CN117241495A - Chip mounter with stable chip mounting mechanism - Google Patents
Chip mounter with stable chip mounting mechanism Download PDFInfo
- Publication number
- CN117241495A CN117241495A CN202311323937.8A CN202311323937A CN117241495A CN 117241495 A CN117241495 A CN 117241495A CN 202311323937 A CN202311323937 A CN 202311323937A CN 117241495 A CN117241495 A CN 117241495A
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- base
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- bonding pad
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- plate
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- 238000001179 sorption measurement Methods 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims 3
- 238000005299 abrasion Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of chip mounters, and provides a chip mounter with a stable chip mounting mechanism. The technical problems that in the prior art, the directions of positioning limitation of a PCB bonding pad are less, the bonding pad is easy to move when being attached, and the stability of the bonding pad and the abrasion of the PCB bonding pad when moving are difficult to ensure are solved. Compared with the prior art, the invention has the following beneficial effects: the positioning limit can be carried out on the PCB bonding pad from the periphery of the PCB bonding pad, so that the positioning accuracy of the PCB bonding pad is ensured, the pressure of the PCB bonding pad to the base can be reduced, the friction force of the follow-up PCB bonding pad when moving on the base is reduced, and the damage of the PCB bonding pad is avoided.
Description
Technical Field
The invention belongs to the technical field of chip mounters, and particularly relates to a chip mounter with a stable chip mounting mechanism.
Background
The chip mounter is a device which is arranged behind a dispensing machine or a screen printer and accurately places surface mounted components on a PCB bonding pad by moving a mounting head in a production line.
The applicant has retrieved some prior art, for example chinese patent with patent publication No. CN114867338A, which places the PCB pad on the patch table when in use, then pushes one side of the PCB pad to move through the clamping plate 19, and then clamps the PCB pad from both sides, but it can only position the PCB pad from both sides of the PCB pad, so that the positioning of the PCB pad cannot be limited in the other direction, which results in inaccurate positioning of the PCB pad, and the PCB pad is easy to move during subsequent patch, so that the stability of the patch is difficult to be ensured, the quality of the patch is reduced, the friction between the PCB pad and the patch table is large when the PCB pad is pushed to move, and the PCB pad is easy to wear.
Disclosure of Invention
The invention aims to provide a chip mounter with a stable chip mounting mechanism, and aims to solve the technical problems that in the prior art, the direction of positioning restriction of a PCB bonding pad is less, so that the PCB bonding pad is easy to move during chip mounting, the stability of the chip mounting is difficult to ensure, and the PCB bonding pad is worn during movement.
The invention discloses a chip mounter with a stable chip mounting mechanism, which comprises a base, wherein two groups of moving plates which are arranged at intervals and are distributed in parallel are slidably arranged on the base, a power assembly for driving the two groups of moving plates to move simultaneously is arranged on the base, a plurality of groups of spacing columns which are distributed at intervals are rotatably arranged on the sides, which are close to each other, of the two groups of moving plates, a spacing plate is slidably arranged on the two groups of moving plates, a first telescopic piece for driving the spacing plate to move is fixedly arranged on each group of moving plates, a cavity is formed in the base, a plurality of groups of air outlet holes which are communicated with the cavity are formed in the base, a fan connected with the cavity is fixedly arranged on the base, two groups of lifting plates which are distributed on the same straight line are arranged on the base, a plurality of chip mounting adsorption plates which are distributed at intervals are fixedly arranged on each group of lifting plates, and a control assembly for driving the lifting plates to rotate and move up and down is arranged on the base.
The technical scheme is as follows: two sets of the lateral surfaces of the movable plate, which are close to each other, are provided with mounting grooves for mounting the limiting columns, a plurality of sets of the limiting columns are linearly distributed at intervals in the mounting grooves along the length direction of the movable plate, and one ends, close to the base, of the plurality of sets of the limiting columns are provided with gaps with the base.
The technical scheme is as follows: two sets of limiting plates all set up to L type structure, and the vertical section of two sets of limiting plates all is located between two sets of movable plates, and the one end that two sets of limiting plates are close to the base all is provided with the clearance with the base.
The technical scheme is as follows: the power assembly comprises a screw rod, the screw rod is rotatably mounted on the base, the screw rod penetrates through the two groups of moving plates and is rotatably connected with the two groups of moving plates, and a first rotary power piece for driving the screw rod to rotate is fixedly mounted on the base.
The technical scheme is as follows: the control assembly comprises a rotating shaft, the rotating shaft is rotatably arranged on the base and positioned on the same side of the two groups of moving plates, a top plate is fixedly arranged at one end of the rotating shaft away from the base, second telescopic members pointing to the base are fixedly arranged at two ends of the top plate, the output ends of the two groups of second telescopic members are fixedly connected with the two groups of lifting plates respectively, and a second rotating power member for driving the rotating shaft to rotate is fixedly arranged on the base.
The technical scheme is as follows: the base 1 is fixedly provided with a positioning frame 19 with a U-shaped structure, and the side wall of the positioning frame 19 is connected with a fixing screw 20 for fixing a material tray in a threaded manner.
Compared with the prior art, the invention has the following beneficial effects:
1. the PCB bonding pad can be positioned and limited from the periphery of the PCB bonding pad, so that the positioning accuracy of the PCB bonding pad is ensured, the follow-up PCB bonding pad cannot move under the limitation of the periphery during bonding, the stability during bonding is ensured, and the bonding pad quality is improved.
2. The PCB bonding pad can be jacked up upwards through the air that flows out to reduce the pressure of PCB bonding pad to the base, and then follow-up PCB bonding pad frictional force when removing on the base reduces, reduces the PCB bonding pad and the wearing and tearing between the base when fixing a position and removing, avoids PCB bonding pad damage.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is a left side view of the moving plate in the present invention.
Fig. 4 is an enlarged schematic view of the area A1 in fig. 1.
In the accompanying drawings: 1. a base; 2. a cavity; 3. a blower; 4. an air outlet hole; 5. a moving plate; 6. a first rotary power member; 7. a screw rod; 8. a mounting groove; 9. a limit column; 10. a chute; 11. a limiting plate; 12. a first telescopic member; 13. a rotating shaft; 14. a top plate; 15. a second telescopic member; 16. a lifting plate; 17. a patch adsorption disc; 18. a second rotary power member; 19. a positioning frame; 20. a fixing screw; 21. a power assembly; 22. and a control assembly.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Specific implementations of the invention are described in detail below in connection with specific embodiments.
As shown in fig. 1-4, the chip mounter with a stable chip mounting mechanism provided by the invention comprises a base 1, wherein two groups of moving plates 5 which are spaced and distributed in parallel are slidably arranged on the base 1, a power component 21 for driving the two groups of moving plates 5 to move simultaneously is arranged on the base 1, a plurality of groups of spacing posts 9 which are spaced are rotatably arranged on the side surfaces of the two groups of moving plates 5, a mounting groove 8 for mounting the spacing posts 9 is arranged on the side surfaces of the two groups of moving plates 5, a plurality of groups of spacing posts 9 are linearly spaced in the mounting groove 8 along the length direction of the moving plates 5, one ends of the plurality of groups of spacing posts 9, which are close to the base 1, are provided with gaps with the base 1, a spacing plate 11 is slidably arranged on the two groups of moving plates 5, every group all fixed mounting has the first extensible member 12 that is used for driving limiting plate 11 to remove on the movable plate 5, two sets of limiting plates 11 all set up to L type structure, the vertical section of two sets of limiting plates 11 all is located between two sets of movable plates 5, two sets of limiting plates 11 are close to the one end of base 1 all be provided with the clearance with base 1, cavity 2 has been seted up in the base 1, the air outlet 4 of multiunit and cavity 2 intercommunication has been seted up on the base 1, fixed mounting has the fan 3 of being connected with cavity 2 on the base 1, be provided with two sets of lifter plates 16 that are located same straight line and distribute on the base 1, equal fixed mounting has multiunit spaced distribution's paster adsorption disc 17 on every group lifter plate 16, be provided with on the base 1 and drive lifter plate 16 rotate with reciprocate's control assembly 22.
In practical application, the embodiment places the PCB bonding pad on the base 1 and enables the PCB bonding pad to be located between the two groups of moving plates 5 and the two groups of limiting plates 11, at this time, the fan 3 conveys air into the cavity 2, the air is blown out to the surface of the base 1 through the air outlet 4, so that the air flowing out from the air outlet 4 at the lower part of the PCB bonding pad can jack up the PCB bonding pad upwards, the pressure of the PCB bonding pad on the base 1 is reduced, the friction force of the subsequent PCB bonding pad when moving on the base 1 is reduced, the abrasion between the PCB bonding pad and the base 1 is reduced, the PCB bonding pad is prevented from being damaged, the power assembly 21 drives the two groups of moving plates 5 to move inwards simultaneously, the limiting columns 9 on one group of moving plates 5 can push the PCB bonding pad to move on the base 1 after being contacted with the side surfaces of the PCB bonding pad, then the first telescopic pieces 12 on the two sides push the two sides of the limiting plates 11 to move towards the PCB bonding pad, the bonding pad can be pushed after one group of the limiting plates 11 is contacted with the side edges of the bonding pad, the PCB bonding pad can be pushed to move simultaneously, the quality of the bonding pad can not be guaranteed to be accurately limited by the PCB bonding pad when the two groups 17 are contacted with the side edges of the PCB bonding pad, and the PCB bonding pad can not be adsorbed by the PCB bonding pad 17, and the material can be accurately adsorbed by the bonding pad can be prevented from being adsorbed by the PCB bonding pad 17 when the following the bonding pad is completely, and the bonding pad is prevented from being adsorbed by the bonding pad 17, and the bonding pad is accurately is prevented from being adsorbed by the bonding pad 17, and the material is attached to the bonding pad is subjected to the material pad 17, and then removing the limitation on the PCB bonding pad, and removing the PCB bonding pad to replace a new PCB bonding pad for bonding.
In one embodiment of the present invention, to install the limiting plate 11, the moving plate 5 is provided with a sliding slot 10 for sliding the limiting plate 11, and the first telescopic members 12 are fixedly installed in the sliding slot 10 and distributed along the length direction of the moving plate 5.
As shown in fig. 1 and fig. 2, in order to provide a chip mounter with a stable chip mounting mechanism, a power assembly 21 includes a screw rod 7, the screw rod 7 is rotatably mounted on a base 1, the screw rod 7 penetrates through two groups of moving plates 5 and is rotatably connected with the two groups of moving plates 5, and a first rotary power member 6 for driving the screw rod 7 to rotate is fixedly mounted on the base 1.
Specifically, the screw rod 7 is parallel to the base 1, and one side surface of each group of moving plates 5 is in sliding contact with the base 1, and the screw rod 7 drives the two groups of moving plates 5 to move inwards or outwards simultaneously.
In practical application, the first rotary power piece 6 drives the screw rod 7 to rotate, so that the screw rod 7 can drive the two groups of moving plates 5 to move inwards or outwards simultaneously, thereby realizing the control of the positions of the moving plates 5 and the clamping of the PCB bonding pads.
In one embodiment of the present invention, the first rotary power member 6 is a first motor, and may be any other component capable of outputting rotary power, such as a hydraulic motor, and the first motor drives the two sets of moving plates 5 to move simultaneously.
As shown in fig. 1 and fig. 2, the control assembly 22 of the chip mounter with the stable chip mounting mechanism provided by the invention comprises a rotating shaft 13, wherein the rotating shaft 13 is rotatably mounted on a base 1 and is positioned on the same side as two groups of moving plates 5, a top plate 14 is fixedly mounted at one end of the rotating shaft 13 far away from the base 1, second telescopic members 15 pointing to the base 1 are fixedly mounted at two ends of the top plate 14, output ends of the two groups of second telescopic members 15 are fixedly connected with the two groups of lifting plates 16 respectively, and a second rotating power member 18 for driving the rotating shaft 13 to rotate is fixedly mounted on the base 1.
Specifically, in order to locate the position of the patch material, a locating frame 19 with a U-shaped structure is fixedly installed on the base 1, and a fixing screw 20 for fixing a material tray is connected to the side wall of the locating frame 19 in a threaded manner.
In practical application, this embodiment is when placing the tray that is equipped with the paster material in locating rack 19, fix a position the material tray through locating rack 19, afterwards fix the material tray through set screw 20, after the material is adsorbed to one of them paster adsorption disc 17, drive pivot 13 through second rotation power piece 18 and rotate 180 degrees this moment, the paster adsorption disc 17 carries the paster material to the top of PCB pad on base 1 this moment, another group of paster adsorption disc 17 moves to the material tray top, second extensible member 15 drives lifter plate 16 and descends this moment, thereby realize the absorption of the paster of PCB pad and paster material, thereby reduced the time interval of pressing from both sides and getting the paster material, can realize lasting paster, improve the efficiency of paster.
In one embodiment of the present invention, the second rotary power member 18 is a second motor, which may be any other member capable of outputting rotary power, such as a hydraulic motor, and the second motor drives the rotating shaft 13 to rotate, so as to change the position of the lifting plate 16, and the second telescopic member 15 is a second electric telescopic rod, which may be any other member capable of actively performing length conversion, such as a hydraulic cylinder, and the second electric telescopic rod drives the lifting plate 16 to move up and down.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. The utility model provides a chip mounter with stable paster mechanism, includes base (1), its characterized in that, slidable mounting has two sets of interval and parallel distribution's movable plate (5) on base (1), is provided with on base (1) and drives two sets of movable plate (5) power pack (21) that remove simultaneously, two sets of movable plate (5) all rotate on the side that is close to each other and install multiunit interval distribution's spacing post (9), all slidable mounting has limiting plate (11) on two sets of movable plate (5), and equal fixed mounting has first extensible member (12) that are used for driving limiting plate (11) to remove on every set of movable plate (5), has seted up cavity (2) in base (1), has seted up multiunit and air outlet (4) of cavity (2) intercommunication on base (1), and fixed mounting has fan (3) that are connected with cavity (2), be provided with on base (1) two sets of elevating plate (16) that are located same straight line and distribute, all fixed mounting has multiunit interval distribution's adsorption disc (17) on every elevating plate (16), it has on base (1) to drive under with elevating plate (16).
2. The chip mounter with the stable chip mounting mechanism according to claim 1, wherein two groups of the movable plates (5) are provided with mounting grooves (8) for mounting limiting columns (9) on sides, which are close to each other, of the movable plates, the groups of the limiting columns (9) are linearly distributed at intervals in the mounting grooves (8) along the length direction of the movable plates (5), and gaps are formed between one ends, close to the base (1), of the groups of the limiting columns (9) and the base (1).
3. The chip mounter with the stable chip mounting mechanism according to claim 1, wherein two groups of limiting plates (11) are all arranged in an L-shaped structure, vertical sections of the two groups of limiting plates (11) are located between the two groups of moving plates (5), and one ends, close to the base (1), of the two groups of limiting plates (11) are provided with gaps with the base (1).
4. The chip mounter with the stable chip mounting mechanism according to claim 1, wherein the power assembly (21) comprises a screw rod (7), the screw rod (7) is rotatably mounted on the base (1), the screw rod (7) penetrates through the two groups of moving plates (5) and is rotatably connected with the two groups of moving plates (5), and a first rotary power piece (6) for driving the screw rod (7) to rotate is fixedly mounted on the base (1).
5. The chip mounter with stable chip mounting mechanism according to claim 1, wherein the control assembly (22) comprises a rotating shaft (13), the rotating shaft (13) is rotatably mounted on the base (1) and located on the same side of the two groups of moving plates (5), a top plate (14) is fixedly mounted at one end, far away from the base (1), of the rotating shaft (13), second telescopic members (15) pointing to the base (1) are fixedly mounted at two ends of the top plate (14), output ends of the two groups of second telescopic members (15) are fixedly connected with the two groups of lifting plates (16) respectively, and a second rotating power member (18) for driving the rotating shaft (13) to rotate is fixedly mounted on the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311323937.8A CN117241495B (en) | 2023-10-13 | 2023-10-13 | Chip mounter with stable chip mounting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311323937.8A CN117241495B (en) | 2023-10-13 | 2023-10-13 | Chip mounter with stable chip mounting mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117241495A true CN117241495A (en) | 2023-12-15 |
| CN117241495B CN117241495B (en) | 2024-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311323937.8A Active CN117241495B (en) | 2023-10-13 | 2023-10-13 | Chip mounter with stable chip mounting mechanism |
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| Country | Link |
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| CN (1) | CN117241495B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120395032A (en) * | 2025-07-04 | 2025-08-01 | 北京中航科电测控技术股份有限公司 | A semiconductor device welding positioning device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100006017A (en) * | 2008-07-08 | 2010-01-18 | 주식회사 세종글로벌테크 | Apparatus for loading and mounting printed circuit board |
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
| JP2019003984A (en) * | 2017-06-13 | 2019-01-10 | ヤマハ発動機株式会社 | Board support device and component mounting machine including the same |
| CN113710004A (en) * | 2021-08-04 | 2021-11-26 | 苏州瀚派电子科技有限公司 | SMT (surface mount technology) chip mounting device and chip mounting process |
| CN115003150A (en) * | 2022-07-15 | 2022-09-02 | 杭州振和电子科技有限公司 | Chip mounter of accurate stable paster |
-
2023
- 2023-10-13 CN CN202311323937.8A patent/CN117241495B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100006017A (en) * | 2008-07-08 | 2010-01-18 | 주식회사 세종글로벌테크 | Apparatus for loading and mounting printed circuit board |
| JP2013118221A (en) * | 2011-12-01 | 2013-06-13 | Nippon Ritoru Kk | Chip mounter |
| JP2019003984A (en) * | 2017-06-13 | 2019-01-10 | ヤマハ発動機株式会社 | Board support device and component mounting machine including the same |
| CN113710004A (en) * | 2021-08-04 | 2021-11-26 | 苏州瀚派电子科技有限公司 | SMT (surface mount technology) chip mounting device and chip mounting process |
| CN115003150A (en) * | 2022-07-15 | 2022-09-02 | 杭州振和电子科技有限公司 | Chip mounter of accurate stable paster |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120395032A (en) * | 2025-07-04 | 2025-08-01 | 北京中航科电测控技术股份有限公司 | A semiconductor device welding positioning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117241495B (en) | 2024-09-27 |
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Effective date of registration: 20240819 Address after: Building C6, 1st Floor, Lanke New Station Xinping High tech Industrial Park, Intersection of Weiwu Road and Dayu Road, Zhanbei Community, Xinzhan District, Hefei City, Anhui Province 230012 Applicant after: Hefei Saimeitaike Technology Co.,Ltd. Country or region after: China Address before: 461002 Road South, 200 meters east of the intersection of Jian'an Avenue and Xuzhou Road, Dongcheng District, Xuchang City, Henan Province Applicant before: Henan Yuexin Integrated Circuit Co.,Ltd. Country or region before: China |
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