CN117529079A - Clamping device and process for chip components - Google Patents
Clamping device and process for chip components Download PDFInfo
- Publication number
- CN117529079A CN117529079A CN202410020633.2A CN202410020633A CN117529079A CN 117529079 A CN117529079 A CN 117529079A CN 202410020633 A CN202410020633 A CN 202410020633A CN 117529079 A CN117529079 A CN 117529079A
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- Prior art keywords
- clamping
- plate
- block
- mounting
- electric telescopic
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims 3
- 238000005457 optimization Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Manipulator (AREA)
Abstract
The invention relates to the technical field of electronic component processing equipment, and particularly discloses a clamping device and a clamping process for a patch component. When the electric telescopic rod is used, the angle between the mounting block and the clamped component is not changed no matter the mounting block and the clamping plate on the mounting block are moved to any position through the first electric telescopic rod.
Description
Technical Field
The invention relates to the technical field of electronic component processing equipment, in particular to a clamping device and a clamping process of a patch component.
Background
The electronic component is a component part of an electronic element and a small machine or instrument, is often composed of a plurality of parts, and can be commonly used in similar products; some parts of the industry such as electric appliances, radio and meters are commonly referred to as electric devices such as capacitors, transistors, hairsprings and springs, and the components are also divided into patch components and plug-in components. The patch element has small volume and light weight, and is easier to weld than the plug-in element.
When welding the paster components and parts on the PCB circuit board, in order to press from both sides the flexibility of getting to the components and parts, the most small arm that will use is carried out centre gripping and is installed the placing to the components and parts, but the arm is carrying out the displacement after the centre gripping to the components and parts, the position and the angle of components and parts all can change, after the components remove to appointed position, need all to adjust the mounted position and the installation angle of components and parts, can reduce the degree of accuracy of components and parts installation when using, the position of different components and parts installation also can be different on PCB circuit board surface when using, and the component centre gripping erection equipment that is used often can't rotate it under the component centre gripping condition and guarantee that the angle of components and parts can not change when position control.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a clamping device and a clamping process for a patch element.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a clamping device and technology of paster components and parts, includes the mounting panel, the guard plate is all installed to the top both sides of mounting panel, and the spacing groove has all been seted up according to length direction to the opposite face of two guard plates, installs the movable plate between two guard plates, and slidable mounting is in two spacing inslot respectively at the both ends of movable plate, and the slide hole has been seted up according to length direction at the top of movable plate, and the sliding block is installed in the slide hole in the slide, and the chassis is installed at the top of mounting panel, and first electric telescopic handle is installed in the top rotation of chassis, and the one end rotation on chassis is kept away from to the piston rod of first electric telescopic handle is installed the second electric telescopic handle, and the fixture is installed at the bottom of sliding block in the top of second electric telescopic handle.
Preferably, the fixture comprises a mounting block, the bottom both ends of the mounting block are all slidable mounting has the grip block, the mounting groove has been seted up on the top of mounting block, slidable mounting has the lifter in the mounting groove, a plurality of mounting hole has been seted up to the interior bottom of mounting groove, slidable mounting has the removal pipe in the mounting hole, the bottom at the lifter is installed on the top of removal pipe, the sucking disc is installed to the bottom of removal pipe, the scanner body is installed to the one end that the movable plate was kept away from to first electric telescopic handle.
Preferably, the sucking disc is located the below of installation piece, and the sucking disc is located between two grip blocks, and the rubber pad is all installed to the bottom opposite face of two grip blocks, and miniature flow control valve body is installed on the top of lifter block, and miniature flow control valve body is located the inside of mounting groove, and the location laser lamp is installed to the bottom of installation piece, and the location laser lamp is located between a plurality of mounting hole.
Preferably, the miniature air pump body is installed on the top of sliding block, miniature air pump body slidable mounting is at the top of movable plate, and the side-mounting of installation piece has the connecting block, and the connecting block passes through the air outlet interconnect of connecting pipe and miniature air pump body.
Preferably, the connecting block is communicated with the inside of the mounting groove, the sucking disc, the moving pipe, the lifting block and the miniature flow control valve body are communicated with each other in sequence, and the sucking disc is positioned above the rubber pad.
Preferably, the second sealing ring is installed on the outer wall of the lifting block, the outer wall of the second sealing ring is in butt joint with the inner wall of the mounting groove, an annular groove is formed in the inner wall of the mounting groove, the first sealing ring is installed on the inner wall of the groove, and the first sealing ring is located above the second sealing ring.
Preferably, the bottom both ends of installation piece all have seted up the spout, and electric slider is installed on the top of grip block, and electric slider slidable mounting is in the spout.
Preferably, the standing grooves are formed in the two ends of the top of the mounting plate, a first standing plate and a second standing plate are respectively arranged in the two standing grooves, a plurality of fixing grooves are formed in the top of the first standing plate, clamping grooves are formed in the inner walls, far away from the two ends of the mounting plate, of the two standing grooves, clamping blocks are arranged in the clamping grooves, and one ends, far away from the opposite faces, of the two clamping blocks are respectively arranged on the opposite faces of the first standing plate and the second standing plate.
Preferably, the motor is installed to the bottom middle-end of mounting panel, and the output shaft top of motor runs through mounting panel and chassis to install in the bottom of first electric telescopic handle, the backup pad is all installed near the position of corner in the bottom of mounting panel, and the chassis is located between two standing grooves.
The invention relates to a use process of a clamping device of a patch element, which is characterized by comprising the following steps of:
step one: the staff places the PCB circuit board on first placing the dish, and the components and parts that wait to install are placed on the second placing the dish, drive first electric telescopic handle through the motor and rotate, make the installation piece remove to the top of second placing the dish.
Step two: the second electric telescopic rod drives the two clamping plates to move to two sides of the component respectively, so that the two clamping plates clamp the component.
Step three: the miniature air pump body inflates to the inside of mounting groove, makes lifting block and movable tube move down, until the sucking disc adsorbs the components and parts surface after the centre gripping.
Step four: the motor makes installation piece and components and parts remove to the top of first placing the dish through first electric telescopic handle, can stretch out and draw back when first electric telescopic handle rotates, and the installation piece can not appear the angle pivoted condition when rotating with the components and parts on it, need not the staff and carries out the angle adjustment when installing the components and parts.
Step five: after the components are placed on the surface of the PCB at the designated position, the clamping plate breaks the clamping of the components, and the miniature flow control valve body can enable gas inside the mounting groove to be blown into the sucker through the moving pipe, so that the sucker breaks the connection of the components, and meanwhile, the components and the surface of the PCB can be cleaned through the gas blown out from the bottom of the sucker.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, when the first electric telescopic rod drives the mounting block to rotate on the chassis, the first electric telescopic rod is rotatably mounted on the second electric telescopic rod, and the sliding block at the top end of the second electric telescopic rod is slidably mounted in the sliding block, so that the mounting block only moves along with the first electric telescopic rod when the first electric telescopic rod drives the mounting block to rotate, the angles of the mounting block and the clamping plate on the mounting block do not change along with the rotation of the first electric telescopic rod, when the components are clamped and mounted, no personnel are required to perform angle adjustment on the mounting block and the clamped components, and no matter the mounting block and the clamping plate on the mounting block move to any position through the first electric telescopic rod when the first electric telescopic rod is used, the angles of the mounting block and the clamped components do not change.
2. According to the invention, when the components are clamped, the miniature air pump body can be inflated to the upper end of the inside of the mounting groove through the connecting pipe and the connecting block, so that the air positioned at the upper end of the inside of the mounting groove pushes the sucker to move downwards, the sucker is adsorbed on the top surface of the clamped components, the adsorption of the sucker on the top surface of the components can enable the components to be more stable during clamping movement, the components can not slightly shake or incline when the mounting block drives the clamped components to move, and the components can be conveniently and accurately installed by staff.
3. According to the invention, when a worker installs the component, the sucker continuously extrudes the top of the component through the moving tube, so that the component is more stable in welding and is in closer contact with the surface of the PCB, after the component is welded, the micro flow control valve body enables air in the installation groove to blow to the inside of the sucker through the moving tube, so that the sucker breaks adsorption with the component, the air in the sucker blows to the edge of the component along the top surface of the component through the edge position, the heated patch solder paste can be cooled during use, and meanwhile, the junction between the surface of the PCB and the surface of the component can be cooled, and the surface of the component and the surface of the PCB can be cleaned.
4. According to the invention, when the mounting block clamps the components through the clamping plate on the mounting block, the first electric telescopic rod is far away from the scanner body on one end of the mounting block, so that the plurality of PCB circuit boards on the first placing plate can be scanned, the positions where the components are to be mounted are known, the components can be conveniently and accurately moved to the designated positions on the surface of the PCV circuit board for mounting, and when the components are mounted, the scanner body is positioned above the second placing plate, the number and the positions of the components on the second placing plate can be known, and the clamping plate is convenient for accurately clamping the components.
Drawings
Fig. 1 is a perspective view of a clamping device and a process of a chip component according to the present invention;
fig. 2 is a schematic structural diagram of a mounting plate of a clamping device and a process for a chip component according to the present invention;
fig. 3 is a schematic diagram of a moving plate structure of a clamping device and a process for a chip component according to the present invention;
fig. 4 is a schematic diagram of a mounting structure of a clamping plate of a clamping device and a clamping process of a chip component according to the present invention;
fig. 5 is a sectional view of a mounting block of a clamping device and a process for a chip component according to the present invention;
fig. 6 is a schematic diagram of a lifting block structure of a clamping device and a process of a chip component according to the present invention;
fig. 7 is a schematic view of the bottom structure of a mounting block of the clamping device and the process of the chip component according to the present invention;
fig. 8 is a schematic diagram of the top structure of a mounting block of a clamping device and a process for a chip component according to the present invention;
fig. 9 is a schematic structural diagram of a mounting board of a clamping device and a process for a chip component according to the present invention.
In the figure: 1. a mounting plate; 2. a protection plate; 3. a chassis; 4. a first electric telescopic rod; 5. a moving plate; 6. a placement groove; 7. a first holding tray; 8. a support plate; 9. a scanner body; 10. a second holding tray; 11. a limit groove; 12. a micro air pump body; 13. a sliding hole; 14. a motor; 15. a mounting block; 16. a clamping plate; 17. a sliding block; 18. a second electric telescopic rod; 19. a connecting block; 20. a chute; 21. a rubber pad; 22. a mounting groove; 23. an electric slide block; 24. a suction cup; 25. a groove; 26. a first seal ring; 27. a moving tube; 28. a lifting block; 29. a second seal ring; 30. a miniature flow control valve body; 31. positioning a laser lamp; 32. a mounting hole; 33. a clamping groove; 34. and (5) clamping blocks.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-9, a clamping device and a process for a patch component comprise a mounting plate 1, wherein protection plates 2 are mounted on two sides of the top of the mounting plate 1, limiting grooves 11 are formed in opposite surfaces of the two protection plates 2 in the length direction, a movable plate 5 is mounted between the two protection plates 2, two ends of the movable plate 5 are respectively and slidably mounted in the two limiting grooves 11, a sliding hole 13 is formed in the top of the movable plate 5 in the length direction, a sliding block 17 is slidably mounted in the sliding hole 13, a chassis 3 is mounted at the top of the mounting plate 1, a first electric telescopic rod 4 is rotatably mounted at the top of the chassis 3, a second electric telescopic rod 18 is rotatably mounted at one end, far away from the chassis 3, of a piston rod of the first electric telescopic rod 4, the top end of the second electric telescopic rod 18 is mounted at the bottom of the sliding block 17, and a clamping mechanism is mounted at the bottom end of the second electric telescopic rod 18.
As a technical optimization scheme of the invention, the clamping mechanism comprises a mounting block 15, clamping plates 16 are slidably mounted at two ends of the bottom of the mounting block 15, a mounting groove 22 is formed in the top end of the mounting block 15, a lifting block 28 is slidably mounted in the mounting groove 22, a plurality of mounting holes 32 are formed in the inner bottom of the mounting groove 22, a moving tube 27 is slidably mounted in the mounting holes 32, the top end of the moving tube 27 is mounted at the bottom of the lifting block 28, a sucker 24 is mounted at the bottom end of the moving tube 27, a scanner body 9 is mounted at one end, far away from the moving plate 5, of a first electric telescopic rod 4, and when the clamping device is clamped by a worker through the two clamping plates 16, the secondary position of the component can be limited through a sucker 34.
As a technical optimization scheme of the invention, the sucker 24 is positioned below the mounting block 15, the sucker 24 is positioned between the two clamping plates 16, rubber pads 21 are respectively arranged on opposite surfaces of bottom ends of the two clamping plates 16, a micro flow control valve body 30 is arranged at the top end of the lifting block 28, the micro flow control valve body 30 is positioned in the mounting groove 22, a positioning laser lamp 31 is arranged at the bottom of the mounting block 15, the positioning laser lamp 31 is positioned among a plurality of mounting holes 32, and the positioning laser lamp 31 can accurately know the positions of clamped components when in use, so that collision is prevented from being caused to the surfaces of the components when the clamping plates 16 downwards move and clamp the components.
As a technical optimization scheme of the invention, the top end of the sliding block 17 is provided with the micro air pump body 12, the micro air pump body 12 is slidably arranged at the top of the movable plate 5, the side surface of the mounting block 15 is provided with the connecting block 19, the connecting block 19 is connected with the air outlet of the micro air pump body 12 through the connecting pipe, and the micro air pump body 12 can charge air into the mounting groove 22 through the connecting pipe and the connecting block 19, so that the sucking disc 24 is conveniently pushed to move downwards.
As a technical optimization scheme of the invention, the connecting block 19 is communicated with the inside of the mounting groove 22, the sucker 24, the movable pipe 27, the lifting block 28 and the micro flow control valve body 30 are sequentially communicated with each other, the sucker 24 is positioned above the rubber pad 21, and the micro air pump body 12 can clean the surfaces of components and parts and the PCB circuit board through the sucker 24 when in use.
As a technical optimization scheme of the invention, a second sealing ring 29 is installed on the outer wall of the lifting block 28, the outer wall of the second sealing ring 29 is in butt joint with the inner wall of the installation groove 22, an annular groove 25 is formed in the inner wall of the installation groove 22, a first sealing ring 26 is installed on the inner wall of the groove 25, the first sealing ring 26 is located above the second sealing ring 29, the first sealing ring 26 can seal the top end of the installation groove 22, and the second sealing ring 29 can seal the connection position of the lifting block 28 and the installation groove 22.
As a technical optimization scheme of the invention, both ends of the bottom of the mounting block 15 are provided with the sliding grooves 20, the top ends of the clamping plates 16 are provided with the electric sliding blocks 23, the electric sliding blocks 23 are slidably arranged in the sliding grooves 20, and the electric sliding blocks 23 can drive the clamping plates 16 to move so that the two clamping plates 16 clamp components.
As a technical optimization scheme of the invention, the two ends of the top of the mounting plate 1 are respectively provided with the placement grooves 6, the two placement grooves 6 are respectively provided with the first placement plate 7 and the second placement plate 10, the top of the first placement plate 7 is provided with a plurality of fixing grooves, the inner walls of the two placement grooves 6 far away from the two ends of the mounting plate 1 are respectively provided with the clamping grooves 33, the clamping blocks 34 are arranged in the clamping grooves 33, one ends of the two clamping blocks 34 far away from the opposite surfaces are respectively arranged on the opposite surfaces of the first placement plate 7 and the second placement plate 10, when in use, a worker can respectively place a plurality of PCB circuit boards in the plurality of fixing grooves on the first placement plate 7, and the fixing grooves can well limit the positions of the PCB circuit boards.
As a technical optimization scheme of the invention, a motor 14 is arranged at the middle end of the bottom of the mounting plate 1, the top end of an output shaft of the motor 14 penetrates through the mounting plate 1 and the chassis 3 and is arranged at the bottom of the first electric telescopic rod 4, the bottom of the mounting plate 1 is provided with a supporting plate 8 at a position close to a corner, the chassis 3 is positioned between two placing grooves 6, and the motor 14 can drive the first electric telescopic rod 4 to rotate at the top of the chassis 3.
The invention relates to a use process of a clamping device of a patch element, which is characterized by comprising the following steps of:
step one: the staff places the PCB circuit board on first placing plate 7, and the components and parts that wait to install are placed on second placing plate 10, drive first electric telescopic handle 4 through motor 14 and rotate, make installation piece 15 remove to the top of second placing plate 10.
Step two: the second electric telescopic rod 18 drives the two clamping plates 16 to move to two sides of the component respectively, so that the two clamping plates 16 clamp the component.
Step three: the micro air pump body 12 inflates the inside of the mounting groove 22, so that the lifting block 28 and the moving pipe 27 move downward until the suction cup 24 is adsorbed on the surface of the clamped component.
Step four: the motor 14 makes installation piece 15 and components and parts remove to the top of first dish 7 of placing through first electric telescopic handle 4, can stretch out and draw back the removal when first electric telescopic handle 4 rotates, and the installation piece 15 and the components and parts on it can not appear the condition of angle rotation when rotating, need not the staff and carries out angle adjustment when installing the components and parts.
Step five: after the components are placed at the designated positions on the surface of the PCB, the clamping plate 16 breaks the clamping of the components, and the micro flow control valve body 30 can enable the air in the installation groove 22 to be blown into the sucker 24 through the moving pipe 27, so that the sucker 24 breaks the connection of the components, and meanwhile, the components and the surface of the PCB can be cleaned through the air blown out from the bottom of the sucker 24.
When the invention is used, a worker can respectively place a plurality of PCB circuit boards in the fixing grooves on the first placing tray 7, a tray with a plurality of components can be placed on the second placing tray 10, and when in use, the first placing tray 7 and the second placing tray 10 are respectively connected with the clamping grooves 33 in the placing grooves 6 at the two ends of the mounting plate 1 through the clamping blocks 24, and when in use, the first placing tray 7 and the second placing tray 10 can be fixed in better positions, so that the first placing tray 7 and the second placing tray 10 are more stable when in use.
The inner wall butt that lies in the inside PCB circuit board both sides of fixed slot and fixed slot when using is convenient for carry out the fixed position to the PCB circuit board, and the staff can change different first placing tray 7 according to the model and the size of PCB circuit board when using, makes the fixed slot on the first placing tray 7 can be better carry out the fixed position to the PCB circuit board. The staff drives first electric telescopic rod 4 through motor 14 and rotates at the top of chassis 3, and the piston rod of first electric telescopic rod 4 rotates and installs on second electric telescopic rod 18, so alright drive second electric telescopic rod 18 and its bottom installation piece 15 rotate with the output shaft of motor 14 as the center when first electric telescopic rod 4 rotates.
The sliding block 17 at the top end of the second electric telescopic rod 18 is slidably mounted in the sliding hole 13 on the moving plate 5, so that when the first electric telescopic rod 4 drives the mounting block 15 to rotate, the angle of the mounting block 15 cannot change along with the rotation of the first electric telescopic rod 4, the mounting block 15 and the clamping plate 16 at the bottom of the mounting block can only change in position and height when in use, the angle cannot rotate, when a worker clamps and installs components, the angle of the mounting block 15 and the component is not required to be adjusted, the clamping plate 16 can better clamp the components, and the components can be accurately installed.
When the first electric telescopic rod 4 drives the installation block 15 to rotate, the installation block 15 can drive the movable plate 5 to move through the sliding block 17, two ends of the movable plate 5 slide in the limiting grooves 11 on the opposite faces of the two protection plates 2 respectively, and the movable plate 5 can move from the upper direction of the first electric telescopic rod 4 to the direction of the second placing plate 10 in use. After the installation piece 15 moves to the top of the second placing plate 10, one end of the first electric telescopic rod 4, which is far away from the installation piece 15, can turn to the direction of the first placing plate 7, when the installation piece 15 clamps components through the clamping plate 16 on the installation piece, the first electric telescopic rod 4 is far away from the scanner body 9 on one end of the installation piece 15, and can scan a plurality of PCB circuit boards on the first placing plate 7, so that the position where the components are to be installed is known, the components can be conveniently and accurately moved to the appointed position on the surface of the PCV circuit board for installation, and when the components are to be installed, the scanner body 9 is positioned above the second placing plate 10, so that the number and the positions of the components on the second placing plate 10 can be known, and the clamping plate can be used for accurately clamping the components conveniently.
After the installation piece 15 moves to the top of the second placing plate 10, the positioning laser lamp 31 located below the installation piece 15 can irradiate the top of the second placing plate 10, the position of the installation piece 15 above the appointed components is adjusted through the positioning laser lamp 31, collision and extrusion of the top surface of the components are prevented due to the angle problem when the installation piece 15 and the clamping plate 16 move downwards, the components can be protected better when the clamping plate is used, and meanwhile the components are clamped conveniently.
The second electric telescopic rod 18 drives the mounting block 15 and the two clamping plates 16 to move downwards until the two clamping plates 16 are respectively positioned on two sides of the component. The two electric sliding blocks 23 respectively drive the two clamping plates 16 to move towards the direction of the component until the two clamping plates 16 clamp and fix the component, and the rubber pads 21 positioned on the side surfaces of the clamping plates 16 enable the clamping plates 16 to play a better role in protecting the two sides of the component when clamping the component, so that the condition that the surface of the component is damaged due to mutual extrusion of the component and the clamping plates 16 is prevented.
After the clamping plate 16 clamps the components, the micro air pump body 12 can be inflated to the upper end of the inside of the installation groove 22 through the connecting pipe and the connecting block 19, so that the air at the upper end of the inside of the installation groove 22 pushes the lifting block 28 and the moving pipe 27 to move downwards, and when the moving pipe 27 moves downwards, the sucking disc 24 can move downwards until the sucking disc 24 is adsorbed on the top surface of the clamped components. When carrying out the centre gripping to polygonal components and parts, the area of components and parts both sides and grip block 16 side contact can reduce, can have certain probability to appear components and parts slightly rock or the condition of slope between two grip blocks 16 when installation piece 15 removes, and sucking disc 24 can make components and parts more stable when the centre gripping removes to the absorption of components and parts top surface, makes things convenient for the staff to carry out accurate installation to components and parts.
The staff drives installation piece 15 and components and parts through motor 14 and first electric telescopic handle 4 and rotates to the direction of first dish 7 of placing, and can stretch out and draw back when first electric telescopic handle 4 rotates, prevents installation piece 15 and two guard plates 2 collision each other when using. After the mounting block 15 and the components move to the designated position at the top of the PCB, the staff can drive the components to move downwards through the second electric telescopic rod 18 until the bottom surface of the components is abutted with the top of the PCB. The electric slide block 23 drives the clamping plates 16 to move, so that the two clamping plates 16 are disconnected to clamp the components, and workers can smear the patch soldering paste at the contact positions of the bottoms of the two sides of the components and the PCB, and heat the patch soldering paste through an electric soldering iron.
When the staff welds the components, sucking disc 24 is through removing pipe 27 and is continuously extrudeing the top of components, makes the components more stable when the welding, and is inseparabler with the contact on PCB circuit board surface. Staff makes the inside air that is located mounting groove 22 through miniature flow control valve body 30 blow to the inside of sucking disc 24 through moving pipe 27, makes sucking disc 24 disconnection and the absorption of components and parts, simultaneously along with the inside air that gets into sucking disc 24 increases, the inside air of sucking disc 24 alright blow to the border position of components and parts along the top surface of components and parts through the border position of sucking disc 24, can cool off the paster solder paste after the heating when using, also can cool off the surface junction of PCB circuit board and components and parts simultaneously, and also can clear up the surface of components and parts and PCB circuit board.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410020633.2A CN117529079A (en) | 2024-01-08 | 2024-01-08 | Clamping device and process for chip components |
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Cited By (1)
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| CN118338561A (en) * | 2024-05-17 | 2024-07-12 | 江苏金一辰电子科技有限公司 | A chip clamping device for processing mobile phone motherboards |
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Application publication date: 20240206 |