CN117347812A - Method and system for testing semiconductor device - Google Patents
Method and system for testing semiconductor device Download PDFInfo
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- CN117347812A CN117347812A CN202311462999.7A CN202311462999A CN117347812A CN 117347812 A CN117347812 A CN 117347812A CN 202311462999 A CN202311462999 A CN 202311462999A CN 117347812 A CN117347812 A CN 117347812A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 150
- 238000012360 testing method Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000012544 monitoring process Methods 0.000 claims abstract description 30
- 230000005856 abnormality Effects 0.000 claims abstract description 27
- 238000012795 verification Methods 0.000 claims abstract description 27
- 238000001514 detection method Methods 0.000 claims description 41
- 238000013500 data storage Methods 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000004891 communication Methods 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 19
- 238000010998 test method Methods 0.000 claims description 4
- 230000002159 abnormal effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor device testing, in particular to a method and a system for testing a semiconductor device. The method and the system for testing the semiconductor device can test whether the semiconductor device has program abnormality or not through the semiconductor test module and the test verification module, and can test whether the semiconductor device has physical abnormality or not through the circuit monitoring module.
Description
Technical Field
The present invention relates to the field of semiconductor device testing technology, and in particular, to a method and system for testing a semiconductor device.
Background
A semiconductor (Semi conductor) is a substance having a conductivity between an insulator and a conductor, and is easily controlled in conductivity, and is useful as a device material for information processing. Semiconductors are very important from a technological or economic point of view. Many electronic products, such as computers, mobile phones, digital recorders, use the conductivity variations of semiconductors to process information.
The existing semiconductor device usually adopts a program test mode to detect the operation condition of the semiconductor device during test.
The conventional semiconductor device generally cannot realize program abnormality test and circuit abnormality test of the semiconductor device at the same time during test, and does not have a warning function, so that a method and a system for testing the semiconductor device are provided.
Disclosure of Invention
The invention aims to provide a method and a system for testing a semiconductor device, which solve the problem that the conventional semiconductor device in the background art generally cannot realize program abnormality test and circuit abnormality test of the semiconductor device at the same time during testing and does not have a warning function.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the semiconductor device comprises a power supply module, a programming module, a data storage module, a display module, a communication interface module, a semiconductor test module, an instruction input module, an operation processing module, a data output module, a data conversion module, a test verification module, a data reading module, an output verification module, an abnormality judgment module, an automatic warning module, a running time recording module, a circuit monitoring module, a temperature detection module and a voltage detection module, wherein the semiconductor device is electrically connected with the power supply module and the programming module, the semiconductor device is also electrically connected with the data storage module and the display module, the semiconductor device is also electrically connected with the communication interface module, the output end of the communication interface module is electrically connected with the semiconductor test module, the output end of the semiconductor test module is electrically connected with the test verification module, the output end of the semiconductor test module is also electrically connected with the running time recording module, and the circuit monitoring module is electrically connected with the output end of the semiconductor device.
Preferably, the power module, the programming module, the data storage module and the display module are all electrically connected with the semiconductor device, and the power module, the programming module, the data storage module and the display module are connected in parallel.
Preferably, the semiconductor device is electrically connected with the semiconductor test module through the communication interface module, and the semiconductor test module is electrically connected with the test verification module in a unidirectional manner.
Preferably, the semiconductor test module comprises an instruction input module, an operation processing module, a data output module and a data conversion module, wherein the output end of the instruction input module is electrically connected with the operation processing module, the output end of the operation processing module is electrically connected with the data output module, and the output end of the data output module is electrically connected with the data conversion module.
Preferably, the command input module, the operation processing module, the data output module and the data conversion module are electrically connected in one direction, and the output end of the data conversion module is electrically connected with the data storage module.
Preferably, the test verification module comprises a data reading module, an output checking module, an abnormality judgment module and an automatic warning module, wherein the output end of the data reading module is electrically connected with the output checking module, the output end of the output checking module is electrically connected with the abnormality judgment module, and the output end of the abnormality judgment module is electrically connected with the automatic warning module.
Preferably, the data reading module, the output checking module, the abnormality judging module and the automatic warning module are in unidirectional electrical connection, and the output end of the automatic warning module is in electrical connection with the display module.
Preferably, the circuit monitoring module comprises a temperature detection module and a voltage detection module, and the temperature detection module and the voltage detection module are electrically connected with the circuit monitoring module.
Preferably, the temperature detection module and the voltage detection module are connected in parallel, and the output ends of the temperature detection module and the voltage detection module are electrically connected with the display module.
Preferably, the method of testing a semiconductor device includes the steps of:
A. preliminary preparation
The semiconductor device is respectively connected with the power supply module, the programming module, the data storage module and the display module, the semiconductor device is connected with the semiconductor test module through the communication interface module, and the corresponding circuit monitoring module is arranged;
B. program testing
The semiconductor device can be tested whether the program is abnormal or not through the semiconductor test module and the test verification module, if the program is abnormal, the automatic warning module automatically warns, the display module is used for displaying error prompts during warning, meanwhile, the running time recording module can record the running time, and the computing capacity of the semiconductor device can be judged according to the running time;
C. other tests
The temperature detection module and the voltage detection module of the circuit monitoring module can be used for monitoring the operation coincidence and the use voltage of the semiconductor device in real time, and the display module is used for displaying the operation coincidence and the use voltage, and the circuit monitoring module can be used for testing whether the semiconductor device has physical abnormality or not.
The invention has at least the following beneficial effects:
1. the method and the system for testing the semiconductor device can connect the semiconductor device with the semiconductor testing module through the non-communication interface module, the power module is used for providing electric energy, the programming module is used for internal programming of each individual semiconductor device, the external data storage module is used for data connection, and the external display module is used for displaying information.
2. The method and the system for testing the semiconductor device can input a detection instruction for testing through the instruction input module of the semiconductor testing module when the semiconductor device is tested, the semiconductor device executes the instruction through the operation processing module, the execution result data is conveniently output through the data output module, the execution result data of the previous step can be converted into a recognizable data form through the data conversion module, and the data storage module can store the data.
3. The test verification module can read output data in the data storage module through the data reading module, the output verification module is convenient to verify the output data, the abnormality judgment module can judge whether the output data is abnormal or not, accordingly whether the output data is correct or not is judged, the automatic warning module is convenient to automatically warn under the abnormal condition, and the display module is used for displaying error prompts during warning.
4. The semiconductor device can be tested for program abnormality through the semiconductor test module and the test verification module, whether the semiconductor device is physically abnormal through the circuit monitoring module, the operation time recording module can record the operation time, the operation capability of the semiconductor device can be judged according to the operation time, and the operation coincidence and the use voltage of the semiconductor device can be monitored in real time through the temperature detection module and the voltage detection module of the circuit monitoring module.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a system frame structure according to the present invention;
FIG. 2 is a schematic diagram of a semiconductor test module according to the present invention;
FIG. 3 is a schematic diagram of a test verification module according to the present invention;
fig. 4 is a schematic diagram of a circuit monitoring module according to the present invention.
In the figure: 1. a semiconductor device; 101. a power module; 102. a programming module; 103. a data storage module; 104. a display module; 2. a communication interface module; 3. a semiconductor test module; 301. an instruction input module; 302. operating a processing module; 303. a data output module; 304. a data conversion module; 4. a test verification module; 401. a data reading module; 402. outputting a checking module; 403. an abnormality judgment module; 404. an automatic warning module; 5. a run-time recording module; 6. a circuit monitoring module; 601. a temperature detection module; 602. and a voltage detection module.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 to 4, a method and a system for testing a semiconductor device include a semiconductor device 1, a power module 101, a programming module 102, a data storage module 103, a display module 104, a communication interface module 2, a semiconductor test module 3, an instruction input module 301, an operation processing module 302, a data output module 303, a data conversion module 304, a test verification module 4, a data reading module 401, an output verification module 402, an abnormality judgment module 403, an automatic warning module 404, a runtime recording module 5, a circuit monitoring module 6, a temperature detection module 601 and a voltage detection module 602, the semiconductor device 1 includes the power module 101, the programming module 102, the data storage module 103 and the display module 104, the semiconductor device 1 is electrically connected with the power module 101 and the programming module 102, the semiconductor device 1 is electrically connected with the data storage module 103 and the display module 104, the semiconductor device 1 is electrically connected with the communication interface module 2, an output end of the communication interface module 2 is electrically connected with the semiconductor test module 3, an output end of the semiconductor test module 3 is electrically connected with the test module 4, an output end of the semiconductor test module 3 is electrically connected with the output end of the semiconductor test module 3, and the output end of the semiconductor test module 5 is electrically connected with the runtime recording module 6.
The scheme comprises the following working processes:
when in use, the semiconductor device 1 can be connected with the semiconductor test module 3 through the non-communication interface module 2, the detection instruction for testing can be input through the instruction input module 301 of the semiconductor test module 3 when in testing, then the semiconductor device 1 executes the instruction through the operation processing module 302, the execution result data is output through the data output module 303, the execution result data is converted into a recognizable data form through the data conversion module 304 and then stored in the data storage module 103, the output data in the data storage module 103 is read through the data reading module 401 by the test verification module 4, the output data is checked through the output checking module 402, whether the output data is abnormal or not is judged through the abnormality judging module 403, so that whether the output data is correctly output data is judged, if abnormal, the abnormal state is automatically warned through the automatic warning module 404, the error prompt is displayed through the display module 104 when in warning, whether the semiconductor device 1 is abnormal in a program state can be tested through the semiconductor test module 3 and the test verification module 4, the operation time recording module 5 can record the operation time, the operation time according to the operation time can be judged, the fact that the semiconductor device 1 is in a program abnormal state through the semiconductor test module 3, and whether the semiconductor device 1 is completely in a state can be completely tested through the semiconductor device 1 and the semiconductor device 1 can be completely and the semiconductor device can be completely and physically tested through the semiconductor device 1 through the monitoring module 1 by the voltage detecting module 6 and the voltage detecting module, and the semiconductor device 1 can be completely and the semiconductor device can be completely detected through the circuit module 1.
The working process can be as follows:
the method and the system for testing the semiconductor device can connect the semiconductor device with the semiconductor testing module through the non-communication interface module, the power module is used for providing electric energy, the programming module is used for internal programming of each individual semiconductor device, the external data storage module is used for data connection, and the external display module is used for displaying information; the method and the system for testing the semiconductor device can input a detection instruction for testing through the instruction input module of the semiconductor testing module when the semiconductor device is tested, the semiconductor device executes the instruction through the operation processing module, the execution result data is conveniently output through the data output module, the execution result data of the previous step can be converted into an identifiable data form through the data conversion module, and the data storage module can store the data; the test verification module can read the output data in the data storage module through the data reading module, the output verification module is convenient for verifying the output data, the abnormality judgment module can judge whether the data is abnormal, so that whether the data is correct output data is convenient to judge, the automatic warning module is convenient for automatically warning under the condition that the abnormality exists, and the display module is used for displaying error prompts during warning; the semiconductor device can be tested for program abnormality through the semiconductor test module and the test verification module, whether the semiconductor device is physically abnormal through the circuit monitoring module, the operation time recording module can record the operation time, the operation capability of the semiconductor device can be judged according to the operation time, and the operation coincidence and the use voltage of the semiconductor device can be monitored in real time through the temperature detection module and the voltage detection module of the circuit monitoring module.
Further, the power module 101, the programming module 102, the data storage module 103 and the display module 104 are electrically connected with the semiconductor device 1, and the power module 101, the programming module 102, the data storage module 103 and the display module 104 are connected in parallel.
Further, the semiconductor device 1 is electrically connected with the semiconductor test module 3 through the communication interface module 2, and the semiconductor test module 3 is electrically connected with the test verification module 4 in a unidirectional manner.
Further, the semiconductor test module 3 includes an instruction input module 301, an operation processing module 302, a data output module 303, and a data conversion module 304, wherein an output end of the instruction input module 301 is electrically connected to the operation processing module 302, an output end of the operation processing module 302 is electrically connected to the data output module 303, and an output end of the data output module 303 is electrically connected to the data conversion module 304.
Further, the command input module 301, the operation processing module 302, the data output module 303 and the data conversion module 304 are electrically connected in a unidirectional manner, and the output end of the data conversion module 304 is electrically connected with the data storage module 103.
Further, the test verification module 4 includes a data reading module 401, an output checking module 402, an anomaly judging module 403 and an automatic warning module 404, wherein the output end of the data reading module 401 is electrically connected with the output checking module 402, the output end of the output checking module 402 is electrically connected with the anomaly judging module 403, and the output end of the anomaly judging module 403 is electrically connected with the automatic warning module 404.
Further, the data reading module 401, the output checking module 402, the abnormality judging module 403 and the automatic warning module 404 are electrically connected in one direction, and the output end of the automatic warning module 404 is electrically connected with the display module 104.
Further, the circuit monitoring module 6 includes a temperature detecting module 601 and a voltage detecting module 602, and the temperature detecting module 601 and the voltage detecting module 602 are electrically connected with the circuit monitoring module 6.
Further, the temperature detection module 601 and the voltage detection module 602 are connected in parallel, and the output ends of the temperature detection module 601 and the voltage detection module 602 are electrically connected with the display module 104.
Further, the method of testing a semiconductor device includes the steps of:
A. preliminary preparation
The semiconductor device 1 is respectively connected with a power supply module 101, a programming module 102, a data storage module 103 and a display module 104, the semiconductor device 1 is connected with a semiconductor test module 3 through a communication interface module 2, and a corresponding circuit monitoring module 6 is arranged;
B. program testing
Whether the semiconductor device 1 has abnormal program or not can be tested through the semiconductor test module 3 and the test verification module 4, if the program is abnormal, the automatic warning is carried out through the automatic warning module 404, the display module 104 is used for displaying error prompts during warning, meanwhile, the running time can be recorded by the running time recording module 5, and the computing capacity of the semiconductor device 1 can be judged according to the running time;
C. other tests
The temperature detection module 601 and the voltage detection module 602 of the circuit monitoring module 6 can monitor the operation coincidence and the use voltage of the semiconductor device 1 in real time, and display the operation coincidence and the use voltage through the display module 104, and the circuit monitoring module 6 can test whether the semiconductor device 1 has physical abnormality.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A method and a system for testing a semiconductor device, which comprises a semiconductor device (1), a power module (101), a programming module (102), a data storage module (103), a display module (104), a communication interface module (2), a semiconductor test module (3), an instruction input module (301), an operation processing module (302), a data output module (303), a data conversion module (304), a test verification module (4), a data reading module (401), an output checking module (402), an abnormality judgment module (403), an automatic warning module (404), a running time recording module (5), a circuit monitoring module (6), a temperature detection module (601) and a voltage detection module (602), and is characterized in that the semiconductor device (1) comprises the power module (101), the programming module (102), the data storage module (103) and the display module (104), the semiconductor device (1) is electrically connected with the power module (101) and the programming module (102), and the semiconductor device (1) is also electrically connected with the data storage module (103) and the display module (104), and the semiconductor device (1) is also electrically connected with the communication interface module (2), and the output end of the communication interface module (2) is electrically connected with the semiconductor test module (3), the output end of the semiconductor test module (3) is electrically connected with the test verification module (4), the output end of the semiconductor test module (3) is further electrically connected with the running time recording module (5), and the circuit monitoring module (6) is electrically connected with the output end of the semiconductor device (1).
2. The method and system for testing a semiconductor device according to claim 1, wherein the power module (101), the programming module (102), the data storage module (103), and the display module (104) are electrically connected to the semiconductor device (1), and the power module (101), the programming module (102), the data storage module (103), and the display module (104) are connected in parallel.
3. The method and system for testing a semiconductor device according to claim 1, wherein the semiconductor device (1) is electrically connected to the semiconductor test module (3) through the communication interface module (2), and the semiconductor test module (3) is electrically connected to the test verification module (4) in a unidirectional manner.
4. The method and system for testing a semiconductor device according to claim 1, wherein the semiconductor testing module (3) includes an instruction input module (301), an operation processing module (302), a data output module (303) and a data conversion module (304), and an output end of the instruction input module (301) is electrically connected to the operation processing module (302), an output end of the operation processing module (302) is electrically connected to the data output module (303), and an output end of the data output module (303) is electrically connected to the data conversion module (304).
5. The method and system according to claim 4, wherein the command input module (301), the operation processing module (302), the data output module (303) and the data conversion module (304) are electrically connected in a single direction, and the output end of the data conversion module (304) is electrically connected to the data storage module (103).
6. The method and system for testing a semiconductor device according to claim 1, wherein the test verification module (4) includes a data reading module (401), an output checking module (402), an anomaly judging module (403) and an automatic warning module (404), the output end of the data reading module (401) is electrically connected with the output checking module (402), the output end of the output checking module (402) is electrically connected with the anomaly judging module (403), and the output end of the anomaly judging module (403) is electrically connected with the automatic warning module (404).
7. The method and system for testing a semiconductor device according to claim 6, wherein the data reading module (401), the output checking module (402), the abnormality determining module (403) and the automatic warning module (404) are electrically connected in one direction, and the output end of the automatic warning module (404) is electrically connected to the display module (104).
8. The method and system for testing a semiconductor device according to claim 1, wherein the circuit monitoring module (6) includes a temperature detection module (601) and a voltage detection module (602), and the temperature detection module (601) and the voltage detection module (602) are electrically connected to the circuit monitoring module (6).
9. The method and system for testing a semiconductor device according to claim 8, wherein the temperature detection module (601) and the voltage detection module (602) are connected in parallel, and the output ends of the temperature detection module (601) and the voltage detection module (602) are electrically connected with the display module (104).
10. A method of testing a semiconductor device according to claims 1-9, characterized in that the method of testing a semiconductor device comprises the steps of:
A. preliminary preparation
The method comprises the steps of connecting a semiconductor device (1) with a power module (101), a programming module (102), a data storage module (103) and a display module (104) respectively, connecting the semiconductor device (1) with a semiconductor test module (3) through a communication interface module (2), and setting a corresponding circuit monitoring module (6);
B. program testing
Whether the semiconductor device (1) has program abnormality or not can be tested through the semiconductor test module (3) and the test verification module (4), if the semiconductor device has abnormality, the semiconductor device is automatically warned through the automatic warning module (404), an error prompt is displayed through the display module (104) during warning, meanwhile, the running time can be recorded through the running time recording module (5), and the computing capacity of the semiconductor device (1) can be judged according to the running time;
C. other tests
The temperature detection module (601) and the voltage detection module (602) of the circuit monitoring module (6) can be used for monitoring the operation coincidence and the use voltage of the semiconductor device (1) in real time, and the operation coincidence and the use voltage are displayed through the display module (104), so that whether the semiconductor device (1) has physical abnormality can be tested through the circuit monitoring module (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311462999.7A CN117347812A (en) | 2023-11-06 | 2023-11-06 | Method and system for testing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311462999.7A CN117347812A (en) | 2023-11-06 | 2023-11-06 | Method and system for testing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117347812A true CN117347812A (en) | 2024-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311462999.7A Pending CN117347812A (en) | 2023-11-06 | 2023-11-06 | Method and system for testing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117347812A (en) |
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2023
- 2023-11-06 CN CN202311462999.7A patent/CN117347812A/en active Pending
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