CN117162298A - Monocrystalline silicon rod cutting device - Google Patents
Monocrystalline silicon rod cutting device Download PDFInfo
- Publication number
- CN117162298A CN117162298A CN202311338651.7A CN202311338651A CN117162298A CN 117162298 A CN117162298 A CN 117162298A CN 202311338651 A CN202311338651 A CN 202311338651A CN 117162298 A CN117162298 A CN 117162298A
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- monocrystalline silicon
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- silicon body
- diamond wire
- motor
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 75
- 238000005520 cutting process Methods 0.000 title claims abstract description 64
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 40
- 239000010432 diamond Substances 0.000 claims abstract description 40
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 11
- 239000000523 sample Substances 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000003028 elevating effect Effects 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012634 fragment Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a monocrystalline silicon rod cutting device, which comprises a processing table, wherein a monocrystalline silicon body is arranged at the top of the processing table, a linear cutting mechanism is arranged in the processing table, a leveling mechanism is arranged at the outer side of the linear cutting mechanism, infrared probes are arranged at both sides of the inner wall of the processing table, driving wheels are arranged at four corners of the bottom of a moving table, a first lifting table and a second lifting table are respectively arranged at both sides of the top of the processing table, and a spraying disc is arranged at one side of the second lifting table; the linear cutting mechanism is used for slicing the monocrystalline silicon body, and the leveling mechanism is used for leveling the cut of the monocrystalline silicon body cut by the linear cutting mechanism; after the diamond wire cuts the monocrystalline silicon body, the first polishing sheet and the second polishing sheet can respectively polish and level the bottom notch of the monocrystalline silicon body, so that the problem that the diamond wire is scratched due to the fact that the notch of the monocrystalline silicon body is uneven is solved, and the situation that the notch of the diamond wire is broken is caused.
Description
Technical Field
The invention relates to the field of monocrystalline silicon rod cutting devices, in particular to a monocrystalline silicon rod cutting device.
Background
Silicon is the most commonly used semiconductor material, and when molten elemental silicon solidifies, the silicon atoms are arranged in a diamond lattice to form nuclei, which grow into crystal grains with the same crystal face orientation, forming monocrystalline silicon. Monocrystalline silicon is taken as a relatively active nonmetallic element crystal, is an important component of a crystal material, and is at the front edge of new material development.
There are various cutting modes of a single crystal silicon rod, among which a diamond wire saw cutting method, which is the most commonly used single crystal silicon cutting method at present, in which a fine diamond wire is used as a cutting tool, and the silicon rod or the silicon wafer is cut into a desired size by the action of electric power or mechanical force, and the method has the advantages of high cutting speed, high precision and good cutting surface smoothness, but the diamond wire is worn out more rapidly and needs to be replaced periodically.
However, due to the fact that the appearance of the diamond wire is uneven, in the process of cutting the monocrystalline silicon rod, an uneven notch is left at the bottom of the monocrystalline silicon rod, so that the notch at the bottom of the monocrystalline silicon rod is uneven, in the process of returning the diamond wire, the outer side of the diamond wire is contacted with the uneven notch for scratch, the notch is easily left on the outer side of the diamond wire, and in the subsequent use process, the notch of the diamond wire is more easily broken due to repeated friction.
Accordingly, there is a need to provide a new single crystal silicon rod cutting apparatus that solves the above-mentioned technical problems.
Disclosure of Invention
In order to solve the technical problems, the invention provides a monocrystalline silicon rod cutting device which is convenient to strip.
The invention provides a monocrystalline silicon rod cutting device, which comprises a processing table, wherein a monocrystalline silicon body is arranged at the top of the processing table, a linear cutting mechanism is arranged in the processing table, a leveling mechanism is arranged at the outer side of the linear cutting mechanism, a guide rail is arranged in the processing table, a moving table is sleeved at the outer side of the guide rail, infrared probes are arranged at two sides of the inner wall of the processing table, driving wheels are arranged at four corners of the bottom of the moving table, a drain pipe is arranged at one side of the bottom of the processing table, a first lifting table and a second lifting table are respectively arranged at two sides of the top of the processing table, and a spraying disc is arranged at one side of the second lifting table; the wire cutting mechanism is used for slicing the monocrystalline silicon body, the leveling mechanism is used for leveling the cut of the monocrystalline silicon body cut by the wire cutting mechanism, leveling the front side and the back side of the cut silicon wafer, facilitating other procedures to operate, and the first lifting table is used for improving or reducing the height of the monocrystalline silicon body.
In order to achieve the effect of being convenient for cutting a monocrystalline silicon body, the invention provides a monocrystalline silicon rod cutting device, and preferably, the wire cutting mechanism comprises a fixing frame, a diamond wire pulley is arranged in the fixing frame, a diamond wire is arranged in the diamond wire pulley, a conduit is connected to the top of the fixing frame, the diamond wire is inserted into the conduit, a connecting pipe is connected to the top of the conduit, one end of the connecting pipe is connected with a cooling liquid tank, two sides of the fixing frame are connected with first motors, and the outer sides of rotating shafts of the first motors are connected with internal keys of the diamond wire pulley.
In order to achieve the effect of polishing the bottom of the monocrystalline silicon body conveniently, the monocrystalline silicon rod cutting device provided by the invention is preferable in that the leveling mechanism comprises a U-shaped support, and a first polishing disc is connected to the top of one side of the U-shaped support.
In order to achieve the effect of fixing the monocrystalline silicon body, the invention provides a monocrystalline silicon rod cutting device, preferably, the leveling mechanism further comprises a mounting frame, a fixing ring is clamped in the mounting frame, a bearing is arranged in the fixing ring, the monocrystalline silicon body is inserted into the bearing, a second motor is connected to the outer side of the mounting frame, a vacuum chuck is connected to a rotating shaft of the second motor, and the bottom of the vacuum chuck is attached to the outer side of the monocrystalline silicon body.
In order to achieve the effect of being convenient for polish the bottom of a silicon wafer, the invention provides a monocrystalline silicon rod cutting device, preferably, the bottom of the movable table is connected with a fixed rod, the inside of the fixed rod is connected with a third motor, a rotating shaft of the third motor is connected with a rotating table, the top of the rotating table is connected with a second polishing disc, and the top of the second polishing disc is attached to the bottom of a monocrystalline silicon body.
In order to achieve the effect of being convenient for driving the mounting frame to adjust the height, the invention provides the monocrystalline silicon rod cutting device, preferably, an electric cylinder is arranged in the first lifting table, one side of a push rod of the electric cylinder, which is connected with the L-shaped connecting frame, is connected with a fixing pile, and one side of the fixing pile is connected with one side of the mounting frame.
In order to achieve the effect of being convenient for driving the linear cutting mechanism to move, the invention provides the monocrystalline silicon rod cutting device, preferably, both sides of the fixing frame are connected with the transmission blocks, the inside of the transmission blocks is connected with the reciprocating screw rod, one end of the reciprocating screw rod is connected with the fourth motor, the fourth motor is arranged in the processing table, both sides of the fixing frame are connected with the guide blocks, and the outer sides of the guide blocks are in sliding connection with the sliding grooves in the processing table.
In order to achieve the effect of being convenient for fixing the fixing ring, the invention provides the monocrystalline silicon rod cutting device, preferably, both sides of the mounting frame are connected with the limiting columns, the outer sides of the limiting columns are sleeved with the limiting blocks, one sides of the limiting blocks are connected with the outer sides of the fixing ring, the inner parts of the limiting columns are provided with the clamping blocks, one sides of the clamping blocks are connected with the compression springs, and the outer sides of the clamping blocks are in clamping fit with the outer sides of the limiting blocks.
Compared with the prior art, the invention has the beneficial effects that:
wire cutting mechanism: and grinding and cutting the monocrystalline silicon body, forming a preliminary silicon wafer after cutting, and falling the preliminary silicon wafer on the surface of the mobile platform, wherein the spraying disc can blow away scraps on the surface of the silicon wafer.
Leveling mechanism: after the diamond wire cuts the monocrystalline silicon body, the first polishing piece and the second polishing piece can polish and level the bottom notch of the monocrystalline silicon body respectively, so that the situation that the diamond wire is scratched due to uneven bottom notch of the monocrystalline silicon body, and the diamond wire is broken due to notch occurrence is avoided.
Drawings
FIG. 1 is a schematic view showing a structure of a preferred embodiment of a single crystal silicon rod cutting apparatus according to the present invention;
FIG. 2 is a schematic view of the internal structure of the processing station shown in FIG. 1;
FIG. 3 is a schematic view of the wire cutting mechanism shown in FIG. 1;
FIG. 4 is a cross-sectional view of the mobile station and base of FIG. 1;
FIG. 5 is an enlarged schematic view of the structure at A in FIG. 1;
fig. 6 is an enlarged schematic view of the structure at B in fig. 2.
Reference numerals in the drawings: 1. a processing table; 2. a single crystal silicon body; 3. a wire cutting mechanism; 31. a fixing frame; 32. a diamond wire pulley; 33. a conduit; 34. a connecting pipe; 35. a first motor; 4. a leveling mechanism; 41. a U-shaped bracket; 42. a first grinding disc; 43. a mounting frame; 44. a fixing ring; 45. a second motor; 46. a vacuum chuck; 47. a third motor; 48. a rotating table; 49. a second sanding disc; 5. a mobile station; 6. a guide rail; 7. an infrared probe; 8. a driving wheel; 9. a first elevating platform; 10. an electric cylinder; 11. an L-shaped connecting frame; 12. fixing piles; 13. a transmission block; 14. a reciprocating screw rod; 15. a guide block; 16. a drain pipe; 17. a limit column; 18. a spray tray; 19. a second lifting table; 20. and a limiting block.
Detailed Description
The invention will be further described with reference to the drawings and embodiments.
Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6 in combination, fig. 1 is a schematic structural diagram of a preferred embodiment of a single crystal silicon rod cutting apparatus according to the present invention; FIG. 2 is a schematic view of the internal structure of the processing station shown in FIG. 1; FIG. 3 is a schematic view of the wire cutting mechanism shown in FIG. 1; FIG. 4 is a cross-sectional view of the mobile station and base of FIG. 1; FIG. 5 is an enlarged schematic view of the structure at A in FIG. 1; fig. 6 is an enlarged schematic view of the structure at B in fig. 2. The monocrystalline silicon rod cutting device comprises a processing table 1, a monocrystalline silicon body 2 is arranged at the top of the processing table 1, a linear cutting mechanism 3 is arranged in the processing table 1, a leveling mechanism 4 is arranged on the outer side of the linear cutting mechanism 3, a guide rail 6 is arranged in the processing table 1, a movable table 5 is sleeved on the outer side of the guide rail 6, infrared probes 7 are arranged on two sides of the inner wall of the processing table 1, driving wheels 8 are arranged at four corners of the bottom of the movable table 5, a drain pipe 16 is arranged on one side of the bottom of the processing table 1, a first lifting table 9 and a second lifting table 19 are respectively arranged on two sides of the top of the processing table 1, and a spraying disc 18 is arranged on one side of the second lifting table 19; the wire cutting mechanism 3 is used for slicing the monocrystalline silicon body 2, the leveling mechanism 4 is used for leveling the notch of the wire cutting mechanism 3 after cutting the monocrystalline silicon body 2, leveling the front and back sides of the cut silicon wafer, facilitating other working procedures to operate, the first lifting platform 9 is used for improving or reducing the height of the monocrystalline silicon body 2, and the spraying disc 18 is used for blowing off scraps on the surface of the silicon wafer.
In the specific implementation process, as shown in fig. 1, 2, 3, 4 and 5, the wire cutting mechanism 3 comprises a fixing frame 31, a diamond wire pulley 32 is arranged in the fixing frame 31, a diamond wire is arranged in the diamond wire pulley 32, a conduit 33 is connected to the top of the fixing frame 31, the diamond wire is inserted into the conduit 33, a connecting pipe 34 is connected to the top of the conduit 33, one end of the connecting pipe 34 is connected with a cooling liquid tank, two sides of the fixing frame 31 are connected with a first motor 35, and the outer side of a rotating shaft of the first motor 35 is connected with an inner key of the diamond wire pulley 32.
Referring to fig. 1, 2, 3, 4 and 5, the leveling mechanism 4 includes a U-shaped bracket 41, and a first grinding disc 42 is connected to the top of one side of the U-shaped bracket 41.
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the leveling mechanism 4 further comprises a mounting frame 43, a fixing ring 44 is clamped in the mounting frame 43, a bearing is arranged in the fixing ring 44, the monocrystalline silicon body 2 is inserted into the bearing, a second motor 45 is connected to the outer side of the mounting frame 43, a vacuum chuck 46 is connected to a rotating shaft of the second motor 45, and the bottom of the vacuum chuck 46 is attached to the outer side of the monocrystalline silicon body 2.
Referring to fig. 1, 2, 3, 4 and 5, a fixed rod is connected to the bottom of the moving table 5, a third motor 47 is connected to the inside of the fixed rod, a rotating table 48 is connected to a rotating shaft of the third motor 47, a second polishing disc 49 is connected to the top of the rotating table 48, and the top of the second polishing disc 49 is attached to the bottom of the monocrystalline silicon body 2.
Referring to fig. 1, 2, 3, 4 and 5, an electric cylinder 10 is provided inside the first elevating platform 9, a fixing pile 12 is connected to one side of the L-shaped connection frame 11 to which a push rod of the electric cylinder 10 is connected, and one side of the fixing pile 12 is connected to one side of the mounting frame 43.
It should be noted that: the surface of spray dish 18 has seted up the bleeder vent, the outside of drive wheel 8 and the outside sliding fit of guide rail 6, mobile station 5 internal connection has driving motor, and driving motor is connected with the top of drive wheel 8, the one end of connecting pipe 34 is connected with the coolant tank, and draw the coolant through the pump body, the coolant enters into conduit 33 inside through connecting pipe 34, cool down the processing to the buddha's warrior attendant line of process, the one end and the inside intercommunication of processing platform 1 of drain pipe 16, the outside of drain pipe 16 is provided with the control valve for the inside coolant of discharge processing platform 1, the internal connection of spray dish 18 has the evacuation pipe, the trachea is from spray dish 18 blowout and air-dries, blow off the silicon chip at mobile station 5 top, keep the clean and the dryness of silicon chip, first grinding dish 42 and U type support 41 pass through two screw fixed connection, second grinding dish 49 is embedded in the top of rotating table 48.
Referring to fig. 2 and 6, both sides of the fixing frame 31 are connected with a driving block 13, the inside of the driving block 13 is connected with a reciprocating screw 14, one end of the reciprocating screw 14 is connected with a fourth motor, the fourth motor is arranged in the processing table 1, both sides of the fixing frame 31 are connected with a guide block 15, and the outside of the guide block 15 is slidably connected with a chute in the processing table 1.
Referring to fig. 1 and 5, both sides of the mounting frame 43 are connected with a limit post 17, a limit block 20 is sleeved on the outer side of the limit post 17, one side of the limit block 20 is connected with the outer side of the fixing ring 44, a clamping block is arranged in the limit post 17, one side of the clamping block is connected with a compression spring, and the outer side of the clamping block is matched with the outer side of the limit block 20 in a clamping manner.
It should be noted that: one side of the transmission block 13 and one side of the guide block 15 are fixed with the fixing frame 31 through screws, one end of the reciprocating screw rod 14 is rotationally connected with the inner wall of the processing table 1, the outer side of the transmission block 13 is in threaded connection with the outer side of the reciprocating screw rod 14, a sliding groove is formed in the processing table 1, the guide block 15 is inserted into the sliding groove, two clamping blocks are inserted into the limiting column 17, one side of each clamping block is welded with a compression spring, each clamping block can retract into the limiting column 17 through the compression springs, and the limiting block 20 penetrates through the corresponding clamping block.
The working principle of the monocrystalline silicon rod cutting device provided by the invention is as follows:
when in use, the silicon single crystal body 2 is placed in the mounting frame 43, then the fixing ring 44 is arranged in the mounting frame 43, the limiting blocks 20 on two sides of the mounting frame 43 are inserted in the outer sides of the limiting columns 17, when the limiting blocks 20 are contacted with the clamping blocks on the outer sides of the limiting columns 17, the inclined surfaces of the clamping blocks are stressed, the compression springs on one side are extruded to retract into the inner parts of the limiting columns 17, the limiting blocks 20 penetrate through the clamping blocks, the clamping blocks clamp and fix the limiting blocks 20, the vacuum sucking discs 46 in the mounting frame 43 are adhered and adsorbed to the top of the silicon single crystal body 2, when the silicon single crystal body 2 is required to be cut, the driving motor in the processing table 1 is started, the fourth motor drives the reciprocating screw 14 to rotate, the reciprocating screw 14 drives the transmission block 13 to move, the transmission block 13 drives the fixing frame 31 to move, and the fixing frame 31 respectively drives the diamond wire pulley 32, the guide tube, the connecting tube 34, the first motor 35 and the U-shaped bracket 41 to move, the rotating shaft of the first motor 35 drives the diamond wire pulley 32 to rotate, the diamond wire pulley 32 drives the diamond wire to move, so that the diamond wire is attached to the outer side of the monocrystalline silicon body 2, the second motor 45 drives the monocrystalline silicon body 2 to slowly rotate through the vacuum chuck 46, cooling liquid in the connecting pipe 34 is sprayed on the surface of the diamond wire to cool the diamond wire in the diamond wire cutting process, when the fixing frame 31 drives the U-shaped bracket 41 to move, the U-shaped bracket 41 drives the first grinding disc 42 to move, so that the top of the first grinding disc 42 is attached to a notch of the monocrystalline silicon body 2, the notch part of the first grinding disc 42 is ground in the rotating process of the monocrystalline silicon body 2, the notch part is kept flat, the reciprocating screw 14 drives the fixing frame 31 to return in an original way through the driving of the driving block 13, and the cut silicon wafer falls on the top of the moving table 5, the driving motor in the movable table 5 drives the driving wheel 8 to rotate, so that the movable table 5 slides along the outer side of the guide rail 6 and slides to the position of the second lifting table 19 to stop, after the infrared probe 7 detects that an object moves to a set position, the electric cylinder 10 in the second lifting table 19 is started, the ejector rod of the electric cylinder 10 drives the L-shaped connecting frame 11 to move, the L-shaped connecting frame 11 drives the spraying disc 18 to move, the spraying disc 18 is sleeved outside the movable table 5, the third motor 47 at the bottom of the movable table 5 is started, the third motor 47 drives the rotating table 48 to rotate, the rotating table 48 drives the second polishing disc 49 to rotate, the top of the second polishing disc 49 rubs with the bottom of a silicon wafer to generate fragments, after polishing, the silicon wafer is started, gas is ejected from the spraying disc 18 through the gas-repellent pipe, the fragments on the surface of the spraying and blowing away of the silicon wafer is carried out by gas flushing, the gas is discharged from the top of the spraying disc 18, the first lifting table 9 reduces the height of the monocrystalline silicon body 2, and the diamond wire cuts the monocrystalline silicon body 2 again.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (8)
1. The utility model provides a monocrystalline silicon stick cutting device, its characterized in that, including processing platform (1), the top of processing platform (1) is provided with monocrystalline silicon body (2), the inside of processing platform (1) is provided with wire cutting mechanism (3), the outside of wire cutting mechanism (3) is provided with leveling mechanism (4), the inside of processing platform (1) is provided with guide rail (6), the outside cover of guide rail (6) is equipped with mobile station (5), the both sides of processing platform (1) inner wall all are provided with infrared probe (7), the four corners of mobile station (5) bottom all are provided with drive wheel (8), drain pipe (16) have been seted up to one side of processing platform (1) bottom, the both sides at processing platform (1) top are provided with first elevating platform (9) and second elevating platform (19) respectively, one side of second elevating platform (19) is provided with spray dish (18).
The wire cutting mechanism (3) is used for slicing the monocrystalline silicon body (2), the leveling mechanism (4) is used for leveling the notch of the wire cutting mechanism (3) after cutting the monocrystalline silicon body (2) and leveling the front side and the back side of the cut silicon wafer, other procedures are convenient to operate, the first lifting table (9) is used for improving or reducing the height of the monocrystalline silicon body (2), and the spraying disc (18) is used for blowing away scraps on the surface of the silicon wafer.
2. The single crystal silicon rod cutting device according to claim 1, wherein the wire cutting mechanism (3) comprises a fixing frame (31), a diamond wire pulley (32) is arranged in the fixing frame (31), a diamond wire is arranged in the diamond wire pulley (32), a conduit (33) is connected to the top of the fixing frame (31), the diamond wire is inserted into the conduit (33), a connecting pipe (34) is connected to the top of the conduit (33), a cooling liquid tank is connected to one end of the connecting pipe (34), first motors (35) are connected to two sides of the fixing frame (31), and the outer sides of rotating shafts of the first motors (35) are connected with internal keys of the diamond wire pulley (32).
3. The monocrystalline silicon rod cutting apparatus according to claim 1, characterized in that the leveling mechanism (4) comprises a U-shaped bracket (41), a first grinding disc (42) being connected to the top of one side of the U-shaped bracket (41).
4. The monocrystalline silicon rod cutting device according to claim 1, characterized in that the leveling mechanism (4) further comprises a mounting frame (43), a fixing ring (44) is clamped in the mounting frame (43), a bearing is arranged in the fixing ring (44), the monocrystalline silicon body (2) is inserted into the bearing, a second motor (45) is connected to the outer side of the mounting frame (43), a vacuum chuck (46) is connected to a rotating shaft of the second motor (45), and the bottom of the vacuum chuck (46) is attached to the outer side of the monocrystalline silicon body (2).
5. The monocrystalline silicon rod cutting apparatus according to claim 1, characterized in that the bottom of the mobile station (5) is connected with a fixed rod, and the inside of the fixed rod is connected with a third motor (47), the rotating shaft of the third motor (47) is connected with a rotating station (48), the top of the rotating station (48) is connected with a second polishing disc (49), and the top of the second polishing disc (49) is attached to the bottom of the monocrystalline silicon body (2).
6. The monocrystalline silicon rod cutting apparatus according to claim 1, characterized in that the first lifting table (9) and the second lifting table (19) are both provided with electric cylinders (10), one side of the ejector rod of each electric cylinder (10) connected with the L-shaped connecting frame (11) is connected with a fixing pile (12), and one side of the fixing pile (12) is connected with one side of the mounting frame (43).
7. The monocrystalline silicon rod cutting device according to claim 2, characterized in that both sides of the fixing frame (31) are connected with transmission blocks (13), the inside of the transmission blocks (13) is connected with a reciprocating screw rod (14), one end of the reciprocating screw rod (14) is connected with a fourth motor, the fourth motor is arranged in the processing table (1), both sides of the fixing frame (31) are connected with guide blocks (15), and the outer sides of the guide blocks (15) are in sliding connection with sliding grooves in the processing table (1).
8. The monocrystalline silicon rod cutting device according to claim 4, wherein both sides of the mounting frame (43) are connected with limiting columns (17), limiting blocks (20) are sleeved on the outer sides of the limiting columns (17), one sides of the limiting blocks (20) are connected with the outer sides of the fixing rings (44), clamping blocks are arranged in the limiting columns (17), one sides of the clamping blocks are connected with compression springs, and the outer sides of the clamping blocks are matched with the outer sides of the limiting blocks (20) in a clamping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311338651.7A CN117162298A (en) | 2023-10-17 | 2023-10-17 | Monocrystalline silicon rod cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311338651.7A CN117162298A (en) | 2023-10-17 | 2023-10-17 | Monocrystalline silicon rod cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117162298A true CN117162298A (en) | 2023-12-05 |
Family
ID=88939644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311338651.7A Withdrawn CN117162298A (en) | 2023-10-17 | 2023-10-17 | Monocrystalline silicon rod cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117162298A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119658857A (en) * | 2024-12-05 | 2025-03-21 | 苏州市职业大学 | Automatic equipment for wafer cutting |
-
2023
- 2023-10-17 CN CN202311338651.7A patent/CN117162298A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119658857A (en) * | 2024-12-05 | 2025-03-21 | 苏州市职业大学 | Automatic equipment for wafer cutting |
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Application publication date: 20231205 |
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| WW01 | Invention patent application withdrawn after publication |