CN117310430A - Semiconductor test fixture - Google Patents
Semiconductor test fixture Download PDFInfo
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- CN117310430A CN117310430A CN202311347689.0A CN202311347689A CN117310430A CN 117310430 A CN117310430 A CN 117310430A CN 202311347689 A CN202311347689 A CN 202311347689A CN 117310430 A CN117310430 A CN 117310430A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000012360 testing method Methods 0.000 title claims abstract description 32
- 238000001514 detection method Methods 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims 2
- 238000007906 compression Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本发明公开了一种半导体测试治具,涉及半导体测试用具技术领域,包括基座,基座底面四角均固接有底柱,基座后端面竖向固结有支撑板,且基座顶面的中部固接有工作台,工作台上设有夹紧组件,支撑板的前端面设有固定组件;本发明通过双向丝杆便于两个夹板相对运动,通过导杆便于夹板稳定移动,进而减少检测时因为位置不同产生的误差;通过压板两侧的导向柱可以使压板下降时不会产生旋转;通过压板顶面的多个槽口便于调节检测组件的位置,便于检测不同位置的半导体;通过检测组件下压时,刚接触到半导体时无法通电,继续下降时,检测组件会通电,减小了检测组件的损耗,便于多次检测半导体,提高了对于半导体进行测试时的安全防护效果。
The invention discloses a semiconductor test fixture, which relates to the technical field of semiconductor test equipment. It includes a base. The four corners of the bottom surface of the base are fixed with bottom pillars. The rear end surface of the base is vertically fixed with a support plate. The top surface of the base is A workbench is fixedly connected to the middle part of the workbench, a clamping assembly is provided on the workbench, and a fixing assembly is provided on the front end of the support plate; the invention facilitates the relative movement of the two splints through a two-way screw rod, and facilitates the stable movement of the splints through a guide rod, thereby reducing Errors caused by different positions during detection; the guide pillars on both sides of the pressure plate can prevent the pressure plate from rotating when it is lowered; the multiple notches on the top surface of the pressure plate facilitate the adjustment of the position of the detection component to facilitate the detection of semiconductors at different positions; through When the detection component is pressed down, it cannot be energized when it first contacts the semiconductor. When it continues to drop, the detection component will be energized, which reduces the loss of the detection component, facilitates multiple detection of semiconductors, and improves the safety protection effect when testing semiconductors.
Description
技术领域Technical field
本发明涉及半导体测试用具技术领域,尤其涉及一种半导体测试治具。The present invention relates to the technical field of semiconductor testing tools, and in particular, to a semiconductor testing fixture.
背景技术Background technique
早期的半导体测试治具主要是简单的物理接口,用于连接被测器件和测试设备。这些治具通常由金属夹具、针状探针等组成,手工布线,测试人员需要手动操作进行测试。Early semiconductor test fixtures were mainly simple physical interfaces used to connect the device under test and test equipment. These fixtures usually consist of metal fixtures, needle probes, etc., which are manually wired and require manual operation by testers to perform testing.
现有的半导体测试治具通常由夹具和探针组成,通过测试人员手动操作探针进行测试半导体;在进行电测试时,测试人员手动操作灵动性更好,在进行少量的半导体测试时,测试人员手动操作是最好的,但是需要进行大量多次的半导体测试时,测试人员手动操作的人为因素比较大,不仅是会带来误差、影响测试结构,而且在通电测试时的安全性不足;因此,需对上述问题进行改善处理。Existing semiconductor test fixtures usually consist of fixtures and probes, and testers manually operate the probes to test semiconductors; when conducting electrical tests, testers have better manual operation flexibility. When conducting a small amount of semiconductor tests, the test Manual operation by personnel is the best, but when a large number of semiconductor tests need to be carried out, the human factor of manual operation by testers is relatively large, which not only causes errors and affects the test structure, but also lacks safety during power-on testing; Therefore, the above problems need to be improved.
发明内容Contents of the invention
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种半导体测试治具。The purpose of the present invention is to propose a semiconductor testing fixture in order to solve the shortcomings existing in the prior art.
为了实现上述目的,本发明采用了如下技术方案:一种半导体测试治具,包括基座,所述基座底面四角均固接有底柱,所述基座后端面竖向固结有支撑板,且所述基座顶面的中部固接有工作台,所述工作台上设有夹紧组件,所述支撑板的前端面设有固定组件;所述夹紧组件包括横向开设在工作台顶面的滑槽,且所述工作台内横向开设有两个等距的导向槽,所述工作台顶面前端的导向槽内横向设有双向丝杆,所述工作台顶面后端的导向槽内横向固接有导杆,所述双向丝杆一端固接有手轮,且所述双向丝杆通过两端固接有轴承转动连接在工作台内,所述导杆通过两端固接有挡片固定连接在工作台内,所述工作台顶面两端设有夹板,所述夹板下端分别螺纹连接在双向丝杆和套接在导杆上。In order to achieve the above object, the present invention adopts the following technical solution: a semiconductor test fixture, including a base, the four corners of the bottom surface of the base are fixed with bottom pillars, and the rear end surface of the base is vertically fixed with a support plate , and a workbench is fixedly connected to the middle part of the top surface of the base, the workbench is provided with a clamping component, and the front end surface of the support plate is provided with a fixed component; the clamping component includes a transverse opening on the workbench. The chute on the top surface, and there are two equidistant guide grooves transversely provided in the workbench. A two-way screw rod is transversely provided in the guide groove at the front end of the top surface of the workbench. The guide groove at the rear end of the top surface of the workbench A guide rod is fixed transversely inside, and a hand wheel is fixedly connected to one end of the two-way screw rod. The two-way screw rod is rotatably connected to the workbench through bearings fixedly connected to both ends. The guide rod is fixedly connected to a handwheel at both ends. The baffle is fixedly connected in the workbench, and the two ends of the top surface of the workbench are provided with splints. The lower ends of the splints are threadedly connected to the two-way screw rod and sleeved on the guide rod respectively.
优选地,所述固定组件包括横向固接在支撑板前端面的两侧上端的固定环,所述固定环与基座之间设有导向柱,所述导向柱底面固接在基座顶面上、上端固接在固定环内侧。Preferably, the fixing assembly includes fixing rings transversely fixed on both sides of the upper end of the front end surface of the support plate, a guide post is provided between the fixing ring and the base, and the bottom surface of the guide post is fixed on the top surface of the base. The upper and upper ends are fixed on the inside of the fixed ring.
优选地,所述固定组件还包括竖向固接在支撑板前端面的中部上端的固定板,所述固定板前端面纵向固接有C型架,所述C型架下端竖向固接有套筒,且所述C型架的上端通过铰接有L型压杆,所述套筒的内侧竖向活动设有导柱,所述导柱两侧设有U型架,所述U型架上下端分别通过螺栓连接在导柱的上端和L型压板的中部。Preferably, the fixing assembly further includes a fixing plate vertically fixed on the middle upper end of the front end surface of the support plate, a C-shaped frame is vertically fixed on the front end surface of the fixed plate, and a C-shaped frame is vertically fixed on the lower end of the C-shaped frame. sleeve, and the upper end of the C-shaped frame is hinged with an L-shaped pressure rod, the inner side of the sleeve is vertically movable with a guide post, and U-shaped frames are provided on both sides of the guide post, and the U-shaped frame The upper and lower ends are respectively connected to the upper end of the guide column and the middle part of the L-shaped pressure plate through bolts.
优选地,所述工作台上端设有压板,所述压板后端的两侧均固接有滑套,所述滑套活动套接在导向柱上,所述压板顶面中部的后端固接有连接座,所述连接座顶面固接有导柱,所述压板顶面开设有多个等距的槽口,所述槽口内设有检测组件。Preferably, a pressure plate is provided at the upper end of the workbench, and sliding sleeves are fixedly connected to both sides of the rear end of the pressure plate. The sliding sleeves are movably connected to the guide column, and the rear end of the middle part of the top surface of the pressure plate is fixedly connected to a sliding sleeve. A connecting seat, a guide post is fixedly connected to the top surface of the connecting seat, a plurality of equidistant notches are provided on the top surface of the pressure plate, and a detection component is provided in the notches.
优选地,所述检测组件包括竖向固接在槽口内的连接块,所述连接块底面固接有外壳,所述外壳腔内竖向设有小胶套,所述小胶套的内侧上端固接有铜环。Preferably, the detection component includes a connecting block vertically fixed in the notch, a shell is fixed on the bottom surface of the connecting block, a small rubber sleeve is vertically provided in the shell cavity, and the inner upper end of the small rubber sleeve is Fixed with copper ring.
优选地,所述铜环的内侧上端固接有通电装置,且所述小胶套、铜环和通电装置的顶面均固接在连接块上,所述外壳下端卡接有大胶套,所述大胶套内侧卡接有探测针,所述探测针上端设于小胶套下端,且所述小胶套与外壳之间竖向设有弹簧。Preferably, the inner upper end of the copper ring is fixedly connected with the energizing device, and the top surface of the small rubber sleeve, the copper ring and the energizing device are all fixed on the connecting block, and the lower end of the shell is connected with a large rubber sleeve. A detection needle is engaged with the inside of the large rubber sleeve. The upper end of the detection needle is located at the lower end of the small rubber sleeve, and a spring is vertically provided between the small rubber sleeve and the outer casing.
与现有技术相比,本发明的有益效果是:本发明通过滑槽和导向槽便于夹板移动,通过夹板进而固定住半导体,便于进行半导体测试;通过双向丝杆便于两个夹板相对运动,通过导杆便于夹板稳定移动,便于将半导体固定在工作台的中间位置,进而减少检测时因为位置不同产生的误差;通过导向柱便于压板稳定下降,通过压板两侧的导向柱可以使压板下降时不会产生旋转,减小误差;通过套筒防止导柱发生偏移,从而使压板稳定下降;通过L型压杆间接控制压板的高度,压板顶面开设有多个等距的槽口,通过多个槽口便于调节检测组件的位置,便于检测不同位置的半导体;同时能够提高对于所测半导体的防护效果;并通过在检测组件下压时,刚接触到半导体时无法通电,继续下降时,检测组件会通电,减小了检测组件的损耗,便于多次检测半导体,提高了对于半导体进行测试时的安全防护效果。Compared with the existing technology, the beneficial effects of the present invention are: the present invention facilitates the movement of the splint through the chute and the guide groove, and then fixes the semiconductor through the splint to facilitate semiconductor testing; the two-way screw rod facilitates the relative movement of the two splints, and The guide rod facilitates the stable movement of the clamping plate and fixes the semiconductor in the middle of the workbench, thereby reducing errors caused by different positions during detection; the guide column facilitates the stable descent of the pressure plate, and the guide columns on both sides of the pressure plate allow the pressure plate to descend smoothly. Rotation will occur to reduce errors; the sleeve is used to prevent the guide post from deflecting, thereby allowing the pressure plate to descend steadily; the height of the pressure plate is indirectly controlled through the L-shaped pressure rod. There are multiple equidistant notches on the top surface of the pressure plate. The notch is convenient for adjusting the position of the detection component and detecting semiconductors at different positions; at the same time, it can improve the protection effect of the semiconductor being tested; and when the detection component is pressed down, it cannot be powered when it first contacts the semiconductor, and when it continues to drop, the detection The components will be energized, which reduces the loss of the detection components, facilitates multiple detection of semiconductors, and improves the safety protection effect when testing semiconductors.
附图说明Description of drawings
此处所说明的附图用来提供对本发明的进一步理解,构成本申请的一部分,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。在附图中:The drawings described here are used to provide a further understanding of the present invention and constitute a part of this application. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached picture:
图1为本发明的整体立体结构示意图;Figure 1 is a schematic diagram of the overall three-dimensional structure of the present invention;
图2为本发明的正视结构示意图;Figure 2 is a schematic front view of the structure of the present invention;
图3为本发明的侧视剖面结构示意图;Figure 3 is a schematic side view of the cross-sectional structure of the present invention;
图4为本发明的俯视剖面结构示意图;Figure 4 is a schematic top view of the cross-sectional structure of the present invention;
图5为本发明的正视第一层剖面结构示意图;Figure 5 is a schematic cross-sectional view of the first layer of the present invention;
图6为本发明的正视第二层剖面结构示意图;Figure 6 is a schematic diagram of the second layer cross-sectional structure of the present invention;
图7为本发明的图6中A部位结构放大示意图;Figure 7 is an enlarged schematic diagram of the structure of part A in Figure 6 of the present invention;
图8为本发明的检测组件的整体立体结构示意图。Figure 8 is a schematic diagram of the overall three-dimensional structure of the detection component of the present invention.
图中序号:1、基座;2、底柱;3、支撑板;4、工作台;5、双向丝杆;6、导杆;7、手轮;8、挡片;9、轴承;10、夹板;11、导向柱;12、固定环;13、压板;14、滑套;15、固定板;16、C型架;17、套筒;18、导柱;19、U型架;20、L型压杆;21、连接座;22、连接块;23、外壳;24、小胶套;25、铜环;26、通电装置;27、大胶套;28、探测针;29、胶环;30、弹簧。Serial numbers in the picture: 1. Base; 2. Bottom column; 3. Support plate; 4. Workbench; 5. Two-way screw; 6. Guide rod; 7. Handwheel; 8. Block; 9. Bearing; 10 , plywood; 11. Guide column; 12. Fixed ring; 13. Pressure plate; 14. Sliding sleeve; 15. Fixed plate; 16. C-shaped frame; 17. Sleeve; 18. Guide column; 19. U-shaped frame; 20 , L-shaped pressure rod; 21. Connecting seat; 22. Connecting block; 23. Shell; 24. Small rubber sleeve; 25. Copper ring; 26. Power supply device; 27. Large rubber sleeve; 28. Detection needle; 29. Glue Ring; 30. Spring.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments.
实施例:参见图1至图8,一种半导体测试治具,包括基座1,通过基座1便于增加工作台4高度;基座1底面四角均固接有底柱2,通过底柱2便于支撑工作台4;基座1后端面竖向固结有支撑板3,通过支撑板3便于连接其他组件且基座1顶面的中部固接有工作台4,通过工作台4便于测试;工作台4上设有夹紧组件,支撑板3的前端面设有固定组件;夹紧组件包括横向开设在工作台4顶面的滑槽,且工作台4内横向开设有两个等距的导向槽,通过滑槽和导向槽便于夹板10移动;工作台4顶面前端的导向槽内横向设有双向丝杆5,通过双向丝杆5便于两个夹板10相对运动,工作台4顶面后端的导向槽内横向固接有导杆6,过导杆6防止夹板10发生旋转;双向丝杆5一端固接有手轮7,通过手轮7便于双向丝杆5的转动;且双向丝杆5通过两端固接有轴承9转动连接在工作台4内,通过轴承9便于双向丝杆5更好的转动;导杆6通过两端固接有挡片8固定连接在工作台4内,通过挡片8防止导杆6滑出;工作台4顶面两端设有夹板10,通过夹板10便于固定半导体;夹板10下端分别螺纹连接在双向丝杆5和套接在导杆6上。Embodiment: Referring to Figures 1 to 8, a semiconductor test fixture includes a base 1, through which the height of the workbench 4 can be easily increased; bottom columns 2 are fixed on the four corners of the bottom surface of the base 1, and through the bottom columns 2 It is convenient to support the workbench 4; a support plate 3 is fixed vertically on the rear end surface of the base 1, and other components are easily connected through the support plate 3; a workbench 4 is fixed in the middle of the top surface of the base 1, and testing is facilitated by the workbench 4; The workbench 4 is provided with a clamping assembly, and the front end surface of the support plate 3 is provided with a fixed assembly; the clamping assembly includes a chute transversely opened on the top surface of the workbench 4, and two equidistant slots are transversely opened in the workbench 4 The guide groove facilitates the movement of the splint 10 through the chute and the guide groove; the guide groove at the front end of the top of the workbench 4 is transversely provided with a two-way screw rod 5, and the two-way screw rod 5 facilitates the relative movement of the two splints 10. A guide rod 6 is fixed transversely in the guide groove at the end, and the guide rod 6 prevents the splint 10 from rotating; a handwheel 7 is fixed at one end of the two-way screw rod 5, and the handwheel 7 facilitates the rotation of the two-way screw rod 5; and the two-way screw rod 5 5 is rotatably connected to the workbench 4 through bearings 9 fixedly connected to both ends. The bearings 9 facilitate better rotation of the two-way screw rod 5; the guide rod 6 is fixedly connected to the workbench 4 through baffles 8 fixedly connected to both ends. The guide rod 6 is prevented from sliding out by the baffle 8; clamping plates 10 are provided at both ends of the top surface of the workbench 4 to facilitate the fixation of semiconductors; the lower ends of the clamping plates 10 are threadedly connected to the two-way screw rod 5 and sleeved on the guide rod 6 respectively.
在本发明中,固定组件包括横向固接在支撑板3前端面的两侧上端的固定环12,通过固定环12便于将导向柱11固定在基座1上;固定环12与基座1之间设有导向柱11,通过导向柱11防止压板13发生偏移;导向柱11底面固接在基座1顶面上、上端固接在固定环12内侧。In the present invention, the fixing assembly includes fixing rings 12 transversely fixed on both sides of the upper end of the front end surface of the support plate 3. The fixing rings 12 facilitate fixing the guide column 11 to the base 1; the connection between the fixing ring 12 and the base 1 Guide posts 11 are provided in between, and the guide posts 11 prevent the pressure plate 13 from deflecting; the bottom surface of the guide posts 11 is fixed on the top surface of the base 1, and the upper end is fixed on the inside of the fixed ring 12.
在本发明中,固定组件还包括竖向固接在支撑板3前端面的中部上端的固定板15,通过固定板15便于将C型架16固定住;固定板15前端面纵向固接有C型架16,通过C型架16便于连接导柱18和L型压板13;C型架16下端竖向固接有套筒17、上端通过铰接有L型压杆20,通过套筒17防止导柱18发生偏移,通过L型压杆20便于控制压板13的高度;套筒17内侧竖向活动设有导柱18,通过导柱18便于连接压板13和L型压杆20;导柱18两侧设有U型架19,通过U型架19便于导柱18下降;U型架19上下端分别通过螺栓连接在导柱18的上端和L型压板13的中部。In the present invention, the fixing assembly also includes a fixing plate 15 vertically fixed on the middle upper end of the front end surface of the support plate 3. The C-shaped frame 16 is easily fixed through the fixing plate 15; The C-shaped frame 16 is used to facilitate the connection between the guide post 18 and the L-shaped pressure plate 13; the lower end of the C-shaped frame 16 is vertically fixed with a sleeve 17, and the upper end is hinged with an L-shaped pressure rod 20. The sleeve 17 prevents the guide post from being guided. When the column 18 is offset, the height of the pressure plate 13 can be easily controlled through the L-shaped pressure rod 20; a vertically movable guide column 18 is provided on the inside of the sleeve 17, and the guide column 18 facilitates the connection between the pressure plate 13 and the L-shaped pressure rod 20; the guide column 18 U-shaped frames 19 are provided on both sides, and the U-shaped frame 19 facilitates the descent of the guide column 18; the upper and lower ends of the U-shaped frame 19 are connected to the upper end of the guide column 18 and the middle part of the L-shaped pressure plate 13 through bolts respectively.
在本发明中,工作台4上端设有压板13,压板13后端的两侧均固接有滑套14,通过滑套14便于压板13下滑;滑套14活动套接在导向柱11上,压板13顶面中部的后端固接有连接座21,通过连接座21便于将导柱18与压板13连接;连接座21顶面固接有导柱18,压板13顶面开设有多个等距的槽口,通过多个槽口便于调节检测组件的位置;槽口内设有检测组件。In the present invention, a pressure plate 13 is provided at the upper end of the workbench 4, and sliding sleeves 14 are fixed on both sides of the rear end of the pressure plate 13. The sliding sleeves 14 facilitate the sliding of the pressure plate 13; the sliding sleeve 14 is movably connected to the guide column 11, and the pressure plate The rear end of the middle part of the top surface of 13 is fixedly connected with a connecting seat 21, through which the guide post 18 and the pressure plate 13 are easily connected; The slots are used to facilitate the adjustment of the position of the detection component through multiple slots; the detection components are arranged in the slots.
在本发明中,检测组件包括竖向固接在槽口内的连接块22,通过连接块22便于固定检测组件;连接块22底面固接有外壳23,通过外壳23便于保护内部组件;外壳23腔内竖向设有小胶套24,通过小胶套24防止弹簧30通电,小胶套24的内侧上端固接有铜环25,通过铜环25便于导电;铜环25的内侧上端固接有通电装置26,通过通电装置26便于检测半导体是否具有导电性;且小胶套24、铜环25和通电装置26的顶面均固接在连接块22上,外壳23下端卡接有大胶套27,通过大胶套27防止误触导电;大胶套27内侧卡接有探测针28,通过探测针28便于检测;探测针28上端设于小胶套24下端,且小胶套24与外壳23之间竖向设有弹簧30,通过弹簧30便于检测半导体。In the present invention, the detection component includes a connection block 22 vertically fixed in the slot, through which the detection component can be easily fixed; a shell 23 is fixed on the bottom surface of the connection block 22, through which the internal components can be easily protected; the cavity of the shell 23 A small rubber sleeve 24 is arranged vertically inside, and the small rubber sleeve 24 prevents the spring 30 from being energized. A copper ring 25 is fixedly connected to the inner upper end of the small rubber sleeve 24, and the copper ring 25 facilitates conduction; the inner upper end of the copper ring 25 is fixedly connected to a The energizing device 26 facilitates the detection of whether the semiconductor is conductive; and the small rubber sleeve 24, the copper ring 25 and the top surface of the energizing device 26 are all fixed on the connecting block 22, and a large rubber sleeve is connected to the lower end of the shell 23 27. The large rubber sleeve 27 prevents accidental contact and conduction; the inside of the large rubber sleeve 27 is connected with a detection needle 28, which facilitates detection; the upper end of the detection needle 28 is located at the lower end of the small rubber sleeve 24, and the small rubber sleeve 24 is connected to the shell A spring 30 is provided vertically between 23, through which the semiconductor can be easily detected.
工作原理:在本实施例中,本发明还提出了一种半导体测试治具的使用方法,包括以下步骤:Working principle: In this embodiment, the invention also proposes a method of using a semiconductor test fixture, which includes the following steps:
步骤一,首先将导线连接在连接块22上通电,再将手轮7逆时针旋转,将夹板10向外打开,然后将半导体放置在工作台4上,再将手轮7顺时针转动,使夹板10向内移动夹紧半导体;Step 1: First connect the wires to the connecting block 22 and energize it, then rotate the handwheel 7 counterclockwise, open the splint 10 outward, then place the semiconductor on the workbench 4, and then rotate the handwheel 7 clockwise to make The clamping plate 10 moves inward to clamp the semiconductor;
步骤二,然后将L型压杆20向上抬起,通过U型架19和C型架16上端的铰链座,使导柱18向下移动,通过套筒17防止导柱18下降时发生偏移;当导柱18下移时,通过连接座21使压板13下降,再通过导向柱11和滑套14防止压板13下降发生偏移,当压板13下降时,固定在压板13下方的检测组件也会下降;Step 2: Then lift the L-shaped pressure rod 20 upward, and move the guide post 18 downward through the hinge seat at the upper end of the U-shaped frame 19 and the C-shaped frame 16. Use the sleeve 17 to prevent the guide post 18 from deflecting when it descends. ; When the guide post 18 moves down, the pressure plate 13 is lowered through the connecting seat 21, and then the guide post 11 and the sliding sleeve 14 prevent the pressure plate 13 from falling and deflecting. When the pressure plate 13 drops, the detection component fixed below the pressure plate 13 also will decline;
步骤三,当大胶套27触碰到半导体时,刚触碰到半导体时,由于内侧装置还未连接,导致没有电,当压板13继续下降时,大胶套27会上升在外壳23内侧,此时弹簧30为压缩状态,当大胶套27内侧的探测针28上端触碰到铜环25时,此时装置通电,检测半导体是否通电,能够提高对于半导体进行检测的便捷性和工作效率,避免出现误测漏测的情况出现;Step 3: When the large rubber sleeve 27 touches the semiconductor, there is no power because the inner device is not connected yet. When the pressure plate 13 continues to drop, the large rubber sleeve 27 will rise on the inside of the housing 23. At this time, the spring 30 is in a compressed state. When the upper end of the detection needle 28 inside the large rubber sleeve 27 touches the copper ring 25, the device is powered on to detect whether the semiconductor is powered on, which can improve the convenience and work efficiency of semiconductor detection. Avoid mis-measurements and missed measurements;
步骤四,当检测完成时,将L型压杆20下压,同理,使压板13上升,上升过程中,弹簧30会将大胶套27向下推出,使探测针28不触碰铜环25,此时装置断电;Step 4: When the detection is completed, press down the L-shaped pressure rod 20. In the same way, the pressure plate 13 rises. During the rising process, the spring 30 will push the large rubber sleeve 27 downward so that the detection needle 28 does not touch the copper ring. 25. At this time, the device is powered off;
步骤五,在装置断电后,将手轮7逆时针转动,使夹板10向外移动从而松动半导体,然后将半导体取出,依次往复,即可测试多个半导体。Step 5: After the device is powered off, turn the hand wheel 7 counterclockwise to move the splint 10 outward to loosen the semiconductor, then take out the semiconductor and reciprocate in order to test multiple semiconductors.
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。The above are only preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person familiar with the technical field can, within the technical scope disclosed in the present invention, implement the technical solutions of the present invention. Equivalent substitutions or changes of the inventive concept thereof shall be included in the protection scope of the present invention.
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Application publication date: 20231229 |