CN117046851A - Laser cleaning method for improving damage threshold of fused quartz element - Google Patents
Laser cleaning method for improving damage threshold of fused quartz element Download PDFInfo
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- CN117046851A CN117046851A CN202310957263.0A CN202310957263A CN117046851A CN 117046851 A CN117046851 A CN 117046851A CN 202310957263 A CN202310957263 A CN 202310957263A CN 117046851 A CN117046851 A CN 117046851A
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- cleaning
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- damage threshold
- fused quartz
- laser cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 239000005350 fused silica glass Substances 0.000 title claims abstract description 57
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000008646 thermal stress Effects 0.000 claims abstract description 21
- 230000007547 defect Effects 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- 238000009826 distribution Methods 0.000 claims abstract description 7
- 230000035882 stress Effects 0.000 claims abstract description 6
- 238000005406 washing Methods 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000007847 structural defect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Glass Melting And Manufacturing (AREA)
Abstract
A laser cleaning method for raising a damage threshold of a fused silica element, comprising: firstly, detecting the distribution and depth of surface and subsurface pollution defects by using an optical microscope and a fluorescence confocal microscope; then, measuring thermal stress at different cleaning depths by adopting a stress birefringence meter; performing laser cleaning without thermal stress by specific parameters so as to remove element surface and subsurface pollution and structural defects, wherein the process can realize uniform cleaning without damaging element roughness; and finally, ultrasonically cleaning the fused quartz element by adopting deionized water. The invention has simple operation and low cost, and can effectively remove defects and pollution only by laser cleaning, thereby realizing uniform cleaning without damaging roughness under the near stress-free condition and obviously improving the damage threshold of the fused quartz element. The method expands the application scene of laser processing and has great significance for improving the damage threshold of the strong laser system element.
Description
Technical Field
The invention belongs to the field of optical element processing and manufacturing, and particularly relates to a laser cleaning method for improving a damage threshold of a fused quartz element.
Background
In modern optical manufacturing, fused silica glass is the first choice material for core elements such as windows, focusing lenses, diffraction gratings and the like in most of the current strong laser systems due to wide band gaps, but with the continuous increase of the laser output energy requirements of the strong laser systems, the current material processing methods such as contact grinding and polishing of the main flow of the fused silica glass can generate defects and pollution such as cracks, scratches, impurities and the like on the processed surface, and the service life of the elements is seriously shortened. Although students at home and abroad use hydrofluoric acid, plasma and ion beams to clean the surfaces at present, reaction product deposition and ion pollution are introduced to the surfaces of the elements, the cost is high, the working procedures are complex, and the requirements of the existing optical element damage threshold cannot be met, so that a method for removing surface defects and pollution is necessary to be invented. Laser cleaning is a relatively economical non-contact machining method without introducing surface defects and polishing impurities, and has an inherent advantage in controlling machining defects such as scratches, cracks and the like, but the laser cleaning technology can seriously damage roughness and introduce thermal stress. Therefore, the laser cleaning method has not been reported to realize the processing without damaging the element roughness under the condition of almost no thermal stress, and simultaneously, the element damage threshold is improved, so that new theory and process are developed to realize the laser cleaning of the fused quartz material, and the method has important significance for improving the damage threshold of the fused quartz element, thereby ensuring the smooth operation of a strong laser system.
Patent document CN109570151a discloses a device and a cleaning method for cleaning an optical element by liquid flow ultrasonic composite auxiliary laser, and the method realizes laser cleaning under low stress by liquid flow ultrasonic auxiliary laser cleaning, so that unnecessary damage can be avoided, and the performance of the optical element is improved. The technical scheme has the defects that the surface roughness precision after laser cleaning cannot be ensured, only the surface pollution can be removed, the depth change removal cannot be performed according to the defect and the pollution distribution, and the pollution removal has a large limitation. Meanwhile, the problem is also the problem of most laser cleaning patents, and the subsurface defect cannot be removed only by removing surface pollution, so that the improvement of the laser damage threshold of the element material is limited.
Patent document CN114149180a discloses a processing method for raising the damage threshold of a fused quartz element, in which defects on the surface of a material are removed by plasma processing, thereby raising the laser damage threshold of the element. The disadvantage of this solution is that the element after plasma processing will generate new oxides, evolving into secondary pollution; in addition, the surface roughness of the component after plasma processing is seriously deteriorated; at the same time, plasma processing equipment is relatively expensive compared to laser cleaning equipment. The three disadvantages limit the development of the plasma processing technology in terms of improving the damage threshold of the optical element, and therefore, the plasma processing technology cannot be widely applied to the processing field of the high-damage-threshold element.
Disclosure of Invention
The invention aims to provide a laser cleaning method for improving the damage threshold of a fused quartz element, which controls the laser cleaning depth under specific parameters, realizes uniform cleaning without damaging the surface roughness under the condition of nearly no thermal stress, and obviously improves the damage threshold of the fused quartz element. The method is simple to operate and low in cost, expands the application scene of laser processing, and has great significance in improving the damage threshold of the strong laser system element.
The technical scheme of the invention is as follows:
a laser cleaning method for raising the damage threshold of a fused quartz component, comprising the steps of:
1) Detecting the range and depth distribution conditions of surface and subsurface pollution defects based on an optical microscope and a fluorescence confocal microscope, thereby performing targeted and accurate cleaning;
2) The stress birefringence meter is adopted to measure the thermal stress at different cleaning depths, so that the thermal stress is not obviously introduced in the cleaning process;
3) Near-stress free depth-varying laser cleaning at specific parameters: fixing the fused quartz element on a three-dimensional moving platform, placing a laser at a position 35mm-40mm away from the element for processing, changing the cleaning depth of the laser by controlling the pulse width, thereby accurately removing defects and pollution of different depths, and processing the fused quartz element according to the parameters in the laser cleaning process until the laser beam finishes the cleaning treatment of the surface of the fused quartz element, wherein the parameters can ensure that the roughness is not destroyed after cleaning;
4) Ultrasonic cleaning of a fused quartz element: washing with deionized water, then carrying out ultrasonic treatment in pure water at 20-30 ℃ for 10-15 minutes, washing with deionized water, and finally drying on an ultra-clean workbench to obtain an ultrasonic-cleaned fused quartz element;
5) Damage threshold test: the laser cleaned fused silica component was subjected to a 1-on-1 damage threshold test according to ISO21254, the test laser wavelength being 355nm, the pulse width being 8.3ns, the frequency being 10Hz.
In the variable-depth laser cleaning under the specific parameters in the step 2), as a further improvement of the invention, the laser power is set to 26.5W, the frequency is 95kHz, the scanning speed is 100mm/s, the scanning path spacing in the x direction and the y direction is 25.5 mu m, and the scanning path is set to be a grid-shaped path; the pulse width is regulated by an acousto-optic modulator, and the value of the pulse width is 55 mu s-65 mu s, so that the laser cleaning depth is controlled to be less than 200nm, and the generation of thermal stress and the damage of roughness are avoided.
Compared with the prior art, the invention has the following technical effects:
the laser cleaning is adopted to remove surface and subsurface pollution and defects, so that uniform cleaning without damaging roughness is realized under the near stress-free condition, and the damage threshold of the fused quartz element is obviously improved. The method is simple to operate and low in cost, expands the application scene of laser processing, and has great significance in improving the damage threshold of the strong laser system element.
Drawings
FIG. 1 is a flow chart of a method of processing a fused silica component to raise the damage threshold of the fused silica component in accordance with the present invention;
FIG. 2 is a schematic diagram of a processing method for increasing the damage threshold of a fused silica component according to the present invention;
FIG. 3 is a comparison of roughness before and after laser cleaning of fused silica components, where a is the initial roughness and b is the roughness after laser cleaning;
FIG. 4 is a comparison of thermal stresses before and after laser cleaning of fused silica components, where a is the initial thermal stress and b is the thermal stress after laser cleaning;
FIG. 5 is a comparison of damage thresholds before and after laser cleaning treatment of fused silica components.
Detailed Description
The laser cleaning method for raising the damage threshold of the fused silica component is described in detail below with reference to the accompanying drawings and examples, but should not be construed as limiting the scope of the invention.
The parameters of the embodiment are set as follows: the laser power is set to 26.5W, the laser frequency is set to 95kHz, the scanning speed is set to 100mm/s, the path distance between the x direction and the y direction is set to 25.5 mu m, the beam radius is set to 150 mu m, the pulse width range is set to 55 mu s-65 mu s, and the workpiece to be processed is a square fused quartz plane workpiece with the side length of 30mm and the thickness of 6 mm.
A laser cleaning method for raising damage threshold of fused quartz element is shown in figure 1. As can be seen, the method comprises the steps of:
1) First, the contamination and defect distribution of the surface was observed based on an optical microscope. Detecting the range and depth distribution conditions of subsurface pollution and defects by a fluorescence confocal microscope; the distribution condition of surface and subsurface defects and pollution can be comprehensively displayed by two detection means;
2) The stress birefringence meter is adopted to measure the thermal stress at different cleaning depths, so that the thermal stress is not obviously introduced in the cleaning process, and when the cleaning depth is less than 200nm, the residual thermal stress is not generated;
3) Depth-varying laser cleaning under specific parameters: because the fused quartz element is fixed on the three-dimensional moving platform, the laser is placed at a position which is 35mm-40mm away from the element for processing, the laser cleaning depth is changed by controlling the pulse width, so that defects and pollution of different depths are removed, the laser is preheated for 30 minutes before laser cleaning, then the laser cleaning is carried out, the fused quartz element is processed according to the parameters in the cleaning process until the laser beam finishes the cleaning treatment of the surface of the fused quartz element, and a laser cleaning equipment diagram is shown in figure 2;
4) Ultrasonic cleaning of a fused quartz element: washing with deionized water, then carrying out ultrasonic treatment in pure water at 20-30 ℃ for 10-15 minutes, washing with deionized water, and finally drying on an ultra-clean workbench to obtain an ultrasonically cleaned fused quartz element, wherein the pretreatment environment is thousands of grades clean;
5) Damage threshold test: the laser cleaned fused silica component was subjected to a 1-on-1 damage threshold test according to ISO21254, the test laser wavelength being 355nm, the pulse width being 8.3ns, the frequency being 10Hz.
The roughness of the fused silica component processed by the method of the present invention was measured using a 4D optical profilometer (NanoCam Sq,4D Technology) with a test size of 0.2mm x 0.2mm, and the results are shown in fig. 3, wherein (a) is the roughness of the fused silica component before processing by the method of the present invention, and (b) is the roughness of the fused silica component after processing by the method of the present invention; the thermal stress of the fused silica component processed by the method of the present invention was measured using a stress birefringence meter (strain gauge M4/150.10, ILIS Gmbh), and the results are shown in FIG. 4, wherein (a) is the thermal stress of the fused silica component before processing by the method of the present invention, and (b) is the thermal stress of the fused silica component after processing by the method of the present invention. The result shows that the roughness RMS value of the fused quartz element is changed from 0.968nm to 1.032nm before and after the processing by the method, the thermal stress is changed from 0.52nm/cm to 0.53nm/cm before the processing, and the roughness of the fused quartz element can not be damaged under the near stress-free condition when the fused quartz element is processed by the processing method.
Then, the fused silica element before and after the processing according to the method of the invention is subjected to a 1 on 1 damage threshold test according to the international standard ISO21254, as shown in FIG. 5, the fused silica element before and after the laser cleaning treatment has a 0% probability damage threshold of from 17.1J/cm 2 Lifting to 25.5J/cm 2 The 100% probability damage threshold is from 39.3J/cm 2 Lifting to 47.9J/cm 2 The processing results observed in the examples demonstrate the very significant practical effect of the invention.
The laser cleaning is adopted to remove surface and subsurface pollution and defects, so that uniform cleaning without damaging roughness is realized under the near stress-free condition, and the damage threshold of the fused quartz element is obviously improved. The method is simple to operate and low in cost, expands the application scene of laser processing, and has great significance in improving the damage threshold of the strong laser system element.
Claims (3)
1. A laser cleaning method for raising a damage threshold of a fused silica element, comprising:
s1, cleaning according to the range and depth distribution of the surface and subsurface pollution defects detected by an optical microscope and a fluorescence confocal microscope, and synchronously measuring the thermal stress at different cleaning depths by using a stress birefringence meter to ensure that no explicit thermal stress is introduced in the cleaning process;
s2, near-stress-free depth-variable laser cleaning under specific parameters: fixing a fused quartz element on a three-dimensional moving platform, placing a laser at a position 35-40 mm away from the element for processing, changing the laser cleaning depth by controlling the pulse width, and removing defects and pollution at different depths, wherein the laser cleaning process is used for processing the fused quartz element according to the parameters until the laser beam finishes the cleaning treatment of the surface of the fused quartz element, and the parameters can ensure that the roughness is not destroyed after cleaning;
s3, ultrasonic cleaning of a fused quartz element: washing with deionized water, then carrying out ultrasonic treatment in pure water at 20-30 ℃ for 10-15 minutes, washing with deionized water, and finally drying on an ultra-clean workbench to obtain the fused quartz element after ultrasonic cleaning.
2. The laser cleaning method for raising the damage threshold of a fused silica element as claimed in claim 1, wherein the laser power is set to 26.5W, the frequency is 95kHz, the scanning speed is 100mm/s, the scanning path pitch in the x-direction and the y-direction is 25.5 μm, and the scanning path is set to a grid-shaped path; the pulse width is regulated by an acousto-optic modulator, and the value of the pulse width is 55 mu s-65 mu s, so that the laser cleaning depth is controlled to be less than 200nm, and the generation of thermal stress and the damage of roughness are avoided.
3. The laser cleaning method for raising a damage threshold of a fused silica component according to claim 1, wherein: s4, damage threshold test: the laser cleaned fused silica component was subjected to a 1-on-1 damage threshold test according to ISO21254, the test laser wavelength being 355nm, the pulse width being 8.3ns, the frequency being 10Hz.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310957263.0A CN117046851A (en) | 2023-08-01 | 2023-08-01 | Laser cleaning method for improving damage threshold of fused quartz element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310957263.0A CN117046851A (en) | 2023-08-01 | 2023-08-01 | Laser cleaning method for improving damage threshold of fused quartz element |
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| CN117046851A true CN117046851A (en) | 2023-11-14 |
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| CN202310957263.0A Pending CN117046851A (en) | 2023-08-01 | 2023-08-01 | Laser cleaning method for improving damage threshold of fused quartz element |
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- 2023-08-01 CN CN202310957263.0A patent/CN117046851A/en active Pending
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