CN117252151A - A method, system and medium for sinking the center area of QFP packaged device EPad - Google Patents
A method, system and medium for sinking the center area of QFP packaged device EPad Download PDFInfo
- Publication number
- CN117252151A CN117252151A CN202311388241.3A CN202311388241A CN117252151A CN 117252151 A CN117252151 A CN 117252151A CN 202311388241 A CN202311388241 A CN 202311388241A CN 117252151 A CN117252151 A CN 117252151A
- Authority
- CN
- China
- Prior art keywords
- epad
- sinking
- area
- data
- central
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2113/00—Details relating to the application field
- G06F2113/18—Chip packaging
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Processing Or Creating Images (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention discloses a method, a system and a medium for processing the subsidence of an EPad central area of a QFP packaging device, and belongs to the field of EDA layout simulation. Aiming at the problems that the existing EPad central area sinking depends on the slow manual operation efficiency and the complicated operation, the invention provides a QFP packaging device EPad central area sinking processing method, which comprises the following steps: acquiring data of an EPad area and sinking processing parameters in the EPad area; constructing an EPad sinking dividing region; forming point sets of different areas by all line segment data of the EPad area; calculating EPad corner region data; and modeling the calculated model data to finish the sinking processing of the central region of the EPad. The invention uses the area as a unit to carry out the integral operation, thereby avoiding the situations of low efficiency and easy operation error caused by manually editing one by one in the past; the modeling method and the modeling device have the advantages that a user can intuitively and quickly see the modeling effect conveniently, and under the condition that EPad area data are complex, operation processing can be performed quickly and efficiently, and the efficiency and the precision are guaranteed.
Description
Technical Field
The invention belongs to the technical field of EDA model layout simulation, and particularly relates to a method, a system and a medium for processing subsidence of an EPad central area of a QFP packaging device.
Background
QFP (Quad Flat Package ) is a surface mount integrated circuit package whose device lead angles extend in four lateral directions. In the QFP related package design of PCB data, a large copper sheet is provided in the middle area, i.e., the Pad (Exposed Pad). In order to increase power consumption and heat dissipation efficiency, many designs require sinking of the EPad center area to better contact the PCB heat dissipation pad and ensure the best heat dissipation effect. The conventional EPad center area sinking processing method is that after two-dimensional data is imported into a three-dimensional scene, manual editing operation is carried out, including operations such as stretching copying, cutting, translation and the like, so that a final modeling effect is achieved, when model data are simple, the operation is easy, but the whole operation process is inconvenient for a user to intuitively and rapidly see the modeling effect; after the model is complex, the operation is troublesome.
Disclosure of Invention
1. Problems to be solved
Aiming at the problems that the existing EPad central area sinking depends on the manual operation and has low efficiency and complicated operation, the invention provides a method, a system and a medium for processing the EPad central area sinking of a QFP packaging device. The invention uses the area as a unit to carry out the integral operation, thereby avoiding the situations of low efficiency and easy operation error caused by manually editing one by one in the past; the modeling method and the modeling device have the advantages that a user can intuitively and quickly see the modeling effect conveniently, and under the condition that EPad area data are complex, operation processing can be performed quickly and efficiently, and the efficiency and the precision are guaranteed.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
A sinking processing method for an EPad central area of a QFP packaging device comprises the following steps:
acquiring data of an EPad area and sinking processing parameters in the EPad area, wherein the EPad area comprises a central sinking area and a plurality of pin areas; the data comprises point data and line segment data; the sinking processing parameters comprise sinking width, sinking height, sinking depth and modeling thickness;
constructing a primary EPad sinking dividing region, wherein the primary EPad sinking dividing region comprises a central sinking region and a plurality of pin regions;
traversing all line segment data of the EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of the primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas;
after expanding the central sinking region in the EPad sinking dividing region, reconstructing a secondary EPad sinking dividing region, traversing all line segment data of the EPad region, judging that each line segment data belongs to the central sinking region or a plurality of pin regions of the secondary EPad sinking dividing region, and forming a secondary point set of the central sinking region and a secondary point set of the plurality of pin regions; the value of the expansion is a modeled thickness value;
calculating the EPad corner region data: intersecting the secondary point set of the center sinking area with the primary point sets of the plurality of pin areas to obtain EPad corner area data;
modeling operation is carried out on the calculated model data, and the sinking processing of the EPad central area is completed; the model data includes EPad corner region data, secondary point set data for a center dip region, and primary point set data for a plurality of pin regions.
Further, when the EPad sinking dividing region is built once, a two-dimensional coordinate system is built by taking the central point of the central sinking region in the EPad region as an origin coordinate, and the plurality of pin regions are respectively positioned in different quadrants in the two-dimensional coordinate system.
Further, the step of constructing the primary EPad sink divided area specifically includes the following steps:
constructing an outer boundary region of the model data;
constructing a polygonal area where the central sinking area is located;
and calculating the areas where the pins are positioned based on the polygonal areas where the outer boundary areas and the central sinking areas are positioned, so as to construct the polygonal areas where the pins are positioned.
Further, when all line segment data of the EPad area are traversed, and when a certain line segment belongs to a certain area, judging that two points of the line segment are in the area; when a certain line segment intersects a certain area, the intersection point of the line segment and the area is judged to be in the area.
Further, the specific steps of modeling the calculated model data are as follows:
directly stretching the secondary point set data of the central sinking area, and then translating downwards, wherein the stretched value is a modeled thickness value; the value of the downward translation is the depth value of sinking;
stretching the primary point set data of the plurality of pin areas downwards, wherein the downwards stretched value is a modeled thickness value;
stretching the EPad corner region data downward, followed by a downward translation; the value of the downward stretch is the depth value of the dip-the modeled thickness value; the value of the downward translation is the modeled thickness value.
A system for applying the method for processing the central area subsidence of the QFP package device EPad according to any one of the above claims, comprising:
and a data acquisition module: the method comprises the steps of acquiring data of an EPad area and sinking processing parameters in the EPad area;
the primary EPad sinking dividing region building module: the method is used for constructing an EPad sinking dividing region;
the primary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas;
the secondary EPad sinking divided area construction module: the method is used for constructing a secondary EPad sinking dividing region;
the secondary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a secondary EPad sinking dividing area, and forming a secondary point set of the central sinking area and a secondary point set of the plurality of pin areas;
the EPad corner region data calculation module: for computing EPad corner region data;
modeling module: and the method is used for modeling the calculated model data to finish the sinking processing of the central region of the EPad.
A computer-readable storage medium storing a computer program which, when executed by a processor, implements a method of QFP package EPad central area sinking processing as described in any one of the above.
3. Advantageous effects
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the invention, through the acquired data of the EPad area and sinking processing parameters in the EPad area, an EPad sinking dividing area is constructed, and a center sinking area and a plurality of pin areas are separately established; sequentially traversing line segments in the EPad region, judging which specific region the line segments belong to, and forming a point set; the modeling operation is automatically carried out by calculating the data of the plurality of pin areas and the corner area, so that the sinking processing of the central area of the EPad is completed; the method is simple and efficient, and facilitates the importing modeling operation of the QFP data by a user; the whole operation is carried out by taking the region as a unit, so that the situations of low efficiency, tedious operation and easy error caused by manually editing one by one in the past are avoided; the whole method greatly improves the degree of automatic processing and ensures the combination of efficiency and precision;
(2) The system has the advantages that the components of the system are simple, the sinking processing parameters of the central region of the EPad are set, the sinking processing region data, the pin data and the corner data are automatically calculated, the QFP is automatically modeled and displayed, the previous complicated operation is avoided, a user can intuitively and quickly see the modeling effect, the operation processing can be still quickly and efficiently carried out under the condition that the EPad region data is complex, and the user experience is greatly improved.
Drawings
FIG. 1 is a schematic overall flow chart of the present invention;
FIG. 2 is a schematic diagram showing setting of EPad sink processing parameters;
FIG. 3 is a schematic illustration of an EPad sink divided region;
FIG. 4 is a schematic diagram of an outer boundary region of EPad data;
FIG. 5 is a schematic diagram of the boundary of the central submerged region of the EPad.
Detailed Description
The invention is further described below in connection with specific embodiments and the accompanying drawings.
Example 1
As shown in fig. 1, fig. 1 is a schematic overall flow chart of the present application; the embodiment provides a method for sinking a central area of a QFP packaging device (EPad), which comprises the following steps:
s1: acquiring data of an EPad area and sinking processing parameters in the EPad area, wherein the EPad area comprises a central sinking area and a plurality of pin areas; the data comprises point data and line segment data; the sinking processing parameters comprise sinking width, sinking height, sinking depth and modeling thickness;
in step S1, the following is explained: the EPad area is of a two-dimensional polygonal structure and comprises a square, pins are respectively arranged on four vertexes of the square, and the four pins extend to four side directions respectively; therefore, in this embodiment, four pins are taken as an example for illustration; namely, when the EPad area is acquired, the EPad area comprises a center sinking area and four pin areas; each region consists of points and line segments, so that the point data and the line segment data of each region are acquired, and subsequent modeling and calculation are facilitated; meanwhile, the sinking processing parameters are shown in fig. 2, which are determined according to different conditions, the application is not particularly limited, and the actual sinking conditions can be determined;
s2: constructing a primary EPad sinking dividing region, wherein the primary EPad sinking dividing region comprises a central sinking region and a plurality of pin regions; importing an EPad region model according to the acquired data of the EPad region, wherein the model is two-dimensional data, and the center sinking region is a polygon for calculating a center region and four pin regions; when the EPad subsidence dividing region is built once, a two-dimensional local coordinate system is built by taking the central point of the central subsidence region in the EPad region as an origin coordinate, and the central subsidence region is positioned in the quadrant Polyon 00; the plurality of pin areas are respectively positioned in different quadrants in the two-dimensional coordinate system; that is, the two-dimensional local coordinate system has four quadrants, the four pins are respectively located in the four quadrants (the pin at the upper right corner is located in the first quadrant region Polygon01, the pin at the upper left corner is located in the second quadrant region Polygon02, the pin at the lower left corner is located in the third quadrant region Polygon03, and the pin at the lower right corner is located in the fourth quadrant region Polygon 04), as shown in fig. 3;
the step S2 specifically comprises the following steps:
s21: constructing an outer boundary region of model data (i.e., an EPad region model); specifically, in this step, the maximum value xMax, yMax of the model data is first calculated; xMax, yMax, is the position of the x-axis and y-axis where the point of the extreme edge of the guide pin is located; then, four points on the outer boundary of the model data are respectively (2 x max, 0), (0, 2 x ymax), (-2 x max, 0), (0, -2 x ymax); the outer boundary areas of the model data formed by sequentially connecting the four points are shown in fig. 4;
s22: constructing a polygonal area where the central sinking area is located; specifically, in this step, according to the Width and the Height in the sinking processing parameters in the EPad area, a Polygon area Polygon00 where the central sinking area is located is constructed, and four points on the boundary of Polygon00 are (Width, 0), (0, height), (-Width, 0), (0, -Height) in order; the polygonal area where the four points are connected in sequence to form the central sinking area is shown in fig. 5;
s23: calculating the areas where the plurality of pins (namely four pins) are positioned based on the polygonal areas where the outer boundary areas and the central sinking areas are positioned, so as to construct the polygonal areas where the plurality of pins are positioned; specifically, in this step, the upper boundary point of the Polygon01 is (Width, 0), (2×xmax, 0), (0, 2×ymax), (0, height) in order; the boundary points on Polygon02 are (0, height), (0, 2 x ymax), (-2 x max, 0), (-Width, 0) in order; the upper boundary points of Polygon03 are (-Width, 0), (-2 x max, 0), (0, -2 x ymax), (0, -Height) in order; the boundary points on Polygon04 are (0, -Height), (0, -2 x ymax), (2 x xmax, 0), (Width, 0) in order; four points in each quadrant are connected in turn to form the area where the four pins are located, respectively.
S3: traversing all line segment data of the EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of the primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas; specifically, when a certain line segment belongs to a certain region, judging that two points of the line segment are in the region; when a certain line segment intersects a certain area, judging that the intersection point of the line segment and the area is in the area; therefore, after all the points are collected, five point sets, namely Center00 (point set in the Center sinking area), lead01 (point set in the first quadrant), lead02 (point set in the second quadrant), lead03 (point set in the third quadrant) and Lead04 (point set in the fourth quadrant), are formed in five areas (the Center sinking area and the four pin areas);
s4: the central subsidence area (namely, the polygonal area where the central subsidence area is located) in the EPad subsidence area is expanded, and then a secondary EPad subsidence area is reconstructed (the step of constructing the secondary EPad subsidence area is the same as the step S2, so that a secondary central subsidence area Polygon05 is formed, the Polygon05 is combined with the outer boundary of the model, new four pin division areas Polygon06, polygon07, polygon08 and Polygon09 are calculated, all line segment data of the EPad area are traversed, and each line segment data is judged to belong to the central subsidence area or a plurality of pin areas of the secondary EPad subsidence area (the step is the same as the step S3), and a secondary point set of the central subsidence area and a secondary point set of a plurality of pin areas are formed, so that Center01, lead05, lead06, lead07 and Lead08 are formed; the value of the expansion is a modeled thickness value;
s5: calculating the EPad corner region data: intersecting the secondary point set of the center sinking area with the primary point sets of the plurality of pin areas to obtain EPad corner area data; specifically, in this step, the calculated Center region data Center01 and the pin region data are intersected, and four corner region data are calculated: the area where Center01 intersects Lead01 is Corner01, the area where Center01 intersects Lead02 is Corner02, the area where Center01 intersects Lead03 is Corner03, and the area where Center01 intersects Lead04 is Corner04;
s6: modeling operation is carried out on the calculated model data, and the sinking processing of the EPad central area is completed; the model data comprises EPad corner area data, secondary point set data of a center sinking area and primary point set data of a plurality of pin areas; specifically, the method comprises the following steps:
directly stretching the secondary point set data Center01 of the central sinking area, and then translating downwards, wherein the stretched value is a modeled thickness value; the value of the downward translation is the depth value of sinking;
stretching the primary point set data read 01, read 02, read 03 and read 04 of the plurality of pin areas downwards, wherein the downwards stretched value is a modeled thickness value;
stretching the EPad Corner region data Corner01, corner02, corner03, corner04 downward, followed by translation downward; the value of the downward stretch is the depth value of the dip-the modeled thickness value; the value of the downward translation is the modeled thickness value.
According to the invention, through the acquired data of the EPad area and sinking processing parameters in the EPad area, an EPad sinking dividing area is constructed, and a center sinking area and a plurality of pin areas are separately established; sequentially traversing line segments in the EPad region, judging which specific region the line segments belong to, and forming a point set; the modeling operation is automatically carried out by calculating the data of the plurality of pin areas and the corner area, so that the sinking processing of the central area of the EPad is completed; the method is simple and efficient, and facilitates the importing modeling operation of the QFP data by a user; the whole operation is carried out by taking the region as a unit, so that the situations of low efficiency, tedious operation and easy error caused by manually editing one by one in the past are avoided; the whole method greatly improves the degree of automatic processing and ensures the combination of efficiency and precision.
Example 2
A system for applying the method for processing the central area subsidence of the QFP package device EPad according to any one of the above claims, comprising:
and a data acquisition module: the method comprises the steps of acquiring data of an EPad area and sinking processing parameters in the EPad area;
the primary EPad sinking dividing region building module: the method is used for constructing an EPad sinking dividing region;
the primary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas;
the secondary EPad sinking divided area construction module: the method is used for constructing a secondary EPad sinking dividing region;
the secondary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a secondary EPad sinking dividing area, and forming a secondary point set of the central sinking area and a secondary point set of the plurality of pin areas;
the EPad corner region data calculation module: for computing EPad corner region data;
modeling module: and the method is used for modeling the calculated model data to finish the sinking processing of the central region of the EPad.
The system has the advantages that the components of the system are simple, the sinking processing parameters of the central region of the EPad are set, the sinking processing region data, the pin data and the corner data are automatically calculated, the QFP is automatically modeled and displayed, the previous complicated operation is avoided, a user can intuitively and quickly see the modeling effect, the operation processing can be still quickly and efficiently carried out under the condition that the EPad region data is complex, and the user experience is greatly improved.
Example 3
A computer-readable storage medium storing a computer program which, when executed by a processor, implements a method of QFP package EPad central area sinking processing as described in any one of the above. It should be noted that, for a person skilled in the art, it is fully possible to implement the same program in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers, etc. by logic programming the method steps, except for implementing the system and the respective modules provided in the present application in a pure computer readable program code. Therefore, the system and each module thereof provided in the present application may be regarded as a hardware component, and the modules included therein for implementing various programs may be regarded as structures in the hardware component, and the modules for implementing various functions may be regarded as structures in both the hardware component and the software program for implementing the method.
The examples of the present invention are merely for describing the preferred embodiments of the present invention, and are not intended to limit the spirit and scope of the present invention, and those skilled in the art should make various changes and modifications to the technical solution of the present invention without departing from the spirit of the present invention.
Claims (7)
1. A sinking processing method for an EPad central area of a QFP packaging device is characterized by comprising the following steps of: the method comprises the following steps:
acquiring data of an EPad area and sinking processing parameters in the EPad area, wherein the EPad area comprises a central sinking area and a plurality of pin areas; the data comprises point data and line segment data; the sinking processing parameters comprise sinking width, sinking height, sinking depth and modeling thickness;
constructing a primary EPad sinking dividing region, wherein the primary EPad sinking dividing region comprises a central sinking region and a plurality of pin regions;
traversing all line segment data of the EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of the primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas;
after expanding the central sinking region in the EPad sinking dividing region, reconstructing a secondary EPad sinking dividing region, traversing all line segment data of the EPad region, judging that each line segment data belongs to the central sinking region or a plurality of pin regions of the secondary EPad sinking dividing region, and forming a secondary point set of the central sinking region and a secondary point set of the plurality of pin regions; the value of the expansion is a modeled thickness value;
calculating the EPad corner region data: intersecting the secondary point set of the center sinking area with the primary point sets of the plurality of pin areas to obtain EPad corner area data;
modeling operation is carried out on the calculated model data, and the sinking processing of the EPad central area is completed; the model data includes EPad corner region data, secondary point set data for a center dip region, and primary point set data for a plurality of pin regions.
2. The method for sinking the central area of the QFP package device EPad according to claim 1, wherein the method comprises the steps of: when the EPad sinking dividing region is built once, a two-dimensional coordinate system is built by taking the central point of the central sinking region in the EPad region as an origin coordinate, and the plurality of pin regions are respectively positioned in different quadrants in the two-dimensional coordinate system.
3. The method for sinking the central area of the QFP package device EPad according to claim 2, wherein the method comprises the steps of: the construction of the primary EPad sink divided region specifically comprises the following steps:
constructing an outer boundary region of the model data;
constructing a polygonal area where the central sinking area is located;
and calculating the areas where the pins are positioned based on the polygonal areas where the outer boundary areas and the central sinking areas are positioned, so as to construct the polygonal areas where the pins are positioned.
4. The method for sinking the central area of the QFP package device EPad according to claim 1, wherein the method comprises the steps of: when all line segment data of the EPad area are traversed, and when a certain line segment belongs to a certain area, judging that two points of the line segment are in the area; when a certain line segment intersects a certain area, the intersection point of the line segment and the area is judged to be in the area.
5. The method for sinking the central area of the QFP package device EPad according to claim 1, wherein the method comprises the steps of: the specific steps of modeling operation on the calculated model data are as follows:
directly stretching the secondary point set data of the central sinking area, and then translating downwards, wherein the stretched value is a modeled thickness value; the value of the downward translation is the depth value of sinking;
stretching the primary point set data of the plurality of pin areas downwards, wherein the downwards stretched value is a modeled thickness value;
stretching the EPad corner region data downward, followed by a downward translation; the value of the downward stretch is the depth value of the dip-the modeled thickness value; the value of the downward translation is the modeled thickness value.
6. A system applying the method for processing the central area subsidence of the pad of the QFP package device EPad according to any one of claims 1 to 5, characterized in that: comprising the following steps:
and a data acquisition module: the method comprises the steps of acquiring data of an EPad area and sinking processing parameters in the EPad area;
the primary EPad sinking dividing region building module: the method is used for constructing an EPad sinking dividing region;
the primary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a primary EPad sinking dividing area, and forming a primary point set of the central sinking area and a primary point set of the plurality of pin areas;
the secondary EPad sinking divided area construction module: the method is used for constructing a secondary EPad sinking dividing region;
the secondary point set construction module: the method comprises the steps of traversing all line segment data of an EPad area, judging that each line segment data belongs to a central sinking area or a plurality of pin areas of a secondary EPad sinking dividing area, and forming a secondary point set of the central sinking area and a secondary point set of the plurality of pin areas;
the EPad corner region data calculation module: for computing EPad corner region data;
modeling module: and the method is used for modeling the calculated model data to finish the sinking processing of the central region of the EPad.
7. A computer-readable storage medium storing a computer program, characterized by: the computer program, when executed by a processor, implements a method for processing a central area dip of a QFP package device EPad according to any one of claims 1 to 5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311388241.3A CN117252151B (en) | 2023-10-24 | 2023-10-24 | Method, system and medium for processing central area sinking of QFP packaging device EPad |
| PCT/CN2023/140168 WO2025086442A1 (en) | 2023-10-24 | 2023-12-20 | Sinking processing method for epad central region of qfp device, and system and medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311388241.3A CN117252151B (en) | 2023-10-24 | 2023-10-24 | Method, system and medium for processing central area sinking of QFP packaging device EPad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117252151A true CN117252151A (en) | 2023-12-19 |
| CN117252151B CN117252151B (en) | 2025-11-28 |
Family
ID=89126403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311388241.3A Active CN117252151B (en) | 2023-10-24 | 2023-10-24 | Method, system and medium for processing central area sinking of QFP packaging device EPad |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117252151B (en) |
| WO (1) | WO2025086442A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025086442A1 (en) * | 2023-10-24 | 2025-05-01 | 芯和半导体科技(上海)股份有限公司 | Sinking processing method for epad central region of qfp device, and system and medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020049940A (en) * | 2000-12-20 | 2002-06-26 | 박종섭 | chip scale semiconductor package in wafer level and method for fabricating the same |
| CN215933584U (en) * | 2021-06-10 | 2022-03-01 | 昂宝电子(上海)有限公司 | High-power integrated circuit chip packaging device and lead frame |
| CN116151183A (en) * | 2023-03-29 | 2023-05-23 | 本源科仪(成都)科技有限公司 | Chip layout three-dimensional modeling method, system, storage medium and electronic equipment |
| CN116504742A (en) * | 2023-06-21 | 2023-07-28 | 青岛泰睿思微电子有限公司 | Frame for semiconductor package, method for manufacturing the same, and method for packaging the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661378A (en) * | 1992-08-06 | 1994-03-04 | Nec Corp | Semiconductor device |
| CN105552048A (en) * | 2016-01-28 | 2016-05-04 | 珠海格力节能环保制冷技术研究中心有限公司 | Heat-conducting bonding pad and package structure of QFP chip with heat-conducting bonding pad |
| US20200013711A1 (en) * | 2018-07-09 | 2020-01-09 | Nxp Usa, Inc. | Hybrid package |
| CN117252151B (en) * | 2023-10-24 | 2025-11-28 | 芯和半导体科技(上海)股份有限公司 | Method, system and medium for processing central area sinking of QFP packaging device EPad |
-
2023
- 2023-10-24 CN CN202311388241.3A patent/CN117252151B/en active Active
- 2023-12-20 WO PCT/CN2023/140168 patent/WO2025086442A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020049940A (en) * | 2000-12-20 | 2002-06-26 | 박종섭 | chip scale semiconductor package in wafer level and method for fabricating the same |
| CN215933584U (en) * | 2021-06-10 | 2022-03-01 | 昂宝电子(上海)有限公司 | High-power integrated circuit chip packaging device and lead frame |
| CN116151183A (en) * | 2023-03-29 | 2023-05-23 | 本源科仪(成都)科技有限公司 | Chip layout three-dimensional modeling method, system, storage medium and electronic equipment |
| CN116504742A (en) * | 2023-06-21 | 2023-07-28 | 青岛泰睿思微电子有限公司 | Frame for semiconductor package, method for manufacturing the same, and method for packaging the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025086442A1 (en) * | 2023-10-24 | 2025-05-01 | 芯和半导体科技(上海)股份有限公司 | Sinking processing method for epad central region of qfp device, and system and medium |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025086442A1 (en) | 2025-05-01 |
| CN117252151B (en) | 2025-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112685991B (en) | Wiring method meeting constraint | |
| CN105787226A (en) | Reconstruction of parameterization model of quadrilateral finite element grid model | |
| TWI643082B (en) | A method and system for routing a solution path | |
| CN108537797A (en) | The distortion of the mesh optimization method of deformable objects cutting simulation in a kind of virtual operation | |
| CN116629196A (en) | Chiplet architecture-based sub-chip deployment method and related components | |
| CN117252151A (en) | A method, system and medium for sinking the center area of QFP packaged device EPad | |
| US12406417B2 (en) | Data processing method, apparatus, and device and storage medium | |
| CN112800547B (en) | Layout optimization method and device for electric vehicle motor controller and storage medium | |
| CN110363854A (en) | Circular formwork dividing method, device, computer equipment and storage medium | |
| CN113034688B (en) | Three-dimensional map model generation method and device | |
| CN115587451B (en) | A method for dynamically updating triangular patch models on web pages based on voxel partitioning | |
| CN107153719B (en) | Method and system for filling redundant metal | |
| CN114282381B (en) | A method and system for automatically generating non-uniform rectangular grids | |
| CN116629193B (en) | Wiring method, device, equipment and storage medium for integrated circuit | |
| CN116339301A (en) | Method for limiting robot construction, chip and robot | |
| CN117852481B (en) | Method and system for quickly determining integrated circuit layout netlist information | |
| CN112435339A (en) | Connection obstacle avoidance method and device and electronic equipment | |
| CN103020402A (en) | Modeling method and modeling device | |
| CN106271052B (en) | Laser processing and device | |
| CN100399867C (en) | Method for automatically executing circuit layout by software | |
| CN107256281B (en) | FPGA (field programmable Gate array) reconfigurable resource non-rectangular layout method based on cutting method | |
| CN113408148A (en) | Pipe cutting simulation method based on SolidWorks secondary development | |
| CN117371387B (en) | Integrated circuit device layout parameterization construction method and device, storage medium and terminal | |
| CN106855893B (en) | A method and device for obtaining a memory layout power supply main line | |
| CN120354814A (en) | Modeling method and device for structure simulation model of advanced chip packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |