CN117368543A

CN117368543A - A kind of wafer aging test device

Info

Publication number: CN117368543A
Application number: CN202311421514.XA
Authority: CN
Inventors: 廉哲; 周斌; 郭孝明; 徐鹏嵩
Original assignee: Suzhou Lianxun Instrument Co ltd
Current assignee: Suzhou Lianxun Instrument Co ltd
Priority date: 2023-10-27
Filing date: 2023-10-27
Publication date: 2024-01-09

Abstract

The invention provides a wafer aging testing device and relates to the technical field of wafer testing. The support structure has at least one probe station located under the fixture. The probe station has a plurality of first probes in contact with the wafer power supply board. At least one set of circuit switch boards is arranged beside the support structure. Each set of circuits The switch board group includes at least one line switch board with a plurality of switches. Each line switch board in each line switch board group is connected to the probe station to pair the fixture with the probe station and the wafer powering board when the switch is turned on. The wafer inside is powered on for testing. The above technical solution is equivalent to connecting all circuit switch boards used for wafer power-on testing to the probe station. When testing the wafer, the test circuits are directly controlled independently through the switches on the circuit switch board, and then through the probe station. The first probe and wafer power-on board on the device realize power-on test of the wafer without replacing the circuit switch board, which saves test time and simplifies the test process.

Description

Wafer aging testing device

Technical Field

The invention relates to the technical field of wafer testing, in particular to a wafer aging testing device.

Background

After the wafer generation is completed, the wafer needs to be subjected to burn-in test. Typically, wafer burn-in testing includes power-up testing and warm-up testing to test the burn-in performance of the wafer. The design of the wafer burn-in apparatus is important for the wafer burn-in. In the power-up test process, different power-up tests are required to be performed on the wafer through multiple power-up lines, so that multiple line switch boards are used.

In the prior art, if the circuit switch boards for carrying out the power-on test on the wafer are directly installed in the wafer aging test device, a large installation space is occupied, so that an installation position of the circuit switch boards is generally set, the circuit switch boards are continuously replaced, and therefore all the power-on test on the wafer is realized.

Disclosure of Invention

An object of the present invention is to provide a wafer burn-in apparatus, which solves the technical problem of time consumption for wafer burn-in the prior art.

Another object of the present invention is to make the wafer burn-in apparatus more compact.

According to an object of the present invention, there is provided a wafer burn-in apparatus for burn-in testing a wafer in a jig including a wafer power-up plate, the wafer burn-in apparatus comprising:

a support structure for supporting the fixture, the support structure having at least one probe station located below the fixture, the probe station having a plurality of first probes in contact with the wafer power-up plate;

at least one group of circuit switch board groups is arranged at the side of the supporting structure, each group of circuit switch board groups comprises at least one circuit switch board with a plurality of switches, and each circuit switch board in each group of circuit switch board groups is connected with the probe station so as to carry out power-on test on the wafer in the clamp through the probe station and the wafer power-on board when the switch is started.

Optionally, each group of the circuit switch board groups is arranged corresponding to one of the probe stations, each group of the circuit switch board groups comprises a plurality of circuit switch boards connected with the corresponding probe station, and the plurality of circuit switch boards are arranged in a vertically spaced stack.

Optionally, the method further comprises:

at least one conductive plate, each conductive plate corresponds to one probe station and one circuit switch board group, the conductive plate is provided with a first part and a second part, the first part is positioned below the corresponding probe station and is contacted with the plurality of first probes of the probe station, and the second part extends from the first part to the outer side of the probe station and is connected with each circuit switch board of the corresponding circuit switch board group.

Optionally, the method further comprises:

at least one group of mounting piece group, every group the mounting piece group corresponds one the current-conducting plate, every group the mounting piece group includes a plurality of mounting pieces, every the mounting piece with the corresponding one that the current-conducting plate is connected the circuit switch board corresponds the arrangement, be equipped with a plurality of second probes in the mounting piece, second probe one end with the corresponding circuit switch board contact, the other end with the second part contact of current-conducting plate.

Optionally, a plurality of the mounting pieces of the mounting piece group are arranged in a staggered manner, and a plurality of the circuit switch boards in the circuit switch board group are arranged in a staggered manner.

Optionally, the supporting structure includes two spaced-apart and oppositely arranged probe stations, the number of the circuit switch board groups is two, and the two circuit switch board groups are respectively located at two sides of the supporting structure and respectively correspond to one probe station.

Optionally, the method further comprises:

and the heating structure is positioned between the two probe platforms, and a heating assembly is arranged in the heating structure and is used for heating the clamp when the clamp is positioned in the supporting structure.

Optionally, the method further comprises:

the two groups of acquisition board groups are respectively and correspondingly arranged at the rear sides of the two groups of circuit switch board groups, each group of acquisition board groups comprises a plurality of current signal acquisition boards, each current signal acquisition board is correspondingly connected with one circuit switch board and is used for acquiring corresponding current signals of the circuit switch boards.

Optionally, a plurality of said current signal acquisition plates of each set of said acquisition plates are arranged in a vertically spaced stack.

Optionally, the method further comprises:

the two power supply modules are respectively arranged beside the two acquisition board groups, and the acquisition board groups and the circuit switch board groups which correspond to each other are connected.

The supporting structure is provided with at least one probe station positioned below the clamp, the probe station is provided with a plurality of first probes contacted with the wafer power-on plate, at least one group of circuit switch board groups are arranged at the side of the supporting structure, each group of circuit switch board groups comprises at least one circuit switch board with a plurality of switches, and each circuit switch board in each group of circuit switch board groups is connected with the probe station so as to perform power-on test on the wafer in the clamp through the probe station and the wafer power-on plate when the switches are opened. The technical scheme is equivalent to that all the circuit switch boards used for the wafer power-on test are connected with the probe station, the test circuit is directly controlled independently through the switch on the circuit switch board when the wafer is tested, and the power-on test of the wafer is realized through the first probe on the probe station and the wafer power-on board without replacing the circuit switch board, so that the test time is saved, and the test flow is simplified.

In the invention, each group of circuit switch board groups is correspondingly arranged with one probe station, each group of circuit switch board groups comprises a plurality of circuit switch boards connected with the corresponding probe station, and the circuit switch boards are vertically stacked at intervals.

The above, as well as additional objectives, advantages, and features of the present invention will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present invention when read in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the invention will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:

FIG. 1 is a schematic block diagram of a wafer burn-in apparatus according to one embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of a wafer burn-in apparatus according to one embodiment of the invention;

FIG. 3 is a schematic enlarged view at A of FIG. 2;

FIG. 4 is a schematic block diagram of a first probe and a second probe in the wafer burn-in apparatus of FIG. 1;

FIG. 5 is a schematic block diagram of a conductive plate in the wafer burn-in apparatus of FIG. 3;

fig. 6 is a schematic installation diagram of the mounting frame and the current signal acquisition board in the wafer burn-in apparatus shown in fig. 1.

Reference numerals:

100-wafer burn-in testing device, 200-clamp, 210-wafer power board, 10-circuit switch board group, 20-supporting structure, 30-mounting member group, 40-heating structure, 50-cylinder, 60-acquisition board group, 70-power module, 80-elastic supporting seat, 11-circuit switch board, 111-switch, 12-mounting board, 21-probe station, 22-base, 23-conducting board, 31-mounting member, 211-first probe, 311-second probe, 61-current signal acquisition board, 231-first part, 232-second part, 90-mounting rack, 91-mounting position.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.

In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature, i.e. one or more such features. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. When a feature "comprises or includes" a feature or some of its coverage, this indicates that other features are not excluded and may further include other features, unless expressly stated otherwise.

Unless specifically stated and limited otherwise, the term "coupled" and the like are to be construed broadly and may be, for example, fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. Those of ordinary skill in the art will understand the specific meaning of the terms described above in the present invention as the case may be.

Unless otherwise defined, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

Fig. 1 is a schematic structural view of a wafer burn-in apparatus 100 according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional view of the wafer burn-in apparatus 100 according to an embodiment of the present invention, fig. 3 is a schematic enlarged view at a shown in fig. 2, and fig. 4 is a schematic structural view of a first probe 211 and a second probe 311 in the wafer burn-in apparatus 100 shown in fig. 1. As shown in fig. 1 to 4, in a specific embodiment, the wafer burn-in apparatus 100 is used for burn-in testing a wafer in a fixture 200, the fixture 200 includes a wafer power-up plate 210, the wafer burn-in apparatus 100 includes a support structure 20 and at least one circuit switch board group 10, wherein the support structure 20 is used for supporting the fixture 200, the support structure 20 has at least one probe station 21 located under the fixture 200, and the probe station 21 has a plurality of first probes 211 contacting the wafer power-up plate 210. At least one set of circuit switch board sets 10 is disposed beside the support structure 20, each set of circuit switch board sets 10 includes at least one circuit switch board 11 having a plurality of switches 111, each circuit switch board 11 in each set of circuit switch board sets 10 is connected to a probe station 21 for electrically testing the wafer in the fixture 200 via the probe station 21 and the wafer power-up board 210 when the switches 111 are turned on. Here, the switch 111 can be understood as relays, each of which is capable of independently controlling the energizing line.

This embodiment is equivalent to connecting all the circuit switch boards 11 for wafer power-up test with the probe station 21, and when testing the wafer, the test circuit is controlled independently by the switch 111 on the circuit switch board 11, and then the power-up test of the wafer is realized by the first probe 211 on the probe station 21 and the wafer power-up board 210, so that the circuit switch board 11 does not need to be replaced, the test time is saved, and the test flow is simplified.

In this embodiment, each of the line switch board groups 10 is arranged corresponding to one of the probe stations 21, and each of the line switch board groups 10 includes a plurality of line switch boards 11 connected to the corresponding probe station 21, and the plurality of line switch boards 11 are arranged in vertically spaced-apart stacks. Compared with the technical scheme that a plurality of circuit switch boards 11 are arranged side by side, the wafer burn-in test device 100 is more compact in structure and saves installation space.

Fig. 5 is a schematic structural view of a conductive plate in the wafer burn-in apparatus shown in fig. 3. As shown in fig. 5, and referring to fig. 3 and 4, in this embodiment, the wafer burn-in apparatus 100 further includes at least one conductive plate 23, each conductive plate 23 corresponding to one probe station 21 and one set of circuit switch board groups 10, the conductive plate 23 having a first portion 231 and a second portion 232, the first portion 231 being located below the corresponding probe station 21 and being in contact with the plurality of first probes 211 of the probe station 21, the second portion 232 extending from the first portion 231 to the outside of the probe station 21 and being connected to each circuit switch board 11 of the corresponding circuit switch board group 10. All the circuit switch boards 11 are in contact with the second probes 311 of the probe stage 21 through the conductive plates 23. Here, the size of the first portion 231 of the conductive plate 23 is set according to the size of the probe stage 21, and the size of the second portion 232 is set according to the number of line switch board groups 10 in each group of line switch board groups 10, and the larger the number of line switch board groups 10, the larger the size of the second portion 232 of the conductive plate 23. Here, a plurality of contact sites are provided on each of the first portion 231 and the second portion 232, the contact sites on the first portion 231 being disposed corresponding to the first probes 211 and for contact with the first probes 211, and the contact sites on the second portion 232 being disposed corresponding to the second probes 311 and for contact with the second probes 311.

In this embodiment, the wafer burn-in apparatus 100 further includes at least one mounting member set 30, each mounting member set 30 corresponding to one conductive plate 23, each mounting member set 30 includes a plurality of mounting members 31, each mounting member 31 is disposed corresponding to one of the circuit switch plates 11 connected to the corresponding conductive plate 23, a plurality of second probes 311 are disposed in the mounting members 31, and one end of each second probe 311 is in contact with the corresponding circuit switch plate 11, and the other end is in contact with the second portion 232 of the conductive plate 23. Here, it can be understood that since the plurality of line switch boards 11 are arranged in a stacked manner, in order to connect all of the line switch boards 11 to the conductive board 23, one mounting member 31 needs to be disposed between each of the line switch boards 11 and the conductive board 23, and the second probe 311 is disposed in the mounting member 31, so that the corresponding line switch board 11 is electrically connected to the conductive board 23 through the second probe 311.

In this embodiment, the plurality of mounting pieces 31 of the mounting piece group 30 are arranged in a staggered manner, and the plurality of line switch boards 11 in the line switch board group 10 are arranged in a staggered manner. Here, the plurality of mounting pieces 31 are each arranged vertically, with one end in contact with the conductive plate 23 and the other end in contact with the corresponding conductive plate 23.

In this embodiment, the supporting structure 20 includes two probe stations 21 spaced apart and arranged opposite to each other, and the number of the line switch board groups 10 is two, and the two line switch board groups 10 are respectively located at two sides of the supporting structure 20 and are respectively arranged corresponding to one probe station 21. Referring to fig. 2, two sets of circuit switch board sets 10 are respectively located on the left and right sides of the support structure 20. This embodiment corresponds to a set of circuit switch board sets 10 disposed on both sides of the supporting structure 20 and connected to two probe stations 21 of the supporting structure 20, so that more circuit switch boards 11 are mounted on the wafer burn-in apparatus 100 and the structure of the wafer burn-in apparatus 100 is more compact.

Referring to fig. 1 and 3, each of the wiring switch board groups 10 includes four wiring switch boards 11 arranged in a stack, the four wiring switch boards 11 are not in contact with each other, the height of each mounting member 31 is set according to the mounting height of the corresponding wiring switch board 11 and the distance from the conductive plate 23, and the length of the corresponding second probe 311 is also set according to the mounting height of the wiring switch board 11 and the distance from the conductive plate 23. The ends of the four stacked circuit switch boards 11 near the probe station 21 are staggered to facilitate placement of the mounting members 31.

In this embodiment, the wafer burn-in apparatus 100 further includes two susceptors 22, each susceptors 22 being located below one of the probe stations 21 and the conductive plate 23 for supporting the conductive plate 23 and the probe station 21. The support structure 20 further includes a plurality of air cylinders 50 at the top and a plurality of elastic support seats 80 on the base 22, the plurality of elastic support seats 80 being spaced apart in the front-rear direction for supporting the jig 200. When the jig 200 is positioned inside the support structure 20, first, the jig 200 is supported by the plurality of elastic support bases 80, that is, the wafer power-up plate 210 of the jig 200 is positioned on the elastic support bases 80, and the jig 200 is not in contact with the first probes 211. After the jig 200 is in place, a downward force is applied to the jig 200 by the pressing of the air cylinder 50, so that the jig 200 moves downward to a position where it contacts the first probe 211, and the contact of the jig 200 with the first probe 211 is achieved. By providing the elastic supporting seat 80, the embodiment can avoid the clamp 200 from being scratched with the first probe 211 in the process of entering the supporting structure 20, so that the clamp 200 is damaged or the first probe 211 is damaged.

In this embodiment, the wafer burn-in apparatus 100 further includes a heating structure 40, the heating structure 40 is located between the two probe stations 21, and a heating assembly is disposed in the heating structure 40 for heating the fixture 200 when the fixture 200 is located in the support structure 20. When the fixture 200 moves into the supporting structure 20, the fixture 200 is supported by the elastic supporting seat 80, and the fixture 200 is not contacted with the first probe 211 and the heating structure 40, after the fixture 200 is in place, a downward acting force is applied to the fixture 200 by pressing down the air cylinder 50, so that the fixture 200 moves downwards to a position contacted with the heating structure 40, and the fixture 200 is heated by the heating structure 40, so that a heating test of a wafer is realized.

Fig. 6 is a schematic installation diagram of the mounting frame and the current signal acquisition board in the wafer burn-in apparatus shown in fig. 1. As shown in fig. 6 and referring to fig. 1, in this embodiment, the wafer burn-in apparatus 100 further includes two collection board groups 60, where the two collection board groups 60 are respectively disposed on the rear sides of the two line switch board groups 10, and each collection board group 60 includes a plurality of current signal collection boards 61, and each current signal collection board 61 is correspondingly connected to one line switch board 11, so as to collect current signals of the corresponding line switch board 11, see fig. 1.

In this embodiment, a plurality of current signal acquisition plates 61 of each set of acquisition plates 60 are arranged in vertically spaced stacks. That is, this embodiment not only stacks the plurality of line switch boards 11 but also stacks the plurality of current signal collection boards 61, thereby further making the structure of the wafer burn-in apparatus 100 more compact.

In this embodiment, the wafer burn-in apparatus 100 further includes two mounting frames 90, each mounting frame 90 is disposed corresponding to one set of circuit switch board groups 10 and one set of collection board groups 60, each mounting frame 90 has a plurality of mounting positions 91 disposed at intervals vertically, one circuit switch board 11 is disposed on each mounting position 91, and each current signal collection board 61 in the collection board groups 60 is connected to one circuit switch board 11, so that one current signal collection board 61 collects current signals of one circuit switch board 11.

In this embodiment, the wafer burn-in apparatus 100 further includes two power modules 70, where the two power modules 70 are disposed beside the two collection board groups 60, and the corresponding collection board groups 60 are connected to the circuit switch board 11 group 10. Referring to fig. 1, this embodiment further includes a mounting plate 12, and the circuit switch board 11 set 10, the support structure 20, the collection board set 60, the power module 70, and the heating structure 40 are all mounted on the mounting plate 12, and in this embodiment, the two circuit switch board 11 sets 10, the two collection board sets 60, and the two power modules 70 are all symmetrically disposed, and the support structure 20 and the heating structure 40 are located in the middle of the mounting plate 12.

In this embodiment, by installing all the circuit switch boards 11 for wafer heating test on the wafer burn-in test device 100, when the wafer is powered, the circuit switch boards 11 do not need to be replaced frequently, and different power-up tests of the wafer can be realized only by controlling corresponding circuits through the switches 111 on the circuit switch boards 11. In addition, the embodiment arranges the plurality of circuit switch boards 11 in a stacking manner, so that the structure of the wafer burn-in test device 100 is more compact while the wafer burn-in test is not affected, and the arrangement space is saved.

By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described herein in detail, many other variations or modifications of the invention consistent with the principles of the invention may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. The utility model provides a wafer burn-in test device for carry out burn-in test to the wafer in the anchor clamps, anchor clamps include the wafer power board, wafer burn-in test device includes:

2. The wafer burn-in apparatus of claim 1, wherein,

each group of the circuit switch board groups is arranged corresponding to one probe station, each group of the circuit switch board groups comprises a plurality of circuit switch boards connected with the corresponding probe station, and the circuit switch boards are arranged in a vertically spaced and stacked mode.

3. The wafer burn-in apparatus of claim 2, further comprising:

4. The wafer burn-in apparatus of claim 3, further comprising:

5. The wafer burn-in apparatus of claim 4, wherein,

the plurality of the installation pieces of the installation piece group are arranged in a staggered mode, and the plurality of the circuit switch boards in the circuit switch board group are arranged in a staggered mode.

6. The wafer burn-in apparatus of any one of claims 1-5, wherein,

the support structure comprises two probe stations which are arranged at intervals and opposite to each other, the number of the line switch board groups is two, and the two line switch board groups are respectively positioned at two sides of the support structure and are respectively arranged corresponding to one probe station.

7. The wafer burn-in apparatus of claim 6, further comprising:

8. The wafer burn-in apparatus of claim 7, further comprising:

9. The apparatus of claim 8, wherein,

a plurality of the current signal acquisition plates of each set of acquisition plates are arranged in a vertically spaced stack.

10. The wafer burn-in apparatus of claim 9, further comprising: