CN117549491A - Multi-cavity batch molding of electronic product injection molds - Google Patents

Abstract

The invention belongs to the technical field of injection molds, and particularly relates to a multi-cavity batch molding injection mold for electronic products. During operation, the heated and melted material is injected into multiple molding molds through the gate, main flow channel, upper runner and lower runner respectively. In the cavity, it is cooled and formed into a plastic casing of an electronic product. It can be seen that on the one hand, the present invention effectively utilizes the upper molding insert and the lower molding insert to realize the integrated molding of the plastic shell of the electronic product, saving subsequent processing time; on the other hand, the present invention uses multiple upper molding inserts The multiple molding cavities defined in conjunction with the lower molding insert enable the mass production of plastic casings for electronic products. This enables the injection mold to double the plastic casings for electronic products while ensuring injection molding accuracy. The molding quantity is to achieve the effect of improving the production efficiency of plastic casings of electronic products while ensuring manufacturing accuracy.

Description

Multi-cavity batch molding of electronic product injection molds

Technical field

The invention belongs to the technical field of injection molds, and in particular relates to a multi-cavity batch molding injection mold for electronic products.

Background technique

Electronic products are related products that work based on electrical energy, such as cameras, speakers, air purifiers, etc. Because early products were mainly based on electron tubes, they were named electronic products. Among them, most parts of electronic products are related to plastic, especially the casings are made of plastic casings. Injection molding is a key step in the production process of plastic housings for electronic products. In the current injection molding process of plastic casings for electronic products, the heated and melted material is injected into the mold cavity at high pressure, and after cooling and solidification, the finished product is obtained. Usually, a single mold only has a single mold cavity, and it is impossible to pass through a single mold during processing. For mass production, if mass production is required, multiple sets of molds must be used simultaneously, which is costly and the production efficiency is low and cannot meet production needs.

Contents of the invention

The purpose of the present invention is to provide a multi-cavity batch molding injection mold for electronic products, aiming to solve the technical problem in the prior art that a single mold only has a single molding cavity, and thus mass production cannot be carried out through a single mold during processing.

In order to achieve the above object, an embodiment of the present invention provides a multi-cavity batch molding electronic product injection mold, including:

A fixed mold base, the upper surface of which is formed with a plurality of lower molding inserts with the same structure;

A movable mold base, the lower surface of which is formed with a plurality of upper molding inserts with the same structure;

When the movable mold base is closed to the fixed mold base, each of the upper molding inserts and the lower molding inserts are aligned and enclosed to form a mold for injection molding of plastic casings of electronic products. Cavities, that is, the plurality of upper molding inserts and the lower molding inserts cooperate to define a plurality of mold cavities;

Wherein, the movable mold base includes a gate provided at the center of the movable mold base, a main channel provided in the movable mold base and connected to the gate, and a correspondingly connected main channel and a plurality of main channels provided on the lower surface of the movable mold base. The upper shunt channel of the upper molding insert; and the upper surface of the fixed mold base is provided with lower shunt channels that communicate with a plurality of the lower molding inserts; the positions of the upper shunt channel and the lower shunt channel are aligned. Positive and interconnected; the heated and melted material is injected into a plurality of mold cavities through the gate, the main flow channel, the upper runner and the lower runner respectively, and is simultaneously cooled and formed into electronic products. plastic shell.

Optionally, the upper surface of the fixed mold base is formed with four lower molding inserts, and the lower surface of the movable mold base is formed with four upper molding inserts matching the four lower molding inserts. Molding inserts, four upper molding inserts and four lower molding inserts cooperate to define four molding cavities, which are used for injection molding of plastic casings of four electronic products.

Optionally, the four lower molding inserts are symmetrically distributed in an array in a rectangular area on the upper surface of the fixed mold base, that is, the two lower molding inserts located on the same side are one group and two groups. The lower molding inserts are symmetrically distributed on both sides of the lower runner with the lower runner as the center; and the four upper molding inserts are symmetrically arranged in an array in a rectangular area on the lower surface of the movable mold base. Distribution, that is, the two upper molding inserts located on the same side are one group, and the two groups of upper molding inserts are symmetrically distributed on both sides of the upper branching channel with the upper branching channel as the center.

Optionally, the fixed mold base remains stationary, and the movable mold base is movably plugged into the fixed mold base; wherein at least one corner of the fixed mold base has a lower positioning plug portion, and the movable mold base At least one corner of the base has an upper positioning plug portion that matches the lower positioning plug portion. The movable mold base and the fixed mold base pass through the upper positioning plug portion and the lower positioning plug portion. Embedding each other for positioning.

Optionally, the upper positioning plug-in part is a guide post, the lower positioning plug-in part is a guide hole, and the movable mold base and the fixed mold base are inserted into the guide hole through the guide column for positioning.

Optionally, the upper positioning plug-in part is a guide hole, the lower positioning plug-in part is a guide column, and the movable mold base and the fixed mold base are sleeved on the guide column through the guide hole. position.

Optionally, the fixed mold base has a lower positioning plug-in portion at two corners located on the same diagonal line, and the movable mold base has a lower positioning plug portion at two corners located on the same diagonal line. It has an upper positioning plug-in part.

Optionally, the fixed mold base and the movable mold base respectively have the lower positioning plug-in part and the upper positioning plug-in part at four corners.

Optionally, the multi-cavity batch molding electronic product injection mold also includes a product demoulding component, which is movably installed in the fixed mold base. The top ends of the product demoulding component are respectively Reach into the fixed mold base, the lower runner and the plurality of lower molding inserts to eject and demold the plastic shells of multiple electronic products at the same time.

Optionally, the product demoulding assembly includes a demoulding top plate, an outer edge ejector block, a runner ejector pin and a main body ejector pin; the demoulding top plate is movably installed in the fixed mold base; a plurality of the outer edge ejector pins The block is fixedly arranged on the upper surface of the demoulding top plate, and the top ends of the plurality of outer edge top blocks respectively extend into the fixed mold base and are located at the outer edges of the plurality of lower molding inserts; The runner ejector pins are fixedly arranged on the upper surface of the demoulding top plate, and the top ends of the plurality of runner ejector pins extend into the lower branch runner; the plurality of main body ejector pins are fixedly arranged on the upper surface of the demoulding top plate. , the top ends of the plurality of main body ejector pins respectively extend into the plurality of lower molding inserts.

The above one or more technical solutions in the multi-cavity batch molding electronic product injection mold provided by the embodiments of the present invention have at least one of the following technical effects: when the multi-cavity batch molding electronic product injection mold is in operation, the heated and melted material is The gate, main flow channel, upper runner and lower runner are respectively injected into multiple mold cavities while simultaneously cooling and forming the plastic shell of the electronic product. It can be seen that on the one hand, the present invention effectively utilizes the upper molding insert and the lower molding insert to realize the integrated molding of the plastic shell of the electronic product, saving subsequent processing time; on the other hand, the present invention uses multiple upper molding inserts The multiple molding cavities defined in conjunction with the lower molding insert enable the mass production of plastic casings for electronic products. This enables the injection mold to double the plastic casings for electronic products while ensuring injection molding accuracy. The molding quantity is to achieve the effect of improving the production efficiency of plastic casings of electronic products while ensuring manufacturing accuracy.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings in the following description are only illustrative of the present invention. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a perspective view of a multi-cavity batch molding electronic product injection mold provided by the present invention;

Figure 2 is an exploded view 1 of the multi-cavity batch molding electronic product injection mold provided by the present invention;

Figure 3 is the second exploded view of the multi-cavity batch molding electronic product injection mold provided by the present invention;

Figure 4 is a cross-sectional view of the multi-cavity batch molding electronic product injection mold provided by the present invention;

Figure 5 is a schematic structural diagram of the product demoulding assembly provided by the present invention.

Among them, each figure in the figure is marked with:

100. Fixed mold base; 110. Lower positioning plug-in part;

200. Moving mold base; 210. Upper positioning plug-in part;

300. Lower molding insert;

400. Upper molding insert;

500, gate;

600. Main channel;

700. Upper shunt;

800. Lower shunt;

900. Product release component; 910. Release top plate; 920. Outer edge top block; 930. Runner ejector pin; 940. Main body ejector pin.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are intended to explain the embodiments of the present invention and are not to be construed as limitations of the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical" ", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience and simplicity in describing the embodiments of the present invention. The description does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore is not to be construed as a limitation of the invention.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present invention, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In the embodiments of the present invention, unless otherwise expressly stipulated and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Disassembly and connection, or integration; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

In the first embodiment of the present invention, as shown in Figures 1 to 4, a multi-cavity batch molding electronic product injection mold is provided, including a fixed mold base 100 and a movable mold base 200.

A plurality of lower molding inserts 300 with the same structure are formed on the upper surface of the fixed mold base 100 , and a plurality of upper molding inserts 400 with the same structure are formed on the lower surface of the movable mold base 200 .

When the movable mold base 200 is closed to the fixed mold base 100, each of the upper molding inserts 400 and the lower molding inserts 300 are aligned and enclosed to form a plastic for injection molding electronic products. The molding cavities of the shell, that is, the plurality of upper molding inserts 400 and the lower molding inserts 300 cooperate to define a plurality of molding cavities;

The movable mold base 200 includes a gate 500 disposed in the center of the movable mold base 200 , a main channel 600 disposed in the movable mold base 200 and connected to the gate 500 , and a lower surface of the movable mold base 200 . There is an upper branch channel 700 that communicates with the main channel 600 and a plurality of the upper molding inserts 400; and the upper surface of the fixed mold base 100 is provided with a lower branch channel 800 that communicates with a plurality of the lower molding inserts 300; The upper runner 700 and the lower runner 800 are aligned and connected to each other; the heated and melted material passes through the gate 500 , the main channel 600 , the upper runner 700 and the lower runner 800 Inject into multiple mold cavities respectively and simultaneously cool and mold the plastic casing of the electronic product.

Specifically, in this embodiment, when the multi-cavity batch molding electronic product injection mold is working, the heated and melted material is injected into multiple molds through the gate 500, the main channel 600, the upper runner 700 and the lower runner 800. In the mold cavity, the plastic shell of the electronic product is formed into a plastic shell while cooling.

It can be seen that, on the one hand, the present invention effectively uses the upper molding insert 400 and the lower molding insert 300 to realize the integrated molding of the plastic shell of the electronic product, saving subsequent processing time; on the other hand, the present invention uses multiple upper molding inserts The multiple molding cavities defined by the insert 400 and the lower molding insert 300 realize the mass production of plastic casings for electronic products, thereby enabling the injection mold to double the quality of electronic products while ensuring injection molding accuracy. The molding quantity of the plastic casing of the product is to achieve the effect of improving the production efficiency of the plastic casing of electronic products while ensuring manufacturing accuracy.

In the second embodiment of the present invention, as shown in Figures 2-3, four lower molding inserts 300 are formed on the upper surface of the fixed mold base 100, and four lower mold inserts 300 are formed on the lower surface of the movable mold base 200. The four lower molding inserts 300 are matched with the four upper molding inserts 400. The four upper molding inserts 400 and the four lower molding inserts 300 cooperate to define four molding inserts. The mold cavity is used for injection molding the plastic casings of four electronic products.

Specifically, in this embodiment, the multi-cavity batch molding electronic product injection mold of the present invention is provided with four upper molding inserts 400 and lower molding inserts 300 on the movable mold base 200 and the fixed mold base 100, respectively. Four molding cavities are formed for injection molding plastic shells of electronic products, and the four molding cavities adopt injection molding paths with the same structure. In this way, four plastic shells of electronic products can be injection molded at one time, and all can achieve better results. Injection molding quality, thereby greatly improving the injection molding production efficiency of plastic shells for electronic products.

The remaining parts of this embodiment are the same as those of Embodiment 1. Features not explained in this embodiment are explained in Embodiment 1 and will not be described again here.

In the third embodiment of the present invention, as shown in Figures 2 to 3, the four lower molding inserts 300 are symmetrically distributed in an array in a rectangular area on the upper surface of the fixed mold base 100, that is, they are located on the same side. The two lower molding inserts 300 form a group, and the two groups of lower molding inserts 300 are symmetrically distributed on both sides of the lower runner 800 with the lower runner 800 as the center; and the four upper molding inserts The inserts 400 are symmetrically distributed in an array in a rectangular area on the lower surface of the movable mold base 200 , that is, the two upper molding inserts 400 located on the same side are one group, and the two upper molding inserts 400 are in one group. They are symmetrically distributed on both sides of the upper branch channel 700 with the upper branch channel 700 as the center.

Specifically, in this embodiment, the four upper molding inserts 400 and the lower molding inserts 300 are symmetrically distributed in an array, so that the upper molding inserts 400 and the lower molding inserts 300 are positioned between the movable mold base 200 and the fixed mold base 200 . The distribution on the mold base 100 is more compact and reasonable, thereby improving the space utilization of the multi-cavity batch molding electronic product injection mold of the present invention and reducing the mold cost. In addition, batch production is efficient and stable, and simultaneous injection molding has a high degree of uniformity, which improves the product qualification rate.

The remaining parts of this embodiment are the same as those of Embodiment 2. Features not explained in this embodiment are explained in Embodiment 2 and will not be described again here.

In the fourth embodiment of the present invention, as shown in Figures 2 to 3, the fixed mold base 100 remains stationary, and the movable mold base 200 is movably plugged into the fixed mold base 100; wherein the fixed mold base 200 is movably connected to the fixed mold base 100; At least one corner of the base 100 has a lower positioning plug portion 110, and at least one corner of the movable mold base 200 has an upper positioning plug portion 210 that matches the lower positioning plug portion 110. The movable mold base 200 The fixed mold base 100 is positioned by inserting the upper positioning plug portion 210 and the lower positioning plug portion 110 into each other.

Specifically, in this embodiment, through the arrangement of the upper positioning plug portion 210 and the lower positioning plug portion 110, the upper positioning plug portion can be used during the installation process between the movable mold base 200 and the fixed mold base 100. 210 and the lower positioning plug portion 110 are inserted into each other for positioning, thereby increasing the installation stability between the movable mold base 200 and the fixed mold base 100 .

The remaining parts of this embodiment are the same as those of Embodiment 1. Features not explained in this embodiment are explained in Embodiment 1 and will not be described again here.

In the fifth embodiment of the present invention, the upper positioning plug part 210 is a guide column, the lower positioning plug part 110 is a guide hole, and the movable mold base 200 and the fixed mold base 100 pass through the guide The post is inserted into the guide hole for positioning.

Specifically, in this embodiment, the upper positioning plug-in part 210 is a guide post, and the lower positioning plug-in part 110 is a guide hole, and both the guide post and the guide hole run up and down, and the guide post is inserted into the guide hole for positioning. This matching structure can ensure precise cooperation between the movable mold base 200 and the fixed mold base 100 during the mold closing process of the multi-cavity batch molding electronic product injection mold of the present invention, which is beneficial to ensuring the injection molding quality of the plastic shell of the electronic product.

The remaining parts of this embodiment are the same as those of Embodiment 4. Features not explained in this embodiment are explained in Embodiment 4 and will not be described again here.

In the sixth embodiment of the present invention, the upper positioning plug-in part 210 is a guide hole, the lower positioning plug-in part 110 is a guide column, and the movable mold base 200 and the fixed mold base 100 pass through the guide hole. The hole is sleeved on the guide post for positioning.

Specifically, in this embodiment, the upper positioning plug-in part 210 is a guide hole, and the lower positioning plug-in part 110 is a guide post, and both the guide post and the guide hole run up and down, and the guide hole is sleeved on the guide post for positioning. , this matching structure can ensure precise cooperation between the movable mold base 200 and the fixed mold base 100 during the mold closing process of the multi-cavity batch molding electronic product injection mold of the present invention, which is beneficial to ensuring the injection molding quality of the plastic shell of the electronic product.

The remaining parts of this embodiment are the same as those of Embodiment 4. Features not explained in this embodiment are explained in Embodiment 4 and will not be described again here.

In the seventh embodiment of the present invention, the fixed mold base 100 has a lower positioning plug portion 110 at two corners located on the same diagonal line, and the movable mold base 200 has a lower positioning plug portion 110 at two corners located on the same diagonal line. Two corners on the line respectively have an upper positioning plug portion 210 .

Specifically, in this embodiment, the upper positioning plug-in part 210 and the lower positioning plug-in part 110 are respectively provided at both ends of a diagonal line of the movable mold base 200 and the fixed mold base 100, thereby reducing the problem of The deflection and misalignment of the movable mold base 200 when the mold is closed or removed from the fixed mold base 100 reduces the damage to the multiple upper molding inserts 400 , the lower molding insert 300 and the plastic shells of electronic products during the mold removal process. .

The remaining parts of this embodiment are the same as those of Embodiment 4. Features not explained in this embodiment are explained in Embodiment 4 and will not be described again here.

In the eighth embodiment of the present invention, as shown in Figures 2 to 3, the fixed mold base 100 and the movable mold base 200 respectively have the lower positioning plug-in part 110 and the upper positioning part at four corners. Plug-in part 210.

Specifically, in this embodiment, by providing upper positioning plug-in parts 210 and lower positioning plug-in parts 110 at the four corners of the movable mold base 200 and the fixed mold base 100, it is possible to avoid the movable mold base 200 when closing or removing the mold from the fixed mold base 100, thus eliminating the damage to the multiple upper molding inserts 400, the lower molding insert 300 and the plastic casings of the electronic products during the mold removal process.

The remaining parts of this embodiment are the same as those of Embodiment 4. Features not explained in this embodiment are explained in Embodiment 4 and will not be described again here.

In the ninth embodiment of the present invention, as shown in Figure 4, the multi-cavity batch molding electronic product injection mold also includes a product demoulding assembly 900, and the product demoulding assembly 900 is movably installed on the fixed mold. In the base 100, the top ends of the product demoulding components 900 respectively extend into the fixed mold base 100, the lower runner 800 and the plurality of lower molding inserts 300, so as to remove the plastics of multiple electronic products. The shell is ejected from the mold at the same time.

Specifically, by adding a product demoulding assembly 900 to the multi-cavity batch molding electronic product injection mold of the present invention, it is extremely convenient to complete the ejection and demoulding work of the plastic shells of multiple electronic products after cooling, without the need for manual extraction. Separation greatly improves the demoulding efficiency, thereby improving the production efficiency of injection molded products, and has a simple structure and low maintenance costs.

Wherein, as shown in Figure 5, the product demoulding assembly 900 includes a demoulding top plate 910, an outer edge top block 920, a runner ejector pin 930 and a main body ejector pin 940; the demoulding top plate 910 is movably installed on the fixed mold In the base 100; a plurality of outer edge push blocks 920 are fixedly arranged on the upper surface of the demoulding top plate 910, and the top ends of the plurality of outer edge push blocks 920 respectively extend into the fixed mold base 100 and are located at multiple positions. at the outer edge of the lower molding insert 300; a plurality of runner ejector pins 930 are fixedly arranged on the upper surface of the demoulding top plate 910, and the top ends of the plurality of runner ejector pins 930 extend into the lower branch flow In the channel 800; a plurality of main body ejector pins 940 are fixedly arranged on the upper surface of the demoulding top plate 910, and the top ends of the plurality of main body ejector pins 940 respectively extend into a plurality of the lower molding inserts 300.

It can be seen that the product demoulding assembly 900 can use the demoulding top plate 910 to drive the outer edge top block 920, the flow channel ejector pin 930 and the main body ejector pin 940 to simultaneously push the movement of the plastic shells of multiple electronic products to be demolded, thereby reducing the Since all parts of the plastic shell of the electronic product to be demolded cannot be demoulded at the same time, the plastic shell of the electronic product may be partially distorted or whitened, thereby protecting the product from damage during the demoulding process.

The remaining parts of this embodiment are the same as those of Embodiment 1. Features not explained in this embodiment are explained in Embodiment 1 and will not be described again here.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. A multi-cavity batch molding injection mold for electronic products, which is characterized by including: A fixed mold base, the upper surface of which is formed with a plurality of lower molding inserts with the same structure; A movable mold base, the lower surface of which is formed with a plurality of upper molding inserts with the same structure; When the movable mold base is closed to the fixed mold base, each of the upper molding inserts and the lower molding inserts are aligned and enclosed to form a mold for injection molding of plastic casings of electronic products. Cavities, that is, the plurality of upper molding inserts and the lower molding inserts cooperate to define a plurality of mold cavities; Wherein, the movable mold base includes a gate provided at the center of the movable mold base, a main channel provided in the movable mold base and connected to the gate, and a correspondingly connected main channel and a plurality of main channels provided on the lower surface of the movable mold base. The upper shunt channel of the upper molding insert; and the upper surface of the fixed mold base is provided with lower shunt channels that communicate with a plurality of the lower molding inserts; the positions of the upper shunt channel and the lower shunt channel are aligned. Positive and interconnected; the heated and melted material is injected into a plurality of mold cavities through the gate, the main flow channel, the upper runner and the lower runner respectively, and is simultaneously cooled and formed into electronic products. plastic shell. 2. The multi-cavity batch molding electronic product injection mold according to claim 1, characterized in that: the upper surface of the fixed mold base is formed with four lower molding inserts, and the lower surface of the movable mold base is Four upper molding inserts matching the four lower molding inserts are formed, and the four upper molding inserts cooperate with the four lower molding inserts to define four molding molds. Cavity, used to injection mold the plastic housings of four electronic products. 3. The multi-cavity batch molding electronic product injection mold according to claim 2, characterized in that: the four lower molding inserts are symmetrically distributed in an array in a rectangular area on the upper surface of the fixed mold base, That is, the two lower molding inserts located on the same side form one group, and the two groups of lower molding inserts are symmetrically distributed on both sides of the lower runner with the lower runner as the center; and the four upper molding inserts are The inserts are symmetrically distributed in an array in a rectangular area on the lower surface of the movable mold base, that is, the two upper molding inserts located on the same side are one group, and the two groups of upper molding inserts are formed by the upper mold base. The shunt channels are centrally symmetrically distributed on both sides of the upper shunt channel. 4. The multi-cavity batch molding electronic product injection mold according to claim 1, characterized in that: the fixed mold base remains stationary, and the movable mold base is movably plugged into the fixed mold base; wherein At least one corner of the fixed mold base has a lower positioning plug-in part, and at least one corner of the movable mold base has an upper positioning plug-in part that matches the lower positioning plug-in part. The movable mold base and the The fixed mold base is positioned by being embedded in each other by the upper positioning plug-in part and the lower positioning plug-in part. 5. The multi-cavity batch molding electronic product injection mold according to claim 4, characterized in that: the upper positioning plug-in part is a guide post, the lower positioning plug-in part is a guide hole, and the movable mold base The fixed mold base is inserted into the guide hole through the guide pillar for positioning. 6. The multi-cavity batch molding electronic product injection mold according to claim 4, characterized in that: the upper positioning plug-in part is a guide hole, the lower positioning plug-in part is a guide column, and the movable mold base The fixed mold base is sleeved on the guide column through the guide hole for positioning. 7. The multi-cavity batch molding electronic product injection mold according to claim 4, characterized in that: the fixed mold base has a lower positioning plug-in portion at two corners located on the same diagonal line. , the movable mold base has an upper positioning plug-in part at two corners located on the same diagonal line. 8. The multi-cavity batch molding electronic product injection mold according to claim 4, characterized in that: the fixed mold base and the movable mold base respectively have the lower positioning plug-in portion and the lower positioning connector at the four corners. Position the plug part as above. 9. The multi-cavity batch molding electronic product injection mold according to claim 1, characterized in that: the multi-cavity batch molding electronic product injection mold further includes a product demoulding component, and the product demoulding component is movable Installed in the fixed mold base, the top end of the product demoulding assembly respectively extends into the fixed mold base, the lower runner and the plurality of lower molding inserts to separate the plurality of electronic products. The plastic shell is ejected from the mold at the same time. 10. The multi-cavity batch molding electronic product injection mold according to claim 9, characterized in that: the product demoulding assembly includes a demoulding top plate, an outer edge top block, a flow channel ejector pin and a main body ejector pin; The mold top plate is movably installed in the fixed mold base; a plurality of outer edge top blocks are fixedly arranged on the upper surface of the demoulding top plate, and the top ends of the multiple outer edge top blocks extend into the fixed mold base respectively. inside and located at the outer edges of the plurality of lower molding inserts; a plurality of runner ejector pins are fixedly arranged on the upper surface of the demoulding top plate, and the top ends of the plurality of runner ejector pins extend into the lower branch flow In the middle of the road; a plurality of main body ejector pins are fixedly arranged on the upper surface of the demoulding top plate, and the top ends of the plurality of main body ejector pins respectively extend into a plurality of the lower molding inserts.