectangular heat conduction frame 41, the two strip-shaped boxes 51 are respectively provided with sliding grooves towards the back surface, the back surfaces of the two strip-shaped boxes 51 are respectively provided with sliding rails, the two motors 52 are respectively and slidably arranged in the two strip-shaped boxes 51, the two rollers 53 are respectively fixed at the back surfaces of the rotating shafts of the two motors 52, the two rollers 53 are respectively and slidably arranged in the sliding rails of the two strip-shaped boxes 51, the U-shaped plate 54 is fixed at the back surfaces of the two motors 52, the dehumidification box 55 is fixed in the middle of the front surfaces of the U-shaped plate 54, the front of the dehumidifying box 55 is provided with an air inlet, a silica gel dehumidifying block 56 is fixedly arranged on the inner wall of the dehumidifying box 55, two motors 52 are respectively fixed with sliding pads oppositely, semiconductor chips of the multilayer circuit board 1 are used for controlling the motors 52 to be opened and closed through wires, the outer walls of the two rollers 53 are respectively fixed with rubber films, the air inlet of the dehumidifying box 55 is fixedly provided with a filter screen, the contact area between the silica gel dehumidifying block 56 and gas is increased in the left and right reciprocating movement process, the silica gel dehumidifying block 56 absorbs moisture in the gas more, and electronic components on the multilayer circuit board 1 are prevented from being corroded by the gas with the moisture, so that the problem that the electronic components of the multilayer circuit board 1 are damaged by moisture is avoided.
The staff puts multilayer circuit board 1 into the casing to connect in the casing through mounting panel 3 on support frame 2, in daily use, the heat at multilayer circuit board 1 edge is absorbed to the heat conduction frame 41 that returns on the multilayer circuit board 1, return shape heat conduction frame 41 will heat transfer to heat conduction foot 42, heat transfer foot 42 will heat transfer to hollow heat conduction pipe 43, hollow heat conduction pipe 43 will heat transfer to heat conduction ring 44, the heat in multilayer circuit board 1 middle part gives off on ceramic fin 46, semiconductor chip on the multilayer circuit board 1 is used for starting the fan device 45 on heat conduction ring 44 through the electric wire simultaneously, fan device 45 begins to rotate the flabellum, the flabellum rotates and rolls up the air current, and outwards discharge the air current, make ceramic fin 46 absorb the heat in multilayer circuit board 1 middle part, ceramic fin 46 will heat transfer to heat conduction ring 44 in, hollow heat conduction pipe 43 will multilayer circuit board 1 edge's heat transfer to in the heat conduction ring 44, fan device 45 evenly discharges the heat, prevent that local heat from causing multilayer circuit board 1 electronic component to damage, thereby the inhomogeneous high heat dissipation problem that causes multilayer circuit board 1 electronic component damage has been avoided.
When the multilayer circuit board 1 is in a humid environment, the semiconductor chips on the multilayer circuit board 1 are used for starting the motor 52 in the strip-shaped box 51 through the electric wires, the motor 52 rotates forward and backward, the motor 52 drives the roller 53 to rotate forward and backward, the roller 53 slides back and forth in the sliding rail of the strip-shaped box 51, the roller 53 drives the motor 52 to slide back and forth in the strip-shaped box 51, the motor 52 drives the U-shaped plate 54 to move back and forth, the U-shaped plate 54 drives the dehumidifying box 55 to move back and forth, the dehumidifying box 55 drives the silica gel dehumidifying block 56 to move back and forth, the contact area between the silica gel dehumidifying block 56 and gas is increased in the back and forth reciprocating movement process, moisture in the gas is absorbed by the silica gel dehumidifying block 56, and electronic components on the multilayer circuit board 1 are prevented from being corroded by the gas with moisture, and the problem that the electronic components of the multilayer circuit board 1 are damaged by moisture is avoided.
Example 2
Referring to fig. 1-8, based on embodiment 1, the present embodiment further includes a heat conducting device 6 and a buffer device 7, wherein the heat conducting device 6 is disposed on the dehumidifying device 5 and located on the right side of the dehumidifying device 5, the heat conducting device 6 includes an L-shaped plate 61, a fan plate 62, two rubber strips 63 and a damping component, the L-shaped plate 61 is fixed in the middle of the back of the U-shaped plate 54, the fan plate 62 is rotatably installed on the front of the L-shaped plate 61, a torsion spring is disposed between the fan plate 62 and the L-shaped plate 61, the two rubber strips 63 are respectively fixed on the left side and the right side of the fan plate 62, the fan plate 62 reciprocates in the L-shaped plate 61, the rubber strips 63 on the fan plate 62 prevent collision damage, the fan plate 62 fans airflow, and the airflow blows the back of the multi-layer circuit board 1, thereby preventing heat from accumulating on the back of the multi-layer circuit board 1, and avoiding the problem of excessive heat damage of the back of the multi-layer circuit board 1.
The damping device sets up at L shaped plate 61 top surface and bottom surface respectively, damper includes two laths 64 and two U-shaped connecting plates 65, two laths 64 articulate respectively at U shaped plate 54 top surface and bottom surface, two U-shaped connecting plates 65 articulate respectively at support frame 2 top surface and bottom surface, the one end that U shaped plate 54 was kept away from to two laths 64 is rotated respectively and is installed inside U-shaped connecting plate 65, be provided with the torsional spring between two laths 64 and two U-shaped connecting plates 65, lath 64 and U-shaped connecting plate 65 buffering dehumidification box 55, reduce the vibrations that dehumidification box 55 removed and cause in the dehumidification process, thereby avoided multilayer circuit board 1 dehumidification to cause vibrations to damage electronic component's problem.
The buffer device 7 is arranged between the two supporting frames 2, the buffer device 7 comprises four cushion bars 71, two arc-shaped elastic sheets 72 and a protection component, the two cushion bars 71 are respectively fixed on the left side and the right side of the square heat conducting frame 41, the other two cushion bars 71 are respectively fixed on the inner wall of the supporting frames 2, the two arc-shaped elastic sheets 72 are respectively fixed between the two cushion bars 71, the arc-shaped elastic sheets 72 on the cushion bars 71 buffer the square heat conducting frame 41, and the multilayer circuit board 1 on the square heat conducting frame 41 in the conveying process is prevented from shaking to cause damage to electronic components, so that the problem of easy damage caused by shaking in the conveying process of the multilayer circuit board 1 is avoided.
The protection component sets up in four backing strips 71 openly, the protection component includes four fagging 73, grid plate 74 and two baffles 75, two fagging 73 are fixed respectively at four backing strips 71 top surfaces, two other fagging 73 are fixed respectively at four backing strips 71 bottom surfaces, grid plate 74 fixed mounting is in four fagging 73 openly, two baffles 75 are fixed respectively at grid plate 74 top surface and bottom surface, two baffles 75 set up two return shape heat conduction frame 41 fronts respectively, grid plate 74 and baffle 75 prevent that there is the foreign matter to get into or collide with multilayer circuit board 1, the foreign matter has prevented to destroy multilayer circuit board 1, thereby the problem that multilayer circuit board 1 accident received the foreign matter damage has been avoided.
While the motor 52 drives the U-shaped plate 54 to reciprocate left and right, the U-shaped plate 54 drives the L-shaped plate 61 to reciprocate left and right, the L-shaped plate 61 drives the fan plate 62 to reciprocate left and right, the fan plate 62 rotates in the L-shaped plate 61, the fan plate 62 is limited by the torsion spring, the fan plate 62 reciprocates in the L-shaped plate 61, the rubber strip 63 on the fan plate 62 prevents from being knocked and damaged, the fan plate 62 fans air flow, the air flow blows the back of the multilayer circuit board 1, heat is prevented from accumulating on the back of the multilayer circuit board 1, and accordingly the problem of overhigh heat damage of the back of the multilayer circuit board 1 is avoided.
While the U-shaped plate 54 drives the L-shaped plate 61 to reciprocate left and right, the lath 64 on the L-shaped plate 61 is limited by the U-shaped connecting plate 65, the lath 64 reciprocates up and down in the L-shaped plate 61, the lath 64 drives the U-shaped connecting plate 65 to reciprocate up and down outside the lath 64, the U-shaped connecting plate 65 reciprocates up and down in the supporting frame 2, under the action of the elasticity of the torsion spring on the lath 64, the lath 64 and the U-shaped connecting plate 65 buffer the dehumidifying box 55, and vibration caused by the movement of the dehumidifying box 55 in the dehumidifying process is reduced, so that the problem that electronic elements are damaged by vibration caused by the dehumidifying of the multilayer circuit board 1 is avoided.
In the daily handling, under the action of the elastic force of the arc-shaped elastic sheet 72 on the pad strip 71, the arc-shaped elastic sheet 72 on the pad strip 71 buffers the shape-returning heat conduction frame 41, so that the multilayer circuit board 1 on the shape-returning heat conduction frame 41 in the handling process is prevented from shaking to cause damage to electronic elements, and the problem that the multilayer circuit board 1 is easy to damage in the handling process is avoided.
In the daily use process, the grid plate 74 on the supporting plate 73 prevents foreign matters from knocking against the multilayer circuit board 1, and the baffle plate 75 on the grid plate 74 prevents the foreign matters from entering the multilayer circuit board 1, so that the grid plate 74 and the baffle plate 75 effectively prevent the foreign matters from damaging the multilayer circuit board 1, and the problem that the multilayer circuit board 1 is accidentally damaged by the foreign matters is avoided.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present invention, and the present invention is not limited thereto, but may be modified or substituted for some of the technical features thereof by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a high-efficient radiating multilayer circuit board, includes multilayer circuit board (1), two support frames (2) and two mounting panel (3), two support frames (2) are inlayed and are fixed in multilayer circuit board (1) left and right sides, two mounting panel (3) are fixed respectively in two support frames (2) one end of keeping away from multilayer circuit board (1), two round hole has been seted up on mounting panel (3) surface, wherein still include heat abstractor (4), dehydrating unit (5), heat conduction device (6) and buffer unit (7), heat abstractor (4) set up on multilayer circuit board (1) outer wall, dehydrating unit (5) set up in heat abstractor (4) rear side, heat conduction device (6) set up on dehydrating unit (5) and are located dehydrating unit (5) right side, buffer unit (7) set up between two support frames (2) for multilayer circuit board (1) are prevented in the handling that multilayer circuit board (1) rocks and cause electronic component to damage;
the heat dissipation device comprises a heat dissipation device (4), and is characterized by further comprising a heat conduction frame (41), four heat conduction pins (42), four hollow heat conduction pipes (43), a heat conduction circular ring (44), a fan device (45) and a plurality of ceramic heat dissipation fins (46), wherein the heat conduction frame (41) is fixedly installed on the outer wall of the multilayer circuit board (1), the four heat conduction pins (42) are respectively fixed at four corners of the heat conduction frame (41), the four hollow heat conduction pipes (43) are respectively fixed on the front surfaces of the four heat conduction pins (42), the heat conduction circular ring (44) is fixed at one ends, far away from the four heat conduction pins (42), of the four hollow heat conduction pipes (43), the fan device (45) is fixedly installed in the middle of the inner wall of the heat conduction circular ring (44), and the ceramic heat dissipation fins (46) are respectively fixed at one side, close to the heat conduction circular ring (44), of the heat conduction circular ring (41).
2. The high-efficiency heat dissipation multi-layer circuit board as set forth in claim 1, wherein a plurality of resistors are welded on the front surface of the multi-layer circuit board (1), a plurality of semiconductor chips are welded on the front surface of the multi-layer circuit board (1), the semiconductor chips of the multi-layer circuit board (1) are used for controlling the opening and closing of the fan device (45) through wires, a plurality of wire interfaces are welded on the front surface of the multi-layer circuit board (1), the loop-shaped heat conduction frame (41) is made of non-conductive heat-resistant materials, and heat conduction gaps are arranged among the plurality of ceramic heat dissipation fins (46).
3. The efficient heat dissipation multi-layer circuit board according to claim 1, wherein the dehumidification device (5) comprises two strip-shaped boxes (51), two motors (52), two rollers (53), a U-shaped plate (54), a dehumidification box (55) and a silica gel dehumidification block (56), the two strip-shaped boxes (51) are respectively fixed on the top surface and the bottom surface of the return-type heat conduction frame (41), sliding grooves are respectively formed in the back surfaces of the two strip-shaped boxes (51), sliding rails are respectively formed in the back surfaces of the two strip-shaped boxes (51), the two motors (52) are respectively and slidably mounted in the back surfaces of rotating shafts of the two strip-shaped boxes (51), the two rollers (53) are respectively and slidably mounted in the sliding rails of the two strip-shaped boxes (51), the U-shaped plate (54) is fixed on the back surfaces of the two motors (52), the dehumidification box (55) is fixed in the middle of the front surfaces of the U-shaped plate (54), the two motors (52) are respectively and the two rollers (53) are respectively and slidably mounted in the back surfaces of the two strip-shaped boxes (51), and the dehumidification block (55) is fixedly mounted on the inner wall of the silica gel dehumidification block (55).
4. The efficient heat dissipation multi-layer circuit board as set forth in claim 3, wherein two motors (52) are respectively fixed with sliding pads facing each other, semiconductor chips of the multi-layer circuit board (1) are used for controlling the motors (52) to be opened and closed through wires, rubber films are respectively fixed on outer walls of the two rollers (53), and a filter screen is fixedly installed at an air inlet of the dehumidification box (55).
5. The efficient heat dissipation multi-layer circuit board as defined in claim 3, wherein the heat conduction device (6) comprises an L-shaped plate (61), a fan plate (62), two rubber strips (63) and a shock absorption assembly, the L-shaped plate (61) is fixed in the middle of the back of the U-shaped plate (54), the fan plate (62) is rotatably arranged on the front of the L-shaped plate (61), a torsion spring is arranged between the fan plate (62) and the L-shaped plate (61), the two rubber strips (63) are respectively fixed on the left side and the right side of the fan plate (62), and the shock absorption assembly is respectively arranged on the top surface and the bottom surface of the L-shaped plate (61).
6. The efficient heat dissipation multi-layer circuit board as recited in claim 5, wherein the shock absorption assembly comprises two laths (64) and two U-shaped connecting plates (65), the two laths (64) are respectively hinged to the top surface and the bottom surface of the U-shaped connecting plates (54), the two U-shaped connecting plates (65) are respectively hinged to the top surface and the bottom surface of the support frame (2), one ends, far away from the U-shaped connecting plates (54), of the two laths (64) are respectively rotatably installed inside the U-shaped connecting plates (65), and torsion springs are arranged between the two laths (64) and the two U-shaped connecting plates (65).
7. The efficient heat dissipation multi-layer circuit board as set forth in claim 1, wherein the buffer device (7) comprises four cushion strips (71), two arc-shaped elastic pieces (72) and a protection assembly, wherein two cushion strips (71) are respectively fixed on the left side and the right side of the rectangular heat conduction frame (41), the other two cushion strips (71) are respectively fixed on the inner wall of the support frame (2), the two arc-shaped elastic pieces (72) are respectively fixed between the two cushion strips (71), and the protection assembly is arranged on the front face of the four cushion strips (71).
8. The efficient heat dissipation multi-layer circuit board as recited in claim 7, wherein the protection assembly comprises four supporting plates (73), a grid plate (74) and two baffle plates (75), wherein two supporting plates (73) are respectively fixed on the top surfaces of the four backing strips (71), the other two supporting plates (73) are respectively fixed on the bottom surfaces of the four backing strips (71), the grid plate (74) is fixedly arranged on the front surfaces of the four supporting plates (73), the two baffle plates (75) are respectively fixed on the top surfaces and the bottom surfaces of the grid plate (74), and the two baffle plates (75) are respectively provided with the front surfaces of the two circular heat conducting frames (41).
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| CN202410133880.3A CN118139268B (en) | 2024-01-31 | 2024-01-31 | A multi-layer circuit board with high efficiency in heat dissipation |
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| CN202410133880.3A CN118139268B (en) | 2024-01-31 | 2024-01-31 | A multi-layer circuit board with high efficiency in heat dissipation |
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| CN118139268B true CN118139268B (en) | 2025-01-28 |
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