CN117637905A - Silicon chip packaging equipment and packaging method thereof - Google Patents

Silicon chip packaging equipment and packaging method thereof Download PDF

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Publication number
CN117637905A
CN117637905A CN202311462550.0A CN202311462550A CN117637905A CN 117637905 A CN117637905 A CN 117637905A CN 202311462550 A CN202311462550 A CN 202311462550A CN 117637905 A CN117637905 A CN 117637905A
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China
Prior art keywords
silicon wafer
regular
film
labeling
conveying line
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CN202311462550.0A
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Chinese (zh)
Inventor
段陆建
祁建国
顾维国
薄宏林
傅晋清
杨宇
吴双
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Manfred Intelligent Manufacturing Jiangsu Co ltd
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Manfred Intelligent Manufacturing Jiangsu Co ltd
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Priority to CN202311462550.0A priority Critical patent/CN117637905A/en
Publication of CN117637905A publication Critical patent/CN117637905A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Labeling Devices (AREA)

Abstract

The invention discloses silicon wafer packaging equipment and a packaging method thereof, which belong to the technical field of silicon wafer packaging, and comprise a frame, and a feeding regulation assembly, a paper pasting assembly, a plastic packaging assembly and a label pasting and blanking assembly which are sequentially arranged along the length direction of the frame, wherein a connecting structure is arranged between adjacent assemblies; the feeding normalization component normalizes the silicon wafer; the dust-free paper is attached to the front side and the back side of the silicon wafer by the paper attaching component; the plastic package assembly comprises a plastic package conveying line, a film covering structure and an oven, wherein the film covering structure and the oven are sequentially arranged along the conveying direction of the plastic package conveying line; the labeling and blanking assembly comprises a blanking conveying line and a labeling structure, and the blanking conveying line conveys silicon wafers to the labeling structure to finish labeling. The invention can carry out packaging treatment on silicon wafers with different specifications without manual direct packaging operation, greatly improves the packaging efficiency of the silicon wafers, effectively avoids the situations of mixing, fragmentation, omission and pollution of the silicon wafers, and ensures the packaging quality and the packaging efficiency of the silicon wafers.

Description

Silicon chip packaging equipment and packaging method thereof
Technical Field
The invention belongs to the technical field of silicon chip packaging, and particularly relates to silicon chip packaging equipment and a packaging method thereof.
Background
Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present, and a battery of the silicon crystal photovoltaic technology adopts silicon as a main material and is made of monocrystalline silicon or polycrystalline silicon. Silicon crystal photovoltaics have the advantages of high efficiency, stability and reliability, but have high production cost. The materials adopted by the thin film solar cell mainly comprise amorphous silicon, copper indium gallium selenide, organic materials and the like, and have the characteristics of light weight, low production cost, strong flexibility and the like, but the efficiency is lower than that of silicon crystal photovoltaics. The polycrystalline silicon photovoltaic adopts high-purity silicon microcrystal crystal which can be compared with a common silicon crystal battery, but the manufacturing process is more advanced than the silicon crystal photovoltaic technology, and the silicon crystal bar belongs to a common silicon crystal.
The silicon wafer is formed after slicing the silicon crystal bar, the thickness of the silicon wafer used in the industry at present is more than 0.16mm, various specifications exist, packaging treatment is needed for the silicon wafers with different specifications, a traditional packaging mode is manual packaging, the silicon wafer is often subjected to full packaging by manual packaging, the disassembly of the subsequent silicon wafer is influenced by the full packaging, the disassembly efficiency is low, and the conditions of mixing, fragmentation, omission, pollution and the like of the silicon wafer are easily caused by manual operation, so that the packaging quality and the packaging efficiency are influenced.
Disclosure of Invention
The invention overcomes the defects of the prior art, and provides silicon chip packaging equipment and a packaging method thereof, so as to solve the problems in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme: a silicon chip packaging device comprises a frame, and a feeding regulation assembly, a paper pasting assembly, a plastic packaging assembly and a labeling blanking assembly which are sequentially arranged along the length direction of the frame, wherein a connecting structure is arranged between adjacent assemblies;
the feeding normalization component normalizes the silicon wafer;
the dust-free paper is attached to the front side and the back side of the silicon wafer by the paper attaching component;
the plastic package assembly comprises a plastic package conveying line, a film coating structure and an oven, wherein the film coating structure and the oven are sequentially arranged along the conveying direction of the plastic package conveying line, one side of the plastic package conveying line is provided with a material roller, a double-layer film is wound on the material roller, the film coating structure comprises two formers and a driving wheel set, a plastic package channel is formed between the two formers, the plastic package conveying line penetrates through the plastic package channel, the formers are triangular structures, the double-layer film is pulled by the driving wheel set after being spread by the two formers, the double-layer film enters the plastic package channel through the bevel edge of the formers to coat a silicon wafer, and the oven heat-seals the coated silicon wafer;
the labeling and blanking assembly comprises a blanking conveying line and a labeling structure, and the blanking conveying line conveys silicon wafers to the labeling structure to finish labeling.
In a preferred embodiment of the present invention, the feeding regulation component is disposed on the frame, and the feeding regulation component includes a regulation stage, a first regulation structure and a second regulation structure, where the first regulation structure is disposed along the length direction of the regulation stage to regulate the silicon wafer, and the second regulation structure is disposed along the width direction of the regulation stage to regulate the silicon wafer.
In a preferred embodiment of the present invention, the first regular structure includes a first regular cylinder and a first regular plate driven by the first regular cylinder, the number of the first regular plates is two and located at two ends of the regular carrier, the second regular structure includes a second regular cylinder and a second regular plate driven by the second regular cylinder, the number of the second regular plates is two and located at two sides of the regular carrier, the first regular plate is connected with the first regular cylinder through a linkage, the second regular plate is connected with the second regular cylinder through another linkage, and the first regular plate and the second regular plate are both provided with air-pumping holes, and the air-pumping holes are connected with an external vacuum generator.
In a preferred embodiment of the present invention, the alignment carrier is an i-shaped structure, the alignment carrier is provided with alignment grooves, and the first alignment plate and the second alignment plate are respectively matched with the alignment grooves to align the silicon wafer.
In a preferred embodiment of the present invention, a transfer robot is disposed between the paper pasting component and the feeding regulation component, the paper pasting component includes a paper pasting conveying line, a paper pasting module and paper pasting suction cups, and the number of the paper pasting suction cups is two and moves along the driving direction of the paper pasting module.
In a preferred embodiment of the present invention, the film coating structure further includes a film coating support and a film coating cutter, the film coating support is provided with a film coating motor, the driving wheel set is connected with the film coating motor through a synchronous belt wheel set, and the film coating cutter is located at the tail end of the former, and cuts the film coated silicon wafer.
In a preferred embodiment of the present invention, the driving wheel set includes an upper wheel set and a lower wheel set, the synchronous belt wheel set includes a plurality of synchronous pulleys, the synchronous pulleys drive the upper wheel set to rotate, and the synchronous pulleys drive the lower wheel set to rotate, and the upper wheel set and the lower wheel set drive the upper film and the lower film of the double-layer film respectively, so that the upper film and the lower film of the double-layer film are driven in the same direction.
In a preferred embodiment of the present invention, an adjusting handle is provided on the film-covered stent, and an adjusting screw is provided on the adjusting handle, and the adjusting screw is in threaded connection with one of the formers to adjust the interval between the two formers.
In a preferred embodiment of the present invention, the labeling structure includes a printer, a labeler, and a labeling block located at a driving end of the labeler, wherein a label absorbing hole for absorbing a label is formed on the labeling block, and after the labeling block absorbs the label, the labeler drives the labeling block to adhere the label to a silicon wafer.
The invention also discloses a packaging method of the silicon chip packaging equipment, which comprises the following steps:
s1, placing a silicon wafer on a normalization carrier, and normalizing two ends and two sides of the silicon wafer by a first normalization structure and a second normalization structure to enable the silicon wafer to be in a standard state to be processed;
s2, the transfer robot transfers the regular silicon wafers to a paper pasting conveying line, and the paper pasting module drives the paper pasting sucker to adsorb paper pasting, and places the paper pasting on the front side and the back side of the silicon wafers;
s3, conveying the silicon wafer to a plastic package conveying line by using a paper pasting conveying line, stretching a double-layer film on a material roller by using two formers, driving an upper film of the double-layer film by using an upper wheel set, driving a lower film by using a lower wheel set, and respectively coating films on the front surface and the back surface of the silicon wafer;
s4, cutting off the film by a film coating cutter, and conveying the film-cut silicon wafer into an oven by a plastic packaging conveying line for packaging the silicon wafer;
s5, conveying the packaged silicon wafer to a labeling structure through a blanking conveying line, adsorbing the label by a labeling block of the labeling structure, and attaching the label to the surface of the silicon wafer by a labeler to finish labeling treatment of the silicon wafer.
The invention solves the defects existing in the background technology, and has the following beneficial effects:
(1) According to the invention, the silicon wafers with different specifications can be packaged without manual direct packaging operation, so that the packaging efficiency of the silicon wafers is greatly improved, the situations of mixing, fragmentation, omission and pollution of the silicon wafers are effectively avoided, and the packaging quality and the packaging efficiency of the silicon wafers are ensured;
(2) The film-covered structure can perform semi-plastic packaging treatment on the silicon wafer, improves the plastic packaging efficiency, is beneficial to subsequent disassembly treatment of the silicon wafer, and reduces the subsequent disassembly fragment rate of the silicon wafer;
(3) The existence of the two triangular structure formers can separate the double-layer films, and the separated double-layer films are respectively coated on the front surface and the back surface of the silicon wafer, so that synchronous operation of the films on the front surface and the back surface of the silicon wafer is realized, and the structural stability of the silicon wafer is ensured while the film coating efficiency is improved.
Drawings
The invention is further described below with reference to the drawings and examples;
FIG. 1 is a schematic view of the overall structure of a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram of a feeding alignment assembly according to a preferred embodiment of the present invention;
FIG. 3 is a schematic view of another feeding regulation assembly according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view of the construction of a sticker assembly according to a preferred embodiment of the present invention;
FIG. 5 is a schematic view of the overall structure of a plastic package assembly according to a preferred embodiment of the present invention;
FIG. 6 is a schematic view of a partial structure of a molding assembly according to a preferred embodiment of the present invention;
FIG. 7 is a schematic view showing the overall structure of a label feeding assembly according to a preferred embodiment of the present invention;
FIG. 8 is a flow chart of a preferred embodiment of the present invention;
in the figure: 100. a frame;
10. a feeding regulation component; 11. a regular carrier; 12. a first structured; 121. a first normalization cylinder; 122. a first normalization plate; 13. a second structured; 131. a second regular cylinder; 132. a second normalization plate; 14. a linkage; 15. an air suction hole; 20. a decal assembly; 21. a sticker conveying line; 22. a paper sticking module; 23. a paper sticking sucker; 24. detecting a camera; 30. a plastic package assembly; 31. a plastic package conveying line; 32. a film-covered structure; 321. a former; 322. a driving wheel group; 3221. an upper wheel group; 3222. a lower wheel group; 323. a stent graft; 3231. a film covered motor; 3232. adjusting the handle; 3233. adjusting a screw rod; 324. a film-coating cutter; 33. an oven; 34. a material roller; 35. a synchronous belt wheel set; 40. labeling and blanking components; 41. a blanking conveying line; 42. labeling structure; 421. a printer; 422. a labeler; 423. labeling blocks; 4231. a label sucking hole; 50. a transfer robot; 60. a paper feed bin; 70. a spot check module; 80. and (5) a normalization module.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Example 1
The embodiment provides a silicon wafer packaging equipment, this silicon wafer packaging equipment can carry out the encapsulation to the silicon wafer of different specifications and handle, need not the manual work and directly carry out the encapsulation operation, improves the encapsulation efficiency to the silicon wafer greatly, effectively avoids the silicon wafer to appear that the condition such as compounding, piece, leak examine and pollute, has guaranteed the encapsulation quality and the encapsulation efficiency of silicon wafer.
As shown in fig. 1, the silicon wafer packaging device of this embodiment includes a frame 100, and a feeding regulation component 10, a paper pasting component 20, a plastic package component 30, and a label pasting and blanking component 40 which are sequentially arranged along the length direction of the frame 100, wherein a linking structure is arranged between adjacent components, so that each component can be stably linked, and the silicon wafer can be sequentially subjected to feeding regulation, paper pasting, plastic package and label pasting and blanking operations.
As shown in fig. 2 and 3, the feeding regular assembly 10 is disposed on the frame 100, the feeding regular assembly 10 includes a regular carrier 11, a first regular structure 12 and a second regular structure 13, the first regular structure 12 is disposed along the length direction of the regular carrier 11 to regular the silicon wafer, and the second regular structure 13 is disposed along the width direction of the regular carrier 11 to regular the silicon wafer, so that the first regular structure 12 and the second regular structure 13 can perform regular treatment on the silicon wafer from each direction, and the regular effect on the silicon wafer is ensured.
Specifically, the first regulating structure 12 includes a first regulating cylinder 121 and a first regulating plate 122 driven by the first regulating cylinder 121, the number of the first regulating plates 122 is two and located at two ends of the regulating carrier 11, the second regulating structure 13 includes a second regulating cylinder 131 and a second regulating plate 132 driven by the second regulating cylinder 131, the number of the second regulating plates 132 is two and located at two sides of the regulating carrier 11, the first regulating plate 122 is connected with the first regulating cylinder 121 through a connecting rod group 14, the second regulating plate 132 is connected with the second regulating cylinder 131 through another connecting rod group 14, the first regulating plate 122 and the second regulating plate 132 are all provided with air pumping holes 15, the air pumping holes 15 are connected with an external vacuum generator, the first regulating cylinder 121 drives the two first regulating plates 122 to move through one connecting rod group 14, the second regulating plates 132 are driven by the other connecting rod group 14 to move, so that the first regulating plates 122 and the second regulating plates 132 are close to the silicon wafer carrier 11, and the phenomenon that the silicon wafer carrier is separated from the silicon wafer carrier 11 is avoided.
Specifically, the regular carrier 11 is an i-shaped structure, the regular carrier 11 is provided with regular grooves, the first regular plate 122 and the second regular plate 132 are respectively matched with the regular grooves to perform regular operation on silicon wafers, the first regular plate 122 and the second regular plate 132 are respectively clamped into the regular grooves to perform regular operation on the silicon wafers, and scale marks are respectively arranged on the first regular plate 122 and the second regular plate 132 in the embodiment, so that the silicon wafers with different specifications can be compatible according to scale switching.
As shown in fig. 1 and 4, the dust-free paper is attached to the front and back sides of the silicon wafer by the paper attaching assembly 20, a transfer robot 50 is arranged between the paper attaching assembly 20 and the feeding regulation assembly 10, the paper attaching assembly 20 comprises a paper attaching conveying line 21, paper attaching modules 22 and paper attaching sucking discs 23, the number of the paper attaching sucking discs 23 is two and moves along the driving direction of the paper attaching modules 22, a paper supplying bin 60 is arranged on a frame 100 of the embodiment so as to provide dust-free paper, the dust-free paper is adsorbed by the paper attaching sucking discs 23, the paper attaching module 22 moves the paper attaching sucking discs 23 with the dust-free paper to the position of the silicon wafer, the dust-free paper is attached to the surface of the silicon wafer, in actual use, the number of the paper supplying bin 60 is two, the paper attaching sucking discs respectively correspond to the positions of the two paper attaching sucking discs 23, and before the silicon wafer reaches the paper attaching position, one paper attaching sucking disc 23 places the dust-free paper on the paper attaching conveying line 21, so that the dust-free paper on the back side of the silicon wafer can be smoothly attached.
In this embodiment, the decal assembly 20 further includes a detection camera 24, and the detection camera 24 is located directly above the decal conveyor line 21 to monitor the decaled silicon wafer in real time.
Referring to fig. 1, 5 and 6, the plastic package assembly 30 includes a plastic package transfer line 31, a film coating structure 32 and an oven 33 sequentially arranged along the transfer direction of the plastic package transfer line 31, a material roller 34 is arranged at one side of the plastic package transfer line 31, a double-layer film is wound on the material roller 34, the film coating structure 32 includes two formers 321 and a driving wheel set 322, a plastic package channel is formed between the two formers 321, the plastic package transfer line 31 penetrates through the plastic package channel, the formers 321 are triangle structures, the double-layer film is pulled by the driving wheel set 322 after being propped up by the two formers 321, the double-layer film enters the plastic package channel through the bevel edge of the former 321 to coat a silicon wafer, the oven 33 heat-seals the coated silicon wafer, the driving wheel set 322 includes an upper wheel set 3221 and a lower wheel set 3222, the synchronous belt pulley set 35 comprises a plurality of synchronous pulleys, the synchronous pulleys drive the upper pulley set 3221 to rotate, the synchronous pulleys drive the lower pulley set 3222 to rotate, the upper pulley set 3221 and the lower pulley set 3222 drive the upper film and the lower film of the double-layer film respectively, the upper film and the lower film of the double-layer film are driven in the same direction, the double-layer film on the material roller 34 is peeled off manually in an initial state, the upper film is driven by the upper pulley set 3221, the lower film is driven by the lower pulley set 3222, the silicon wafer is conveyed on the plastic package conveying line 31, the upper film covers the front surface of the silicon wafer, the lower film covers the back surface of the silicon wafer, synchronous operation of the front surface and the back surface of the silicon wafer is realized, and the structural stability of the silicon wafer is ensured while the film covering efficiency is improved.
In this embodiment, the film coating structure 32 further includes a film coating support 323 and a film coating cutter 324, the film coating support 323 is provided with a film coating motor 3231, the driving wheel set 322 is connected with the film coating motor 3231 through the synchronous belt wheel set 35, the film coating cutter 324 is located at the end of the former 321, the film coating motor 3231 cuts the film on the coated silicon wafer, and the film coating motor 3231 synchronously drives the upper wheel set 3221 and the lower wheel set 3222 of the driving wheel set 322 through the synchronous belt structure, so that the upper film and the lower film are synchronously attached to the surface of the silicon wafer.
Further, an adjusting handle 3232 is disposed on the film-coating bracket 323, an adjusting screw 3233 is disposed on the adjusting handle 3232, and the adjusting screw 3233 is in threaded connection with one of the two formers 321 to adjust the interval between the two formers 321, so as to adapt to silicon wafers with different specifications.
In the practical use of the film coating structure 32 of this embodiment, the double-layer film changes the conveying direction through the hypotenuse of the former 321, the double-layer film is separated into an upper film and a lower film under the action of the two formers 321, the separated double-layer film is respectively coated on the front and back sides of the silicon wafer, the synchronous operation of the front and back side of the silicon wafer is realized, the film coating efficiency is improved, the structural stability of the silicon wafer is ensured, the former 321 of the triangular structure body can realize the semi-plastic packaging treatment of the silicon wafer, the plastic packaging efficiency is improved, the subsequent disassembly treatment of the silicon wafer is facilitated, and the subsequent disassembly fragment rate of the silicon wafer is reduced.
Referring to fig. 1 and fig. 7, the labeling blanking assembly 40 includes a blanking conveying line 41 and a labeling structure 42, the blanking conveying line 41 conveys the silicon wafer to the labeling structure 42, labeling is completed, the labeling structure 42 includes a printer 421, a labeler 422 and a labeling block 423 located at a driving end of the labeler 422, a label absorbing hole 4231 for absorbing labels is formed in the labeling block 423, the labeler 422 drives the labeling block 423 to adhere the labels to the silicon wafer after the labeling block 423 adsorbs the labels, and after the blanking conveying line 41 conveys the packaged silicon wafer to a labeling position, the labeling block 423 is completed to absorb the labels, the labeler 422 drives the labeling block 423 to be close to the silicon wafer, and labeling can be performed on the surface of the silicon wafer.
As shown in fig. 1, a sampling module 70 and a trimming module 80 are further disposed on the frame 100 in this embodiment, the sampling module 70 corresponds to the position of the feeding trimming module 10, sampling is performed on the silicon wafers (for example, sampling one group of five groups of silicon wafers or sampling one group of ten groups of silicon wafers) at a certain frequency, if the sampled silicon wafers are defective, the sampled silicon wafers are processed manually to be qualified, and then the sampled silicon wafers are put into the trimming module 80 to be trimmed, if the sampled silicon wafers are good, the silicon wafers are directly put into the trimming module 80 to be subsequently processed, and the trimming module 80 in this embodiment has the same structure as the feeding trimming module 10.
In actual use, the packaging device of this embodiment places the stacked silicon wafers on the alignment carrier 11 by the external truss, aligns the stacked silicon wafers by the first alignment structure 12 and the second alignment structure 13, makes the silicon wafers in an aligned standard state to be processed, then transfers the aligned silicon wafers onto the decal transfer line 21 by the transfer robot 50, at this time, places a piece of dust-free paper on the decal transfer line 21 in advance, attaches the back surface of the silicon wafers, then adsorbs the dust-free paper by the decal sucker 23, moves the decal sucker 23 with the dust-free paper adsorbed to the position of the silicon wafer by the decal module 22, attaches the dust-free paper to the surface of the silicon wafers, makes the front surface of the silicon wafers attached with the dust-free paper, and after the attachment is completed, photographs and detects the silicon wafers by the detection camera 24, after detection, the paper pasting conveying line 21 conveys the silicon wafer to the plastic packaging conveying line 31, before conveying, the double-layer film on the material roller 34 is spread by the two forming devices 321, the upper film of the double-layer film is driven by the upper wheel set 3221, the lower film is driven by the lower wheel set 3222, the upper film and the lower film are respectively covered on the front surface and the back surface of the silicon wafer, the silicon wafer continuously moves in the plastic packaging conveying line 31 until the film is completed, the film is cut off by the film coating cutter 324, then the silicon wafer enters the oven 33 to realize the packaging operation of the silicon wafer, after packaging is completed, the silicon wafer is conveyed to the position of the labeling structure 42 through the blanking conveying line 41, at the moment, the labeling block 423 is driven by the labeling device 422 to be close to the silicon wafer for labeling the surface of the silicon wafer.
Example two
As shown in fig. 8, the embodiment discloses a packaging method of a silicon wafer packaging device, which is matched with the silicon wafer packaging device to package a silicon wafer, and specifically comprises the following steps:
s1, placing a silicon wafer on a regulation carrying platform 11, regulating the two ends and the two sides of the silicon wafer by a first regulation structure 12 and a second regulation structure 13 to enable the silicon wafer to be in a standard state to be processed, enabling the silicon wafer to be in a stacked irregular state in an initial state, and regulating the silicon wafer from four directions of the silicon wafer by the first regulation structure 12 and the second regulation structure 13 to enable the silicon wafer to be in the standard state after being regulated;
s2, the transfer robot 50 transfers the regular silicon wafers to the paper pasting conveying line 21, the paper pasting module 22 drives the paper pasting sucker 23 to adsorb paper pasting, the paper pasting is placed on the front side and the back side of the silicon wafers, the number of the paper pasting sucker 23 is two, and the two paper pasting suckers can be used alternately, so that the paper pasting treatment is carried out on the front side and the back side of the silicon wafers more quickly, and the efficiency is improved;
s3, a silicon wafer is conveyed to a plastic package conveying line 31 by a paper pasting conveying line 21, a double-layer film on a material roller 34 is stretched by two moulders 321, an upper film of the double-layer film is driven by an upper wheel set 3221, a lower film is driven by a lower wheel set 3222, the films are respectively coated on the front surface and the back surface of the silicon wafer, and under the driving action of a film coating motor 3231, the upper wheel set 3221 and the lower wheel set 3222 synchronously drive, so that synchronous operation of film coating on the front surface and the back surface of the silicon wafer is realized, and the film coating efficiency is improved while the structural stability of the silicon wafer is ensured;
s4, cutting off the film by a film covering cutter 324, conveying the film-cut silicon wafer into an oven 33 by a plastic packaging conveying line 31, packaging the silicon wafer, and conveying the silicon wafer out by the plastic packaging conveying line 31 after the silicon wafer is placed in the oven 33 for a period of time;
s5, the packaged silicon wafer is conveyed to a labeling structure 42 through a blanking conveying line 41, a labeling block 423 of the labeling structure 42 adsorbs labels, the labels are attached to the surface of the silicon wafer through a labeler 422, and labeling treatment of the silicon wafer is completed.
In summary, the invention can carry out packaging treatment on silicon wafers with different specifications without manual direct packaging operation, greatly improves the packaging efficiency of the silicon wafers, effectively avoids the situations of mixing, fragments, omission and pollution of the silicon wafers, ensures the packaging quality and packaging efficiency of the silicon wafers, and the film coating structure 32 can carry out semi-plastic packaging treatment on the silicon wafers, improves the plastic packaging efficiency, is beneficial to subsequent disassembly treatment of the silicon wafers, and reduces the subsequent disassembly fragment rate of the silicon wafers.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.

Claims (10)

1. The silicon wafer packaging equipment is characterized by comprising a frame (100), and a feeding regulation assembly (10), a paper pasting assembly (20), a plastic packaging assembly (30) and a labeling blanking assembly (40) which are sequentially arranged along the length direction of the frame (100), wherein a connecting structure is arranged between adjacent assemblies;
the feeding normalization component (10) normalizes the silicon wafer;
the dust-free paper is attached to the front side and the back side of the silicon wafer by the paper attaching assembly (20);
the plastic package assembly (30) comprises a plastic package conveying line (31) and a film covering structure (32) and an oven (33) which are sequentially arranged along the conveying direction of the plastic package conveying line (31), one side of the plastic package conveying line (31) is provided with a material roller (34), a double-layer film is wound on the material roller (34), the film covering structure (32) comprises two formers (321) and a driving wheel group (322), a plastic package channel is formed between the two formers (321), the plastic package conveying line (31) penetrates through the plastic package channel, the formers (321) are triangular structures, the double-layer film is pulled by the driving wheel group (322) after being stretched by the two formers (321), the double-layer film enters the plastic package channel through the bevel edge of the formers (321) to cover a silicon wafer, and the oven (33) heat-seals the silicon wafer after being covered;
the labeling blanking assembly (40) comprises a blanking conveying line (41) and a labeling structure (42), and the blanking conveying line (41) conveys silicon wafers to the labeling structure (42) to finish labeling.
2. The silicon wafer packaging device according to claim 1, wherein the feeding regulation component (10) is arranged on the frame (100), the feeding regulation component (10) comprises a regulation carrying platform (11), a first regulation structure (12) and a second regulation structure (13), the first regulation structure (12) is used for regulating the silicon wafer along the length direction of the regulation carrying platform (11), and the second regulation structure (13) is used for regulating the silicon wafer along the width direction of the regulation carrying platform (11).
3. The silicon wafer packaging device according to claim 2, wherein the first regular structure (12) comprises a first regular cylinder (121) and first regular plates (122) driven by the first regular cylinder (121), the number of the first regular plates (122) is two and located at two ends of the regular carrier (11), the second regular structure (13) comprises a second regular cylinder (131) and second regular plates (132) driven by the second regular cylinder (131), the number of the second regular plates (132) is two and located at two sides of the regular carrier (11), the first regular plates (122) are connected with the first regular cylinder (121) through a connecting rod group (14), the second regular plates (132) are connected with the second regular cylinders (131) through another connecting rod group (14), and the first regular plates (122) and the second regular plates (132) are provided with air suction holes (15) and the air suction holes (15) respectively.
4. A silicon wafer packaging device according to claim 3, wherein the regular carrier (11) is an i-shaped structure, regular grooves are formed in the regular carrier (11), and the first regular plate (122) and the second regular plate (132) are respectively matched with the regular grooves to perform regular operation on the silicon wafer.
5. The silicon wafer packaging device according to claim 1, wherein a transfer robot (50) is arranged between the paper pasting component (20) and the feeding regulating component (10), the paper pasting component (20) comprises a paper pasting conveying line (21), a paper pasting module (22) and paper pasting sucking discs (23), and the number of the paper pasting sucking discs (23) is two and moves along the driving direction of the paper pasting module (22).
6. The silicon wafer packaging device according to claim 1, wherein the film coating structure (32) further comprises a film coating support (323) and a film coating cutter (324), a film coating motor (3231) is arranged on the film coating support (323), the driving wheel set (322) is connected with the film coating motor (3231) through a synchronous belt wheel set (35), and the film coating cutter (324) is located at the tail end of the former (321) and is used for cutting a film coated silicon wafer.
7. The silicon wafer packaging device according to claim 6, wherein the driving wheel set (322) comprises an upper wheel set (3221) and a lower wheel set (3222), the synchronous belt wheel set (35) comprises a plurality of synchronous pulleys, the synchronous pulleys drive the upper wheel set (3221) to rotate, and the synchronous pulleys drive the lower wheel set (3222) to rotate, and the upper wheel set (3221) and the lower wheel set (3222) respectively drive the upper film and the lower film of the double-layer film to drive the upper film and the lower film of the double-layer film along the same direction.
8. The silicon wafer packaging device according to claim 6, wherein an adjusting handle (3232) is arranged on the film coating bracket (323), an adjusting screw (3233) is arranged on the adjusting handle (3232), and the adjusting screw (3233) is in threaded connection with one of the formers (321) so as to adjust the interval between the two formers (321).
9. The silicon wafer packaging device according to claim 1, wherein the labeling structure (42) comprises a printer (421), a labeler (422) and a labeling block (423) located at the driving end of the labeler (422), a label sucking hole (4231) for sucking a label is formed in the labeling block (423), and after the labeling block (423) sucks the label, the labeler (422) drives the labeling block (423) to adhere the label to the silicon wafer.
10. A packaging method of a silicon wafer packaging device, applied to the silicon wafer packaging device according to any one of claims 1 to 9, characterized by comprising the steps of:
s1, placing a silicon wafer on a normalization carrier (11), and normalizing two ends and two sides of the silicon wafer by a first normalization structure (12) and a second normalization structure (13) to enable the silicon wafer to be in a standard state to be processed;
s2, a transfer robot (50) transfers the regular silicon wafers to a decal conveying line (21), a decal module (22) drives a decal sucker (23) to adsorb decals, and the decals are placed on the front side and the back side of the silicon wafers;
s3, conveying the silicon wafer to a plastic package conveying line (31) by a paper pasting conveying line (21), stretching a double-layer film on a material roller (34) by two formers (321), driving an upper film of the double-layer film by an upper wheel set (3221), driving a lower film by a lower wheel set (3222), and respectively coating films on the front side and the back side of the silicon wafer;
s4, cutting off the film by a film coating cutter (324), and conveying the film-cut silicon wafer into an oven (33) by a plastic package conveying line (31) for packaging the silicon wafer;
s5, conveying the packaged silicon wafer to a labeling structure (42) through a blanking conveying line (41), adsorbing the label by a labeling block (423) of the labeling structure (42), and attaching the label to the surface of the silicon wafer by a labeler (422) to finish labeling treatment of the silicon wafer.
CN202311462550.0A 2023-11-06 2023-11-06 Silicon chip packaging equipment and packaging method thereof Pending CN117637905A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311462550.0A CN117637905A (en) 2023-11-06 2023-11-06 Silicon chip packaging equipment and packaging method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311462550.0A CN117637905A (en) 2023-11-06 2023-11-06 Silicon chip packaging equipment and packaging method thereof

Publications (1)

Publication Number Publication Date
CN117637905A true CN117637905A (en) 2024-03-01

Family

ID=90027879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311462550.0A Pending CN117637905A (en) 2023-11-06 2023-11-06 Silicon chip packaging equipment and packaging method thereof

Country Status (1)

Country Link
CN (1) CN117637905A (en)

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