CN117732983A - A bending machine that facilitates Z-shaped bending of flat wires with holes - Google Patents

Abstract

The invention discloses a bending machine convenient for Z-shaped bending of a perforated back flat wire, which relates to the field of flat wire processing and comprises a material conveying device seat, wherein one side of the material conveying device seat is connected with a bending processing table, a copper bar vertical bending elbow mechanism and a copper bar Z-shaped bending mechanism are arranged on the side wall of the bending processing table, the flat wire is placed in the material conveying device seat, a punching platform is arranged in the material conveying device seat, a turret is arranged at the top end of the punching platform, and the turret comprises a bearing disc and a rotary disc. According to the invention, through the turret, the stamping die, the movable supporting plate and the cleaning mechanism, when the flat wire is processed, the movable supporting plate is driven to rotate by the polishing motor, so that edge burrs of the punched holes of the flat wire are polished and cleaned, and after the edge burrs are cleaned, the scraps are discharged through the guide grooves in the movable supporting plate, and then the scraps are recovered through the cleaning mechanism, so that unnecessary abrasion of the flat wire caused by the scraps is avoided, and the cleaning effect is improved.

Description

A bending machine that facilitates Z-shaped bending of flat wires with holes

Technical field

The invention relates to the field of flat wire processing, specifically a bending machine that facilitates Z-shaped bending of flat wires with holes.

Background technique

Flat wire is also called flat wire, flat wire, rectangular wire or ultra-narrow strip. It refers to a heterogeneous metal wire with a rounded rectangular cross-section. Because the flat wire is shaped like a ribbon, it is sometimes also called an ultra-narrow flat strip. Compared with Common round wire and flat wire have unique advantages in terms of heat dissipation, welding contact area, fatigue resistance, hardness control, etc. During the processing of flat wires, the surface of the flat wire will be affected according to the use of the flat wire. Make holes, and then bend the flat wire at multiple angles according to the actual situation to facilitate the use of the flat wire.

However, in the existing technology, flat wires are punched with different diameters according to processing needs. For this reason, when punching, multiple sets of stamping structures are installed, and different stamping structures are driven by motors above the flat wires according to needs. Move, move the stamping heads of different diameters above the flat wire to perform stamping. This will cause the stamping mechanism to be too large, resulting in a bloated use process (reciprocating movement is required to drive the stamping structure to reciprocate above the flat wire), and during the stamping process , it is necessary to select a suitable socket according to different stamping heads and provide support to ensure that the discharge opening of the socket is consistent with the punching head, thereby reducing the deformation of the punching edge of the flat wire. However, during the stamping process, it will also cause punching There are protruding burrs on the edges. With the existing technology, it is difficult to process the burrs after being supported by the socket, resulting in the need for further processing, which increases the processing steps and difficulty (especially after the subsequent flat wires are bent into multiple sets of shapes, more difficult to deburr).

Contents of the invention

Based on this, the purpose of the present invention is to provide a bending machine that facilitates Z-shaped bending of flat wires with holes to solve the technical problem.

In order to achieve the above object, the present invention provides the following technical solution: a bending machine that facilitates Z-shaped bending of flat wires with holes, including a feeding device seat, and a bending processing table is connected to one side of the feeding device seat. , and the side wall of the bending processing table is equipped with a copper row vertical bending elbow mechanism and a copper row Z-bending mechanism. A flat wire is placed inside the feeding device seat, and a flat wire is installed inside the feeding device seat. There is a stamping platform, and a turret is installed on the top of the stamping platform. The turret includes a bearing plate and a turntable. A servo motor is provided above the turntable. The turntable is divided into upper and lower layers. The upper layer of the turntable is equipped with a There are multiple sets of stamping dies. The lower layer of the turntable is equipped with multiple sets of movable pallets that match the stamping dies. The flat wire passes between the stamping dies and the movable pallets. The bottom end of the stamping die is provided with a stamping head. And there is a cavity inside the movable pallet that matches the stamping head. A connecting spring is installed on the outside of the stamping die. The stamping die is movably connected to the turntable through the connecting spring. A grinding motor is installed inside the bearing plate, so The grinding motor is drivingly connected to the movable pallet. The stamping platform is located above the turret and is equipped with a punching boosting cylinder. The output end of the punching boosting cylinder is engaged with the stamping die for transmission. The stamping platform is located on the turret. A cleaning mechanism is installed at one end of the tower. Multiple sets of suction pipes are provided on one side of the cleaning mechanism, and the suction pipes are aligned with the movable pallet.

By adopting the above technical solution, different stamping dies can be driven by the turntable to move under the punching booster cylinder, so that the flat wire can be punched with different specifications. After punching, the flat wire can be punched by the rotating movable pallet. Grinding is performed to reduce punching burrs, and the negative pressure generated by the cleaning mechanism after punching can collect the cleaned waste.

The present invention is further configured that a control panel is installed on the outside of the stamping platform, and a cutting mechanism is installed on the side of the stamping platform close to the Z-bend mechanism for folding copper strips, and the flat wire passes through the cutting mechanism, and the cutting mechanism The cutting mechanism includes a cutting cylinder, a cutting head, and a limit frame. The flat wire is located between the cutting head and the limit frame.

By adopting the above technical solution, the processed flat wire can be cut by the cutting mechanism, which facilitates flat wire processing.

The present invention is further configured such that the turret is fixed above the stamping platform, the top of the bearing plate is installed with a buffer pad on one side of the turntable, and the bottom end of the buffer pad is provided with a mounting hanger, and the The grinding motor is installed inside the installation hanger, and the buffer pad and the turntable are located below the flat wire to support the flat wire.

By adopting the above technical solution, the impact force on the turntable during the punching process can be reduced, thereby reducing the deformation of the turntable and improving the punching efficiency.

The present invention is further configured that the specifications of the punching heads inside each group of stamping dies are different, and the specifications of the internal cavity of the movable pallet matching each group of stamping dies match the nearest stamping head. The punching head punches the flat wire, and the generated waste is discharged through the internal cavity of the movable pallet.

By adopting the above technical solution, it is convenient to punch flat wires with different specifications.

The invention is further configured that a fixed frame is installed on the outside of the punching boosting cylinder, the servo motor is fixed on the bottom end of the fixed frame, the output end of the servo motor is fixedly connected to the turntable, and the servo motor drives the turntable. Make a turn.

By adopting the above technical solution, the servo motor can be conveniently fixed and limited.

The invention is further configured such that a groove is provided at the output end of the punching boosting cylinder, an electromagnet is installed at the output end of the punching boosting cylinder above the groove, and the top of each group of stamping dies is provided with a groove. There is a limit groove, and a magnetic ring is movable connected inside the limit groove. When the stamping die moves below the output end of the punching booster cylinder, the magnetism generated by the electromagnet attracts the magnetic ring to move into the groove, and the lower part of the magnetic ring The half part is also located inside the limiting groove, and the top of the stamping die is also provided with multiple sets of balls around the magnetic ring.

By adopting the above technical solution, the punching boosting cylinder and the stamping die can be easily connected to avoid the stamping die from being offset during the stamping process.

The present invention is further configured that the stamping die is provided with a protruding ring on the outside below the upper layer of the turntable, and the top end of the protruding ring is connected with a connecting spring, and the stamping die is movably connected to the turntable through the connecting spring.

By adopting the above technical solution, the stamping die can be moved up and down conveniently and returned to the position after stamping is completed.

The present invention is further configured such that driven teeth are provided on the outside of the movable supporting plate, driving teeth are connected to the output end of the grinding motor, and the movable supporting plate is drivingly connected to the grinding motor through the driven teeth. The top of the plate is provided with a support ring, and the movable support plate is engaged with the lower limit of the turntable through the support ring. The inner wall of the movable support plate is provided with multiple sets of lead-out grooves, and the top of the lead-out groove extends to the middle position of the top of the support ring. , connected to the cavity, the bottom end of the outlet groove extends to the outer wall of the movable support plate, and is aligned with the suction pipe.

By adopting the above technical solution, the movable pallet can be rotated conveniently to polish the stamped flat wire, and during the grinding process, the waste chips generated by the grinding can be discharged through the discharge groove, and as the movable pallet rotates, the flat wire can be polished through Centrifugal force can discharge waste chips more conveniently, improving the discharge effect.

The present invention is further configured that a support washer is provided at the top of the stamping platform, and the support washer extends to the inside of the turret to fit with the bottom end of the turntable, and extension plates are provided at both ends of the support washer. When the turntable rotates, the extension plate is retracted inside the support pad ring. When punching is performed, the extension plate is unfolded and arranged around the movable support plate.

By adopting the above technical solution, the impact force when punching the turntable can be reduced, the stability of the turntable can be improved, and the waste chips generated during the grinding process can be collected through the extension plate.

The present invention is further configured that a fan and a filter element are installed inside the cleaning mechanism, a handle extending to the outside of the cleaning mechanism is provided at the top of the filter element, and the filter element is located between the fan and the suction pipe. The end of the air pipe is a bevel. When the movable support plate rotates, the suction pipe does not hinder the rotation of the movable support plate.

By adopting the above technical solution, the waste chips can be easily recycled, and during the recycling process, the waste chips are collected through the filter element to facilitate recycling.

To sum up, the present invention mainly has the following beneficial effects:

1. The present invention effectively reduces the number of punching and boosting cylinders by setting up a turret, a stamping die, and multiple sets of movable pallets. It can punch flat wires with different diameters, and the punching head can be replaced through a turntable structure. , which facilitates subsequent maintenance and replacement of the punching head. Before punching, the stamping die can be easily connected to the punching pressurization hole, which improves the stability of punching. During the punching process, the movable support plate can effectively The edge position of the flat wire punching is supported and limited, thereby effectively reducing the deformation of the flat wire punching edge during the punching process and improving the punching effect.

2. Through the turret, stamping die, movable pallet and cleaning mechanism provided in the present invention, when processing the flat wire, the grinding motor can drive the movable pallet to rotate, thereby polishing and cleaning the edge burrs of the punched flat wire. , and after cleaning, the waste chips will be discharged through the outlet groove in the movable pallet, and then the waste chips will be recycled through the cleaning mechanism, thereby avoiding unnecessary wear and tear on the flat wire caused by the waste chips and improving the cleaning effect.

3. The present invention can limit the position of the turntable through the support gasket during the punching process, thereby reducing the deformation of the turntable during the punching process, and seal the movable pallet during polishing through the support gasket, thereby It effectively reduces the scattering of waste chips during the grinding process and improves the effect of waste recycling.

Description of drawings

Figure 1 is a schematic structural diagram of the present invention;

Figure 2 is a schematic diagram of the installation position of the turntable punching mechanism of the present invention;

Figure 3 is a schematic diagram of the installation of the turntable punching mechanism and the flat wire of the present invention;

Figure 4 is a schematic structural diagram of the turntable punching mechanism of the present invention;

Figure 5 is a schematic diagram of the exploded structure of the turntable punching mechanism of the present invention;

Figure 6 is a schematic cross-sectional structural diagram of the punching boosting cylinder of the present invention;

Figure 7 is a schematic structural diagram of the turntable punching section of the present invention;

Figure 8 is a schematic diagram of the partially enlarged structure of position A in Figure 7 of the present invention;

Figure 9 is a schematic structural diagram of the buffer pad of the present invention;

Figure 10 is a schematic structural diagram of the cleaning mechanism and movable pallet of the present invention;

Figure 11 is a schematic cross-sectional structural diagram of the movable pallet of the present invention.

In the picture: 1. Feeding device seat; 2. Bending processing table; 201. Control panel; 202. Stamping platform; 203. Cutting mechanism; 3. Copper row vertical bending elbow mechanism; 4. Copper row folding Z Bending mechanism; 5. Turret; 501. Bearing plate; 502. Turntable; 503. Servo motor; 504. Buffer plate; 505. Installation hanger; 506. Grinding motor; 5061. Driving gear; 507. Support backing ring ; 508. Extension plate; 6. Punching booster cylinder; 601. Fixed frame; 602. Electromagnet; 7. Stamping die; 701. Stamping head; 702. Magnetic ring; 703. Limiting groove; 704. Protruding ring; 705. Connecting spring; 706. Ball; 8. Movable support plate; 801. Driven tooth; 802. Lead-out groove; 803. Support ring; 9. Cleaning mechanism; 901. Filter element; 902. Suction pipe; 10. Flat Wire.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and cannot be understood as limiting the present invention.

The embodiments of the present invention will be described below based on the overall structure of the present invention.

A bending machine that facilitates Z-shaped bending of flat wires with holes, as shown in Figures 1 to 10, includes a feeding device seat 1, and a bending processing table 2 is connected to one side of the feeding device seat 1, and A copper row vertical bending elbow mechanism 3 and a copper row Z-bending mechanism 4 are installed on the side wall of the bending processing table 2. A flat wire 10 is placed inside the feeding device seat 1, which can drive the flat wire 10 during bending. The machine moves internally. A stamping platform 202 is installed inside the conveyor base 1. A turret 5 is installed on the top of the stamping platform 202. The stamping platform 202 is located above the turret 5 and a punching boosting cylinder 6 is installed. The turret 5 includes The bearing plate 501 and the turntable 502 are provided with a servo motor 503 above the turntable 502. A fixed frame 601 is installed on the outside of the punching boosting cylinder 6. The servo motor 503 is fixed at the bottom of the fixed frame 601. The output end of the servo motor 503 is connected to The turntable 502 is fixedly connected, and the servo motor 503 drives the turntable 502 to rotate. The turntable 502 is divided into upper and lower layers. Multiple sets of stamping dies 7 are installed on the upper layer of the turntable 502. The output end of the punching booster cylinder 6 is engaged with the stamping dies 7 for transmission. The lower layer of the turntable 502 is equipped with multiple sets of movable pallets 8 that match the stamping die 7. The flat wire 10 passes between the stamping die 7 and the movable pallets 8. A stamping head 701 is provided at the bottom of the stamping die 7 and is movable. A cavity matching the punching head 701 is provided inside the supporting plate 8. A groove is provided at the output end of the punching boosting cylinder 6. An electromagnet 602 is installed at the output end of the punching boosting cylinder 6 above the groove. Each group The top of the stamping die 7 is provided with a limiting groove 703, and a magnetic ring 702 is movably connected inside the limiting groove 703. When the stamping die 7 moves below the output end of the punching booster cylinder 6, the magnetic attraction generated by the electromagnet 602 The magnetic ring 702 moves into the groove, and the lower half of the magnetic ring 702 is still located inside the limiting groove 703, thereby limiting the horizontal position of the stamping die 7. The top of the stamping die 7 surrounds the magnetic ring 702 and has multiple openings. The balls 706 are assembled, and the stamping die 7 is provided with a protruding ring 704 on the outside below the upper layer of the turntable 502. The top of the protruding ring 704 is connected with a connecting spring 705. The stamping die 7 is movably connected to the turntable 502 through the connecting spring 705. At this time, punching and pressurization are started. The output end of the cylinder 6 moves downward to squeeze the stamping die 7 to move downward, so that the punching head 701 punches the flat wire 10 .

A grinding motor 506 is installed inside the bearing plate 501. A driven tooth 801 is provided on the outside of the movable pallet 8. The output end of the grinding motor 506 is connected to a driving tooth 5061. The movable pallet 8 is driven by the driven tooth 801 and the grinding motor 506. connection, the top of the movable pallet 8 is provided with a support ring 803, the movable pallet 8 is engaged with the lower limit of the turntable 502 through the support ring 803, the inner wall of the movable pallet 8 is provided with multiple sets of lead-out grooves 802, and the lead-out grooves 802 The top end of the support ring 803 extends to the middle position of the top end of the support ring 803 and is connected to the cavity. The bottom end of the lead-out groove 802 extends to the outer wall of the movable support plate 8. A support pad ring 507 is provided at the top of the stamping platform 202, and the support pad ring 507 extends When the inside of the turret 5 is in contact with the bottom end of the turntable 502, extension plates 508 are provided at both ends of the support ring 507. When the turntable 502 rotates, the extension plates 508 are retracted inside the support ring 507. When punching, The extension plate 508 is unfolded and arranged around the movable pallet 8. The stamping platform 202 is located at one end of the turret 5 and is equipped with a cleaning mechanism 9. A plurality of sets of suction pipes 902 are provided on one side of the cleaning mechanism 9, and the suction pipes 902 are connected to the movable pallet. 8 is aligned, the punched waste passes through the cavity of the movable pallet 8 and falls to the bottom of the stamping platform 202. The rotating movable pallet 8 uses the top grinding block to grind and clean the protruding burrs of the punch holes at the bottom of the flat wire 10, and then exports The groove 802 discharges the waste chips generated by grinding, and the cleaning mechanism 9 is started. The fan in the cleaning mechanism 9 generates negative pressure and reaches the surroundings of the movable pallet 8 through the suction pipe 902. The waste chips discharged from the lead-out groove 802 are adsorbed and collected, and filtered The filter element 901 filters and collects waste chips, reducing pollution to the processing environment and improving the processing effect.

Please refer to Figure 1 and Figure 2. A control panel 201 is installed on the outside of the stamping platform 202, and a cutting mechanism 203 is installed on the side of the stamping platform 202 close to the copper strip Z-bending mechanism 4. The flat wire 10 passes through the cutting mechanism. 203. The cutting mechanism 203 includes a cutting cylinder, a cutting head, and a limit frame. The flat wire 10 is located between the cutting head and the limit frame, which can facilitate the bending of the punched flat wire 10, and after bending , the flat wire 10 is cut off by the cutting mechanism 203 .

Please refer to Figures 7 and 8. The turret 5 is fixed above the stamping platform 202. The top of the bearing plate 501 is located on one side of the turntable 502, and a buffer pad 504 is installed. The bottom end of the buffer pad 504 is provided with a mounting hanger 505. , the grinding motor 506 is installed inside the installation hanger 505. The buffer pad 504 and the turntable 502 are located below the flat wire 10 to support the flat wire 10. During the punching process of the flat wire 10, the buffer pad 504 can be used to The flat wire 10 provides auxiliary support to reduce the impact on the turntable 502.

Please refer to Figures 5 and 7. The specifications of the punching heads 701 inside each group of stamping dies 7 are different, and the internal cavity specifications of the movable pallet 8 matching each group of stamping dies 7 match the nearest stamping head 701. The punching head 701 punches the flat wire 10, and the generated waste is discharged through the internal cavity of the movable supporting plate 8, which can facilitate the punching process of the flat wire 10 with different specifications and increase the processing range.

Please refer to Figures 7 and 10. A fan and a filter element 901 are installed inside the cleaning mechanism 9. The top of the filter element 901 is provided with a handle extending to the outside of the cleaning mechanism 9, and the filter element 901 is located between the fan and the suction pipe 902. , the end of the suction pipe 902 is a bevel. When the movable support plate 8 rotates, the suction pipe 902 does not hinder the rotation of the movable support plate 8, and can conveniently collect the waste chips after grinding and pass them through the filter element 901. Waste scraps are collected.

When processing the flat wire 10, first straighten the flat wire 10 through the conveying device seat 1, and the transport roller transports the flat wire 10 into the turret 5. At this time, according to the size of the required punching hole, select the appropriate punching Head 701. At this time, the servo motor 503 is powered on. The servo motor 503 drives the turntable 502 to rotate, driving the stamping die 7 on the turntable 502 and the matching movable pallet 8 to rotate synchronously until the appropriate stamping head 701 moves to the flat surface. When the line 10 is above, the starting electromagnet 602 generates a magnetic force that attracts the magnetic ring 702. Under the action of the magnetic force, the magnetic ring 702 is located between the limiting groove 703 and the bottom slot of the punching booster cylinder 6, thus pressurizing the punching force. The mold 7 is horizontally limited to prevent the stamping mold 7 from deflecting during the stamping process. At the same time, the movable pallet 8 also rotates to the vicinity of the grinding motor 506. Through the outer driven teeth 801 and the active force of the grinding motor 506, The teeth 5061 engage, open the extension plate 508 to block the bottom of the movable pallet 8 (the extension plate 508 can be driven by a motor, a cylinder, etc.), then start the grinding motor 506, and drive the movable pallet 8 on the flat line through the driving teeth 5061 10 is rotated below, and then the flat wire 10 needs to be punched. At this time, the punching booster cylinder 6 is started, and its output end moves downward to squeeze the stamping die 7 to move downward, so that the punching head 701 punches the flat wire 10. During the punching process, the turntable 502 is limitedly supported by the support ring 507 to reduce the deformation of the turntable 502, and the flat wire 10 is also partially supported by the buffer pad 504 to reduce the direct impact on the turntable 502. The impact force thereby improves the service life of the turntable 502. The punched waste passes through the cavity of the movable pallet 8 and falls to the bottom of the stamping platform 202. The rotating movable pallet 8 passes through the top grinding block (not shown in the figure, the details The shape needs to be determined according to the punching situation, usually a frosted sheet) is used to grind and clean the protruding burrs of the punched hole at the bottom of the flat wire 10, discharge the waste generated by grinding through the lead-out groove 802, start the cleaning mechanism 9, and the cleaning mechanism 9 The negative pressure generated by the fan reaches the surroundings of the movable pallet 8 through the suction pipe 902, and adsorbs and collects the waste chips discharged from the outlet slot 802 (at this time, the support ring 507 and the extension plate 508 surround the outside of the movable pallet 8, thereby protecting the external environment from the outside world. The air flow and waste chips are isolated and limited to avoid waste chips flying around), and the waste chips are filtered and collected through the filter element 901, which reduces the pollution to the processing environment and improves the processing effect;

After punching is completed, if the subsequent punching size needs to be adjusted, the electromagnet 602 is started in reverse at this time, so that the electromagnet 602 generates a magnetic force that repels the magnetic ring 702, and presses the magnetic ring 702 into the limiting groove 703. Within, the connection between the stamping die 7 and the punching boosting cylinder 6 is released, and then the servo motor 603 is started to drive the turntable 502 to rotate, and the stamping dies 7 of other specifications are moved below the punching boosting cylinder 6 to facilitate the flat wire 10 Perform punching of different specifications;

After the punching process is completed, start the punching booster cylinder 6 to move the punching head 701 out of the punching hole in the flat wire 10, start the feeding device seat 1 to drive the flat wire 10 to move, and the flat wire 10 moves to pass through the cutting knife group After reaching the bending position, according to the bending requirements, the flat wire 10 is bent and deformed through the copper row vertical bending elbow mechanism 3 and the copper row bending Z-bending mechanism 4 (while bending, the flat wire 10 is bent through the punching structure. The wire 10 is punched, thus improving the processing efficiency). After bending, the cylinder of the cutting mechanism 203 is started to drive the cutting knife group to cut off the flat wire 10 to complete the processing of the flat wire 10.

Although embodiments of the invention have been shown and described, these specific embodiments are merely illustrative of the invention and are not intended to limit the invention. The specific features, structures, materials or characteristics described may be used in any one or more The embodiments or examples are combined in a suitable manner. After reading this description, those skilled in the art can make modifications and substitutions to the embodiments as needed without inventive contribution without departing from the principles and purposes of the present invention. and modifications, etc., as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims (10)

1. A bending machine that facilitates Z-shaped bending of flat wires with holes, including a feeding device seat (1). One side of the feeding device seat (1) is connected to a bending processing table (2), And the side wall of the bending processing table (2) is equipped with a copper row vertical bending elbow mechanism (3) and a copper row Z-bending mechanism (4). A flat bending device (1) is placed inside the conveyor seat (1). Line (10), characterized in that: a stamping platform (202) is installed inside the conveyor seat (1), a turret (5) is installed on the top of the stamping platform (202), and the turret (5) 5) It includes a bearing plate (501) and a turntable (502). A servo motor (503) is provided above the turntable (502). The turntable (502) is divided into upper and lower layers. The upper layer of the turntable (502) is installed There are multiple sets of stamping dies (7), and multiple sets of movable pallets (8) matching the stamping dies (7) are installed on the lower layer of the turntable (502). The flat wire (10) passes through the stamping dies (7). Between the stamping die (7) and the movable pallet (8), a stamping head (701) is provided at the bottom end of the stamping die (7), and a cavity matching the stamping head (701) is provided inside the movable pallet (8), so A connecting spring (705) is installed on the outside of the stamping die (7). The stamping die (7) is movably connected to the turntable (502) through the connecting spring (705). A grinding motor is installed inside the bearing plate (501). (506), the grinding motor (506) is drivingly connected to the movable pallet (8), the punching platform (202) is located above the turret (5) and is equipped with a punching boosting cylinder (6). The output end of the hole boosting cylinder (6) is engaged with the stamping die (7) for transmission. The stamping platform (202) is located at one end of the turret (5) and is equipped with a cleaning mechanism (9). The cleaning mechanism (9) Multiple sets of suction pipes (902) are provided on one side of the machine, and the suction pipes (902) are aligned with the movable support plate (8). 2. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: a control panel (201) is installed on the outside of the stamping platform (202), and the stamping platform (202) is equipped with a control panel (201). (202) A cutting mechanism (203) is installed on the side close to the copper strip folding Z-bending mechanism (4). The flat wire (10) passes through the cutting mechanism (203). The cutting mechanism (203) It includes a cutting cylinder, a cutting head, and a limiting frame, and the flat wire (10) is located between the cutting head and the limiting frame. 3. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: the turret (5) is fixed above the stamping platform (202), and the load-bearing The top of the disk (501) is located on one side of the turntable (502), and a buffer pad (504) is installed. The bottom end of the buffer pad (504) is provided with a mounting hanger (505). The grinding motor (506) Installed inside the installation hanger (505), the buffer pad (504) and the turntable (502) are located below the flat wire (10) to support the flat wire (10). 4. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: the specifications of the stamping heads (701) inside each group of the stamping dies (7) are all different. , and the internal cavity specifications of the movable pallet (8) matched with each group of stamping dies (7) match its nearest stamping head (701). The punching head (701) punches the flat wire (10), and the generated waste is discharged through the internal cavity of the movable supporting plate (8). 5. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: a fixing frame (601) is installed on the outside of the punching boosting cylinder (6), The servo motor (503) is fixed at the bottom of the fixed frame (601). The output end of the servo motor (503) is fixedly connected to the turntable (502). The servo motor (503) drives the turntable (502) to rotate. . 6. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: the output end of the punching boosting cylinder (6) is provided with a groove, and the The output end of the punching booster cylinder (6) is located above the groove and is equipped with an electromagnet (602). The top of each group of stamping dies (7) is provided with a limit slot (703), and the limit slot (703) There is a magnetic ring (702) movable inside. When the stamping die (7) moves below the output end of the punching booster cylinder (6), the magnetism generated by the electromagnet (602) attracts the magnetic ring (702) to move to the groove. inside, and the lower half of the magnetic ring (702) is also located inside the limiting groove (703). The top of the stamping die (7) is also provided with multiple sets of balls (706) surrounding the magnetic ring (702). 7. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 6, characterized in that: the stamping die (7) is located below the upper layer of the turntable (502) and has a protruding ring ( 704), the top end of the protruding ring (704) is connected with a connecting spring (705), and the stamping die (7) is movably connected to the turntable (502) through the connecting spring (705). 8. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: driven teeth (801) are provided on the outside of the movable supporting plate (8), so The output end of the grinding motor (506) is connected to a driving tooth (5061), and the movable supporting plate (8) is drivingly connected to the grinding motor (506) through the driven teeth (801). The movable supporting plate (8) A support ring (803) is provided at the top, and the movable support plate (8) is engaged with the lower limit of the turntable (502) through the support ring (803). The inner wall of the movable support plate (8) is provided with multiple sets of lead-out slots ( 802), and the top end of the lead-out groove (802) extends to the middle position of the top of the support ring (803), connected with the cavity, and the bottom end of the lead-out groove (802) extends to the outer wall of the movable support plate (8), and is connected with the suction Trachea (902) aligned. 9. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: a support washer (507) is provided at the top of the stamping platform (202), and the supporting ring is The backing ring (507) extends to the inside of the turret (5) and fits the bottom end of the turntable (502). Both ends of the support backing ring (507) are provided with extension plates (508). When the turntable (502) rotates When punching, the extension plate (508) is unfolded and arranged around the movable supporting plate (8). 10. A bending machine that facilitates Z-shaped bending of flat wires with holes according to claim 1, characterized in that: a fan and a filter element (901) are installed inside the cleaning mechanism (9), so The top of the filter element (901) is provided with a handle that extends to the outside of the cleaning mechanism (9), and the filter element (901) is located between the fan and the suction pipe (902). The end of the suction pipe (902) It is an inclined surface, and when the movable supporting plate (8) rotates, the suction pipe (902) does not hinder the rotation of the movable supporting plate (8).