CN117564886A - Grinding equipment, usage method and automated production line thereof - Google Patents

Grinding equipment, usage method and automated production line thereof Download PDF

Info

Publication number
CN117564886A
CN117564886A CN202311652212.3A CN202311652212A CN117564886A CN 117564886 A CN117564886 A CN 117564886A CN 202311652212 A CN202311652212 A CN 202311652212A CN 117564886 A CN117564886 A CN 117564886A
Authority
CN
China
Prior art keywords
polishing
grinding
belt
guide wheel
mechanical arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311652212.3A
Other languages
Chinese (zh)
Inventor
游迪
王枫宇
李鑫阳
钱昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Shunde Machinery Co ltd
Original Assignee
Zhejiang Shunde Machinery Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Shunde Machinery Co ltd filed Critical Zhejiang Shunde Machinery Co ltd
Priority to CN202311652212.3A priority Critical patent/CN117564886A/en
Publication of CN117564886A publication Critical patent/CN117564886A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/008Machines comprising two or more tools or having several working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18Accessories
    • B24B21/20Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明涉及抛光打磨机械技术领域,具体公开了一种打磨设备、使用方法及其自动化生产线。该设备包含至少两个打磨机构,旋转机构以及底座,其中打磨机构安装于旋转机构上,底座用于承托旋转机构。使用时,通过转动旋转盘将一个打磨机构移入工作区域;而后使用机械臂夹取待打磨部件并进行位置调整,对准后,推进机械臂靠近打磨机构,实施加工;完成后,调整机械臂仅在水平方向上远离打磨机构,而后通过旋转盘将其他任意一个所需的打磨机构移动至工作区域中;重复机械臂的水平移动与旋转盘的转动工作直至打磨/抛光工作结束。本发明将多个打磨或抛光设备进行了集成,减少了机械臂的调整步骤,降低了机械臂调整过程中产生误差的可能性。

The invention relates to the technical field of polishing and grinding machinery, and specifically discloses a grinding equipment, a usage method and an automated production line. The equipment includes at least two grinding mechanisms, a rotating mechanism and a base, wherein the grinding mechanism is installed on the rotating mechanism, and the base is used to support the rotating mechanism. When in use, a grinding mechanism is moved into the working area by rotating the rotating disk; then the mechanical arm is used to clamp the parts to be polished and adjust the position. After alignment, push the mechanical arm close to the grinding mechanism to perform processing; after completion, adjust the mechanical arm only Move away from the grinding mechanism in the horizontal direction, and then move any other required grinding mechanism to the working area through the rotating disk; repeat the horizontal movement of the mechanical arm and the rotation of the rotating disk until the grinding/polishing work is completed. The invention integrates multiple grinding or polishing equipment, reduces the adjustment steps of the mechanical arm, and reduces the possibility of errors during the adjustment process of the mechanical arm.

Description

Polishing equipment, using method and automatic production line thereof
Technical Field
The invention relates to the technical field of polishing and grinding machinery, in particular to grinding equipment, a using method and an automatic production line thereof.
Background
The automatic processing flow comprises automatic workpiece clamping, abrasive replacement, process parameter adjustment and other functions, so that manual intervention is reduced in the process, and the production efficiency is improved. In automated production lines, sanding equipment is often used to precision machine workpieces to improve surface quality and/or dimensional accuracy. Such devices typically have high precision control systems and automation functions.
To achieve a careful grinding and/or polishing of the workpiece, the portions of the automated production line that are to be ground/polished on a flat surface need to involve the use of different mesh grinding or polishing belts to accommodate the relevant requirements of the surface quality and/or processing speed of the workpiece.
However, most polishing devices and/or polishing devices with different meshes in the existing automatic production line are arranged separately, so that the occupied area is large, and in the whole process flow, a mechanical arm is required to clamp a workpiece to corresponding polishing or polishing equipment before corresponding polishing or polishing work is performed.
In this process, the displacement adjustment of the robot arm is involved, and after the displacement of the robot arm main body is completed, the position adjustment of the work surface to be worked of the clamped workpiece is also involved. On the one hand, the more steps need to be adjusted, the more time is needed to be spent, and the production efficiency of the product is affected; on the other hand, the more steps need to be adjusted, the greater the possibility of error generation, for example, after the mechanical arm finishes displacement at any time, the working face to be worked and the working face of the polishing belt are not adjusted to realize a relative parallel relation, so that the structures such as edges, chamfers, fillets and the like around the working face to be worked on the workpiece can be worn in the polishing process, and finally the production qualification rate of the product is reduced.
Disclosure of Invention
The invention provides polishing equipment, which can reduce the occupied area of equipment related to polishing work in an automatic production line, and simultaneously reduce the adjustment steps of a mechanical arm in the whole polishing and/or polishing work process, and further reduce the possibility of errors in the polishing and/or polishing process.
The invention is realized by the following technical scheme.
A sanding apparatus comprising:
at least two polishing mechanisms, which are respectively provided with polishing belts or polishing belts with different meshes, wherein a plurality of the polishing belts or polishing belts are provided with working surfaces for contacting with a part to be polished;
the polishing belts with different meshes can enable the polishing equipment to adapt to different polishing processing quality requirements and polishing speed requirements, for example, when polishing is carried out by using the polishing belts with large meshes, the polishing speed is higher, but the working surface to be polished on the part to be polished after polishing is rough; when the polishing belt with small mesh number is used for polishing, the polishing speed is low, but the working surface to be polished is smooth.
Correspondingly, if any polishing mechanism is provided with the polishing belt, the polishing equipment has polishing and polishing functions.
Meanwhile, each polishing mechanism only has difference in the selection of polishing belts or polishing belts, and the replacement and maintenance work of the polishing mechanisms are facilitated.
The rotary mechanism comprises a fixed frame and a rotary disc, wherein the rotary disc is used for supporting the fixed frame, and the fixed frame is used for fixedly mounting a plurality of polishing mechanisms, so that a plurality of working surfaces are outwards far away from the rotary disc and have equal distances from the center of the rotary disc;
firstly, before polishing, moving one required polishing mechanism to one end close to a mechanical arm for polishing or polishing, wherein the position of the polishing mechanism is a working area;
then, after the mechanical arm clamps the part to be polished and completes position adjustment, the mechanical arm is close to a polishing mechanism positioned in a working area to carry out corresponding polishing or polishing work, and after the first work is completed, the mechanical arm only needs to move in the horizontal direction to enable the part to be polished to be far away from the polishing mechanism;
then, the other needed polishing mechanism is rotated into the working area through the rotating disc, and as the distances from each working surface to the center of the rotating disc are equal, the relative positions of the mechanical arm and the working surface are the same as those of the mechanical arm after the previous work is completed, and the part to be polished, which is clamped by the mechanical arm, does not need to carry out adjustment work on angles and the like of the working surface to be polished, so that the working surface to be polished is parallel to the working surface;
after that, the mechanical arm still only needs to translate horizontally, so that the part to be polished is close to the polishing mechanism in the working area, and corresponding polishing or polishing work can be realized.
And the base is used for movably mounting the rotating mechanism.
As a further improvement of the invention, the polishing mechanism is also provided with a guide structure for guiding the moving track of the polishing belt or the polishing belt, so that the polishing belt or the polishing belt forms a closed-loop structure and keeps the working surface in a flat state.
On one hand, the guide structure can guide the polishing belt or the polishing belt to form a closed-loop structure, so that the polishing belt or the polishing belt is ensured to maintain a stable tensioning state in the use process, and the problems of unstable polishing/polishing effect, falling off of the polishing belt or the polishing belt and the like caused by poor tensioning are solved; the closed loop structure can also lead the stress of the polishing belt or the polishing belt to be more uniform in operation, thereby achieving more uniform abrasion and prolonging the service life of the polishing belt or the polishing belt; meanwhile, a polishing belt or polishing belt system with a closed-loop structure can be integrated with an automatic production line, so that the functions of automatic replacement, automatic adjustment and the like are realized, and the production efficiency is improved.
On the other hand, the guide structure can enable the polishing belt or the polishing belt to generate a flat working surface, so that the polishing mechanism is more suitable for polishing or polishing a planar structure, only the working surface is polished or polished, and the structures such as edges, corners and the like on the periphery of the working surface are not worn.
As a further improvement of the invention, the guiding structure comprises a plurality of guiding wheels and a driving device, wherein the driving device is used for providing rotary driving force for the guiding wheels, so that the rotating speed of the guiding wheels is matched with the moving speed of the polishing belt or the polishing belt.
If the guide wheel is not equipped with a drive device, the guide wheel will inevitably come into contact with the sanding belt or polishing belt while playing a guiding role. If the guide wheel is rotatable, the polishing belt or the polishing belt drives the guide wheel to rotate; if the guide wheel is stationary, the sanding belt or polishing belt must rub against the guide wheel. In either case, the presence of the guide wheel will necessarily cause a loss of drive power to the belt or belt, i.e., slow down the belt or belt movement. This phenomenon is most pronounced at the end of the drive that is furthest from the belt or belt.
In order for each part of the whole polishing belt or the polishing belt to meet the set moving speed requirement, the driving device of the polishing belt or the polishing belt needs to output a larger driving force to reduce the influence of the driving power loss.
And after the guide wheel is also provided with a corresponding driving device, the driving pressure of the driving device of the polishing belt or the polishing belt is shared by reducing the driving power loss while the guide function is played. Further, when the moving speed of the polishing belt or the polishing belt is adjusted, the driving force power loss is not needed to be considered any more, and the moving speeds of all parts of the polishing belt or the polishing belt tend to be uniform, so that the polishing or polishing precision is further improved.
On the other hand, a larger friction force is generated after the part to be polished is contacted with the polishing belt or the polishing belt, so that the moving speed of the polishing belt or the polishing belt can reach the set requirement in the polishing/polishing working process, and the moving speed of the polishing belt or the polishing belt can be always kept higher than the required moving speed in the non-polishing/polishing working process. And after the guiding wheel has a rotary driving force, the rotary driving force can provide assistance for the movement of the polishing belt or the grinding belt, so that the rotating speed of the driving device of the polishing belt or the grinding belt can be properly reduced, and further, the power consumption of the driving device of the polishing belt or the grinding belt is reduced.
As a further development of the invention, the guiding structure comprises a primary guiding wheel, a transition guiding wheel and a final guiding wheel,
the transition guide wheel is positioned between the initial guide wheel and the final guide wheel, and the three guide wheels are contacted with the polishing belt or the polishing belt, so that a flat surface is formed between the initial guide wheel and the final guide wheel by the polishing belt or the polishing belt, and the working surface is positioned between the transition guide wheel and the initial guide wheel;
the rotating speed of the transition guide wheel is 1.2-1.4 times of the rotating speed of the rest guide wheels in the guide structure.
The three guiding wheels are provided with tangent lines at the joint of the polishing belt or the polishing belt, and the three tangent lines are parallel to each other and are all positioned on the same plane, wherein the primary guiding wheel and the final guiding wheel are matched with the other guiding wheels to play a role in tightening the polishing belt or the polishing belt, so that a flat surface is formed between the final guiding wheel and the primary guiding wheel. Meanwhile, the face comprises a working face, and the working face is positioned between the transition guide wheel and the initial guide wheel.
When the grinding/polishing work is not carried out, the initial guide wheel and the final guide wheel jointly support a flat surface on the grinding belt or the polishing belt, and the transition guide wheel is less in contact with the grinding belt or the polishing belt, so that the transition guide wheel has a higher rotating speed compared with other guide wheels, and the grinding belt or the polishing belt cannot be greatly influenced.
On one hand, when the polishing/buffing work is performed, the polishing belt or the buffing belt is tightly contacted with the transition guide wheel due to the fact that the part to be polished presses the polishing belt or the buffing belt, the working surface on the polishing belt between the transition guide wheel and the primary guide wheel is in a tight state due to the high rotating speed of the transition guide wheel, the working surface is kept smooth, and further the working surface cannot be worn by structures such as edges, chamfers and the like around the working surface to be polished on the part to be polished;
on the other hand, after being pressed, the transition guide wheel provides a pulling force for the polishing belt or the polishing belt at a higher rotating speed, and the pulling force counteracts a friction force generated by contacting a part to be polished, and the moving speed of a working surface on the polishing belt or the polishing belt always tends to be uniform by matching with other guide wheels.
The rotating speed of the transition guide wheel is 1.2-1.4 times of the rotating speed of the rest guide wheels in the guide structure, so that the effects of tightening and pushing the polishing belt or the polishing belt to tend to move at a uniform speed can be achieved, the normal operation of the polishing belt or the polishing belt in a closed-loop structure can not be influenced, and the phenomena of falling off of the polishing belt or the polishing belt and the like can not be caused.
The polishing device is further improved, and is characterized in that the tensioning structure is further arranged on the polishing mechanism and used for enabling the polishing belt or the polishing belt to be kept in a tight state in the working process, guaranteeing that the working surface is kept flat, and further enabling the working surface not to wear structures such as edges, corners and the like around the working surface on the part to be polished.
As a further improvement of the invention, the polishing device also comprises a distance measuring device which is used for detecting the distance between the part to be polished and the working surface in the working state. The interval between the part to be polished and the working face directly influences the abrasion loss of the part to be polished, and the measurement of the interval provides a basis for the control of the interval, so that during polishing or polishing work, the abrasion is precisely controlled to only occur on the surface to be polished, and structures such as chamfering, chamfering and the like around the surface to be polished are not involved.
As a further improvement of the invention, the polishing equipment further comprises an infrared positioning instrument, the infrared positioning instrument comprises a plurality of infrared transmitters and receivers, wherein the infrared transmitters are arranged on a mechanical arm for clamping the part to be polished, the receivers are arranged on the polishing mechanism, the receiving surface of the receivers comprises an adapting area and an adjusting area, the adapting area is arranged on the receiving surface at intervals, and the rest areas on the receiving surface are adjusting areas.
In the final stage of position adjustment of the part to be polished, the positioning result of the infrared positioning instrument is used as an important basis for position adjustment of the part to be polished; when the infrared rays emitted by the infrared emitters on the mechanical arm fall in the corresponding adapting areas, the working surface to be worked and the working surface form a parallel relation; when only part of infrared rays fall in the adjustment area, the position of the mechanical arm needs to be adjusted until the infrared rays fall in the adaptation area; when the receiving surface does not receive infrared rays, the fact that the butt joint work of the mechanical arm and the polishing mechanism has larger offset in the whole direction is indicated, an information processing unit in the infrared positioning instrument generates error reporting information and feeds the error reporting information back to a human-computer interface, and manual intervention correction is needed.
An automated production line, characterized in that: comprising a sanding apparatus as defined in any one of the preceding claims.
A method of using the polishing apparatus of any one of the above or in the automated production line, comprising the steps of:
s1, enabling one polishing mechanism to enter a working area by rotating the rotating disc;
s2, clamping the part to be polished by using a mechanical arm and adjusting the position of a surface to be polished on the part to be polished towards a polishing mechanism in the working area, wherein the swing, the movement amplitude and the like of the mechanical arm can be limited by limiting parts such as a positioning block and the like, so that the position adjustment of the part to be polished is ensured to have no larger deviation in the whole direction;
s3, adjusting the surface to be polished to be parallel to the working surface, and adjusting the position of the part to be polished in a small range to enable the position to be precisely matched with the working surface so as to avoid abrasion of structures such as chamfer angles and edges around the surface to be polished in subsequent work;
s4, pushing the mechanical arm to be close to the polishing mechanism, and processing the surface to be worked;
s5, after the mechanical arm is adjusted, the mechanical arm is only far away from the polishing mechanism in the horizontal direction, and other adjusting steps are reduced, so that the possibility of error generation is reduced;
s6, enabling any other polishing mechanism required to move into the working area by rotating the rotating disc;
s7, repeating the steps S4-S6 until finishing polishing.
As a further improvement of the invention, the positioning result of the infrared positioning instrument is adopted in the step S3 as the position adjustment basis of the clamped part to be polished.
When the infrared rays emitted by the infrared emitters on the mechanical arm fall in the corresponding adapting areas, the surface to be worked and the working surface form a parallel relation; when only part of the infrared rays fall in the adjusting area, the position of the mechanical arm is adjusted until the infrared rays fall in the adapting area; when the receiver does not receive the infrared rays, an information processing unit in the infrared positioning instrument generates error reporting information and feeds the error reporting information back to a human-computer interface.
The beneficial effects of the invention include:
(1) A plurality of polishing devices and/or polishing devices are integrated, so that the occupied area of the devices is reduced; meanwhile, the adjustment steps of the mechanical arm are reduced, and directly, the time required by polishing and/or polishing work is reduced, and further, the possibility of errors in the adjustment process of the mechanical arm is reduced;
(2) The polishing and/or polishing precision is improved by matching the guiding structure and the infrared positioning instrument, the structures such as edges and corners and chamfers around the working surface are not worn, and the production qualification rate of products is improved;
(3) The polishing device has the advantages that the components of all polishing mechanisms are uniform, replacement and maintenance are convenient, the polishing device is matched with concise using steps, and the polishing device is high in applicability and easy to popularize and use.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate preferred embodiments of the invention and, together with the description, serve to explain the principles and advantages of the invention, and to serve as an aid in understanding the principles and advantages of the invention, in which:
FIG. 1 is a schematic diagram of an assembled configuration of a polishing apparatus;
FIG. 2 is a front view of the grinding mechanism;
fig. 3 is a side view of the grinding mechanism.
Reference numerals illustrate:
1, a polishing mechanism, a polishing belt, a working surface of 101a, a 102 guiding structure, a 102a initial guiding wheel, a 102b transition guiding wheel, a 102c final guiding wheel and a 103 tensioning structure;
2, a rotating mechanism, a 201 fixing frame and 202 rotating discs;
3, a base;
4 receiver, 401 adaptation field, 402 adjustment field.
Detailed Description
The invention is described in further detail below with reference to the drawings and the examples.
For the purposes of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and examples, it being understood that the specific examples described herein are intended to illustrate the present invention, not all the examples. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are within the scope of the present invention.
In all embodiments, the part to be sanded refers to the part to be used for sanding/polishing work, and the work surface of the part to be sanded refers to the work surface to be used for sanding/polishing work.
Example 1
As shown in fig. 1-3, the present embodiment provides a polishing apparatus, which includes at least two polishing mechanisms 1, a rotating mechanism 2 and a base 3, wherein the polishing mechanisms 1 are mounted on the rotating mechanism 2, and the base 3 is used for supporting and mounting the rotating mechanism 2.
The rest components on different polishing mechanisms 1 have the same composition, and the difference is that polishing belts or polishing belts 101 with different meshes are arranged; when in a working state, the polishing belt or the polishing belt 101 is driven to move by the corresponding driving device, each polishing belt or polishing belt 101 comprises a working surface 101a for contacting with a part to be polished, and the polishing belt or polishing belt 101 is suitable for planar polishing or polishing work due to the flat working surface 101 a.
The rotating mechanism 2 comprises a fixed frame 201 and a rotating disc 202, wherein the rotating disc 202 is used for supporting the fixed frame 201, the fixed frame 201 is used for fixedly mounting a plurality of polishing mechanisms 1, in the invention, when the polishing mechanisms 1 perform rotary movement, the moving track is arc-shaped, and the circle center of the arc-shaped moving track coincides with the center of the rotating disc 202.
As shown in fig. 1-2, in the present invention, it is further ensured that the working surfaces 101a on the polishing mechanisms 1 are far away from the rotating disc 202 and the distances from each working surface 101a to the center of the rotating disc 202 are equal. With this structure, the mechanical arm clamps the part to be polished and after the first adjustment work is completed, the first polishing/polishing work can be performed by being close to the polishing mechanism 1 located in the work area.
After the mechanical arm is completed, the mechanical arm only needs to move in the horizontal direction, so that the part to be polished is far away from the polishing mechanism 1, and the preparation work of the second polishing/polishing work is completed after the other needed polishing mechanism 1 rotates into the working area. The mechanical arm does not need to adjust the angle and the like of the working surface on the part to be polished.
In the grinding/polishing work, if any one adjustment work of the mechanical arm generates errors, the grinding/polishing precision is affected. For example, a front surface of a square component with a chamfer needs to be polished, the front surface is adjusted to be parallel to a working surface of a polishing belt in the first three adjustment operations of the mechanical arm, and only the top of the front surface is closer to the working surface than the bottom in the fourth adjustment operation, so that the chamfer structure at the top is worn after polishing is completed, and a position on the front surface close to the bottom may not meet polishing requirements.
When the invention is adopted to carry out polishing work involving multiple meshes or progressive polishing work from polishing, after the mechanical arm is adjusted for the first time, the mechanical arm is only required to be adjusted in a simple way in the horizontal direction in the subsequent process, and the adjustment of the distance between the mechanical arm and the mechanical arm in the horizontal direction is a variable easy to control, so that the possibility of error generation is further reduced.
Preferably, the polishing mechanism 1 is further provided with a guiding structure 102 for guiding the moving track of the polishing belt or polishing belt 101, so that the polishing belt or polishing belt 101 forms a closed loop structure, and the working surface 101a is kept flat.
Wherein the guide structure 102 is a structure including, but not limited to: the polishing belt or the polishing belt 101 is guided to form a closed loop structure by a plurality of guiding wheels, and simultaneously the polishing belt or the polishing belt 101 is tensioned by two or more guiding wheels to form a section of flat working surface 101a; the polishing belt or the polishing belt 101 is characterized by comprising a plurality of guide wheels and a support plate surface, wherein the support plate surface is positioned on the back surface of a working surface 101a of the polishing belt or the polishing belt 101 to provide support to form a section of a flat working surface 101a, the guide wheels are positioned at two ends of the support plate surface and are used for guiding the moving path of the rest part of the polishing belt or the polishing belt 101 to enable the polishing belt or the polishing belt 101 to form at least one of any part combination which can enable the polishing belt or the polishing belt 101 to form a closed-loop structure and has the flat working surface 101a, and the like.
Preferably, the guiding structure 102 comprises a plurality of guiding wheels and driving means, as shown in fig. 1, and the inner cavity of the polishing mechanism 1 may be used for installing corresponding driving means, and the driving means is used for providing a rotational driving force for the plurality of guiding wheels, so that the rotational speed of the plurality of guiding wheels is adapted to the moving speed of the polishing belt or the polishing belt, i.e. so that the moving speed of the whole parts of the polishing belt 101 after polishing the belt is the same.
Preferably, as shown in fig. 2, the guiding structure 102 comprises a primary guiding wheel 102a, a transition guiding wheel 102b and a final guiding wheel 102c, wherein the transition guiding wheel 102b is positioned between the primary guiding wheel 102a and the final guiding wheel 102c, contact tangents are formed when the three guiding wheels are connected with the polishing belt or polishing belt 101, and the three tangents are parallel to each other and all are on the same plane, so that the polishing belt or polishing belt 101 forms a flat surface between the primary guiding wheel 102a and the final guiding wheel 102c, the flat surface comprises a working surface 101a, and the working surface 101a is positioned between the primary guiding wheel 102a and the transition guiding wheel 102 b. In the non-lapping/polishing operation state, the flat surface is actually generated by tightening and supporting the initial guide wheel 102a and the final guide wheel 102c, so that the contact between the transition guide wheel 102b and the lapping or polishing belt 101 is not tight, and the lapping or polishing belt 101 is not deformed by the influence of the transition guide wheel 102b, such as wrinkles.
However, in the lapping/polishing working state, the lapping or polishing belt 101 is pressed, and is tightly attached to the transition guide wheel 102b, and the rotational speed of the transition guide wheel 102b is 1.2-1.4 times that of the rest guide wheels, so that the lapping or polishing belt 101 between the transition guide wheel 102b and the primary guide wheel 102a is tightened under the influence of the rotational speed difference between the adjacent two guide wheels, and further, a flat working surface 101a is formed between the transition guide wheel 102b and the primary guide wheel 102 a.
As shown in fig. 2, the transition guide wheel 102b guides the polishing belt or belt 101 to move upward, which provides a first upward tension force that is greater than a second tension force provided by the primary guide wheel 102a, while the friction force provided by the member to be polished is downward, canceling out the portion of the first tension force provided by the transition guide wheel 102b that is greater than the second tension force, so that the overall moving speed of the working surface 101a on the polishing belt or belt 101 still tends to be uniform.
Example 2
The difference between this embodiment and embodiment 1 is that the polishing mechanism 1 in this embodiment is further provided with a tensioning structure 103, and the tensioning structure 103 includes but is not limited to: a spring tensioning structure for applying a constant tensioning force to the tensioning wheel by means of a spring device; a hydraulic/pneumatic tensioning structure for adjusting the tensioning force of the tensioning wheel by controlling hydraulic pressure or pneumatic pressure using a hydraulic cylinder or a pneumatic cylinder; a mechanical tensioning structure for manually adjusting the position and tensioning force of the tensioning wheel through a mechanical handle or a screw device; and the sensor and the control system are utilized to realize any at least one of an automatic tensioning structure and the like for automatically monitoring and adjusting the tensioning force of the tensioning wheel.
As shown in fig. 2, the polishing belt or polishing belt 101 with a closed loop structure is guided by the guiding wheel in an additional direction, so that the polishing belt or polishing belt 101 is kept in a tight state during the working process, and the working surface 101a is kept flat. Since the grinding mechanism 1 is mainly suitable for planar grinding/polishing work, the flat working surface 101a will not cause abrasion of the structures such as edges, chamfers, fillets and the like around the working surface on the component to be ground.
Example 3
The difference between this embodiment and embodiment 1 or embodiment 2 is that the distance measuring device is further included in this embodiment, and the distance measuring device is used for detecting the distance between the workpiece to be polished and the working surface 101a in the working state.
The spacing between the part to be ground and the working surface 101a directly affects the amount of wear of the part to be ground. The smaller the distance between the member to be polished and the working face 101a, the larger the amount of wear of the member to be polished, and conversely, the smaller the amount of wear.
To ensure accurate control of the amount of wear, the spacing between the part to be polished and the working surface 101a can be measured experimentally first when the part to be polished reaches a specified amount of wear. And in actual production work, when the distance measuring device detects that the distance reaches the data obtained by the test, the result is fed back to the control unit of the mechanical arm, and the control unit can stop advancing the mechanical arm according to the information, so that the abrasion loss of polishing work is accurately controlled, the polishing work only occurs on the surface to be worked, and structures such as chamfer angles, round angles and the like around the surface to be worked are not involved.
Example 4
Compared with the embodiment 1, 2 or 3, the difference is that, as shown in fig. 3, the embodiment further includes an infrared positioner, the infrared positioner includes a plurality of infrared transmitters and a plurality of receivers 4, wherein the plurality of infrared transmitters are disposed on a mechanical arm for clamping a component to be polished, the receivers 4 are disposed on the polishing mechanism 1, a receiving surface of the receivers 4 includes an adapting area 401 and an adjusting area 402, the adapting area 401 is disposed on the receiving surface at intervals, and the rest areas on the receiving surface are the adjusting areas 402.
When the mechanical arm is adjusted accurately, the number of infrared emitters and the final landing point of the emitted infrared rays should be in one-to-one correspondence with the position of the adaptation area 401.
When the infrared rays can be received in each adapting area 401, it is indicated that the adjustment of the mechanical arm is completed, and the working surface to be worked and the working surface 101a form a corresponding parallel relationship.
However, for example, the part of the adapting zone 401 near the top of the grinding mechanism 1 receives no infrared ray, and the adapting zone 401 near the bottom receives the infrared ray, which indicates that the angle of the mechanical arm needs to be adjusted upwards;
also, for example, the adjustment area 402 near the side of the polishing belt or belt 101 receives infrared light, but the adjustment area 401 does not receive any infrared light, which indicates that the mechanical arm needs to perform displacement adjustment toward the side far from the polishing belt or belt 101;
the rest of the adjustment area 402 can receive infrared light, and the adaptation area 401 does not receive infrared light in its entirety or in part, and so on.
If the adapting area 401 and the adjusting area 402 do not receive infrared rays, it indicates that the position adjustment of the mechanical arm has a large offset in the overall direction, and error reporting information needs to be generated by an information processing unit in the infrared positioning instrument and fed back to the human-computer interface to request manual intervention for error correction adjustment.
Example 5
The embodiment provides an automatic production line comprising any one of the polishing devices in embodiments 1-4.
The automation refers to the automation operation of the mechanical arm adopted in the embodiment, and the automation operation of the mechanical arm is a mature prior art, and specific implementation manners thereof are not described in detail in the embodiment.
Example 6
The embodiment provides a method for using the polishing apparatus according to any of the embodiments 1 to 4 or the polishing apparatus in the automated production line of embodiment 5, including the following steps:
s1, enabling a polishing mechanism 1 to enter a working area by rotating a rotating disc 202;
s2, clamping a part to be polished by using a mechanical arm and adjusting the position of a surface to be polished on the part to be polished facing the polishing mechanism 1 in the working area;
at this time, the adjustment work of the mechanical arm in the whole direction is completed.
Specifically, the swing, the movement amplitude and the like of the mechanical arm can be controlled and limited by any at least one limiting component including a positioning block, a joint limiter and the like, so that the position adjustment of the component to be polished is ensured not to deviate greatly in the whole direction.
S3, adjusting the surface to be worked to be parallel to the working surface 101a;
at this time, a small-scale adjustment of the position of the member to be polished is performed.
The working surface to be worked is accurately matched with the working surface 101a, so that abrasion caused by structures such as chamfer angles, edges and the like around the working surface to be worked in subsequent work is avoided.
S4, pushing the mechanical arm to approach the polishing mechanism 1, and processing a working surface to be processed;
s5, after the mechanical arm is finished, the mechanical arm is adjusted to be far away from the polishing mechanism 1 in the horizontal direction;
other adjustment steps are reduced, thereby reducing the possibility of errors.
S6, enabling any other needed polishing mechanism 1 to move into a working area by rotating the rotating disc 202;
s7, repeating the steps S4-S6 until the grinding/polishing work is finished.
Preferably, in S3, the positioning result of the infrared positioning device is used as a basis for adjusting the position of the clamped part to be polished.
When the infrared rays emitted by the infrared emitters on the mechanical arm fall in the corresponding adapting areas 401, the working surface to be worked and the working surface 101a are in parallel relation;
when only part of the infrared rays fall in the adjustment area 402, adjusting the position of the mechanical arm until the infrared rays fall in the adaptation area 401;
when the receiver 4 does not receive the infrared rays, an information processing unit in the infrared positioning instrument generates error reporting information and feeds the error reporting information back to a human-computer interface to request manual intervention error correction.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme recorded in each embodiment can be modified or part of technical features in the technical scheme can be replaced equivalently; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1.一种打磨设备,其特征在于,包含有:1. A grinding equipment, characterized in that it contains: 至少两个打磨机构(1),分别设置有不同目数的打磨带或抛光带(101),若干个所述打磨带或抛光带(101)上均包含有用于与待打磨部件接触的工作面(101a);At least two grinding mechanisms (1) are respectively provided with grinding belts or polishing belts (101) with different mesh numbers. Several of the grinding belts or polishing belts (101) each include a working surface for contacting the component to be polished. (101a); 旋转机构(2),包含有固定架(201)以及旋转盘(202),所述旋转盘(202)用于承托所述固定架(201),所述固定架(201)用于固定安装若干个所述打磨机构(1),使得若干个所述工作面(101a)远离所述旋转盘(202)朝外,且到所述旋转盘(202)的中心的距离相等;The rotating mechanism (2) includes a fixed frame (201) and a rotating disk (202). The rotating disk (202) is used to support the fixed frame (201), and the fixed frame (201) is used for fixed installation. A plurality of the grinding mechanisms (1), such that a plurality of the working surfaces (101a) face outward away from the rotating disk (202) and are equidistant from the center of the rotating disk (202); 底座(3),用于活动安装所述旋转机构(2)。The base (3) is used to movablely install the rotating mechanism (2). 2.根据权利要求1所述的一种打磨设备,其特征在于,所述打磨机构(1)上还设置有引导结构(102),用于引导所述打磨带或抛光带(101)的移动轨迹,使所述打磨带或抛光带(101)形成闭环结构,且保持所述工作面(101a)处于平整状态。2. A grinding equipment according to claim 1, characterized in that the grinding mechanism (1) is also provided with a guide structure (102) for guiding the movement of the grinding belt or polishing belt (101) trajectory, so that the grinding belt or polishing belt (101) forms a closed-loop structure and keeps the working surface (101a) in a flat state. 3.根据权利要求2所述的一种打磨设备,其特征在于,所述引导结构(102)包含若干个引导轮以及驱动装置,所述驱动装置用于为若干个所述引导轮提供旋转驱动力,使得若干个所述引导轮的转速与打磨带或抛光带(101)的移动速度相适配。3. A grinding equipment according to claim 2, characterized in that the guide structure (102) includes a plurality of guide wheels and a driving device, and the driving device is used to provide rotational drive for a plurality of the guide wheels. force, so that the rotational speed of several guide wheels is adapted to the moving speed of the grinding belt or polishing belt (101). 4.根据权利要求3所述的一种打磨设备,其特征在于,所述引导结构(102)包含初引导轮(102a)、过渡引导轮(102b)以及终引导轮(102c),4. A grinding equipment according to claim 3, characterized in that the guide structure (102) includes an initial guide wheel (102a), a transition guide wheel (102b) and a final guide wheel (102c), 所述过渡引导轮(102b)位于所述初引导轮(102a)与所述终引导轮(102c)之间,三种引导轮与所述打磨带或抛光带(101)相接触,使得所述打磨带或抛光带(101)在所述初引导轮(102a)与所述终引导轮(102c)之间形成有平整的面且所述工作面(101a)位于所述过渡引导轮(102b)与所述初引导轮(102a)之间;The transition guide wheel (102b) is located between the initial guide wheel (102a) and the final guide wheel (102c), and the three guide wheels are in contact with the grinding belt or polishing belt (101), so that the The grinding belt or polishing belt (101) forms a flat surface between the initial guide wheel (102a) and the final guide wheel (102c), and the working surface (101a) is located on the transition guide wheel (102b) Between the initial guide wheel (102a); 所述过渡引导轮(102b)的转速为其余所述引导轮的转速的1.2~1.4倍。The rotation speed of the transition guide wheel (102b) is 1.2 to 1.4 times that of the other guide wheels. 5.根据权利要求1~4任意一项所述的一种打磨设备,其特征在于,所述打磨机构(1)上还设置有张紧结构(103),用于使得所述打磨带或抛光带(101)在工作过程中保持紧绷状态,保障所述工作面(101a)保持平整。5. A grinding equipment according to any one of claims 1 to 4, characterized in that the grinding mechanism (1) is also provided with a tensioning structure (103) for making the grinding belt or polishing machine The belt (101) remains in a tight state during the working process to ensure that the working surface (101a) remains flat. 6.根据权利要求1所述的一种打磨设备,其特征在于,还包含有测距装置,工作状态下用于检测所述待打磨部件与所述工作面(101a)之间的间距。6. The grinding equipment according to claim 1, further comprising a distance measuring device for detecting the distance between the component to be grinded and the working surface (101a) in working condition. 7.根据权利要求1所述的一种打磨设备,其特征在于,所述打磨设备还包含有红外线定位仪,所述红外线定位仪包含有若干个红外线发射器和接收器(4),7. A grinding equipment according to claim 1, characterized in that the grinding equipment further includes an infrared locator, and the infrared locator includes several infrared transmitters and receivers (4), 其中,若干个所述红外线发射器设置于用于夹取所述待打磨部件的机械臂上,Wherein, several of the infrared emitters are arranged on a mechanical arm used to clamp the parts to be polished, 所述接收器(4)设置于所述打磨机构(1)上,所述接收器(4)的接收面上包含适配区(401)和调整区(402),所述适配区(401)间隔地设置于所述接收面上,所述接收面上其余区域为调整区(402)。The receiver (4) is arranged on the grinding mechanism (1). The receiving surface of the receiver (4) includes an adaptation area (401) and an adjustment area (402). The adaptation area (401) ) are arranged at intervals on the receiving surface, and the remaining areas on the receiving surface are adjustment areas (402). 8.一种自动化生产线,其特征在于:包含有权利要求1~7中任一条所述的打磨设备。8. An automated production line, characterized by: including the grinding equipment described in any one of claims 1 to 7. 9.一种权利要求1~7中任一条所述的打磨设备的使用方法,其特征在于,包含如下步骤:9. A method of using the grinding equipment according to any one of claims 1 to 7, characterized in that it includes the following steps: S1.通过转动所述旋转盘(202),使得一个所述打磨机构(1)进入工作区域;S1. By rotating the rotating disk (202), one of the grinding mechanisms (1) enters the working area; S2.使用机械臂夹取所述待打磨部件并调整其上的待工作面朝向所述工作区域内的打磨机构(1)的所在位置;S2. Use a robotic arm to clamp the component to be polished and adjust the working surface on it to face the position of the polishing mechanism (1) in the working area; S3.调整所述待工作面与所述工作面(101a)相平行;S3. Adjust the surface to be worked to be parallel to the working surface (101a); S4.推进所述机械臂靠近所述打磨机构(1),对所述待工作面进行加工;S4. Push the robotic arm close to the grinding mechanism (1) to process the surface to be worked; S5.完成后,调整所述机械臂仅在水平方向上远离所述打磨机构(1);S5. After completion, adjust the mechanical arm only in the horizontal direction away from the grinding mechanism (1); S6.通过转动所述旋转盘(202),使得其他任意一个所需的所述打磨机构(1)移动至所述工作区域中;S6. By rotating the rotating disk (202), any other required grinding mechanism (1) can be moved to the working area; S7.重复S4~S6,直至打磨/抛光工作结束。S7. Repeat S4~S6 until the grinding/polishing work is completed. 10.根据权利要求9所述的一种打磨设备的使用方法,其特征在于,S3中采用红外线定位仪的定位结果作为被夹取的所述待打磨部件的位置调整依据;10. The method of using the grinding equipment according to claim 9, characterized in that in S3, the positioning result of the infrared positioner is used as the basis for position adjustment of the clamped component to be grinded; 所述机械臂上的红外线发射器发射的红外线均落在相应的适配区(401)内时,所述待工作面与所述工作面(101a)已形成平行关系;When the infrared rays emitted by the infrared emitter on the robotic arm fall within the corresponding adaptation area (401), the surface to be worked and the working surface (101a) have formed a parallel relationship; 所述红外线仅有部分落在调整区(402)内时,调整所述机械臂的位置,直至所述红外线均落在适配区(401)内;When only part of the infrared rays fall within the adjustment area (402), adjust the position of the robotic arm until all the infrared rays fall within the adaptation area (401); 所述接收器(4)未接收到所述红外线时,所述红外定位仪中的信息处理单元产生报错信息,并反馈至人机界面。When the receiver (4) does not receive the infrared ray, the information processing unit in the infrared locator generates an error message and feeds it back to the human-machine interface.
CN202311652212.3A 2023-12-05 2023-12-05 Grinding equipment, usage method and automated production line thereof Pending CN117564886A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311652212.3A CN117564886A (en) 2023-12-05 2023-12-05 Grinding equipment, usage method and automated production line thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311652212.3A CN117564886A (en) 2023-12-05 2023-12-05 Grinding equipment, usage method and automated production line thereof

Publications (1)

Publication Number Publication Date
CN117564886A true CN117564886A (en) 2024-02-20

Family

ID=89895405

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311652212.3A Pending CN117564886A (en) 2023-12-05 2023-12-05 Grinding equipment, usage method and automated production line thereof

Country Status (1)

Country Link
CN (1) CN117564886A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206568014U (en) * 2017-03-13 2017-10-20 淄博市技师学院 A kind of mechanical correcting device of emery wheel
WO2019140592A1 (en) * 2018-01-18 2019-07-25 常州恒联机械五金有限公司 Automatic handle-polishing apparatus
CN113560968A (en) * 2021-09-08 2021-10-29 阳江市安佳乐厨业有限公司 Manufacturing process and production line for automatic cutting edge of cutter by using robot technology
CN215201259U (en) * 2021-05-13 2021-12-17 苏州软体智能装备科技有限公司 Full-automatic grinding machine production line for vacuum cups
CN114393307A (en) * 2022-03-14 2022-04-26 浙江顺得机械有限公司 Two-side clamping type welding tool
CN216504141U (en) * 2021-12-17 2022-05-13 厦门鼎铸智能设备有限公司 Abrasive belt machine capable of converting multiple abrasive belts for use
CN221539281U (en) * 2023-12-05 2024-08-16 浙江顺得机械有限公司 Automatic change production line with equipment of polishing and automatic production line thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206568014U (en) * 2017-03-13 2017-10-20 淄博市技师学院 A kind of mechanical correcting device of emery wheel
WO2019140592A1 (en) * 2018-01-18 2019-07-25 常州恒联机械五金有限公司 Automatic handle-polishing apparatus
CN215201259U (en) * 2021-05-13 2021-12-17 苏州软体智能装备科技有限公司 Full-automatic grinding machine production line for vacuum cups
CN113560968A (en) * 2021-09-08 2021-10-29 阳江市安佳乐厨业有限公司 Manufacturing process and production line for automatic cutting edge of cutter by using robot technology
CN216504141U (en) * 2021-12-17 2022-05-13 厦门鼎铸智能设备有限公司 Abrasive belt machine capable of converting multiple abrasive belts for use
CN114393307A (en) * 2022-03-14 2022-04-26 浙江顺得机械有限公司 Two-side clamping type welding tool
CN221539281U (en) * 2023-12-05 2024-08-16 浙江顺得机械有限公司 Automatic change production line with equipment of polishing and automatic production line thereof

Similar Documents

Publication Publication Date Title
US4383393A (en) Automatic lens grinding machine
JP2023503402A (en) Portal grinder
CN115042060B (en) Remove pinch roller formula abrasive band and press mill mechanism
CN105690230B (en) A kind of full-automatic molding line polisher
CN110370169A (en) Clamp system, grinding device and polishing process
CN110587456A (en) Polishing equipment
WO2014049844A1 (en) Method for polishing board-like body, and apparatus for polishing board-like body
CN113500503B (en) Automobile wheel grinding and polishing system
CN221539281U (en) Automatic change production line with equipment of polishing and automatic production line thereof
US8684791B2 (en) Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials
CN117564886A (en) Grinding equipment, usage method and automated production line thereof
CN120985486A (en) An integrated multi-functional grinding equipment
CN112496984B (en) An automatic workstation for grinding metal sheets and sheet products
CN120055948A (en) Fine grinding polishing machine and fine grinding polishing method for spherical/aspherical workpieces
CN202344362U (en) Sapphire thinning machine
CN118578257A (en) Vertical grinding device
CN211387560U (en) Pen container positioning device
JP2019084624A (en) Method for production of glass plate and fixing apparatus for positioning of grind stone
CN111015164B (en) Pen holder positioning device and method
CN115741448A (en) Wafer grinding thickness control device and system
CN110000670B (en) Grinding machine and grinding and abrasive belt changing method thereof
CN106514473A (en) Automatic polishing machine for large planar disk
CN222932358U (en) Disc type slider double-end-face grinding tool
JPH11347901A (en) Truing tool and chamfering device for wafer therewith
CN116748979B (en) A method for polishing flat-edge silicon wafers

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination