CN117545166A - Flexible metal-clad plate, preparation method thereof and flexible circuit board - Google Patents
Flexible metal-clad plate, preparation method thereof and flexible circuit board Download PDFInfo
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- CN117545166A CN117545166A CN202311560989.7A CN202311560989A CN117545166A CN 117545166 A CN117545166 A CN 117545166A CN 202311560989 A CN202311560989 A CN 202311560989A CN 117545166 A CN117545166 A CN 117545166A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 208
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 111
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000012790 adhesive layer Substances 0.000 claims abstract description 68
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 24
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 24
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000009719 polyimide resin Substances 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920005749 polyurethane resin Polymers 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000011056 performance test Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 229920001774 Perfluoroether Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
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- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000013101 initial test Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The application belongs to the technical field of printed circuits. The application discloses a flexible metal-clad plate, which comprises an adhesive layer, a substrate layer and a metal layer; the substrate layer is arranged on at least one side of the bonding layer, the substrate layer comprises at least one of polytetrafluoroethylene resin or soluble polytetrafluoroethylene resin, and the substrate layer comprises a through hole; the metal layer is arranged on one side of the substrate layer far away from the bonding layer; part of the adhesive layer fills into the through hole. The application also discloses a preparation method of the flexible metal-clad plate. The application also discloses a flexible circuit board. The flexible metal-clad plate disclosed by the application is good in dimensional stability, stable in structure and high in reliability.
Description
Technical Field
The invention belongs to the technical field of printed circuits, and particularly relates to a flexible metal-clad plate, a preparation method thereof and a flexible circuit board.
Background
With the development of communication technology, the propagation speed of signals is faster, the delay is lower, and the propagation frequency is higher.
The transmission loss of the signal is larger at high frequency, and the dielectric constant of the traditional flexible metal-clad plate is higher, so that the dielectric loss is larger, and the high-frequency signal can be absorbed or lost when the flexible metal-clad plate is applied to the high-frequency signal. Therefore, there is a need to develop materials with low dielectric constants and low dielectric losses. The polytetrafluoroethylene resin has low dielectric constant and small dielectric loss factor, and is an ideal high-frequency microwave dielectric material.
However, in the process of implementing the technical scheme in the embodiment of the present application, the applicant finds that at least the following technical problems exist in the above technology:
the adhesion between the polytetrafluoroethylene resin and the metal is small, and the polytetrafluoroethylene is easy to fall off among layers when being applied to the flexible metal-clad plate; in addition, polytetrafluoroethylene resin has a large linear expansion coefficient, is not bending-resistant, and cannot be directly applied to the field of flexible copper-clad plates.
Disclosure of Invention
The embodiment of the application provides the flexible metal-clad plate with good dimensional stability and reliability, and the flexible metal-clad plate has good bonding performance among layers.
The application provides a flexible metal-clad sheet comprising an adhesive layer, a substrate layer, and a metal layer; the substrate layer is arranged on at least one side of the bonding layer, the substrate layer comprises at least one of polytetrafluoroethylene resin or soluble polytetrafluoroethylene resin, and the substrate layer comprises a through hole; the metal layer is arranged on one side of the substrate layer far away from the bonding layer; portions of the adhesive layer fill into the through holes of the substrate layer and connect to the metal layer.
Further, the aperture of the through hole is 0.1-1mm, and the porosity of the substrate layer is 30-60%.
Further, the pore diameter of the through hole is 0.5-0.8mm, and the porosity of the substrate layer is 40-50%.
Further, the bonding strength between the substrate layer and the metal layer is 6N/cm or more, and the bonding strength between the adhesive layer and the substrate layer is 6N/cm or more.
Further, the water absorption of the flexible metal-clad plate is 0.1% -0.3%, the water absorption of the adhesive layer is 0.3% -0.5%, and the water absorption of the base material layer is 0.01% -0.05%.
Further, the thickness of the metal layer is 6-50 μm, the thickness of the adhesive layer is 6-50 μm, and the thickness of the base material layer is 6-50 μm.
Further, the adhesive layer includes at least one of polyimide resin, epoxy resin, or polyurethane resin.
Further, the metal layer includes at least one of copper element, nickel element, palladium element, silver element, or platinum element.
The application provides a preparation method of a flexible metal-clad plate, which is used for preparing any one of the flexible metal-clad plates;
it specifically comprises a step of, in particular,
and (3) hole making: preparing a through hole penetrating through the substrate layer in the substrate layer;
and (3) primary pressing: laminating the substrate layer and the metal layer;
and (3) coating and curing: coating a first resin solution on the surface of the substrate layer far away from the metal layer, and forming a bonding layer after curing to prepare a flexible metal-clad plate with a single-sided structure;
further, the preparation method also comprises the steps of,
and (3) secondary lamination: and symmetrically pressing the two flexible metal-clad plates with the single-sided structure in a mode that the metal layers are arranged on the outer sides, so as to obtain the flexible metal-clad plate with the double-sided structure.
The application also provides a flexible circuit board which comprises any one of the flexible metal-clad plates or the flexible metal-clad plate manufactured by any one of the manufacturing methods.
According to the flexible metal-clad plate, through the through holes are formed in the substrate layer of the flexible metal-clad plate, the bonding layer is partially filled into the through holes and connected to the metal layer, so that the layers of the flexible metal-clad plate are more stable and are not easy to separate, and the reliability of the flexible metal-clad plate is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a flexible metal clad sheet according to one embodiment of the present application;
FIG. 2 is a schematic exploded view of a flexible metal clad sheet in one embodiment of the present application;
FIG. 3 is a schematic top view of a flexible metal clad sheet according to one embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a flexible metal clad sheet according to one embodiment of the present application;
fig. 5 is a schematic cross-sectional structure of the flexible metal-clad sheet of comparative example 1.
In the figure: the flexible metal clad sheet 100, the adhesive layer 11, the base material layer 12, the through hole 121, and the metal layer 13.
Detailed Description
In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.
The present embodiment provides a flexible metal-clad sheet 100 as shown in fig. 1, the flexible metal-clad sheet 100 including an adhesive layer 11, a base material layer 12, and a metal layer 13. The substrate layer 12 is disposed on at least one side of the adhesive layer 11, and the metal layer 13 is disposed on a side of the substrate layer 12 remote from the adhesive layer 11. As shown in fig. 2 and 3, the substrate layer 12 further includes a through hole 121, the through hole 121 penetrates the substrate layer 12 in a direction perpendicular to the substrate layer 12, and the adhesive layer 11 is partially filled into the through hole 121. The adhesive layer 11 is partially connected to the metal layer 13 through the via 121. The adhesive strength of the adhesive layer 11 and the metal layer 13 is greater than the adhesive strength of the substrate layer 12 and the metal layer 13, and the dielectric constant of the adhesive layer 11 is greater than the dielectric constant of the substrate layer 12. The substrate layer 12 has a low dielectric constant and a low dissipation factor, and can provide the flexible metal-clad plate 100 with better dielectric properties. The flexible metal-clad sheet 100 is further provided with an adhesive layer 11, and the adhesive layer 11 has better adhesion to the metal layer 13. The adhesive layer 11 is partially connected to the metal layer 13 through the through hole 121, and the base material layer 12 is fixed, so that the layers of the flexible metal clad sheet 100 are not easily separated, and the stability of the structure of the flexible metal clad sheet 100 is improved. The through-hole 121 stabilizes the structure of the flexible metal-clad plate 100 and improves the dimensional stability of the flexible metal-clad plate 100.
As an alternative embodiment, the flexible metal clad sheet 100 may be of a single sided construction (as shown in fig. 1). The flexible metal-clad sheet 100 of a single-sided structure has a base material layer 12 provided on one side of the adhesive layer 11, and a metal layer 13 provided on one side of the base material layer 12 remote from the adhesive layer 11. The flexible metal clad sheet 100 may also be of a double sided construction (as shown in fig. 4). The flexible metal-clad plate 100 with a double-sided structure is characterized in that the substrate layers 12 are respectively arranged on two sides of the bonding layer 11, and the metal layers 13 are arranged on one sides of the substrate layers 12 away from the bonding layer 11. Specifically, the structure of the flexible metal-clad sheet 100 may be selected according to actual requirements.
As an alternative embodiment, the aperture of the through hole 121 is 0.1-1mm. The size and shape of the through holes in the substrate layer may be uniform or non-uniform. Too small a pore diameter of the through-hole 121 makes impregnation of the adhesive layer 11 difficult. Too large a hole diameter of the through hole 121 may decrease the area occupied by the base material layer 12 per unit area, and may decrease the dielectric performance of the base material layer 12. The pore diameter of the through-hole 121 is 0.1-1mm, which ensures that the adhesive layer 11 can fill the through-hole 121 of the substrate layer 12 and that the substrate layer 12 has maintained good dielectric properties. Preferably, the aperture of the through-hole 121 is 0.5-0.8mm, ensuring that the adhesive layer 11 is easy to impregnate the through-hole 121 and ensuring good dielectric properties of the substrate layer 12.
As an alternative embodiment, the porosity of the substrate layer 12 is 30-60%. Too low a porosity of the substrate layer 12 may result in too little adhesive layer 11 in the through hole 121, which may result in poor adhesion of the adhesive layer 11 to the metal layer 13, and thus in easy delamination of the metal layer 13. Too high a porosity of the substrate layer 12 may reduce the content of the substrate layer 12 per unit volume, thereby degrading the dielectric properties of the substrate layer 12. The porosity of the substrate layer 12 is 30-60% to ensure structural stability of the flexible metal clad sheet 100 and good dielectric properties. Preferably, the porosity of the substrate layer 12 is 40-50% to ensure a stable structure and excellent electrical properties of the flexible metal clad sheet 100.
As an alternative embodiment, the thickness of the adhesive layer 11 is 6-50 μm. Too thin an adhesive layer 11 may make the strength of the adhesive layer 11 low, and the adhesive layer 11 may be easily broken during use of the flexible metal clad sheet 100, resulting in damage to the flexible metal clad sheet 100. Too thick adhesive layer 11 may reduce the flexibility of flexible metal-clad sheet 100 and may not meet the light and thin use requirements of flexible metal-clad sheet 100. Too thick an adhesive layer 11 may also lead to a decrease in the dielectric properties of the flexible metal-clad sheet 100. Preferably, the thickness of the adhesive layer 11 is 12-25 μm, ensuring high mechanical strength and good flexibility of the adhesive layer 11. The thickness of the base material layer 12 is 6-50 μm, and the base material layer 12 is ensured to have good poor insulation and dielectric properties. Preferably, the thickness of the base material layer 12 is 12-25 μm, ensuring that the flexible metal-clad sheet 100 is thin and lightweight and has good electrical properties.
As an alternative embodiment, the thickness of the metal layer 13 is 6-50 μm. Too thin a metal layer 13 increases the electrical resistance of the flexible metal-clad sheet 100 and increases the electrical loss during transmission of electrical signals. Meanwhile, the mechanical strength of the metal layer 13 which is too thin is too low, so that the flexible metal clad sheet 100 is easy to break when in use or storage, and the flexible metal clad sheet 100 is broken, so that the flexible metal clad sheet 100 is scrapped, and the service life of the flexible metal clad sheet is reduced. Too thick metal layer 13 may reduce the flexibility of the flexible metal-clad sheet 100, and may not meet the high density and miniaturization development requirements of electronic products. Preferably, the thickness of the metal layer 13 is 12-25 μm, ensuring excellent electrical properties and flexibility of the flexible metal-clad sheet 100.
As an alternative embodiment, the adhesive layer 11 includes at least one of polyimide resin, epoxy resin, or polyurethane resin. Preferably, the polyimide resin, which has good heat transfer properties, may facilitate cooling of the flexible metal clad sheet 100, and a higher glass transition temperature of the polyimide resin may enable good operation of the flexible metal clad sheet 100 at higher temperatures. Meanwhile, the polyimide resin has a smaller bending modulus, so that the flexibility of the flexible metal-clad plate 100 can be increased, the application range of the flexible metal-clad plate 100 is widened, and the requirement of the flexibility of the flexible metal-clad plate 100 is met. The polyimide resin has good adhesion to metal, and the adhesive layer 11 is connected to the metal layer 13 through the through hole 121. The polyimide resin has good adhesion performance, and can make the adhesive layer 11 and the metal layer 13 have higher adhesion strength under a smaller contact area, so that the structure of the flexible metal clad plate 100 is more stable.
As an alternative embodiment, the substrate layer 12 comprises at least one of polytetrafluoroethylene resin or soluble polytetrafluoroethylene resin. The soluble Polytetrafluoroethylene (PFA) contains perfluoroalkoxy groups in the molecular structure, corresponding to substitution of one fluorine atom in Polytetrafluoroethylene (PTFE) with perfluoroalkoxy groups. A carbon in Polytetrafluoroethylene (PTFE) is directly attached to an oxygen which is then attached to a group such as a perfluoromethyl or perfluoroethyl group. Compared with polytetrafluoroethylene, the soluble polytetrafluoroethylene has low melt viscosity and is beneficial to processing. The polytetrafluoroethylene resin and the soluble polytetrafluoroethylene resin both have lower dielectric constants, so that the dielectric loss of the flexible metal-clad plate 100 can be reduced, and the flexible metal-clad plate 100 can be ensured to rapidly transmit electric signals.
As an alternative embodiment, the metal layer 13 includes at least one of copper element, nickel element, palladium element, silver element, or platinum element. These metal elements have good conductivity, and can ensure good electrical properties of the flexible metal-clad sheet 100. Preferably, the metal layer 13 is composed of copper elements. Specifically, the copper layer may be an electronic grade copper foil including at least one of electrolytic copper and rolled copper. Copper has low surface oxygen characteristics, can be attached to various substrates, and has a wide temperature range, so that the flexible metal clad sheet 100 can exhibit good service performance over a wide temperature range. Copper has excellent conductivity and ductility, and provides the flexible metal clad sheet 100 with good electrical properties and flexibility.
As an alternative embodiment, the adhesive strength between the substrate layer 12 and the metal layer 13 is 6N/cm or more, and the adhesive strength between the adhesive layer 11 and the substrate layer 12 is 6N/cm or more. The adhesive layer 11 is connected to the metal layer 13 through the through hole 121, and the adhesive strength between the adhesive layer 11 and the metal layer 13 is high, and in general, the adhesive strength between the adhesive layer 11 and the metal layer 13 is 12N/cm or more, so that the structure of the flexible metal-clad sheet 100 can be further stabilized. The flexible metal-clad sheet 100 is ensured not to be peeled off between the layers of the flexible metal-clad sheet 100 during long-term use, and the reliability of the flexible metal-clad sheet 100 is improved.
As an alternative embodiment, the water absorption of the adhesive layer 11 is 0.3 to 0.8% and the water absorption of the base material layer 12 is 0.01 to 0.1%. The water absorption of the flexible metal clad sheet 100 is 0.1 to 0.5%. The water absorption of the adhesive layer 11 is low, and the substrate layer 12 can further reduce the water absorption of the flexible metal clad sheet 100, so that the water absorption of the flexible metal clad sheet 100 is 0.1-0.5%, and the reliability of the flexible metal clad sheet 100 is greatly improved.
The embodiment of the application provides a preparation method of the flexible metal-clad plate 100, which is used for preparing any one of the flexible metal-clad plates 100. The preparation method specifically comprises hole making, one-time pressing and coating. The substrate layer 12 is perforated, and a plurality of through holes 121 penetrating the substrate layer 12 in a direction perpendicular to the substrate layer are formed in the substrate layer 12. The through-holes 121 may be prepared by vacuum suction or conventional hole making methods. The conventional pore-forming method includes at least one of conventional pore-forming (forming a pore structure using high temperature or pressure), ion beam drilling, laser processing, thermal stimulation pore-forming, chemical pore-forming, laser pore-forming, electrochemical pore-forming, jet pore-forming, or abrasive grinding pore-forming. And then the base material layer 12 and the metal layer 13 are pressed for one time, and the base material layer 12 and the metal layer 13 are pressed under the conditions of 160-220 ℃ and 3-10MPa. After lamination, coating is carried out, the adhesive layer 11 solution is coated on the surface of the substrate layer 12, and is dried at 70-160 ℃ and cured at 260-350 ℃, thus obtaining the flexible metal-clad plate 100 with a single-sided structure.
As an alternative embodiment, the method of manufacturing the flexible metal clad sheet 100 further includes a secondary lamination. The two flexible metal-clad plates 100 with single-sided structures are symmetrically pressed together in a manner that the metal layer 13 is arranged on the outer side, and the pressing condition is 220-280 ℃ and 3-10MPa. After the secondary lamination, a flexible metal clad sheet 100 of a double-sided structure is obtained.
As an alternative embodiment, the substrate layer 12 may also be surface treated prior to one lamination of the method of manufacturing the flexible metal clad sheet 100. The surface of the substrate layer 12 is treated by adopting a corona or frosting scheme, so that the surface tension is more than or equal to 50 dynes, and the adhesion force between the substrate layer 12 and the metal layer 13 is improved.
The embodiment provides a flexible circuit board, which comprises any one of the flexible metal-clad plates 100 or the flexible metal-clad plate 100 manufactured by any one of the manufacturing methods. The flexible metal-clad sheet 100 has excellent dielectric properties, and the flexible metal-clad sheet 100 is stable in structure and highly reliable.
The present application is further described below with reference to examples, but the scope of protection of the present application is not limited to the examples.
Example 1
As shown in fig. 4, a flexible metal-clad sheet 100 of a double-sided structure, the flexible metal-clad sheet 100 including an adhesive layer 11, a base material layer 12, and a metal layer 13. The base material layer 12 is arranged on two sides of the bonding layer 11, and the metal layer 13 is arranged on one side of the base material layer 12 away from the bonding layer 11. The base material layer 12 includes a through hole 121 penetrating the base material layer 12, and the adhesive layer 11 is partially filled into the through hole 121. Wherein the thickness of the two substrate layers 12 is the same and the thickness of the two metal layers 13 is the same.
Specifically, the adhesive layer 11 is made of polyimide resin, and the thickness of the adhesive layer 11 is 12 μm. The base material layer 12 is made of polytetrafluoroethylene resin, and the thickness of the base material layer 12 is 12 μm. The metal layer 13 is copper foil, and the thickness of the metal layer 13 is 12 μm. The porosity of the substrate layer 12 was 50%. The aperture of the through hole 121 is 0.6mm.
Example 2
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 12 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 12 μm.
Example 3
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 12 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 25 μm.
Example 4
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 25 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 12 μm.
Example 5
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 25 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 25 μm.
Example 6
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 50 μm, the thickness of the base material layer 12 was adjusted to 50 μm, and the thickness of the metal layer 13 was adjusted to 50 μm.
Example 7
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 6. Mu.m, the thickness of the base layer 12 was adjusted to 6. Mu.m, and the thickness of the metal layer 13 was adjusted to 6. Mu.m.
Example 8
The procedure of example 1 was repeated except for the following features.
The porosity of the base material layer 12 was adjusted to 30%, and the pore diameter of the through-hole 121 was adjusted to 0.1mm.
Example 9
The procedure of example 1 was repeated except for the following features.
The porosity of the base material layer 12 was adjusted to 40%, and the pore diameter of the through-hole 121 was adjusted to 1.0mm.
Example 10
The procedure of example 1 was repeated except for the following features.
The porosity of the base material layer 12 was adjusted to 60%, and the pore diameter of the through-hole 121 was adjusted to 0.8mm.
Example 11
The procedure of example 1 was repeated except for the following features.
The porosity of the base material layer 12 was adjusted to 50%, and the pore diameter of the through-hole 121 was adjusted to 0.3mm.
Example 12
The procedure of example 1 was repeated except for the following features.
The base material layer 12 is made of a soluble polytetrafluoroethylene resin.
Example 13
The procedure of example 1 was repeated except for the following features.
The adhesive layer 11 is made of epoxy resin.
Example 14
The procedure of example 1 was repeated except for the following features.
The adhesive layer 11 is made of polyurethane resin.
Comparative example 1
As shown in fig. 5, a flexible metal-clad sheet 100 of a double-sided structure, the flexible metal-clad sheet 100 including an adhesive layer 11, a base material layer 12, and a metal layer 13. The base material layer 12 is arranged on two sides of the bonding layer 11, and the metal layer 13 is arranged on one side of the base material layer 12 away from the bonding layer 11. Wherein the thickness of the two substrate layers 12 is the same and the thickness of the two metal layers 13 is the same.
Specifically, the adhesive layer 11 is made of polyimide resin, and the thickness of the adhesive layer 11 is 12 μm. The base material layer 12 is made of polytetrafluoroethylene resin, and the thickness of the base material layer 12 is 12 μm. The metal layer 13 is copper foil, and the thickness of the metal layer 13 is 12 μm.
Comparative example 2
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 12 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 12 μm.
Comparative example 3
The procedure of example 1 was repeated except for the following features.
The thickness of the adhesive layer 11 was adjusted to 25 μm, the thickness of the base layer 12 was adjusted to 25 μm, and the thickness of the metal layer 13 was adjusted to 25 μm.
1. Performance test:
the flexible metal clad sheets in the above examples and comparative examples were subjected to performance tests.
Peel strength: the peel strength between the metal layer and the substrate layer and between the substrate layer and the adhesive layer was tested. Test methods reference standard GB/T2790 test method for 180℃peel strength of Adhesives Flexible vs. rigid Material. Sample size: 200mm 15mm; stretching speed: 100mm/min.
Dimensional stability:
test methods refer to the standard IPC-TM-650.2.2.4C. Samples of 260mm (TD) by 300Mm (MD) were sampled, and a cross mark was made at each of the four corners of the sample with a punch, and the intersection points of the cross marks were designated A, B, C and D (distributed in the machine direction of the flexible metal clad sheet between points A and B, distributed in the machine direction of the flexible metal clad sheet between points C and D, distributed in the perpendicular direction of the flexible metal clad sheet between points A and C, and distributed in the perpendicular direction of the flexible metal clad sheet between points B and D), respectively. Measuring the distance between four points by using a secondary imaging instrument to serve as blank control data; then, completely etching metal copper by using etching liquid on the sample, measuring the distance between four points by using a secondary imaging instrument, and recording a data result; then heating the sample etched with the metal copper in an oven at 150+/-2 ℃ for 30+/-2 min; cooling for 24h at 23+ -2deg.C and 50+ -5% humidity, measuring the distance between four points with a two-dimensional imager, and recording the data.
Dimensional stability calculation formula:
wherein,
MD = machine direction dimensional change thousandth;
TD = vertical dimensional change thousandth;
i = initial test results;
f = last measurement;
a-B = distance between point a and point B;
a-C = distance between point a and point C;
C-D = distance between point C and point D;
B-D = distance between point B and point D.
Dielectric constant & dielectric loss factor:
1) Detection equipment: a network analyzer E5080B+ resonant cavity 10GHz fixture;
2) Test conditions: cutting a sample with the size of 7cm by using scissors, treating the sample in a circulating oven at 150 ℃ for 2 hours, standing the sample for 2 hours in a room temperature environment after drying is finished, testing, and recording a test result.
2. Performance test results:
the results of the performance test of the flexible metal clad sheets of the above examples and comparative examples are shown in table 1.
Table 1: test results
As can be seen from comparison of example 1 and comparative example 1, the flexible metal clad sheet of example 1 has a similar dielectric constant to that of comparative example 1, but the adhesion strength between the metal layer and the base material layer and between the base material layer and the adhesive layer is greatly improved, and the dimensional stability is better and the reliability is good. As can be seen from the comparison between the example 2 and the comparative example 2, the example 2 greatly improves the interlayer peeling strength and the stability of the flexible metal-clad plate structure on the premise of smaller dielectric constant change and unchanged dielectric loss factor. As is clear from the comparison between example 5 and comparative example 3, the dielectric constants of example 5 and comparative example 3 are close to each other at the same thickness, but the structural stability of example 5 is higher. From examples 1-7, the flexible metal clad sheet of the present application was able to maintain good peel strength at various thicknesses. As can be seen from examples 8-11, the flexible metal-clad plate in the present application has good structural stability and dimensional stability under different pore diameters and porosities, and has high reliability. As can be seen from examples 12-14, in the structures of the present application, the use of different materials as the adhesive layer enables the flexible metal clad sheet to have better peel strength and higher reliability. In examples 13 and 14, adhesive layer materials with poor dimensional stability were used, but higher peel strength could still be achieved with the structures of the present application.
The flexible metal-clad plate has the advantages that the through holes are formed, so that the peeling strength and the dimensional stability of the flexible metal-clad plate can be greatly improved on the premise that the dielectric constant and the dielectric loss factor of the flexible metal-clad plate are not affected excessively, and the reliability is high.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
Claims (10)
1. A flexible metal-clad sheet, comprising:
a bonding layer;
a substrate layer provided on at least one side of the adhesive layer, the substrate layer including at least one of polytetrafluoroethylene resin or soluble polytetrafluoroethylene resin, the substrate layer including a through hole;
the metal layer is arranged on one side of the substrate layer away from the bonding layer;
a portion of the adhesive layer fills into the through hole of the substrate layer and is connected to the metal layer.
2. The flexible metal-clad sheet of claim 1, wherein:
the aperture of the through hole is 0.1-1mm, and the porosity of the substrate layer is 30-60%;
preferably, the pore diameter of the through hole is 0.5-0.8mm, and the porosity of the substrate layer is 40-50%.
3. The flexible metal-clad sheet of claim 1, wherein:
the bonding strength between the substrate layer and the metal layer is more than or equal to 6N/cm, and the bonding strength between the bonding layer and the substrate layer is more than or equal to 6N/cm.
4. The flexible metal-clad sheet of claim 1, wherein:
the water absorption rate of the flexible metal-clad plate is 0.1% -0.3%, the water absorption rate of the bonding layer is 0.3% -0.5%, and the water absorption rate of the substrate layer is 0.01% -0.05%.
5. The flexible metal-clad sheet of claim 1, wherein:
the thickness of the metal layer is 6-50 mu m, the thickness of the bonding layer is 6-50 mu m, and the thickness of the base material layer is 6-50 mu m.
6. The flexible metal-clad sheet of claim 1, wherein:
the adhesive layer includes at least one of polyimide resin, epoxy resin, or polyurethane resin.
7. The flexible metal-clad sheet of claim 1, wherein:
the metal layer includes at least one of copper element, nickel element, palladium element, silver element, or platinum element.
8. A preparation method of a flexible metal-clad plate is characterized by comprising the following steps:
for the preparation of a flexible metal-clad sheet according to any one of claims 1 to 7;
it specifically comprises a step of, in particular,
and (3) hole making: preparing a through hole penetrating through the substrate layer in the substrate layer;
and (3) primary pressing: pressing the substrate layer and the metal layer;
and (3) coating and curing: and coating the first resin solution on the surface of the substrate layer far away from the metal layer, and forming the bonding layer after curing to obtain the flexible metal-clad plate with a single-sided structure.
9. The method of manufacturing according to claim 8, wherein:
the preparation method also comprises the steps of,
and (3) secondary lamination: and symmetrically pressing the two flexible metal-clad plates with the single-sided structure in a mode that the metal layers are arranged on the outer sides, so as to obtain the flexible metal-clad plate with the double-sided structure.
10. A flexible circuit board, characterized in that:
the flexible circuit board comprises the flexible metal-clad sheet according to any one of claims 1 to 7 or the flexible metal-clad sheet produced by the production method according to any one of claims 8 to 9.
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