CN118123228A

CN118123228A - High-precision machining method and device based on laser positioning

Info

Publication number: CN118123228A
Application number: CN202410551907.0A
Authority: CN
Inventors: 刘忠; 刘小平; 张德道; 肖慧勤
Original assignee: Dongguan Chenxing Intelligent Precision Equipment Co ltd
Current assignee: Dongguan Chenxing Intelligent Precision Equipment Co ltd
Priority date: 2024-05-07
Filing date: 2024-05-07
Publication date: 2024-06-04
Anticipated expiration: 2044-05-07
Also published as: CN118123228B

Abstract

The application provides a high-precision processing method and device based on laser positioning, which belong to the technical field of equipment control and are used for ensuring stable precision of laser cutting. The method comprises the following steps: the method comprises the steps that electronic equipment obtains a side view image of an element to be processed, wherein positions, to which the element to be processed needs to be cut, are marked in the side view image; the electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1, and the cutting precision of the M sub-areas is different; the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

Description

High-precision machining method and device based on laser positioning

Technical Field

The application relates to the technical field of equipment control, in particular to a high-precision processing method and device based on laser positioning.

Background

With the continuous development of technology, automation technology is increasingly widely applied in various fields, wherein the application of the automation technology is also increasingly mature in the mechanical processing industry. In the past, traditional machining processes often required manual operations, which are not only inefficient, but also present a risk of human error. However, with the development of automation technology, it is now possible to automatically control the machining process by a machine, thereby greatly improving the production efficiency and quality.

In the cutting field, the application of automation technology is particularly prominent. In the past, manual operation of cutting equipment was required, with cutting being performed by manual control. This approach not only requires a lot of manpower, but also the cutting accuracy and quality are difficult to ensure. With the development of laser technology, precise positioning can now be performed by means of a laser, so that automated cutting is achieved.

The laser cutting technique is a cutting method based on the energy and photo-thermal effect of a laser beam. The method has the advantages of high precision, high efficiency, environmental protection and the like, and has been widely applied in various fields. In the cutting field, the laser cutting technology can realize accurate positioning and cutting, so that the cutting precision and quality are greatly improved. The realization of the automatic laser cutting technology is not separated from the support of an automatic control system. Accurate control of the cutting process can be achieved by an automated control system, thereby ensuring the accuracy and quality of the cut. Meanwhile, the automatic control system can also realize automatic operation of the cutting process, so that the production efficiency is greatly improved.

However, since the shape of the element to be processed is not fixed, the precision of the laser cutting is not the same or is not stable enough due to the different shapes, so how to ensure the stable precision of the laser cutting is a hot problem in the current research.

Disclosure of Invention

The embodiment of the application provides a high-precision processing method and device based on laser positioning, which are used for ensuring stable precision of laser cutting.

In order to achieve the above purpose, the application adopts the following technical scheme:

In a first aspect, an embodiment of the present application provides a high-precision processing method based on laser positioning, which is applied to an electronic device, and the method includes: the method comprises the steps that electronic equipment obtains a side view image of an element to be processed, wherein positions, to which the element to be processed needs to be cut, are marked in the side view image; the electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1, and the cutting precision of the M sub-areas is different; the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

Optionally, the electronic device determines a target area to be cut off of the element to be processed according to a position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, including:

The electronic equipment divides the element to be processed into two areas according to the position to which the element to be processed needs to be cut into one section line segment, and the cutting direction of the cutting equipment, and determines that a first area pointed by the cutting direction of the cutting equipment in the two areas is a target area to which the element to be processed needs to be cut, and the shape of a second area pointed by the cutting direction of the cutting equipment in the two areas is the side view shape of the processed element; and the electronic equipment sequentially overlaps and determines M sub-areas in the cutting direction of the cutting equipment according to the width of the target area, and the value of M is positively correlated with the width of the target area.

Optionally, one end of the target area away from the position to which the element to be processed needs to be cut is a first end, the other end of the target area located at the position to which the element to be processed needs to be cut is a second end, and the width of the target area refers to a distance value between the first end and the second end, where the distance value is any one of a weighted value, a mean value, a maximum value or a minimum value of different distances between different positions on the first end and different positions on the second end.

Optionally, the method further comprises: the electronic equipment determines the cutting precision of each of the M sub-areas and error factors corresponding to the cutting precision of each of the M sub-areas according to the positions of each of the M sub-areas.

Optionally, setting i as an integer traversing 1 to M, as the value of i increases, an i-th sub-area in the M sub-areas is an area marked along the cutting direction of the cutting device, if i=1, the 1-th sub-area in the M sub-areas is a sub-area containing the first terminal, if i=2, the 2-th sub-area in the M sub-areas is a sub-area adjacent to the 1-th sub-area, and so on until if i=m, the M-th sub-area in the M sub-areas is a sub-area containing the second terminal; correspondingly, setting j as an integer traversing 1 to M-3, and determining the cutting precision of each of the M sub-areas and the error factor corresponding to the cutting precision of each of the M sub-areas by the electronic equipment according to the positions of each of the M sub-areas, wherein the error factor comprises the following components: the electronic equipment determines the cutting precision of the jth sub-area as a precision value j and an error factor j corresponding to the precision value j according to the position of the jth sub-area in the M sub-areas, determines the cutting precision of the jth+1th sub-area as a precision value j+1 and an error factor j+1 corresponding to the precision value j+1 according to the position of the jth sub-area in the M sub-areas, determines the cutting precision of the jth+2th sub-area as a precision value j+2 and an error factor j+2 corresponding to the precision value j+2 according to the position of the jth sub-area in the M sub-areas, and determines the cutting precision of the jth+3th sub-area as a precision value j+3 and an error factor j+3 corresponding to the precision value j+3 according to the position of the jth+3th sub-area in the M sub-areas; the precision value j is smaller than the precision value j+1, the precision value j+1 is larger than the precision value j+2, the precision value j+2 is smaller than the precision value j+3, the precision value j+3 is larger than the precision value j+1, the error factor j is larger than the error factor j+1, the error factor j+1 is larger than the error factor j+2, and the error factor j+2 is larger than the error factor j+3.

Optionally, the magnitude of the precision value is inversely related to the width of the sub-region to which the precision value corresponds, the error factor is used to determine the cutting speed of the cutting device within the sub-region to which the error factor corresponds, and the magnitude of the error factor is positively related to the cutting speed.

Optionally, the positions of the m=6, 6 sub-areas are in sequence along the cutting direction of the cutting device: the 1 st sub-area, the 2 nd sub-area, the 3 rd sub-area, the 4 th sub-area, the 5 th sub-area and the 6 th sub-area; the cutting precision of the 1 st sub-area is a precision value 1, the cutting precision of the 2 nd sub-area is a precision value 2, the cutting precision of the 3 rd sub-area is a precision value 3, the cutting precision of the 4 th sub-area is a precision value 4, the cutting precision of the 5 th sub-area is a precision value 5, the cutting precision of the 6 th sub-area is a precision value 6, the precision value 1 is smaller than the precision value 2, the precision value 3 is smaller than the precision value 4, the precision value 3 is positioned between the precision value 1 and the precision value 2, the precision value 5 is smaller than the precision value 6, the precision value 5 is positioned between the precision value 3 and the precision value 4, the corresponding width of the 1 st sub-area is larger than the width of the 2 nd sub-area, the width of the 3 rd sub-area is larger than the width of the 4 th sub-area, the width of the 5 th sub-area is larger than the width of the 6 th sub-area, and the width of the 5 th sub-area is positioned between the width of the 3 rd sub-area and the 4 th sub-area; error factor 1 corresponding to precision value 1, error factor 2 corresponding to precision value 2, error factor 3 corresponding to precision value 3, error factor 4 corresponding to precision value 4, error factor 5 corresponding to precision value 5, error factor 6 corresponding to precision value 6, error factor 1 being greater than error factor 2, error factor 2 being greater than error factor 3, error factor 3 being greater than error factor 4, error factor 4 being greater than error factor 5, error factor 5 being greater than error factor 6.

Optionally, if the cross-sectional shape of the electronic device according to the position to which the element to be processed needs to be cut is arc-shaped, the shape between the adjacent cross-sections of two adjacent sub-areas in the M sub-areas is also arc-shaped, and along the cutting direction of the cutting device, the radian of the shape between the adjacent cross-sections of two adjacent sub-areas gradually increases until reaching the radian of the cross-section of the position to which the element to be processed needs to be cut.

Optionally, the electronic device controls the cutting device to cut the M sub-areas by performing laser positioning on the M sub-areas on the element to be processed, so as to obtain the element after processing, including: the electronic equipment marks M sub-areas on the element to be processed through laser by controlling the laser device, and controls the cutting equipment to cut the M sub-areas by taking the laser as a boundary to obtain the processed element.

In a second aspect, there is provided a laser positioning-based high precision machining apparatus comprising an electronic device configured to: the method comprises the steps that electronic equipment obtains a side view image of an element to be processed, wherein positions, to which the element to be processed needs to be cut, are marked in the side view image; the electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1, and the cutting precision of the M sub-areas is different; the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

Optionally, the apparatus is further configured to: the electronic equipment determines the cutting precision of each of the M sub-areas and error factors corresponding to the cutting precision of each of the M sub-areas according to the positions of each of the M sub-areas.

In a third aspect, an embodiment of the present application provides a computer readable storage medium having stored thereon program code which, when executed by the computer, performs the method according to the first aspect.

In summary, based on the above method and device, it can be seen that:

Under the condition that the electronic equipment acquires a side view image of the element to be processed, which marks the position to which the element to be processed needs to be cut, the electronic equipment can determine a target area to be cut off by the processing element from the side view image, and divide the target area into M sub-areas with different cutting precision, so that the electronic equipment can control the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, and the cutting precision of the M sub-areas is the same, so that error accumulation can not be caused due to the same precision in cutting, the processed element with higher precision is obtained, and the stable precision of laser cutting can be ensured.

Drawings

FIG. 1 is a flow chart of a high-precision processing method based on laser positioning according to an embodiment of the application;

fig. 2 is a schematic view of a scenario of a high-precision processing method based on laser positioning according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical scheme of the application will be described below with reference to the accompanying drawings.

In the embodiment of the application, the indication can comprise direct indication and indirect indication, and can also comprise explicit indication and implicit indication. The information indicated by a certain information (such as the first indication information, the second indication information, or the third indication information) is referred to as information to be indicated, and in a specific implementation process, there are various ways of indicating the information to be indicated, for example, but not limited to, the information to be indicated may be directly indicated, such as the information to be indicated itself or an index of the information to be indicated. The information to be indicated can also be indicated indirectly by indicating other information, wherein the other information and the information to be indicated have an association relation. It is also possible to indicate only a part of the information to be indicated, while other parts of the information to be indicated are known or agreed in advance. For example, the indication of the specific information may also be achieved by means of a pre-agreed (e.g., protocol-specified) arrangement sequence of the respective information, thereby reducing the indication overhead to some extent. And meanwhile, the universal part of each information can be identified and indicated uniformly, so that the indication cost caused by independently indicating the same information is reduced.

The specific indication means may be any of various existing indication means, such as, but not limited to, the above indication means, various combinations thereof, and the like. Specific details of various indications may be referred to the prior art and are not described herein. As can be seen from the above, for example, when multiple pieces of information of the same type need to be indicated, different manners of indication of different pieces of information may occur. In a specific implementation process, a required indication mode can be selected according to specific needs, and the selected indication mode is not limited in the embodiment of the present application, so that the indication mode according to the embodiment of the present application is understood to cover various methods that can enable a party to be indicated to learn information to be indicated.

It should be understood that the information to be indicated may be sent together as a whole or may be sent separately in a plurality of sub-information, and the sending periods and/or sending timings of these sub-information may be the same or different. Specific transmission method the embodiment of the present application is not limited. The transmission period and/or the transmission timing of the sub-information may be predefined, for example, predefined according to a protocol, or may be configured by the transmitting end device by transmitting configuration information to the receiving end device.

The "pre-defining" or "pre-configuring" may be implemented by pre-storing corresponding codes, tables, or other manners that may be used to indicate relevant information in the device, and the embodiments of the present application are not limited to the specific implementation manner. Where "save" may refer to saving in one or more memories. The one or more memories may be provided separately or may be integrated in an encoder or decoder, processor, or communication device. The one or more memories may also be provided separately as part of a decoder, processor, or communication device. The type of memory may be any form of storage medium, and embodiments of the application are not limited in this regard.

The "protocol" referred to in the embodiments of the present application may refer to a protocol family in the communication field, a standard protocol similar to a frame structure of the protocol family, or a related protocol applied to a future communication system, which is not specifically limited in the embodiments of the present application.

In the embodiment of the present application, the descriptions of "when … …", "in … …", "if" and "if" all refer to that the device will perform corresponding processing under some objective condition, and are not limited in time, and do not require that the device must have a judging action when implementing, and do not mean that there are other limitations.

In the description of the embodiments of the present application, unless otherwise indicated, "/" means that the objects associated in tandem are in a "or" relationship, e.g., A/B may represent A or B; the "and/or" in the embodiment of the present application is merely an association relationship describing the association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a alone, a and B together, and B alone, wherein A, B may be singular or plural. Also, in the description of the embodiments of the present application, unless otherwise indicated, "plurality" means two or more than two. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b or c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural. In addition, in order to facilitate the clear description of the technical solution of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same item or similar items having substantially the same function and effect. It will be appreciated by those of skill in the art that the words "first," "second," and the like do not limit the amount and order of execution, and that the words "first," "second," and the like do not necessarily differ. Meanwhile, in the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as examples, illustrations or explanations. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion that may be readily understood.

The network architecture and the service scenario described in the embodiments of the present application are for more clearly describing the technical solution of the embodiments of the present application, and do not constitute a limitation on the technical solution provided by the embodiments of the present application, and those skilled in the art can know that, with the evolution of the network architecture and the appearance of the new service scenario, the technical solution provided by the embodiments of the present application is applicable to similar technical problems.

The method provided by the embodiment of the application can be executed by electronic equipment, the electronic equipment can be a terminal, the terminal can be a terminal with a communication function, or can be a chip or a chip system arranged on the terminal. The terminal device may also be referred to as a User Equipment (UE), an access terminal, a subscriber unit, a subscriber station, a mobile station, a remote terminal, a mobile device, a user terminal, a wireless communication device, a user agent, or a user device. The terminal device in the embodiment of the present application may be a mobile phone (mobile phone), a tablet computer (Pad), a computer with a wireless transceiving function, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned (SELF DRIVING), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (SMART GRID), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (SMART CITY), a wireless terminal in smart home (smart home), a vehicle-mounted terminal, an RSU with a terminal function, or the like.

Referring to fig. 1, an embodiment of the application provides a high-precision processing method based on laser positioning. The method may be performed by an electronic device. The method comprises the following steps:

S101, the electronic equipment acquires a side view image of the element to be processed.

The position to which the element to be processed needs to be cut is marked in the side view image, specifically, the position to which the element to be processed needs to be cut may be a section line segment, the section line segment may be an arc line segment, a section is shown to be arc, or may also be a straight line, and a section is shown to be plane. There are various ways for the electronic device to obtain the side view image, for example, the side view image may be directly transmitted to the electronic device by the device that captures the side view image, or may be manually uploaded to the electronic device by the user, and the specific way is not limited.

S102, the electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1.

The cutting accuracy of the M sub-areas is different. The widths of the M sub-regions are also different.

The electronic device may divide the element to be processed into two areas according to the position to which the element to be processed needs to be cut is a section line segment, and determine a first area pointed by the cutting direction of the cutting device in the two areas as a target area to which the element to be processed needs to be cut, and a second area pointed by the cutting direction of the cutting device in the two areas has a side view shape of the processed element. For example, as shown in fig. 3, the target area is area 1, and the second area is area 2.

The electronic device may sequentially determine M sub-regions in the cutting direction of the cutting device according to the width of the target region, where the value of M is positively correlated with the width of the target region, that is, different values of M have positively correlated correspondence with different widths of the target region. The first end is defined as one end of the target area away from the position to which the element to be processed needs to be cut, and the second end is defined as the other end of the target area located at the position to which the element to be processed needs to be cut, so that the width of the target area refers to a distance value between the first end and the second end, where the distance value may be any one of weighted values, average values, maximum values or minimum values of different distances between different positions on the first end and different positions on the second end, and is not limited in particular. Along the cutting direction of the cutting device, the width of each sub-region of the M sub-regions sequentially changes in the order of large, small, large and small, and the specific value of the size can be described in the related description hereinafter, which is not repeated here.

On the basis, the electronic equipment can also determine the cutting precision of each of the M sub-areas and error factors corresponding to the cutting precision of each of the M sub-areas according to the positions of each of the M sub-areas. For example, setting i as an integer traversing 1 to M, as the value of i increases, the i-th sub-region of the M sub-regions is a region marked along the cutting direction of the cutting device, if i=1, the 1-th sub-region of the M sub-regions is a sub-region containing the first terminal, if i=2, the 2-th sub-region of the M sub-regions is a sub-region adjacent to the 1-th sub-region, and so on until if i=m, the M-th sub-region of the M sub-regions is a sub-region containing the second terminal; accordingly, j is set to an integer traversing 1 to M-3. In this way, the electronic device may determine, according to the position of the jth sub-area in the M sub-areas, that the cutting precision of the jth sub-area is the precision value j and the error factor j corresponding to the precision value j, determine, according to the position of the jth+1th sub-area in the M sub-areas, that the cutting precision of the jth+1th sub-area is the precision value j+1 and the error factor j+1 corresponding to the precision value j+1, determine, according to the position of the jth+2th sub-area in the M sub-areas, that the cutting precision of the jth+2th sub-area is the precision value j+2 and the error factor j+2 corresponding to the precision value j+2, and determine, according to the position of the jth+3th sub-area in the M sub-areas, that the cutting precision of the jth+3th sub-area is the precision value j+3 and the error factor j+3 corresponding to the precision value j+3. The precision value j is smaller than the precision value j+1, the precision value j+1 is larger than the precision value j+2, the precision value j+2 is smaller than the precision value j+3, the precision value j+3 is larger than the precision value j+1, the error factor j is larger than the error factor j+1, the error factor j+1 is larger than the error factor j+2, and the error factor j+2 is larger than the error factor j+3.

The magnitude of the precision value is inversely related to the width of the sub-region corresponding to the precision value, the error factor is used for determining the cutting speed of the cutting device in the sub-region corresponding to the error factor, and the magnitude of the error factor is positively related to the cutting speed, the faster the cutting speed is, the lower the cutting precision is, so that the error factor is also greater, in other words, the cutting speed of the cutting device in the sub-region corresponding to the error factor can be determined by the error factor.

It will be appreciated that the sub-area with a lower accuracy value may be used to increase the cutting speed, since the error factor is also larger and the cutting speed of the cutting device may be faster. On the contrary, the sub-area with higher precision value has smaller error factor, and the cutting speed of the cutting equipment is relatively slower so as to maintain the precision. At this time, along the cutting direction of the cutting device, the precision value is reciprocally increased in a manner of continuously increasing and decreasing, so as to give consideration to the cutting efficiency and the cutting precision, and the precision value reaches the highest value in the Mth sub-area, thereby ensuring that the precision of the position where the element to be processed needs to be cut is sufficiently high. In addition, as the precision value is increased in a reciprocating way in which the precision value is continuously increased and then reduced, when the precision value is cut from one subarea with lower precision value to the adjacent subarea with higher precision value, the higher precision value can also correct the error caused by the cutting of the lower precision value at the moment, that is, the reciprocating way can also realize the continuous correction of the error.

It is convenient to understand that, as shown in fig. 3, in one example, the positions of m=6, 6 sub-areas are in order along the cutting direction of the cutting device: the 1 st sub-area, the 2 nd sub-area, the 3 rd sub-area, the 4 th sub-area, the 5 th sub-area and the 6 th sub-area; the cutting precision of the 1 st sub-area is a precision value 1, the cutting precision of the 2 nd sub-area is a precision value 2, the cutting precision of the 3 rd sub-area is a precision value 3, the cutting precision of the 4 th sub-area is a precision value 4, the cutting precision of the 5 th sub-area is a precision value 5, the cutting precision of the 6 th sub-area is a precision value 6, the precision value 1 is smaller than the precision value 2, the precision value 3 is smaller than the precision value 4, the precision value 3 is positioned between the precision value 1 and the precision value 2, the precision value 5 is smaller than the precision value 6, the precision value 5 is positioned between the precision value 3 and the precision value 4, the corresponding width of the 1 st sub-area is larger than the width of the 2 nd sub-area, the width of the 3 rd sub-area is larger than the width of the 4 th sub-area, the width of the 5 th sub-area is larger than the width of the 6 th sub-area, and the width of the 5 th sub-area is positioned between the width of the 3 rd sub-area and the 4 th sub-area; error factor 1 corresponding to precision value 1, error factor 2 corresponding to precision value 2, error factor 3 corresponding to precision value 3, error factor 4 corresponding to precision value 4, error factor 5 corresponding to precision value 5, error factor 6 corresponding to precision value 6, error factor 1 being greater than error factor 2, error factor 2 being greater than error factor 3, error factor 3 being greater than error factor 4, error factor 4 being greater than error factor 5, error factor 5 being greater than error factor 6.

It will be appreciated that the foregoing is exemplified by m=6, and not limited to, m=8, m=10, m=4, etc. can be implemented by referring to the foregoing principles, and will not be described herein.

Alternatively, as shown in fig. 2, if the cross-sectional shape of the electronic device according to the position to which the element to be processed needs to be cut is arc-shaped, the shape between the adjacent cross-sections of two adjacent sub-areas in the M sub-areas is also arc-shaped, and along the cutting direction of the cutting device, the radian of the shape between the adjacent cross-sections of two adjacent sub-areas gradually increases until reaching the radian of the cross-section of the position to which the element to be processed needs to be cut. That is, since the precision value is increased reciprocally, when the precision value is low, the radian of the shape between the adjacent sections should be low, so as to avoid the increase of the cutting error caused by the overlarge radian, and then, as the precision value is increased gradually, the corresponding radian is increased, in short, the radian is required to be matched with the precision, so as to avoid the increase of the cutting error caused by the mismatch.

S103, the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

The electronics can mark M sub-areas on the element to be processed by laser light by controlling the laser device. At this time, the image capturing device (such as a high-definition camera) captures a video of the element to be processed in the process of being cut, and transmits the video to the electronic device. At this time, the electronic device may analyze the cutting position of the cutting device through the video, for example, whether to approach the laser position or cut to the laser position. In this way, the electronic device can control the cutting device to cut M sub-areas with the laser as a boundary, so as to know which sub-area is currently cut and what is the next sub-area, so that the cutting device can be controlled to cut with the corresponding precision value and cutting speed, and finally the machined element is obtained.

In summary, when the electronic device obtains a side view image of the to-be-processed element marked with the position to which the to-be-processed element needs to be cut, the electronic device can determine a target area from which the to-be-processed element needs to be cut and divide the target area into M sub-areas with different cutting precision, so that when the electronic device performs laser positioning on the M sub-areas on the to-be-processed element, the electronic device controls the cutting device to cut the M sub-areas, the cutting precision of the M sub-areas is the same, so that errors are not accumulated due to the same precision in cutting, the processed element with higher precision is obtained, and stable precision of laser cutting can be ensured.

Also provided in this embodiment is a high-precision machining apparatus based on laser positioning, the apparatus including an electronic device configured to: the method comprises the steps that electronic equipment obtains a side view image of an element to be processed, wherein positions, to which the element to be processed needs to be cut, are marked in the side view image; the electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1, and the cutting precision of the M sub-areas is different; the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

The following describes the various components of an electronic device 400 in detail with reference to fig. 3:

The processor 401 is a control center of the electronic device 400, and may be one processor or a generic name of a plurality of processing elements. For example, processor 401 is one or more central processing units (central processing unit, CPU) and may be an Application SPECIFIC INTEGRATED Circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present application, such as: one or more microprocessors (DIGITAL SIGNAL processors, DSPs), or one or more field programmable gate arrays (field programmable GATE ARRAY, FPGAs).

Alternatively, the processor 401 may perform various functions of the electronic device 400, such as the functions in the method shown in fig. 1 described above, by running or executing a software program stored in the memory 402 and invoking data stored in the memory 402.

In a particular implementation, processor 401 may include one or more CPUs, such as CPU0 and CPU1 shown in FIG. 3, as an embodiment.

In a particular implementation, as one embodiment, an electronic device 400 may also include multiple processors, such as processor 401 and processor 404 shown in FIG. 3. Each of these processors may be a single-core processor (single-CPU) or a multi-core processor (multi-CPU). A processor herein may refer to one or more devices, circuits, and/or processing cores for processing data (e.g., computer program instructions).

The memory 402 is configured to store a software program for executing the solution of the present application, and the processor 401 controls the execution of the software program, and the specific implementation may refer to the above method embodiment, which is not described herein again.

Alternatively, memory 402 may be read-only memory (ROM) or other type of static storage device that may store static information and instructions, random access memory (random access memory, RAM) or

Other types of dynamic storage devices, which can store information and instructions, can also be, but are not limited to, an electrically erasable programmable read-only memory (EEPROM), a compact disk read-only memory (compact disc read-only memory) or other optical disk storage, optical disk storage (including compact disk, laser disk, optical disk, digital versatile disk, blu-ray disk, etc.), magnetic disk storage or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and capable of being accessed by a computer. The memory 402 may be integrated with the processor 401 or may exist separately and as an electronic device 400

Is coupled to the processor 401 (not shown in fig. 3), and embodiments of the present application are not limited in this regard.

A transceiver 403 for communication with other devices. For example, the multi-beam based positioning device is a terminal and the transceiver 403 may be used to communicate with a network device or with another terminal.

Alternatively, the transceiver 403 may include a receiver and a transmitter (not separately shown in fig. 3). The receiver is used for realizing the receiving function, and the transmitter is used for realizing the transmitting function.

Alternatively, transceiver 403 may be integrated with processor 401 or may exist separately and be coupled to processor 401 by an interface circuit (not shown in fig. 3) of electronic device 400, as embodiments of the application are not limited in this regard.

It should be noted that the structure of one electronic device 400 shown in fig. 3 is not limited to the apparatus, and an actual one electronic device 400 may include more or fewer components than shown, or may combine some components, or may be different in arrangement of components.

In addition, the technical effects of the electronic device 400 may refer to the technical effects of the method of the above-mentioned method embodiment, and will not be described herein.

It should be appreciated that the processor in embodiments of the application may be a central processing unit (central processing unit, CPU), which may also be other general purpose processors, digital signal processors (DIGITAL SIGNAL processors, DSPs), application Specific Integrated Circuits (ASICs), off-the-shelf programmable gate arrays (field programmable GATE ARRAY, FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

It should also be appreciated that the memory in embodiments of the present application may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The nonvolatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an erasable programmable ROM (erasable PROM), an electrically erasable programmable EPROM (EEPROM), or a flash memory. The volatile memory may be random access memory (random access memory, RAM) which acts as external cache memory. By way of example, and not limitation, many forms of random access memory (random access memory, RAM) are available, such as static random access memory (STATIC RAM, SRAM), dynamic Random Access Memory (DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate synchronous dynamic random access memory (double DATA RATE SDRAM, DDR SDRAM), enhanced synchronous dynamic random access memory (ENHANCED SDRAM, ESDRAM), synchronous link dynamic random access memory (SYNCHLINK DRAM, SLDRAM), and direct memory bus random access memory (direct rambus RAM, DR RAM).

The above embodiments may be implemented in whole or in part by software, hardware (e.g., circuitry), firmware, or any other combination. When implemented in software, the above-described embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product comprises one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, the processes or functions in accordance with embodiments of the present application are produced in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wired (e.g., infrared, wireless, microwave, etc.) means. Computer readable storage media can be any available media that can be accessed by a computer or data storage devices, such as servers, data centers, etc. that contain one or more collections of available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. The semiconductor medium may be a solid state disk.

It should be understood that the term "and/or" is merely an association relationship describing the associated object, and means that three relationships may exist, for example, a and/or B may mean: there are three cases, a alone, a and B together, and B alone, wherein a, B may be singular or plural. In addition, the character "/" herein generally indicates that the associated object is an "or" relationship, but may also indicate an "and/or" relationship, and may be understood by referring to the context.

In the present application, "at least one" means one or more, and "a plurality" means two or more. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example, at least one (one) of a, b, or c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural.

It should be understood that, in various embodiments of the present application, the sequence numbers of the foregoing processes do not mean the order of execution, and the order of execution of the processes should be determined by the functions and internal logic thereof, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the above-described apparatus embodiments are merely meant to be exemplary, e.g., the division of units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some feature fields may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method of the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a read-only memory (ROM), a random access memory (random access memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. A high-precision machining method based on laser positioning, which is applied to electronic equipment, the method comprising:

The electronic equipment acquires a side view image of a to-be-processed element, wherein the side view image is marked with a position to which the to-be-processed element needs to be cut;

The electronic equipment determines a target area to be cut off of the element to be processed according to the position to which the element to be processed needs to be cut off, and divides the target area into M sub-areas, wherein M is an integer greater than 1, and the cutting precision of the M sub-areas is different;

and the electronic equipment controls the cutting equipment to cut the M sub-areas by carrying out laser positioning on the M sub-areas on the element to be processed, so as to obtain the processed element.

2. The method of claim 1, wherein the electronic device determining a target area to which the element to be processed needs to be cut according to a position to which the element to be processed needs to be cut, and dividing the target area into M sub-areas, comprises:

The electronic equipment divides the element to be processed into two areas according to the position to which the element to be processed needs to be cut into one section line segment, and the cutting direction of the cutting equipment determines that a first area pointed by the cutting direction of the cutting equipment in the two areas is the target area to which the element to be processed needs to be cut, and the shape of a second area pointed by the cutting direction of the cutting equipment in the two areas is the side view shape of the processed element;

And the electronic equipment sequentially determines the M sub-areas in a superimposed manner in the cutting direction of the cutting equipment according to the width of the target area, and the value of M is positively correlated with the width of the target area.

3. The method according to claim 2, wherein one end of the target area away from the position to which the element to be processed needs to be cut is a first end, the other end of the target area at the position to which the element to be processed needs to be cut is a second end, and the width of the target area refers to a distance value between the first end and the second end, and the distance value is any one of a weighted value, a mean value, a maximum value, and a minimum value of different distances between different positions on the first end and different positions on the second end.

4. A method according to claim 3, characterized in that the method further comprises:

And the electronic equipment determines the cutting precision of each of the M sub-areas and error factors corresponding to the cutting precision of each of the M sub-areas according to the positions of each of the M sub-areas.

5. The method according to claim 4, wherein i is an integer traversing 1 to M, and as i increases in value, an i-th sub-region of the M sub-regions is a region marked along a cutting direction of the cutting device, and if i=1, a 1-th sub-region of the M sub-regions is a sub-region containing the first terminal, and if i=2, a 2-th sub-region of the M sub-regions is a sub-region adjacent to the 1-th sub-region, and so on, until if i=m, an M-th sub-region of the M sub-regions is a sub-region containing the second terminal;

Correspondingly, setting j as an integer traversing 1 to M-3, and determining, by the electronic device, respective cutting precision of the M sub-areas and error factors corresponding to the respective cutting precision of the M sub-areas according to respective positions of the M sub-areas, where the error factors include:

The electronic device determines that the cutting precision of the jth sub-area is a precision value j and an error factor j corresponding to the precision value j according to the position of the jth sub-area in the M sub-areas, determines that the cutting precision of the jth sub-area is a precision value j+1 and an error factor j+1 corresponding to the precision value j+1 according to the position of the jth sub-area in the M sub-areas, determines that the cutting precision of the jth+2 sub-area is a precision value j+2 and an error factor j+2 corresponding to the precision value j+2 according to the position of the jth sub-area in the M sub-areas, and determines that the cutting precision of the jth+3 sub-area is a precision value j+3 and an error factor j+3 corresponding to the precision value j+3 according to the position of the jth+3 sub-area in the M sub-areas;

The precision value j is smaller than the precision value j+1, the precision value j+1 is larger than the precision value j+2, the precision value j+2 is smaller than the precision value j+3, the precision value j+3 is larger than the precision value j+1, the error factor j is larger than the error factor j+1, the error factor j+1 is larger than the error factor j+2, and the error factor j+2 is larger than the error factor j+3.

6. The method according to claim 5, wherein the magnitude of the precision value is inversely related to the width of the sub-region to which the precision value corresponds, the error factor is used to determine the cutting speed of the cutting device within the sub-region to which the error factor corresponds, and the magnitude of the error factor is inversely related to the cutting speed.

7. The method of claim 5, wherein the positions of M = 6,6 sub-areas along the cutting direction of the cutting device are in order: the 1 st sub-area, the 2 nd sub-area, the 3 rd sub-area, the 4 th sub-area, the 5 th sub-area and the 6 th sub-area; the cutting precision of the 1 st sub-area is a precision value 1, the cutting precision of the 2 nd sub-area is a precision value 2, the cutting precision of the 3 rd sub-area is a precision value 3, the cutting precision of the 4 th sub-area is a precision value 4, the cutting precision of the 5 th sub-area is a precision value 5, the cutting precision of the 6 th sub-area is a precision value 6, the precision value 1 is smaller than the precision value 2, the precision value 3 is smaller than the precision value 4, the precision value 3 is positioned between the precision value 1 and the precision value 2, the precision value 5 is smaller than the precision value 6, the precision value 5 is positioned between the precision value 3 and the precision value 4, correspondingly, the width of the 1 st sub-area is larger than the width of the 2 nd sub-area, the width of the 3 rd sub-area is larger than the width of the 4 th sub-area, the width of the 3 rd sub-area is positioned between the width of the 1 st sub-area and the 2 nd sub-area and the width of the 5 sub-area is larger than the width of the 5 th sub-area and the width of the 3 sub-area is positioned between the 2 th sub-area and the width of the 5 sub-area is larger than the width of the 4 sub-area; the error factor 1 corresponding to the precision value 1, the error factor 2 corresponding to the precision value 2, the error factor 3 corresponding to the precision value 3, the error factor 4 corresponding to the precision value 4, the error factor 5 corresponding to the precision value 5, the error factor 6 corresponding to the precision value 6, the error factor 1 is greater than the error factor 2, the error factor 2 is greater than the error factor 3, the error factor 3 is greater than the error factor 4, the error factor 4 is greater than the error factor 5, and the error factor 5 is greater than the error factor 6.

8. The method according to claim 5, wherein if the cross-sectional shape of the electronic device according to the position to which the element to be processed is to be cut is arc-shaped, the shape between the adjacent cross-sections of the adjacent two sub-areas of the M sub-areas is also arc-shaped, and the radian of the shape between the adjacent cross-sections of the adjacent two sub-areas gradually increases along the cutting direction of the cutting device until reaching the radian of the cross-section of the position to which the element to be processed is to be cut.

9. The method of claim 1, wherein the electronic device controls a cutting device to cut the M sub-areas by performing laser positioning on the M sub-areas on the element to be processed, so as to obtain a processed element, and the method comprises:

The electronic equipment marks the M sub-areas on the element to be processed through laser by controlling a laser device, and controls the cutting equipment to cut the M sub-areas by taking the laser as a boundary to obtain the processed element.

10. A high precision machining apparatus based on laser positioning, the apparatus comprising an electronic device, the apparatus being configured to: