CN1180011A - Method and device for manufacturing thermoplastic resin plate with embossint pattern - Google Patents

Method and device for manufacturing thermoplastic resin plate with embossint pattern Download PDF

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Publication number
CN1180011A
CN1180011A CN 97110932 CN97110932A CN1180011A CN 1180011 A CN1180011 A CN 1180011A CN 97110932 CN97110932 CN 97110932 CN 97110932 A CN97110932 A CN 97110932A CN 1180011 A CN1180011 A CN 1180011A
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China
Prior art keywords
roller
mentioned
thermoplastic resin
resin board
belt
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CN 97110932
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Chinese (zh)
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藤井淳司
船木章
森胁隆次
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Idemitsu Petrochemical Co Ltd
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Idemitsu Petrochemical Co Ltd
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Priority to CN 97110932 priority Critical patent/CN1180011A/en
Publication of CN1180011A publication Critical patent/CN1180011A/en
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Abstract

A manufacturing method of a thermoplastic resin plate with embossing patterns is provided. The surface of a first roller is coated with elastic materials (18); the first roller and a second roller (13, 14) are connected through a metal-made non-joint transmission belt (15); the first roller is adjacent to a third roller (13, 33), and the transmission belt (15) is arranged between the first and the third roller. A melted thermoplastic plate (11) is introduced between the third roller and the transmission belt. Material (18) is elastically deformed through the extrusion of the first and the third roller. And the planar crimping is implemented between the first and the third roller and the plate (11) for copying the patterns as well as for cooling. When the plate (11) is made from amorphous resin, the surface of the third roller is kept at a dew point to (resin Tg +20) DEG C. When the plate (11) is made from thermoplastic resin, the surface is kept at the dew point to (resin melting point-30) DEG C. The planar crimping and the cooling are continued.

Description

Manufacture method and manufacturing installation thereof with thermoplastic resin board of embossed pattern
The present invention relates to have the manufacture method and the manufacturing installation thereof of the thermoplastic resin board of embossed pattern, for example, can be used in the manufacturing of heavy reflectivity plate.
In recent years, on the surface of thermoplastic resin board, impose the heavy reflecting plate (plastics system reflecting plate) of microprism processing, can in reflecting plate field, casting field, building field etc., use.
As the heavy reflectivity plate of this class, the U.S. generally acknowledge the beaded glass type arranged with the cube edge type.Usually, beaded glass type good, the good brightness that causes at distinguishing at a distance with because of the light reflection of cube edge type at in-plant distinguishing.
In the heavy reflectivity plate of above-mentioned cube edge type is made, the floral designs that embossed pattern forms with model correctly must be duplicated on the thermoplastic resin board.
For this reason, particularly, thermoplastic resin board pressurize under suitable temperature and pressure, and importantly, this pressurized state should keep official hour facing to the model of embossed pattern formation usefulness.
In the past, as the manufacture method according to the heavy reflectivity plate of such necessary condition, what for example proposed has continuous pressurization (with reference to special public clear 60-56103 communique) and a driving-belt method (with reference to the public clear 5-17023 communique of spy).
Above-mentioned continuous extrausion process is for overlapping on driving-belt and the sheet material of the solid phase of supplying with continuously, and with a plurality of pressue devices with heating or cooling function, the model that embossed pattern is formed usefulness sequentially pushes pattern is duplicated manufacture method on the plate.
Above-mentioned driving-belt method is the roller with a pair of mutual cramping, will have the driving-belt of model and the thermoplastic resin board pressurization of embossed pattern, with this figure is duplicated method for making on the plate.
But if adopt above-mentioned continuous pressurization, speed of production is slow, and because device is complicated, so need to maximize.
If adopt above-mentioned driving-belt method, self has embossed pattern driving-belt, so as the permanance of the driving-belt of mould problem has taken place again.
On the other hand, as melt the tabular resin of extruding from the extruder die first melt, use the method for the heavy reflectivity plate of driving-belt manufacturing, do not constitute the manufacturing technology of heavy reflectivity plate self, can be with reference to using the spy to open flat 6-55613 communique, open flat 3-6919 communique in fact, open the plate manufacturing technology of middle records such as flat 1-83092 communique in fact.
But,,, think that the transparency of plate is not enough in the occasion of not adding nucleator opening about the spy in the technology of flat 6-55613 communique.Opening in the technology of flat 3-6919 communique about real, the occasion that forming speed is high, since short between the face nip, so think that the surface gloss of driving-belt one side is poor.Open in the relevant technology of flat 1-83092 communique in above-mentioned reality, use elastic body, but on driving-belt rubber-coated elastic body, therefore the problem of permanance is arranged.
The invention is characterized in, the employed manufacturing installation of manufacture method with thermoplastic resin board of embossed pattern is equipped with 1st roller of surface with the resilient material coating, and between the 1st and the 2nd roller, reel and adorning the metal non junction driving-belt that the surface is a minute surface, the 3rd roller that contacts with the 1st roller by above-mentioned metal non junction driving-belt, be designed to adjoin the form of above-mentioned metal non junction driving-belt, the surface of above-mentioned the 3rd roller is processed to the embossed pattern forming face, the method of using this manufacturing installation manufacturing to have the thermoplastic resin board of embossed pattern is, the above-mentioned thermoplastic resin board of molten condition is imported between the above-mentioned metal non junction driving-belt and above-mentioned the 3rd roller that contacts with above-mentioned the 1st roller, with the extruding force between the above-mentioned the 1st and the 3rd roller, one side makes above-mentioned resilient material elastic deformation, one side planarly contacts pressurization with the 3rd roller with above-mentioned thermoplastic resin board with the above-mentioned the 1st, and duplicate embossed pattern and cool off simultaneously, in this cooling period, when the resin of above-mentioned thermoplastic resin board is the occasion of non-crystalline resin, the surface temperature of above-mentioned the 3rd roller to be remained under dew point~(resin Tg+20) ℃, and the resin of working as above-mentioned thermoplastic resin board is the occasion of crystalline resin, the surface temperature of above-mentioned the 3rd roller will remain under dew point~(m.p.-30 of resin) ℃, then, with above-mentioned metal non junction driving-belt this thermoplastic resin board is pressurizeed and cooling facing to the 3rd roll surface shape ground contact.
The thermoplastic resin board of said above-mentioned molten condition for example, is the thermoplastic resin board after just having melt extruded from the die head of extruder, or with solid-state thermoplastic resin board heating and melting resin plate etc.
For the thermoplastic resin board among the present invention, comprised thermoplastic resin membranes' different relatively on the thickness just occasion.
In addition, above-mentioned sheet material can be any sheet material of the single or multiple lift of thermoplastic resin board.
For above-mentioned non-crystalline resin, can contain acrylic resin, polycarbonate, Polyvinylchloride etc.The nucleator that can also in these resins, contain in addition, D-sorbite system, aluminum benzoate system, sodium system etc.
The resin of above-mentioned thermoplastic resin board is the occasion of non-crystalline resin, when the surface temperature of the 3rd roller is ℃ higher than (Tg+20 of resin), during peel plate, the pattern dislocation takes place easily from the 3rd roller, so it is preferred below the Tg of resin, more preferably below (Tg-10 of resin ℃).
For above-mentioned crystalline resin, can contain polypropylene etc.
The resin of above-mentioned thermoplastic resin board is the occasion of crystalline resin, when the surface temperature of above-mentioned the 3rd roller is ℃ higher than (m.p.-30 of resin), from the 3rd roller during peel plate, the pattern dislocation takes place easily, so preferably below (m.p.-50 of resin) ℃, more preferably below (m.p.-70 of resin) ℃.
For keeping the 3rd roller in the said temperature scope, the adjustment means of water-cooled etc. can be set for roller.
In addition, preferably also the temperature of above-mentioned non junction driving-belt is remained on the 3rd temperature that roller is identical under.
In the present invention, the minute surface degree of metal non junction driving-belt is expressed as below the 3S with surface roughness, below the preferred 1S, more preferably below the 0.5S.During greater than 3S, be difficult to obtain the good smooth surface of thermoplastic resin board.
As the material of non junction driving-belt, can use stainless steel, carbon steel, titanium alloy, or the like.
The thickness of non junction driving-belt is arbitrarily, but for example 0.3-1.5mm is desirable.When thinner than 0.3mm, the strength degradation of band, permanance deterioration.When thicker, the roller of the band of reeling directly strengthened, thereby device is maximized than 1.5mm.In addition, the decrease in efficiency of heating, cooling, thus manufacturing cost is risen.
The material of above-mentioned resilient material is arbitrarily, but can use fluororubber, silicon rubber, EPT, EPDM etc.In these resilient materials,, also can contain metal powders such as silver, copper in order to improve heat conductivity.
The thickness of resilient material is pressed in order to obtain the good face of elastic deformation, more than the preferred 1mm, more preferably more than the 3mm.When thinner than 1mm, elastic effect is poor, and reduces between the planar contact pressor areas to thermoplastic resin board.In addition, because resiliency descends, resin material ridge takes place in the introduction part of the thermoplastic resin board between non junction driving-belt and the 3rd roller easily.The upper limit of thickness is about 50mm.When thicker than this, the problem of permanance and heat conductivity takes place easily.
The concrete shape of above-mentioned embossed pattern is arbitrarily, if when for example using as heavy reflectivity plate, pattern is made the pyrometric cone prismatic cut line (cube prism patterns).The size that constitutes the continuously arranged unit of pattern is arbitrarily, and similar figures get final product.
In addition, the reel roller of metal non junction driving-belt, have the 1st and the 2 two roller at least, for example can also in this metal non junction driving-belt, a roller be set again, above-mentioned non junction driving-belt facing to above-mentioned the 1st roller is cooled off or heat with this roller.
In the present invention, thermoplastic resin board is imported the above-mentioned metal non junction driving-belt that contacts with above-mentioned first roller, and between above-mentioned the 3rd roller time, this thermoplastic resin board is imported slightly simultaneously under the state of contact at these non junction driving-belts and roller.Can make the low molten resin of viscosity thus, one side is along with the elastic deformation of above-mentioned resilient material, one side is accepted the good duplicating of embossed pattern by the 3rd roller, then by planar contact pressurization and cooling for the 3rd roller, can prevent that the embossed pattern that the forms pattern when model is peeled off from damaging phenomenon, thereby can improve the reappearance of embossed pattern.
In addition, when thermoplastic resin board is contacted earlier with metal non junction driving-belt or roller, then before the duplicating of finishing embossed pattern on the molten resin, just carrying out cooling, the curing of molten resin.
In the present invention, face when making the planar contact pressurization of above-mentioned thermoplastic resin board along with the elastic deformation of above-mentioned elastic resin is pressed and is 0.1MPa-20.0MPa, and the face when preferably making the planar contact pressurization of above-mentioned thermoplastic resin board when following the elastic deformation of above-mentioned resilient material is pressed and is 0.01MPa-0.5MPa.
The face of lower limit is forced down when above-mentioned 0.1MPa or 0.01MPa, the decrease in efficiency of duplicating and cooling off.Especially, when duplicating embossed pattern on the thermoplastic resin board, when improving processing speed under the state that forces down at face, pattern blurring (floral designs that once duplicating are got back to original model again) takes place easily.
In addition, when making the above-mentioned 20.0MPa of face pressure ratio of the upper limit or 0.5MPa high, the belt tension height is so see it is bad from the viewpoint in driving-belt life-span.
Manufacturing installation with thermoplastic resin board of embossed pattern of the present invention is characterised in that, this device is equipped with the 1st roller that the surface coats with resilient material, with the planar metal non junction driving-belt of surface mirror that installs around in the middle of the 1st and the 2nd roller, become embossed pattern to form the 3rd roller of face with surface working, the 3rd roller, contact with above-mentioned the 1st roller by above-mentioned metal non junction driving-belt, and be designed to adjoin the state of above-mentioned metal non junction driving-belt.
That is, the present invention is for implementing the manufacturing installation of above-mentioned manufacture method.
In addition, for improving cooling effectiveness, in above-mentioned non junction driving-belt, 1 roller can also be set again facing to the above-mentioned metal non junction driving-belt of the 1st roller.
In the present invention, above-mentioned resilient material, its hardness (according to JIS K6301 A type standard) is preferably below 95 degree.
When above-mentioned hardness was spent greater than 95, elastic force diminished, and when the planar contact that molten thermoplastic resin's plate and the 3rd roller and metal endless belt are contacted is slightly simultaneously pressurizeed, resin material ridge took place easily, so the hardness of above-mentioned resilient material is preferably below 60 degree.
Below drawing is illustrated simply.
Fig. 1 is the skeleton diagram of the manufacturing installation that uses in the manufacture method that has about the thermoplastic resin board of the embossed pattern of the present invention's the 1st embodiment.
Fig. 2 is that the embossed pattern of the 1st embodiment forms the enlarged drawing with roller.
Fig. 3 is the A-A line sectional drawing of Fig. 2.
Fig. 4 is the enlarged drawing of thermoplastic resin board with embossed pattern of the 1st embodiment.
Fig. 5 is the B-B line sectional drawing of Fig. 4.
Fig. 6 is the skeleton diagram of the manufacturing installation that uses in the manufacture method that has about the thermoplastic resin board of the embossed pattern of the present invention's the 2nd embodiment.[the 1st embodiment]
Be illustrated with reference to Fig. 1-5 pair of manufacture method and manufacturing installation that has about the thermoplastic resin board 11 of the embossed pattern of the present embodiment.
At first explanation has the formation of manufacturing installation of thermoplastic resin board 11 of the embossed pattern of the present embodiment.
This manufacturing installation is by the metal non junction driving-belt 15 that installs around between the T die head 12 of the extruder of assembling and the 1st roller 13 and the 2nd roller 14 and form the 3rd roller 33 of usefulness by this metal non junction driving-belt 15 and the 1st embossed pattern that roller 13 contacts and 2 backer rolls (film-traying roll), 34 formations of near the 4th roller 17 of setting the 2nd roller 14 and the thermoplastic resin board 11 that pressurizes.
Above-mentioned the 1st roller 13 coating silicon rubber elastomeric material 18 on its surface.The hardness of this resilient material 18 (according to the standard of JIS K6301 A type) is that thickness is 1mm-50mm below 95 degree.
Above-mentioned metal non junction driving-belt 15 is made by stainless steel etc., and having surface roughness is the following minute surface of 0.5S.
The the 1st and the 2nd roller 13 and at least one side of 14, its turning axle 19 is being connected with the rotating driving device (not shown).
Shown in Fig. 2 and 3, above-mentioned embossed pattern forms the 3rd roller 33 of usefulness, is forming the model 35 that embossed pattern 36 (referring to Figure 4 and 5) is formed on thermoplastic resin board 11 on its outer peripheral face.This model 35 is concaveconvex shapes that pyrometric cone prismatic that corresponding heavy reflectivity plate is used is cut line.
And the 3rd roller 33 adjoins for a part that makes its outer peripheral face and to follow metal non junction driving-belt, and is configured on the position that the non junction driving-belt 15 of 13,14 on the 1st and the 2nd roller caves in to the inside.That is, when manufacturing had the thermoplastic resin board 11 of embossed pattern, the plate 11 on non junction driving-belt 15 and this non junction driving-belt 15 forms under the state of a part of the outer peripheral face that is wound on the 3rd roller 33 wriggled.Above-mentioned 2 backer rolls 34 are the form that thermoplastic resin board 11 pressurizes to be disposed facing to embossed pattern forming rolls 33 with the inboard from non junction driving-belt 15.
Above-mentioned the 4th roller 17 is to make thermoplastic resin board 11 become planar contact pressurization ground guided plate 11 by non junction driving-belt 15 on the part of the outer peripheral face of the 2nd roller 14.
For above-mentioned each roller 13,14,32,33, be provided with the temperature control equipment (not shown) of water-cooled etc. that can the reconciliation statement surface temperature.
Among Fig. 1 shown in dot-and-dash line, be to improve towards the cooling effectiveness of the metal non junction driving-belt 15 of the 1st roller 13, the place ahead of the 1st roller 13 that also can be in non junction driving-belt 15 is provided with other roller 32.
Below explanation has the manufacture method of thermoplastic resin board 11 of the embossed pattern of the present embodiment of using above-mentioned manufacturing installation.
At first, surface temperature to the 3rd roller 33 is controlled, and when the resin of thermoplastic resin board 11 is non-crystalline resin, remains under dew point~(Tg+20 of resin) ℃, and when the resin of thermoplastic resin board 11 is crystalline resin, remain under dew point~(m.p.-30 of resin) ℃.
And the thermoplastic resin board 11 that will be melt extruded by the T die head 12 of extruder imports to, and non junction driving-belt 15 Hes that contact with the 1st roller 13 are shaped between two rollers 13,33 that contact slightly simultaneously with roller 33 with embossed pattern.With 11 contact pressurization and the coolings of 13,33 pairs of plates of two rollers.At this moment, elastic deformation is taken place by the extruding force between the 1st and the 3rd roller 13,33 compression in resilient material 18, and resilient material 18 is at the angle θ from the center of two rollers 13,33 of elastic deformation 1Part, plate 11 are passed through two rollers 13,33 by the model 35 of planar contact pressurization and photocopying roll 33.Pressing for the face of plate 11 at this moment is 0.1MPa-20.0MPa.
Then this thermoplastic resin board 11 is contacted pressurization and cooling facing to roller 33 on non junction driving-belt 15.Be expressed to the plate 11 of roller 33 sides by non junction driving-belt 15 usefulness backer rolls 34, at angle θ from the center of roller 33 2The place adjoins with roller 33, and plate 11 adjoins at this and to meet angle θ 2Part is carried out the planar pressurization that contacts by roller 33 and non junction driving-belt 15.Pressing for the face of plate 11 at this moment is 0.01MPa-0.5MPa.
Next makes 15 rotations of non junction driving-belt and makes thermoplastic resin board 11 shift to the 2nd roller 14.Herein, the plate 11 of this embossed pattern that is shaped is added by 15 contacts of non junction driving-belt cool off when being pressed on the 2nd roller 14.With the 4th roller 17 guiding and adjoin at the plate 11 of this roller 14 at angle θ from the center of roller 14 3Part is carried out planar contact pressurization on non junction driving-belt 15.The face of this moment is pressed and is 0.01MPa-0.5MPa.
According to the present embodiment, be shaped with the angle θ of roller 33 at the 1st roller 13 and embossed pattern 1Part, cool off when making the planar contacts pressurization of plate 11 by non junction driving-belt 15 by roller 13,33 when making resilient material 18 distortion and on plate 11, duplicate floral designs 36, so can be to the thermoplastic resin board 11 that melt extrudes at high-speed shaping embossed pattern 36 down.And 11 transparencys of the plate with embossed pattern 36 that obtain are good.
In addition, after above-mentioned planar contact pressurization and cooling, form at embossed pattern and to adjoin angle θ with roller 33 2Part uses planar contact of the plate 11 of non junction driving-belt 15 and roller 33 to pressurize and cooling, and then, at the angle θ of the 2nd roller 14 3Part uses the planar of plate 11 of non junction driving-belt 15 and the 2nd roller 14 to contact pressurization and cooling, so can make the transparency of thermoplastic resin board 11 better.[the 2nd embodiment]
With reference to Fig. 6, the manufacture method of thermoplastic resin board 11 of the embossed pattern with the present embodiment and the embodiment of manufacturing installation are described.
It is different that the manufacturing installation of the present embodiment and the manufacturing installation of the 1st embodiment have been compared these points.
In the formation of this manufacturing installation, the 4th roller 17 in the 1st embodiment is not set, the 1st roller 13, the 2nd roller 14, metal non junction driving-belt 15 and the 3rd roller 33 of in addition similarly being equipped with resilient material 18 to coat.
Use the manufacture method of thermoplastic resin board 11 of this manufacturing installation identical with the 1st embodiment, the plate 11 of the 4th roller 17 guiding that is the 1st embodiment of no use is to the planar contact pressurization and the cooling of non junction driving-belt 15.
Promptly, to import to from molten thermoplastic resin's plate 11 that the T die head 12 of extruder is extruded between the 1st and the 3rd roller 13,33, carry out planar contact pressurization and cooling with the 1st with 13,33 pairs of plates 11 of the 3rd roller again, then, with the non junction driving-belt 15 of above-mentioned minute surface, this thermoplastic resin board 11 is carried out planar contact pressurization and cooling facing to the 3rd roller 33.
If use the present embodiment, at the angle θ of the 1st and the 3rd roller 13,33 1Part, one side makes resilient material 18 carry out elastic deformation, one side makes plate 11 planar contact pressurization coolings simultaneously and duplicate floral designs 36 on plate 11 by non junction driving-belt 15 usefulness rollers 13,33, so can form embossed pattern 36 to the thermoplastic resin board 11 that melt extrudes down high-speed.And 11 transparencys of the plate with embossed pattern that obtain are good.
In addition, except imposing above-mentioned planar contact pressurization and cooling, by meeting angle θ with adjoining of roller 33 in the embossed pattern shaping 2The planar contact of the non junction driving-belt 15 of part and the plate 11 of roller 33 pressurizeed and cooling, can make the transparency of thermoplastic resin board 11 better.Embodiment 1
In above-mentioned the 1st embodiment, the actual conditions of manufacturing installation and manufacture method is as described below.
The screw diameter 65mm of single shaft extruder, the wide 600mm of T die head.
Thermoplastic resin Polyvinylchloride (degree of polymerization: 1000, Tg:60 ℃) 50 weight portions.
Resin additive plastifier: DOP (two-2-ethylhexyl phthalic ester) 45 weight portions.Stabilizing agent: zinc stearate propylene ester 0.1 weight portion, barium stearate 0.1 weight portion.
The thickness 0.3mm of thermoplastic resin board.
The material silicon rubber of resilient material, thickness 10mm, hardness 50 degree.
Linear velocity 3m/min.
50 ℃ of the surface temperatures of the 3rd roller.Embodiment 2
In the manufacture method of embodiment 1, just change the surface temperature of board raw material and the 3rd roller.
Thermoplastic resin polypropylene (m.p.:160 ℃).
The surface temperature of the 3rd roller ... 70 ℃.Embodiment 3
In the manufacture method of embodiment 1, just change the surface temperature of board raw material and the 3rd roller.
Thermoplastic resin polycarbonate (Tg:145 ℃).
140 ℃ of the surface temperatures of the 3rd roller.Comparative example 1
In embodiment 1, only change the surface temperature of the 3rd roller.
85 ℃ of the surface temperatures of the 3rd roller.Comparative example 2
In embodiment 2, only change the surface temperature of the 3rd roller.
140 ℃ of the surface temperatures of the 3rd roller.Comparative example 3
In embodiment 3, only change the surface temperature of the 3rd roller.
170 ℃ of the surface temperatures of the 3rd roller.
For using the foregoing description 1-3 and comparative example 1-3, the performance of prepared thermoplastic resin board is estimated, and it the results are shown in the following table 1.
The metewand on the performance hurdle of table, as described below.
◎ has been considered to sufficient heavy reflecting properties.
* do not see that heavy reflecting properties is arranged.
Table 1
The resin of plate The temperature of the 3rd roller (℃) Performance
Embodiment 1 Polyvinylchloride ????50 ????◎
Embodiment 2 Polypropylene ????70 ????◎
Embodiment 3 Polycarbonate ????140 ????◎
Comparative example 1 Polyvinylchloride ????70 ????×
Comparative example 2 Polypropylene ????140 ????×
Comparative example 3 Polycarbonate ????160 ????×
As seen from Table 1, the thermoplastic resin board with embossed pattern 11 that obtains by embodiment 1-3, be to use the manufacturing installation of the present embodiment, and make the surface temperature of the 3rd roller 33, resin at thermoplastic resin board 11 is the occasion of non-crystalline resin, be dew point~(Tg+20 of resin) ℃, resin at thermoplastic resin board 11 is the occasion of crystalline resin, for what make under dew point~(m.p.-30 of resin) ℃ the condition, so can duplicate model 35 well, and can obtain having the product of sufficient heavy reflecting properties.
On the other hand, according to comparative example 1, though use the manufacturing installation of embodiment to produce thermoplastic resin board with embossed pattern, but it is because also high during than 80 ℃ of the surface temperature (Tg+20 of resin) of the 3rd roller 33 ℃, so when model is peeled off, cause that pattern damages, model duplicates bad, thereby can not see sufficient heavy reflectivity.
If with comparative example 2, use the manufacturing installation of embodiment to produce thermoplastic resin board with embossed pattern, but it is because also high during than 130 ℃ of the surface temperature (m.p.30 of resin) of the 3rd roller 33 ℃, so causing the pattern when model is peeled off damages, it is bad that model is duplicated, so can not see heavy reflecting properties.
If with comparative example 3, use the manufacturing installation of embodiment to produce thermoplastic resin board with embossed pattern, but because also high during than 165 ℃ of the temperature (Tg+20 of resin) of the 3rd roller 33 ℃, so equally with above-mentioned comparative example can not see heavy reflecting properties.

Claims (8)

1 has the manufacture method of the thermoplastic resin board of embossed pattern, it is characterized in that, the used manufacturing installation of manufacture method with thermoplastic resin board of embossed pattern is equipped with, the 1st roller that the surface coats with resilient material, and the metal non junction driving-belt of the surperficial minute surface that installs around between the 1st and the 2nd roller, with the 3rd form that roller is designed to adjoin above-mentioned metal non junction driving-belt that contacts with above-mentioned the 1st roller by above-mentioned metal non junction driving-belt, and the surface working of above-mentioned the 3rd roller becomes embossed pattern to form face, this preparation method is, the above-mentioned thermoplastic resin board of molten condition is imported between the above-mentioned metallic non junction driving-belt and above-mentioned the 3rd roller that contacts with above-mentioned the 1st roller, with the pressure between above-mentioned the 1st roller and the 3rd roller, one side makes above-mentioned resilient material carry out elastic deformation, one side makes above-mentioned thermoplastic resin board be contacted pressurization with the above-mentioned the 1st with the 3rd roller planarly, duplicating embossed pattern cools off simultaneously, when this cooling, resin for above-mentioned thermoplastic resin board is the occasion of non-crystalline resin, the surface temperature of above-mentioned the 3rd roller is remained under dew point~(Tg+20 of resin) ℃, and be the occasion of crystalline resin for the resin of above-mentioned thermoplastic resin board, the surface temperature of the 3rd roller is remained under dew point~(m.p.-30 of resin) ℃, then, with above-mentioned metal non junction driving-belt this thermoplastic resin board is carried out contacting pressurization and cooling facing to the 3rd roller planarly.
The manufacture method of the thermoplastic resin board with embossed pattern of 2 claims 1, it is characterized in that, when above-mentioned cooling, resin for above-mentioned thermoplastic resin board is the occasion of non-crystalline resin, the surface temperature of above-mentioned the 3rd roller is remained under Tg ℃ of dew point~resin, and be the occasion of crystalline resin for the resin of above-mentioned thermoplastic resin board, the surface temperature of above-mentioned the 3rd roller is remained on dew point~(m.p.-50 of resin) ℃.
3 manufacture methods with thermoplastic resin board of embossed pattern as claimed in claim 1, it is characterized in that, follow the elastic deformation of above-mentioned resilient material, face when making above-mentioned thermoplastic resin board carry out planar contact pressurization is pressed and is 0.1MPa-20.0MPa, without the elastic deformation of above-mentioned resilient material the time, the face when making above-mentioned thermoplastic resin board carry out planar contact pressurization is pressed and is 0.01MPa-0.5MPa.
The manufacture method of the thermoplastic resin board with embossed pattern of 4 claims 1 is characterized in that, the minute surface degree of above-mentioned metal non junction driving-belt is below the 3S when representing with surface roughness.
5 have the manufacturing installation of the thermoplastic resin board of embossed pattern, it is characterized in that, the metal non junction driving-belt that this device is equipped with the 1st roller that the surface coats with resilient material, install around the surperficial minute surface between the 1st and the 2nd roller becomes embossed pattern to form the 3rd roller with face with surface working, the 3rd roller contacts with above-mentioned the 1st roller by above-mentioned metal non junction driving-belt, and is designed to adjoin the form that connects above-mentioned metal non junction driving-belt.
The manufacturing installation of the thermoplastic resin board with embossed pattern of 6 claims 5 is characterized in that, above-mentioned resilient material, and its hardness (according to JIS K6301 A type standard) is below 95 degree.
The manufacturing installation of the thermoplastic resin board with embossed pattern of 7 claims 5 is characterized in that, above-mentioned resilient material, and its hardness (according to JIS K6301 A type standard) is below 60 degree.
The manufacturing installation of the thermoplastic resin board with embossed pattern of 8 claims 5 is characterized in that, the thickness of above-mentioned resilient material is 1mm-50mm.
CN 97110932 1996-03-06 1997-03-06 Method and device for manufacturing thermoplastic resin plate with embossint pattern Pending CN1180011A (en)

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Application Number Priority Date Filing Date Title
CN 97110932 CN1180011A (en) 1996-03-06 1997-03-06 Method and device for manufacturing thermoplastic resin plate with embossint pattern

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Application Number Priority Date Filing Date Title
JP48746/96 1996-03-06
CN 97110932 CN1180011A (en) 1996-03-06 1997-03-06 Method and device for manufacturing thermoplastic resin plate with embossint pattern

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CN102343670A (en) * 2010-07-29 2012-02-08 鸿富锦精密工业(深圳)有限公司 Preparation method for optical film
CN101462353B (en) * 2007-12-21 2013-03-27 住友化学株式会社 Method for producing extruded resin sheet
CN101456251B (en) * 2007-12-11 2013-03-27 住友化学株式会社 Method for producing extruded resin sheet
CN103737913A (en) * 2013-12-31 2014-04-23 常州丰盛光电科技股份有限公司 Sheet three-roller expanding knurling device and method for transfer-printing sheet by using same
CN106715096A (en) * 2015-01-21 2017-05-24 株式会社Ihi Double belt press
CN112743734A (en) * 2020-12-18 2021-05-04 成都佳驰电子科技有限公司 Production method of high-density composite film with hot-pressing pressure maintaining function

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100532070C (en) * 2005-03-02 2009-08-26 辅祥实业股份有限公司 Device and method for manufacturing panel with embossing on surface
CN101456251B (en) * 2007-12-11 2013-03-27 住友化学株式会社 Method for producing extruded resin sheet
CN101462353B (en) * 2007-12-21 2013-03-27 住友化学株式会社 Method for producing extruded resin sheet
CN102343670A (en) * 2010-07-29 2012-02-08 鸿富锦精密工业(深圳)有限公司 Preparation method for optical film
CN103737913A (en) * 2013-12-31 2014-04-23 常州丰盛光电科技股份有限公司 Sheet three-roller expanding knurling device and method for transfer-printing sheet by using same
CN106715096A (en) * 2015-01-21 2017-05-24 株式会社Ihi Double belt press
CN112743734A (en) * 2020-12-18 2021-05-04 成都佳驰电子科技有限公司 Production method of high-density composite film with hot-pressing pressure maintaining function

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