CN117589594A - Semiconductor material bending testing equipment - Google Patents

Abstract

The invention discloses semiconductor material bending test equipment which comprises a base, a connecting frame arranged on the upper part of the base, a pressing component for applying midpoint bending to detect downward pressure, a counter adjusting component for supporting and counter adjusting supporting points, a detection supporting mechanism suitable for supporting different semiconductor materials and a display component for displaying pressure values. The invention belongs to the technical field of test equipment, and particularly relates to semiconductor material bending test equipment which is suitable for thicker semiconductor material devices and semiconductor thin sheets according to a bending test method during a semiconductor period, so that the device meets the two-point and four-point bending test of the semiconductor devices.

Description

Semiconductor material bending testing equipment

Technical field

The invention belongs to the technical field of testing equipment, and in particular relates to a semiconductor material bending testing equipment.

Background technique

Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. The core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors.

Some existing semiconductor material bending testing equipment can only perform bending tests on semiconductor materials of individual shapes. Even if they can be applied to semiconductor materials of different shapes, the bending testing equipment has a complex structure and poor versatility.

Contents of the invention

In response to the above situation, in order to overcome the shortcomings of the prior art, the present invention provides a semiconductor material bending test equipment. According to the bending test method during the semiconductor period, the device can meet the two-point and four-point bending tests of semiconductor devices, and is also suitable for thicker materials. Semiconductor material devices and semiconductor wafers.

The technical solution adopted by the present invention is as follows: a semiconductor material bending test equipment, including a base and a connection frame arranged on the upper part of the base, and also includes a pressing component for applying midpoint bending detection pressure, and a supporting point position for supporting and opposing adjustment. The opposing adjustment component, the detection support mechanism suitable for supporting different semiconductor materials, and the display component for displaying the pressure value. The pressing component is located in the middle of the connection frame, and the opposing adjustment component is located between the opposite inner walls of the base. The detection support mechanism is located on the upper part of the opposing adjustment component and is located in the base. The detection support mechanism is symmetrically arranged, and the display component is hingedly located in the middle of the outer side wall of the base;

The opposing adjustment assembly includes an opposing screw, a sliding rod, a sliding plate and an adjusting handle. The opposing screw is rotatably located in the middle of the opposite inner wall of the base. One end of the opposing screw extends through the side wall of the base to the outside of the base. , the adjustment handle is located at one end of the opposing screw rod extending out of the base, the sliding rod is located on both sides of the opposite inner wall of the base, the sliding rod is symmetrically arranged with the opposing screw rod as the center, and the sliding plate runs through the sliding rod Set on the opposing screw, the sliding plate is threadedly connected to the opposing screw, and the sliding plate is arranged symmetrically.

Further, the detection support mechanism includes a pressure sensor one, a stud, a connecting ring, a support plate and a pressure sensor two. The pressure sensor one is located in the middle of the upper part of the slide plate, and the stud is threadedly connected to the center of the upper end face of the pressure sensor. At , the connecting ring is threadedly connected to the outer side wall of the upper end of the stud, and the supporting plates are provided on both sides of the upper end surface of the connecting ring. The supporting plates are bent and arranged symmetrically with the connecting ring as the center. The second pressure sensor is located at the upper bend of the support plate.

Further, the pressing assembly includes a pressing rod, a pressing plate and a pressing handle. One end of the pressing rod runs through the middle of the connecting frame and is located at the bottom of the connecting frame. The pressing rod is threadedly connected to the connecting frame. The pressing handle is located on the pressing At the upper end of the rod, the pressing plate is rotatably located at the bottom of the pressing rod, and the pressing plate is arranged in an inverted V shape.

Further, the display assembly includes a display housing, a display screen and a PCB control board. The display housing is rotatably located in the middle of the side wall of the base away from the adjustment handle. The PCB control board is located in the display housing. The display screen is arranged on the upper part of the display housing, and the display screens are arranged at equal intervals. The display screen is electrically connected to the PCB control board, and the pressure sensor one and the pressure sensor two are electrically connected to the PCB control board respectively.

After adopting the above structure, the beneficial effects of the present invention are as follows: The semiconductor material bending test equipment proposed by the present invention has a simple structure and is easy to use. According to the bending test of the semiconductor material, the bottom of the semiconductor material can be supported by two or four points of pressure. For monitoring, apply downward pressing force to the midpoint of the semiconductor material, and use the display screen connected to each pressure sensor one and pressure sensor two to observe the pressure value of each monitoring point when the semiconductor material deforms.

Description of drawings

The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

Figure 1 is a schematic diagram of the overall structure of a semiconductor material bending testing equipment proposed by the present invention;

Figure 2 is a schematic structural diagram of a detection support mechanism of a semiconductor material bending testing equipment proposed by the present invention;

Figure 3 is a front view of a semiconductor material bending testing equipment proposed by the present invention.

In the drawings: 1. Base, 2. Connection frame, 3. Pressing component, 4. Opposing adjustment component, 5. Detection support mechanism, 6. Display component, 7. Opposing screw, 8. Slide rod, 9. Skateboard, 10. Adjustment handle, 11. Pressure sensor one, 12. Stud, 13. Connecting ring, 14. Support plate, 15. Pressure sensor two, 16. Pressing rod, 17. Pressing plate, 18. Pressing handle, 19 , display housing, 20. display screen, 21. PCB control board.

Detailed ways

As shown in Figures 1 and 2, a semiconductor material bending test equipment includes a base 1 and a connection frame 2 arranged on the upper part of the base 1. It also includes a pressing component 3 for applying pressure under mid-point bending detection, and a pressure component 3 for supporting and The counter-adjusting component 4 for counter-adjusting the support point position, the detection support mechanism 5 suitable for supporting different semiconductor materials, and the display component 6 for displaying the pressure value. The pressing component 3 is located in the middle of the connection frame 2. The counter-adjusting component 4 is located between the opposite inner walls of the base 1. The detection support mechanism 5 is located on the upper part of the opposite adjustment component 4 and is located in the base 1. The detection support mechanism 5 is arranged symmetrically. The display component 6 is hingedly located in the middle of the outer side wall of the base 1. , the detection support mechanism 5 supports the semiconductor material at multiple points in two ways, uses the pressing component 3 to adjust the downward force, and applies it to the midpoint of the semiconductor material, and realizes the bending of the semiconductor material by reading the value of the pressure sensor at each point of the display component 6 test.

As shown in Figures 1 and 3, in order to make the device suitable for semiconductor materials of different lengths and sizes, and to achieve bending strength testing at different support points, the opposing adjustment component 4 includes an opposing screw 7, a sliding rod 8, and a sliding plate 9 and the adjusting handle 10. The opposing screw rod 7 is rotatably located in the middle of the opposite inner wall of the base 1. One end of the opposing screw rod 7 extends through the side wall of the base 1 to the outside of the base 1. The adjusting handle 10 is provided on the opposing screw rod 7 and extends out of the base. At one end of 1, sliding rods 8 are located on both sides of the opposite inner wall of the base 1. The sliding rods 8 are arranged symmetrically with the opposing screw rod 7 as the center. The sliding rod 9 penetrates the sliding rod 8 and is located on the opposing screw rod 7. The sliding rod 9 is connected to the opposing screw rod 7. The screw rod 7 is threaded, and the slide plate 9 is symmetrically arranged. The outer walls of the two ends of the counter screw rod 7 have opposite positive and negative threads. Turn the adjustment handle 10 to make the symmetrical slide plate 9 rotate on the counter screw rod 7. The two ends of 7 move in opposite directions, and the sliding bars 8 on both sides increase the stability of the sliding plate 9 when it moves and increase the support strength of the sliding plate 9 .

As shown in Figures 1 and 2, in order to support and test semiconductor materials at different support points, the detection support mechanism 5 includes a pressure sensor 11, a stud 12, a connecting ring 13, a support plate 14 and a pressure sensor 2 15. The pressure sensor 11 is located in the middle of the upper part of the slide plate 9, the stud 12 is threadedly connected to the center of the upper end of the pressure sensor, the connecting ring 13 is threaded to the outer side wall of the upper end of the stud 12, and the support plate 14 is located on both sides of the upper end of the connecting ring 13 , the support plate 14 is arranged in a bent manner, the support plate 14 is arranged symmetrically with the connecting ring 13 as the center, the pressure sensor 15 is arranged at the bending part of the upper end of the support plate 14, the pressure sensor 11 is directly used to detect the symmetrical pressing plate 17 It is suitable for thicker semiconductor materials to achieve two-point support testing. The pressure sensor 2 15 connected to one end of the support plate 14 that is laterally bent is suitable for thin sheet pressure sensors to achieve four-point support testing.

As shown in Figures 1 and 2, in order to achieve an adjustable pressing force on the midpoint of the semiconductor material, the pressing assembly 3 includes a pressing rod 16, a pressing plate 17 and a pressing handle 18. One end of the pressing rod 16 runs through the middle of the connection frame 2. At the bottom of the connection frame 2, the pressing rod 16 is threadedly connected to the connecting frame 2. The pressing handle 18 is provided at the upper end of the pressing rod 16. The pressing plate 17 is rotatably provided at the bottom of the pressing rod 16. The pressing plate 17 is arranged in an inverted V shape. The pressing plate 17 The semiconductor material is positioned with the symmetrical support plate 14, and the pressing handle 18 is rotated to move the screw up and down in the middle of the connecting frame 2 to realize the downward pressure of the pressing plate 17 and exert downward pressure on the middle of the semiconductor material.

As shown in Figures 2 and 3, in order to facilitate reading the values monitored by each pressure sensor 11 and pressure sensor 2 15, the display assembly 6 includes a display housing 19, a display screen 20 and a PCB control board 21. The display housing 19 It is rotatably installed in the middle of the side wall of the base 1 away from the adjustment handle 10. The PCB control board 21 is installed in the display housing 19, and the display screen 20 is installed in the upper part of the display housing 19. The display screens 20 are arranged in equal intervals. The screen 20 is electrically connected to the PCB control board 21. The pressure sensor one 11 and the pressure sensor two 15 are electrically linked to the PCB control board 21 respectively. The display screen 20 is electrically connected to each of the pressure sensor one 11 and the pressure sensor two 15 through the PCB control board 21. The pressure value of each support point when bending is realized.

During specific use, the operator turns the adjustment handle 10 and adjusts the position of the symmetrical sliding plate 9 on the opposing screw 7 so that the semiconductor material is placed on the symmetrical support plates 14. Semiconductor materials of different sizes or shapes can be placed. Between the symmetrical support plates 14, the pressure sensor 11 can be used for testing. It can also be placed at the transverse bend of the support plate 14, and each support point can be tested through the pressure sensor 215. Turn the pressing handle 18 to lower the pressing plate 17. Press, so that the downward force acts on the midpoint of the semiconductor material. Finally, when the semiconductor is bent, the pressure value is read through the display screen 20 .

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art will understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principles and spirit of the invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents. In short, if a person of ordinary skill in the art is inspired by the invention and without departing from the spirit of the invention, can devise structural methods and embodiments similar to the technical solution without inventiveness, they shall all fall within the protection scope of the invention.

Claims (4)

1. The utility model provides a semiconductor material bending test equipment, includes base and the connecting frame of setting on base upper portion, its characterized in that: the device comprises a base, a connecting frame, a pressing assembly, a counter regulating assembly, a detection supporting mechanism and a display assembly, wherein the pressing assembly is used for applying midpoint bending to detect downward pressure, the counter regulating assembly is used for supporting and counter regulating supporting points, the detection supporting mechanism is suitable for supporting different semiconductor materials, the display assembly is used for displaying pressure values, the pressing assembly is arranged in the middle of the connecting frame, the counter regulating assembly is arranged between opposite inner side walls of the base, the detection supporting mechanism is arranged on the upper part of the counter regulating assembly and in the base, the detection supporting mechanism is symmetrically arranged, and the display assembly is hinged in the middle of the outer side wall of the base;

the opposite direction adjusting assembly comprises an opposite direction screw rod, a sliding plate and an adjusting handle, wherein the opposite direction screw rod is rotatably arranged in the middle of the opposite inner side wall of the base, one end of the opposite direction screw rod penetrates through the side wall of the base and extends to the outer side of the base, the adjusting handle is arranged at one end of the opposite direction screw rod, which extends out of the base, the sliding rod is arranged at two sides of the opposite inner side wall of the base, the sliding rod is symmetrically arranged with the opposite direction screw rod as a center, the sliding plate penetrates through the sliding rod and is arranged on the opposite direction screw rod, the sliding plate is in threaded connection with the opposite direction screw rod, and the sliding plate is symmetrically arranged.

2. A semiconductor material bending test apparatus according to claim 1, wherein: the detection supporting mechanism comprises a first pressure sensor, a stud, a connecting ring, a supporting plate and a second pressure sensor, wherein the first pressure sensor is arranged in the middle of the upper portion of the sliding plate, the stud is in threaded connection with the center of the upper end face of the pressure sensor, the connecting ring is in threaded connection with the outer side wall of the upper end of the stud, the supporting plate is arranged on two sides of the upper end face of the connecting ring, the supporting plate is arranged in a bending mode, the supporting plate is symmetrically arranged with the connecting ring as the center, and the second pressure sensor is arranged at the bending position of the upper end of the supporting plate.

3. A semiconductor material bending test apparatus according to claim 1, wherein: the pressing assembly comprises a pressing rod, a pressing plate and a pressing handle, wherein one end of the pressing rod penetrates through the middle of the connecting frame to be arranged at the bottom of the connecting frame, the pressing rod is in threaded connection with the connecting frame, the pressing handle is arranged at the upper end of the pressing rod, the pressing plate is rotatably arranged at the bottom of the pressing rod, and the pressing plate is in inverted V-shaped arrangement.

4. A semiconductor material bending test apparatus according to claim 1, wherein: the display assembly comprises a display shell, a display screen and a PCB control board, wherein the display shell is rotatably arranged in the middle of the side wall of one side of the base, which is far away from the adjusting handle, the PCB control board is arranged in the display shell, the display screen is arranged on the upper part of the display shell and is arranged at equal intervals, the display screen is electrically connected with the PCB control board, and the first pressure sensor and the second pressure sensor are electrically connected with the PCB control board respectively.