CN117178082A - 湿式处理装置及柔性印刷基板的制造方法 - Google Patents

湿式处理装置及柔性印刷基板的制造方法 Download PDF

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Publication number
CN117178082A
CN117178082A CN202280029725.6A CN202280029725A CN117178082A CN 117178082 A CN117178082 A CN 117178082A CN 202280029725 A CN202280029725 A CN 202280029725A CN 117178082 A CN117178082 A CN 117178082A
Authority
CN
China
Prior art keywords
slit
pair
roller
shield
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280029725.6A
Other languages
English (en)
Chinese (zh)
Inventor
三浦宏介
新田耕司
酒井将一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN117178082A publication Critical patent/CN117178082A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202280029725.6A 2021-04-22 2022-04-13 湿式处理装置及柔性印刷基板的制造方法 Pending CN117178082A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021072460 2021-04-22
JP2021-072460 2021-04-22
PCT/JP2022/017679 WO2022224886A1 (ja) 2021-04-22 2022-04-13 湿式処理装置およびフレキシブルプリント基板の製造方法

Publications (1)

Publication Number Publication Date
CN117178082A true CN117178082A (zh) 2023-12-05

Family

ID=83722954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280029725.6A Pending CN117178082A (zh) 2021-04-22 2022-04-13 湿式处理装置及柔性印刷基板的制造方法

Country Status (4)

Country Link
US (1) US12460312B2 (https=)
JP (1) JPWO2022224886A1 (https=)
CN (1) CN117178082A (https=)
WO (1) WO2022224886A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181870U (ja) 1983-05-18 1984-12-04 三菱電機株式会社 条材の連続電気メツキ装置の回収槽
JP4212081B2 (ja) * 2001-11-09 2009-01-21 日陽エンジニアリング株式会社 連続湿式処理方法及び装置並びに液シール方法及び装置
WO2008072403A1 (ja) * 2006-12-14 2008-06-19 Nichiyo Engineering Corporation 非接触液シール装置及び方法
JP6448494B2 (ja) 2015-07-29 2019-01-09 株式会社エリアデザイン サクションめっき装置

Also Published As

Publication number Publication date
JPWO2022224886A1 (https=) 2022-10-27
US20240200220A1 (en) 2024-06-20
WO2022224886A1 (ja) 2022-10-27
US12460312B2 (en) 2025-11-04

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