CN117012736B - Power module heat dissipation substrate and manufacturing method thereof - Google Patents
Power module heat dissipation substrate and manufacturing method thereof Download PDFInfo
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- CN117012736B CN117012736B CN202311127968.6A CN202311127968A CN117012736B CN 117012736 B CN117012736 B CN 117012736B CN 202311127968 A CN202311127968 A CN 202311127968A CN 117012736 B CN117012736 B CN 117012736B
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- 239000000758 substrate Substances 0.000 title claims abstract description 66
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000005266 casting Methods 0.000 claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- 239000002131 composite material Substances 0.000 claims abstract description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 230000008569 process Effects 0.000 claims abstract description 30
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 238000010273 cold forging Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000009749 continuous casting Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 19
- 238000005242 forging Methods 0.000 claims description 9
- 239000000498 cooling water Substances 0.000 claims description 6
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007531 graphite casting Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a power module radiating substrate and a manufacturing method thereof. The heat dissipation substrate is made of a composite material consisting of graphene and copper as a substrate, and the manufacturing method comprises the continuous casting, cutting and cold forging forming processes of the composite substrate. The method comprises the steps of casting a copper liquid, coating a solid carbon source on the middle section of the copper liquid, growing large-area graphene on the surface of the liquid copper at high temperature, cooling the rear section of the copper liquid by using an external water tank of the cooler, and pulling out a graphene-copper composite material casting. Cutting according to the size requirement of the radiating substrate of the power module, and improving the density of the composite material casting through a cold forging process. The manufacturing method can improve the heat conductivity and the heat diffusivity of the heat dissipation substrate, simplify the manufacturing process flow of the heat dissipation substrate, is compatible with the graphene growth process, and can obtain the heat dissipation substrate of the high-heat-conductivity power module for mass production and improve the production efficiency and the yield.
Description
Technical Field
The invention relates to a power module radiating substrate and a manufacturing method thereof, and belongs to the technical field of power semiconductors.
Background
The power module heat dissipation substrate is a heat dissipation product widely used in the application field of power modules represented by new energy automobiles at present. With the continuous development of third generation semiconductor materials, more and more silicon carbide (SiC) power devices or SiC-Si hybrid modules are being applied in new energy automobiles. Compared with a silicon-based module, the device has small volume and more concentrated chip heat flux density, so that higher requirements are put on the packaging of the power module and the efficiency of heat dissipation products. At present, a main stream power module packaging adopts a direct liquid cooling heat dissipation mode, the power module is directly connected with a heat dissipation substrate, and a heat conduction silicone grease layer with poor heat conduction performance is removed, so that the overall packaging heat resistance is reduced, however, the heat dissipation substrate is closer to a heat source, and parameters such as heat conductivity, heat diffusivity and the like play a key role in the heat dissipation efficiency of the power module.
In order to improve the heat conduction performance of the heat dissipation substrate of the power module, patents and papers have also proposed that a graphene layer is manufactured on the surface of the packaging lining plate of the power module to help the lateral diffusion of local heat, but the method is not suitable for mass production. The batch manufacturing of the existing radiating substrate comprises a series of process flows of casting and drawing, extrusion forming, cutting and forging, the production steps are tedious and time-consuming, and impurities are easy to introduce. Therefore, the patent provides the graphene-copper composite substrate-based power module radiating substrate which can be produced in batch and has improved radiating performance and the manufacturing method thereof on the basis of simplifying the manufacturing flow of the power module radiating substrate and simultaneously being compatible with the growth process of graphene.
Disclosure of Invention
The invention aims to meet the requirement of high heat dissipation efficiency of a new generation of vehicle-standard grade SiC power module, and provides a high heat conduction power module heat dissipation substrate and a manufacturing method thereof.
The heat dissipation substrate is made of a composite material consisting of graphene and copper, wherein a graphene film is dispersed in metal copper, and graphene exists in a bottom plate and a pin array of the heat dissipation substrate at the same time; the manufacturing method comprises continuous casting, cutting and cold forging forming processes.
In the casting process, the front section of the casting mould is inserted into copper liquid, the inner wall of the middle section of the casting mould is uniformly coated with a solid carbon source, the solid carbon source is decomposed into carbon atoms at high temperature, and graphene is deposited and grown on the surface of liquid copper when the copper liquid passes through the casting mould, so that a graphene-copper composite material is obtained; after the composite material flows into the rear section of the casting mould to be cooled, the casting of the composite material is pulled out from the outlet;
in the cutting process, the obtained casting of the composite material is cut according to the length requirement of the radiating substrate of the power module, so that a sparse radiating substrate composite base material is obtained;
in the cold forging forming process, the obtained heat dissipation base plate composite base material is forged and pressed into a base plate and a pin array according to the shape required by the power module heat dissipation base plate by adopting the cold forging process.
Specifically, the casting mould is made of artificial graphite, and a water tank is arranged at the periphery of the casting mould.
Specifically, the outer wall of the casting mould is milled with a cooling water ditch.
Specifically, the shape of the outlet of the casting mould is a bar type or a plate type, and the plate type is divided into two types, namely a non-boss type and a boss type; the outlet of the rod type is used for drawing out the rod type casting, the outlet of the plate type without the boss is used for drawing out the casting without the boss, and the outlet of the plate type with the boss is used for drawing out the casting with the boss.
In the cold forging forming process, the composite base material obtained by cutting the rod-shaped casting is subjected to forging and forming twice; and (3) forming the composite base material obtained by cutting the plate-shaped casting in one step in a cold forging forming process.
The invention has the following advantages:
1. the invention provides a heat dissipation substrate based on a graphene-copper composite substrate and designs a manufacturing method thereof aiming at the problem of concentrated heat flux of a SiC power module, so that the heat conductivity and the heat diffusivity of a heat dissipation substrate product are improved.
2. On the basis of simplifying the manufacturing process flow of the radiating substrate, the method is compatible with the graphene growth process, so that the manufacturing method for mass-producing the radiating substrate of the high-heat-conductivity power module is obtained, and the production efficiency and the yield are improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a pin heat dissipating substrate.
Fig. 2 is a schematic plan structure of a graphene film applied to a surface of a heat dissipation substrate.
Fig. 3 is a schematic cross-sectional view of a pin-type heat dissipating substrate with a composite substrate according to the present invention.
Fig. 4 is a schematic view of an apparatus for a continuous casting process in an embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a mold (bar type) of the outlet of a cooler in an embodiment of the invention.
Fig. 6a is a schematic cross-sectional view of a mold (no boss plate type) of the cooler outlet in an embodiment of the present invention.
Fig. 6b is a schematic cross-sectional view of a mold (boss plate type) of the cooler outlet in an embodiment of the present invention.
FIG. 7 is a schematic view of the microstructure of a graphene-copper composite substrate in an embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the drawings and examples.
The invention is used for manufacturing the heat dissipation substrate in the power module thermal management structure. In the prior art, the heat dissipation substrate is usually made of pure metal material such as copper or aluminum, and the heat dissipation substrate product in the embodiment of the present invention is shown in fig. 1, and is a pin heat dissipation substrate 30 made of copper metal, including a bottom plate 31 and a pin array 32. In order to improve the heat conductivity of the heat dissipation substrate 30, patent and paper propose transferring a large-area graphene film 41 to the surface of the bottom plate 31, as shown in fig. 2, when the lower surface of the power module and the upper surface of the heat dissipation substrate 30 adopt a direct interconnection packaging mode, the heat conductivity in the horizontal plane of the graphene film is very high, which is favorable for the heat of the local hot spot in the power module to be rapidly diffused in the plane, but because the heat conductivity in the vertical plane of the graphene film is lower, the heat cannot be timely dissipated to the environment through the heat dissipation substrate, and the heat dissipation efficiency of the power module is affected.
The heat dissipation substrate 30 according to the present invention is made of a composite material of graphene 22 and metallic copper 21 as a base material, as shown in fig. 3, the graphene 22 is dispersed in the metallic copper 21. The two materials are combined and present in both the base plate 31 and the pin array 32, which not only enhances the heat diffusivity in the horizontal plane, but also conducts rapidly in the vertical plane, thereby achieving more efficient thermal management. The lower surface of the lower metal of the packaging lining plate of the power module is exposed outside the module shell and is directly connected with the upper surface of the bottom plate 31 of the heat dissipation substrate provided by the invention through an interconnection process. The interconnection process may be soldering or sintering.
The batch manufacturing of the heat dissipation substrate comprises a series of process flows of casting and drawing, extrusion forming, cutting and forging, and the production steps are complicated and time-consuming, because the blank obtained by the casting and drawing process is generally sparse in organization structure, the material strength is required to be improved through the extrusion forming process, and impurities are easily introduced into the process. The cold forging manufacturing method for the power module radiating basal plate product has the advantage of improving the hardness of the blank, can simplify the process flow, and realizes the high-efficiency production of the power module radiating basal plate through continuous casting, cutting and cold forging forming.
Fig. 4 is a schematic view showing an apparatus for carrying out a continuous casting process in an embodiment of the present invention, which comprises three parts of a furnace wall 10 of a melting furnace, a charging tank 11, and a cooler. The cooler is of a combined structure and consists of an inner casting mould 12 and an outer water tank 13.
Wherein the casting mould 12 adopts artificial graphite, which is favorable for solidification of molten metal because of good heat conduction property, and has good self-lubricating property, high casting speed, accurate casting size and smooth surface. The outer wall of the casting mould 12 is milled with cooling water channels. The outside of the casting mould 12 is provided with a steel water tank 13, a cooling water inlet 131 is arranged on the side of the lower part of the water tank 13 close to the furnace wall 10, and a cooling water outlet 132 is arranged on the upper part of the water tank 13.
The molten copper 15 is placed in the furnace wall 10 through the charging chute 11, the front section of the mold 12 is inserted into the molten copper 15, and the molten copper 15 is passed through the mold 12 and the casting 16 is pulled out from the upper outlet of the mold 12. The inner wall of the middle section of the casting mould 12 is uniformly coated with a solid carbon source layer 17, and is decomposed into carbon atoms at high temperature, and graphene is deposited and grown on the surface of the liquid copper 15. The rear section of the mold 12 cools the graphene-copper composite.
In the embodiment, the outlet of the mold 12 has two structures, as shown in fig. 5, 6a, and 6b, which are bar-type and plate-type, respectively, and the plate-type structure is divided into a plate-type without boss of fig. 6a and a plate-type with boss of fig. 6 b.
The bar outlets 121 may draw out bar castings 161. The diameter R of the material is 16+/-0.5 mm or 20+/-0.5 mm or 25+/-0.5 mm or 30+/-0.5 mm according to different product requirements.
The plateless plate-type outlet 122 may be drawn out of the plateless plate-type casting 162. The length a in FIG. 6a is 120.+ -. 2mm or 100.+ -. 2mm or 90.+ -. 2mm or 80.+ -. 2mm or 70.+ -. 2mm and the width b is 12.+ -. 0.5mm or 10.+ -. 0.5mm or 8.+ -. 0.5mm according to different product requirements.
For products with boss requirements, the boss plate-type outlet 123 provided by the embodiment of the invention can directly pull out the boss plate-type casting 163. Width b in fig. 6b 2 3.5+ -0.5 mm, b 1 The length a is 12+/-0.5 mm or 10+/-0.5 mm or 8+/-0.5 mm or 7+/-0.5 mm, the length a is 120+/-2 mm or 110+/-2 mm or 100+/-2 mm or 90+/-2 mm, and the boss length c is 100+/-2 mm or 90+/-2 mm or 80+/-2 mm or 70+/-2 mm.
The following provides an embodiment of the method for manufacturing the heat dissipation substrate of the power module, and the general flow is as follows:
step 1: according to the shape and size requirements of the power module radiating substrate, processing an artificial graphite casting mould 12 with a rod-shaped outlet structure and a plate-shaped outlet structure, and uniformly coating a solid carbon source material 17, such as natural crystalline flake graphite powder or polystyrene and other carbon-containing polymer composite materials, on the inner wall of the middle section of the casting mould 12.
Step 2: and (3) milling a cooling water ditch on the outer wall of the casting mould 12 obtained in the step (1), adding an external steel water tank 13, and assembling the cooler for later use.
Step 3: the front section of the casting mould 12 of the cooler assembled in the step 2 is inserted into molten metal copper liquid 15, a solid carbon source 17 coated on the inner wall of the middle section of the casting mould 12 is decomposed into carbon atoms at high temperature, and the carbon atoms are recombined on the surface of liquid copper 21 to generate a graphene film in the process that the copper liquid 15 flows upwards through the casting mould 12, so that a graphene-copper composite material is obtained, and the microstructure of the graphene-copper composite material is shown in figure 7.
Compared with solid copper, the graphene 22 grows on the surface of the liquid copper 21 at a higher speed, and the good fluidity and uniformity of the liquid copper are beneficial to eliminating the grain boundary of the graphene, so that the high-quality large-area graphene film is obtained. The inherent difficulty of the technology is that the temperature of the growing environment needs to be raised to be higher than the melting point 1083 ℃ of copper, but in the manufacturing method provided by the embodiment of the invention, the growing process of graphene is fused with the drawing process of a casting, and the graphene 22 is directly grown on the surface of the liquid copper 21 by means of the high temperature of molten copper. Another advantage of using the artificial graphite mold 12 is that the liquid copper can spread out on the graphite surface, which is more conducive to growing large areas of graphene than the spherical morphology on other materials.
Step 4: the composite material in the step 3 flows into the rear section of the casting mould 12, and after the cooling effect of the water tank 13, a rod-shaped or plate-shaped graphene-copper composite material casting is pulled out from the outlet of the casting mould 12. The sectional shapes of the bar-shaped castings 161, the non-boss plate-shaped castings 162 and the boss plate-shaped castings 163 are respectively shown in fig. 5, 6a and 6 b.
Step 5: cutting the casting of the composite material obtained in the step 4 according to the length requirement of the heat dissipation substrate of the power module to obtain the heat dissipation substrate composite substrate to be processed, wherein the structure of the heat dissipation substrate composite substrate to be processed is loose.
Step 6: and (3) forging the composite base material obtained in the step (5) by adopting a cold forging process according to the structure required by the heat dissipation base plate of the power module, and enhancing the strength of the composite base material to obtain the heat dissipation base plate finished product shown in fig. 3. The rod-shaped base material is subjected to twice forging and pressing, namely, the rod-shaped base material is pressed to a plate shape by one forging and pressing, and the needle structure required by a product is manufactured on the plate-shaped base material by the two forging and pressing; and if the composite substrate produced in the previous step is a plate-type substrate, the composite substrate can be formed by one-step forging and pressing.
According to the manufacturing method of the radiating substrate based on the graphene-copper composite substrate, disclosed by the invention, casting drawing and graphene growth are integrated, the high-temperature condition and the cooling parameter are considered, the graphene-copper composite substrate with high quality can be obtained through a regulating and controlling process, the thermal conductivity and the thermal diffusivity of the graphene-copper composite substrate are greatly improved compared with those of similar products, and the graphene-copper composite substrate is suitable for high-efficiency thermal management of a new-generation SiC power module.
The present invention is not limited to the preferred embodiments described herein, but is intended to cover modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (5)
1. The manufacturing approach of a power module heat dissipating substrate, characterized by, include the continuous casting, cutting and cold forging shaping process;
in the casting process, the front section of the casting mould is inserted into copper liquid, the inner wall of the middle section of the casting mould is uniformly coated with a solid carbon source, the solid carbon source is decomposed into carbon atoms at high temperature, and graphene is deposited and grown on the surface of liquid copper when the copper liquid passes through the casting mould, so that a graphene-copper composite material is obtained; after the composite material flows into the rear section of the casting mould to be cooled, the casting of the composite material is pulled out from the outlet;
in the cutting process, the obtained casting of the composite material is cut according to the length requirement of the radiating substrate of the power module, so that a sparse radiating substrate composite base material is obtained;
in the cold forging forming process, the obtained heat dissipation base plate composite base material is forged and pressed into a base plate and a pin array according to the shape required by the power module heat dissipation base plate by adopting the cold forging process.
2. The method of manufacturing a heat dissipating substrate for a power module according to claim 1, wherein the mold is made of artificial graphite, and a water tank is provided at the periphery of the mold.
3. The method of claim 1, wherein the outer wall of the mold is formed with cooling water grooves.
4. The method for manufacturing a heat dissipating substrate for a power module according to claim 1, wherein the shape of the mold outlet is a bar type or a plate type, and the plate type is divided into two types, i.e., no boss and a boss; the outlet of the rod type is used for drawing out the rod type casting, the outlet of the plate type without the boss is used for drawing out the casting without the boss, and the outlet of the plate type with the boss is used for drawing out the casting with the boss.
5. The method for manufacturing a heat dissipating substrate for a power module according to claim 4, wherein the composite substrate obtained by cutting the bar-shaped casting is subjected to two forging and pressing processes in the cold forging and forming process; and (3) forming the composite base material obtained by cutting the plate-shaped casting in one step in a cold forging forming process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311127968.6A CN117012736B (en) | 2023-09-04 | 2023-09-04 | Power module heat dissipation substrate and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311127968.6A CN117012736B (en) | 2023-09-04 | 2023-09-04 | Power module heat dissipation substrate and manufacturing method thereof |
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| CN117012736B true CN117012736B (en) | 2024-01-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339945A (en) * | 2011-10-29 | 2012-02-01 | 华南师范大学 | High-power light-emitting diode (LED) with cooling substrate made of diamond powder-copper powder composite |
| CN103343246A (en) * | 2013-07-03 | 2013-10-09 | 上海大学 | Preparation method of long-size dispersion strengthening copper-based composite material and casting device thereof |
| CN106077535A (en) * | 2016-07-14 | 2016-11-09 | 深圳市烯世传奇科技有限公司 | A kind of method of Graphene modification single crystal Cu |
| CN108531769A (en) * | 2018-04-16 | 2018-09-14 | 厦门奈福电子有限公司 | A kind of graphene-metallic composite and its prepare raw material, method and application |
| CN110117729A (en) * | 2019-04-26 | 2019-08-13 | 厦门百路达高新材料有限公司 | A method of producing graphene metal |
-
2023
- 2023-09-04 CN CN202311127968.6A patent/CN117012736B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102339945A (en) * | 2011-10-29 | 2012-02-01 | 华南师范大学 | High-power light-emitting diode (LED) with cooling substrate made of diamond powder-copper powder composite |
| CN103343246A (en) * | 2013-07-03 | 2013-10-09 | 上海大学 | Preparation method of long-size dispersion strengthening copper-based composite material and casting device thereof |
| CN106077535A (en) * | 2016-07-14 | 2016-11-09 | 深圳市烯世传奇科技有限公司 | A kind of method of Graphene modification single crystal Cu |
| CN108531769A (en) * | 2018-04-16 | 2018-09-14 | 厦门奈福电子有限公司 | A kind of graphene-metallic composite and its prepare raw material, method and application |
| CN110117729A (en) * | 2019-04-26 | 2019-08-13 | 厦门百路达高新材料有限公司 | A method of producing graphene metal |
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