CN117476577A - Liquid cooling device of electronic component, electronic component assembly, vehicle module and vehicle - Google Patents
Liquid cooling device of electronic component, electronic component assembly, vehicle module and vehicle Download PDFInfo
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- CN117476577A CN117476577A CN202311420128.9A CN202311420128A CN117476577A CN 117476577 A CN117476577 A CN 117476577A CN 202311420128 A CN202311420128 A CN 202311420128A CN 117476577 A CN117476577 A CN 117476577A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a liquid cooling device of electronic component, vehicle module and vehicle, relates to heat dissipation technical field, including heat exchange housing, be provided with in the heat exchange housing: the electronic component mounting device comprises a mounting position for mounting the electronic component, a sealed first heat exchange cavity and a sealed second heat exchange cavity, wherein the first heat exchange cavity is arranged around the mounting position; the second heat exchange cavity surrounds the first heat exchange cavity; the first heat exchange cavity is used for filling insulating first heat exchange liquid, and the second heat exchange cavity is used for filling second heat exchange working medium. After the electronic element can transfer heat through the first heat exchange liquid in the first heat exchange cavity, the heat is transferred through the second heat exchange cavity again, the first heat exchange cavity is arranged in the second heat exchange cavity, the second heat exchange cavity wraps the first heat exchange cavity, the heat exchange area is increased, the heat transfer efficiency of the liquid cooling device of the electronic element is improved, and when the electronic element is subjected to heat dissipation, the heat dissipation effect on the electronic element can be increased.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a liquid cooling device for an electronic component, a vehicle module, and a vehicle.
Background
With the continuous improvement of industrial automation level, as the application service requirements of customers on electronic equipment are increased, the power consumption of electronic elements is higher and higher, and part of application working conditions are more and more extreme, each technological transformation is a challenge to the limit performance of the electronic elements, and the requirements on the reliability, stability and power performance output capability of the electronic elements are higher and higher. Heat dissipation has become an important challenge in improving the performance of electronic components, and whether or not the electronics are able to dissipate heat well directly affects the performance of the overall device.
At present, the existing heat dissipating device has poor heat dissipating capability on electronic elements, which is easy to cause the reliability reduction of the electronic elements during operation, directly affects the application experience of customers, and the problem needs to be solved.
In chinese patent (publication No. CN114156249 a), a phase-change cooled IGBT (Insulated GateBipolar Transistor ) module is proposed, the phase-change cooled IGBT module comprising: IGBT main part and inclosed shell, the IGBT main part is electric power conversion and the main part device of control equipment, pack the phase transition heat transfer working medium in the shell of IGBT module, the phase transition heat transfer working medium is insulating liquid material, and the phase transition heat transfer working medium is the material that can realize boiling under the operating temperature of IGBT main part, still be provided with gaseous heat transfer space between shell and the phase transition heat transfer working medium, the fixed inside that sets up at the shell of IGBT main part, and soak in the phase transition heat transfer working medium, and the IGBT main part passes the shell through the circuit after with outside intercommunication. However, in this patent, the IGBT main body is immersed in an insulating liquid material, and after heat exchange by a phase change heat exchange medium, the heat is dissipated by air cooling at the housing, and the heat dissipation efficiency at the housing is limited.
In chinese patent (publication No. CN116075106 a), a heat dissipating assembly, a vehicle module, and a vehicle are proposed, where the heat dissipating assembly includes a circuit board, one or more chips, a heat dissipating device, and a first cooling medium, and the one or more chips are disposed on the circuit board; the heat dissipation device and the circuit board jointly enclose to form an enclosed space, and the one or more chips are positioned in the enclosed space; the first cooling working medium is arranged in the closed space and submerges the one or more chips, is used for transferring heat of the one or more chips to the heat dissipation device through gas-liquid conversion, and is non-conductive liquid. The heat exchange area of the conventional heat exchange structure is smaller, and when the power consumption of the electronic element is higher, the heat dissipation efficiency of the electronic element is difficult to meet.
Disclosure of Invention
One of the purposes of the present invention is to provide a liquid cooling device for electronic components, so as to solve the problem of low heat dissipation efficiency of electronic components in the prior art; the second objective is to provide an electronic device assembly; a third object is to provide a vehicle module; a fourth object is to provide a vehicle.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the liquid cooling device of the electronic component comprises a heat exchange shell, wherein the heat exchange shell is internally provided with:
a mounting position for mounting the electronic component,
the first heat exchange cavity is sealed and arranged around the mounting position;
a closed second heat exchange chamber surrounding the first heat exchange chamber;
the first heat exchange cavity is used for filling insulating first heat exchange liquid, and the second heat exchange cavity is used for filling second heat exchange working medium.
Optionally, the heat exchange shell comprises a shell body, a sealing element and a mounting seat, wherein the mounting seat is arranged in the mounting seat, the mounting seat is arranged in the sealing element and is in sealing connection with the sealing element to form the first heat exchange cavity, and the sealing element is arranged in the shell body and is in sealing connection with the shell body to form the second heat exchange cavity.
Optionally, the mounting seat is provided with a first heat exchange structure protruding outside the mounting seat, and the first heat exchange structure is used for being connected with the electronic element.
Optionally, the first heat exchange structure is a plurality of pin fins, and a plurality of pin fins are arranged in a row.
Optionally, the inner wall of sealing member is provided with the second heat transfer structure, be provided with the third heat transfer structure on the outer wall of sealing member, the second heat transfer structure is used for increasing the sealing member with the heat exchange efficiency of first heat exchange liquid, the third heat transfer structure is used for increasing the sealing member with the heat exchange efficiency of second heat exchange working medium.
Optionally, the second heat exchange structure and the third heat exchange structure are a plurality of pin-shaped fins, and the pin-shaped fins are arranged in a row.
Optionally, the mounting seat is tubular, the inside of the tubular is the mounting position, the mounting seat is arranged in the sealing element in a penetrating way, and the outer wall of the mounting seat is in sealing connection with the sealing element.
Optionally, the two opposite sides of the shell body are respectively provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are communicated with the second heat exchange cavity.
Optionally, the shell body comprises a base and a cover body arranged on the base, the cover body and the sealing piece form the second heat exchange cavity, and the liquid inlet and the liquid outlet are arranged on the base.
Optionally, a partition plate is arranged in the second heat exchange cavity, the partition plate partitions the second heat exchange cavity, the partition plate is provided with a drainage port close to the top of the inner wall of the cover body, and the liquid inlet and the liquid outlet are communicated through the drainage port.
Optionally, the shell body comprises a base and a cover body arranged on the base, the cover body and the sealing piece form the second heat exchange cavity, and the liquid inlet and the liquid outlet are arranged on the base.
Optionally, a partition plate is arranged in the second heat exchange cavity, the partition plate partitions the second heat exchange cavity, the partition plate is provided with a drainage port close to the top of the inner wall of the cover body, and the liquid inlet and the liquid outlet are communicated through the drainage port.
Optionally, a sealing groove is formed in a surface, in contact with the base, of the cover body, and sealant is arranged in the sealing groove, and the cover body is in sealing connection with the base through the sealing groove and the sealant.
Alternatively, the process may be carried out in a single-stage, the first heat exchange liquid comprises a fluorinated liquid, 1, 2-tetrafluoroethane, 1, 3-pentafluoropropane a combination of one or more of 1, 3-tetrafluoropropene, 1-chloro-3, 3-trifluoropropene.
Optionally, an injection port for injecting the first heat exchange liquid is arranged on the sealing member, and a plugging plug for plugging the injection port is arranged on the injection port.
Optionally, the second heat exchange working medium is water.
An electronic component assembly comprises an electronic component and the liquid cooling device, wherein the electronic component is at least partially accommodated in the first heat exchange cavity.
Optionally, the electronic component is a power device.
A vehicle module comprising a liquid cooling arrangement of an electronic component as described above.
A vehicle comprising a vehicle module as described above.
The liquid cooling device for the electronic element, the electronic element assembly, the vehicle module and the vehicle have the following beneficial effects: by arranging the sealed first heat exchange cavity and the sealed second heat exchange cavity, insulating first heat exchange liquid is filled in the first heat exchange cavity, and a second heat exchange working medium for cooling is arranged in the second heat exchange cavity. After the electronic element can transfer heat through the first heat exchange liquid in the first heat exchange cavity, the heat is transferred out again through the second heat exchange cavity, the first heat exchange cavity is arranged in the second heat exchange cavity, the second heat exchange cavity wraps the first heat exchange cavity, the heat exchange area is increased, the heat transfer efficiency of the liquid cooling device of the electronic element is improved, and when the electronic element is subjected to heat dissipation, the heat dissipation effect on the electronic element can be increased. And considering that when the electronic element is a power device, the working voltage of the power device is large, if the positive and negative ends of the electronic element are also immersed in the first heat exchange liquid, the risk of voltage breakdown or creepage is most likely to occur. In the liquid cooling device, the positive electrode and the negative electrode of the power device can be prevented from being in direct contact with the first heat exchange liquid.
Drawings
FIG. 1 is a schematic diagram of a liquid cooling apparatus for electronic components according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an electronic component and a mounting base assembled according to an embodiment of the present invention;
FIG. 3 is a schematic view of a seal according to an embodiment of the present invention;
FIG. 4 is a schematic view of an assembled seal, mounting base and electronic component according to an embodiment of the present invention;
FIG. 5 is a schematic view of a cover according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a liquid cooling apparatus for electronic components according to an embodiment of the invention.
Wherein, 1-bolt; 2-a liquid inlet; 3-electronic components; 4-a cover; 5-a seal; 6, a mounting seat; 7-a liquid outlet; 8-a base; 9-a first heat exchange structure; a 10-AC power alternating current side component; 11-DC power direct current side components; 12-flow channel; 13-a third heat exchange structure; 14-a second heat exchange structure; 15-sealing the groove; 16-a through outlet; 17-mounting slots; 18-a second heat exchange cavity; 19-a first heat exchange cavity; 20-dividing plate.
Detailed Description
Further advantages and effects of the present invention will become readily apparent to those skilled in the art from the disclosure herein, by referring to the accompanying drawings and the preferred embodiments. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be understood that the preferred embodiments are presented by way of illustration only and not by way of limitation.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
With the increasing heat dissipation demands of electronic components, technicians make many attempts, for example, in the field of automotive automation, with the continuous improvement of automotive automation level, the power of chips applied to internal modules of an automobile is rapidly increased, in order to obtain higher performance of functional modules, chip technologies are continuously upgraded, planar gates, trench gates, fine trench gates, substrate thinning technologies and the like are correspondingly generated, so as to improve the current carrying capacity of chips and reduce the power consumption, but the optimization iteration speed of the chip technologies is extremely fast, generally, the power of the functional modules is improved, and generally the following two ways are adopted:
1. by connecting more chips in parallel, the current output capacity is enhanced, the current carrying capacity of the chips is solved, but the cost of the power module is increased and the cost of products is increased by the mode;
2. the heat dissipation technology of the current chip is improved, but at present, the heat dissipation modes of the vehicle-standard and industrial-grade power semiconductor modules generally adopt air cooling and water cooling for heat dissipation. In order to meet the national safety regulations, the module generally adopts ceramic materials with both insulation and heat conduction as packaging materials. The ceramic material is used as a good insulating material, and solves the electrical isolation function, but the thermal resistance of the whole module is limited due to the low heat conduction capacity, so that the heat generated by the chip is difficult to transfer in time. The thermal resistance of the ceramic lining plate occupies about 25% -30% of the whole module, and can not be effectively reduced under the prior art condition, so that the performance of the module is blocked. The current numerous vehicle enterprises search for heat dissipation technology, are limited to the development and design of ceramic materials, are limited to the influence of the thermal resistance of the ceramic materials, and are difficult to break through the magnitude of heat dissipation of chips.
Currently, each large server manufacturer also realizes that equipment such as a server is placed in low-boiling insulating liquid so as to perform timely and effective heat dissipation. By utilizing the heat exchange principle, some technicians completely submerge the server in a special cooling liquid, and a large amount of heat generated by the server operated at a high speed can be directly absorbed by the cooling liquid to enter an external circulation cooling system, so that the energy consumption for heat dissipation in the whole process is almost zero. In conventional data centers, almost more than half of the power is consumed in dissipating heat. In the process, technicians overcome the problems in the fields of server systems, refrigeration systems, cooling materials and the like, and realize the zero-noise, zero-pollution, green and energy-saving server cluster. Liquid cooling is a very efficient cooling and heat dissipation mode, and the application of the liquid cooling to a server cluster is an emerging technology only in recent years, and thus, the effort of electronic technicians on heat dissipation of electronic elements is seen.
However, current attempts and utilization of low-boiling insulating liquid are limited to electronic components with lower operating voltage, and viable solutions are still rarely provided for heat dissipation of power devices. In the state of passing high voltage and high current, how to ensure good electrical insulation property of the low-boiling insulating liquid becomes a problem to be overcome when the low-boiling insulating liquid is applied to power devices. It will be appreciated that dry air is a good insulating material, but that sufficient electrical distance must be considered between two conductors passing high currents in air to prevent various potential safety hazards, such as voltage breakdown, electrical insulation and creepage. Therefore, how to ensure the electrical safety of the insulating liquid is a serious issue for safe use of low-boiling insulating liquid.
Therefore, when the heat dissipation design is performed on the power device, not only the types of heat exchange materials need to be screened class by class, but also the difficulty in assembling the power device with the heat dissipation structure and various potential safety hazard problems such as voltage breakdown, electrical insulation, creepage and the like possibly generated when the power device dissipates heat through the heat dissipation structure need to be fully considered when the heat dissipation structure is designed. Voltage breakdown is a phenomenon in which a dielectric loses its dielectric properties to a conductor under the action of a sufficiently strong electric field, and is also called dielectric breakdown, and the corresponding voltage is called breakdown voltage. From the above, the voltage breakdown may affect the normal use of the power device and may damage the power device. Because the power device is a semiconductor device with the capability of processing high voltage and large current, the power device is easy to generate voltage breakdown phenomenon. In addition, in terms of electrical insulation, a gap between charged portions and/or between the charged portions and the ground member, which is called an electrical distance, in which a probability of occurrence of discharge is small, is considered in design. When the voltage is large, insulation conditions are difficult to be met between the electrified parts, the phenomenon of channeling between the electrified parts is easy to occur, and the short circuit of a circuit system is easy to be caused and the power device is easy to burn. The creepage phenomenon is a phenomenon that when the performance of the insulating material is reduced, the electrified metal part and the insulating material generate a water wave-like electric arc along the outer skin due to external factors such as high air humidity, successive cloudy and rainy seasons, a humid environment and the like. Creepage phenomenon should also be avoided in the heat dissipation of the power device. As described above, many factors are considered when the heat dissipation process is performed on the power device.
Through continuous adjustment and control of the heat radiation structure and the heat radiation material, the heat radiation structure which is suitable for mass industrial production and has good economic effect can be designed, and the process is very difficult. The heat dissipation bottleneck of the current power device is an important breakthrough for heat dissipation of the chip if the bottleneck can be broken through and the heat dissipation performance of the current power device is improved in an order of magnitude.
The embodiment provides a liquid cooling device of electronic component, including heat exchange shell, be provided with in the heat exchange shell: the electronic component mounting device comprises a mounting position for mounting the electronic component 3, a sealed first heat exchange cavity 19 and a sealed second heat exchange cavity 18, wherein the first heat exchange cavity 19 is arranged around the mounting position; the second heat exchange chamber 18 surrounds the first heat exchange chamber 19; the first heat exchange cavity 19 is used for filling insulating first heat exchange liquid, and the second heat exchange cavity 19 is used for filling second heat exchange working medium. The electronic component 3 is arranged at the installation position, the first heat exchange liquid is in the first heat exchange cavity 19, the installation position of the electronic component 3 is installed in a surrounding manner through the sealed first heat exchange cavity 19, and the heat generated by the electronic component 3 can be taken away in time by the first heat exchange liquid in the first heat exchange cavity 19. By arranging the first heat exchange cavity 19 in the second heat exchange cavity 18, the heat in the first heat exchange cavity 19 is taken away by utilizing the second heat exchange working medium in the second heat exchange cavity 18. The liquid cooling device has better heat dissipation effect on the electronic element 3 through the matching of the first heat exchange cavity 19 filled with the first heat exchange liquid and the second heat exchange cavity 18 with the second heat exchange working medium. The first heat exchange cavity 19 surrounds the installation position, and simultaneously, the second heat exchange cavity 18 surrounds the first heat exchange cavity 19, between the first heat exchange cavity 19 and the installation position, between the second heat exchange cavity 18 and the first heat exchange cavity 19, the contact area is large, the heat exchange efficiency is high, the heat exchange between the electronic element 3 and the outside is facilitated, and then the heat dissipation of the electronic element 3 is facilitated.
In this embodiment, the first heat exchange liquid is a liquid with a two-phase conversion function, and the liquid can be vaporized when heated and liquefied when cooled, and the first heat exchange liquid has a boiling point lower than that of water, so that the electronic component 3 can be cooled in time when the electronic component 3 heats and the temperature reaches the boiling point of the liquid. It will be appreciated that the liquid absorbs a significant amount of heat as it evaporates. As can be seen from the above principle, when the first heat exchange liquid exchanges heat with the electronic component 3 and evaporates, a large amount of heat on the electronic component 3 is taken away. The electronic element 3 and the first heat exchange liquid can continuously exchange heat through the heated vaporization of the first heat exchange liquid, the heat exchange efficiency is high, and the situation that the electronic element 3 is short-circuited can be avoided due to the insulation of the first heat exchange liquid. In this embodiment, the liquid cooling device is suitable for power devices with power consumption of 500W to 1000W. Each gram of the first heat exchange liquid can ensure that the electronic element 3 with the power loss of 200W is kept below the normal working junction temperature through a plurality of groups of tests. From the above, a small amount of the first heat exchange liquid can take away a large amount of heat, and the heat transfer capability is excellent.
Wherein, the heat exchange shell includes shell body, sealing member 5 and mount pad 6, and the installation position sets up in mount pad 6, and mount pad 6 sets up in sealing member 5 and with sealing member 5 sealing connection to form first heat transfer chamber 19, sealing member 5 sets up in the shell body, and with shell body sealing connection, in order to form second heat transfer chamber 18. By disposing the electronic component 3 on the mount 6, the mount 6 is hermetically connected with the seal 5, and the electronic component 3 can be firmly fixed. Above-mentioned simple structure reduces the processing degree of difficulty in first heat transfer chamber, has higher engineering feasibility, and the assembly of being convenient for, and occupation space is little. In this embodiment, by using the laser welding technique, the manner of using the bolts for stabilization is abandoned, and miniaturization of the liquid cooling device can be further realized. Because the installation space in the automobile is limited, the liquid cooling device needs to be miniaturized to save space.
In detail, the mounting base 6 is provided with a first heat exchanging structure 9 protruding outside the mounting base, and the first heat exchanging structure 9 is used for being connected with the electronic component 3. The first heat exchange structure 9 can increase the contact area between the electronic element 3 and the first heat exchange liquid, improve the heat dissipation effect of the first heat exchange liquid on the electronic element 3, and improve the heat dissipation efficiency on the electronic element 3. In this embodiment, the pin fin is made of copper, which is a reddish-colored metal, is slightly hard, extremely tough, wear-resistant, has good ductility, thermal conductivity, electrical conductivity and corrosion resistance, and is inexpensive. In some embodiments, the material of the first heat exchange structure 9 can be adjusted according to the heat dissipation effect and the production cost of the actual requirement.
Specifically, the inner wall of the sealing member 5 is provided with a second heat exchange structure 14, the outer wall of the sealing member 5 is provided with a third heat exchange structure 13, the second heat exchange structure 14 is used for increasing the heat exchange area of the sealing member 5 and the first heat exchange liquid, and the third heat exchange structure 13 is used for increasing the heat exchange area of the sealing member 5 and the second heat exchange working medium. In this embodiment, the materials of the second heat exchange structure 14 and the third heat exchange structure 13 are copper, and the second heat exchange structure 14 and the third heat exchange structure 13 are an integral structure and are disposed on the sealing member 5. The heat in the first heat exchange liquid can be quickly conducted into the second heat exchange working medium by utilizing the good heat conduction capacity of the second heat exchange structure 14 and the third heat exchange structure 13, so that the heat exchange efficiency of the liquid cooling device on the electronic element 3 is improved, and the heat exchange effect of the liquid cooling device is improved. In some embodiments, the sealing member 5 is made of a material with excellent heat transfer performance, and the second heat exchange structure 14 and the third heat exchange structure 13 may not be an integral structure, and the second heat exchange structure 14 transfers heat to the third heat exchange structure 13 through the sealing member 5.
In this embodiment, the first heat exchanging structure 9 is a plurality of pin fins, and the plurality of pin fins are arranged in a row. The pin-shaped fins are cylindrical, and the contact area between the first heat exchange structure 9 and the first heat exchange liquid can be increased to a greater extent. In this embodiment, the second heat exchange structure 14 and the third heat exchange structure 13 are each a plurality of pin fins, and the plurality of pin fins are arranged in a row. The pin fins arranged on the inner wall and the outer wall of the sealing piece 5 can accelerate the heat conduction efficiency, so that the heat in the first heat exchange liquid is quickly transferred to the second heat exchange working medium. In some embodiments, the first heat exchange structure 9 may be a sheet-like structure arranged side by side. The structure types of the first heat exchange structure 9, the second heat exchange structure 14 and the third heat exchange structure 13 can be adjusted according to actual use requirements.
Wherein, mount pad 6 is tubular, and the tubular inside is the installation position, and mount pad 6 wears to establish in sealing member 5, and the outer wall and the sealing member 5 sealing connection of mount pad 6. The electronic component 3 is provided on the mounting position. In the present embodiment, the electronic component 3 provided on the mount 6 includes an AC (Alternating Current) power alternating Current side member 10 and a DC (Direct Current) power Direct Current side member 11. The current output side of the AC power AC current side component 10 is connected to the current input side of the DC power DC current side component 11, and after the connection, the two components are interconnected by using a copper block as a conductor and adopting a soft soldering technology, so that electrical interconnection between the chip and the substrate and information communication between the chips are realized. After the AC power AC current side member 10 and the DC power DC current side member 11 are interconnected, the connection between the AC power AC current side member 10 and the DC power DC current side member 11 is fixed in the mounting base 6 by thermoplastic injection molding. The electronic component 3 is used for converting alternating current in a vehicle into direct current, and the operating voltage and the operating power of the electronic component 3 are high. The electronic element 3 is designed to be long through circuit arrangement, the output part and the input part of the AC power alternating current side part 10 and the output part and the input part of the DC power direct current side part are respectively positioned at two ends of the electronic element 3, the output part of the AC power alternating current side part 10 is connected with the input part of the DC power direct current side part 11, and the connecting part of the AC power alternating current side part 10 and the DC power direct current side part 11 is arranged at the installation position. The two ends of the electronic component 3 extend out of the mounting seat 6, and the output part and the input part of the electronic component 3 are arranged outside the first heat exchange cavity 19, so that better electric distance setting is realized. Because the electrical insulation property of the high-voltage high-current in the first heat exchange liquid is unstable, a longer electrical distance is needed to ensure the safety during use. However, the longer electrical distance increases the volume occupied by the liquid cooling device, and the input and output parts of the electronic component 3 are disposed outside the first heat exchange chamber 19 in consideration of economic benefit and cost, so that the electrical distance between the input and output parts can be satisfied, and the arrangement is convenient for connecting or removing the electronic component 3. In the present embodiment, the mount 6 is square-tube-shaped to accommodate the elongated electronic component 3. Experiments show that the first heat exchange structure 9 has the best heat conducting effect by using copper, when the first heat exchange structure 9 made of copper contacts with the first heat exchange liquid, part of copper ions in the first heat exchange structure 9 can escape into the first heat exchange liquid, but due to the design of a circuit, a chip in a sheet shape has two surfaces, namely a C (collector) electrode and an E (emitter) electrode of the electronic element 3, and the C electrode and the E electrode are arranged in a back-to-back manner. The C-pole and the E-pole of the electronic component 3 are the locations where the electronic component 3 mainly generates heat, and in order to prevent the risk of voltage breakdown between the C-pole and the E-pole, the outer wall of the chip is encapsulated with EMC (EpoxyMolding Compound ). The epoxy molding compound is powder molding compound which is prepared by mixing epoxy resin serving as matrix resin, high-performance phenolic resin serving as curing agent, silica powder and the like serving as filler and various additives. After the outer wall of the electronic component 3 is subjected to plastic packaging through EMC, electrical safety between the C electrode and the E electrode can be ensured. Copper ions between the C-pole and the E-pole are difficult to escape to the other opposite pole, so that the escaping copper ions are difficult to cause short-circuiting of the electronic component 3.
Wherein, be provided with inlet 2 and liquid outlet 7 on the relative both sides of shell body respectively, inlet 2 and liquid outlet 7 all communicate with second heat transfer chamber 18. In this embodiment, the second heat exchange working medium is water, which has low price and large specific heat capacity, i.e. the water has a smaller temperature rise when absorbing the same heat compared with the water with the initial temperature and other low specific heat capacity liquids. Meanwhile, because the boiling point of water is higher, the absorbed heat energy is difficult to boil the water in the application environments of a liquid cooling device of an electronic element and the like, and the constant pressure in the second heat exchange cavity can be ensured. The type of the second heat exchange working medium can be adjusted according to actual production requirements.
Specifically, the shell body comprises a base 8 and a cover body 4 arranged on the base 8, the cover body 4 and the sealing piece 5 form a second heat exchange cavity 18, and the liquid inlet 2 and the liquid outlet 7 are arranged on the base 8. The shell body is split into the base 8 and the cover body 4, so that the processing difficulty of the shell body can be reduced, and the shell body can be processed conveniently. In the present embodiment, a plurality of placement positions for mounting the electronic components 3 can be disposed in the cover 4, so that the space for cooling the electronic components 3 by water cooling can be saved. By dividing the shell body into the base 8 and the cover body 4, the processing and assembling difficulties of the shell body can be reduced, and the engineering feasibility is higher. Corresponding to one installation position, two through holes 16 are formed in the cover body 4, and two ends of the strip-shaped electronic element 3 extend out through the through holes 16. In this embodiment, three placement positions are provided on each housing, and six through-holes 16 are provided on the housing corresponding to the placement positions. The number of the placing positions in the cover body 4 can be adjusted according to actual use requirements so as to adapt to different use scenes.
In detail, a partition plate 20 is arranged in the second heat exchange cavity 18, the partition plate 20 partitions the second heat exchange cavity 18, the partition plate is provided with a drainage port which is arranged close to the top of the inner wall of the cover body 4, and the liquid inlet 2 and the liquid outlet 7 are communicated through the drainage port. By providing the dividing plate 20, the water flow at the base plate can be led to the top of the cover 4, so that the electronic component 3 positioned on the top of the cover 4 can also have good heat dissipation. The partition plate 20 has the advantages of simple structure, convenient processing, low cost and good drainage effect on the second heat exchange working medium. In this embodiment, the partition plate 20 divides the second heat exchange cavity 18 into a first cavity for setting the sealing member 5 and a flow channel 12 for communicating the drainage port and the liquid outlet 7, the flow channel 12 is connected with the liquid outlet 7, and the liquid inlet 2 is connected with the first cavity, so that the above setting can balance the heat dissipation effect of water on the electronic component 3. In some embodiments, the flow channel 12 is connected to the liquid inlet 2 and the liquid outlet 7 is connected to the first chamber. In this embodiment, the partition plate is assembled by the installation groove 17 provided on the inner wall of the cover 4, and the partition plate is easily assembled to the inner wall of the cover 4 by providing the installation groove 17.
The surface of the cover body 4, which is in contact with the base 8, is provided with a sealing groove 15, sealant is arranged in the sealing groove 15, and the cover body 4 is in sealing connection with the base 8 through the sealing groove 15 and the sealant. By providing the sealing groove 15 and the sealant, the connection between the base 8 and the cover 4 is made tighter. In the present embodiment, in order to secure the sealability of the cover 4 and the base 8, the cover 4 and the base 8 are also fixed by the bolts 1. The tightness of the first heat exchange cavity 19 is ensured, and a laser processing technology is adopted when the mounting seat 6 and the sealing piece 5 are sealed. The laser processing technology is a door processing technology for cutting, welding, surface treatment, punching, micro-processing and the like of materials (including metals and non-metals) by utilizing the interaction characteristic of laser beams and substances. The laser processing is widely applied to national economy important departments such as automobile, electronics, electric appliances, aviation, metallurgy, mechanical manufacturing and the like as an advanced manufacturing technology, and plays an increasingly important role in improving the product quality, labor productivity, automation, no pollution, reducing material consumption and the like. The laser processing technology can ensure that welding pollution and deformation are not generated when the mounting seat 6 and the sealing piece 5 are sealed, and ensure the tightness of the mounting seat 6 and the sealing piece 5.
In detail, the first heat exchange liquid may be any liquid which is non-conductive and has a two-phase conversion function (i.e. can be vaporized when heated and liquefied when cooled), and has a low boiling point, and when the electronic component 3 reaches the boiling point temperature of the first heat exchange liquid, the first heat exchange liquid is rapidly vaporized, and heat is rapidly taken away. The choice of the type of first heat exchanging liquid can be adjusted depending on the temperature at which the electronic component 3 is kept at the optimum performance. Wherein, the first heat exchange liquid comprises a fluorinated liquid, 1, 2-tetrafluoroethane, 1, 3-pentafluoropropane a combination of one or more of 1, 3-tetrafluoropropene, 1-chloro-3, 3-trifluoropropene.
During operation of the electronic component 3, a large amount of heat, in particular power components, is generated, whereby hot spots are formed at the respective locations of the heat sink. When the heat at the hot spot is continuously accumulated and cannot be effectively dissipated in time, the accumulated heat at the hot spot can affect the processing performance of the electronic component 3, even burn out the electronic component 3, and also affect the working performance of the device for dissipating heat of the electronic component 3. Therefore, the chip is arranged on the mounting seat 6, the heating position of the electronic element 3 is suspended in the first heat exchange cavity 19, and the first heat exchange liquid is filled in the first heat exchange cavity 19, so that the heating part of the electronic element 3 can be wrapped by the first heat exchange liquid in all directions. Based on the tightness of the first heat exchange chamber 19, a receiving space with tightness can be provided for the first heat exchange liquid.
In this embodiment, pin fins are disposed on the electronic component 3, and a flow channel with the first heat exchange liquid is formed between two adjacent pin fins, so that the contact area between the electronic component 3 and the first heat exchange liquid is increased and the heat exchange effect of the first heat exchange medium is enhanced by disposing the pin fins. Therefore, when the electronic element 3 works and heats, the first heat exchange medium can timely take away heat on the electronic element 3, and is vaporized through the two-phase conversion property of the first heat exchange medium, so that the heat on the electronic element 3 is taken away and forms steam, bubbles are formed in the first heat exchange medium to rise, and the temperature of the gaseous first heat exchange medium is reduced along with the rising of the gaseous first heat exchange medium and the process of touching the sealing piece 5, and the gaseous first heat exchange medium can be condensed into liquid and flows back into the liquid first heat exchange liquid. The circulation is performed in this way, so that heat transfer between the electronic component 3 and the liquid cooling device is realized. The heat of the electronic component 3 is continuously transferred to the sealing element 5 through the first heat exchange medium 'evaporation-condensation-evaporation-condensation', then transferred to the second heat exchange cavity 18 through the second heat exchange structure 14 on the sealing element 5, and then the heat on the third heat exchange structure 13 is taken away through the flow of water, so that the heat dissipation efficiency and effect on the electronic component 3 can be greatly optimized.
As can be seen from the physical properties of the first heat exchange liquid, a certain space for accommodating steam needs to be reserved in the first heat exchange cavity 19. As is known from the common physical phenomenon, a liquid is vaporized into a gas in a closed space, and the pressure in the closed space increases sharply. It will be appreciated that when the electronic component 3 emits a large amount of heat, if the first heat exchange liquid is rapidly vaporized to be gaseous at the same temperature, the pressure in the first heat exchange chamber 19 will be suddenly increased, which is easy to cause the explosion of the liquid cooling device. Therefore, the first heat exchange liquid is mixed with insulating liquids with different boiling points so as to achieve the purpose of balancing the air pressure in the sealed first heat exchange cavity 19. The pressure value in the first heat exchange cavity 19 is adjusted in a safe range through insulating liquids with different boiling points, so that potential safety hazards caused by rapid increase of air pressure in the first heat exchange cavity 19 due to severe vaporization of the first heat exchange liquid at a certain temperature value are avoided. When the first heat exchange liquid mixed with insulating liquids with different boiling points is used, if the heat emitted by the electronic component 3 is generated, the insulating liquids with different components can be vaporized and transfer heat respectively, that is, when the insulating liquid with one component begins to vaporize, the insulating liquid with the other component is condensed, so that the pressure value range in the first heat exchange cavity 19 can be ensured to be within the safety limit by alternating.
Wherein, be provided with the filling port that is used for injecting into first heat transfer liquid on the sealing member 5, be provided with the shutoff stopper that is used for shutoff filling port on the filling port. The first heat exchange liquid is injected through the injection port, so that the injection amount of the first heat exchange liquid can be conveniently adjusted in the injection process.
The present embodiment also proposes an electronic component assembly comprising an electronic component 3 and a liquid cooling device as described above, the electronic component 3 being at least partially accommodated in the first heat exchange chamber 19. The electronic component 3 is a power device. It should be understood that when the first heat exchange liquid is injected into the first heat exchange cavity 19, it is considered that in a state where some application conditions are extreme, the liquid cooling device is easy to jolt and shake, so that the first heat exchange liquid is easy to shake in the first heat exchange cavity 19, so that the first heat exchange liquid is difficult to wrap the electronic component 3 located in the first heat exchange cavity 19 at any time, and the electronic component 3 may fail due to local overheat. In order to avoid the above state, the amount of the first heat exchange liquid injected into the first heat exchange cavity 19 needs to be supported by a large amount of test data, so that the vapor accommodating space is reasonably distributed, and meanwhile, the first heat exchange liquid is ensured to effectively dissipate heat of the electronic component 3 under extreme conditions.
The present embodiment also proposes a vehicle module including the electronic component assembly as described above. IT should be noted that, the above vehicle module may be a battery management module, an autopilot control module, or a communication module in a vehicle, and the liquid cooling device may be not only suitable for a vehicle module as above, but also suitable for any device requiring heat dissipation of the electronic component 3, such as a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, and other smart consumer electronic devices, may also be a telecommunications room device such as a metropolitan router, a central router, and other telecommunications room devices, may also be an IT computer room device such as a data center server, a data center switch, and other vehicle-mounted devices such as an MDC (Mobile Data Center, a mobile data center), and may also be applied to industrial robots, rail transit (such as subways, high-speed rails), or special power sources (such as ships, airplanes, vehicles), and the embodiments of the present application are not strictly limited.
The present embodiment also proposes a vehicle comprising a vehicle module as described above. The vehicle may be, but is not limited to, a pure electric vehicle (PureElectric Vehicle/BatteryElectric Vehicle, PEV/BEV), a hybrid vehicle (HybridElectric Vehicle, HEV), an extended range electric vehicle (RangeExtendedElectric Vehicle, REEV), a Plug-in hybrid vehicle (Plug-inHybrid Electric Vehicle, PHEV), a new energy vehicle (NewEnergy Vehicle), a fuel vehicle, etc. The vehicle module may be, but is not limited to, an autopilot module, a module to which a braking system belongs, a module to which a steering braking system belongs, and the like.
In summary, by providing the sealed first heat exchange chamber 19 and the second heat exchange chamber 18 and filling the first heat exchange chamber 19 with the insulating first heat exchange liquid, the second heat exchange chamber 18 has the second heat exchange medium for cooling. After the electronic element 3 can transfer heat out through the first heat exchange liquid in the first heat exchange cavity 19, the heat is transferred out again through the second heat exchange cavity 18, the first heat exchange cavity 19 is arranged in the second heat exchange cavity 18, the second heat exchange cavity 18 wraps the first heat exchange cavity 19, the heat exchange area is increased, the heat transfer efficiency of the liquid cooling device of the electronic element 3 is improved, and when the electronic element 3 is subjected to heat dissipation, the heat dissipation effect on the electronic element 3 can be increased. And considering that when the electronic component 3 is a power device, the working voltage of the power device is large, if the positive and negative ends of the electronic component 3 are also immersed in the first heat exchange liquid, the risk of voltage breakdown or creepage is most likely to occur. In the liquid cooling device, the positive electrode and the negative electrode of the power device can be prevented from being in direct contact with the first heat exchange liquid.
The present embodiment is excellent in heat dissipation performance of the electronic component 3, and can be described by comparing data. When the original ceramic material is used to dissipate heat from the electronic component 3, the thermal coefficient is between 0.09 and 0.1, and after the thermal coefficient is reduced to 0.09, breakthrough progress is difficult to achieve. The practical test proves that the liquid cooling device can reduce the thermal resistance coefficient of the electronic element 3 to 0.03-0.05. As can be seen from the above data, compared with the thermal resistivity of the existing power semiconductor, the thermal resistivity of the electronic component 3 in the liquid cooling device in the application is improved by an order of magnitude, and the liquid cooling device has a good heat dissipation effect particularly for a power device with a large heating value and a large working voltage, so that a new thought and direction are provided for heat dissipation of the electronic component 3.
The above embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention.
Claims (18)
1. The liquid cooling device for the electronic component is characterized by comprising a heat exchange shell, wherein the heat exchange shell is internally provided with:
a mounting position for mounting the electronic component,
the first heat exchange cavity is sealed and arranged around the mounting position;
a closed second heat exchange chamber surrounding the first heat exchange chamber;
the first heat exchange cavity is used for filling insulating first heat exchange liquid, and the second heat exchange cavity is used for filling second heat exchange working medium.
2. The liquid cooling apparatus for electronic components according to claim 1, wherein: the heat exchange shell comprises a shell body, a sealing element and a mounting seat, wherein the mounting seat is arranged in the mounting seat, the mounting seat is arranged in the sealing element and is in sealing connection with the sealing element to form a first heat exchange cavity, and the sealing element is arranged in the shell body and is in sealing connection with the shell body to form a second heat exchange cavity.
3. The liquid cooling apparatus for electronic components according to claim 2, wherein: the mounting seat is provided with a first heat exchange structure protruding out of the outer side of the mounting seat, and the first heat exchange structure is used for being connected with the electronic element.
4. A liquid cooling apparatus for electronic components according to claim 3, wherein: the first heat exchange structure is a plurality of pin-shaped fins, and a plurality of pin-shaped fins are arranged in a arrayed mode.
5. The liquid cooling apparatus for electronic components according to claim 2, wherein: the inner wall of sealing member is provided with the second heat transfer structure, be provided with the third heat transfer structure on the outer wall of sealing member, the second heat transfer structure is used for the increase the sealing member with the heat exchange efficiency of first heat exchange liquid, the third heat transfer structure is used for the increase the sealing member with the heat exchange efficiency of second heat exchange working medium.
6. The liquid cooling apparatus for electronic components according to claim 5, wherein: the second heat exchange structure and the third heat exchange structure are a plurality of pin-shaped fins, and the pin-shaped fins are arranged in a row.
7. The liquid cooling apparatus for electronic components according to claim 2, wherein: the mounting seat is tubular, the inside of the tubular shape is the mounting position, the mounting seat is arranged in the sealing element in a penetrating way, and the outer wall of the mounting seat is in sealing connection with the sealing element.
8. The liquid cooling apparatus for electronic components according to claim 2, wherein: the shell body is provided with a liquid inlet and a liquid outlet on two opposite sides respectively, and the liquid inlet and the liquid outlet are communicated with the second heat exchange cavity.
9. The liquid cooling apparatus for electronic components according to claim 8, wherein: the shell body comprises a base and a cover body arranged on the base, the cover body and the sealing piece form a second heat exchange cavity, and the liquid inlet and the liquid outlet are arranged on the base.
10. The liquid cooling apparatus for electronic components according to claim 9, wherein: the second heat exchange cavity is internally provided with a partition plate, the partition plate partitions the second heat exchange cavity, the partition plate is provided with a drainage port close to the top of the inner wall of the cover body, and the liquid inlet is communicated with the liquid outlet through the drainage port.
11. The liquid cooling apparatus for electronic components according to claim 9, wherein: the sealing device is characterized in that a sealing groove is formed in the surface, which is in contact with the base, of the cover body, sealing glue is arranged in the sealing groove, and the cover body is in sealing connection with the base through the sealing groove and the sealing glue.
12. The liquid cooling apparatus for electronic components according to claim 1, wherein: the first heat exchange liquid comprises a fluorinated liquid, 1, 2-tetrafluoroethane, 1, 3-pentafluoropropane a combination of one or more of 1, 3-tetrafluoropropene, 1-chloro-3, 3-trifluoropropene.
13. The liquid cooling apparatus for electronic components according to claim 2, wherein: the sealing piece is provided with an injection port for injecting the first heat exchange liquid, and the injection port is provided with a plugging plug for plugging the injection port.
14. The liquid cooling apparatus for electronic components according to claim 1, wherein: the second heat exchange working medium is water.
15. An electronic component assembly comprising an electronic component and a liquid cooling apparatus according to any one of claims 1 to 14, wherein the electronic component is at least partially housed in the first heat exchange chamber.
16. The electronic component assembly of claim 15, wherein the electronic component is a power device.
17. A vehicle module comprising the electronic component assembly of claim 13 or 14.
18. A vehicle comprising the vehicle module of claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311420128.9A CN117476577A (en) | 2023-10-30 | 2023-10-30 | Liquid cooling device of electronic component, electronic component assembly, vehicle module and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311420128.9A CN117476577A (en) | 2023-10-30 | 2023-10-30 | Liquid cooling device of electronic component, electronic component assembly, vehicle module and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117476577A true CN117476577A (en) | 2024-01-30 |
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ID=89634137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311420128.9A Pending CN117476577A (en) | 2023-10-30 | 2023-10-30 | Liquid cooling device of electronic component, electronic component assembly, vehicle module and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117476577A (en) |
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2023
- 2023-10-30 CN CN202311420128.9A patent/CN117476577A/en active Pending
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