CN117565622A

CN117565622A - Thermal management integrated component, system and vehicle

Info

Publication number: CN117565622A
Application number: CN202311641655.2A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-11-30
Filing date: 2023-11-30
Publication date: 2024-02-20

Abstract

A thermal management integrated component, a system, and a vehicle, the thermal management integrated component comprising a waterway substrate and a coolant frame; the waterway substrate comprises a first layer and a second layer, the second layer is stacked on the first layer, and the area of the second layer is smaller than that of the first layer; the first layer and the second layer are respectively provided with a cooling liquid runner; the refrigerant frame comprises a first area and a second area; a refrigerant module is arranged in the first area, and a refrigerant flow passage is arranged in the refrigerant module; the second area is a hollowed-out area; the waterway substrate and the refrigerant frame are integrated together, the second layer is embedded into the second area, and the first area is embedded into a concave section formed between the second layer and the first layer. By adopting the scheme, the volume of the integrated module of the thermal management system can be reduced.

Description

Thermal management integrated component, system and vehicle

Technical Field

The present application relates to the field of thermal management technology, and in particular, to a thermal management integrated component, system, and vehicle.

Background

With the continuous development of vehicles, in order to improve the production assembly efficiency, the quality control is convenient, the space occupied by the thermal management system is reduced, and the integration of the whole vehicle thermal management system is called as a trend. However, the current implementation of the integrated module of the thermal management system has a large volume, occupies a large space, and reduces the overall volume of the integrated module of the thermal management system.

Disclosure of Invention

The application provides a thermal management integrated component, a system and a vehicle, which can reduce the volume of a thermal management system integrated module.

In a first aspect, the present application provides a thermal management integrated component comprising a waterway substrate and a coolant frame;

the waterway substrate comprises a first layer and a second layer, wherein the second layer is stacked on the first layer, and the area of the second layer is smaller than that of the first layer; a cooling liquid flow passage is arranged in each of the first layer and the second layer;

the refrigerant frame comprises a first area and a second area; a refrigerant module is arranged in the first area, and a refrigerant flow passage is arranged in the refrigerant module; the second area is a hollowed-out area;

the water channel substrate and the refrigerant frame are integrated, the second layer is embedded in the second area, and the first area is embedded in a concave section formed between the second layer and the first layer.

In the above scheme, on the one hand, the setting mode that waterway base plate and refrigerant frame are nested through arch and fretwork for waterway base plate and refrigerant frame integrated whole thickness that is in the same place reduces, and then reduces the whole thickness of thermal management integrated component, reduces the volume. On the other hand, the waterway substrate is designed into two layers, and the cooling liquid flow channels are also arranged in the second layer to meet the layout requirement of the cooling liquid flow channels, so that the situation that the area of the first layer is overlarge due to the fact that all flow channels are arranged in the first layer is avoided, namely the length or the width of the first layer is reduced. In addition, the high-pressure-resistant refrigerant flow channel is concentrated to the refrigerant module with a smaller area, so that the use of high-pressure-resistant metal materials can be reduced, the weight is reduced, and meanwhile, the material consumption and the manufacturing cost are saved.

In a possible embodiment, the area ratio of the second layer to the first layer is between 40% and 60%.

In the above scheme, in the area proportion interval, the cost of the waterway substrate can be reduced to the greatest extent, and the quantity of the cooling liquid flow channels meeting the requirements can be arranged in the waterway substrate, namely, the cost and the function are considered.

In one possible embodiment, the area of the second region is larger than the area of the second layer, and the ratio of the area of the second region to the area of the refrigerant frame is between 50% and 70%.

In the above scheme, in the area proportion interval, the cost of the refrigerant frame can be reduced to the greatest extent, the area of the refrigerant module is ensured, and the number of the refrigerant flow channels meeting the requirements is arranged, namely, the cost and the function are considered.

In one possible embodiment, the area ratio of the refrigerant module to the refrigerant frame is between 30% and 50%.

In the scheme, the area ratio of the refrigerant module to the refrigerant frame is within the area ratio range, so that the cost of the refrigerant module can be reduced to the greatest extent, the number of the refrigerant channels meeting the requirements can be ensured in the refrigerant module, and the cost and the function are both considered.

In one possible embodiment, a ratio of a thickness of the refrigerant module to a thickness of the refrigerant frame is between 50% and 100%.

In the scheme, the thickness ratio of the refrigerant module to the refrigerant frame is within the thickness ratio range, so that the material cost of the refrigerant module can be reduced to the greatest extent, the size of the cross section of the refrigerant flow channel arranged in the refrigerant module is guaranteed to meet the flow requirement, and the cost and the function are both considered.

In one possible embodiment, the refrigerant module is manufactured by forging, and the portion of the refrigerant frame other than the refrigerant module is manufactured by die casting or sheet metal.

In the scheme, the refrigerant module is forged to bear the circulation of high-pressure refrigerant, and the frame of the refrigerant frame is made by adopting a die casting or sheet metal making method, so that the making cost can be reduced.

In one possible implementation manner, the refrigerant module is provided with a first refrigerant flow passage interface; the refrigerant frame is also provided with first heat exchange equipment;

the first heat exchange equipment comprises a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is positioned at a first side of the first heat exchange device, and the first refrigerant outlet is positioned at a second side which is away from the first side of the first heat exchange device;

The first refrigerant inlet is used for being communicated with the compressor; the first refrigerant outlet is in butt joint communication with the first refrigerant flow passage interface.

In the above scheme, the refrigerant inlet of the first heat exchange device is used for being connected with the compressor, and the compressor is not integrated on the refrigerant module, so that the refrigerant inlet of the first heat exchange device is not connected with the refrigerant flow passage interface of the refrigerant module, but is designed on the other side to be convenient to be connected with the compressor, thereby the refrigerant module is not required to be provided with a flow passage for communicating the refrigerant outlet of the compressor with the refrigerant inlet of the first heat exchange device, the area of the refrigerant module is further reduced, and the cost is reduced.

In a possible embodiment, the aforementioned first heat exchange device comprises a first cooling liquid inlet and a first cooling liquid outlet; the first cooling liquid inlet and the first cooling liquid outlet are positioned on the second side of the first heat exchange device;

a first cooling liquid flow passage interface and a second cooling liquid flow passage interface are arranged on the waterway substrate, and the second area comprises a first hollowed-out area;

the first cooling liquid flow passage interface passes through the first hollowed-out area and is in butt joint communication with the first cooling liquid inlet;

the second cooling liquid flow passage interface passes through the first hollowed-out area and is in butt joint communication with the first cooling liquid outlet, or the second cooling liquid flow passage interface passes through a through hole on the plate-shaped area and is in butt joint communication with the first cooling liquid outlet.

In the scheme, the cooling liquid flow passage interface of the substrate passes through the hollowed-out area of the cooling medium frame to be directly in butt joint communication with the cooling liquid inlet and outlet of the first heat exchange equipment, and the cooling medium flow passage interface of the cooling medium module is directly in butt joint communication with the cooling medium outlet of the first heat exchange equipment, so that a pipeline or other flow passage switching is not needed, a switching sealing interface is reduced, and flow resistance caused by pipeline switching is reduced.

In one possible implementation manner, a second refrigerant flow passage interface is arranged in the refrigerant module; the refrigerant frame is also used for fixing second heat exchange equipment;

the second heat exchange device comprises a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is positioned at a first side of the second heat exchange device, and the second refrigerant outlet is positioned at a second side which is away from the first side of the second heat exchange device;

the second refrigerant inlet is in butt joint communication with the second refrigerant flow passage interface; the second refrigerant outlet is used for communicating with the compressor.

In the above scheme, the refrigerant outlet of the second heat exchange device is used for being connected with the compressor, and the compressor is not integrated on the refrigerant module, so that the refrigerant outlet of the second heat exchange device is not connected with the refrigerant flow passage interface of the refrigerant module, but is designed on the other side to be convenient to be connected with the compressor, thereby the refrigerant module is not required to be provided with a flow passage for communicating the refrigerant inlet of the compressor with the refrigerant outlet of the second heat exchange device, the area of the refrigerant module is further reduced, and the cost is reduced.

In a possible embodiment, the aforementioned second heat exchange device comprises a second cooling liquid inlet and a second cooling liquid outlet; the second cooling liquid inlet and the second cooling liquid outlet are positioned on the first side of the second heat exchange device;

a third cooling liquid flow passage interface and a fourth cooling liquid flow passage interface are arranged on the waterway substrate, and the second area comprises a second hollowed-out area;

the third cooling liquid flow passage interface passes through the second hollowed-out area to be in butt joint communication with the second cooling liquid inlet, and the fourth cooling liquid flow passage interface passes through the first area to be in butt joint communication with the first cooling liquid outlet.

In the scheme, the cooling liquid flow passage interface of the substrate passes through the hollowed-out area of the cooling medium frame to be directly in butt joint communication with the cooling liquid inlet and outlet of the second heat exchange equipment, and the cooling medium flow passage interface of the cooling medium module is directly in butt joint communication with the cooling medium outlet of the second heat exchange equipment, so that a pipeline or other flow passage switching is not needed, a switching sealing interface is reduced, and flow resistance caused by pipeline switching is reduced.

In one possible implementation manner, a third refrigerant flow passage interface and a fourth refrigerant flow passage interface are arranged in the refrigerant module; the refrigerant container is integrated on the refrigerant module and is communicated with the refrigerant flow passage in the refrigerant module through the third refrigerant flow passage interface and the fourth refrigerant flow passage interface.

In the scheme, the refrigerant container can be integrated on the refrigerant module, so that the integration level is improved, and the refrigerant transmission path can be reduced.

In one possible embodiment, the refrigerant container includes a first side and a second side, and the first side of the refrigerant container faces opposite to the second side of the refrigerant container;

a third refrigerant inlet and a third refrigerant outlet are arranged on the first side of the refrigerant container, the third refrigerant inlet is in butt joint communication with the third refrigerant flow passage interface in the refrigerant module, and the third refrigerant outlet is in butt joint communication with the fourth refrigerant flow passage interface in the refrigerant module;

the second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or,

the direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

In the scheme, the tank body of the refrigerant container is perpendicular to the refrigerant module, so that the influence on a refrigerant loop caused by incapability of normally providing the refrigerant when the refrigerant in the tank body is less can be reduced, and on the other hand, the tank body is perpendicular to the refrigerant module, and the capacity of the refrigerant can be increased by replacing a longer tank body. In addition, the tank body of the refrigerant container can be placed in parallel with the refrigerant module, and the arrangement is flexible.

In one possible embodiment, a fifth refrigerant flow port is provided in the refrigerant module;

the expansion valve is integrated on the refrigerant module and is communicated with a refrigerant flow passage in the refrigerant module through the fifth refrigerant flow passage interface.

In the scheme, the expansion valve can be integrated on the refrigerant module, so that the integration level is improved.

In one possible embodiment, the refrigerant frame is disposed on a first side of the waterway substrate, and a second side of the waterway substrate faces opposite to the first side of the waterway substrate;

and the multi-way valve, the first water pump, the second water pump and the third water pump are sequentially arranged along the direction of the longer side of the second side of the waterway substrate.

In the scheme, the multi-way valve and the water pump are communicated with the cooling liquid flow channels in the substrate, so that the arrangement of the cooling liquid flow channels in the substrate can be optimized, the staggering of the flow channels is reduced, more flow channels are distributed by utilizing the area of the substrate as much as possible, and the utilization rate of the substrate is improved.

In a second aspect, the present application provides a thermal management system comprising a thermal management integrated component as defined in any one of the first aspects above.

In a third aspect, the present application provides a vehicle comprising a thermal management integrated component as described in any one of the first aspects above, or the vehicle comprises a thermal management system as described in the second aspect above.

Drawings

FIGS. 1 to 9 are schematic structural views of a thermal management integrated component according to an embodiment of the present application;

FIGS. 9A, 10 and 10A are schematic structural views of a thermal management integrated component according to an embodiment of the present application;

FIGS. 11 and 12 are schematic structural views of a thermal management integrated component according to an embodiment of the present application;

fig. 13 to 16 are schematic diagrams of layout positional relationships provided in the embodiments of the present application;

FIG. 17 is a schematic diagram of a thermal management system according to an embodiment of the present disclosure;

fig. 18 is a schematic structural diagram of a vehicle according to an embodiment of the present application.

Reference numerals:

00-thermal management integrated component; 01 to 30-interface; 100-waterway base plate; 101-a first layer of a substrate; 102-a second layer of the substrate; 1021-a first sub-layer of a second layer of the substrate; 1022—a second sub-layer of the second layer of the substrate; 200-refrigerant frame; 201—a first region of the refrigerant frame 200; 202-a second region of the refrigerant frame 200; 110-a multi-way valve 110;111 (including 1111, 1112, and 1113) -a water pump; 120-refrigerant module; 121-a first heat exchange device; 122-a second heat exchange device; 123-refrigerant container; 124-expansion valve.

Detailed Description

In the embodiments of the present application, "plurality" means two or more. In the embodiment of the present application, "and/or" is used to describe the association relationship of the association object, and represents three relationships that may exist independently, for example, a and/or B may represent: a alone, B alone, or both a and B. Descriptions such as "at least one (or at least one) of a1, a2, … …, and an" used in the embodiments of the present application include a case where any one of a1, a2, … …, and an exists alone, and also include a case where any combination of any plurality of a1, a2, … …, and an exists alone; for example, the description of "at least one of a, b, and c" includes the case of a alone, b alone, c alone, a and b in combination, a and c in combination, b and c in combination, or abc in combination.

The terms "first," "second," and the like in this application are used to distinguish between identical or similar items that have substantially the same function and function, and it should be understood that there is no logical or chronological dependency between the "first," "second," and "nth" terms, nor is it limited to the number or order of execution. It will be further understood that, although the following description uses the terms first, second, etc. to describe various elements, these elements should not be limited by the terms. These terms are only used to distinguish one element from another element.

In the various embodiments of the application, where no special description or logic conflict exists, the terms and/or descriptions between the various embodiments are consistent and may reference each other, and features of different embodiments may be combined to form new embodiments based on their inherent logic relationships.

The thermal management integrated component and thermal management system provided by embodiments of the present application, including the thermal management integrated component, are suitable for use in vehicles, as well as in thermal management scenarios where other cooling (heat dissipation) and/or heating requirements are desired. The thermal management integrated component and the thermal management system provided by the embodiment of the application can be applied to an electric automobile. Specifically, the electric automobile is a vehicle suitable for driving by an electric driver. The electric vehicle may be a pure electric vehicle (pure electric vehicle/battery electric vehicle, pure EV/battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), an extended range electric vehicle (range extended electric vehicle, REEV), a plug-in hybrid electric vehicle (plug-in hybrid electric vehicle, PHEV), or a new energy vehicle (new energy vehicle, NEV), etc.

The thermal management system of the embodiment of the application can heat or dissipate heat of the management object by using water. In some possible implementations, the management object may be a passenger compartment, a battery, an electric drive, a control system, and so forth. In this application, water is used to transfer thermal energy. In some possible implementations, the thermal management system of the present application is also capable of heating or dissipating heat from a management object using a cooling fluid such as water and a refrigerant (refrigerants). Wherein, the refrigerant can make heat transfer through evaporation and condensation. It should be appreciated that water may be replaced with other cooling fluids for transferring thermal energy, as embodiments of the present application are not specifically limited.

The volume of the integrated module of the current thermal management system is large, so that the integrated volume of the thermal management system can be reduced, and the occupied space is reduced. Embodiments of the present application provide a thermal management integrated component 00. The heat management integrated part 00 includes a waterway substrate 100 and a refrigerant frame 200;

the waterway substrate 100 includes a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101. The second layer 102 has a smaller area than the first layer 101. The first layer 101 and the second layer 102 are each provided with a coolant flow passage. The refrigerant frame 200 includes a first region 201 and a second region 202. The second region 202 is a hollowed-out region. The first region 201 is provided with a refrigerant module 120, and the refrigerant module 120 is provided with a refrigerant flow passage. The waterway base 100 and the refrigerant frame 200 are integrated. The second layer 102 is embedded in the second region 202 and the first region 201 is embedded in a recessed region formed between the second layer 102 and the first layer 101.

To facilitate an understanding of the thermal management integrated component 00 provided in accordance with an embodiment of the present application, the following is exemplary described in conjunction with the accompanying drawings. It should be understood that the form of each device in the drawings shown in the embodiments of the present application is only schematic, and is not limited to the embodiments of the present application.

In one possible implementation, referring to fig. 1, an exploded schematic view of a thermal management integrated component 00 is shown.

As can be seen in fig. 1, the thermal management integrated part 00 may include a waterway substrate 100, a refrigerant frame 200, and a refrigerant module 120.

Illustratively, the waterway substrate 100 is provided therein with a coolant flow passage. As shown in fig. 1, waterway substrate 100 includes first layer 101 and second layer 102. The waterway substrate 100 may include a first side and a second side, the first side facing opposite the second side. The second layer 102 is located on a second side of the waterway substrate 100. Illustratively, the waterway substrate 100 may be, for example, an injection molding made of plastic, or may be a metal waterway substrate made of metal, or may be a waterway substrate made of other materials, which is not limited in the embodiment of the present application.

In one possible implementation, as shown in fig. 1, the second layer 102 may include two sublayers, namely a first sublayer 1021 and a second sublayer 1022. The first sub-layer 1021 and the second sub-layer 1022 are stacked on the first layer 101, and an area of the second layer 102 (i.e., a sum of areas of the first sub-layer 1021 and the second sub-layer 1022) is smaller than an area of the first layer 101. The first layer 101, the first sub-layer 1021, and the second sub-layer 1022 are each provided with a coolant flow passage.

Illustratively, as shown in fig. 1, the refrigerant frame 200 may include a first region 201 (diagonal coverage area) and a second region 202. The first region 201 is a plate-like region. The second region 202 may include two sub-regions of the first hollowed-out region 2021 and the second hollowed-out region 2022. In one possible implementation, the first region 201 is provided with a through hole 2011. The refrigerant frame 200 may be made of metal, for example, by die casting or sheet metal, which is a low cost process.

Illustratively, as shown in fig. 1, the refrigerant module 120 is provided with ports 23 to 27, which are in communication with refrigerant channels provided in the refrigerant module 120. For an introduction of the interfaces 23 to 27, reference is made to the following description of fig. 5 and 7, which will not be described in detail here. Illustratively, the coolant module 120 may be a plate made of metal. For example, in order to achieve high pressure resistance and high air tightness of the refrigerant flow channel to satisfy the circulation of the high pressure refrigerant, the refrigerant module 120 may be manufactured by a forging process.

The refrigerant module 120 is fixedly installed in the first region 201 of the refrigerant frame 200. Illustratively, the refrigerant module 120 and the refrigerant frame 200 may be integrally formed. Alternatively, the refrigerant module 120 and the frame 200 may be separate components fixedly coupled together by bolting, hinging, ultrasonic coupling, welding, or the like.

Illustratively, when the waterway substrate 100 and the coolant frame 200 are integrated together, the second layer 102 is embedded in the second region 202, such as may be seen in fig. 2. It can be seen that the refrigerant frame 200 is disposed on the second side of the waterway base 100. Illustratively, the refrigerant frame 200 may be fixedly disposed on the second side of the waterway substrate 100 by bolting, hinging, ultrasonic connection, welding, or the like. Illustratively, when the waterway substrate 100 and the refrigerant frame 200 are integrated together, the first sub-layer 1021 is embedded in the first hollow region 2021 of the refrigerant frame 200, and the second sub-layer 1022 is embedded in the second hollow region 2022 of the refrigerant frame 200. The interface 10 and the interface 11 on the waterway substrate 100 pass through the first hollowed-out area 2021 along with the first sublayer 1021. The interface 08, the interface 09, the interface 13, and the interface 14 on the waterway substrate 100 pass through the second hollowed-out area 2022 along with the second sub-layer 1022. In addition, the first region 201 of the refrigerant frame 200 is embedded in a recessed section formed between the second layer 102 and the first layer 101 of the waterway substrate 100.

For example, in another possible implementation manner, the first area 201 of the refrigerant frame 200 may not be provided with a metal plate, but the refrigerant module may be directly fixed on the frame of the first area 201 by using bolts or welding. Therefore, the metal material can be further saved, and the cost and the weight are reduced.

In the above implementation scheme, the water path substrate 100 and the refrigerant frame 200 are arranged in a protruding and hollow nested manner, so that the overall thickness of the water path substrate 100 and the refrigerant frame 200 integrated together is reduced, and then the overall thickness of the thermal management integrated component 00 is reduced, and the volume is reduced. On the other hand, the waterway substrate 100 is designed to be two layers, and the second layer is also provided with the cooling liquid flow channels to meet the layout requirement of the cooling liquid flow channels, so that the problem that the area of the first layer is too large due to the fact that all flow channels are arranged on the first layer is avoided, namely the length or the width of the first layer is reduced, and the volume of the thermal management integrated component 00 is further reduced.

In another possible implementation manner, the first hollowed-out area 2021 may be enlarged to cover the area where the through hole 2011 is located. See, for example, fig. 3. In fig. 3, the area of the first region 201 is reduced and the area of the first hollowed-out region 2021 is enlarged as compared to the above-described fig. 1. This implementation saves material costs for the first region 201 without the need for an additional through hole 2011. It is understood that the shape of the refrigerant module 120 may be a regular polygon or may be any irregular shape. The embodiment of the present application does not limit the specific shape of the refrigerant module 120.

Illustratively, the area ratio of the second layer 102 to the first layer 101 of the waterway substrate 100 is between 40% and 60%. In the area proportion interval, the cost of the waterway substrate can be reduced to the greatest extent, and the quantity of the cooling liquid flow channels meeting the requirements can be arranged in the waterway substrate, namely, the cost and the function are considered.

Illustratively, the area of the refrigerant module 120 is much smaller than the area of the refrigerant frame 200. For example, the area ratio of the refrigerant module 120 to the refrigerant frame 200 may be between 30% and 70%. In order to meet the requirement of high-pressure refrigerant circulation, materials (metals adopted by the refrigerant module also need to have high pressure resistance) and manufacturing cost are high, so that the refrigerant flow channel is concentrated in the refrigerant module 120 with a small area in the embodiment of the application, and cost can be effectively saved. And because the refrigerant module 120 is metal, reducing the area of the refrigerant module 120 can also reduce the overall weight of the thermal management integrated component.

Illustratively, the thickness of the refrigerant module 120 may be substantially less than or equal to the thickness of the refrigerant frame 200. Illustratively, the thickness ratio of the refrigerant module 120 to the refrigerant frame 200 may be between 50% and 100%. In the thickness proportion interval, the material cost of the refrigerant module can be reduced to the greatest extent, the size of the cross section of the refrigerant flow passage arranged in the refrigerant module is guaranteed to meet the flow requirement, and the cost and the function are considered. In addition, if the thickness of the refrigerant module 120 is far smaller than that of the refrigerant frame 200, the overall thickness of the thermal management integrated component 00 can be reduced, and the volume can be reduced.

In a possible implementation, the first side of the substrate 100 may further be provided with a multi-way valve 110 and a water pump 111. The multi-way valve 110 and the water pump 111 may communicate with a coolant flow channel in the substrate 100. The frame 200 may further be fixedly provided with a first heat exchanging device 121 and a second heat exchanging device 122. The first heat exchanging device 121 may be, for example, a heat exchanging device such as a condenser. The second heat exchange device 122 may be, for example, a heat exchange device such as a cooler. The specific type and form of the two heat exchange devices are not limited in the embodiment of the application.

For ease of understanding, an exploded structural schematic view of the thermal management integrated component 00 shown in fig. 4 may be exemplarily referred to. In fig. 4, the water pump 111 may exemplarily include three water pumps, namely a water pump 1111, a water pump 1112, and a water pump 1113.

As can be seen in fig. 4, the first side of waterway substrate 100 is provided with interfaces 01 to 04. The interface 01 is used to connect the multi-way valve 110 so that the multi-way valve 110 communicates with a coolant flow channel provided in the waterway substrate 100. The interface 02 is used to connect the water pump 1111 such that the water pump 1111 communicates with a coolant flow channel provided in the waterway substrate 100. The interface 03 is used to connect the water pump 1112 so that the water pump 1112 communicates with a coolant flow passage provided in the waterway substrate 100. The interface 04 is used to connect the water pump 1113 so that the water pump 1113 communicates with a coolant flow passage provided in the waterway substrate 100.

Illustratively, the multi-way valve 110 may be, for example, a three-way valve, an eight-way valve, a nine-way valve, or the like, which is not limited in the embodiments of the present application.

Illustratively, as shown in FIG. 4, the multi-way valve 110, the water pump 1111, the water pump 1112, and the water pump 1113 may be disposed in a sequential order along the longer side of the first side of the water substrate 100. The arrangement of the cooling liquid flow channels in the waterway substrate 100 can be optimized, the flow channel staggering is reduced, the flow channels with more area layout of the waterway substrate 100 are utilized as much as possible, and the utilization rate of the waterway substrate 100 is improved.

Illustratively, as shown in fig. 4, the first side of the waterway substrate 100 is further provided with an interface 05, an interface 06, and an interface 07. Interface 05, interface 06 and interface 07 are in communication with the coolant flow channels in waterway substrate 100 and are also used to communicate circuits in the thermal management system. For example, interface 05 communicates with a water heater (positive temperature coefficient, PTC), and interfaces 06 and 07 communicate with a battery circuit. It will be appreciated that the embodiments herein are merely examples, and the devices specifically communicating with interface 05, interface 06, and interface 07 are not limited, and may be specifically determined according to the design of the actual thermal management circuit.

Illustratively, as shown in fig. 4, the second side of the waterway substrate 100 is provided with an interface 08, an interface 09, and an interface 10. Interface 08, interface 09, and interface 10 are in communication with coolant flow channels in waterway substrate 100 and are also used to communicate circuits in a thermal management system. For example, interface 08 and interface 10 are used to communicate with an interface of an electro-drive module; the interface 09 is for communication with a heat sink. It will be appreciated that the embodiments herein are merely examples, and the devices in which interfaces 08, 09 and 10 specifically communicate are not limited, and may be specifically determined according to the design of the actual thermal management circuit.

Illustratively, the second side of the waterway substrate 100 may also be provided with other interfaces. For example, referring to fig. 5, an exploded view of the waterway substrate 100 on a second side is shown. It can be seen that the second side of waterway substrate 100 may also be provided with interfaces 11-14. The ports 11 to 14 communicate with a coolant flow passage in the waterway substrate 100. Wherein the interface 11 and the interface 12 are also used for communicating with the first heat exchange device 121; the interface 13 and the interface 14 are also used for communication with a second heat exchange device 122. For ease of understanding, the following description will be made in connection with the first heat exchange device 121 and the second heat exchange device 122 shown in fig. 4.

Illustratively, in fig. 4, the first heat exchange device 121 includes an interface 15 and an interface 16. One of the interface 15 and the interface 16 is a cooling fluid inlet of the first heat exchange device 121, the other is a cooling fluid outlet of the first heat exchange device 121, and specifically which is the inlet or the outlet is determined according to practical application requirements, which is not limited in the embodiment of the present application. The second heat exchange device 122 comprises an interface 17 and an interface 18. One of the interface 17 and the interface 18 is a cooling fluid inlet of the second heat exchange device 122, and the other is a cooling fluid outlet of the second heat exchange device 122, and specifically which is the inlet or the outlet is determined according to practical application requirements, which is not limited in the embodiment of the present application. Referring to fig. 4 and 5, the interface 11 on the second side of the waterway substrate 100 passes through the first hollowed-out area 2021 and is in butt-joint communication with the interface 15 of the first heat exchange device 121. The interface 12 on the second side of the waterway substrate 100 passes through the through hole 2011 and is in butt joint communication with the interface 16 of the first heat exchange device 121. Alternatively, in the case shown in fig. 3, the interface 12 on the second side of the waterway substrate 100 passes through the first hollowed-out area 2021 and is in butt-joint communication with the interface 16 of the first heat exchange device 121. The interface 13 on the second side of the waterway substrate 100 passes through the second hollowed-out area 2022 and is in butt joint communication with the interface 17 of the second heat exchange device 122. The interface 14 on the second side of the waterway substrate 100 passes through the second hollowed-out area 2022 to be in butt-joint communication with the interface 18 of the second heat exchange device 122.

Illustratively, it can also be seen in fig. 4 that the first heat exchange device 121 further comprises an interface 19 and an interface 20. Wherein, the interface 19 may be a refrigerant inlet of the first heat exchange device 121; the interface 20 may be a refrigerant outlet of the first heat exchange device 121. The interface 19 may be used for communication with a compressor, for example. For example, the interface 19 may be used to communicate with the outlet of the compressor.

Illustratively, it can also be seen in fig. 4 that the second heat exchange device 122 further comprises an interface 21 and an interface 22. Wherein, the interface 21 may be a refrigerant inlet of the second heat exchange device 122; the interface 22 may be a refrigerant outlet of the second heat exchange device 122. Illustratively, the interface 22 may be used to communicate with a compressor. For example, the interface 22 may be used to communicate with an inlet of a compressor.

Illustratively, the interface 20 and the interface 21 are in abutting communication with a refrigerant flow path interface in the refrigerant module 120. For ease of understanding, the description is presented in connection with the refrigerant module 120 shown in fig. 5. As can be seen in fig. 5, the refrigerant module 120 is provided with ports 23 to 27. The ports 23 to 27 are communicated with a refrigerant flow passage provided in the refrigerant module 120. The interface 20 of the first heat exchange device 121 may be in butt-joint communication with the interface 23 of the refrigerant module 120. The interface 21 of the second heat exchange device 122 may be in butt-joint communication with the interface 24 of the refrigerant module 120.

Illustratively, as can be seen in fig. 4 above, the above-mentioned interface 19 is provided on one side (simply referred to as the first side) of the first heat exchange device 121. The interface 20, the interface 15, and the interface 16 are provided on the other side (simply referred to as the second side) of the first heat exchanging device 121. The second side of the first heat exchange device 121 is oriented opposite to the first side of the first heat exchange device 121 or the second side of the first heat exchange device 121 is oriented away from the first side of the first heat exchange device 121. And the second side of the first heat exchanging apparatus 121 may be a side in contact with the refrigerant frame 200. It will be appreciated that the refrigerant inlet (i.e. the port 19) of the first heat exchange device 121 is configured to be connected to a compressor, which is not integrated with the refrigerant module 120, and therefore, the port 19 of the first heat exchange device 121 is not connected to the refrigerant flow port of the refrigerant module 120. Then, the interface 19 is designed on the other side (i.e. the first side of the first heat exchange device 121) so as to be connected with the compressor, and a flow passage for communicating the compressor interface and the interface 19 of the first heat exchange device 121 is not required to be provided on the refrigerant module 120, so that the area of the refrigerant module 120 is reduced, and the cost is reduced.

Similarly, as can be seen by way of example in fig. 4 above, the interface 21 is provided on one side (simply referred to as the first side) of the second heat exchange device 122 with the interface 17 and the interface 18. The above-mentioned interface 22 is provided on the other side (simply referred to as the second side) of the second heat exchange device 122. The second side of the second heat exchange device 122 is oriented opposite the first side of the second heat exchange device 122 or the second side of the second heat exchange device 122 is oriented away from the first side of the second heat exchange device 122. And the first side of the second heat exchanging arrangement 122 may be a side in contact with the refrigerant frame 200. It will be appreciated that the refrigerant outlet (i.e., port 22) of the second heat exchange device 122 is configured to be coupled to a compressor, which is not integrated with the refrigerant module, and therefore, the port 22 of the second heat exchange device 122 is not coupled to the refrigerant flow path port of the refrigerant module 120. Then, the interface 22 is designed on the other side (i.e. the second side of the second heat exchange device 122) so as to be connected with the compressor, and a flow passage for communicating the compressor interface and the interface 22 of the second heat exchange device 122 is not required to be provided on the refrigerant module 120, so that the area of the refrigerant module 120 is reduced, and the cost is reduced.

Illustratively, the ports 25 and 26 in the refrigerant module 120 may be used to communicate with the refrigerant container 123, and the ports 27 may be used to communicate with the expansion valve 124. For ease of understanding, see fig. 6 and 7. As can be seen in fig. 6, the refrigerant container 123 is provided with an interface 28 and an interface 29. One of the interface 28 and the interface 29 is a refrigerant inlet of the refrigerant container 123, the other is a refrigerant outlet of the refrigerant container 123, and specifically, which is the inlet or the outlet is determined according to practical application requirements, which is not limited in the embodiment of the present application. The expansion valve 124 is provided with a port 30. Referring to fig. 7, the port 28 of the refrigerant container 123 communicates with the port 25 of the refrigerant module 120. The port 29 of the refrigerant container 123 communicates with the port 26 of the refrigerant module 120. The port 30 of the expansion valve 124 communicates with the port 27 of the refrigerant module 120.

In one possible implementation, the refrigerant container and/or expansion valve may be integrated into the refrigerant module 120. In this case, the above-mentioned interface 28 is in direct abutting communication with the interface 25; the interface 29 and the interface 26 are directly connected in a butt joint way; the interface 30 is in direct abutting communication with the interface 27. Alternatively, in another possible implementation, the refrigerant container and/or expansion valve may not be integrated into the refrigerant module 120. In this case, the above-mentioned interface 28 is in communication with the interface 25 via a pipe; the interface 29 and the interface 26 are communicated through a pipeline; the above-mentioned interface 30 is in communication with the interface 27 via a pipeline. It is to be understood that this is by way of example only and is not to be construed as limiting the embodiments of the present application.

The refrigerant container 123 may be, for example, a liquid storage tank. The shape may be cylindrical or cubic or any other shape, and the embodiment of the present application is not limited thereto.

In one possible implementation, to facilitate an overall visual understanding of the thermal management integrated component 00 provided by embodiments of the present application, reference may be made to fig. 8 and 9 for an example. Fig. 8 and 9 illustrate the refrigerant container 123 and the expansion valve 124 integrated in the refrigerant module 120. Fig. 8 is a schematic view showing the overall appearance of the thermal management integrated part 00 as seen from the first side of the waterway substrate 100 after each device is integrated on the waterway substrate 100. Fig. 9 is a schematic overall external view of the thermal management integrated component 00, as seen from the second side of the waterway substrate 100, after the respective devices are integrated onto the waterway substrate 100. It will be appreciated that the illustrations in fig. 8 and 9 are merely examples, and constitute limitations of embodiments of the present application. For example, in the thermal management integrated unit 00 shown in fig. 8 and 9, other devices (for example, shut-off valve (SOV), three-way valve, compressor, etc.) may be integrated on the waterway substrate 100, which is not limited in the embodiment of the present application. For example, referring also to fig. 9A, a shut-off valve 125 may also be integrated with the refrigerant module 120. The stop valve 125 is connected to the refrigerant flow channel in the refrigerant module 120 through a refrigerant flow channel interface provided on the refrigerant module 120. Illustratively, the shut-off valve may also be referred to as a throttle valve, etc., which is not limited by the embodiments of the present application.

Illustratively, as can be seen in fig. 9 above, the refrigerant container 123 and the expansion valve 124 are located between the first heat exchange device 121 and the second heat exchange device 122. Illustratively, in a particular thermal management refrigerant circuit, the refrigerant is forced into the first heat exchange device 121 by a compressor. After heat exchange, the heat flows out from the first heat exchange device 121 to the refrigerant container 123. Then, the refrigerant flows from the refrigerant container 123 to the expansion valve 124, and flows through the expansion valve 124 to the second heat exchange device 122. The refrigerant after heat exchange flows out of the second heat exchange device 122 and flows back to the compressor to form a refrigerant loop. Based on this, in the embodiment of the present application, the refrigerant container 123 and the expansion valve are disposed between the first heat exchange device 121 and the second heat exchange device 122, so that the length of the refrigerant flow channel can be saved. The area of the refrigerant module 120 can be further reduced to further reduce the cost and weight of the heat management integrated unit 00.

Illustratively, in fig. 9, the refrigerant container 123 is disposed perpendicular to the waterway substrate 100 (also perpendicular to the refrigerant module 120). Specifically, it is assumed that the side of the refrigerant container 123 where the above-described ports 28 and 29 are provided is a first side, and the side opposite to the first side is a second side, that is, the bottom of the refrigerant container is a second side. The direction from the second side of the refrigerant container 123 toward the first side of the refrigerant container 123 is perpendicular to the refrigerant module. And the interface 28 and the interface 29 are respectively in direct butt joint communication with the interface 25 and the interface 26 on the refrigerant module 120. The tank body of the refrigerant container 123 is perpendicular to the refrigerant module 120, so that the influence on a refrigerant loop caused by the fact that the refrigerant cannot be normally provided when the refrigerant in the tank body is less can be reduced, and on the other hand, the tank body is perpendicular to the refrigerant module, and the capacity of the refrigerant can be increased by replacing a longer tank body.

In another possible implementation, the refrigerant container 123 may be disposed laterally on the refrigerant module 120. Specifically, a direction from the second side of the refrigerant container 123 toward the first side of the refrigerant container 123 is parallel to the refrigerant module 120. For ease of understanding, reference may be made to fig. 10 and 10A for exemplary purposes. Fig. 10 and 10A show schematic views of the refrigerant container 123 transversely disposed on the refrigerant module 120. Fig. 10 is different from fig. 10A in that the positions of the refrigerant inlets and outlets on the refrigerant container 123 are different. In this arrangement, the connection between the connection 25 and the connection 28, and the connection 26 and the connection 29 can be connected by means of a short pipe or by means of welding. For example, the arrangement positions of the interface 25 and the interface 26 on the refrigerant module 120 may be adaptively changed according to the arrangement position of the refrigerant container 123, which is not limited in the embodiment of the present application. The lateral arrangement of the refrigerant container 123 on the refrigerant module 120 may further reduce the thickness of the thermal management integrated part 00.

The foregoing figures 1-10 are exemplary only, and are illustrative of embodiments of the present application. The specific form and size of each device is schematically illustrated, as are the form and size of each interface. The form and size of the waterway substrate 100 are also schematically shown. The waterway substrate 100 may be any regular square, oval, or may be irregularly shaped, which is not limited in the embodiment of the present application. Illustratively, in one possible implementation, if the waterway substrate 100 is another shape, the layout positions of the respective interfaces and the respective devices disposed on the waterway substrate may be adaptively adjusted. For ease of understanding, reference may be made to fig. 11 and 12 for exemplary purposes. The shape of the waterway substrate 100 shown in fig. 11 and 12 is different from the shape of the waterway substrate 100 shown in fig. 4 and 5 described above.

Illustratively, fig. 11 is a schematic view of an exploded structure of the thermal management integrated part 00 seen from a first side of the waterway substrate 100. Fig. 12 is a schematic view showing an exploded structure of the thermal management integrated part 00 seen from the second side of the waterway substrate 100. As can be seen in fig. 11 and 12, the shape and size of the waterway substrate 100 are different from those of the waterway substrate 100 shown in fig. 4 and 5; the layout of the devices disposed on the waterway substrate 100 is also different from that shown in fig. 4 and 5.

Illustratively, as shown in fig. 11, the multi-way valve 110, the water pump 111, the water pump 112, and the water pump 113 are still disposed on the first side of the waterway substrate 100. However, the relative position layout among the multi-way valve 110, the water pump 111, the water pump 112, and the water pump 113 is changed as compared to that shown in fig. 4 described above. For example, the multi-way valve 110, the water pump 111, the water pump 112, and the water pump 113 are provided at four corners of the waterway substrate 100, respectively, and the like. The adaptive adjustment of the position layout is to reduce the staggering of the cooling channels in the waterway substrate 100, so as to utilize the channels with more area layout of the waterway substrate 100 as much as possible, and improve the utilization rate of the waterway substrate 100. Regarding the communication relationship between the multi-way valve 110, the water pump 111, the water pump 112 and the water pump 113 and the interface on the waterway substrate 100, reference may be made to the related description of fig. 4, which is not repeated herein.

As shown in fig. 12, the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 are still disposed on the refrigerant frame 200. Specifically, the refrigerant module 120 is disposed in a first region 201 (diagonal region in fig. 12) of the refrigerant frame 200; the first heat exchange device 121 and the second heat exchange device 122 are disposed on the refrigerant frame 200 and are correspondingly in butt-joint communication with the cooling fluid channel interface (including the interface 11 to the interface 14) passing through the second area 202 on the waterway substrate 100. However, as compared with the above-described fig. 5, the relative position layout among the refrigerant module 120, the first heat exchanging device 121, and the second heat exchanging device 122 is changed. For example, in fig. 5, the refrigerant module 120 is disposed in a middle region of the refrigerant frame 200 (the first region 201 is located in the middle region of the refrigerant frame 200), the first heat exchanging device 121 and the second heat exchanging device 122 are disposed in two side regions of the refrigerant frame 200, respectively, and the first heat exchanging device 121 and the second heat exchanging device 122 sandwich the refrigerant module 120. In fig. 12, the refrigerant module 120 is disposed on one side of the refrigerant frame 200 (the first area 201 is disposed on one side of the refrigerant frame 200), and the first heat exchanging device 121 and the second heat exchanging device 122 are disposed on the other side of the refrigerant frame 200 opposite to the side on which the refrigerant module 120 is disposed. The first heat exchanging device 121 and the second heat exchanging device 122 are located side by side on the same side (simply referred to as a first side) of the refrigerant module 120. As an example, the refrigerant container 123 and the expansion valve 124 are further provided on the refrigerant module 120, and the refrigerant container 123 and the expansion valve 124 are located at the other side opposite to the first side. And the refrigerant container 123 is disposed adjacent to the first heat exchange device 121, and the expansion valve 124 is disposed adjacent to the second heat exchange device 122. This arrangement allows a shorter refrigerant transfer path.

Illustratively, in fig. 12, waterway substrate 100 may include a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101, and the area of the second layer 102 is smaller than that of the first layer 101. The second layer 102 has a coolant flow passage provided therein. When the waterway substrate 100 and the coolant frame 200 are integrated together, the second layer 102 is embedded in the second area 202, and the interface 08 to the interface 14 on the waterway substrate 100 passes through the second area 202 along with the second layer 102. Alternatively, in another possible implementation, a through hole (not shown in fig. 12) may be provided in 201 shown in fig. 12, and the interface 12 is in abutting communication with the interface 16 of the first heat exchange device 121 through the through hole 2011. Reference may be made specifically to the above description related to fig. 4, and this is not repeated here.

It should be understood that the foregoing descriptions of fig. 11 and 12 are merely examples, and are not meant to limit the embodiments of the present application.

In one possible implementation, the layout position of each device on the second side of the waterway substrate 100 is not limited to the layout position shown in fig. 5 (or fig. 7) or fig. 12, but may be other layout positions. For example, see fig. 13 to 16. Fig. 13 is a schematic plan view showing a positional relationship of the second side of the waterway board 100 in the thermal management integrated component 00 shown in fig. 7. Fig. 14 is a schematic plan view showing a positional relationship of the second side of the waterway substrate 100 in the thermal management integrated component 00 shown in fig. 12. The schematic plan views shown in fig. 13 and 14 exemplarily show the layout positional relationship of the refrigerant module 120, the first heat exchanging device 121, the second heat exchanging device 122, the refrigerant container 123, and the expansion valve 124 integrated on the second side of the waterway substrate 100. In another possible implementation, the layout positional relationship of the devices integrated on the second side of the waterway substrate 100 may also be shown in fig. 15 or 16, for example.

Illustratively, in fig. 15, the long sides of the first and second heat exchanging devices 121 and 122 may be disposed perpendicular to the long side direction of the waterway substrate 100. The refrigerant module 120 is disposed in a middle area of the second side of the waterway substrate 100, and the refrigerant container 123 and the expansion valve 124 integrated on the refrigerant module 120 are disposed between the first heat exchange device 121 and the second heat exchange device 122.

Illustratively, in fig. 16, the layout positional relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 forms a mirror image relationship with the layout positional relationship shown in fig. 14 described above. That is, in fig. 16, the refrigerant module 120 is disposed on one side of the second side of the waterway substrate 100, the first heat exchanging device 121 and the second heat exchanging device 122 are disposed on the other side of the second side of the waterway substrate 100, and the first heat exchanging device 121 and the second heat exchanging device 122 are disposed side by side on the same side (simply referred to as the first side) of the refrigerant module 120. As an example, the refrigerant container 123 and the expansion valve 124 are further provided on the refrigerant module 120, and the refrigerant container 123 and the expansion valve 124 are located at the other side opposite to the first side. And the refrigerant container 123 is disposed adjacent to the first heat exchange device 121, and the expansion valve 124 is disposed adjacent to the second heat exchange device 122.

In the layout positional relationship shown in fig. 13 to 16, the refrigerant container 123 is disposed close to the refrigerant outlet of the first heat management device 121, the expansion valve 124 is disposed close to the refrigerant inlet of the second heat exchange device 122, and the refrigerant container 123 and the expansion valve 124 are disposed as close together as possible, so that the length of the refrigerant flow channel can be greatly shortened, and the area of the refrigerant module 120 can be greatly reduced.

To sum up, in this application embodiment, on the one hand, the setting mode that waterway base plate and refrigerant frame are nested through arch and fretwork for waterway base plate and refrigerant frame integrated whole thickness reduction together, and then reduce the whole thickness of thermal management integrated component, reduce the volume. On the other hand, the waterway substrate is designed into two layers, and the cooling liquid flow channels are also arranged in the second layer to meet the layout requirement of the cooling liquid flow channels, so that the situation that the area of the first layer is overlarge due to the fact that all flow channels are arranged in the first layer is avoided, namely the length or the width of the first layer is reduced. In addition, the high-pressure-resistant refrigerant flow channel is concentrated to the refrigerant module with a smaller area, so that the use of high-pressure-resistant metal materials can be reduced, the weight is reduced, and meanwhile, the material consumption and the manufacturing cost are saved.

Embodiments of the present application also provide a thermal management system, such as may be seen in fig. 17. A thermal management integrated component 1701 may be included in the thermal management system 1700. The thermal management integrated component 1701 may be, for example, a thermal management integrated component as in any of the possible embodiments described above. Reference may be made specifically to the foregoing description, and details are not repeated here.

Embodiments of the present application also provide a vehicle, for example, as may be seen in fig. 18. A thermal management integrated component 1801 may be included in the vehicle 1800. The thermal management integrated component 1801 may be, for example, a thermal management integrated component as in any of the possible embodiments described above. Reference may be made specifically to the foregoing description, and details are not repeated here.

It should be understood that, in the embodiments of the present application, the sequence number of each process does not mean that the execution sequence of each process should be determined by the function and the internal logic of each process, and should not constitute any limitation on the implementation process of the embodiments of the present application.

It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should be further understood that reference throughout this specification to "one embodiment," "an embodiment," "one possible implementation," means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment," "one possible implementation" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management integrated component, wherein the thermal management integrated component comprises a waterway substrate and a refrigerant frame;

The waterway substrate comprises a first layer and a second layer, wherein the second layer is stacked on the first layer, and the area of the second layer is smaller than that of the first layer; a cooling liquid runner is arranged in each of the first layer and the second layer;

the waterway substrate and the refrigerant frame are integrated together, the second layer is embedded into the second area, and the first area is embedded into a concave section formed between the second layer and the first layer.

2. The thermal management integrated component of claim 1, wherein the area ratio of the second layer to the first layer is between 40% and 60%.

3. The thermal management integrated component of claim 1 or 2, wherein an area of the second region is greater than an area of the second layer, the area ratio of the second region to the area of the refrigerant frame being between 50% and 70%.

4. The thermal management integrated component of any of claims 1-3, wherein the area ratio of the refrigerant module to the refrigerant frame is between 30% and 50%.

5. The thermal management integrated component of any of claims 1-4, wherein a ratio of a thickness of the coolant module to a thickness of the coolant frame is between 50% and 100%.

6. The thermal management integrated component of any of claims 1-5, wherein the coolant module is fabricated by forging and the coolant frame is fabricated by die casting or sheet metal.

7. The thermal management integrated component of any of claims 1-6, wherein a first refrigerant flow interface is provided in the refrigerant module; the refrigerant frame is also provided with first heat exchange equipment;

8. The thermal management integrated component of claim 7, wherein the first heat exchange device comprises a first coolant inlet and a first coolant outlet; the first cooling liquid inlet and the first cooling liquid outlet are positioned on the second side of the first heat exchange device;

The waterway substrate is provided with a first cooling liquid flow passage interface and a second cooling liquid flow passage interface, and the second area comprises a first hollowed-out area;

the first cooling liquid flow passage interface penetrates through the first hollow area and is in butt joint communication with the first cooling liquid inlet;

the second cooling liquid flow passage interface passes through the first hollow area and is in butt joint communication with the first cooling liquid outlet, or the second cooling liquid flow passage interface passes through a through hole on the plate-shaped area and is in butt joint communication with the first cooling liquid outlet.

9. The thermal management integrated component of any of claims 1-8, wherein a second refrigerant flow interface is provided in the refrigerant module; the refrigerant frame is also used for fixing second heat exchange equipment;

the second refrigerant inlet is in butt joint communication with the second refrigerant flow passage interface; the second refrigerant outlet is used for being communicated with the compressor.

10. The thermal management integrated component of claim 9, wherein the second heat exchange device comprises a second coolant inlet and a second coolant outlet; the second cooling liquid inlet and the second cooling liquid outlet are positioned on the first side of the second heat exchange device;

the waterway substrate is provided with a third cooling liquid flow passage interface and a fourth cooling liquid flow passage interface, and the second area comprises a second hollowed-out area;

11. The thermal management integrated component of any of claims 1-10, wherein a third refrigerant flow interface and a fourth refrigerant flow interface are provided in the refrigerant module; the refrigerant container is integrated on the refrigerant module and is communicated with the refrigerant flow channels in the refrigerant module through the third refrigerant flow channel interface and the fourth refrigerant flow channel interface.

12. The thermal management integrated component of claim 11, wherein the refrigerant container comprises a first side and a second side, the first side of the refrigerant container facing opposite the second side of the refrigerant container;

13. The thermal management integrated component of any of claims 1-12, wherein a fifth refrigerant flow interface is provided in the refrigerant module; the expansion valve is integrated on the refrigerant module and is communicated with a refrigerant flow passage in the refrigerant module through the fifth refrigerant flow passage interface; and/or the number of the groups of groups,

a sixth refrigerant flow passage interface is arranged in the refrigerant module; the stop valve is integrated on the refrigerant module and is communicated with the refrigerant flow passage in the refrigerant module through the sixth refrigerant flow passage interface.

14. The thermal management integrated component of any of claims 1-13, wherein the coolant frame is disposed on a first side of the waterway substrate, a second side of the waterway substrate facing opposite the first side of the waterway substrate;

15. A thermal management system comprising the thermal management integrated component of any of claims 1-14.

16. A vehicle comprising the thermal management integrated component of any one of claims 1-14, or the vehicle comprising the thermal management system of claim 15.