CN117816589A - Chip detection and sorting equipment and method - Google Patents
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- CN117816589A CN117816589A CN202410014112.6A CN202410014112A CN117816589A CN 117816589 A CN117816589 A CN 117816589A CN 202410014112 A CN202410014112 A CN 202410014112A CN 117816589 A CN117816589 A CN 117816589A
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- 238000001514 detection method Methods 0.000 title claims abstract description 79
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- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
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Abstract
Description
技术领域Technical Field
本发明涉及芯片检测技术领域,尤其涉及一种芯片检测分选设备及方法。The present invention relates to the field of chip detection technology, and in particular to a chip detection and sorting device and method.
背景技术Background technique
随着半导体行业的飞速发展,半导体芯片的生产逐渐向自动化、标准化的方向发展。在芯片生产过程中,外观检测作为重要的一环,主要用以检测芯片表面有无瑕疵,以为芯片后续生产提供参考。检测时,将装载有多个芯片的料盘送入到检测设备,检测设备对料盘上的多个芯片进行同步检测,然后再将料盘上的不合格品剔除出来。但由于芯片是以料盘作为装载载体,芯片朝向料盘的一侧因受料盘的遮挡,难以直接进行外观检测。此外,现有的检测设备各机构间配合较差,导致整体的检测效率较低。With the rapid development of the semiconductor industry, the production of semiconductor chips is gradually moving towards automation and standardization. In the chip production process, appearance inspection is an important part, mainly used to detect whether there are defects on the chip surface, so as to provide a reference for the subsequent production of the chip. During the inspection, a tray loaded with multiple chips is sent to the inspection equipment, and the inspection equipment performs synchronous inspections on the multiple chips on the tray, and then removes the unqualified products on the tray. However, since the chip is loaded on the tray as a loading carrier, the side of the chip facing the tray is blocked by the tray, making it difficult to directly perform appearance inspection. In addition, the coordination between the various mechanisms of the existing inspection equipment is poor, resulting in low overall inspection efficiency.
发明内容Summary of the invention
为克服上述缺点,本发明的目的在于提供一种芯片检测分选设备及方法,在实现对芯片多面检测的同时,有效提高了检测效率。In order to overcome the above-mentioned shortcomings, the object of the present invention is to provide a chip detection and sorting device and method, which can effectively improve the detection efficiency while realizing multi-faceted detection of the chip.
为了达到以上目的,本发明采用的技术方案之一是:一种芯片检测分选设备,包括;In order to achieve the above objectives, one of the technical solutions adopted by the present invention is: a chip detection and sorting device, comprising:
料盘,其上设有若干用以放置芯片的芯片放置槽;A material tray, on which a plurality of chip placement slots for placing chips are provided;
输送装置,用以输送料盘,其包括平行布设的上料输送线组、下料输送线组;其中,上料输送线组包括平行布设的第一输送线、第二输送线,第一输送线用以输送未放置芯片的料盘,第二输送线用以输送放置有芯片的料盘;A conveying device for conveying a material tray, comprising a loading conveying line group and a unloading conveying line group arranged in parallel; wherein the loading conveying line group comprises a first conveying line and a second conveying line arranged in parallel, the first conveying line is used to convey a material tray without chips placed thereon, and the second conveying line is used to convey a material tray with chips placed thereon;
检测装置,包括分别布设在上料输送线组、下料输送线组上的第一视觉检测机构、第二视觉检测机构,The detection device includes a first visual detection mechanism and a second visual detection mechanism respectively arranged on the loading conveying line group and the unloading conveying line group.
翻面装置,包括能在上料输送线组、下料输送线组之间往复移动的翻面组件,翻面组件能将经第一视觉检测机构检测后的芯片进行翻面;The flipping device includes a flipping assembly that can reciprocate between the loading conveying line group and the unloading conveying line group, and the flipping assembly can flip the chip after being inspected by the first visual inspection mechanism;
分选装置,设置在下料输送线组上,用以对经第二视觉检测机构检测后的芯片进行分选。The sorting device is arranged on the unloading conveying line group and is used for sorting the chips after being inspected by the second visual inspection mechanism.
本发明的芯片检测分选设备的有益效果在于:The beneficial effects of the chip detection and sorting equipment of the present invention are:
1、在输送装置中,通过上料输送线组、下料输送线组的配合实现了对料盘的上、下料输送;在检测装置中,通过第一视觉检测机构的设置能对料盘中芯片未被遮挡的正面进行拍照检测,然后再通过翻面组件对芯片的翻面操作,使得芯片被遮挡的背面能翻转至外露出来;再通过第二视觉检测机构对外露出来的芯片背面进行拍照检测,进而在无需人工参与的前提下,实现了对芯片的多面检测;最后通过分选装置将次品或废品剔除出来。本发明通过输送装置、检测装置、翻面装置及分选装置的配合满足了对芯片多面检测的需求,有效提高了检测效率;1. In the conveying device, the upper and lower material conveying of the material tray is realized through the cooperation of the loading conveying line group and the unloading conveying line group; in the detection device, the first visual detection mechanism is set to take photos of the unobstructed front side of the chip in the material tray, and then the chip is turned over by the flipping assembly so that the obstructed back side of the chip can be flipped to be exposed; the exposed back side of the chip is then photographed and detected by the second visual detection mechanism, thereby realizing multi-sided detection of the chip without human intervention; finally, the defective or waste products are removed by the sorting device. The present invention meets the demand for multi-sided detection of chips through the cooperation of the conveying device, the detection device, the flipping device and the sorting device, and effectively improves the detection efficiency;
2、在上料输送线组中,设置第一输送线、第二输送线是为了配合翻面组件的翻面操作:当装有芯片的料盘与未装有芯片的料盘输送至翻面组件的工作范围内时,翻面组件首先将未装有芯片的料盘进行翻面,以使该料盘的芯片放置槽朝下;然后将该料盘放置到装有芯片的料盘上,以使两个料盘的芯片放置槽一一对应连通;再通过对两个料盘进行翻面操作,以使芯片转移至之前未装有芯片的料盘上,且此时芯片已完成翻面动作。通过两个料盘的配合,既能利用两个料盘叠放形成的封闭空间,对芯片进行限位,避免后续翻面过程中芯片的滑落;又能将翻面后的芯片直接移载至另一料盘内,实现空料盘(未放置芯片的料盘)对翻面后的芯片的同步装载,以利于后续对翻面后的芯片进行外观检测。2. In the feeding conveyor line group, the first conveyor line and the second conveyor line are set to cooperate with the flipping operation of the flipping component: when the tray with chips and the tray without chips are conveyed to the working range of the flipping component, the flipping component first flips the tray without chips so that the chip placement slot of the tray faces downward; then the tray is placed on the tray with chips so that the chip placement slots of the two trays are connected one by one; then the two trays are flipped so that the chips are transferred to the tray without chips, and the chips have completed the flipping action. Through the cooperation of the two trays, the closed space formed by the stacking of the two trays can be used to limit the chips to prevent the chips from slipping during the subsequent flipping process; and the flipped chips can be directly transferred to another tray to achieve the synchronous loading of the flipped chips by the empty tray (tray without chips), so as to facilitate the subsequent appearance inspection of the flipped chips.
进一步来说,第一输送线、第二输送线均包括用以承接料盘的输送机架,输送机架的一端设有拆叠机构,另一端设有供翻面装置取料的取料工位。取料工位上分别设有料盘顶升部、取料限位部,料盘顶升部用以将料盘顶升至离开输送机架;取料限位部用以限定料盘在取料工位上的位置。Furthermore, the first conveyor line and the second conveyor line both include a conveyor frame for receiving the material tray, one end of the conveyor frame is provided with a stacking mechanism, and the other end is provided with a material taking station for the turning device to take the material. The material taking station is provided with a material tray lifting part and a material taking limit part, respectively. The material tray lifting part is used to lift the material tray away from the conveyor frame; the material taking limit part is used to limit the position of the material tray on the material taking station.
在芯片生产过程中,为了提高效率,装载芯片的料盘通常采用堆叠的方式进行流转,因此,实际应用时,放置到第一输送线、第二输送线上均是多个堆叠的料盘,基于此,在输送机架上布设拆叠机构能对堆叠的料盘进行拆叠,以利于检测装置对每一个料盘进行视觉检测;而在取料工位上设置料盘顶升部能使料盘脱离输送机架的输送,再通过取料限位部的设置以对料盘的取料位置进行限定。In the chip production process, in order to improve efficiency, the trays loaded with chips are usually circulated in a stacked manner. Therefore, in actual application, multiple stacked trays are placed on the first conveyor line and the second conveyor line. Based on this, a destacking mechanism is arranged on the conveyor frame to destacking the stacked trays, so as to facilitate the detection device to perform visual inspection of each tray; and a tray lifting part is arranged on the material picking station to enable the tray to be separated from the conveyor frame, and then the material picking position of the tray is limited by the setting of the material picking limit part.
进一步来说,翻面组件包括升降驱动部、翻面驱动部及料盘夹持部,料盘夹持部用以夹持一个或两个料盘,且料盘夹持部能在翻面驱动部的作用下带动夹持的料盘翻转;翻面驱动部安装在升降驱动部上,并能在升降驱动部的作用下带动料盘夹持部上下抖动。Further, the flipping assembly includes a lifting drive unit, a flipping drive unit and a tray clamping unit. The tray clamping unit is used to clamp one or two trays, and the tray clamping unit can drive the clamped trays to flip under the action of the flipping drive unit; the flipping drive unit is installed on the lifting drive unit, and can drive the tray clamping unit to shake up and down under the action of the lifting drive unit.
通过料盘夹持部对一个或两个料盘的夹持,以利于两个料盘的叠放夹取(同时夹取两个料盘)或拆叠夹取(只夹取一个料盘);当料盘夹持部同时夹取住两个料盘时,通过翻面驱动部的驱动,能对两个料盘进行同步翻面,进而使得上方料盘内的芯片能在自重作用下进入到下方的料盘内,再配合升降驱动部驱动,带动料盘夹持部及两个料盘同步上下抖动,以使得芯片能在抖动作用下顺畅地进入到下方的料盘内,实现芯片翻面的目的。The tray clamping part clamps one or two trays, which facilitates the stacking and clamping of the two trays (clamping two trays at the same time) or the detaching and clamping (clamping only one tray); when the tray clamping part clamps the two trays at the same time, the two trays can be turned over synchronously through the driving of the turning-over driving part, so that the chips in the upper tray can enter the lower tray under the action of their own weight, and then cooperate with the driving of the lifting driving part to drive the tray clamping part and the two trays to shake up and down synchronously, so that the chips can smoothly enter the lower tray under the shaking action, thereby achieving the purpose of flipping the chips.
进一步来说,料盘夹持部包括与料盘形状匹配的夹持框,夹持框上均布有多个用以夹紧一个或两个料盘的夹紧件;夹紧件包括夹紧驱动件、夹紧块,夹紧块包括夹紧块本体、上止挡板、下止挡板,上止挡板、下止挡板分别位于夹紧块本体的上、下端面,用以限制料盘上、下端面的位置;夹紧块本体高度与两个料盘的叠加高度相匹配,且夹紧块本体能同时抵接在料盘相邻的两个侧面上。Further, the tray clamping portion includes a clamping frame matching the shape of the tray, and the clamping frame is evenly distributed with a plurality of clamping members for clamping one or two trays; the clamping members include a clamping drive member and a clamping block, and the clamping block includes a clamping block body, an upper stop plate, and a lower stop plate, and the upper stop plate and the lower stop plate are respectively located on the upper and lower end surfaces of the clamping block body, so as to limit the positions of the upper and lower end surfaces of the tray; the height of the clamping block body matches the stacking height of the two trays, and the clamping block body can simultaneously abut against two adjacent side surfaces of the tray.
将夹紧块本体高度与两个料盘的叠放高度相适配,再通过上止挡板、下止挡板的配合,能在夹紧块本体夹持两个料盘时,使得上止挡板、下止挡板能分别抵接在叠放的两个料盘的上、下端面上,进而对两个料盘的叠放高度进行限定,以避免后续翻转过程中,料盘在夹紧块本体上的滑移,保证芯片翻转的可靠性。而对于仅夹取单个料盘(该料盘上未放置芯片)的情况而言,上止挡板、下止挡板则能限定单个料盘在夹紧块本体上的滑移范围,避免单个料盘自夹紧块本体上的滑脱。The height of the clamping block body is matched with the stacking height of the two trays, and then through the cooperation of the upper stop plate and the lower stop plate, when the clamping block body clamps the two trays, the upper stop plate and the lower stop plate can respectively abut against the upper and lower end surfaces of the two stacked trays, thereby limiting the stacking height of the two trays to avoid the trays from slipping on the clamping block body during the subsequent flipping process, thereby ensuring the reliability of chip flipping. For the case of clamping only a single tray (no chip is placed on the tray), the upper stop plate and the lower stop plate can limit the sliding range of the single tray on the clamping block body to avoid the single tray from slipping off the clamping block body.
进一步来说,拆叠机构包括拆叠升降组件、料盘拆分组件、敲击组件,拆叠升降组件用以带动堆叠的料盘上升或下降;料盘拆分组件包括能插入到料盘上的拆分板,敲击组件包括相对设置在料盘两侧的敲击部,敲击部用以对插入有拆分板的料盘进行敲击,以使料盘发生抖动。Further, the unstacking mechanism includes a unstacking lifting assembly, a material tray splitting assembly, and a knocking assembly. The unstacking lifting assembly is used to drive the stacked material trays to rise or fall; the material tray splitting assembly includes a splitting plate that can be inserted into the material tray, and the knocking assembly includes a knocking part relatively arranged on both sides of the material tray, and the knocking part is used to knock the material tray with the splitting plate inserted therein to cause the material tray to shake.
通过拆叠升降组件带动料盘上下移动,以将任一料盘移动至料盘拆分组件的工作区域内,以实现对不同高度的料盘拆叠;然后通过料盘拆分组件的拆分板插入至料盘内,能对料盘进行限位,进而能将该料盘(即上层料盘)与其下方的料盘(即下层料盘)进行拆分;再通过敲击组件对上层料盘的敲击,使得勾连在上层料盘上的芯片能在振动力的作用下回落到下层料盘内,进而避免拆分时出现芯片损伤及芯片位置偏移的问题,保证拆叠动作的顺畅进行。The stacking lifting assembly is used to drive the material tray to move up and down, so as to move any material tray into the working area of the material tray splitting assembly, so as to realize the stacking of material trays at different heights; then, the splitting plate of the material tray splitting assembly is inserted into the material tray to limit the material tray, and then the material tray (i.e., the upper material tray) and the material tray below it (i.e., the lower material tray) can be split; and then the knocking assembly is used to knock the upper material tray, so that the chip connected to the upper material tray can fall back into the lower material tray under the action of the vibration force, thereby avoiding chip damage and chip position displacement during splitting, and ensuring smooth stacking action.
进一步来说,输送机架上布设有两组传送组件,每组传送组件上均设有能在拆叠机构、取料工位之间往复移动的推料组件;且两个推料组件沿料盘输送方向上错位设置,以分别推动不同的料盘。通过错位设置的两个推料组件能利用错位形成的时间差实现一个推料组件带动料盘向取料工位移动的同时,另一个推料组件回转至拆叠机构处等待下一个拆叠的料盘;以利于提高料盘整体的输送效率。Furthermore, two groups of conveying components are arranged on the conveyor frame, and each group of conveying components is provided with a pushing component that can reciprocate between the destacking mechanism and the material-retrieving station; and the two pushing components are staggered along the conveying direction of the material tray to push different material trays respectively. The two staggered pushing components can utilize the time difference formed by the staggering to realize that while one pushing component drives the material tray to move to the material-retrieving station, the other pushing component rotates to the destacking mechanism to wait for the next destacking material tray; so as to improve the overall conveying efficiency of the material tray.
进一步来说,推料组件包括推料基板,推料基板远离取料工位的一侧设有能升降移动的推杆,朝向加工工位的一侧设有能在止动驱动件作用下抵接到料盘上的止动板;当推杆处于最高点时,推杆能抵接在料盘上,当推杆处于最低点时,推杆位于料盘的下方。通过止动板与推杆配合以实现对料盘两侧的限位,进而保证料盘输送过程中的稳定性。Specifically, the pusher assembly includes a pusher base plate, a pusher rod that can be lifted and lowered is provided on the side of the pusher base plate away from the material taking station, and a stopper plate that can abut against the material tray under the action of a stopper driving member is provided on the side facing the processing station; when the pusher rod is at the highest point, the pusher rod can abut against the material tray, and when the pusher rod is at the lowest point, the pusher rod is located below the material tray. The stopper plate cooperates with the pusher rod to limit the positions of both sides of the material tray, thereby ensuring the stability of the material tray during transportation.
进一步来说,分选装置包括固定基座、分选升降板、调距机构、吸料机构,分选升降板滑动设置在固定基座的一侧,并能在第一驱动件的作用下升降移动;调距组件包括沿竖直方向滑动设置在分选升降板上的调距基板,调距基板沿水平方向上均布有多个调距载板,多个调距载板能在第二驱动件的作用下向相互靠近或远离的方向移动;吸料组件包括与调距载板一一对应设置的吸料部,每一吸料部均包括能独立升降移动的吸料杆。Further, the sorting device includes a fixed base, a sorting lifting plate, a distance adjusting mechanism, and a suction mechanism. The sorting lifting plate is slidably arranged on one side of the fixed base and can be lifted and lowered under the action of a first driving member; the distance adjusting component includes a distance adjusting substrate slidably arranged on the sorting lifting plate in a vertical direction, and the distance adjusting substrate is evenly distributed with multiple distance adjusting carriers in a horizontal direction. The multiple distance adjusting carriers can move in a direction close to or away from each other under the action of a second driving member; the suction component includes a suction part arranged one by one in correspondence with the distance adjusting carriers, and each suction part includes a suction rod that can be independently lifted and lowered.
将调距组件及吸料组件设置在分选升降板上,能利用分选升降板的升降移动带动调距组件及吸料组件进行整体的升降移动;在调距组件中,通过调距载板向相互靠近或相互远离的方向移动实现了相邻两个调距基板之间的间距变化,进而实现了吸料部之间的间距变化,以利于根据料盘上放置槽的间距调整吸料部之间的间距,使得吸料部能对准放置槽内的芯片;且在吸料部中,通过设置能独立升降的吸料杆,以利于根据放置槽内的芯片情况(合格或不合格)选择使用相应的吸料部,以实现对芯片的分选动作(即将不合格品吸取出来,而合格品仍留在放置槽内),分选灵活度更高。The distance adjusting component and the material suction component are arranged on the sorting lifting plate, and the lifting and lowering movement of the sorting lifting plate can be used to drive the distance adjusting component and the material suction component to perform overall lifting and lowering movement; in the distance adjusting component, the distance between two adjacent distance adjusting substrates is changed by moving the distance adjusting carrier plate towards or away from each other, thereby realizing the distance change between the material suction parts, so as to facilitate the adjustment of the distance between the material suction parts according to the distance of the placement slots on the material tray, so that the material suction parts can be aligned with the chips in the placement slots; and in the material suction part, by arranging a suction rod that can be lifted and lowered independently, it is convenient to select the corresponding material suction part according to the condition of the chip in the placement slot (qualified or unqualified), so as to realize the chip sorting action (i.e., suck out the unqualified products, while the qualified products remain in the placement slot), and the sorting flexibility is higher.
进一步来说,调距基板上布设有与调距载板一一对应设置的调距槽孔,任一相邻两个调距槽孔之间沿水平方向上的间距自上往下逐渐增大;且在同一高度上,任一相邻两个调距槽孔之间的水平间距均相同;调距载板包括载板本体,载板本体的上端部设有能沿对应的调距槽孔移动的移动件,移动件位于对应的调距槽孔内,其两端分别抵接在对应的调距槽孔的内侧壁上。Furthermore, the distance-adjusting substrate is provided with distance-adjusting slots which are arranged one-to-one with the distance-adjusting carriers, and the distance between any two adjacent distance-adjusting slots in the horizontal direction gradually increases from top to bottom; and at the same height, the horizontal distance between any two adjacent distance-adjusting slots is the same; the distance-adjusting carrier includes a carrier body, and the upper end of the carrier body is provided with a moving part which can move along the corresponding distance-adjusting slot, and the moving part is located in the corresponding distance-adjusting slot, and its two ends are respectively abutted against the inner side walls of the corresponding distance-adjusting slot.
通过对调距槽孔的限定使得多个调距槽孔能呈现出以中心轴对称布设的态势,且调距槽孔自靠近中心轴向远离中心轴的方向倾斜幅度逐渐增大。这是为了保证在调距载板沿调距槽孔移动的过程中,相邻两个调距载板之间的间距变化能保持相同,以适配料盘上均匀布设的芯片放置槽。再通过移动件在调距槽孔内的移动,以带动载板本体之间的间距变化。By limiting the distance adjustment slots, multiple distance adjustment slots can be arranged symmetrically with respect to the central axis, and the inclination of the distance adjustment slots gradually increases from the direction close to the central axis to the direction away from the central axis. This is to ensure that the distance change between two adjacent distance adjustment carriers can remain the same during the movement of the distance adjustment carrier along the distance adjustment slots, so as to adapt to the chip placement slots evenly arranged on the material tray. Then, the distance between the carrier bodies is driven to change by the movement of the moving parts in the distance adjustment slots.
需要注意的是,若在中心轴处也设置有调距槽孔时,该调距槽孔应呈竖向布设,以使沿该调距槽孔移动的调距载板始终沿竖向移动。It should be noted that if a distance-adjusting slot is also provided at the central axis, the distance-adjusting slot should be arranged vertically so that the distance-adjusting carrier plate moving along the distance-adjusting slot always moves vertically.
本发明采用的技术方案之二是:一种芯片检测分选方法,包括如下步骤:The second technical solution adopted by the present invention is: a chip detection and sorting method, comprising the following steps:
将装有芯片的料盘、未装芯片的料盘分别放置到上料输送线组的指定位置上;Place the trays with chips and the trays without chips at the designated positions of the loading conveyor line group respectively;
将装有芯片的料盘、未装有芯片的料盘向翻面装置的方向输送,且在输送过程中,第一视觉检测机构对装有芯片的料盘进行拍照检测;The trays with chips and the trays without chips are transported toward the flipping device, and during the transport process, the first visual inspection mechanism takes photos of the trays with chips for inspection;
翻面组件将未装有芯片的料盘与装有芯片的料盘倒置叠放后进行翻面,并使翻面后的芯片能转移至未装有芯片的料盘内;The flipping component stacks the tray without chips and the tray with chips upside down and then flips them over, so that the flipped chips can be transferred to the tray without chips;
翻面组件将装有翻面后芯片的料盘输送至下料输送组上,第二视觉检测机构对装有翻面后芯片的料盘进行拍照检测;The flipping assembly conveys the tray with the flipped chips to the unloading conveying group, and the second visual inspection mechanism takes photos of the tray with the flipped chips for inspection;
分选装置根据第一视觉检测机构与第二视觉检测机构的检测结果对芯片进行分拣。The sorting device sorts the chips according to the detection results of the first visual detection mechanism and the second visual detection mechanism.
本发明芯片检测分选方法的有益效果在于:The beneficial effects of the chip detection and sorting method of the present invention are:
通过两个料盘及翻面组件的配合实现了对芯片的翻面动作,再通过第一视觉检测机构、第二视觉检测机构分别对翻面前、翻面后的芯片进行视觉检测,以实现对芯片的多面检测;最后通过分选装置对芯片进行分选,以将检测合格与检测不合格的芯片分拣出来。The chip is flipped over by the cooperation of two material trays and a flipping assembly, and then the first visual inspection mechanism and the second visual inspection mechanism respectively perform visual inspection on the chip before and after flipping, so as to realize multi-sided inspection of the chip; finally, the chip is sorted by a sorting device to separate the qualified chips from the unqualified chips.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明实施例芯片检测分选设备的结构示意图;FIG1 is a schematic structural diagram of a chip detection and sorting device according to an embodiment of the present invention;
图2为本发明实施例机台上的结构示意图;FIG2 is a schematic diagram of the structure of a machine according to an embodiment of the present invention;
图3为本发明实施例料盘的结构示意图;FIG3 is a schematic structural diagram of a material tray according to an embodiment of the present invention;
图4为本发明实施例第二输送线上料端的结构示意图;4 is a schematic structural diagram of a feed end of a second conveyor line according to an embodiment of the present invention;
图5为图4中A部位的局部放大图;FIG5 is a partial enlarged view of the portion A in FIG4 ;
图6为本发明实施例第二输送线的结构示意图;FIG6 is a schematic structural diagram of a second conveyor line according to an embodiment of the present invention;
图7为本发明实施例推料组件的结构示意图;7 is a schematic structural diagram of a pusher assembly according to an embodiment of the present invention;
图8为本发明实施例翻面装置的结构示意图;FIG8 is a schematic structural diagram of a flipping device according to an embodiment of the present invention;
图9为本发明实施例取料工位的结构示意图;9 is a schematic structural diagram of a material taking station according to an embodiment of the present invention;
图10为本发明翻面组件的结构示意图;FIG10 is a schematic structural diagram of a flip assembly of the present invention;
图11为图10中B部位的局部放大图;FIG11 is a partial enlarged view of the portion B in FIG10 ;
图12为本发明夹紧件的结构示意图;FIG12 is a schematic structural diagram of a clamping member of the present invention;
图13为本发明检测装置的结构示意图;FIG13 is a schematic diagram of the structure of the detection device of the present invention;
图14为本发明分选装置的结构示意图;FIG14 is a schematic structural diagram of a sorting device according to the present invention;
图15为本发明调距载板的结构示意图。FIG. 15 is a schematic structural diagram of the distance-adjustable carrier plate of the present invention.
图中:In the figure:
1-料盘;11-芯片放置槽;12-手持抬边;13-限位插槽;1- material tray; 11- chip placement slot; 12- hand-held lifting edge; 13- limit slot;
2-输送装置;21-第一输送线;211-输送机架;212-角钢;22-第二输送线;23-合格品输送线;24-废品输送线;25-拆叠机构;251-拆叠升降组件;252-拆分板;253-敲击气缸;26-传送组件;27-推料组件;271-推料基板;272-推杆;273-止动驱动件;274-止动板;28-料盘顶升部;29-限位夹块;2- conveying device; 21- first conveying line; 211- conveying frame; 212- angle steel; 22- second conveying line; 23- qualified product conveying line; 24- reject conveying line; 25- unstacking mechanism; 251- unstacking lifting assembly; 252- splitting plate; 253- knocking cylinder; 26- conveying assembly; 27- pushing assembly; 271- pushing base plate; 272- pushing rod; 273- stopping driving member; 274- stopping plate; 28- tray lifting part; 29- limiting clamping block;
3-检测装置;31-第一视觉检测机构;32-第二视觉检测机构;33-3D检测机构;3-detection device; 31-first visual detection mechanism; 32-second visual detection mechanism; 33-3D detection mechanism;
4-翻面装置;41-升降驱动部;411-升降基板;412-第一直线模组;413-第二直线模组;414-抖动基座;42-翻面驱动部;421-翻转机架;422-检测传感器;423-检测板;43-料盘夹持部;431-夹持框;432-夹紧驱动件;433-夹紧块;4331-夹紧块本体;4332-上止挡板;4333-下止挡板;水平驱动部-44;4-turning device; 41-lifting drive unit; 411-lifting base plate; 412-first linear module; 413-second linear module; 414-shaking base; 42-turning drive unit; 421-turning frame; 422-detection sensor; 423-detection plate; 43-tray clamping unit; 431-clamping frame; 432-clamping drive member; 433-clamping block; 4331-clamping block body; 4332-upper stop plate; 4333-lower stop plate; horizontal drive unit-44;
5-分选装置;51-固定基座;52-分选升降板;53-第一驱动件;54-调距基板;541-调距槽孔;55-调距载板;56-第二驱动件;57-吸料杆;5-sorting device; 51-fixed base; 52-sorting lifting plate; 53-first driving member; 54-adjustable distance base plate; 541-adjustable distance slot hole; 55-adjustable distance carrier plate; 56-second driving member; 57-suction rod;
6-机台;61-防护罩。6-machine; 61-protective cover.
具体实施方式Detailed ways
下面结合附图对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.
实施例Example
参见附图1-2所示,本发明的一种芯片检测分选设备,包括料盘1、输送装置2、检测装置3、翻面装置4、分选装置5,其中,输送装置2用以输送料盘1,其包括平行布设的上料输送线组、下料输送线组。检测装置3包括分别布设在上料输送线组、下料输送线组上的第一视觉检测机构31、第二视觉检测机构32。翻面装置4包括能在上料输送线组、下料输送线组之间往复移动的翻面组件,翻面组件能将经第一视觉检测机构31检测后的芯片进行翻面。分选装置5设置在下料输送线组上,用以对经第二视觉检测机构32检测后的芯片进行分选。Referring to the accompanying drawings 1-2, a chip detection and sorting device of the present invention includes a material tray 1, a conveying device 2, a detection device 3, a flipping device 4, and a sorting device 5, wherein the conveying device 2 is used to convey the material tray 1, and includes a loading conveying line group and a unloading conveying line group arranged in parallel. The detection device 3 includes a first visual detection mechanism 31 and a second visual detection mechanism 32 respectively arranged on the loading conveying line group and the unloading conveying line group. The flipping device 4 includes a flipping assembly that can reciprocate between the loading conveying line group and the unloading conveying line group, and the flipping assembly can flip the chip after being detected by the first visual detection mechanism 31. The sorting device 5 is arranged on the unloading conveying line group, and is used to sort the chips after being detected by the second visual detection mechanism 32.
更进一步地,参见附图1所示,芯片检测分选设备包括机台6,输送装置2、检测装置3、翻面装置4及分选装置5均设置在机台6上,且机台6上还设有能罩设在输送装置2上的防护罩61。且防护罩61在输送装置2的一侧开设有与输送装置2连通的上下料口。Furthermore, referring to FIG. 1 , the chip detection and sorting equipment includes a machine platform 6, on which the conveying device 2, the detection device 3, the flipping device 4 and the sorting device 5 are all arranged, and the machine platform 6 is also provided with a protective cover 61 that can cover the conveying device 2. The protective cover 61 is provided with a loading and unloading port on one side of the conveying device 2 and is connected to the conveying device 2.
其中,参见附图2所示,上料输送线组包括平行布设的第一输送线21、第二输送线22,第一输送线21用以输送未放置芯片的料盘1,第二输送线22用以输送放置有芯片的料盘1。下料输送线组包括合格品输送线23及至少一个废品输送线24。示例性地,废品输送线24设置有两个,以利于分选装置的分拣操作。As shown in FIG. 2 , the loading conveyor line group includes a first conveyor line 21 and a second conveyor line 22 arranged in parallel, wherein the first conveyor line 21 is used to convey a tray 1 without chips, and the second conveyor line 22 is used to convey a tray 1 with chips. The unloading conveyor line group includes a qualified product conveyor line 23 and at least one defective product conveyor line 24. Exemplarily, two defective product conveyor lines 24 are provided to facilitate the sorting operation of the sorting device.
在实际应用时,为了提高效率,料盘1多是以堆叠的形式进行上料的。如图3所示,料盘1呈平板状,其上开设有若干呈矩形阵列排布的芯片放置槽11,芯片放置槽11的槽深与芯片的厚度相适配。且料盘1沿其长度方向的两侧分别设有手持抬边12,沿其宽度方向的两侧分别设有限位插槽13。当多个料盘1堆叠时,上一层料盘1的下端面能抵接在下一层料盘1的上端面上,以使下一层料盘1上的芯片放置槽11能处于封闭状态,进而在搬运堆叠料盘1的过程中,限制芯片自芯片放置槽11内的滑脱。In actual application, in order to improve efficiency, the trays 1 are mostly loaded in a stacked form. As shown in FIG3 , the tray 1 is in the shape of a flat plate, on which are provided a plurality of chip placement grooves 11 arranged in a rectangular array, and the groove depth of the chip placement grooves 11 is adapted to the thickness of the chip. The tray 1 is provided with hand-held lifting edges 12 on both sides along its length direction, and with limit slots 13 on both sides along its width direction. When multiple trays 1 are stacked, the lower end surface of the upper layer of the tray 1 can abut against the upper end surface of the lower layer of the tray 1, so that the chip placement grooves 11 on the lower layer of the tray 1 can be in a closed state, thereby limiting the slipping of the chips from the chip placement grooves 11 during the transportation of the stacked trays 1.
位于保证对每一料盘1上的芯片均能进行外观检测。在一些实施例中,第一输送线21、第二输送线22的上料端需配备用以拆分料盘的拆叠机构。具体的,参见附图4-5所示,第一输送线21、第二输送线22均包括用以承接料盘1的输送机架211,输送机架211的一端设有拆叠机构25,另一端设有供翻面装置4取料的取料工位。It is located to ensure that the appearance inspection of the chips on each tray 1 can be performed. In some embodiments, the loading ends of the first conveyor line 21 and the second conveyor line 22 need to be equipped with a destacking mechanism for splitting the trays. Specifically, referring to Figures 4-5, the first conveyor line 21 and the second conveyor line 22 both include a conveyor frame 211 for receiving the tray 1, and one end of the conveyor frame 211 is provided with a destacking mechanism 25, and the other end is provided with a material taking station for the turning device 4 to take the material.
具体的,参见附图5所示,拆叠机构25包括拆叠升降组件251、料盘拆分组件、敲击组件,拆叠升降组件151用以带动堆叠的料盘1上升或下降;料盘拆分组件包括能在拆分驱动件(如气缸)作用下插入到料盘限位插槽13内的拆分板252,敲击组件包括相对设置在料盘1两侧的敲击部,敲击部用以对插入有拆分板252的料盘1进行敲击,以使料盘1发生抖动。Specifically, referring to Figure 5, the unstacking mechanism 25 includes a unstacking lifting assembly 251, a material tray splitting assembly, and a knocking assembly. The unstacking lifting assembly 151 is used to drive the stacked material trays 1 to rise or fall; the material tray splitting assembly includes a splitting plate 252 that can be inserted into the material tray limiting slot 13 under the action of a splitting driving member (such as a cylinder), and the knocking assembly includes a knocking part relatively arranged on both sides of the material tray 1, and the knocking part is used to knock the material tray 1 with the splitting plate 252 inserted therein to cause the material tray 1 to shake.
当堆叠的料盘1被放置到输送机架211的上料端时,启动拆叠升降组件251,以使堆叠的料盘1上移至离开输送机架211;当自下往上的第二层料盘(下称“上层料盘”)位于拆分组件的工作区域内时,拆分板252插入到上层料盘的限位插槽13内,以对上层料盘进行支撑限位;启动敲击组件,以使敲击部能对上层料盘1的两侧进行敲击,此时,勾连到上层料盘下端的芯片即可在振动作用下回落到最下层料盘(下称“下层料盘”)的芯片放置槽内;启动拆叠升降组件251以带动下层料盘下移至输送机架211上,此时,因拆分板252对上层料盘的支撑,上层料盘及其上方的其余料盘均能保持不动,进而下层料盘被拆分开来。When the stacked material tray 1 is placed on the loading end of the conveyor frame 211, the destacking lifting component 251 is started to move the stacked material tray 1 up and away from the conveyor frame 211; when the second layer of material trays from bottom to top (hereinafter referred to as the "upper material tray") is located in the working area of the splitting component, the splitting plate 252 is inserted into the limiting slot 13 of the upper material tray to support and limit the upper material tray; the knocking component is started so that the knocking part can knock on both sides of the upper material tray 1. At this time, the chip connected to the lower end of the upper material tray can fall back into the chip placement groove of the lowest material tray (hereinafter referred to as the "lower material tray") under the action of vibration; the destacking lifting component 251 is started to drive the lower material tray to move down to the conveyor frame 211. At this time, due to the support of the splitting plate 252 to the upper material tray, the upper material tray and the remaining material trays above it can remain motionless, and then the lower material tray is split.
也即可以理解为,本实施例的拆叠机构21是采用自下往上的拆叠方式,而通过敲击组件的设置能避免堆叠料盘在搬运过程中出现的芯片歪斜勾连到上层料盘上的问题,进而避免拆叠过程中出现的芯片损伤问题。That is, it can be understood that the unstacking mechanism 21 of this embodiment adopts an unstacking method from bottom to top, and the setting of the knocking component can avoid the problem of chips from the stacked trays being skewed and hooked to the upper tray during transportation, thereby avoiding the problem of chip damage during the unstacking process.
在一些实施例中,敲击部包括安装在输送机架211上的敲击气缸253,敲击气缸253的活塞杆朝向料盘1,且活塞杆上设有能抵接在料盘1侧面的敲击面。更进一步地,输送机架211上还设有与料盘1拐角数量一一对应的角钢212,以对料盘1的升降移动进行限位导向。In some embodiments, the knocking part includes a knocking cylinder 253 installed on the conveyor frame 211, the piston rod of the knocking cylinder 253 faces the material tray 1, and the piston rod is provided with a knocking surface that can abut against the side of the material tray 1. Furthermore, the conveyor frame 211 is also provided with angle steels 212 corresponding to the number of corners of the material tray 1, so as to limit and guide the lifting and lowering movement of the material tray 1.
在一些实施例中,拆叠升降组件包括安装在输送机架211上的拆分升降气缸,拆分升降气缸上设有用以承接料盘1的升降顶板,升降顶板的尺寸小于料盘1的尺寸,以使料盘1位于升降顶板上时,料盘1的四个拐角部位能外露在升降顶板上。In some embodiments, the disassembling and lifting assembly includes a splitting and lifting cylinder installed on a conveying frame 211, and the splitting and lifting cylinder is provided with a lifting top plate for receiving the material tray 1, and the size of the lifting top plate is smaller than the size of the material tray 1, so that when the material tray 1 is located on the lifting top plate, the four corners of the material tray 1 can be exposed on the lifting top plate.
在一些实施例中,参见附图6所示,输送机架211沿垂直于料盘输送方向上布设有两组传送组件26,每组传送组件26上均设有能在拆叠机构25、取料工位之间往复移动的推料组件27;且两个推料组件27沿料盘1输送方向上错位设置,以分别推动不同的料盘1。In some embodiments, referring to FIG. 6 , the conveyor frame 211 is provided with two groups of conveying components 26 along a direction perpendicular to the conveying direction of the material tray, and each group of conveying components 26 is provided with a pushing component 27 that can reciprocate between the stacking mechanism 25 and the material picking station; and the two pushing components 27 are staggered along the conveying direction of the material tray 1 to push different material trays 1 respectively.
具体的,参见附图7所示,推料组件27包括推料基板271,推料基板271远离取料工位的一侧设有能升降移动的推杆272,当推杆272处于最高点时,推杆272能抵接在料盘1上,以推动料盘1移动;当推杆272处于最低点时,推杆272位于料盘1的下方,以避免推杆272回转到上料端的过程中碰触到移动的料盘1。Specifically, referring to FIG7 , the pushing assembly 27 includes a pushing base plate 271. A push rod 272 that can be raised and lowered is provided on the side of the pushing base plate 271 away from the material picking station. When the push rod 272 is at the highest point, the push rod 272 can abut against the material tray 1 to push the material tray 1 to move; when the push rod 272 is at the lowest point, the push rod 272 is located below the material tray 1 to prevent the push rod 272 from touching the moving material tray 1 during the process of rotating to the loading end.
由于两组推料组件27是分别位于输送机架211的两侧的,为了避免两组推料组件27之间的干扰,推杆272对料盘1的抵接位置点势必是偏向料盘1侧方的,而自料盘1侧方推动料盘1可能会导致料盘1因受力不均出现偏转现象,基于此,在推料基板271朝向取料工位的一侧设有能在止动驱动件273作用下抵接到料盘1上的止动板274。具体的,推料基板271上安装有铰接座,铰接座通过销轴铰接有止动板274。止动驱动件273包括沿料盘1输送方向布设的止动气缸,止动气缸安装在推料基板271上,且止动气缸的活塞杆朝向止动板274。销轴上套装有扭簧,扭簧的一端与止动板274连接,另一端与铰接座连接。通过止动气缸对止动板274的推动,能带动止动板274沿铰接座转动,进而使得止动板274能在翻转的状态下抵接到料盘1上。Since the two groups of pushing components 27 are respectively located on both sides of the conveying frame 211, in order to avoid interference between the two groups of pushing components 27, the contact point of the push rod 272 on the material tray 1 is bound to be biased towards the side of the material tray 1, and pushing the material tray 1 from the side of the material tray 1 may cause the material tray 1 to deflect due to uneven force. Based on this, a stop plate 274 that can abut against the material tray 1 under the action of the stop drive 273 is provided on the side of the pushing substrate 271 facing the material taking station. Specifically, a hinge seat is installed on the pushing substrate 271, and the hinge seat is hinged with the stop plate 274 through a pin shaft. The stop drive 273 includes a stop cylinder arranged along the conveying direction of the material tray 1, and the stop cylinder is installed on the pushing substrate 271, and the piston rod of the stop cylinder faces the stop plate 274. A torsion spring is mounted on the pin shaft, one end of the torsion spring is connected to the stop plate 274, and the other end is connected to the hinge seat. The stop plate 274 is pushed by the stop cylinder, so that the stop plate 274 can be driven to rotate along the hinge seat, so that the stop plate 274 can abut against the material tray 1 in a flipped state.
需要注意的是,传送组件26可采用现有技术中的同步带传动,本实施例不再对其进行赘述。It should be noted that the transmission component 26 can adopt the synchronous belt drive in the prior art, which will not be described in detail in this embodiment.
在一些实施例中,参见附图8-9所示,取料工位上分别设有料盘顶升部28、取料限位部,料盘顶升部28用以将料盘1顶升至离开输送机架211,其结构可参照拆叠升降组件251。取料限位部用以限定料盘1在取料工位上的位置,其包括至少一组能相向或背向移动的限位件,每组限位件均包括相对设置的两个限位夹块29,每一限位夹块29均能在限位驱动件(如直线气缸)的作用下向靠近或远离料盘1的方向移动。且限位夹块29的高度与两个料盘1叠放的高度相适配,以使限位夹块29既能对单个的料盘1进行限位,又能对叠放的两个料盘1进行同步限位。In some embodiments, as shown in Figures 8-9, the material taking station is provided with a material tray lifting part 28 and a material taking limiting part, respectively. The material tray lifting part 28 is used to lift the material tray 1 to leave the conveyor frame 211, and its structure can refer to the stacking lifting assembly 251. The material taking limiting part is used to limit the position of the material tray 1 on the material taking station, and it includes at least one group of limiting parts that can move toward or away from each other, and each group of limiting parts includes two limiting clamps 29 arranged oppositely, and each limiting clamp 29 can move in the direction of approaching or away from the material tray 1 under the action of a limiting driving part (such as a linear cylinder). And the height of the limiting clamp 29 is adapted to the height of the two stacked material trays 1, so that the limiting clamp 29 can not only limit the position of a single material tray 1, but also limit the position of the two stacked material trays 1 synchronously.
在上料输送线组中设置第一输送线21、第二输送线22,是为了配合翻面组件的翻面操作。具体的,在一些实施例中,参见附图8所示,翻面组件包括升降驱动部41、翻面驱动部42及料盘夹持部43,料盘夹持部43用以夹持一个或两个料盘1,且料盘夹持部43能在翻面驱动部42的作用下带动夹持的料盘1翻转;翻面驱动部42安装在升降驱动部43上,并能在升降驱动部43的作用下带动料盘夹持部43上下抖动。The first conveyor line 21 and the second conveyor line 22 are arranged in the feeding conveyor line group to cooperate with the flipping operation of the flipping assembly. Specifically, in some embodiments, as shown in FIG8 , the flipping assembly includes a lifting drive unit 41, a flipping drive unit 42 and a tray clamping unit 43. The tray clamping unit 43 is used to clamp one or two trays 1, and the tray clamping unit 43 can drive the clamped trays 1 to flip under the action of the flipping drive unit 42; the flipping drive unit 42 is installed on the lifting drive unit 43, and can drive the tray clamping unit 43 to shake up and down under the action of the lifting drive unit 43.
为了便于描述,将第一输送线21输送的未放置芯片的料盘1设为第一料盘,将第二输送线22输送的放置有芯片的料盘1设为第二料盘。操作时,首先通过料盘夹持部43夹持住未第一料盘,再通过翻面驱动部42将第一料盘翻转至芯片放置槽11朝下;升降驱动部41带动第一料盘下移并叠放到第二料盘上,然后料盘夹持部43同时夹取住第一料盘、第二料盘,并通过翻面驱动部42同步翻转第一料盘、第二料盘,以使第二料盘翻转至第一料盘的上方,此时,第二料盘上的芯片完成翻面动作,并在重力作用下进入到第一料盘的芯片放置槽11内;再通过升降驱动部41带动第一料盘、第二料盘同步上下抖动,以使卡顿在第二料盘上的芯片能在抖动作用下顺利进入到第一料盘的芯片放置槽11内,此时,位于第一料盘内的芯片即为翻面后的芯片;然后再通过料盘夹持部43将第二料盘取走即可。此时,料盘夹持部43取走的第二料盘内没有芯片,且芯片放置槽11朝下,因此,可将料盘夹持部43取走的第二料盘可作为下一次翻面操作中的上述第一料盘使用。For the convenience of description, the tray 1 without chips placed thereon and transported by the first conveyor line 21 is set as the first tray, and the tray 1 with chips placed thereon and transported by the second conveyor line 22 is set as the second tray. During operation, firstly, the first tray is clamped by the tray clamping part 43, and then the first tray is flipped by the flipping driving part 42 so that the chip placement slot 11 faces downward; the lifting driving part 41 drives the first tray to move downward and stack it on the second tray, and then the tray clamping part 43 clamps the first tray and the second tray at the same time, and the first tray and the second tray are synchronously flipped by the flipping driving part 42, so that the second tray is flipped to the top of the first tray. At this time, the chip on the second tray completes the flipping action and enters the chip placement slot 11 of the first tray under the action of gravity; then the first tray and the second tray are driven by the lifting driving part 41 to shake up and down synchronously, so that the chip stuck on the second tray can smoothly enter the chip placement slot 11 of the first tray under the shaking action, and at this time, the chip located in the first tray is the flipped chip; and then the second tray can be taken away by the tray clamping part 43. At this time, there is no chip in the second tray taken away by the tray clamping part 43, and the chip placement groove 11 is facing downward. Therefore, the second tray taken away by the tray clamping part 43 can be used as the above-mentioned first tray in the next turning operation.
由于第一料盘、第二料盘结构相同,且其内部的芯片放置槽11的深度是与芯片的厚度相适配的,当两个料盘1叠放后,第一料盘、第二料盘上相连通的芯片放置槽11之间的间距(相连通的芯片放置槽11之间的间距最小值为单个芯片放置槽深度的2倍)应小于芯片的宽度及长度,以抑制芯片在两个芯片放置槽11之间发生自转现象,以使得芯片的翻面动作仅能依靠料盘1的翻转实现。Since the first material tray and the second material tray have the same structure and the depth of the chip placement groove 11 inside them is adapted to the thickness of the chip, when the two material trays 1 are stacked, the spacing between the connected chip placement grooves 11 on the first material tray and the second material tray (the minimum spacing between the connected chip placement grooves 11 is 2 times the depth of a single chip placement groove) should be smaller than the width and length of the chip to inhibit the chip from rotating between the two chip placement grooves 11, so that the flipping of the chip can only be achieved by flipping the material tray 1.
在一些实施例中,参见附图10-11所示,料盘夹持部43包括与料盘1形状匹配的夹持框431,夹持框431上均布有多个用以夹紧一个或两个料盘的夹紧件。更进一步地,夹紧件布设在夹持框431的拐角处,其包括在夹紧驱动件432(如直线气缸)作用下沿夹持框431对角线方向往复移动的夹紧块433,夹紧块433能同时抵接在料盘1相邻的两个侧面上。In some embodiments, as shown in Figures 10-11, the tray clamping portion 43 includes a clamping frame 431 that matches the shape of the tray 1, and a plurality of clamping members for clamping one or two trays are evenly distributed on the clamping frame 431. Furthermore, the clamping members are arranged at the corners of the clamping frame 431, and include a clamping block 433 that reciprocates along the diagonal direction of the clamping frame 431 under the action of a clamping drive member 432 (such as a linear cylinder), and the clamping block 433 can abut against two adjacent side surfaces of the tray 1 at the same time.
由于夹紧块433是自料盘1的侧面夹紧料盘1的,而当夹紧块433夹持叠放的两个料盘1时,由于一个料盘1上是放置有芯片的,若叠放后两个料盘1在夹紧块433上发生滑移,易导致两个料盘1之间出现间隙,芯片有滑落风险。因此,在一些实施例中,对夹紧块433的结构作了改进。具体的,参见附图12所示,夹紧块433包括夹紧块本体4331、上止挡板4332、下止挡板4333,上止挡板4332、下止挡板4333分别位于夹紧块本体4331的上、下端面,用以限制料盘1上、下端面的位置;夹紧块本体4331高度与第一料盘、第二料盘的叠加高度相匹配,且夹紧块本体4331上设有能分别抵接在料盘1相邻两个侧面上的第一抵接面、第二抵接面。Since the clamping block 433 clamps the tray 1 from the side of the tray 1, and when the clamping block 433 clamps two stacked trays 1, since a chip is placed on one tray 1, if the two trays 1 slip on the clamping block 433 after being stacked, it is easy to cause a gap between the two trays 1, and there is a risk of the chip slipping. Therefore, in some embodiments, the structure of the clamping block 433 is improved. Specifically, as shown in Figure 12, the clamping block 433 includes a clamping block body 4331, an upper stop plate 4332, and a lower stop plate 4333. The upper stop plate 4332 and the lower stop plate 4333 are respectively located on the upper and lower end surfaces of the clamping block body 4331 to limit the position of the upper and lower end surfaces of the tray 1; the height of the clamping block body 4331 matches the stacking height of the first tray and the second tray, and the clamping block body 4331 is provided with a first abutting surface and a second abutting surface that can respectively abut on two adjacent side surfaces of the tray 1.
将夹紧块本体4331高度与两个料盘1的叠放高度相适配,再通过上止挡板4332、下止挡板4333的配合,能在夹紧块本体4331夹持两个料盘1时,使得上止挡板4332、下止挡板4333能分别抵接在叠放的两个料盘1的上、下端面上,进而对两个料盘1的叠放高度进行限定,以避免后续翻转过程中,料盘1在夹紧块本体4331上的滑移,保证芯片翻转的可靠性。而对于仅夹取单个料盘(该料盘上未放置芯片)的情况而言,上止挡板4332、下止挡板4333则能限定单个料盘在夹紧块本体4331上的滑移范围,避免单个料盘自夹紧块本体4331上的滑脱。The height of the clamping block body 4331 is matched with the stacking height of the two material trays 1, and then through the cooperation of the upper stop plate 4332 and the lower stop plate 4333, when the clamping block body 4331 clamps the two material trays 1, the upper stop plate 4332 and the lower stop plate 4333 can respectively abut against the upper and lower end surfaces of the two stacked material trays 1, thereby limiting the stacking height of the two material trays 1, so as to avoid the material tray 1 from slipping on the clamping block body 4331 during the subsequent flipping process, and ensure the reliability of chip flipping. For the case of clamping only a single material tray (no chip is placed on the material tray), the upper stop plate 4332 and the lower stop plate 4333 can limit the sliding range of the single material tray on the clamping block body 4331, and avoid the single material tray from slipping off the clamping block body 4331.
在一些实施例中,翻面驱动部42包括翻转机架421、翻转驱动件(图中未示出),翻转机架421固接在升降驱动部41上,其内设有用以容置料盘夹持部43的容置空间。料盘夹持部43位于容置空间内,且夹持框431的两端分别与翻转机架41转动连接。翻转驱动件(如翻转气缸)安装在翻转机架41上,用以驱动料盘夹持部43翻转。In some embodiments, the flipping driving unit 42 includes a flipping frame 421 and a flipping driving member (not shown in the figure). The flipping frame 421 is fixedly connected to the lifting driving unit 41, and is provided with a receiving space for receiving the tray clamping unit 43. The tray clamping unit 43 is located in the receiving space, and both ends of the clamping frame 431 are respectively rotatably connected to the flipping frame 41. The flipping driving member (such as a flipping cylinder) is installed on the flipping frame 41 to drive the tray clamping unit 43 to flip.
更进一步地,由于料盘1翻转是为了实现芯片的翻面动作,也即需将芯片翻转180°,因此,为了检测料盘1的翻转角度,可在翻转机架421上设置检测传感器422,并在夹持框431上设置检测板423,当夹持框431翻转时,检测板423随即翻转,并进入到或离开检测传感器422的检测范围内,进而能对翻转角度进行检测。Furthermore, since the material tray 1 is flipped to realize the turning over of the chip, that is, the chip needs to be flipped 180°, in order to detect the flipping angle of the material tray 1, a detection sensor 422 can be set on the flipping frame 421, and a detection plate 423 can be set on the clamping frame 431. When the clamping frame 431 is flipped, the detection plate 423 is flipped immediately and enters or leaves the detection range of the detection sensor 422, so that the flipping angle can be detected.
在一些实施例中,参见附图10所示,升降驱动部41包括在水平驱动部44作用下能水平移动的升降基板411,升降基板411设有在第一直线模组412作用下能升降移动的升降板,升降板上设有在第二直线模组413作用下升降移动的抖动基座414,抖动基座414与翻转机架421固接。且第二直线模组413的直线运动行程小于第一直线模组412的直线运动行程。通过第二直线模组413及抖动基座414的配合能利用较小的直线运动行程快速实现翻转机架421的上下抖动,而第一直线模组412对升降板的升降驱动则是为了实现对料盘1在输送装置2上的夹取或释放。示例性地,第一直线模组412、第二直线模组413可采用现有技术中的直线丝杆模组。需要注意的是,在水平驱动部44的作用下,翻面组件能移动至第一输送线21、第二输送线22、合格品输送线23或废品输送线24上。In some embodiments, as shown in FIG. 10 , the lifting drive unit 41 includes a lifting base plate 411 that can move horizontally under the action of the horizontal drive unit 44, and the lifting base plate 411 is provided with a lifting plate that can move up and down under the action of the first linear module 412, and the lifting plate is provided with a shaking base 414 that can move up and down under the action of the second linear module 413, and the shaking base 414 is fixedly connected to the flip frame 421. And the linear motion stroke of the second linear module 413 is smaller than the linear motion stroke of the first linear module 412. Through the cooperation of the second linear module 413 and the shaking base 414, the up and down shaking of the flip frame 421 can be quickly realized by utilizing a smaller linear motion stroke, and the lifting and lowering drive of the lifting plate by the first linear module 412 is to realize the clamping or release of the material tray 1 on the conveying device 2. Exemplarily, the first linear module 412 and the second linear module 413 can adopt the linear screw module in the prior art. It should be noted that, under the action of the horizontal driving unit 44 , the flipping assembly can be moved to the first conveyor line 21 , the second conveyor line 22 , the qualified product conveyor line 23 or the waste product conveyor line 24 .
芯片翻面组件的翻转方法如下:将未放置芯片的第一料盘翻转至芯片放置槽朝下;将第一料盘叠放至放置有芯片的第二料盘的上方,将第一料盘、第二料盘进行对齐限位,以使第一料盘上的芯片放置槽能一一对准第二料盘上的芯片放置槽;同时夹取叠放后的第一料盘、第二料盘,并将其翻转至第二料盘位于第一料盘的上方;带动翻转后的第一料盘、第二料盘同步上下抖动;将上下抖动后的第一料盘、第二料盘放置到指定位置后,取走位于上方的第二料盘,此时,位于第一料盘上的芯片即为翻面后的芯片。The flipping method of the chip flipping assembly is as follows: flip the first tray without chips so that the chip placement slot is facing downward; stack the first tray on top of the second tray with chips, and align and limit the first tray and the second tray so that the chip placement slots on the first tray can be aligned one by one with the chip placement slots on the second tray; clamp the stacked first tray and the second tray at the same time, and flip them so that the second tray is located above the first tray; drive the flipped first tray and the second tray to shake up and down synchronously; after placing the first tray and the second tray after shaking up and down to the designated positions, remove the second tray located on top, at this time, the chip on the first tray is the flipped chip.
为了便于翻面后拆分第一料盘、第二料盘,取料工位上也设置有能插入到料盘1上的拆分板252,拆分板252的工作原理可参照拆叠机构。下面具体描述对芯片翻面组件的工作过程:In order to facilitate the separation of the first tray and the second tray after flipping, a splitting plate 252 that can be inserted into the tray 1 is also provided on the material taking station. The working principle of the splitting plate 252 can refer to the stacking mechanism. The working process of the chip flipping assembly is described in detail below:
当第一料盘(未装有芯片)、第二料盘(装有芯片)分别移动至第一输送线21、第二输送线22的取料工位上时,第一输送线21上的料盘顶升部28将第一料盘顶升至指定的上料位置,对应的取料限位部的限位件向靠近第一料盘的方向移动,以对第一料盘的位置进行限定;然后取料限位部退回原位;同时,第二输送线22上的料盘顶升部28将第二料盘顶升至指定的上料位置,对应的取料限位部的限位件向靠近第二料盘的方向移动,以对第二料盘的位置进行限定;然后取料限位部退回原位;When the first material tray (without chips) and the second material tray (with chips) are moved to the material picking stations of the first conveyor line 21 and the second conveyor line 22 respectively, the material tray lifting part 28 on the first conveyor line 21 lifts the first material tray to the specified loading position, and the corresponding limiting member of the material picking limiting member moves in the direction close to the first material tray to limit the position of the first material tray; then the material picking limiting member returns to its original position; at the same time, the material tray lifting part 28 on the second conveyor line 22 lifts the second material tray to the specified loading position, and the corresponding limiting member of the material picking limiting member moves in the direction close to the second material tray to limit the position of the second material tray; then the material picking limiting member returns to its original position;
水平驱动部44带动翻转组件移动至第一输送线21的取料工位的上方,第一直线模组412驱动升降板下移,并使夹持框431移动至套装到第一料盘上;夹紧件随即夹紧第一料盘;第一直线模组412驱动升降板上移,以使料盘夹持部43带动第一料盘上移至离开第一输送线21;启动翻转驱动件,料盘夹持部43随即带动第一料盘翻转,直至第一料盘的芯片放置槽11朝下;The horizontal driving part 44 drives the flipping assembly to move above the material taking station of the first conveyor line 21, and the first linear module 412 drives the lifting plate to move downward, and moves the clamping frame 431 to fit onto the first material tray; the clamping member then clamps the first material tray; the first linear module 412 drives the lifting plate to move upward, so that the material tray clamping part 43 drives the first material tray to move upward and away from the first conveyor line 21; the flipping driving part is started, and the material tray clamping part 43 then drives the first material tray to flip until the chip placement slot 11 of the first material tray faces downward;
水平驱动部44带动翻转组件移动至第二输送线22的取料工位的上方,第一直线模组412驱动升降板下移,并使料盘夹持部43带动第一料盘移动至第二料盘的上方;夹紧件随即释放第一料盘,第一料盘落入到第二料盘上;取料限位部的限位件随即对第一料盘、第二料盘进行限位,以使第一料盘与第二料盘对齐;然后取料限位部退回原位;翻转组件继续下降至夹持框431套装到第一料盘、第二料盘上;夹紧件随即同时夹紧第一料盘、第二料盘;第一直线模组412驱动升降板上移,以使料盘夹持部43带动第一料盘、第二料盘上移至离开第一输送线21;启动翻转驱动件,料盘夹持部43随即带动第一料盘、第二料盘同步翻转,直至第二料盘的芯片放置槽11朝下,此时,第一料盘的芯片放置槽11朝上,而位于第二料盘内的芯片能在自重作用下下移至第一料盘的芯片放置槽内;The horizontal driving part 44 drives the flipping assembly to move above the material picking station of the second conveyor line 22, and the first linear module 412 drives the lifting plate to move downward, and causes the tray clamping part 43 to drive the first tray to move above the second tray; the clamping part then releases the first tray, and the first tray falls onto the second tray; the limiting part of the material picking limiting part then limits the first tray and the second tray to align the first tray with the second tray; then the material picking limiting part returns to its original position; the flipping assembly continues to descend until the clamping frame 431 is fitted onto the first tray, The first material tray is placed on the second material tray; the clamping member then clamps the first material tray and the second material tray at the same time; the first linear module 412 drives the lifting plate to move up, so that the material tray clamping part 43 drives the first material tray and the second material tray to move up and away from the first conveyor line 21; the flipping driving member is started, and the material tray clamping part 43 then drives the first material tray and the second material tray to flip synchronously until the chip placement slot 11 of the second material tray faces downward, at this time, the chip placement slot 11 of the first material tray faces upward, and the chip located in the second material tray can move down to the chip placement slot of the first material tray under the action of its own weight;
第二直线模组413带动抖动基座414上下抖动,翻转机架421随即带动料盘夹持部43上下抖动,以使倾斜卡顿在第一料盘或第二料盘的芯片放置槽11内的芯片能顺利进入到第一料盘芯片放置槽11的指定位置上;The second linear module 413 drives the shaking base 414 to shake up and down, and the flip frame 421 then drives the tray clamping part 43 to shake up and down, so that the chip stuck in the chip placement slot 11 of the first tray or the second tray can smoothly enter the designated position of the chip placement slot 11 of the first tray;
水平驱动部44带动翻转组件移动至下料输送组处,第一直线模组412带动升降板下移,料盘夹持部43随即带动第一料盘、第二料盘进入到料盘顶升部28上;夹紧件释放第一料盘、第二料盘,拆分板252随即插入到第二料盘上,料盘顶升部28随即带动第一料盘下移,以使第二料盘与第一料盘拆分开来;然后第二直线模组带动料盘夹持部43上移一小段距离(一个料盘的高度),然后夹紧件夹紧位于上方的第二料盘;第一直线模组412带动料盘夹持部43上移,此时,第一料盘上装载的芯片即为翻面后的芯片。The horizontal drive unit 44 drives the flipping assembly to move to the unloading conveying group, the first linear module 412 drives the lifting plate to move downward, and the tray clamping unit 43 immediately drives the first tray and the second tray to enter the tray lifting unit 28; the clamping member releases the first tray and the second tray, and the splitting plate 252 is immediately inserted into the second tray, and the tray lifting unit 28 immediately drives the first tray to move downward, so that the second tray is separated from the first tray; then the second linear module drives the tray clamping unit 43 to move up a short distance (the height of one tray), and then the clamping member clamps the second tray located above; the first linear module 412 drives the tray clamping unit 43 to move up, and at this time, the chip loaded on the first tray is the flipped chip.
为了保证翻面的稳定性,翻面组件的翻转动作相对较为平缓,难以适配输送装置对料盘的输送速度,因此,在实际应用时,可在水平驱动部44上布设两组能独立运行的翻面组件,以提升翻面效率。In order to ensure the stability of flipping, the flipping action of the flipping assembly is relatively gentle, and it is difficult to adapt to the conveying speed of the conveying device for the material tray. Therefore, in actual application, two groups of independently operating flipping assemblies can be arranged on the horizontal drive unit 44 to improve the flipping efficiency.
需要注意的是,为了保证对芯片的两面均能进行检测,参见附图13所示,第一视觉检测机构31应设置在第二输送线22上,以对尚未翻面的芯片进行视觉检测;第二视觉检测机构32则设置在下料输送组上,以对翻面后的芯片进行视觉检测。对于翻面后的料盘下料位置,可选择下料输送线组中的任一条输送线(下称“下料输送线”),并将第二视觉检测机构32设置在下料输送线上,以对翻面后的芯片进行检测。It should be noted that, in order to ensure that both sides of the chip can be inspected, as shown in FIG. 13, the first visual inspection mechanism 31 should be set on the second conveyor line 22 to visually inspect the chip that has not been turned over; the second visual inspection mechanism 32 is set on the unloading conveyor group to visually inspect the chip after turning over. For the unloading position of the material tray after turning over, any conveyor line in the unloading conveyor line group (hereinafter referred to as "unloading conveyor line") can be selected, and the second visual inspection mechanism 32 is set on the unloading conveyor line to inspect the chip after turning over.
更进一步地,在实际应用中,对于一些复杂的芯片,例如有引脚的芯片,其在生产过程中,引脚有可能会出现歪齿现象,而视觉检测仅能进行平面检测,因此,在一些实施例中,检测装置还包括安装在第二输送线22上的3D检测机构33,以对芯片进行3D检测。Furthermore, in actual applications, for some complex chips, such as chips with pins, the pins may become crooked during the production process, and visual inspection can only perform plane inspection. Therefore, in some embodiments, the inspection device also includes a 3D inspection mechanism 33 installed on the second conveyor line 22 to perform 3D inspection on the chip.
当检测装置完成对芯片的检测后,控制中心根据检测结果即可获知料盘上哪些芯片是合格品,哪些芯片是废品,然后将分拣结果发送给分选装置5,分选装置5随即对料盘上的芯片进行分选。When the detection device completes the detection of the chips, the control center can know which chips on the tray are qualified and which chips are defective based on the detection results, and then send the sorting results to the sorting device 5, which then sorts the chips on the tray.
具体的,参见附图14-15所示,分选装置5包括固定基座51、分选升降板52、调距机构、吸料机构。固定基座51能在合格品输送线23、废品输送线24之间往复移动。分选升降板52滑动设置在固定基座51的一侧,并能在第一驱动件53的作用下升降移动。调距机构包括沿竖直方向滑动设置在分选升降板52上的调距基板54,调距基板54沿水平方向上均布有多个调距载板55,多个调距载板55能在第二驱动件56的作用下向相互靠近或远离的方向移动;吸料机构包括与调距载板55一一对应设置的吸料部,每一吸料部均包括能独立升降移动的吸料杆57。Specifically, as shown in Figures 14-15, the sorting device 5 includes a fixed base 51, a sorting lifting plate 52, a distance adjustment mechanism, and a suction mechanism. The fixed base 51 can reciprocate between the qualified product conveying line 23 and the waste product conveying line 24. The sorting lifting plate 52 is slidably arranged on one side of the fixed base 51, and can be lifted and lowered under the action of the first driving member 53. The distance adjustment mechanism includes a distance adjustment substrate 54 slidably arranged on the sorting lifting plate 52 in the vertical direction, and the distance adjustment substrate 54 is evenly distributed with a plurality of distance adjustment carriers 55 in the horizontal direction. The plurality of distance adjustment carriers 55 can move in a direction close to or away from each other under the action of the second driving member 56; the suction mechanism includes a suction part arranged one by one with the distance adjustment carrier 55, and each suction part includes a suction rod 57 that can be lifted and lowered independently.
由于芯片规格不同,料盘1上的芯片放置槽11的大小及相邻两个芯片放置槽11间的间距也会有所不同。因此,通过调距机构的设置可使吸料部之间的间距可变,进而适配不同规格的芯片分选。使用时,首先将固定基座51移动至下料输送线上,并使料盘1沿下料输送线移动至分选装置5的运行范围内;利用第二驱动件56带动多个调距载板55向相互靠近或远离的方向移动,以使得相邻两个调距载板55之间的间距与料盘1上芯片放置槽11的间距相适配,进而使得位于调距载板55上的吸料部能对准对应的芯片放置槽11内的芯片;然后第一驱动件53带动分选升降板52移动至设定的高度,以带动吸料部移动至料盘1的吸料范围内;然后驱动吸料杆57下移以吸取料盘1上的芯片。由于吸料杆57就能独立升降,因此,可根据芯片放置槽11内的芯片情况选择相应的吸料部,以将不合格的芯片吸取出来。Due to the different chip specifications, the size of the chip placement slots 11 on the tray 1 and the spacing between two adjacent chip placement slots 11 will also be different. Therefore, the spacing between the suction parts can be changed by setting the distance adjustment mechanism, so as to adapt to the sorting of chips of different specifications. When in use, first move the fixed base 51 to the unloading conveyor line, and move the tray 1 along the unloading conveyor line to the operating range of the sorting device 5; use the second driving member 56 to drive multiple distance-adjusting carriers 55 to move in a direction close to or away from each other, so that the spacing between two adjacent distance-adjusting carriers 55 is adapted to the spacing of the chip placement slots 11 on the tray 1, so that the suction part located on the distance-adjusting carrier 55 can align with the chip in the corresponding chip placement slot 11; then the first driving member 53 drives the sorting lifting plate 52 to move to the set height, so as to drive the suction part to move to the suction range of the tray 1; then drive the suction rod 57 to move down to absorb the chip on the tray 1. Since the suction rod 57 can be raised and lowered independently, a corresponding suction part can be selected according to the condition of the chips in the chip placement slot 11 to suck out unqualified chips.
示例性地,当下料输送线组包括一个合格品输送线23和两个废品输送线24时,可将其中一个废品输送线24作为料盘的下料输送线(即翻面组件将翻面的料盘1放置到该输送线上),并在另一废品输送线24与合格品输送线23上放置空料盘;然后通过吸料部对下料输送线上的料盘内芯片的分拣,将合格的芯片移载至合格品输送线23上的空料盘内,不合格的芯片则移载至另一废品输送线24的空料盘内。亦或者,直接以合格品输送线23作为料盘的下料输送线,吸料部仅将不合格的芯片剔除出去,而合格的芯片仍留在下料输送线的料盘1内,此时,两个废品输送线24可用于剔除不同质量问题的芯片(如一个废品输送线24用以剔除3D检测有缺陷的芯片,另一个废品输送线25用以剔除视觉检测有缺陷的芯片)。在实际应用时,芯片的分选可根据实际需求进行调整,并不受本实施例限制。Exemplarily, when the unloading conveyor line group includes one qualified product conveyor line 23 and two defective product conveyor lines 24, one of the defective product conveyor lines 24 can be used as the unloading conveyor line of the tray (i.e., the flip assembly places the flipped tray 1 on the conveyor line), and an empty tray is placed on the other defective product conveyor line 24 and the qualified product conveyor line 23; then, the chips in the tray on the unloading conveyor line are sorted by the suction part, and the qualified chips are transferred to the empty tray on the qualified product conveyor line 23, and the unqualified chips are transferred to the empty tray of the other defective product conveyor line 24. Alternatively, the qualified product conveyor line 23 is directly used as the unloading conveyor line of the tray, and the suction part only removes the unqualified chips, while the qualified chips remain in the tray 1 of the unloading conveyor line. At this time, the two defective product conveyor lines 24 can be used to remove chips with different quality problems (such as one defective conveyor line 24 is used to remove chips with defects in 3D detection, and the other defective conveyor line 25 is used to remove chips with defects in visual detection). In actual application, the chip sorting can be adjusted according to actual needs and is not limited by this embodiment.
在一些实施例中,参见附图15所示,分选升降板52朝向调距机构的一侧对称设置有一对沿竖直方向布设的竖轨,一对竖轨之间设有沿水平方向布设的横轨。且调距基板54滑动设置在一对竖轨上,调距载板55滑动设置在横轨上。且在调距基板54上布设有与调距载板55一一对应设置的调距槽孔541,调距载板55能沿对应的调距槽孔541移动。任一相邻两个调距槽孔541之间沿水平方向上的间距自上往下逐渐增大。且在同一高度上,任一相邻两个调距槽孔541之间的水平间距均相同。In some embodiments, as shown in FIG. 15 , a pair of vertical rails arranged in the vertical direction are symmetrically arranged on one side of the sorting lifting plate 52 facing the distance adjustment mechanism, and a horizontal rail arranged in the horizontal direction is arranged between the pair of vertical rails. The distance adjustment substrate 54 is slidably arranged on the pair of vertical rails, and the distance adjustment carrier 55 is slidably arranged on the horizontal rail. Distance adjustment slots 541 arranged one-to-one corresponding to the distance adjustment carrier 55 are arranged on the distance adjustment substrate 54, and the distance adjustment carrier 55 can move along the corresponding distance adjustment slots 541. The distance between any two adjacent distance adjustment slots 541 in the horizontal direction gradually increases from top to bottom. And at the same height, the horizontal distance between any two adjacent distance adjustment slots 541 is the same.
由于料盘1上的芯片放置槽11是均匀布设的,因此,在调节调距载板55间间距时,需保证两调距载板55之间的间距始终保持相同。因此,本实施例中将多个调距槽孔541设置为以中心轴对称布设的态势,且将多个调距槽孔541自靠近中心轴向远离中心轴的方向倾斜幅度逐渐增大,以使得在调距载板55沿调距槽孔541移动的过程中,相邻两个调距载板55之间的间距变化能始终保持相同。Since the chip placement slots 11 on the tray 1 are evenly arranged, when adjusting the spacing between the spacing-adjusting carriers 55, it is necessary to ensure that the spacing between the two spacing-adjusting carriers 55 always remains the same. Therefore, in this embodiment, the plurality of spacing-adjusting slots 541 are arranged symmetrically about the central axis, and the inclination amplitude of the plurality of spacing-adjusting slots 541 from the direction close to the central axis to the direction away from the central axis is gradually increased, so that in the process of the spacing-adjusting carrier 55 moving along the spacing-adjusting slots 541, the spacing change between two adjacent spacing-adjusting carriers 55 can always remain the same.
需要注意的是,若在中心轴处也设置有调距槽孔541时,该调距槽孔541应呈竖向布设,以使沿该调距槽孔541移动的调距载板55始终沿竖向移动。示例性地,调距槽孔541设置有七个,且位于中间的调距槽孔541沿竖直方向布设,其他调距槽孔541则两两对称设置在中间的调距槽孔541的两侧。It should be noted that if a distance adjustment slot 541 is also provided at the central axis, the distance adjustment slot 541 should be arranged vertically so that the distance adjustment carrier 55 moving along the distance adjustment slot 541 always moves vertically. For example, there are seven distance adjustment slots 541, and the distance adjustment slot 541 in the middle is arranged in the vertical direction, and the other distance adjustment slots 541 are symmetrically arranged on both sides of the distance adjustment slot 541 in the middle.
在一些实施例中,调距载板55包括载板本体,载板本体的上端部设有能沿对应的调距槽孔541移动的柱杆,柱杆位于对应的调距槽孔541内,其两端分别抵接在对应的调距槽孔541的内侧壁上。In some embodiments, the distance-adjustable carrier 55 includes a carrier body, the upper end of which is provided with a column rod that can move along the corresponding distance-adjustable slot hole 541. The column rod is located in the corresponding distance-adjustable slot hole 541, and its two ends are respectively abutted against the inner side walls of the corresponding distance-adjustable slot hole 541.
在一些实施例中,分选升降板52的一侧设有位置检测机构,调距基板54上设有能进入到位置检测机构检测范围内的检测板。In some embodiments, a position detection mechanism is provided on one side of the sorting lifting plate 52, and a detection plate that can enter the detection range of the position detection mechanism is provided on the distance adjustment substrate 54.
本发明的芯片检测分选设备的工作过程如下:The working process of the chip detection and sorting equipment of the present invention is as follows:
人工将未装芯片的堆叠料盘、装有芯片的堆叠料盘分别放置到第一输送线21、第二输送线22的上料端;第一输送线21、第二输送线22上的拆叠机构25分别对堆叠料盘进行拆叠,以使单个的第一料盘、第二料盘能分别在传送组件26及推板组件27的配合下移动至相应的取料工位;在第二料盘沿第二输送线22移动的过程中,第一视觉检测机构31及3D检测机构33对第二料盘上的芯片进行外观检测;Manually place the stacked trays without chips and the stacked trays with chips on the loading ends of the first conveyor line 21 and the second conveyor line 22 respectively; the destacking mechanisms 25 on the first conveyor line 21 and the second conveyor line 22 destacking the stacked trays respectively, so that the single first tray and the second tray can be moved to the corresponding material picking station respectively with the cooperation of the conveying assembly 26 and the push plate assembly 27; while the second tray moves along the second conveyor line 22, the first visual inspection mechanism 31 and the 3D inspection mechanism 33 perform appearance inspection on the chips on the second tray;
翻面组件将第一料盘倒置叠放在第二料盘上并对第一料盘、第二料盘进行翻面操作,以使第二料盘上的芯片能移载至第一料盘上,此时,第一料盘上的芯片即为翻面后的芯片;The flipping assembly stacks the first tray upside down on the second tray and flips the first tray and the second tray so that the chips on the second tray can be transferred to the first tray. At this time, the chips on the first tray are the flipped chips.
翻面组件将第一料盘输送至下料输送线上,第二视觉检测机构32对第一料盘内的芯片进行外观检测;然后第一料盘移动至分选装置5的运行范围内;The flip assembly conveys the first tray to the unloading conveyor line, and the second visual inspection mechanism 32 performs appearance inspection on the chips in the first tray; then the first tray moves to the operating range of the sorting device 5;
分选装置5根据外观检测结果对芯片进行分拣,以使合格的芯片进入到合格品输送线23上,不合格的芯片进入到废品输送线24上。The sorting device 5 sorts the chips according to the appearance inspection result, so that the qualified chips enter the qualified product conveying line 23 and the unqualified chips enter the waste product conveying line 24.
需要注意的是,在实际应用中,为了使芯片在进行外观检测后仍保持原先的放置方向(即芯片在第二料盘上的放置方向);可在第二视觉检测机构32对芯片进行外观检测之后,通过翻面组件对芯片进行翻面操作,然后再通过分选装置5进行分选。It should be noted that in actual applications, in order to ensure that the chip maintains its original placement direction (i.e., the placement direction of the chip on the second tray) after the appearance inspection, the chip can be turned over by the flipping assembly after the second visual inspection mechanism 32 performs an appearance inspection on the chip, and then sorted by the sorting device 5.
以上实施方式只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人了解本发明的内容并加以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所做的等效变化或修饰,都应涵盖在本发明的保护范围内。The above implementation modes are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119153374A (en) * | 2024-09-23 | 2024-12-17 | 中电鹏程智能装备有限公司 | Chip tray overturning and feeding device and using method |
| CN119560419A (en) * | 2025-01-24 | 2025-03-04 | 深圳格芯集成电路装备有限公司 | Chip detection and sorting device and method |
| CN119596107A (en) * | 2024-11-29 | 2025-03-11 | 广东长兴半导体科技有限公司 | A fully automatic chip efficient testing equipment |
| CN119747242A (en) * | 2025-01-08 | 2025-04-04 | 中电鹏程智能装备有限公司 | A chip high-speed appearance defect detection device and detection method |
| CN120300046A (en) * | 2025-04-23 | 2025-07-11 | 恩纳基智能装备(无锡)股份有限公司 | High-precision multi-specification chip loading equipment |
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- 2024-01-04 CN CN202410014112.6A patent/CN117816589A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119153374A (en) * | 2024-09-23 | 2024-12-17 | 中电鹏程智能装备有限公司 | Chip tray overturning and feeding device and using method |
| CN119596107A (en) * | 2024-11-29 | 2025-03-11 | 广东长兴半导体科技有限公司 | A fully automatic chip efficient testing equipment |
| CN119747242A (en) * | 2025-01-08 | 2025-04-04 | 中电鹏程智能装备有限公司 | A chip high-speed appearance defect detection device and detection method |
| CN119560419A (en) * | 2025-01-24 | 2025-03-04 | 深圳格芯集成电路装备有限公司 | Chip detection and sorting device and method |
| CN120300046A (en) * | 2025-04-23 | 2025-07-11 | 恩纳基智能装备(无锡)股份有限公司 | High-precision multi-specification chip loading equipment |
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