CN117943921B - A fast recovery diode back thinning processing equipment - Google Patents
A fast recovery diode back thinning processing equipment Download PDFInfo
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- CN117943921B CN117943921B CN202410353452.1A CN202410353452A CN117943921B CN 117943921 B CN117943921 B CN 117943921B CN 202410353452 A CN202410353452 A CN 202410353452A CN 117943921 B CN117943921 B CN 117943921B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention relates to the technical field of fast recovery diodes, in particular to a back thinning treatment device of a fast recovery diode, which comprises a frame, a grinding device and a fixing device; two driving rollers are rotatably arranged on the frame; the driving rollers are provided with adhesive tapes, and two sides of each adhesive tape are respectively connected with the two driving rollers in a bridging way; the grinding device comprises a first linear driver, a first mounting frame and a grinding assembly; the first mounting frame is connected with the driving end of the first linear driver; the grinding component is arranged on the first mounting frame and is used for grinding the diode; the fixing device comprises a supporting table and a pressing assembly; the supporting table is arranged on the frame; the compressing assembly is arranged on the frame. The invention realizes the function of avoiding offset of the adhesive film in the process of grinding the diode, can achieve the effect of efficiently processing the diode while stably fixing the diode through the arrangement of the adhesive tape and the driving roller, and solves the problem of uneven grinding thickness caused by offset of the adhesive film in the processing process.
Description
Technical Field
The invention relates to the technical field of fast recovery diodes, in particular to a back thinning treatment device of a fast recovery diode.
Background
A Fast Recovery Diode (FRD) is a semiconductor diode having a characteristic of good switching characteristics and a short reverse recovery time. When the back thinning treatment is carried out on the fast recovery diode, the workpiece is usually manually moved and controlled to be polished, so that the working quality cannot be ensured, and the working efficiency is low.
For this reason, chinese patent CN114750057B discloses a back thinning apparatus and process for producing a composite fast recovery diode, and by setting a back thinning mechanism, the back thinning mechanism can simultaneously perform thinning treatment on a plurality of diode workpieces, and the structure of a fixing plate is matched with a base, so that the back thinning mechanism has the advantages of simple structure and batch work, and the polishing machine and polishing solution are provided with a compact structure, so that the matching effect is good during work, and the efficiency of the thinning treatment on the diode workpieces can be effectively improved.
However, the existing thinning equipment still needs to manually stack the base, and the diode needs to be placed in the base, so that the dependence on manpower is high, the working efficiency is limited, and the installation accuracy cannot be guaranteed. The diode is fixed by adopting a vacuum adsorption method, and the diode is easily damaged in the processing process due to the fact that the size of the diode is small and the diode is influenced by vacuum adsorption force.
Therefore, chinese patent CN206780157U discloses a light-emitting diode wafer, which can avoid the adhesive film from directly receiving the adsorption force of the vacuum adsorption device by arranging an adsorption sheet between the adhesive film and the vacuum adsorption device, thereby being beneficial to keeping the adhesive film and the light-emitting diode wafer tightly attached all the time, and solving the problems that the light-emitting diode wafer is separated from the adhesive film due to the larger adsorption force in the thinning process and the light-emitting diode wafer is loose.
But adopt gasket protection's mode, need guarantee that wafer or paste the membrane and can closely cooperate with the adsorption plate, in case take place the skew between paste membrane and the adsorption plate, can lead to the condition such as fold, overlap appear in paste membrane, and then lead to the diode to be supported and appear the slope condition, and then lead to polishing thickness inhomogeneous.
Disclosure of Invention
According to the back thinning treatment equipment for the fast recovery diode, the problem that the polishing thickness is uneven due to the fact that the adhesive film is deviated in the processing process is solved through the frame, the polishing device and the fixing device.
In order to solve the problems in the prior art, the invention provides a device for thinning the back of a fast recovery diode, which comprises a frame, a grinding device and a fixing device; the machine frame is rotatably provided with two driving rollers, and is provided with a rotary driver for driving one of the driving rollers to rotate; the driving rollers are provided with adhesive tapes, and two sides of each adhesive tape are respectively connected with the two driving rollers in a bridging way; the grinding device comprises a first linear driver, a first mounting frame and a grinding assembly; the first linear driver is arranged on the frame; the first mounting frame is connected with the driving end of the first linear driver; the grinding component is arranged on the first mounting frame and is used for grinding the diode; the fixing device comprises a supporting table and a pressing assembly; the supporting table is arranged on the frame and is positioned below the adhesive tape; the compaction assembly is arranged on the frame and is used for compacting the adhesive tape on the supporting table.
Preferably, the compression assembly comprises a first bracket, a second bracket and a first elastic member; the first bracket is arranged on the frame; the first support is provided with a first guide ring, and one end of the first guide ring, which is far away from the first support, is provided with a first limiting ring; the second support is in sliding fit with the first guide ring, a first pressing block is arranged on the second support, and the second support is connected with the first pressing block through a rod piece; two ends of the first elastic piece are respectively connected with the first bracket and the second bracket; under the operating condition, when the first linear driver drives the first mounting frame to move downwards, the first mounting frame is contacted with the second bracket to push the second bracket to move downwards.
Preferably, the adhesive tape is provided with a wear-resistant part; under the operating condition, when the pressing component works, the pressing component presses the wear-resisting part of the adhesive tape on the supporting table.
Preferably, a limiting mechanism is arranged on the frame and comprises an extension rod, an induction plate and an adjusting component; the extension rod is arranged on the first mounting frame; the sensing plate is arranged on the frame and is provided with a pressure sensor for sensing the pressure applied by the sensing plate; the adjusting component is arranged on the rack and is used for adjusting the position of the induction plate.
Preferably, the adjusting assembly comprises a second mounting frame, a screw, a worm gear, a worm and a handle; the second mounting frame is slidably mounted on the frame, and the induction plate is mounted on the second mounting frame; the screw is rotatably arranged on the second mounting frame and is in threaded connection with the frame; the worm is rotatably arranged on the second mounting frame; the worm wheel is sleeved on the screw rod and is in meshed connection with the worm; the handle is sleeved on the worm.
Preferably, the pressing assembly comprises a third bracket, a fourth bracket and a second elastic piece; the third bracket is arranged on the frame; a second guide rod is arranged on the third bracket, and a second limiting ring is arranged at one end of the second guide rod, which is far away from the third bracket; the fourth support is in sliding fit with the second guide rod, a second pressing block is arranged on the fourth support, and the fourth support is connected with the second pressing block through a rod piece; two ends of the second elastic piece are respectively connected with the fourth bracket and the second limiting ring; an auxiliary control mechanism is arranged on the frame and comprises a limiting component and a control component; the limiting component is arranged on the third bracket and is used for limiting the fourth bracket to move; the control component is arranged on the third bracket; under operating condition, when first mounting bracket moves down, first mounting bracket drive control assembly, control assembly remove restriction subassembly to the removal restriction of fourth support, and the fourth support moves down under the elasticity effect of second elastic component, and the fourth support drives the second briquetting and removes, and the second briquetting compresses tightly the area of pasting on the brace table.
Preferably, the limiting assembly comprises a mounting seat, a clamping block and a third elastic piece; the mounting seat is arranged on the third bracket; the clamping block is slidably arranged on the mounting seat; a clamping groove matched with the clamping block is formed in the fourth bracket; the two ends of the third elastic piece are respectively connected with the mounting seat and the clamping block.
Preferably, the control assembly comprises a mounting plate, a fourth elastic piece and a clamping plate; two ends of the fourth elastic piece are respectively connected with the mounting plate and the mounting seat; the clamping plate is arranged on the mounting plate and is in sliding fit with the mounting seat; the clamping block is provided with an inclined guide groove; a pushing assembly for pushing the mounting plate to move downwards along the vertical direction is arranged on the first mounting frame; a reset component for controlling the reset of the fourth bracket is arranged on the third bracket; under operating condition, when the first linear driver drives the first mounting bracket to move downwards, after the pushing component is contacted with the mounting plate, the mounting plate and the clamping plate are driven to move downwards by overcoming the elastic force of the fourth elastic piece, the clamping plate is extruded after being contacted with the inclined guide groove of the clamping plate, and the clamping block is driven to move towards the direction away from the clamping groove.
Preferably, the pushing assembly comprises a connecting frame, a pushing frame and a fifth elastic piece; the connecting frame is arranged on the first mounting frame; the pushing frame is slidably arranged on the connecting frame, and a limiting block is arranged on the pushing frame; the both ends of fifth elastic component are connected with pushing away frame and link respectively, when pushing away the frame and not contacting with the mounting panel, under the elasticity effect of fifth elastic component, stopper and link support tight fit.
Preferably, the reset assembly comprises a second linear driver, a push plate and an extension plate; the second linear driver is arranged on the third bracket; the push plate is connected with the driving end of the second linear driver; the extension plate is connected with the fourth bracket and is positioned right above the push plate.
Compared with the prior art, the invention has the beneficial effects that:
1. According to the invention, the function of avoiding offset of the adhesive film in the process of grinding the diode is realized through the frame, the grinding device and the fixing device, the effect of stably fixing the diode and simultaneously carrying out high-efficiency processing can be achieved through the arrangement of the adhesive tape and the driving roller, and the problem of uneven grinding thickness caused by offset of the adhesive film in the processing process is solved.
2. According to the invention, the function of pressing the adhesive tape on the supporting table is realized through the first bracket, the second bracket, the first pressing block and the first elastic piece, the first pressing block is automatically driven to press down when the first mounting frame moves down, and the first pressing block is automatically controlled to reset after the first mounting frame resets through the arrangement of the first elastic piece.
Drawings
Fig. 1 is a perspective view of a first embodiment of a fast recovery diode backside thinning apparatus.
Fig. 2 is an exploded perspective view of a grinding device and a fixing device in a fast recovery diode backside thinning apparatus.
Fig. 3 is a schematic perspective view of a hold-down assembly of a first embodiment of a fast recovery diode backside thinning apparatus.
Fig. 4 is a schematic perspective view of a grinding device and a limiting mechanism in a fast recovery diode backside thinning apparatus.
Fig. 5 is a schematic perspective view of a limiting mechanism in a fast recovery diode backside thinning apparatus.
Fig. 6 is a schematic perspective view of a hold-down assembly and auxiliary control mechanism of a second embodiment of a fast recovery diode backside thinning treatment apparatus.
Fig. 7 is an enlarged partial schematic view at a in fig. 6.
Fig. 8 is a schematic perspective view of a hold-down assembly and reset assembly of a second embodiment of a fast recovery diode backside thinning processing apparatus.
Fig. 9 is an exploded perspective view of a control assembly in a fast recovery diode backside thinning process apparatus.
Fig. 10 is a schematic perspective view of a pusher assembly in a fast recovery diode backside thinning apparatus.
The reference numerals in the figures are: 1-a frame; 11-a driving roller; 12-a rotary drive; 13-sticking the tape; 131-wear part; 2-a grinding device; 21-a first linear drive; 22-a first mounting frame; 23-an abrasive assembly; 3-fixing means; 31-a support table; 311-rolling shafts; 32-a compression assembly; 321-a first bracket; 3211-a first guide bar; 3212-a first limiting ring; 322-a second scaffold; 3221-a first briquette; 323-a first elastic member; 324-third rack; 3241—a second guide bar; 3242-a second stop collar; 325-fourth rack; 3251-a second briquette; 326-a second elastic member; 4-a limiting mechanism; 41-an extension rod; 42-a sensing plate; 43-an adjustment assembly; 431-a second mount; 432-screw; 433-worm gear; 434-a worm; 435-a handle; 5-an auxiliary control mechanism; 51-a limiting assembly; 511-mount; 512-clamping blocks; 5121-oblique guide slot; 513-a third elastic member; 514-a clamping groove; 52-a control assembly; 521-mounting plates; 522-fourth elastic member; 523-cardboard; 53-pushing assembly; 531-a connecting frame; 532—push rack; 5321-a stopper; 533-fifth elastic member; 54-reset component; 541-a second linear drive; 542-push plate; 543-extension plate; 6-diode.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1 and 2: a kind of fast recovery diode back thins the processing equipment, including frame 1, grinding device 2 and fixing device 3; two driving rollers 11 are rotatably arranged on the frame 1, and a rotary driver 12 for driving one of the driving rollers 11 to rotate is arranged on the frame 1; the driving rollers 11 are provided with adhesive tapes 13, and two sides of each adhesive tape 13 are respectively connected with the two driving rollers 11 in a bridging way; the grinding device 2 comprises a first linear drive 21, a first mounting frame 22 and a grinding assembly 23; the first linear actuator 21 is mounted on the frame 1; the first mounting frame 22 is connected with the driving end of the first linear driver 21; a grinding assembly 23 is provided on the first mounting frame 22 and is used for grinding the diode 6; the fixing device 3 comprises a supporting table 31 and a pressing assembly; the supporting table 31 is arranged on the frame 1 and is positioned below the adhesive tape 13; the pressing assembly is provided on the frame 1 and it is used to press the adhesive tape 13 against the support table 31.
According to the invention, the function of avoiding offset of the adhesive film in the process of grinding the diode 6 is realized through the frame 1, the grinding device 2 and the fixing device 3, the effect of efficiently processing the diode 6 while stabilizing and fixing the diode 6 can be achieved through the arrangement of the adhesive tape 13 and the driving roller 11, and the problem of uneven polishing thickness caused by offset of the adhesive film in the processing process is solved. The grinding assembly 23 is well known in the art and is not described in detail; the rotary driver 12 is preferably a servo motor, the first linear driver 21 is preferably a linear cylinder or a linear motor, and the rotary driver 12, the first linear driver 21 and the grinding assembly 23 are electrically connected with a controller; the two sides of the adhesive tape 13 are respectively an adhesive surface and a wear-resistant surface with adhesiveness, when in processing, an operator firstly stacks the diodes 6 on the adhesive tape 13 in sequence through a manipulator, the diodes 6 are adhered and fixed through the adhesive surface of the adhesive tape 13, then a controller sends a signal to the rotary driver 12, the rotary driver 12 drives the driving roller 11 to rotate after receiving the signal, the driving roller 11 drives the adhesive tape 13 to rotate, then the diodes 6 are moved to the grinding component 23, then the controller sends the signal to the first linear driver 21, the first linear driver 21 drives the first mounting frame 22 to move downwards after receiving the signal, simultaneously presses the adhesive tape 13 to the supporting table 31 through the pressing component, the diodes 6 are fixed through the supporting table 31 and the adhesive tape 13, the first mounting frame 22 drives the grinding component 23 to move downwards, then the diodes 6 are ground through the grinding component 23, after the processing is completed, the first linear driver 21 controls the first mounting frame 22 and the grinding component 23 to reset, and then the next group of diodes 6 are thinned through the steps.
Referring to fig. 2 and 3: the compressing assembly includes a first bracket 321, a second bracket 322, and a first elastic member 323; the first bracket 321 is mounted on the frame 1; the first support 321 is provided with a first guide ring, and one end of the first guide ring, which is far away from the first support 321, is provided with a first limiting ring 3212; the second bracket 322 is in sliding fit with the first guide ring, a first pressing block 3221 is arranged on the second bracket 322, and the second bracket 322 is connected with the first pressing block 3221 through a rod piece; both ends of the first elastic member 323 are respectively connected with the first bracket 321 and the second bracket 322; in an operating state, when the first linear driver 21 drives the first mounting frame 22 to move downwards, the first mounting frame 22 contacts with the second bracket 322 to push the second bracket 322 to move downwards.
As a first embodiment of the pressing assembly, the present invention realizes the function of pressing the adhesive tape 13 on the support table 31 through the first bracket 321, the second bracket 322, the first pressing block 3221 and the first elastic member 323, automatically drives the first pressing block 3221 to press down when the first mounting frame 22 moves down, and automatically controls the first pressing block 3221 to reset after the first mounting frame 22 resets through the arrangement of the first elastic member 323. During processing, an operator firstly stacks the diodes 6 on the adhesive tape 13 according to the sequence through a manipulator, the diodes 6 are adhered and fixed through the adhesive surface of the adhesive tape 13, then a controller sends a signal to the rotary driver 12, the rotary driver 12 drives the driving roller 11 to rotate after receiving the signal, the driving roller 11 drives the adhesive tape 13 to rotate, then the diodes 6 are moved to the grinding assembly 23, then the controller sends the signal to the first linear driver 21, the first linear driver 21 drives the first mounting frame 22 to move downwards after receiving the signal, the first mounting frame 22 is contacted with the second mounting frame 322, the elastic force of the first elastic piece 323 is overcome to push the second mounting frame 322 and the first pressing block 3221 to move downwards, the adhesive film is pressed on the supporting table 31 through the first pressing block 3221, the diode 6 is fixed through the supporting table 31 and the adhesive tape 13, the first mounting frame 22 drives the grinding assembly 23 to move downwards, and then the diode 6 is processed through the grinding assembly 23. After the processing is completed, the first linear driver 21 controls the first mounting frame 22 and the grinding assembly 23 to reset, and the second bracket 322 is reset under the elastic force of the first elastic piece 323 after losing the extrusion acting force.
Referring to fig. 1: the adhesive tape 13 is provided with a wear-resistant portion 131; in the operating state, when the pressing assembly is operated, the pressing assembly presses the abrasion-resistant portion 131 of the adhesive tape 13 against the support table 31.
The present invention achieves the effect of improving the service life of the adhesive tape 13 through the abrasion-resistant portion 131, while avoiding the situation that the adhesive tape 13 is pulled under the adhesive action when the first pressing block 3221 is reset. The wear-resisting part 131 of the sticking belt 13 is preferably made of rubber, and the wear-resisting part 131 of the rubber layer is arranged on the sticking belt 13, so that the friction force between the pressing block and the sticking belt 13 can be improved, the sticking belt 13 can be protected, the sticking belt 13 is prevented from being pulled when the first pressing block 3221 is reset, the sticking belt 13 is pulled up, and the sticking belt 13 is damaged.
Referring to fig. 1 and 4: the frame 1 is provided with a limiting mechanism 4, and the limiting mechanism 4 comprises an extension rod 41, an induction plate 42 and an adjusting component 43; the extension rod 41 is provided on the first mounting frame 22; the sensing plate 42 is arranged on the frame 1, and a pressure sensor for sensing the pressure applied to the sensing plate 42 is arranged on the sensing plate 42; an adjustment assembly 43 is provided on the housing 1 and is used to adjust the position of the sensing plate 42.
The present invention achieves the function of precisely controlling the grinding depth of the grinding assembly 23 by the extension bar 41, the sensing plate 42 and the adjustment assembly 43. The surface of the sensing plate 42 is polished, so that the surface flatness of the controller is precisely controlled; during processing, the adhesive tape 13 is controlled to rotate through the rotary driver 12, the adhesive tape 13 drives the diode 6 to move to the grinding component 23, then the abrasion-resistant part 131 of the adhesive tape 13 is pressed on the supporting table 31 through the pressing component, then the grinding component 23 is controlled to move downwards through the first linear driver 21, the grinding component 23 grinds the diode 6, along with the increase of the grinding depth, the extension rod 41 on the first mounting frame 22 is in contact with the sensing plate 42, after the pressure sensor on the sensing plate 42 senses the pressure, a feedback signal is given to the controller, the controller stops driving of the first linear driver 21 after receiving the signal, and then the grinding depth is controlled, the upper surface of the sensing plate 42 is subjected to fine processing, the effect of measuring the tool is achieved, and when the grinding depth is adjusted, the height of the sensing plate 42 is adjusted through the adjusting component 43, and the automatic processing threshold value is controlled.
Referring to fig. 4 and 5: the adjustment assembly 43 includes a second mount 431, a screw 432, a worm gear 433, a worm 434, and a handle 435; the second mounting frame 431 is slidably mounted on the frame 1, and the sensing plate 42 is mounted on the second mounting frame 431; the screw 432 is rotatably mounted on the second mounting frame 431 and is in threaded connection with the frame 1; the worm 434 is rotatably mounted on the second mount 431; the worm wheel 433 is sleeved on the screw 432, and the worm wheel 433 is in meshed connection with the worm 434; the handle 435 is sleeved on the worm 434.
The invention realizes the function of adjusting the height of the sensing plate 42 through the second mounting frame 431, the screw 432, the worm wheel 433, the worm 434 and the handle 435. When adjusting the grinding depth, the operator holds handle 435, rotates worm 434 through handle 435, and worm 434 drives the worm wheel 433 rotation of being connected rather than the transmission, and worm wheel 433 drives screw 432 rotation, and screw 432 and frame 1 threaded connection, the rotation of screw 432 can drive second mounting bracket 431 and remove, and second mounting bracket 431 drives the sensor board 42 and removes, adjusts the height of sensor board 42, control automated machining's threshold. Through the setting of worm wheel 433 and worm 434, reach the speed reduction transmission, improve the effect of adjusting the precision, simultaneously through the auto-lock nature of worm wheel 433, worm 434, can avoid second mounting bracket 431 to slide by oneself under gravity or other exogenic actions, and then reach the effect that avoids leading to the increase of response precision error.
Referring to fig. 6-8: the compression assembly includes a third bracket 324, a fourth bracket 325, and a second elastic member 326; the third bracket 324 is mounted on the frame 1; the third bracket 324 is provided with a second guide rod 3241, and one end of the second guide rod 3241, which is far away from the third bracket 324, is provided with a second limiting ring 3242; the fourth bracket 325 is in sliding fit with the second guide rod 3241, a second pressing block 3251 is arranged on the fourth bracket 325, and the fourth bracket 325 is connected with the second pressing block 3251 through a rod piece; two ends of the second elastic piece 326 are respectively connected with the fourth bracket 325 and the second limiting ring 3242; an auxiliary control mechanism 5 is arranged on the frame 1, and the auxiliary control mechanism 5 comprises a limiting component 51 and a control component 52; the restriction assembly 51 is provided on the third bracket 324 and serves to restrict the fourth bracket 325 from moving; the control assembly 52 is disposed on the third bracket 324; in the working state, when the first mounting frame 22 moves down, the first mounting frame 22 drives the control component 52, the control component 52 releases the movement restriction of the restriction component 51 to the fourth bracket 325, the fourth bracket 325 moves down under the elastic force of the second elastic member 326, the fourth bracket 325 drives the second pressing block 3251 to move, and the second pressing block 3251 presses the adhesive tape 13 on the supporting table 31.
As the second embodiment of the pressing assembly, the present invention realizes the function of pressing the adhesive tape 13 on the support table 31 through the third bracket 324, the fourth bracket 325, the second pressing block 3251 and the second elastic member 326, and achieves the effect of rapidly controlling the pressing of the fourth bracket 325 after the first mounting bracket 22 moves down to the designated range through the arrangement of the restriction assembly 51 and the control assembly 52, and the effect of stabilizing the pressing force of the second pressing block 3251 through the arrangement of the second elastic member 326. When the first linear driver 21 drives the first mounting frame 22 and the grinding assembly 23 to move downwards, the first mounting frame 22 drives the control assembly 52, the control assembly 52 releases the movement restriction of the restriction assembly 51 on the fourth support 325, the fourth support 325 moves downwards under the elastic action of the second elastic element 326, the fourth support 325 drives the second pressing block 3251 to move, and the second pressing block 3251 presses the adhesive tape 13 on the supporting table 31.
Referring to fig. 6-9: the restriction assembly 51 includes a mounting base 511, a clamping block 512 and a third elastic member 513; the mounting base 511 is mounted on the third bracket 324; the clamping block 512 is slidably mounted on the mounting seat 511; the fourth bracket 325 is provided with a clamping groove 514 matched with the clamping block 512; both ends of the third elastic member 513 are respectively connected to the mounting base 511 and the clamping block 512.
The present invention realizes the function of restricting the movement of the fourth bracket 325 by the mounting base 511, the clamping block 512, the clamping groove 514 and the third elastic member 513. When the first linear driver 21 drives the first mounting frame 22 and the grinding assembly 23 to move downwards, the first mounting frame 22 drives the control assembly 52, the control assembly 52 overcomes the elastic force of the third elastic member 513 to drive the clamping block 512 to move away from the clamping groove 514, after the clamping block 512 is separated from the clamping groove 514, the movement restriction of the restriction assembly 51 on the fourth support 325 is released, the fourth support 325 moves downwards under the elastic force of the second elastic member 326, the fourth support 325 drives the second pressing block 3251 to move, and the second pressing block 3251 presses the adhesive tape 13 on the supporting table 31.
Referring to fig. 6-9: the control assembly 52 includes a mounting plate 521, a fourth spring 522, and a catch plate 523; both ends of the fourth elastic member 522 are connected to the mounting plate 521 and the mounting base 511, respectively; the clamping plate 523 is arranged on the mounting plate 521, and the clamping plate 523 is in sliding fit with the mounting seat 511; the clamping block 512 is provided with an inclined guide groove 5121; the first mounting frame 22 is provided with a pushing assembly 53 for pushing the mounting plate 521 downward in the vertical direction; the third bracket 324 is provided with a reset component 54 for controlling the reset of the fourth bracket 325; in the working state, when the first linear driver 21 drives the first mounting frame 22 to move downwards, the pushing assembly 53 contacts with the mounting plate 521 to drive the mounting plate 521 and the clamping plate 523 to move downwards against the elastic force of the fourth elastic member 522, and the clamping plate 523 contacts with the inclined guide groove 5121 of the clamping block 512 to press the clamping block 512 to drive the clamping block 512 to move towards a direction away from the clamping groove 514.
The present invention realizes the function of controlling the movement of the clamping block 512 through the mounting plate 521, the fourth elastic member 522 and the clamping plate 523. When the first linear driver 21 drives the first mounting frame 22 and the grinding assembly 23 to move downwards, the pushing assembly 53 contacts with the mounting plate 521, the mounting plate 521 and the clamping plate 523 are driven to move downwards by overcoming the elastic force of the fourth elastic member 522, the clamping plate 523 contacts with the inclined guide groove 5121 of the clamping block 512, the clamping block 512 is extruded to drive the clamping block 512 to move in the direction away from the clamping groove 514, after the clamping block 512 is separated from the clamping groove 514, the movement restriction of the fourth bracket 325 by the limiting assembly 51 is released, the fourth bracket 325 moves downwards under the elastic force of the second elastic member 326, the fourth bracket 325 drives the second pressing block 3251 to move, and the second pressing block 3251 presses the adhesive tape 13 on the supporting table 31. After the machining is completed, the first linear actuator 21 controls the first mounting frame 22 to reset, and simultaneously controls the fourth bracket 325 to reset by the reset component 54 against the elastic force of the second elastic member 326, and after the fourth bracket 325 is reset, the limiting component 51 again fixes the fourth bracket 325.
Referring to fig. 6, 7 and 10: the pushing assembly 53 includes a connection frame 531, a pushing frame 532, and a fifth elastic member 533; the connection frame 531 is mounted on the first mounting frame 22; the pushing frame 532 is slidably mounted on the connecting frame 531, and a limiting block 5321 is arranged on the pushing frame 532; both ends of the fifth elastic member 533 are connected to the push frame 532 and the connection frame 531, respectively, and when the push frame 532 is not in contact with the mounting plate 521, the stopper 5321 is tightly fitted to the connection frame 531 under the elastic force of the fifth elastic member 533.
The present invention realizes the function of pushing the mounting plate 521 through the connection frame 531, the pushing frame 532 and the fifth elastic member 533, thereby achieving the effect of driving the control unit 52 and releasing the restriction of the movement of the fourth bracket 325 by the restriction unit 51 through the control unit 52. The fifth elastic member 533 has a substantially larger elastic coefficient than the fourth elastic member 522; when the first linear driver 21 drives the first mounting frame 22 and the grinding assembly 23 to move downwards, the first mounting frame 22 drives the connecting frame 531 to move, the connecting frame 531 pushes the pushing frame 532 to move through the fifth elastic member 533, after the pushing frame 532 contacts with the mounting plate 521, the mounting plate 521 and the clamping plate 523 are driven to move downwards by overcoming the elastic force of the fourth elastic member 522, the clamping plate 512 is extruded after the clamping plate 523 contacts with the inclined guide groove 5121 of the clamping plate 512, the clamping block 512 is driven to move in the direction away from the clamping groove 514, after the clamping block 512 is separated from the clamping groove 514, the movement restriction of the limiting assembly 51 on the fourth bracket 325 is released, the fourth bracket 325 moves downwards under the elastic force of the second elastic member 326, the fourth bracket 325 drives the second pressing block 3251 to move, and the second pressing block 3251 presses the adhesive tape 13 on the supporting table 31. By the elastic force of the fifth elastic member 533, the pushing frame 532 still pushes the mounting plate 521 under the elastic force of the fifth elastic member 533 for a period of time when the first mounting frame 22 begins to return, until the pushing frame 532 is completely separated from the mounting plate 521, and after the return assembly 54 controls the fourth bracket 325 to return, the limiting assembly 51 can not limit the movement of the fourth bracket 325.
Referring to fig. 6-8: the reset assembly 54 includes a second linear drive 541, a push plate 542, and an extension plate 543; the second linear actuator 541 is mounted on the third bracket 324; the push plate 542 is connected to the driving end of the second linear actuator 541; the extension plate 543 is connected to the fourth bracket 325 and is located directly above the push plate 542.
The present invention realizes the function of controlling the reset of the fourth holder 325 through the second linear driver 541, the push plate 542, and the extension plate 543. The second linear driver 541 is preferably a linear cylinder, and the second linear driver 541 is electrically connected to the controller; after finishing processing, the first linear driver 21 controls the first mounting frame 22 to reset, the first mounting frame 22 drives the connecting frame 531 and the pushing frame 532 to move, after the pushing frame 532 is separated from the mounting plate 521, the controller sends a signal to the second linear driver 541, the second linear driver 541 receives the signal and drives the pushing plate 542 to move upwards, the pushing plate 542 pushes the extending plate 543 to move, and then the extending plate 543 drives the fourth bracket 325 to move, after the clamping groove 514 of the fourth bracket 325 is aligned with the clamping block 512, the clamping block 512 is clamped into the clamping groove 514 under the elastic action of the third elastic piece 513, and further the movement of the fourth bracket 325 is limited. In this process, the second linear actuator 541 controls the reset of the push plate 542.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of the invention should be assessed as that of the appended claims.
Claims (7)
1. The fast recovery diode back thinning treatment device is characterized by comprising a frame (1), a grinding device (2) and a fixing device (3);
Two driving rollers (11) are rotatably arranged on the frame (1), and a rotary driver (12) for driving one of the driving rollers (11) to rotate is arranged on the frame (1);
The driving rollers (11) are provided with adhesive tapes (13), and two sides of each adhesive tape (13) are respectively connected with the two driving rollers (11) in a bridging way;
The grinding device (2) comprises a first linear driver (21), a first mounting frame (22) and a grinding assembly (23);
the first linear driver (21) is arranged on the frame (1);
The first mounting frame (22) is connected with the driving end of the first linear driver (21);
a grinding assembly (23) is arranged on the first mounting frame (22) and is used for grinding the diode (6);
The fixing device (3) comprises a supporting table (31) and a pressing assembly;
the supporting table (31) is arranged on the frame (1) and is positioned below the adhesive tape (13);
The pressing component is arranged on the frame (1) and is used for pressing the adhesive tape (13) on the supporting table (31); the adhesive tape (13) is provided with a wear-resistant part (131);
In the working state, when the pressing component works, the pressing component presses the wear-resistant part (131) of the adhesive tape (13) on the supporting table (31);
a limiting mechanism (4) is arranged on the frame (1), and the limiting mechanism (4) comprises an extension rod (41), an induction plate (42) and an adjusting component (43);
the extension rod (41) is arranged on the first mounting frame (22);
The sensing plate (42) is arranged on the frame (1), and a pressure sensor for sensing the pressure applied to the sensing plate (42) is arranged on the sensing plate;
an adjusting assembly (43) is arranged on the frame (1) and is used for adjusting the position of the induction plate (42);
The adjusting assembly (43) comprises a second mounting frame (431), a screw (432), a worm wheel (433), a worm (434) and a handle (435);
A second mounting frame (431) is slidably mounted on the frame (1), and the induction plate (42) is mounted on the second mounting frame (431);
The screw (432) is rotatably arranged on the second mounting frame (431) and is in threaded connection with the frame (1);
The worm (434) is rotatably arranged on the second mounting frame (431);
The worm wheel (433) is sleeved on the screw rod (432), and the worm wheel (433) is meshed with the worm (434);
The handle (435) is sleeved on the worm (434).
2. A fast recovery diode backside thinning apparatus in accordance with claim 1, wherein the hold-down assembly comprises a first bracket (321), a second bracket (322), and a first elastic member (323);
The first bracket (321) is arranged on the frame (1);
A first guide ring is arranged on the first bracket (321), and a first limiting ring (3212) is arranged at one end of the first guide ring, which is far away from the first bracket (321);
The second bracket (322) is in sliding fit with the first guide ring, a first pressing block (3221) is arranged on the second bracket (322), and the second bracket (322) is connected with the first pressing block (3221) through a rod piece;
Both ends of the first elastic piece (323) are respectively connected with the first bracket (321) and the second bracket (322);
In the working state, when the first linear driver (21) drives the first mounting frame (22) to move downwards, the first mounting frame (22) is contacted with the second bracket (322) to push the second bracket (322) to move downwards.
3. A fast recovery diode backside thinning apparatus in accordance with claim 1, wherein the hold down assembly comprises a third bracket (324), a fourth bracket (325) and a second elastic member (326);
the third bracket (324) is arranged on the frame (1);
A second guide rod (3241) is arranged on the third bracket (324), and a second limiting ring (3242) is arranged at one end, far away from the third bracket (324), of the second guide rod (3241);
The fourth bracket (325) is in sliding fit with the second guide rod (3241), a second pressing block (3251) is arranged on the fourth bracket (325), and the fourth bracket (325) is connected with the second pressing block (3251) through a rod piece;
two ends of the second elastic piece (326) are respectively connected with the fourth bracket (325) and the second limiting ring (3242);
an auxiliary control mechanism (5) is arranged on the frame (1), and the auxiliary control mechanism (5) comprises a limiting component (51) and a control component (52);
A limiting assembly (51) is provided on the third bracket (324) and is used for limiting the movement of the fourth bracket (325);
The control assembly (52) is arranged on the third bracket (324);
Under the operating condition, when the first mounting frame (22) moves downwards, the first mounting frame (22) drives the control component (52), the control component (52) releases the movement restriction of the restriction component (51) to the fourth support (325), the fourth support (325) moves downwards under the action of the elastic force of the second elastic piece (326), the fourth support (325) drives the second pressing block (3251) to move, and the second pressing block (3251) presses the adhesive tape (13) on the supporting table (31).
4. A fast recovery diode reverse side thinning processing apparatus in accordance with claim 3 wherein the limiting assembly (51) comprises a mounting base (511), a latch (512) and a third resilient member (513);
the mounting seat (511) is mounted on the third bracket (324);
the clamping block (512) is slidably arranged on the mounting seat (511);
A clamping groove (514) matched with the clamping block (512) is formed in the fourth bracket (325);
both ends of the third elastic piece (513) are respectively connected with the mounting seat (511) and the clamping block (512).
5. A fast recovery diode backside thinning apparatus in accordance with claim 3, wherein the control assembly (52) comprises a mounting plate (521), a fourth elastic member (522), and a clamping plate (523);
both ends of the fourth elastic piece (522) are respectively connected with the mounting plate (521) and the mounting seat (511);
the clamping plate (523) is arranged on the mounting plate (521), and the clamping plate (523) is in sliding fit with the mounting seat (511);
The clamping block (512) is provided with an inclined guide groove (5121);
A pushing component (53) for pushing the mounting plate (521) to move downwards along the vertical direction is arranged on the first mounting frame (22);
A reset component (54) for controlling the reset of the fourth bracket (325) is arranged on the third bracket (324);
Under the operating condition, when the first linear driver (21) drives the first mounting frame (22) to move downwards, after the pushing component (53) is contacted with the mounting plate (521), the mounting plate (521) and the clamping plate (523) are driven to move downwards by overcoming the elastic force of the fourth elastic piece (522), the clamping plate (523) is contacted with the inclined guide groove (5121) of the clamping block (512), then the clamping block (512) is extruded, and the clamping block (512) is driven to move in the direction away from the clamping groove (514).
6. A fast recovery diode back surface thinning processing apparatus in accordance with claim 5 wherein the push assembly (53) comprises a connection frame (531), a push frame (532) and a fifth elastic member (533);
the connecting frame (531) is arranged on the first mounting frame (22);
The pushing frame (532) is slidably arranged on the connecting frame (531), and a limiting block (5321) is arranged on the pushing frame (532);
Both ends of the fifth elastic piece (533) are respectively connected with the pushing frame (532) and the connecting frame (531), and when the pushing frame (532) is not contacted with the mounting plate (521), the limiting block (5321) is in tight fit with the connecting frame (531) under the elastic action of the fifth elastic piece (533).
7. A fast recovery diode backside thinning apparatus in accordance with claim 5, wherein the reset assembly (54) comprises a second linear driver (541), a push plate (542), and an extension plate (543);
a second linear actuator (541) mounted on the third bracket (324);
The push plate (542) is connected with the driving end of the second linear driver (541);
the extension plate (543) is connected to the fourth holder (325) and is located directly above the push plate (542).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410353452.1A CN117943921B (en) | 2024-03-27 | 2024-03-27 | A fast recovery diode back thinning processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410353452.1A CN117943921B (en) | 2024-03-27 | 2024-03-27 | A fast recovery diode back thinning processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117943921A CN117943921A (en) | 2024-04-30 |
| CN117943921B true CN117943921B (en) | 2024-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410353452.1A Active CN117943921B (en) | 2024-03-27 | 2024-03-27 | A fast recovery diode back thinning processing equipment |
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| GB277464A (en) * | 1926-07-20 | 1927-09-22 | William Edward Martin | Machine for grinding the surface of metal sheets |
| CN207840973U (en) * | 2018-02-06 | 2018-09-11 | 名辉家具（珠海）有限公司 | A kind of long belt grinding system of the sectional furniture timber of concentrated dust-removing |
| CN109807707A (en) * | 2019-04-10 | 2019-05-28 | 易高家居有限公司 | A kind of Home Fashion & Design Shanghai decorative panel grinding device |
| CN211136656U (en) * | 2019-12-25 | 2020-07-31 | 肇庆豪发铝材科技有限公司 | Frosting device is used in aluminium alloy production |
| CN211992139U (en) * | 2020-05-03 | 2020-11-24 | 保定众力达保温材料制造有限公司 | Surface grinding device that EPS cystosepiment was used |
| CN212218164U (en) * | 2020-04-14 | 2020-12-25 | 深圳市易天自动化设备股份有限公司 | Glass grinds and prevents centring device |
| CN114055298A (en) * | 2021-11-19 | 2022-02-18 | 深圳西可实业有限公司 | Grinding mechanism for full-production-line type operation without shutdown in processing |
| CN217291644U (en) * | 2021-12-10 | 2022-08-26 | 杭州高达交通设施工程有限公司 | Processing equipment for traffic signboard |
| CN116587163A (en) * | 2023-06-01 | 2023-08-15 | 宿迁菲莱特电子制品有限公司 | Positioning and conveying device for magnetic core machining and application method of positioning and conveying device |
| CN219521629U (en) * | 2022-12-20 | 2023-08-15 | 江苏新恒鼎装备制造有限公司 | Crank shaft and crank polishing device |
-
2024
- 2024-03-27 CN CN202410353452.1A patent/CN117943921B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB277464A (en) * | 1926-07-20 | 1927-09-22 | William Edward Martin | Machine for grinding the surface of metal sheets |
| CN207840973U (en) * | 2018-02-06 | 2018-09-11 | 名辉家具（珠海）有限公司 | A kind of long belt grinding system of the sectional furniture timber of concentrated dust-removing |
| CN109807707A (en) * | 2019-04-10 | 2019-05-28 | 易高家居有限公司 | A kind of Home Fashion & Design Shanghai decorative panel grinding device |
| CN211136656U (en) * | 2019-12-25 | 2020-07-31 | 肇庆豪发铝材科技有限公司 | Frosting device is used in aluminium alloy production |
| CN212218164U (en) * | 2020-04-14 | 2020-12-25 | 深圳市易天自动化设备股份有限公司 | Glass grinds and prevents centring device |
| CN211992139U (en) * | 2020-05-03 | 2020-11-24 | 保定众力达保温材料制造有限公司 | Surface grinding device that EPS cystosepiment was used |
| CN114055298A (en) * | 2021-11-19 | 2022-02-18 | 深圳西可实业有限公司 | Grinding mechanism for full-production-line type operation without shutdown in processing |
| CN217291644U (en) * | 2021-12-10 | 2022-08-26 | 杭州高达交通设施工程有限公司 | Processing equipment for traffic signboard |
| CN219521629U (en) * | 2022-12-20 | 2023-08-15 | 江苏新恒鼎装备制造有限公司 | Crank shaft and crank polishing device |
| CN116587163A (en) * | 2023-06-01 | 2023-08-15 | 宿迁菲莱特电子制品有限公司 | Positioning and conveying device for magnetic core machining and application method of positioning and conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117943921A (en) | 2024-04-30 |
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