CN117348100A - Semiconductor lead frame detection device and method - Google Patents
Semiconductor lead frame detection device and method Download PDFInfo
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- CN117348100A CN117348100A CN202311182293.5A CN202311182293A CN117348100A CN 117348100 A CN117348100 A CN 117348100A CN 202311182293 A CN202311182293 A CN 202311182293A CN 117348100 A CN117348100 A CN 117348100A
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- 238000001514 detection method Methods 0.000 title claims abstract description 95
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000007689 inspection Methods 0.000 claims description 15
- 230000005622 photoelectricity Effects 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000009347 mechanical transmission Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/20—Detecting, e.g. by using light barriers using multiple transmitters or receivers
- G01V8/22—Detecting, e.g. by using light barriers using multiple transmitters or receivers using reflectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention belongs to the technical field of semiconductor equipment, and discloses a semiconductor lead frame detection device and method, wherein the device comprises a substrate, a sliding table assembly, a workpiece placing table, a workpiece placing plate and a detection component; the slipway subassembly sets up on the base plate, the work piece is placed the platform and is passed through slipway subassembly and base plate sliding connection, the photoelectricity detection hole has been seted up on the work piece is placed the board, photoelectricity detection hole's downside is fixed and is provided with the reflecting plate, detection part includes supporting component, position adjustment subassembly and laser detection sensor, supporting component's bottom and base plate fixed connection, position adjustment subassembly and supporting component's top sliding connection, laser detection sensor sets up on the position adjustment subassembly, laser detection sensor is used for judging whether the work piece is put and is reflected and/or the work piece is placed at appointed position according to whether receiving the infrared ray of reflecting plate reflection. The invention realizes the recognition of the workpiece placement position, has simple and practical principle, high precision and wide application range.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor lead frame detection device and method.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and diodes are devices fabricated using semiconductors.
The lead frame is a key structural member for forming an electric loop by electrically connecting an internal circuit lead-out end of a chip with an external lead through bonding materials such as gold wires, aluminum wires and copper wires, and plays a role of a bridge connected with an external lead, and the lead frame is needed to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry
According to the characteristics of the semiconductor packaging technology, the function of detecting whether the workpiece is reversed or not and whether the workpiece is placed in the opposite position or not when the semiconductor lead frame is pushed to normally run is required.
Disclosure of Invention
In view of the above, the present invention provides a device and a method for detecting a semiconductor lead frame, so as to solve the problem that the position of a workpiece is misplaced and cannot be identified.
A semiconductor lead frame detection device comprises a substrate, a sliding table assembly, a workpiece placement table, a workpiece placement plate and a detection component; the device comprises a substrate, a workpiece placing table, a workpiece placing plate, a photoelectric detection hole, a reflecting plate, a detection component, a supporting component, a position adjusting component and a laser detection sensor, wherein the sliding table component is arranged on the substrate, the workpiece placing table is connected with the substrate in a sliding mode, the workpiece placing plate is arranged at the top of the workpiece placing table, the photoelectric detection hole is formed in the workpiece placing plate, the reflecting plate is fixedly arranged at the lower side of the photoelectric detection hole, the bottom of the supporting component is fixedly connected with the substrate and is located on one side of the workpiece placing plate, the position adjusting component is connected with the top of the supporting component in a sliding mode, the laser detection sensor is arranged on the position adjusting component, and the laser detection sensor is used for judging whether a workpiece is placed reversely and/or not according to whether infrared rays reflected by the reflecting plate are received or not.
Further, the sliding table assembly comprises a first sliding rail, a contact plate and a supporting plate;
the first sliding rail is fixedly arranged at the top of the base plate, the bottom of the contact plate is in sliding connection with the first sliding rail, the two supporting plates are respectively fixedly arranged at two ends of the top of the contact plate, and the bottom of the workpiece placing table is fixedly connected with the two supporting plates.
Further, two waste material placing boxes are embedded and installed on the outer side of each supporting plate.
Further, be provided with a plurality of stations on the work piece placing plate, every the station is used for placing a work piece, every still fixed being provided with spacing post in one side of station, the work piece placing plate is in every one side of station has all seted up one photoelectricity detection hole.
Further, a plurality of workpiece spacing grooves are formed in the upper portion of the workpiece placing plate.
Further, the support assembly comprises a support rod, a rotating rod and a transverse plate;
the bottom of the supporting rod is fixedly connected with the base plate, the bottom of the rotating rod is detachably connected with the top of the supporting rod, and one end of the transverse plate is fixedly connected with the top of the rotating rod.
Further, the position adjusting assembly comprises a second sliding rail, a sliding block, a fixed block, an adjusting knob and a locking groove;
the second sliding rails are fixedly arranged at the top of the transverse plate, a plurality of sliding blocks are arranged, one sliding block is correspondingly arranged at each station on each workpiece placing plate, each sliding block is in sliding connection with the second sliding rail, the outer side of each sliding block is fixedly connected with the fixing plate, one side of each fixing plate is provided with a threaded through hole, and each threaded through hole is in threaded connection with the adjusting knob;
the laser detection sensor sets up a plurality ofly, every all correspond and be provided with one on the fixed plate laser detection sensor, the fixed plate with the outside of diaphragm is parallel and have the clearance, locking recess sets up the outside of diaphragm and be located in the clearance, be provided with a plurality of latch segment in the locking recess, a plurality of latch segment all with locking recess sliding connection, every the latch segment corresponds with one adjust knob's position and sets up.
Further, the supporting rod is perpendicular to the base plate, the rotating rod and the supporting rod are concentrically arranged, and the transverse plate is perpendicular to the rotating rod and is parallel to the workpiece placing plate.
Further, the center line of the second sliding rail is parallel to the center line of the transverse plate, an included angle between the fixed plate and the sliding block is 90 degrees, and the center line of the locking groove is parallel to the center line of the second sliding rail.
The invention also provides a semiconductor lead frame detection method, which is executed by the semiconductor lead frame detection device and comprises the following steps:
the position of the laser detection sensor on the supporting component is adjusted through the position adjusting component, so that the position of the laser detection sensor corresponds to a station on the workpiece placing plate;
after the workpiece is sent to a station on the workpiece placing plate, infrared rays are emitted to the photoelectric detection holes;
the laser detection sensor judges whether the workpiece is reversely placed and whether the workpiece is placed at a designated position according to whether the infrared rays reflected by the reflecting plate are received or not, and comprises: and if the laser sensor does not receive the infrared rays reflected by the reflecting plate, determining that the current position of the workpiece has no perforation, and the workpiece is placed on the specified position or not.
The invention has the beneficial effects that:
1. the invention has simple detection principle and ingenious design, has the function of detecting whether the workpiece is reversely placed and whether the workpiece is placed at the opposite position when the semiconductor lead frame is pushed to normally run, judges whether the workpiece plate is provided with corresponding holes through capturing the infrared rays by the laser detection sensor, and can not identify the corresponding holes if the workpiece is reversely placed or misplaced by the laser sensor, thereby realizing the identification of the placement position of the workpiece.
2. The detection device disclosed by the invention is stable in mechanical transmission, and the position adjusting assembly is used for controlling different positions of the laser detection sensor on the supporting assembly, so that perforation conditions of different positions of a workpiece are detected, the detection device is simple in structure and convenient to use, can be used for workpieces of various types, and is wider in application range.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view showing a semiconductor lead frame inspection apparatus according to an embodiment of the present invention;
FIG. 2 shows an enlarged schematic view of the structure of FIG. 1 at A;
FIG. 3 illustrates a schematic installation of a workpiece placement plate according to an embodiment of the invention;
fig. 4 shows a schematic installation view of a support plate according to an embodiment of the present invention;
fig. 5 shows a schematic flow chart of a semiconductor lead frame inspection according to an embodiment of the invention.
In the figure: 1. a substrate; 2. a waste material placing box; 3. a first slide rail; 4. a contact plate; 5. a support plate; 6. a workpiece placement table; 7. a work placement plate; 8. a limit column; 9. a photoelectric detection hole; 10. workpiece spacing grooves; 11. a support rod; 12. a rotating lever; 13. a cross plate; 14. a slide block; 15. a fixing plate; 16. a laser detection sensor; 17. an adjustment knob; 18. a locking groove; 19. and a second slide rail.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like herein are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings.
The invention provides a semiconductor lead frame detection device and a method, which can detect whether a workpiece is reversely placed and whether the workpiece is placed at the opposite position when the semiconductor lead frame is pushed to normally run, and after the problem is detected, a laser detection sensor 16 sends a signal to a control system to stop the pushing process in time, and if the workpiece is reversely placed or misplaced, the laser sensor cannot identify the corresponding hole site and can send an alarm, so that the semiconductor lead frame detection device has a simple structure and strong practicability.
As shown in fig. 1, a semiconductor lead frame inspection apparatus includes a substrate 1, a slide table assembly, a work placement table 6, a work placement plate 7, and inspection members.
Wherein, slip table subassembly sets up on base plate 1, work piece places platform 6 and base plate 1 sliding connection through slip table subassembly, for example, slip table subassembly includes first slide rail 3, contact plate 4 and backup pad 5, first slide rail 3 is fixed to be set up at the top of base plate 1, the bottom and the first slide rail 3 sliding connection of contact plate 4 realize the spacing and the direction function of promotion direction through first slide rail 3, as shown in fig. 1 and 4, two backup pads 5 are fixed respectively and are set up at the top both ends of contact plate 4, the bottom and two backup pad 5 fixed connection of work piece place platform 6, two waste material are placed box 2 are all inlayed and are installed in the outside of every backup pad 5.
The workpiece placement plate 7 is arranged at the top of the workpiece placement table 6, a photoelectric detection hole 9 is formed in the workpiece placement plate 7, and a reflecting plate is fixedly arranged on the lower side of the photoelectric detection hole 9, so that a laser reflection function is realized, and the laser reflection plate can be any reflection structure in the prior art.
The detection component comprises a supporting component, a position adjusting component and a laser detection sensor 16, wherein the bottom of the supporting component is fixedly connected with the base plate 1 and is positioned on one side of the workpiece placement plate 7, the position adjusting component is slidably connected with the top of the supporting component, the laser detection sensor 16 is arranged on the position adjusting component, and the position adjusting component is used for adjusting the position of the laser detection sensor 16 on the supporting component.
In the detection process, when the infrared rays penetrate through the photoelectric detection hole 9 and then irradiate the reflecting plate at the lower side of the photoelectric detection hole 9, the laser detection sensor 16 is used for judging whether the workpiece is reversely placed and/or whether the workpiece is placed at a designated position according to whether the infrared rays reflected by the reflecting plate are received or not.
The laser detection sensor 16 is configured to determine whether the workpiece is reflected and/or whether the workpiece is placed at a specified position according to whether the infrared ray reflected by the reflecting plate is received, which is specifically based on the following principle: the laser detection sensor 16 judges whether there are perforations at different positions on the workpiece according to whether the infrared rays reflected by the reflecting plate are received or not, if the workpiece is placed reversely or is not placed at a designated position, the laser sensor cannot receive the reflected infrared rays, and the current position of the workpiece is determined to have no perforation, so that the placement position of the workpiece is identified.
For example, the laser detection sensor 16 may be any laser sensor known in the art, such as a reflected output molar mass, modal mass, or the like.
For example, the work placement stage 6 may be any of the prior art placement mechanisms in which a placement groove is provided on the work placement stage 6, and the work placement plate 7 is provided in the placement groove.
For example, a plurality of work stations are arranged on the work piece placing plate 7, each work station is used for placing a work piece, a limit column 8 is fixedly arranged on one side of each work station and used for fixing the position of the work piece, and a photoelectric detection hole 9 is formed in one side of each work station of the work piece placing plate 7.
For example, 4 stations are arranged on the workpiece placement plate 7, 1 photoelectric detection hole 9 is arranged on one side of each station, and 1 limit post 8 is arranged on one side of each station.
For example, as shown in fig. 1 and 3, the upper part of the work placement plate 7 is provided with a plurality of work spacing grooves 10 for the isolated mounting of the work.
For example, the support assembly includes a support rod 11, a rotating rod 12 and a transverse plate 13, wherein, the bottom of the support rod 11 is fixedly connected with the base plate 1, the support rod 11 is vertical to the base plate 1, the bottom of the rotating rod 12 is detachably connected with the top of the support rod 11 through a flange, the rotating rod 12 and the support rod 11 are concentrically arranged, one end of the transverse plate 13 is fixedly connected with the top of the rotating rod 12, the transverse plate 13 is vertical to the rotating rod 12 and is arranged in parallel with the workpiece placing plate 7, the transverse plate 13 can rotate around the support rod 11 through the rotating rod 12, and the transverse plate 13 can be positioned right above the workpiece placing plate 7 by rotating the transverse plate 13.
For example, as shown in fig. 2, the position adjustment assembly includes a second slide rail 19, a slider 14, a fixed block, an adjustment knob 17, and a locking groove 18.
The second slide rail 19 is fixedly arranged at the top of the transverse plate 13, the center line of the second slide rail 19 is parallel to the center line of the transverse plate 13, the slide blocks 14 are arranged in a plurality, stations on each workpiece placement plate 7 are correspondingly provided with one slide block 14, each slide block 14 is in sliding connection with the second slide rail 19, the outer side of each slide block 14 is fixedly connected with a fixing plate 15, one side of each fixing plate 15 is provided with a threaded through hole, and each threaded through hole is in threaded connection with an adjusting knob 17.
The laser detection sensor 16 sets up a plurality ofly, all correspond and be provided with a laser detection sensor 16 on every fixed plate 15, contained angle between fixed plate 15 and the slider 14 is 90 degrees, fixed plate 15 is parallel and have the clearance with the outside of diaphragm 13, locking recess 18 sets up in the outside of diaphragm 13 and is located the clearance, locking recess 18's central line is parallel with the central line of second slide rail 19, be provided with a plurality of latch segment in the locking recess 18, a plurality of latch segment all with locking recess 18 sliding connection, every latch segment corresponds the setting with the position of an adjust knob 17, through rotatory adjust knob 17 and latch segment cooperation, realize laser detection sensor 16's fixed, through adjusting different position latch segment and different position adjust knob 17 positions, and then control detection device detects the trompil condition of difference on the work piece.
According to the invention, the transverse plate 13 is connected with the supporting rod 11 through the rotating rod 12, so that the transverse plate 13 can circumferentially rotate around the central line of the supporting rod 11, an arbitrary included angle between the transverse plate 13 and a workpiece on the workpiece placing plate 7 is realized, the sliding block 14 can linearly slide along the second sliding rail 19 on the transverse plate 13, and the fixed block can be positioned at an arbitrary position above the workpiece placing plate 7, so that the purpose of adjusting the position of the laser detection sensor 16 is achieved.
For example, the second slide rail 19 is a linear slide rail, which may be any of the lateral slide mechanisms of the prior art, such as a linear bearing, a lateral guide shaft, and the like.
For example, the adjusting knob 17 is a screw locking structure, and the position locking can be achieved by adjusting, or a pressing clamping mechanism or the like.
The working principle of the invention is as follows: when the feeding mechanism sends a workpiece to the top of the workpiece placement plate 7, the laser detection sensor 16 is used for identifying the hole position of the workpiece, the workpiece is provided with a plurality of small holes, if the workpiece is placed reversely or misplaced, the laser detection sensor 16 cannot identify the corresponding hole position, so that judgment is made, the supporting plate 5 moves on the first sliding rail 3 in the detection process, the contact plate 4 drives the supporting plate 5 to move on the first sliding rail 3, the supporting plate 5 drives the workpiece placement table 6 to move, the workpiece placement table 6 drives the workpiece placement plate 7 to move, the edge of the workpiece placement plate 7 is fixed with a limit post 8 for fixing the position of the workpiece, when infrared rays penetrate through the photoelectric detection hole 9, the infrared rays irradiate the reflecting plate at the lower side of the photoelectric detection hole 9, then an emission phenomenon occurs, so that the laser detection sensor 16 is used for identifying whether the workpiece plate is correspondingly perforated or not, and an adjusting knob 17 is arranged on the fixing block, and the adjusting knob 17 can be used for adjusting the fixing block to move on the second sliding rail 19, so that the laser detection sensor 16 is controlled to move at different positions on the transverse plate 13, so that perforation conditions of the workpiece at different positions are detected.
Based on the above semiconductor lead frame detection device, as shown in fig. 5, the invention also provides a semiconductor lead frame detection method, which comprises the following steps:
s1, adjusting the position of the laser detection sensor 16 on the supporting component through the position adjusting component, so that the position of the laser detection sensor 16 corresponds to a station on the workpiece placing plate 7.
S2, after the workpiece is sent to a station on the workpiece placement plate 7, infrared rays are emitted to the photoelectric detection holes 9.
S3, the laser detection sensor 16 judges whether the workpiece is reversely placed and whether the workpiece is placed at a designated position according to whether the infrared rays reflected by the reflecting plate are received or not, and the method comprises the following steps:
the laser detection sensor 16 determines that the workpiece is provided with a perforation at a corresponding position on the workpiece if it receives the infrared light reflected by the reflecting plate, and determines that the workpiece is not placed reversely and is placed at a specified position if it does not receive the infrared light reflected by the reflecting plate, and determines that the current position of the workpiece is not perforated and/or the workpiece is placed reversely and/or is not placed at the specified position.
S4, if the laser detection sensor 16 determines that the workpiece is reversely placed or the workpiece is not placed at the designated position, an audible and visual alarm is sent.
The semiconductor lead frame detection device is stable in mechanical transmission, the adjusting knob 17 is arranged on the fixed block, and the adjusting knob 17 can be used for moving the fixed block on the second sliding rail 19, so that different positions of the laser detection sensor 16 on the transverse plate 13 are controlled, perforation conditions of different positions of a workpiece are detected, the structure is simple, the use is convenient, the device can be used for workpieces of various types, and the application range of the detection device is wider.
The semiconductor lead frame detection method is simple in principle and ingenious in design, has the function of detecting whether the workpiece is reversely placed and whether the workpiece is placed in the opposite position when the semiconductor lead frame is pushed to normally run, judges whether the workpiece plate is provided with corresponding through holes through capturing of the infrared rays by the laser detection sensor 16, and cannot identify the corresponding hole sites if the workpiece is reversely placed or misplaced, so that the identification of the placement position of the workpiece is realized, and the method is simple and practical in principle and high in precision.
Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The semiconductor lead frame detection device is characterized by comprising a substrate (1), a sliding table assembly, a workpiece placement table (6), a workpiece placement plate (7) and a detection component;
the device comprises a substrate (1), a workpiece placing table (6) and a laser detection sensor (16), wherein the workpiece placing table (6) is connected with the substrate (1) in a sliding mode through the sliding table, a workpiece placing plate (7) is arranged at the top of the workpiece placing table (6), a photoelectric detection hole (9) is formed in the workpiece placing plate (7), a reflecting plate is fixedly arranged on the lower side of the photoelectric detection hole (9), the detection component comprises a supporting component, a position adjusting component and the laser detection sensor (16), the bottom of the supporting component is fixedly connected with the substrate (1) and is located on one side of the workpiece placing plate (7), the position adjusting component is connected with the top of the supporting component in a sliding mode, the laser detection sensor (16) is arranged on the position adjusting component, and the laser detection sensor (16) is used for judging whether a workpiece is placed reversely and/or not and whether the workpiece is placed at a designated position or not according to whether infrared rays reflected by the reflecting plate are received or not.
2. The semiconductor lead frame inspection device according to claim 1, wherein the slide assembly comprises a first slide rail (3), a contact plate (4) and a support plate (5);
the device comprises a base plate (1), a first sliding rail (3), a contact plate (4), two supporting plates (5) and a workpiece placing table (6), wherein the first sliding rail (3) is fixedly arranged at the top of the base plate (1), the bottom of the contact plate (4) is in sliding connection with the first sliding rail (3), the two supporting plates (5) are respectively fixedly arranged at two ends of the top of the contact plate (4), and the bottom of the workpiece placing table (6) is fixedly connected with the two supporting plates (5).
3. A semiconductor lead frame inspection device according to claim 2, characterized in that two scrap placement boxes (2) are mounted in inlay on the outside of each support plate (5).
4. A semiconductor lead frame inspection apparatus according to any one of claims 1 to 3, wherein a plurality of work stations are provided on the work piece placement plate (7), each work station is used for placing one work piece, a limit post (8) is fixedly provided on one side of each work station, and one photoelectric inspection hole (9) is provided on one side of each work station on the work piece placement plate (7).
5. The semiconductor lead frame inspection device according to claim 1, wherein a plurality of workpiece spacing grooves (10) are formed in the upper portion of the workpiece placement plate (7).
6. The semiconductor lead frame inspection device according to claim 4, wherein the support assembly comprises a support bar (11), a rotation bar (12), and a cross plate (13);
the bottom of the supporting rod (11) is fixedly connected with the base plate (1), the bottom of the rotating rod (12) is detachably connected with the top of the supporting rod (11), and one end of the transverse plate (13) is fixedly connected with the top of the rotating rod (12).
7. The semiconductor lead frame inspection device according to claim 6, wherein the position adjustment assembly comprises a second slide rail (19), a slider (14), a fixed block, an adjustment knob (17), and a locking groove (18);
the second sliding rails (19) are fixedly arranged at the top of the transverse plate (13), a plurality of sliding blocks (14) are arranged, one sliding block (14) is correspondingly arranged at each station on each workpiece placement plate (7), each sliding block (14) is in sliding connection with the second sliding rail (19), the outer side of each sliding block (14) is fixedly connected with the fixing plate (15), one side of each fixing plate (15) is provided with a threaded through hole, and each threaded through hole is in threaded connection with the adjusting knob (17);
the laser detection sensor (16) is arranged in a plurality, each fixing plate (15) is correspondingly provided with one laser detection sensor (16), each fixing plate (15) is parallel to the outer side of each transverse plate (13) and is provided with a gap, each locking groove (18) is arranged on the outer side of each transverse plate (13) and is located in the corresponding gap, a plurality of locking blocks are arranged in each locking groove (18), each locking block is in sliding connection with each locking groove (18), and each locking block is correspondingly arranged at the position of each adjusting knob (17).
8. The semiconductor lead frame inspection device according to claim 6, wherein the support bar (11) is perpendicular to the substrate (1), the rotation bar (12) and the support bar (11) are concentrically arranged, and the traverse plate (13) is perpendicular to the rotation bar (12) and is arranged in parallel to the work placement plate (7).
9. The semiconductor lead frame inspection device according to claim 7, wherein a center line of the second slide rail (19) is parallel to a center line of the traverse plate (13), an included angle between the fixing plate (15) and the slider (14) is 90 degrees, and a center line of the locking groove (18) is parallel to a center line of the second slide rail (19).
10. A semiconductor lead frame inspection method, characterized by being performed by the semiconductor lead frame inspection apparatus according to any one of claims 1 to 9, comprising the steps of:
the position of the laser detection sensor (16) on the supporting component is adjusted through the position adjusting component, so that the position of the laser detection sensor (16) corresponds to a station on the workpiece placing plate (7);
after the workpiece is sent to a station on the workpiece placement plate (7), infrared rays are emitted to the photoelectric detection hole (9);
the laser detection sensor (16) judges whether the workpiece is reversely placed and whether the workpiece is placed at a specified position according to whether the infrared rays reflected by the reflecting plate are received or not, and comprises: and if the laser detection sensor (16) does not receive the infrared rays reflected by the reflecting plate, determining that the current position of the workpiece has no perforation, and the workpiece is placed on the specified position or not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311182293.5A CN117348100A (en) | 2023-09-13 | 2023-09-13 | Semiconductor lead frame detection device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311182293.5A CN117348100A (en) | 2023-09-13 | 2023-09-13 | Semiconductor lead frame detection device and method |
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| CN117348100A true CN117348100A (en) | 2024-01-05 |
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| CN202311182293.5A Pending CN117348100A (en) | 2023-09-13 | 2023-09-13 | Semiconductor lead frame detection device and method |
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| CN213208833U (en) * | 2020-11-19 | 2021-05-14 | 龙口市和义机械配件有限公司 | Dedicated hole position degree detection device |
| CN214951200U (en) * | 2021-04-23 | 2021-11-30 | 浙江正鼎汽车零部件有限公司 | Workpiece positioning position detection device |
| CN215064386U (en) * | 2021-04-25 | 2021-12-07 | 河北昊方新能源科技有限公司 | Clutch flatness detection device |
| CN218854905U (en) * | 2022-12-13 | 2023-04-14 | 浙江诺德智能自动化科技有限公司 | Positive and negative detection device of iron core |
| CN219223629U (en) * | 2022-12-22 | 2023-06-20 | 东莞市辅金精密组件有限公司 | Product electrical measurement jig |
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2023
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| CN105033471A (en) * | 2015-08-14 | 2015-11-11 | 武汉法利莱切焊系统工程有限公司 | Laser weakening machining equipment |
| CN206618384U (en) * | 2017-04-05 | 2017-11-07 | 长春市力众模具制造有限公司 | A kind of workpiece hole position device for fast detecting |
| CN107367230A (en) * | 2017-06-30 | 2017-11-21 | 爱驰威汽车零部件（盐城）有限公司 | A kind of vehicle punching hole position detecting device |
| CN213208833U (en) * | 2020-11-19 | 2021-05-14 | 龙口市和义机械配件有限公司 | Dedicated hole position degree detection device |
| CN214951200U (en) * | 2021-04-23 | 2021-11-30 | 浙江正鼎汽车零部件有限公司 | Workpiece positioning position detection device |
| CN215064386U (en) * | 2021-04-25 | 2021-12-07 | 河北昊方新能源科技有限公司 | Clutch flatness detection device |
| CN218854905U (en) * | 2022-12-13 | 2023-04-14 | 浙江诺德智能自动化科技有限公司 | Positive and negative detection device of iron core |
| CN219223629U (en) * | 2022-12-22 | 2023-06-20 | 东莞市辅金精密组件有限公司 | Product electrical measurement jig |
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