CN117270112A

CN117270112A - Optical transmission module, optical module, circuit board assembly and optical network equipment

Info

Publication number: CN117270112A
Application number: CN202210661271.6A
Authority: CN
Inventors: 李月涛; 汪金朗; 史锡婷
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2023-12-22
Also published as: WO2023241308A1

Abstract

The embodiment of the application discloses an optical transmission module, an optical module, a circuit board assembly and optical network equipment, relates to the field of optical communication, and solves the problem that the installation of an existing optical extraction module is limited. The optical transmission module includes a support and an optical fiber assembly disposed on the support. The optical fiber assembly comprises an optical fiber array and a fixing device, wherein the optical fiber array comprises a plurality of optical fibers arranged side by side along a first direction. The fixing device comprises an optical main body assembly and a plurality of condensing lenses, wherein the optical main body assembly is used for fixing first ends of a plurality of optical fibers in the optical fiber array. The optical main body component is provided with a reflecting surface which is used for correspondingly reflecting the light beam signals transmitted by the optical fibers to the condensing lenses respectively. The plurality of condensing lenses are spaced apart in a first direction on the optical body assembly and are located on a side close to the support. The plurality of condensing lenses are used for respectively converging the light beam signals reflected by the reflecting surface to a plurality of coupling interfaces which are distributed on the optical chip at intervals along the first direction.

Description

Optical transmission module, optical module, circuit board assembly and optical network equipment

Technical Field

The present disclosure relates to the field of optical communications technologies, and in particular, to an optical transmission module, an optical module, a circuit board assembly, and an optical network device.

Background

Advances in information technology have led to increases in the rate of communication transmissions, which have led to the need for higher rate switching chips. In order to match with the high-speed exchange chip, more channels are required to be introduced, so that the packaging mode of the chip is greatly changed. The process from the mutual independent development of the electric chip and the optical chip to the same plate processing of the electric chip and the optical chip is realized, and then the encapsulation of the electric chip and the optical chip is realized.

Among the numerous extraction interfaces of the optical chip, a Grating Coupler (GC) interface is an important light extraction mode, and has stable performance and high reliability. Because the direction of the light beam output by the grating coupling interface is perpendicular to the optical chip, an extra height space is reserved above the grating coupling interface to place the optical fiber assembly. However, since the optical chip and the electrical chip need to be closely attached to the heat sink to ensure heat dissipation, the height space above the grating coupling interface in the optical chip is limited. In addition, in the application scene of photoelectric co-encapsulation, the optical chip and the electric chip are stacked. The light chip adopts a light emitting mode at the suspended bottom, and the suspended height of the light chip is the reserved height space of the light extraction module. The thickness of the electric chip is smaller, so that the suspension height of the optical chip is smaller. The height space of the light extraction module is smaller, so that the installation of the light extraction module is limited.

Disclosure of Invention

The embodiment of the application provides an optical transmission module, an optical module, a circuit board assembly and optical network equipment, which solve the problem that the installation of the existing optical extraction module is limited.

In order to achieve the above purpose, the present application adopts the following technical scheme:

in a first aspect, embodiments of the present application provide an optical transmission module including a support and an optical fiber assembly. The fiber optic assembly is adapted to be disposed on a support. The fiber optic assembly includes an array of optical fibers and a fixture, wherein the array of optical fibers includes a plurality of optical fibers disposed side-by-side along a first direction. The fixing device comprises an optical main body assembly and a plurality of condensing lenses, wherein the optical main body assembly is used for fixing first ends of a plurality of optical fibers in the optical fiber array. And the optical body assembly is provided with a reflecting surface for reflecting the light beam signals transmitted by the optical fibers to the condensing lenses correspondingly. The plurality of condensing lenses are spaced apart in a first direction on the optical body assembly and are located on a side close to the support. The plurality of condensing lenses are used for respectively converging the light beam signals reflected by the reflecting surface to a plurality of coupling interfaces which are distributed on the optical chip at intervals along the first direction.

Based on the above, the optical transmission module in the embodiment of the application correspondingly reflects the light beam signals transmitted by the optical fibers to the condensing lenses through the reflecting surfaces on the optical main body assembly, and the condensing lenses respectively collect the light beam signals reflected by the reflecting surfaces to the coupling interfaces on the optical chip at intervals along the first direction. Therefore, the signal transmission between the optical transmission module and the optical chip is realized. And, through the cambered surface angle of design suitable condensing lens, the height of support piece in the optical transmission module can be less. The optical body assembly and the optical fiber array can be arranged on the same plane, the height of the optical body assembly can be slightly larger than that of the optical fiber array, and the thickness of the condensing lens is smaller than that of the supporting piece. Therefore, the whole optical transmission module has smaller height, can be applied to the scene that the height between the coupling interface of the optical chip and the substrate is below 5mm, and can not generate the problems of polarization maintaining performance degradation and extra insertion loss.

In some embodiments of the present application, the optical body assembly includes a first optical mount and a second optical mount. The second optical fixing piece is arranged opposite to the first optical fixing piece. The first ends of the plurality of optical fibers in the optical fiber array are clamped between the first optical mount and the second optical mount. The surface of the first optical fixing piece, which is close to the first end of the optical fiber, and the surface of the second optical fixing piece, which is close to the first end of the optical fiber, are connected with the end surfaces of the first ends of the optical fibers in the optical fiber array to form a reflecting surface. The condensing lens and the supporting piece are arranged on the surface of one side, far away from the first optical fixing piece, of the second optical fixing piece. The optical main body component has less material and simple structure, and is convenient for processing the reflecting surface.

In other embodiments of the present application, the optical body assembly includes a first optical fixing member, a second optical fixing member, and a reflective lens. Wherein the second optical fixing piece is positioned below the first optical fixing piece. The support member is disposed below the second optical mount. First ends of a plurality of optical fibers in the optical fiber array are clamped between the first optical mount and the second optical mount. The surface of the first optical fixing piece, which is close to the first end of the optical fiber, and the surface of the second optical fixing piece, which is close to the first end of the optical fiber, are connected with the end surfaces of the first ends of the optical fibers in the optical fiber array to form a connecting surface. The reflective lens has oppositely disposed first and second outer surfaces. The first outer surface of the reflecting lens is connected with the connecting surface. The reflecting surface is formed on the second outer surface of the reflecting lens. The condensing lens is disposed on a side surface of the reflecting lens near the support. The reflecting lens and the condensing lens are of an integrated structure. The light transmission module has fewer assembly steps and is convenient to install.

The reflecting surface is an arc surface or a reflecting inclined surface protruding outwards. The side edge of the reflecting surface, which is close to the supporting piece, is positioned outside the side edge of the reflecting surface, which is far away from the supporting piece. The appropriate shape of the reflecting surface can be selected according to the reflecting angle requirement of the optical beam signal of the optical fiber.

Based on the above, in some embodiments, the optical fiber assembly further includes a sealing layer, wherein the sealing layer is filled between the condensing lens and the coupling interface of the corresponding optical chip, and covers both the condensing lens and the coupling interface of the corresponding optical chip. Therefore, the coupling interface of the condensing lens and the optical chip can be sealed by the sealing layer, and the influence of impurities such as dust, vapor and the like on the optical performance of the coupling interface of the condensing lens and the optical chip is avoided. And the sealing layer has a simpler structure. Illustratively, the sealing layer is an optical path glue layer. The light path glue has low price and good optical performance such as transmissivity and refractive index.

In some embodiments of the present application, the optical fiber assembly further includes an optical spacer for being disposed between the encapsulant layer and the coupling interface of the corresponding optical chip. The optical gasket may cover the coupling interface of the optical chip to seal the coupling interface of the optical chip. And the thickness of the optical path glue layer can be controlled to be smaller than 50 mu m by adjusting the thickness of the optical gasket. Therefore, on the premise of ensuring the sealing effect on the condensing lens, the deformation of the light path adhesive in the baking process can be avoided.

For the optical transmission module with a plurality of groups of optical fiber assemblies, the optical fiber assemblies are sequentially stacked on the supporting piece, and the lengths of the optical fiber assemblies are sequentially decreased along the direction close to the supporting piece. The reflecting surfaces in the optical fiber assemblies are respectively used for reflecting the light beam signals transmitted by the optical fiber arrays to the condensing lenses in the fixing devices. The plurality of condensing lenses of the fixing device in the plurality of groups of optical fiber assemblies are used for converging the light beam signals reflected by the plurality of reflecting surfaces to a plurality of coupling interfaces distributed on the optical chip along the second direction respectively. The optical transmission module with the plurality of groups of optical fiber assemblies can carry out signal transmission with a plurality of rows of coupling interfaces arranged in an array on the optical chip, can meet the requirement of high channel density, and can be suitable for installation scenes with smaller height space.

In addition, for the optical transmission module with multiple groups of optical fiber assemblies, one group of optical main body assemblies comprises a first optical fixing piece, a second optical fixing piece, a reflecting lens and an optical connecting piece. Wherein the second optical fixing piece is positioned below the first optical fixing piece. First ends of a plurality of optical fibers in the optical fiber array are clamped between the first optical mount and the second optical mount. The surface of the first optical fixing piece, which is close to the first end of the optical fiber, and the surface of the second optical fixing piece, which is close to the first end of the optical fiber, are connected with the end surfaces of the first ends of the optical fibers in the optical fiber array to form a connecting surface. The first outer surface of the reflecting lens is connected with the connecting surface, and the reflecting surface is formed on the second outer surface of the reflecting lens, and the second outer surface is opposite to the first outer surface. The condensing lens is disposed on a side surface of the reflecting lens, which is close to the support. An optical connector connects the reflective lenses in the same set of fiber optic assemblies with the reflective lenses in an adjacent set of fiber optic assemblies. The reflection lens, the optical connecting piece and the condensing lens of the optical main body component in the optical fiber components are of an integrated structure, so that the assembly steps of the optical main body component in the optical module are further reduced, and the optical main body component is convenient to install.

The total thickness of the optical fiber array in the optical fiber assembly and the optical body assembly in the fixing device is 1.2-1.5mm. The thickness of the support is 0.3mm. Thus, 3 sets of fiber optic assemblies can be installed in a height space of 5mm apart. For the optical module with 40 optical fibers in each group of optical fiber arrays, the spacing between two adjacent coupling interfaces along the first direction on the optical chip is 127 μm, and the spacing between two adjacent coupling interfaces along the second direction is 3mm, the optical channel density of the optical module can be 11.1ch/mm ² (channel/square millimeters) above.

In a second aspect, an optical module according to an embodiment of the present application includes an optical chip and an optical transmission module described in the foregoing embodiment. The first surface of the optical chip is provided with a plurality of coupling interfaces, and the coupling interfaces are distributed at intervals along a first direction. The support in the optical transmission module is disposed on the optical chip. The light transmission module comprises a plurality of light transmission lenses, a plurality of reflecting surfaces and a plurality of coupling interfaces, wherein the light transmission lenses are used for respectively converging light beam signals reflected by the reflecting surfaces to the plurality of coupling interfaces which are distributed on the optical chip at intervals along a first direction. The structure of the optical transmission module in the optical module of the embodiment of the present application is the same as that of the optical transmission module in the above embodiment, and the two optical transmission modules can solve the same technical problem and obtain the same technical effect, which is not described herein again. Moreover, the optical transmission module can be suitable for application scenes in which a plurality of coupling interfaces on the optical chip are all grating coupling interfaces.

And the plurality of coupling interfaces distributed along the first direction are a row of the coupling interfaces, a plurality of rows of coupling interfaces are arranged on the first surface of the optical chip, and the plurality of rows of coupling interfaces are distributed at intervals along the second direction. Correspondingly, the optical transmission module comprises a plurality of groups of optical fiber assemblies, the optical fiber assemblies are sequentially stacked on the supporting piece, and the lengths of the optical fiber assemblies are sequentially decreased along the direction close to the supporting piece. The reflecting surfaces in the optical fiber assemblies are respectively used for reflecting the light beam signals transmitted by the optical fiber arrays to the condensing lenses of the fixing devices. The plurality of condensing lenses of the fixing device in the plurality of groups of optical fiber assemblies are used for converging the light beam signals reflected by the plurality of reflecting surfaces to a plurality of coupling interfaces distributed on the optical chip along the second direction respectively. Therefore, the optical module can meet the transmission requirements of high speed and high density.

In addition, the optical module further comprises an airtight cover, and the airtight cover is arranged outside the optical transmission module. The airtight cover is used for sealing the support, the optical fiber assembly and a plurality of coupling interfaces of the optical chip. The airtight cover can isolate the coupling interface of the condensing lens and the optical chip from the external environment. Therefore, the coupling interface of the condensing lens and the optical chip is prevented from being influenced by external environment, and the installation operation of the airtight cover is simpler.

In one embodiment, a distance between two adjacent coupling interfaces distributed along the second direction on the optical chip is more than 0.7 mm. The scheme of stacking multiple groups of optical fiber assemblies can be suitable for optical chips with the spacing between two adjacent coupling interfaces distributed along the second direction being more than 0.7 mm.

In a third aspect, an embodiment of the present application further includes a circuit board assembly including a substrate, an electrical chip, and the optical module described in the foregoing embodiment. Wherein the electrical chip is disposed on the first region of the substrate. The optical module is arranged on the substrate and connected with the electric chip. The optical module in the circuit board assembly of the embodiment of the application has the same structure as that of the optical module in the embodiment, and the optical module can solve the same technical problem and obtain the same technical effect.

In some embodiments, the light module is disposed on the second region of the substrate. The optical module is connected with the electric chip through the substrate. Based on the structure of the circuit board assembly, the optical module further comprises an airtight cover, and the airtight cover is arranged outside the optical chip and the optical transmission module. The lower edge of the airtight cover is connected with the substrate. The airtight cover has smaller volume and lower cost.

In other embodiments, the optical module is disposed on a side of the electrical chip away from the upper substrate, and the first surface of the optical chip in the optical module has a plurality of first connection portions. Correspondingly, a plurality of second connecting parts are arranged on the surface of one side of the electric chip far away from the substrate. The partial area of the first surface of the optical chip with the plurality of first connecting parts is opposite to the partial area of the electric chip with the second connecting parts. The first connection portion is connected to the second connection portion. The partial area of the first surface of the optical chip with a plurality of coupling interfaces is opposite to the substrate. The optical transmission module in the optical module is positioned between the optical chip and the substrate. The optical chip and the electric chip are stacked in the circuit board assembly, so that the occupied board space of the optical chip and the electric chip on the substrate can be reduced. Thereby, space utilization on the circuit board assembly is improved.

Based on the structure of the circuit board assembly, the optical module further comprises an airtight cover, and the airtight cover is arranged outside the optical chip, the optical transmission module and the electric chip. The airtight cover is simple to install, and can isolate the optical chip, the optical transmission module and the electric chip from the outside in the circuit board assembly, so that the circuit board assembly is less affected by the outside.

In a fourth aspect, embodiments of the present application include an optical network device that includes a housing and a circuit board assembly as described in the previous embodiments. The circuit board assembly is disposed within the housing. The optical network device may be a router (e.g., a cluster router), a core server, a supercomputer, a splitter, a fiber amplifier, a beam shaper, or an adjustable filter, etc. Because the circuit board assembly in the optical network device of the embodiment of the present application has the same structure as the circuit board assembly described in the foregoing embodiment, the circuit board assembly and the circuit board assembly can solve the same technical problem and obtain the same technical effect, and will not be described herein.

Drawings

In order to describe the technical solutions of the embodiments of the present application, the following description will describe the drawings that are required to be used in the embodiments of the present application.

Fig. 1 is a perspective view of an optical network device according to an embodiment of the present application as a router;

fig. 2 is a schematic structural diagram of a circuit board assembly in an optical network device according to an embodiment of the present application;

fig. 3 is a schematic cross-sectional view of a first circuit board assembly in an optical network device according to an embodiment of the present application;

fig. 4 is a schematic cross-sectional view of a second circuit board assembly in an optical network device according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an optical transmission module with an end-folded optical fiber of a first circuit board assembly in an optical network device;

Fig. 6 is a schematic structural diagram of an optical transmission module with an end-folded optical fiber of a second circuit board assembly in an optical network device;

fig. 7 is a schematic cross-sectional view of an optical chip and an optical transmission module of an optical module in an optical network device according to an embodiment of the present application;

fig. 8 is an exploded schematic view of an optical chip and an optical transmission module of an optical module in an optical network device according to an embodiment of the present application;

fig. 9 is a side view of a fiber optic assembly in an optical network device according to an embodiment of the present application;

fig. 10 is an exploded view of various components within a fiber optic assembly of an optical network device according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of an optical fiber assembly with an arc-shaped reflecting surface in an optical network device according to an embodiment of the present application;

fig. 12 is a schematic optical path diagram of an optical module in an optical network device according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of an optical module with a second fixing device in an optical network device according to an embodiment of the present application;

fig. 14 is an exploded schematic view of an optical module in an optical network device according to an embodiment of the present application, where the optical module has multiple groups of optical transmission modules and multiple rows of coupling interfaces on an optical chip;

fig. 15 is a schematic cross-sectional view of an optical module in an optical network device according to an embodiment of the present application, where the optical module has multiple groups of optical transmission modules and multiple rows of coupling interfaces on an optical chip;

Fig. 16 is a schematic cross-sectional view of a second circuit board assembly of an optical network device according to an embodiment of the present application, where the second circuit board assembly has multiple groups of optical transmission modules and multiple rows of coupling interfaces;

fig. 17 is a schematic cross-sectional view of a second circuit board assembly in an optical network device having multiple sets of optical transmission modules and multiple rows of coupling interfaces;

fig. 18 is a schematic cross-sectional view of an optical module having a plurality of second fixing devices in an optical network device according to an embodiment of the present application;

fig. 19 is a schematic cross-sectional view of an optical module in an optical network device according to an embodiment of the present application with a plurality of third fixing devices;

fig. 20 is a schematic cross-sectional view of an optical module with a sealing layer in an optical network device according to an embodiment of the present application;

fig. 21 is a schematic cross-sectional view of an optical module with a sealing layer and an optical pad in an optical network device according to an embodiment of the present application;

fig. 22 is a schematic cross-sectional view of an optical module with a sealing cover in an optical network device according to an embodiment of the present application;

fig. 23 is a schematic cross-sectional view of a first circuit board assembly with a sealed enclosure in an optical network device according to an embodiment of the present application;

fig. 24 is a schematic cross-sectional view of a second circuit board assembly with a sealed enclosure in an optical network device according to an embodiment of the present application;

fig. 25 is a schematic perspective view of a sealing cover in an optical network device according to an embodiment of the present application.

Reference numerals:

1000-optical network device, 100-housing, 200-circuit board assembly, 10-substrate, 101-third connection, 102-routing layer, 20-electrical chip, 201-second connection, 30-optical module, 1-optical chip, 1 a-first surface, 11-first connection, 12a, 12b, 12 c-coupling interface, 2-optical transmission module, 2 a-support, 2b, 2ba, 2bb, 2 bc-optical fiber assembly, 21-optical fiber array, 211-optical fiber, 2111-first end, 22-fixture, 221-optical body assembly, 221 a-lower edge, 221 b-upper edge, 2211-first optical fixture, 2212-second optical fixture, 2213-reflective lens, 2213 a-first outer surface, 2213 b-second outer surface, 2214-optical connector, 220-fixture slot, 222-condenser lens, 23-optical spacer, 24-optical spacer, 25a, 25 b-cover, 251 a-sealing surface, 22 a-reflective surface, 40-sealing surface, and heat sink surface.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings.

Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in this application, directional terms "upper", "lower", "left", "right", "horizontal", and "vertical" are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect thereto, and which may be correspondingly varied according to the variation in the orientation in which the components are disposed in the drawings. In this application, unless explicitly specified and limited otherwise, the term "coupled" is to be construed broadly, e.g., as "coupled" may refer to a mechanical, physical, or a combination of structures. For example, the two parts can be fixedly connected, detachably connected or integrated, and can be directly connected or indirectly connected through an intermediate medium. The circuit structure is also understood to be in physical contact and electrical conduction with components, and also understood to be in a form of connection between different components in a circuit structure through a PCB copper foil or a lead and other physical circuits capable of transmitting electric signals.

The embodiment of the application comprises an optical network device, which can be a router (such as a cluster router), a core server, a supercomputer, a splitter, an optical fiber amplifier, a beam shaper, a tunable filter and the like. The embodiment of the present application does not particularly limit the specific form of the optical network device. For convenience of explanation, the optical network device is exemplified by the router shown in fig. 1.

Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an optical network device provided in some embodiments of the present application as a router, and fig. 2 is a schematic structural diagram of a circuit board assembly in the optical network device shown in fig. 1. As can be seen from the above, in the present embodiment, the optical network device 1000 is a router. Router 1000 may include a housing 100 as shown in fig. 1 and a circuit board assembly 200 as shown in fig. 2. A mounting cavity (not shown) is formed in the housing 100, and the circuit board assembly 200 is disposed in the mounting cavity of the housing 100.

Referring to fig. 2, the circuit board assembly 200 includes a substrate 10, an electrical chip 20, and an optical module 30. Wherein the light module 30 and the electrical chip 20 are both arranged on the substrate 10. The optical module 30 is used for modulating, converting and transmitting optical input/output signals of the photoelectric signals. The electrical chip 20 may be a switching chip in particular. The switching chip is electrically connected to the optical module 30, so that signal transmission between the optical module 30 and the electrical chip 20 is achieved. By way of example, the circuit board assembly 200 shown in fig. 2 includes 1 electrical chip 20 and 2 optical modules 30, the electrical chip 20 being electrically connected to each of the 2 optical modules 30. The number of the electrical chips 20 and the optical modules 30 in the circuit board assembly 200 is not limited, and can be specifically selected according to actual needs.

As shown in fig. 3, the upper surface of the substrate 10 has a plurality of third connection portions 101. Specifically, the third connection portion 101 may be a pad or a metal post, or the like. Within the substrate 10 is a multi-layered trace layer 102, only one trace layer 102 being shown in fig. 3. The trace layer 102 may be connected to the third connection portion 101. And the electrical chip 20 is provided with a plurality of second connection portions 201. Specifically, the second connection portion 201 may be a pad, a metal post, or the like. The optical module 30 includes an optical chip 1, and the optical chip 1 is used for performing photoelectric conversion. For example, the optical chip 1 may be an optical waveguide chip (such as a planar optical waveguide chip). The first surface 1a of the optical chip 1 has a plurality of first connection portions 11. Specifically, the first connection portion 11 may be a pad, a metal post, or the like. The electrical chip 20 and the optical chip 1 may be connected by different combinations of the third connection portion 101, the second connection portion 201 and the first connection portion 11, so as to implement signal transmission between the optical chip 1 and the electrical chip 20 in the optical module 30. The manner in which the electrical chip 20 and the optical chip 1 are connected is exemplified below.

In some embodiments, the optical module 30 and the electrical chip 20 may be electrically connected through the substrate 10. With continued reference to fig. 3, the electrical chip 20 is disposed within the first region a of the substrate 10. And the light module 30 is disposed in the second region B of the substrate 10. In other words, the electrical chip 20 is spaced apart from the optical module 30. The second connection portion 201 of the electrical chip 20 is connected to the third connection portion 101 of the substrate 10, and the first connection portion 11 of the optical chip 1 is connected to the third connection portion 101 of the substrate 10. Thus, the electrical chip 20 may be electrically connected with the optical chip 1 in the optical module 30 through the wiring layer 102 of the substrate 10.

In other embodiments, the optical module 30 and the electrical chip 20 may be directly electrically connected. As shown in fig. 4, the upper surface (i.e., the surface of the electric chip 20 on the side away from the substrate 10) and the lower surface (i.e., the surface of the electric chip 20 on the side close to the substrate 10) of the electric chip 20 each have the above-described second connection portion 201. The second connection portion 201 on the lower surface of the electric chip 20 is connected with the third connection portion 101 of the substrate 10. A partial region of the first surface 1a of the optical chip 1 having the plurality of first connection portions 11 is disposed opposite to a region of the upper surface of the electrical chip 20 having the second connection portions 201. And a partial region of the first surface 1a of the optical chip 1 without the first connection portion 11 may be opposite to the substrate 10. The second connection portion 201 on the upper surface of the electrical chip 20 may be connected with the first connection portion 11 of the optical chip 1. Thereby, a direct electrical connection of the electrical chip 20 with the optical chip 1 in the optical module 30 is achieved. The mounting method shown in fig. 4 may also be referred to as flip-chip mounting of the optical chip 1 on the electrical chip 20 in the optical module 30.

The optical chip 1 is provided with a coupling interface 12 as shown in fig. 5, and the coupling interface 12 is used for inputting a beam signal or outputting a beam signal. The coupling interface 12 may also be referred to as an Optical Input Output (Optical Input & Output) interface. The coupling interface 12 may be an Edge Coupler (EC) interface, and the coupling interface 12 is located on the side of the optical chip 1. The coupling interface 12 may also be a grating coupling interface, the coupling interface 12 being arranged on the first surface 1a of the optical chip 1. The optical module 30 further includes an optical transmission module 2 as shown in fig. 5, and the optical transmission module 2 in the optical module 30 may be one or two or more optical transmission modules, which is not limited in this application. The optical transmission module 2 comprises an optical fiber assembly 2b, and the optical fibers 211 in the optical fiber assembly 2b can be directly connected with the coupling interface 12. Thus, the optical chip 1 may transmit the optical beam signal to the optical fiber assembly 2b through the coupling interface 12, and then transmit the optical beam signal to other devices through the optical fiber assembly 2 b. The optical fiber assembly 2b can also transmit the beam signals of other devices to the optical chip 1 through the coupling interface 12.

Taking the optical chip 1 with a grating coupling interface as an example, with continued reference to fig. 5, the optical transmission module 2 is disposed above the optical chip 1. However, it is considered that a heat sink 40 is required to be provided above the optical chip 1 and the electric chip 20, and the optical chip 1 and the electric chip 20 need to be closely attached to the heat sink 40 to ensure a good heat dissipation effect. Therefore, the height H reserved for the optical transmission module 2 ₁ Smaller, such that the fiber optic assembly 2b in the optical transmission module 2 is limited in installation. Whereas the optical chip 1 shown in fig. 6 is flip-chip mounted on the electrical chip 20, the coupling interface 12 is located in the area of the optical chip 1 opposite the substrate 10. Since the thickness of the electrical chip 20 (the vertical direction in the drawing is the thickness direction) is small, the height H between the coupling interface 12 and the substrate 10 ₂ And also smaller, which also results in limited installation of the fiber optic assembly 2b in the optical transmission module 2.

To solve the above-mentioned problem, as shown in fig. 5 and 6, a first end of an optical fiber 211 in an optical fiber assembly 2b is bent in an optical transmission module 2, and then connected to a coupling interface 12, so as to implement installation of the optical fiber assembly 2 b. However, the optical fiber 211 has a limit of the minimum bending radius, and cannot satisfy the height limit height (H ₁ Or H ₂ ) Application scenes below 5 mm. In addition, in an optical link requiring high polarization maintaining performance, the small radius bend at the first end of the optical fiber 211 may cause degradation of the polarization maintaining performance during transmission, and may also introduce additional insertion loss.

Accordingly, in order to solve the above-mentioned problems without deterioration of polarization maintaining performance and additional insertion loss, the embodiments of the present application provide an optical transmission module 2 that does not require bending of the optical fiber 211.

The optical transmission module 2 of the embodiment of the present application includes, in addition to the optical fiber assembly 2b, a support member 2a as shown in fig. 7, and the support member 2a may be disposed on the first surface 1a of the optical chip 1. For example, the support 2a may be a spacer. The material of which the support 2a is made may be glass, plastic or the like. The optical fiber assembly 2b may be provided on the support 2 a.

For the optical chip 1 having a plurality of coupling interfaces 12 as shown in fig. 8, the plurality of coupling interfaces 12 may be spaced apart along the first direction P. Accordingly, the optical fiber assembly 2b mated with the plurality of coupling interfaces 12 includes an optical fiber array 21, the optical fiber array 21 including a plurality of optical fibers 211 arranged side-by-side along the first direction P. The optical fiber assembly 2b further includes a fixture 22, the fixture 22 including an optical body assembly 221 as shown in fig. 8 and a plurality of condensing lenses 222 as shown in fig. 9. Wherein the optical body assembly 221 may secure the first ends 2111 of the plurality of optical fibers 211 in the optical fiber array 21. The optical body assembly 221 is formed with a reflecting surface 22a, and the reflecting surface 22a is used for reflecting the beam signals transmitted by the optical fibers 211 to the condensing lenses 222, respectively. The plurality of condensing lenses 222 are spaced apart in the first direction P on the optical body assembly 221 and are located on a side close to the support 2 a.

For example, as shown in fig. 10, the optical body assembly 221 may include a first optical fixture 2211 and a second optical fixture 2212, the second optical fixture 2212 being disposed opposite the first optical fixture 2211. The support 2a is disposed below the second optical fixture 2212, i.e., the support 2a is disposed on a side surface of the second optical fixture 2212 remote from the first optical fixture 2211. First ends 2111 of a plurality of optical fibers 211 in optical fiber array 21 are clamped between first optical mount 2211 and second optical mount 2212. Specifically, the first optical fixture 2211 and the second optical fixture 2212 may each be a transparent fixing plate, such as a glass plate, a plastic plate, or a silicon plate. A plurality of fixing grooves 220 may be formed on the surface of the first optical fixture 2211 opposite to the second optical fixture 2212, or on the surface of the second optical fixture 2212 opposite to the first optical fixture 2211. First ends 2111 of the plurality of optical fibers 211 in the optical fiber array 21 are respectively received in the plurality of fixing grooves 220. Of course, the first optical fixture 2211 and the second optical fixture 2212 may be disposed in the fixing groove 220. The surface of the first optical fixture 2211 near the first end 2111 of the optical fiber 211 and the surface of the second optical fixture 2212 near the first end 2111 of the optical fiber 211 are connected with the end surfaces of the first ends 2111 of the optical fibers 211 in the optical fiber array 21. The surface of the first optical fixture 2211 near the first end 2111 of the optical fiber 211, the surface of the second optical fixture 2212 near the first end 2111 of the optical fiber 211, and the end surfaces of the first ends 2111 of the optical fibers 211 in the optical fiber array 21 are all provided with inclined surfaces having the same inclination, thereby forming a reflecting surface 22a as shown in fig. 8. The reflecting surface 22a may be a reflecting inclined surface as shown in fig. 8, or an arc surface protruding outwards as shown in fig. 11, so as to adapt to different reflecting angle requirements. The side edge of the reflecting surface 22a (the lower edge 221a of the reflecting surface 22a shown in fig. 11) near the supporting member 2a is located outside the side edge of the reflecting surface 22a (the upper edge 221b of the reflecting surface 22a shown in fig. 11) far from the supporting member 2a. Thus, by designing the reflecting surface 22a with a proper inclination angle, the requirement of reflecting the beam signal of the optical fiber 211 to the condensing lens 222 as shown in fig. 12 can be achieved.

The plurality of condensing lenses 222 are disposed on a side surface of the second optical fixture 2212 near the supporting member 2a, and are configured to respectively condense the beam signals reflected by the reflecting surface 22a to the plurality of coupling interfaces 12 on the optical chip 1, which are spaced apart along the first direction P. Thereby, signal transmission of the optical fiber assembly 2b and the optical chip 1 is realized. Therefore, the optical transmission module 2 of the embodiment of the present application can transmit the optical beam signal of the optical fiber 211 to the coupling interface 12 of the optical chip 1 only through the reflecting surface 22a of the optical body assembly 221 and the condensing lens 222. Also, by designing an appropriate arc angle of the condensing lens 222, the height of the support 2a in the light transmission module 2 can be small. While the optical body assembly 221 may be disposed coplanar with the optical fiber array 21, the optical body assembly 221 may have a height slightly greater than the height of the optical fiber array 21, and the condensing lens 222 may have a thickness smaller than the height of the support 2a. Therefore, the whole optical transmission module 2 has a smaller height, can be applied to a scene where the height between the coupling interface 12 of the optical chip 1 and the substrate 10 is less than 5mm, and does not cause problems of deterioration of polarization maintaining performance and additional insertion loss.

It should be noted that, in the optical body assembly 221, the first optical fixture 2211 and the second optical fixture 2212, and the condenser lens 222 and the second optical fixture 2212 may be connected by an adhesive material. In manufacturing the optical body assembly 221, the surface of the first optical fixture 2211 near the first end 2111 of the optical fiber 211, the surface of the second optical fixture 2212 near the first end 2111 of the optical fiber 211, and the end surfaces of the first ends 2111 of the optical fibers 211 in the optical fiber array 21 may be formed by polishing. The optical body assembly 221 has a smaller volume, so that the volume of the optical transmission module 2 can be reduced, and the material cost of the optical transmission module 2 can be reduced.

The optical body assembly 221 may have other structures than the structure shown in fig. 12. In some embodiments of the present application, referring to fig. 13, the optical body assembly 221 includes a first optical fixture 2211, a second optical fixture 2212, and a reflective lens 2213. The first and second optical fixtures 2211 and 2212 in fig. 13 are similar in structure to the first and second optical fixtures 2211 and 2212 in fig. 12, except that: the surface of the first optical fixture 2211 near the first end 2111 of the optical fiber 211, the surface of the second optical fixture 2212 near the first end 2111 of the optical fiber 211, and the end surfaces of the first ends 2111 of the optical fibers 211 in the optical fiber array 21 in fig. 13 may be vertical surfaces to form the connection surface 22b. And the reflective lens 2213 has a plurality of outer surfaces, such as a plurality of outer surfaces including a first outer surface 2213a and a second outer surface 2213b disposed opposite to each other. The first outer surface 2213a of the reflective lens 2213 may be connected with the connection surface 22b described above. The second outer surface 2213b of the reflective lens 2213 may form the reflective surface 22a described above. The condenser lens 222 is disposed on a side surface of the reflective lens 2213 close to the support 2a. For example, the connection surface 22b shown in fig. 13 is a plane, and the longitudinal section of the reflective lens 2213 (perpendicular to the plane of the reflective lens 2213) is a right trapezoid. The condenser lens 222 is a convex lens protruding toward the optical chip 1 side. Therefore, in manufacturing the optical body assembly 221, the reflective lens 2213 and the condensing lens 222 can be manufactured as a unitary structure, thereby reducing the assembly steps. The reflective surface 22a of the reflective lens 2213 and the curved surface of the condenser lens 222 may be manufactured by a press molding process or by a polishing process. Both of these manufacturing processes can ensure the accuracy and reliability of the inclination angle of the reflecting surface 22a and the arc surface of the condenser lens 222.

The optical chip 1 is only provided with a row of a plurality of coupling interfaces 12 distributed along the first direction P, so that some application scenes with low requirements on optical channel density can be satisfied. For applications where the optical channel density is high, such as an optical module with a pool of light sources, the optical fiber array 21 in the optical module 30 needs to transmit both the light source and the light beam signal. Therefore, multiple sets of fiber arrays 21 are often required to deliver the light source and beam signals.

Therefore, as shown in fig. 14, the optical chip 1 of the embodiment of the present application is provided with a plurality of rows of coupling interfaces 12 on the first surface 1a (a plurality of coupling interfaces 12 distributed along the first direction P are referred to as a row of coupling interfaces 12), and the plurality of rows of coupling interfaces 12 are distributed at intervals along the second direction Q. In other words, the first surface 1a of the optical chip 1 has a plurality of coupling interfaces 12 arranged in an array. Accordingly, the optical transmission module 2 includes a plurality of sets of the above-described optical fiber assemblies 2b as shown in fig. 15, and the plurality of sets of the optical fiber assemblies 2b are stacked on the support member 2 a. And, the lengths of the plurality of groups of optical fiber assemblies 2b decrease in order in the direction approaching the support 2 a. Thus, the first ends 2111 of the plurality of sets of fiber optic assemblies 2b may each correspond to a plurality of rows of coupling interfaces 12 on the optical chip 1. Fig. 14 and 15 each show that the optical chip 1 has two rows of coupling interfaces 12 on the first surface 1a, and the optical transmission module 2 includes two groups of optical fiber assemblies 2b, where the two groups of optical fiber assemblies 2b respectively correspond to the two rows of coupling interfaces 12. Therefore, the reflecting surfaces 22a in the optical fiber assemblies 2b can reflect the beam signals transmitted by the optical fiber arrays 21 to the condensing lenses 222 of the fixing devices 22. The plurality of condensing lenses 222 of the fixing device 22 in the plurality of groups of optical fiber assemblies 2b can respectively condense the beam signals reflected by the plurality of reflecting surfaces 22a to the plurality of coupling interfaces 12 distributed along the second direction Q on the optical chip 1. Thus, the optical module 30 can be applied to an installation scene with a small height space, and can meet the requirement of high channel density.

At a distance H between the first surface 1a of the optical chip 1 and the substrate 10 ₂ For example, as shown in fig. 16, 3 rows of coupling interfaces 12 may be provided on the optical chip 1. The optical module 30 includes 3 sets of optical fiber assemblies 2b sequentially stacked on the support 2 a. The range W of the total thickness of the optical fiber array 21 and the optical body assembly 221 in each set of optical fiber assemblies 2b ₀ From 1.2mm to 1.5mm, and the thickness W of the support 2a ₁ Can be 0.3mm to meet the signal transmission of the optical moduleAnd (5) inputting requirements. In particular, the group of fiber optic assemblies 2ba located at the top layer corresponds to the row of coupling interfaces 12a furthest from the support 2 a. While a layer of fiber optic assemblies 2bb in the middle layer corresponds to a row of coupling interfaces 12b in the middle position. While the group of fiber optic assemblies 2bc located at the bottom corresponds to the row of coupling interfaces 12c closest to the support 2 a. And, for each group of the optical fiber arrays 21, there are 40 optical fibers 211, and the distance D between two adjacent coupling interfaces 12 along the first direction P on the optical chip 1 ₁ A spacing D of 127 μm between two adjacent coupling interfaces 12 in the second direction Q ₂ An optical module 30 of 3mm, the optical channel density of the optical module 30 may be 11.1ch/mm ² (channel/square millimeters) above.

While figure 17 shows an optical module 30 in which the first ends 2111 of the optical fibers 211 of the 3-group optical fiber assembly 2b are bent. Thus, the connection of the optical fiber 211 with the coupling interface 12 is achieved. Taking the above parameters as an example of the optical module 30, the optical module 30 of FIG. 17 has a density of 2.574ch/mm ² . Therefore, compared to the optical module 30 shown in fig. 17, the optical channel density of the optical module 30 of the embodiment of the present application is improved by more than 4 times. While fig. 17 shows an optical module 30 with equal insertion loss or a small difference between insertion loss at the coupling interface 12 and insertion loss of the optical module 30 of the embodiment of the present application (e.g., about 0.5dB for both optical modules 30).

It should be noted that, in order to avoid mutual interference of the light beam signals transmitted by the two adjacent condensing lenses 222 along the second direction Q in the two adjacent groups of light transmission modules 2, in the embodiment of the present application, the distance D between the two adjacent coupling interfaces 12 distributed along the second direction Q ₂ Is more than 0.7 mm. In other words, the scheme of stacking multiple groups of fiber optic assemblies 2b of the embodiments of the present application may be adapted to have a spacing D between two adjacent coupling interfaces 12 distributed along the second direction Q ₂ An optical chip 1 of 0.7mm or more.

For an optical transmission module 2 having multiple rows of optical fiber assemblies 2b, the multiple rows of optical fiber assemblies 2b in the optical transmission module 2 may each employ the above-described structure scheme of the optical fiber assemblies 2b, as shown in fig. 16 and fig. 18. And, the multi-row optical fiber assembly 2b in the optical transmission module 2 can also adopt other structures.

For example, the reflective lenses 2213 and the condensing lenses 222 in the multi-row optical fiber assembly 2b of the optical transmission module 2 may be integrally constructed to reduce the assembling steps. For example, the optical body assembly 221 in the optical transmission module 2 is further provided with an optical connector 2214 as shown in fig. 19 on the basis of the structure shown in fig. 18, and the optical connector 2214 connects the reflective lens 2213 in the same optical fiber assembly 2b with the reflective lens 2213 in an adjacent group of optical fiber assemblies 2 b. Thus, the optical body assemblies 221 in the plurality of sets of optical fiber assemblies 2b may be connected as a unitary structure by the optical connection 2214. For example, the optical connection 2214 may be a connection lens. The optical connector 2214, the reflective lens 2213 and the condensing lens 222 are made of the same material. Therefore, the reflective lens 2213, the optical connector 2214 and the condensing lens 222 of the optical body assembly 221 in the optical fiber assembly 2b can be manufactured by an integral molding process to obtain an integral structure, so that the mounting steps of the optical module 30 are further reduced.

The above describes different versions of the main structure of the fiber optic assembly 2b in the optical module 30. With the optical fiber assembly 2b having the above-described structure, a gap is provided between the condensing lens 222 and the coupling interface 12 of the optical chip 1 in the optical fiber assembly 2b, and the condensing lens 222 and the coupling interface 12 are easily affected in optical performance by impurities such as dust and moisture in the outside air. Accordingly, the fiber optic assembly 2b in some embodiments of the present application further includes a sealing structure for sealing the condenser lens 222 from the coupling interface 12. The sealing structure may be various, and the sealing structure is exemplified below.

For the spacing (or maximum spacing) D between the condenser lens 222 and the coupling interface 12 ₃ Smaller versions, as shown in fig. 20, the sealing structure may be a sealing layer 23. The sealing layer 23 may be filled between the condensing lens 222 and the coupling interface 12 of the corresponding optical chip 1, and wrap the coupling structure of the condensing lens 222 and the corresponding optical chip 1. The sealing structure is simpler. For example, the sealing layer 23 is an optical path adhesive layer. The optical path adhesive layer has low price and good optical performance such as transmissivity and refractive index. And, at the thickness W of the optical path adhesive layer ₁ Less than 50 μmThe light path glue is not easy to deform in the baking process, so that the light path glue can be suitable for application scenes with smaller space between the condensing lens 222 and the coupling interface 12.

Whereas for the distance (or maximum distance) D between the condenser lens 222 and the coupling interface 12 of the corresponding optical chip 1 ₃ Larger, e.g. spacing (or maximum spacing) D between the condensing lens 222 and the coupling interface 12 of the corresponding optical chip 1 ₃ And the thickness of the light path adhesive layer is larger than 50 mu m, and the light path adhesive layer with excessive thickness is easy to deform in the baking process. Therefore, in some embodiments of the present application, the optical fiber assembly 2b further includes an optical pad 24 as shown in fig. 21, where the optical pad 24 is disposed between the sealing layer 23 and the coupling interface 12 of the corresponding optical chip 1. The optical pad 24 may cover the coupling interface 12 of the optical chip 1 and be fixed on the first surface 1a of the optical chip 1 by an adhesive material. Thus, the coupling interface 12 of the optical chip 1 is sealed. And, by adjusting the thickness of the optical spacer 24, the thickness W of the optical path adhesive layer can be controlled ₁ Less than 50 μm. Therefore, on the premise of ensuring the sealing effect of the condensing lens 222, the deformation of the light path adhesive in the baking process can be avoided.

It should be noted that, when the optical module 30 is assembled, a horizontal microscope may be used to monitor the distance (or maximum distance) D between the plurality of condensing lenses 222 and the plurality of coupling interfaces 12 on the optical chip 1 ₃ . If the distance between one condensing lens 222 and one coupling interface 12 on the optical chip 1 is smaller than 50 μm, the optical path glue is directly filled between the condensing lens 222 and the coupling interface 12 on the optical chip 1, and the whole condensing lens 222 and the coupling interface 12 on the optical chip 1 are wrapped. If the distance between one condensing lens 222 and one coupling interface 12 on the optical chip 1 is larger than 50 μm, a proper thickness W is selected ₂ An optical pad 24 (e.g. 150 μm) is fixed to the coupling interface 12 on the optical chip 1. Then, the optical spacer 24 and the condenser lens 222 are filled with optical path glue so that the thickness W of the filled optical path glue ₁ Less than 50 μm.

For the optical transmission module 2 having 3 or more optical fiber assemblies 2b, the above two sealing structures may cause excessive assembly steps of the optical module 30. Therefore, the optical module 30 of the embodiment of the present application further includes an airtight cover 25 as shown in fig. 22, and the airtight cover 25 is directly covered outside the optical transmission module 2. The hermetic cover 25 may isolate the condensing lens 222, the coupling interface 12 of the optical chip 1, and the external environment. Thus, sealing of the coupling interface 12 of the condenser lens 222 and the optical chip 1 is achieved.

It should be noted that, for the circuit board assemblies 200 with different structures, the cover arrangement of the airtight cover 25 may be different. For example, as shown in fig. 23, the optical chip 1 is disposed at a distance from the electrical chip 20. The airtight cover 25a is provided outside the optical chip 1 and the optical transmission module 2. The lower edge of the airtight cover 25a is connected to the substrate 10.

As another example, as shown in fig. 24, the optical chip 1 is flip-chip mounted on the electrical chip 20. The airtight cover 25b is provided outside the optical chip 1, the optical transmission module 2, and the electrical chip 20. Specifically, the lower edge of the airtight cover 25b is connected to the substrate 10. Alternatively, the inner surface of the airtight cover 25b is connected to the side surface of the substrate 10. Thus, the airtight cover 25b can isolate the optical chip 1, the optical transmission module 2 and the electrical chip 20 in the circuit board assembly 200 from the outside, and the circuit board assembly 200 is less affected by the outside.

It will be appreciated that when the optical fiber array 21 needs to be connected to an external device by passing through the airtight cover 25, a sealing joint (sealing joint) 251 as shown in fig. 25 is provided on the airtight cover 25, and the sealing joint 251 corresponds to the position of the optical fiber array 21 in the optical transmission module 2. The optical fiber array 21 in the optical transmission module 2 passes out of the airtight cover 25 through the inside of the sealing joint 251, while also maintaining the tightness of the inside of the airtight cover 25.

Taking the case that the sealing structure includes the sealing layer 23 as an example, the assembling step of the optical module 30 includes the following steps:

s100: the optical fiber assembly 2b is assembled. For example, after the first optical fixture 2211 and the second optical fixture 2212 clamp and fix the optical fiber array 21, the reflection surface 22a is formed by a grinding process. And then the space between the upper surface of the condensing lens 222 and the optical fiber array 21 is monitored by using the beam analyzer, and the orientation of the condensing lens 222 is adjusted until the light spots formed by the condensing lenses 222 or selected condensing lenses 222 in the optical fiber assembly 2b meet the preset requirements. Then, the condensing lens 222 and the second optical fixture 2212 are fixed by an adhesive material. The above steps are performed multiple times, so as to obtain multiple groups of optical fiber assemblies 2b corresponding to the multiple coupling interfaces 12 distributed along the second direction Q on the optical chip 1. Wherein the focal length of the condensing lens 222 and the thickness of the substrate in the condensing lens 222 (the condensing lens 222 includes a substrate and a convex lens disposed on the substrate) used in the plurality of groups of optical fiber assemblies 2b may be different, so as to adapt to the positions of the coupling interfaces 12 with different height requirements.

S200: a plurality of sets of optical fiber assemblies 2b are stacked on the support 2a. For example, the specific assembly steps of the multiple sets of fiber optic modules 2b are as follows: one end of a group of optical fiber assemblies 2b (the lowest optical fiber assembly 2 b) is first placed above a row of coupling interfaces 12 located at the edge position in the second direction Q in the array of coupling interfaces 12 on the optical chip 1. Then, the light source is connected to the test loop of the optical fiber assembly 2b, and the position of the optical fiber assembly 2b above the coupling interface 12 is adjusted. The optical link insertion loss of the test loop is monitored until the insertion loss of the optical link is adjusted to be the lowest, and the specific installation position of the optical fiber assembly 2b is obtained. After that, a support 2a of an appropriate size is selected to be fixed on the optical chip 1. The optical fiber assembly 2b is then fixed with the support member 2a, and the assembly of the bottommost group of optical fiber assemblies 2b is completed. The above steps are then repeated to perform the means of upper layer fiber assembly 2b. The position of the optical fiber assembly 2b on the upper layer is adjusted based on the top of the optical fiber assembly 2b on the lower layer, so that the insertion loss of the whole optical link of the optical fiber assembly 2b is minimized, and then the curing operation of the optical fiber assembly 2b is performed. And so on until the assembly of the plurality of sets of fiber optic assemblies 2b is completed.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An optical transmission module, comprising:

a support;

an optical fiber assembly for placement on the support; the optical fiber assembly includes:

an optical fiber array including a plurality of optical fibers arranged side by side along a first direction;

the fixing device comprises an optical main body assembly and a plurality of condensing lenses, wherein the optical main body assembly is used for fixing first ends of a plurality of optical fibers in the optical fiber array; the optical main body component is provided with a reflecting surface which is used for correspondingly reflecting the light beam signals transmitted by the optical fibers to the condensing lenses respectively; the plurality of condensing lenses are spaced apart along the first direction on the optical body assembly and are located on a side close to the support; the condensing lenses are used for converging the beam signals reflected by the reflecting surface to a plurality of coupling interfaces which are distributed on the optical chip at intervals along the first direction.

2. The optical transmission module of claim 1, wherein the optical body assembly comprises:

a first optical mount;

the second optical fixing piece is arranged opposite to the first optical fixing piece; first ends of a plurality of optical fibers in the optical fiber array are clamped between the first optical fixing piece and the second optical fixing piece; the surface of the first optical fixing piece, which is close to the first end of the optical fiber, and the surface of the second optical fixing piece, which is close to the first end of the optical fiber, are connected with the end surfaces of the first ends of the optical fibers in the optical fiber array so as to form the reflecting surface; the condensing lens and the supporting piece are arranged on the surface of one side, far away from the first optical fixing piece, of the second optical fixing piece.

3. The optical transmission module of claim 1, wherein the optical body assembly comprises:

a first optical mount;

the second optical fixing piece is positioned below the first optical fixing piece, and first ends of a plurality of optical fibers in the optical fiber array are clamped between the first optical fixing piece and the second optical fixing piece; the surface of the first optical fixing piece, which is close to the first end of the optical fiber, and the surface of the second optical fixing piece, which is close to the first end of the optical fiber, are connected with the end surfaces of the first ends of the optical fibers in the optical fiber array to form a connecting surface;

The first outer surface of the reflecting lens is connected with the connecting surface; the reflecting surface is formed on a second outer surface of the reflecting lens, the second outer surface being opposite to the first outer surface; the condensing lens is arranged on one side surface of the reflecting lens, which is close to the supporting piece; the reflecting lens and the condensing lens are of an integrated structure.

4. A light transmission module as recited in any one of claims 1-3, wherein the reflective surface is an arcuate surface or a reflective bevel that is convex toward the outside; the side edge of the reflecting surface, which is close to the supporting piece, is positioned on the outer side of the side edge of the reflecting surface, which is far away from the supporting piece.

5. The optical transmission module of any one of claims 1-4, wherein the fiber optic assembly further comprises:

and the sealing layer is used for being filled between the condensing lens and the coupling interface of the corresponding optical chip and covering the coupling interfaces of the condensing lens and the corresponding optical chip.

6. The optical transmission module of claim 5, wherein the sealing layer is an optical path glue layer.

7. The optical transmission module of claim 5 or 6, wherein the fiber optic assembly further comprises:

And the optical gasket is used for being arranged between the sealing layer and the coupling interface of the corresponding optical chip and covering the coupling interface of the optical chip.

8. The optical transmission module according to any one of claims 1 to 7, wherein the optical transmission module includes a plurality of groups of the optical fiber assemblies, the plurality of groups of the optical fiber assemblies are sequentially stacked on the support member, and lengths of the plurality of groups of the optical fiber assemblies are sequentially decreased in a direction approaching the support member; the reflecting surfaces in the optical fiber assemblies are respectively used for reflecting the light beam signals transmitted by the optical fiber arrays to the condensing lenses of the fixing devices; the plurality of condensing lenses of the fixing device in the optical fiber assembly are used for converging the light beam signals reflected by the reflecting surfaces to a plurality of coupling interfaces distributed on the optical chip along the second direction.

9. The optical transmission module of claim 8, wherein a set of the optical body assemblies comprises:

a first optical mount;

The first outer surface of the reflecting lens is connected with the connecting surface; the reflecting surface is formed on a second outer surface of the reflecting lens, the second outer surface being opposite to the first outer surface; the condensing lens is arranged on one side surface of the reflecting lens, which is close to the supporting piece;

an optical connection connecting the reflective lenses in the same set of the fiber optic assemblies with the reflective lenses in an adjacent set of the fiber optic assemblies; and the reflection lenses, the optical connecting pieces and the condensing lenses of the optical main body assemblies in the optical fiber assemblies are of an integrated structure.

10. The optical transmission module of any one of claims 1-9, wherein the total thickness of the array of optical fibers in the set of optical fiber assemblies and the optical body assembly in the fixture is in the range of 1.2-1.5mm; the thickness of the support is 0.3mm.

11. An optical module, comprising:

the optical chip is provided with a plurality of coupling interfaces on the first surface, and the coupling interfaces are distributed at intervals along the first direction;

the optical transmission module of any one of the preceding claims 1-10, wherein a support in the optical transmission module is provided on the optical chip; the light transmission module comprises a plurality of light transmission lenses, a plurality of reflecting surfaces and a plurality of coupling interfaces, wherein the light transmission lenses are used for respectively converging light beam signals reflected by the reflecting surfaces to the plurality of coupling interfaces which are distributed on the light chip at intervals along the first direction.

12. The optical module of claim 11, wherein the plurality of coupling interfaces distributed along the first direction is a row of the coupling interfaces; a plurality of rows of the coupling interfaces are arranged on the first surface of the optical chip and are distributed at intervals along the second direction;

the optical transmission module comprises a plurality of groups of optical fiber assemblies, the optical fiber assemblies are sequentially stacked on the supporting piece, and the lengths of the optical fiber assemblies are sequentially decreased along the direction approaching to the supporting piece; the reflecting surfaces in the optical fiber assemblies are respectively used for reflecting the light beam signals transmitted by the optical fiber arrays to the condensing lenses of the fixing devices; the plurality of condensing lenses of the fixing device in the optical fiber assembly are used for converging the light beam signals reflected by the reflecting surfaces to a plurality of coupling interfaces distributed on the optical chip along the second direction.

13. The light module as recited in claim 11 or 12, wherein the light module further comprises:

and the airtight cover is arranged outside the optical transmission module and is used for sealing the support piece, the optical fiber assembly and a plurality of coupling interfaces of the optical chip.

14. The optical module of any one of claims 11-13, wherein the plurality of coupling interfaces are each a grating coupling interface.

15. The optical module of claim 14, wherein a spacing between two adjacent coupling interfaces distributed along the second direction is 0.7mm or more.

16. A circuit board assembly, comprising:

a substrate;

an electrical chip disposed on the first region of the substrate;

the optical module of any one of the preceding claims 11-15, being arranged on the substrate and being connected to the electrical chip.

17. The circuit board assembly of claim 16, wherein the optical module is disposed on the second region of the substrate; the optical module is connected with the electric chip through the substrate;

the optical module further comprises an airtight cover, wherein the airtight cover is arranged outside the optical chip and the optical transmission module, and the lower edge of the airtight cover is connected with the substrate.

18. The circuit board assembly of claim 16, wherein the optical module is disposed on a side of the electrical chip remote from the substrate, and wherein a first surface of the optical chip in the optical module has a plurality of first connection portions; a plurality of second connecting parts are arranged on the surface of one side, far away from the substrate, of the electric chip; a partial region of the first surface of the optical chip, which is provided with the plurality of first connecting parts, is opposite to a partial region of the electrical chip, which is provided with the second connecting parts, and the first connecting parts are connected with the second connecting parts; the partial areas with the plurality of coupling interfaces on the first surface of the optical chip are opposite to the substrate, and the optical transmission module in the optical module is positioned between the optical chip and the substrate;

The optical module further comprises an airtight cover, and the airtight cover is arranged outside the optical chip, the optical transmission module and the electric chip.

19. An optical network device comprising a housing and the circuit board assembly of any one of claims 16-18 disposed within the housing.

20. The optical network device of claim 19, wherein the optical network device is a router.