CN117995727A

CN117995727A - Film sticking device

Info

Publication number: CN117995727A
Application number: CN202410261458.6A
Authority: CN
Inventors: 杨善斌; 范志平; 刘攀; 卢少君
Original assignee: Guangdong Siwo Advanced Equipment Co ltd
Current assignee: Guangdong Siwo Advanced Equipment Co ltd
Priority date: 2024-03-07
Filing date: 2024-03-07
Publication date: 2024-05-07

Abstract

The application provides a film sticking device, which comprises: a work table, wherein a work area is formed on the work table, and a bearing table capable of lifting and bearing a wafer to be processed is arranged in the work area; the workbench is provided with a winding and unwinding unit, a first winding unit, a second winding unit and a pressing unit which is positioned between the winding and unwinding unit and the first winding unit and above the operation area; the winding and unwinding unit, the first winding and unwinding unit and the pressing unit can horizontally move on the workbench to enter or leave the working area; and the film stripping module and the film collecting module which can move to be close to or far away from the workbench surface are respectively arranged on the opposite sides of the winding and unwinding unit and the first winding unit. The film sticking device provided by the application can reduce the waste of the adhesive layer tape and simultaneously shorten the preparation time between two film sticking periods, so that the operation efficiency is improved, the film sticking device can also adapt to wafers with different thicknesses, and the adaptability is high.

Description

Film sticking device

Technical Field

The application belongs to the technical field of semiconductor equipment, and particularly relates to a film sticking device.

Background

In the wafer production process, a protective film is required to be attached to the front surface of the product before the product is ground. In the related art, a film laminating apparatus generally includes a film winding and unwinding device, and a film cutting device. In general, only one of the film winding and unwinding device and the film winding and unwinding device in the film laminating equipment can move, so that after the wafer film is laminated, the film winding and unwinding device can cause waste of part of film rolls during resetting; meanwhile, for wafers with different thickness sizes, thickness errors are easy to occur during film pasting, so that film pasting effect is poor, and film pasting yield is affected.

Disclosure of Invention

The embodiment of the application aims to provide a film sticking device so as to solve the technical problems that film rolls are wasted and wafers with different thickness sizes are difficult to adapt in the prior art.

In order to achieve the above object, the technical solution adopted in the embodiments of the present application is to provide a film sticking device, which includes:

a workbench, wherein a working area for pasting a film on the wafer to be processed is formed on the workbench, and a bearing table capable of lifting and bearing the wafer to be processed is arranged in the working area;

the workbench is provided with a winding and unwinding unit, a first winding unit, a second winding unit and a pressing unit which is positioned between the winding and unwinding unit and the first winding unit and above the operation area;

The winding and unwinding unit, the first winding unit and the pressing unit can horizontally move on the workbench to enter or leave the working area; the film stripping module and the film collecting module which can move to be close to or far away from the workbench surface are respectively arranged on the opposite sides of the winding and unwinding unit and the first winding unit;

The rolling and unwinding unit is used for releasing a glue film, the stripping end of the stripping module is used for stripping an adhesive layer and a protective film on the glue film, the second rolling unit is used for rolling the protective film, the pressing unit is used for pressing the adhesive layer on the wafer to be processed, and the first rolling unit is used for rolling the adhesive layer which is redundant after pressing.

Optionally, the film stripping module comprises a film stripping plate and a plurality of rollers which are arranged on one side of the film stripping plate away from the operation area and are respectively positioned on the upper side and the lower side of the film stripping plate; one of the rollers is connected with a tension monitoring device.

Optionally, the rolling and unwinding unit further comprises a rolling and unwinding bracket arranged on the workbench along a horizontal sliding manner and a rolling and unwinding roller module fixedly arranged on the rolling and unwinding bracket, and the film stripping module is arranged on the rolling and unwinding bracket along a vertical sliding manner.

Optionally, the first rolling unit further comprises a rolling support arranged on the workbench in a horizontal sliding manner and a rotating frame arranged on the rolling support in a rotating manner, and the rotating frame is provided with a rolling roller module and a film collecting module eccentrically arranged with the rotating shaft.

Optionally, a lifting mechanism is connected between the winding bracket and the rotating frame and located at one side of the rotating shaft, and the lifting mechanism is used for pushing the rotating frame to rotate so that the film winding module is close to or far away from the working table surface.

Optionally, a braking mechanism is arranged on either or both of the winding and unwinding unit and the first winding unit, the braking mechanism comprises a braking roller and a braking plate capable of propping against the braking roller, and the adhesive film and/or the adhesive layer is arranged between the braking roller and the braking plate in a penetrating manner.

Optionally, in the winding direction of the adhesive layer, the brake mechanism is disposed before the film peeling module and/or the brake mechanism is disposed after the film collecting module.

Optionally, two sides of the length direction of the workbench are provided with linear sliding tables, and the first rolling unit and the pressing unit are both arranged on the linear sliding tables.

Optionally, a static removing device is further arranged on the winding and unwinding unit and/or the first winding unit.

The film sticking device provided by the embodiment of the application has at least the following beneficial effects:

The rolling and unwinding unit and the first rolling and unwinding unit can horizontally move on the workbench to enter or leave the operation area, so that after the lamination unit and the external cutting unit are used for pasting films on the wafer and cutting is completed, the adhesive layer tape required by the next film pasting operation period can be synchronously pulled out in the resetting process of the first rolling and unwinding unit, the waste of the adhesive layer tape is reduced, the preparation time between the two film pasting periods can be shortened, and the operation efficiency is improved; meanwhile, the bearing table can adjust the height of the bearing table relative to the workbench surface according to the actual thickness of the wafer, so that the surface of the wafer can be flush with an operation area no matter whether the thickness of the wafer changes, and therefore, the pressing mechanism and the first rolling unit can be used for achieving better film pasting operation on the wafer under the condition that the operation height is not changed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of a film laminating apparatus according to some embodiments of the present application;

FIG. 2 is a perspective view of a film laminating apparatus according to some embodiments of the present application;

FIG. 3 is a front view of a portion of the construction of a film laminating apparatus according to some embodiments of the present application;

FIG. 4 is a schematic diagram illustrating a stage of installing a film of the film laminating apparatus according to some embodiments of the present application;

FIG. 5 is a schematic diagram of a laminating stage of a laminating apparatus according to some embodiments of the present application;

FIG. 6 is a schematic diagram of a film cutting stage of a film laminating apparatus according to some embodiments of the present application;

FIG. 7 is a schematic diagram of a residual film recovery stage of a film laminating apparatus according to some embodiments of the present application;

fig. 8 is a schematic diagram of a film pulling stage of the film laminating apparatus according to some embodiments of the present application.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments.

It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element.

When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 8, a film sticking device according to an embodiment of the application will be described.

The film sticking device is used for sticking a film layer to a wafer; in the wafer film pasting process, the protective film M1 and the adhesive layer M2 on the adhesive film M are separated first, the protective film M1 of the adhesive film M is wound and recovered, the adhesive layer M2 is cut after being adhered to a wafer, and the waste adhesive layer M2 remained after cutting is recovered.

Referring to fig. 1 to 3, the film laminating apparatus according to the present application includes a workbench, a carrying platform 810 disposed in the workbench, and a winding and unwinding unit 100, a first winding unit 200, a second winding unit 300 and a lamination unit 400 disposed on the workbench.

Wherein, be formed with the operation area A that is used for pasting the film to the wafer on the workstation, be provided with the opening that supplies plummer 810 to go up and down to pass on the workstation in being located operation area A, plummer 810 is the shape with opening looks adaptation, but its lifting slip sets up in the workstation in order to go up and down to flush with operation area A's surface through the opening. The aforementioned openings may be circular or other shapes.

It will be appreciated that the upper surface of the carrier 810 may accommodate at least one wafer, or may be an even number of wafers, such as two wafers, four wafers, etc. In the arrangement capable of accommodating the even-numbered wafers, the even-numbered wafers are arranged side by side in the width direction of the work area a. In a further embodiment, the carrier 810 is heated, so that the glue on the film covering the wafer surface is softened by heating during the wafer film pasting process, so that the film is better adhered to the wafer surface.

Referring to fig. 1-2, in a further embodiment, the carrier 810 may be driven by a single elevator 820, or may be driven by multiple elevators 820. In the arrangement mode of jointly driving the plurality of lifting devices 820, each lifting device 820 can be independently driven to realize horizontal leveling of the bearing platform 810, so that the surface of a wafer can be kept at the same horizontal plane with other areas of the operation area A when the wafer is pasted each time, and the occurrence of poor rate such as wrinkles and the like when the adhesive layer M2 is pasted due to inconsistent levelness during pasting is avoided.

The winding and unwinding unit 100 is used for releasing the adhesive film M, the second winding unit 300 is used for recovering the protective film M1, the pressing unit 400 is used for pressing and tightly adhering the adhesive layer M2 to the wafer, and the first winding unit 200 is used for recovering the waste aftertackiness after cutting to connect the layer M2.

Specifically, referring to fig. 1 to 3, the unwinding unit 100, the first winding unit 200, the second winding unit 300, and the pressing unit 400 are described in detail below.

The winding and unwinding unit 100 comprises a winding and unwinding bracket 120, a winding and unwinding roller module 130, a film stripping module 110, a plurality of first film guide rollers 141, a pressing roller 142, a film stripping power roller 143 and a second film guide roller 144, wherein the winding and unwinding roller module 130, the film stripping module 110, the first film guide rollers 141, the pressing roller 142, the film stripping power roller 143 and the second film guide roller 144 are arranged behind the film stripping module 110, and the winding and unwinding roller module 130 is arranged on the winding and unwinding bracket 120.

The protection film roll is placed on the roll unwinding module 130, and the protection film M1 belt sequentially passes through each first film guiding roller 141 and the film stripping module 110, the protection film M1 belt and the bonding layer M2 belt on the protection film M1 belt at the film stripping module 110 are torn off and form a larger included angle therebetween, and the protection film M1 belt sequentially passes through the pressing roller 142, the film stripping power roller 143 and the second film guiding roller 144 after being torn off, and finally is wound and recovered by the second winding unit 300. In this process, the winding and unwinding roller module 130 is used for releasing the adhesive film M tape, each first film guiding roller 141 plays a guiding and conveying role on the adhesive film M tape, so that the adhesive film M tape can be smoothly wound to the peeling module 110 for peeling, the peeling power roller 143 is used for winding and delivering the protective film M1 tape, the pressing roller 142 is used for pulling the protective film M1 tape, so that the protective film M1 tape can be smoothly wound by the peeling power roller 143 for being smoothly separated from the adhesive layer M2 tape, and the second film guiding roller 144 also plays a guiding role on the protective film M1 tape.

The pressing unit 400 is slidably disposed on the workbench, and is capable of sliding in the operation area a to press the bonding layer M2 tape onto the wafer on the operation area a, and the external cutting unit cuts and separates the wafer from the bonding layer M2 tape after the bonding layer M2 tape is pressed. After dicing the wafer and the adhesive layer M2 tape is completed, the wafer is transported away from the operation area a by the transport unit, and the operation area a leaves the remaining adhesive layer M2 tape diced.

The first rolling unit 200 includes a rolling support 220, a film rolling module 210, a film rolling power roller 250, and a rolling roller module 240, wherein the film rolling module 210, the film rolling power roller 250, and the rolling roller module 240 are disposed on the rolling support 220, the rolling roller module 240 is used for rolling the remaining adhesive layer M2 tape after finishing film pasting and cutting, and the adhesive layer M2 tape is wound on the rolling roller module 240 after sequentially passing through the film rolling module 210 and the film rolling power roller 250. It can be understood that the winding roller module 240 is a gravity roller, specifically, a sliding rail assembly is vertically disposed on the winding bracket 220, the winding roller module 240 is disposed on the sliding rail assembly, and the winding roller thereon is abutted against the film-winding power roller 250, and is driven by the film-winding power roller 250 to rotate so as to implement winding and recycling of the remaining adhesive layer M2 tape.

The second winding unit 300 is used for winding the recovery protection film M1 tape.

Further, the unwinding unit 100 and the first winding unit 200 can be horizontally movably disposed on the table, which is driven by a linear driving mechanism including, but not limited to, a screw mechanism, a linear sliding table 600 mechanism, etc., and the unwinding unit 100 and the first winding unit 200 are independently moved and disposed, respectively, so that the unwinding unit 100 and the first winding unit 200 can be independently moved to enter or leave the working area a, respectively.

In some embodiments, linear slides 600 are provided on both sides of the length of the table.

For the unreeling unit 100, the unreeling unit 100 is slidably disposed on the linear sliding table 600, and a first driving source is disposed on the workbench, the first driving source may be a linear motor, a movable end of the first driving source is connected to the unreeling bracket 120, and meanwhile, the bottom of the unreeling bracket 120 is only slidably disposed on the linear sliding table 600.

The first winding unit 200 is slidably disposed on two linear sliding tables 600 at two sides of the bottom thereof, and the first winding unit 200 is driven by one of the linear sliding tables 600 to perform horizontal linear movement.

For the pressing unit 400, the two sides of the bottom are also slidably disposed on the two linear sliding tables 600, and the pressing unit 400 is driven by one of the linear sliding tables 600 to perform horizontal linear movement.

By arranging the linear sliding tables 600 on two sides of the workbench and driving the first rolling unit 200 and the pressing unit 400 by different linear sliding tables 600 respectively, the film sticking device disclosed by the application is compact in structure and small in occupied space.

In addition, the film peeling module 110 and the film collecting module 210 are movably disposed, and both can be moved to be close to or far from the table surface of the workbench. The movable setting mode of the film stripping module 110 and the film collecting module 210 may be a vertical linear movement or a swinging setting around a rotation shaft, which is not limited in particular. Through setting up the activity of shell membrane module 110 and receipts membrane module 210 for when rolling up and unreeling unit 100 and/or first roll-up unit 200 remove, the perpendicular distance between shell membrane module 110 and receipts membrane module 210 and the table surface can increase, thereby avoid shell membrane module 110 and receipts membrane module 210 and the table surface to appear the motion interference, and finally improve the removal stroke of rolling up and unreeling unit 100 and first roll-up unit 200 on the table surface, in order to improve the operating efficiency.

Specifically, referring to fig. 4 to 8, the following details the operation procedure of the film sticking apparatus according to the embodiment of the present application.

Referring to fig. 4, the adhesive film M stage is installed. In this step, the protective film M1 tape is pulled out and sequentially passes through each of the first film guide rollers 141 and the film peeling module 110 by manually placing the protective film roll on the roll-off module 130, and the protective film M1 tape and the adhesive layer M2 tape on the protective film M1 tape are torn off at the film peeling module 110; the torn adhesive layer M2 passes through the film collecting module 210 and the gap between the film collecting power roller 250 and the winding roller module 240 and is clamped by the film collecting power roller 250 and the winding roller module 240 together so as to be convenient for subsequent winding and recovery; the torn protective film M1 sequentially passes through the pressing roller 142, the film peeling power roller 143 and the second film guiding roller 144, and then is wound around the second winding unit 300.

And (5) preparing a film pasting stage. After the carrying platform 810 carries the wafer and moves to the level that the surface of the wafer is flush with other surfaces of the operation area A according to the thickness of the wafer, the first rolling unit 200 and the pressing unit 400 move to the initial position far away from the rolling unit 100, the pressing unit 400 is close to the first rolling unit 200, and meanwhile, the film collecting module 210 abuts against the adhesive layer M2 to enable the adhesive layer M2 to be tightly attached to the surface of the operation area A; the winding and unwinding unit 100 also horizontally moves to an initial position far away from the laminating unit 400, and meanwhile, the film stripping module 110 also moves to an initial position far away from the workbench surface, so that the distance between the front end of the film stripping module 110 (namely, the separation position of the protective film M1 belt and the adhesive layer M2 belt) and the laminating unit 400 is greater than the maximum length of the operation area a, and a certain included angle is formed between the adhesive layer M2 belt and the surface of the operation area a.

Referring to fig. 5, the bonding stage. The lamination unit 400 moves towards one side close to the winding and unwinding unit 100, the adhesive layer M2 tape is pressed and attached to the surface of the wafer in the moving process, and in the process, the film stripping module 110 is synchronously lowered to be close to the working table, so that the tension of the protective film M1 tape on the winding and unwinding unit 100 is kept consistent in the attaching process until the film stripping module 110 is lowered to a position flush with the working table, and after the movement of the lamination unit 400 forms a complete coverage operation area a, the attaching operation is completed.

Referring to fig. 6, the film cutting stage. After the bonding operation is completed, the external cutting unit cuts the adhesive layer M2 tape bonded to the wafer surface so as to separate the adhesive layer M2 bonded to the wafer surface from the adhesive layer M2 tape located above the operation area a and not bonded to the wafer surface.

Referring to fig. 7, the residual film recovery stage. The position of the unreeling unit 100 is kept unchanged, the first reeling unit 200 moves towards the side of the unreeling unit 100, so that the adhesive layer M2 remained on the operation area A is reeled, and when the first reeling unit 200 moves to the edge of the operation area A close to the reeling unit, the residual film recycling operation is completed.

Referring to fig. 8, the film pulling stage. The film collecting module 210 moves to be far away from the table surface, and the collecting roller module 240 and the film collecting power roller 250 remain in a stationary state to fixedly clamp the adhesive layer M2 tape, and then the first collecting unit 200 moves to be reset in a direction away from the winding and unwinding unit 100, in which the winding and unwinding roller module 130 releases the protective film M1 tape, and at the same time, the film peeling module 110 also moves in a direction away from the table surface to avoid contact with the table surface during the pulling-out of the adhesive layer M2.

By arranging the film sticking device in this way, on one hand, the winding and unwinding unit 100 and the first winding and unwinding unit 200 are movably arranged, and the film stripping module 110 and the film winding module 210 on the winding and unwinding unit are movably arranged, so that the first winding and unwinding unit 200 can synchronously pull out the adhesive layer M2 tape required by the next working period and can not be contacted with a workbench surface while resetting, waste of the adhesive layer M2 tape caused by resetting the first winding and unwinding unit 200 can be avoided, and the wafer sticking quantity of the single-roll protective film M1 tape can be increased; on the other hand, even if the thickness of the wafer changes, the carrying platform 810 can be lifted timely according to the thickness of the wafer so that the surface of the wafer can be kept flush with other surfaces of the operation area a, so that in the film preparation stage, the lamination stage, the residual film recovery stage and the film pulling stage, the adhesive tape can be fully contacted with the operation area a during the movement process no matter the movement of the first winding unit 200 or the movement of the pressing unit 400, thereby being beneficial to improving the film pasting yield and the film collecting efficiency.

Referring to fig. 1 to 3, in some embodiments, the film peeling module 110 includes a film peeling plate 111 and a plurality of rollers disposed on a side of the film peeling plate 111 away from the operation area a and respectively located on upper and lower sides of the film peeling plate 111; the roller is also referred to as a portion of the first film guide roller 141 described in the foregoing embodiment.

Referring to fig. 1 to 3, in a specific embodiment, the film peeling plate 111 is extended toward one side of the first rolling unit 200, the width of the film peeling plate 111 is adapted to or slightly smaller than the width of the operation area a, and a guide slope is provided at a side of the top surface thereof toward the first rolling unit 200. The aforementioned protective film M1 tape is separated into an adhesive layer M2 tape and a protective film M1 tape at the guide slope edge on the film peeling plate 111.

It can be understood that the film stripping module 110 may be movably disposed, or the film stripping plate 111 may be movably disposed, or the whole film stripping module 110 may be movably disposed, and the movable manner may be swing or linear movement. For example, in the manner that the whole peeling module 110 is movably disposed, the peeling module 110 includes a peeling bracket 113 and a linear driving device (such as a linear motor or an air cylinder), the peeling bracket 113 is vertically slidably disposed on the winding and unwinding bracket 120 and driven by the linear driving device, and the peeling plate 111 and a portion of the first film guiding roller 141 are disposed on the peeling bracket 113.

Further, a tension monitoring device 112 is connected to one of the first film guiding rollers 141. Further, as an example. The tension monitoring device 112 includes a force measuring bracket, a sliding rail assembly and a force measuring sensor, the sliding rail assembly is connected with the force measuring bracket and the peeling bracket 113, the force measuring sensor is also connected with the force measuring bracket and the peeling bracket 113, and a first film guiding roller 141 is rotatably arranged on the force measuring bracket. In the film pasting operation process, the tension of the protective film M1 belt is changed, and the force measuring bracket can be pulled to slide on the sliding rail assembly, so that the force measuring sensor detects the change value, and the first winding unit 200 or the winding and unwinding roller module 130 adjusts the moving/winding and unwinding speed according to the tension change value, so that the tension of the protective film M1 belt is kept in a target range.

Referring to fig. 1 to 3, in some embodiments, the first roll-up unit 200 further includes a roll-up support 220 provided to the table to slide horizontally and a rotating frame 230 rotatably provided to the roll-up support 220, and a roll-up roller module 240 and a film-collecting module 210 provided eccentrically to the rotating shaft are provided on the rotating frame 230. Through setting up rotating turret 230, set up roll module 240 and receipts membrane module 210 on rotating turret 230 in the same time, after the operation of preceding wafer pad pasting is accomplished, when the surplus membrane is retrieved after the first roll-up unit 200 needs to reset, make rotating turret 230 whole rotate can make receipts membrane module 210 move towards one side of keeping away from table surface to avoid first roll-up unit 200 reset in-process receipts membrane module 210 and table surface too near distance makes the extravagant problem that the waiting adhesive linkage M2 that pulls out and table surface contact is too early.

It will be appreciated that the turret 230 may be driven by a rotating motor or may be driven by an air cylinder to effect oscillation.

Specifically, in some embodiments, a lifting mechanism 260 is connected between the roll-up stand 220 and the rotating frame 230 at one side of the rotating shaft, and the lifting mechanism 260 is used to push the rotating frame 230 to rotate so as to make the film-collecting module 210 approach to or separate from the working surface. The lifting mechanism 260 may be a linear motor or a cylinder.

Referring to fig. 1 to 3, in some embodiments, a braking mechanism is provided at either or both of the unwinding unit 100 and the first winding unit 200, the braking mechanism including a braking roller 520 and a braking plate 510 capable of abutting against the braking roller 520, and the adhesive film M and/or the adhesive layer M2 is interposed between the braking roller 520 and the braking plate 510.

In a specific embodiment, the unwinding unit 100 and the first winding unit 200 are provided with braking mechanisms.

Specifically, in the unreeling unit 100, a brake mechanism is provided on the peeling bracket 113 and located before the peeling plate, more specifically, it is provided before the tension monitoring device 112. The braking mechanism comprises a braking cylinder and a braking plate 510, wherein the braking cylinder is used for pushing the braking plate 510 to be abutted against one of the first film guiding rollers 141 so as to tightly press the protective film M1 belt against the corresponding first film guiding roller 141 and stop the protective film M1 belt.

In the first winding unit 200, a braking mechanism is provided on the turret 230 and in the film collecting module 210, the braking mechanism also including a braking cylinder and a braking plate 510. Specifically, the film collecting module 210 includes a guide roller 211, a tension cylinder, a tension roller 212, a brake roller 520, a brake cylinder, and a brake plate 510. The tension roller 212 is disposed behind the guide roller 211, the brake roller 520 is disposed behind the guide roller 211, and the adhesive layer M2 tape passes through a gap between the guide roller 211 and the tension roller 212 after passing around the guide roller 211, and is wound in the winding roller module 240 after passing around the brake roller 520 and then passing around the film winding power roller 250.

The tension cylinder is connected to the tension roller 212 for pushing the tension roller 212 toward or away from the guide roller 211 to adjust the tension of the adhesive layer M2 tape in the first winding unit 200. The brake cylinder is connected with the brake plate 510 to push the brake plate 510 against the brake roller 520, thereby clamping the adhesive layer M2.

A braking mechanism in the winding and unwinding unit 100 for belt tension adjustment of the protective film M1 at the stage of preparation for film attachment. Specifically, the brake cylinder pushes the brake plate 510 close to the first film guide roller 141 to increase friction between the protective film M1 belt and the first film guide roller 141 and the brake plate 510, thereby putting the protective film M1 belt in different tension states.

The braking mechanism in the first winding unit 200 is used to clamp and pull the adhesive layer M2 tape toward the side away from the winding and unwinding unit 100 during the film pulling stage. Specifically, the winding and unwinding roller module 130 releases the adhesive film M tape while the braking mechanism clamps the adhesive layer M2 tape, and at the same time, the first winding and unwinding unit 100 moves on the operation area a to clamp the adhesive layer M2 tape and pull it to the initial position.

By providing a braking mechanism at either or both of the unwinding unit 100 and the first winding unit 200, the pulling or tension control of the protective film M1 tape or the adhesive layer M2 tape can be made more accurate, so as to be advantageous for improving the film attachment accuracy.

Referring to fig. 1 to 3, in some embodiments, the press unit 400 includes a press frame 410 provided to a table in a horizontal sliding manner and a press roller 420 provided to the press frame 410 in a vertical moving manner. For example, there may be a sliding table assembly on the table, on which the press frame 410 is disposed, and the moving stroke of the sliding table assembly is greater than the length of the working area a. Further, a pressing cylinder for pushing the pressing roller to approach or separate from the working table is further disposed on the pressing frame 410, and the pressing roller can leave the working table to be reset smoothly when the pressing unit 400 performs pressing and resetting.

Further, a heating module is provided in the pressing roller 420, and correspondingly, a temperature sensor is also provided in the pressing roller 420. In this way, when the press roller 420 presses the adhesive layer M2 of the working area a onto the wafer, it can heat the adhesive layer M2 synchronously so as to soften the adhesive layer thereon, thereby achieving a better pressing effect.

Referring to fig. 1 to 3, in some embodiments, a static-removing device 700 is provided on the unwinding unit 100 and/or the first winding unit 200.

For example, on the winding and unwinding unit 100, the static eliminator 700 may be disposed between the film stripping plate 111 and the pressing roller 142; on the first winding unit 200, the static electricity removing device 700 is disposed directly above the film collecting module 210. The static-removing device 700 may be a static-removing ion device.

By providing the static electricity removing device 700 on the winding and unwinding unit 100 and/or the first winding and unwinding unit 200, the problem of work contamination of the protective film M1 tape and/or the adhesive layer M2 tape due to electrostatic adhesion of dust can be prevented, and the problem of mutual adhesion of the tape layers due to static electricity during winding and unwinding of the protective film M1 tape can be prevented.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims

1. A film sticking device for sticking a film layer to a wafer, comprising:

2. A film laminating apparatus as claimed in claim 1, wherein: the film stripping module comprises a film stripping plate and a plurality of rollers which are arranged on one side of the film stripping plate far away from the operation area and are respectively positioned on the upper side and the lower side of the film stripping plate; one of the rollers is connected with a tension monitoring device.

3. A film laminating apparatus as claimed in claim 2, wherein: the rolling and unwinding unit further comprises a rolling and unwinding bracket arranged on the workbench along the horizontal sliding direction and a rolling and unwinding roller module fixedly arranged on the rolling and unwinding bracket, and the film stripping module is arranged on the rolling and unwinding bracket along the vertical sliding direction.

4. A film laminating apparatus as claimed in claim 1, wherein: the first rolling unit further comprises a rolling support arranged on the workbench in a horizontal sliding mode and a rotating frame arranged on the rolling support in a rotating mode, and a rolling roller module and a film collecting module eccentrically arranged with a rotating shaft are arranged on the rotating frame.

5. The film laminating apparatus as claimed in claim 4, wherein: and a lifting mechanism is connected between the rolling support and the rotating frame and positioned at one side of the rotating shaft, and the lifting mechanism is used for pushing the rotating frame to rotate so that the film collecting module is close to or far away from the working table surface.

6. A film laminating apparatus as claimed in any one of claims 1 to 5, wherein: the winding and unwinding unit and the first winding unit are provided with a braking mechanism, the braking mechanism comprises a braking roller and a braking plate capable of propping against the braking roller, and the adhesive film and/or the adhesive layer is/are arranged between the braking roller and the braking plate in a penetrating mode.

7. The film laminating apparatus as claimed in claim 6, wherein: in the winding direction of the bonding layer, the brake mechanism is arranged before the film stripping module and/or after the film collecting module.

8. A film laminating apparatus as claimed in any one of claims 1 to 5, wherein: the pressing unit comprises a pressing frame arranged on the workbench in a horizontal sliding manner and a pressing roller arranged on the pressing frame in a vertical movable manner; and a heating module is arranged in the pressing roller.

9. A film laminating apparatus as claimed in claim 1, wherein: the two sides of the workbench in the length direction are provided with linear sliding tables, and the first rolling unit and the pressing unit are both arranged on the linear sliding tables.

10. A film laminating apparatus as claimed in claim 1, wherein: and the winding and unwinding unit and/or the first winding unit are/is also provided with a static eliminating device.