CN117043939A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN117043939A
CN117043939A CN202180096198.6A CN202180096198A CN117043939A CN 117043939 A CN117043939 A CN 117043939A CN 202180096198 A CN202180096198 A CN 202180096198A CN 117043939 A CN117043939 A CN 117043939A
Authority
CN
China
Prior art keywords
circuit pattern
electrode
semiconductor device
pair
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180096198.6A
Other languages
English (en)
Chinese (zh)
Inventor
中原贤太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN117043939A publication Critical patent/CN117043939A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180096198.6A 2021-03-29 2021-03-29 半导体装置 Pending CN117043939A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013259 WO2022208603A1 (ja) 2021-03-29 2021-03-29 半導体装置

Publications (1)

Publication Number Publication Date
CN117043939A true CN117043939A (zh) 2023-11-10

Family

ID=83455713

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180096198.6A Pending CN117043939A (zh) 2021-03-29 2021-03-29 半导体装置

Country Status (5)

Country Link
US (1) US20240071868A1 (https=)
JP (1) JP7438454B2 (https=)
CN (1) CN117043939A (https=)
DE (1) DE112021007408T5 (https=)
WO (1) WO2022208603A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277870A (ja) * 1988-06-30 1990-03-16 Mitsubishi Electric Corp 並列計算機システム
JPH0277870U (https=) * 1988-12-02 1990-06-14
JP2850606B2 (ja) * 1991-11-25 1999-01-27 富士電機株式会社 トランジスタモジュール
JP3396566B2 (ja) * 1995-10-25 2003-04-14 三菱電機株式会社 半導体装置
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
CN105981167B (zh) * 2014-08-12 2019-05-28 富士电机株式会社 半导体装置
BE1028071B1 (de) * 2020-02-19 2021-09-13 Phoenix Contact Gmbh & Co Elektrisches Kontaktelement

Also Published As

Publication number Publication date
DE112021007408T5 (de) 2024-01-18
JP7438454B2 (ja) 2024-02-26
JPWO2022208603A1 (https=) 2022-10-06
US20240071868A1 (en) 2024-02-29
WO2022208603A1 (ja) 2022-10-06

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