CN116939980A - High-heat-dissipation flexible LED circuit board and preparation method thereof - Google Patents
High-heat-dissipation flexible LED circuit board and preparation method thereof Download PDFInfo
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- CN116939980A CN116939980A CN202311208681.6A CN202311208681A CN116939980A CN 116939980 A CN116939980 A CN 116939980A CN 202311208681 A CN202311208681 A CN 202311208681A CN 116939980 A CN116939980 A CN 116939980A
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- circuit board
- heat
- led circuit
- flame
- mixing
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- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000003063 flame retardant Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 54
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000003365 glass fiber Substances 0.000 claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 14
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 14
- 238000003475 lamination Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000013461 design Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 43
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 37
- 239000000499 gel Substances 0.000 claims description 35
- 239000003054 catalyst Substances 0.000 claims description 31
- 239000011259 mixed solution Substances 0.000 claims description 27
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 26
- 229920000647 polyepoxide Polymers 0.000 claims description 26
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 18
- 239000011159 matrix material Substances 0.000 claims description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims description 18
- 239000011574 phosphorus Substances 0.000 claims description 18
- 229910052697 platinum Inorganic materials 0.000 claims description 18
- 239000000741 silica gel Substances 0.000 claims description 18
- 229910002027 silica gel Inorganic materials 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 18
- ALYNCZNDIQEVRV-UHFFFAOYSA-N aniline-p-carboxylic acid Natural products NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 claims description 14
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 14
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 14
- HIVGXUNKSAJJDN-UHFFFAOYSA-N [Si].[P] Chemical compound [Si].[P] HIVGXUNKSAJJDN-UHFFFAOYSA-N 0.000 claims description 13
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 12
- 229960004050 aminobenzoic acid Drugs 0.000 claims description 11
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 8
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 8
- 229910019142 PO4 Inorganic materials 0.000 claims description 7
- 239000010452 phosphate Substances 0.000 claims description 7
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 229920000734 polysilsesquioxane polymer Polymers 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000001029 thermal curing Methods 0.000 claims description 6
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000010526 radical polymerization reaction Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 238000012512 characterization method Methods 0.000 description 58
- 238000005452 bending Methods 0.000 description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 25
- 230000008569 process Effects 0.000 description 24
- 239000000203 mixture Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 14
- 238000002679 ablation Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000003057 platinum Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005069 Extreme pressure additive Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to the technical field of circuit boards, and particularly relates to a high-heat-dissipation flexible LED circuit board and a preparation method thereof. The method comprises the following steps: step 1: carrying out circuit design and arrangement on a polytetrafluoroethylene glass fiber substrate to form a pretreatment plate; step 2: coating heat-conducting gel on the surface of the circuit, arranging a flame-retardant sheet between the two pretreatment plates after the circuits of the two pretreatment plates are aligned in opposite directions, and performing heat treatment after lamination to obtain a high-heat-dissipation flexible LED circuit board; the heat conducting gel is modified heat conducting gel; the flame-retardant sheet is a modified flame-retardant sheet. The LED circuit board with high heat dissipation performance and high flexibility is manufactured, the circuit board is not easy to separate from the edge, the edge is tilted and separated after being bent, the bonding strength of the flame retardant sheet and the substrate is strong, and the flame retardant performance of the LED circuit board is enhanced, so that the LED circuit board has self-extinguishing capability.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a high-heat-dissipation flexible LED circuit board and a preparation method thereof.
Background
LEDs are a common lighting device that is commonly used in residential, commercial and industrial applications.
The LED circuit board lamp area of current commonly used metal-based circuit board preparation is all crooked use as required in a lot of positions when using, and the lamp area is when crooked use generally all very easily causes the circumstances of circuit board bending fracture, and for example long lamp area is because of the tensile fracture of self weight when installing, and the copper of crooked back has thick copper line lamp area circuit board thick copper to the circuit board top to break, the waterproof resin of lamp area package is crooked to the circuit board top to break, how to solve the crooked and tensile breakable problem of LED circuit board lamp area is a difficult problem in industry. The LED circuit board lamp strip manufactured by the plastic base circuit board has the advantages that the base plate is overheated when in use, the insulation is lost, the electric breakdown phenomenon occurs, and the service life is short; the bending strength of the LED circuit board lamp strip manufactured by the ceramic-based circuit board is weak, and the flexible circuit board cannot be manufactured.
The polytetrafluoroethylene used for the common plastic base substrate is generally called as a non-stick coating or an easy-to-clean material, and the material has the characteristics of acid resistance and alkali resistance, is almost insoluble in all solvents, but has relatively poor binding force with copper materials, so that in order to ensure the binding effect, a two-plate pressing mode is adopted as a composite plate during use. However, polytetrafluoroethylene composite sheets suffer from the following drawbacks: the device is easy to break and damage, short in service life and poor in heat conductivity, gaps can be generated between two tetrafluoroethylene glass fiber substrates in the lamination heat treatment process, and if lamination deviation causes circuit damage. Meanwhile, the composite board is attached to the double-sided conductive lines in opposite directions, so that a certain electric breakdown risk exists.
Disclosure of Invention
In order to solve the problems that the existing metal-based circuit board is easy to bend and break, the ceramic-based circuit board basically does not have bending capability, the conventional plastic-based circuit board is generally made of polytetrafluoroethylene, the service life is short, the thermal conductivity is poor, the circuit board is easy to break and break due to the fact that bending acute angles are easy to occur, and the like, the invention provides a high-heat-dissipation flexible LED circuit board and a preparation method of the circuit board.
The invention aims at:
1. ensuring that the substrate and the copper material have better combination effect;
2. the prepared composite circuit board has good flexibility;
3. the breakdown resistance of the circuit board can be effectively improved.
In order to achieve the above purpose, the present invention adopts the following technical scheme.
A preparation method of a high heat dissipation flexible LED circuit board,
the method comprises the following steps:
step 1: carrying out circuit design and arrangement on a polytetrafluoroethylene glass fiber substrate to form a pretreatment plate;
step 2: coating heat-conducting gel on the surface of the circuit, arranging a flame-retardant sheet between the two pretreatment plates after the circuits of the two pretreatment plates are aligned in opposite directions, and performing heat treatment after lamination to obtain a high-heat-dissipation flexible LED circuit board;
the heat conducting gel in the step 2 is modified heat conducting gel;
the modified heat-conducting gel is prepared by the following method:
mixing 7-10 wt% of alkyl phosphate, 57-60 wt% of divinyl end-capped polydimethylsiloxane and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 30-60 min at the temperature of 85-95 ℃, adding a platinum catalyst, 2-phenyl-3-butine-2-ol, disilyl end-capped polydimethylsiloxane and dodecyl trimethyl siloxane after the mixed solution is cooled to room temperature, and carrying out ultrasonic mixing until the mixed solution is gel-like, thus obtaining the heat-conducting gel;
the flame-retardant sheet is a modified epoxy resin flexible flame-retardant sheet.
As a preferred alternative to this,
the polytetrafluoroethylene glass fiber substrate in the step 1 is a resin substrate made of glass fibers mixed when tetrafluoroethylene is subjected to free radical polymerization.
As a preferred alternative to this,
the dosage of the platinum catalyst is 0.1-0.3 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the 2-phenyl-3-butine-2-alcohol is 0.03-0.07 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the disilyl hydrogen end-capped polydimethylsiloxane is 0.03-0.07 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the dodecyl trimethyl siloxane is 2.5-3.5-wt% of the total mass of the silica gel matrix mixed solution.
As a preferred alternative to this,
the platinum catalyst is a 4-aminobenzoic acid modified platinum catalyst.
As a preferred alternative to this,
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
mixing gamma-glycidoxy trimethoxy silane with acetone (1.8-2.2): mixing according to the mass ratio of 1, adding phosphoric acid with the mass of 0.05-0.10 wt% of gamma-glycidoxy trimethoxy silane, stirring for 30-60 min, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3: (1.8-2.2): (4.8-5.2) mixing and dissolving in ethanol, regulating the pH value to 4-6 by phosphoric acid, stirring 1-3 h at normal temperature, and drying to obtain a powdery silicon-phosphorus hybrid, wherein the bisphenol A type epoxy resin and the powdery silicon-phosphorus hybrid are prepared by the following steps of: (2.5-4) mixing in mass ratio, adding 0.6-1.0 times of the gamma-glycidoxy trimethoxy silane and 4, 4-diamino diphenyl methane, uniformly mixing, and then placing into a mould for thermal curing to obtain the modified epoxy resin flexible flame-retardant sheet.
The high-heat-dissipation flexible LED circuit board is manufactured by the method.
For the technical scheme of the invention, the core is to provide the special heat-conducting gel which can infiltrate the surface of the circuit, can generate good protection effect on the circuit, provide heat-conducting and heat-radiating performance, and can strengthen the binding force of the substrate, the conductive circuit and the flame-retardant sheet, in particular to improve the binding force of the substrate and the flame-retardant sheet.
The invention uses the platinum catalyst modified by 4-aminobenzoic acid to replace pure platinum catalysis when preparing heat-conducting gel, the pure platinum catalyst has certain catalysis effect on hydrosilylation, but the storage modulus is overlarge, the heat-conducting gel can generate a cross-linking network after solidification, the plasticity is reduced, the solidified gel becomes crisp, the bending limit of an LED circuit board and the bonding effect actually generated by the heat-conducting gel are reduced, after the pure platinum catalyst contacts with impurity components in common electric conduction circuits such as nitrogen, phosphorus, sulfur elements or lead, mercury and the like, the activity of the platinum catalyst is reduced, namely the catalyst is poisoned, the bonding effect is influenced, and even the bonding effect is not effective, so that the platinum catalyst is prevented from being poisoned in the using process.
Meanwhile, as the platinum catalyst modified by 4-aminobenzoic acid forms a compact complete ammonia-substituted protective layer outside the silicon hydrogen bond bone, the spiral structure can infiltrate into the flame retardant sheet after contacting with the surface of the flame retardant sheet, and fills the space gap of the flexible flame retardant sheet, when the external temperature rises rapidly, the amino group and the phosphorus-rich carbide form a silicon phosphorus ammonia layer together, so that the performance of the flame retardant sheet is improved, the flame retardant sheet is prevented from losing insulating property due to the fact that the electric field causes charged particles with sufficient quantity and energy to accumulate in the flame retardant sheet in the use process, heat accumulation inside the flame retardant sheet, the phosphorus-rich carbide and the silicon dioxide layer can be arranged inside the heat conductive gel tightly, a more continuous and compact heat conductive network can be formed, and the flame retardant sheet is prevented from losing insulating capability due to overhigh temperature.
The alkyl phosphate used in the invention is added to the side chain of the silica gel skeleton to prepare the C-P long chain of the synergistic mixture of the phosphoric acid simple substance and the double esterification, the C-P long chain can be used as an extreme pressure additive, the long chain is easy to bond with the C-C chain under the action of pressure, and can form a stable cross-linked network with the C-P, and the heat conducting gel in hot pressing can improve the binding force between the polytetrafluoroethylene glass fiber substrate and the modified flame retardant sheet.
For the technical scheme of the invention, the other core is that the silicon-containing phosphorus hybrid slightly improves the glass transition temperature of the flame-retardant sheet. Because the modified epoxy resin condensate contains phosphorus-containing groups, the initial decomposition temperature of the modified epoxy resin condensate is lower than that of pure epoxy resin, and the high-temperature carbon residue rate of the condensate is greatly improved compared with that of the pure epoxy resin due to the phosphorus-rich carbide and the silicon dioxide layer generated by heating the condensate, when the silicon-phosphorus hybrid content accounts for 30 percent of the epoxy resin, the LOI reaches more than 32, and the modified epoxy resin condensate becomes an extremely flame-retardant material and can be used for manufacturing a flexible flame-retardant sheet with high plasticity.
The beneficial effects of the invention are as follows:
the LED circuit board with high heat dissipation performance and high flexibility is manufactured, the circuit board is not easy to separate from the edge, the edge is tilted and separated after being bent, the bonding strength of the flame retardant sheet and the substrate is strong, and the flame retardant performance of the LED circuit board is enhanced, so that the LED circuit board has self-extinguishing capability.
Detailed Description
The present invention will be described in further detail with reference to specific examples. Those of ordinary skill in the art will be able to implement the invention based on these descriptions. In addition, the embodiments of the present invention referred to in the following description are typically only some, but not all, embodiments of the present invention. Therefore, all other embodiments, which can be made by one of ordinary skill in the art without undue burden, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
The raw materials used in the examples of the present invention are all commercially available or available to those skilled in the art unless specifically stated otherwise; the methods used in the examples of the present invention are those known to those skilled in the art unless specifically stated otherwise.
The polytetrafluoroethylene glass fiber substrate used in the examples of the present invention was a resin substrate made of tetrafluoroethylene mixed with glass fibers during radical polymerization, and was ordered from Jiangsu jia star seal, inc., unless otherwise specified.
The 4-aminobenzoic acid modified platinum catalyst used in the examples of the present invention was ordered from Shanghai Fuli Hydrogen New energy technology Co., ltd (internal trademark PABA-PTO) unless otherwise specified.
If no special description exists, the surface circuits of the pretreatment boards in the step 1 of the embodiment of the invention are all the same experimental circuits.
The side chain polysilhydrodimethicone used in the examples of the present invention was prepared by the following method, unless otherwise specified: dimethyl silicone oil, hydroquinone, toluene and chloroplatinic acid-isopropanol are stirred uniformly, heated under the protection of nitrogen, dimethyl siloxane is added dropwise when the temperature rises to 80 ℃, and the mixture is heated continuously and heated to 120 ℃ until the reaction is complete after the dropwise addition is completed in 1.5 h. Wherein the toluene mass is 150 wt% of the dimethyl silicone oil mass, the hydroquinone mass is 0.5 wt% of the dimethyl silicone oil mass, and the chloroplatinic acid-isopropanol dosage is 50×10 of the reactant mass -6 。
Example 1
A high-heat-dissipation flexible LED circuit board is prepared by the following method:
step 1: the polytetrafluoroethylene glass fiber substrate with the thickness of 0.5 and mm is used as a carrier plate, the surface of the carrier plate is subjected to circuit design and arrangement by a conventional process to form a pretreatment plate, and the specific process is as follows:
cutting tetrafluoroethylene glass fiber substrate board, covering copper, printing on the tetrafluoroethylene glass fiber substrate board according to a designed circuit diagram by adopting white screen mesh with 77T and 195 meshes, printing circuit ink, and drying the ink;
removing redundant copper foil except copper material covered by circuit ink on the tetrafluoroethylene glass fiber substrate by using a silk screen printing etching process;
removing the circuit ink on the tetrafluoroethylene glass fiber substrate to expose the designed copper foil circuit;
drilling a positioning hole, polishing, cleaning and drying a copper foil circuit on a tetrafluoroethylene glass fiber substrate to obtain a pretreatment plate;
step 2: coating modified heat-conducting gel on the surface of the circuit;
the modified heat-conducting gel is prepared by the following method:
mixing 8 wt% of alkyl phosphate, 58 wt% of divinyl-terminated polydimethylsiloxane and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 45 min at 90 ℃, cooling the mixed solution to room temperature, and respectively adding a 4-aminobenzoic acid modified platinum catalyst accounting for 0.2 wt% of the mass of the silica gel matrix mixed solution, 0.05 wt% of 2-phenyl-3-butine-2-ol, 0.05 wt% of disilyl-terminated polydimethylsiloxane and 3.0 wt% of dodecyl trimethyl siloxane, and carrying out ultrasonic mixing until the mixture becomes gel, thus obtaining the heat-conducting gel;
after the lines of the two pretreatment plates are aligned in opposite directions, a modified epoxy resin flexible flame-retardant sheet is arranged between the two pretreatment plates;
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
gamma-glycidoxy trimethoxysilane was reacted with acetone at 2:1, adding industrial concentrated phosphoric acid (85 wt%) with the mass of gamma-glycidoxy trimethoxy silane of 0.08 and wt percent, stirring for 45 min, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3:2:5, mixing and dissolving in enough ethanol, regulating the pH to 5 by phosphoric acid after the mixture is completely dissolved, stirring the mixture at 20 ℃ for 2 h, and drying the mixture to obtain a powdery silicon-phosphorus hybrid, and mixing bisphenol A epoxy resin and the powdery silicon-phosphorus hybrid according to a ratio of 10:3, mixing in a mass ratio, adding 4, 4-diaminodiphenyl methane with the molar quantity of 0.8 times that of gamma-glycidoxy trimethoxy silane, uniformly mixing, and then placing into a mould for thermal curing at the temperature of 85 ℃ for 20 min to prepare a modified epoxy resin flexible flame-retardant sheet with the thickness of 0.2 mm;
and (5) carrying out heat baking treatment at 60 ℃ for 15 min after lamination by a conventional lamination standard process to obtain the high-heat-dissipation flexible LED circuit board.
And performing performance characterization on the prepared high-heat-dissipation flexible LED circuit board. The characterization includes heat dissipation performance characterization, natural bending angle characterization, bending resistance performance characterization, flame retardant performance characterization and self-extinguishing performance characterization.
Wherein, the heat dispersion characterization process includes: in a test environment with good ventilation, the circuit board is respectively connected to electrify the circuit board under the conditions of room temperature (20 ℃) and high temperature (55 ℃), the working environment of the LED equipment is simulated, the LED equipment continuously works for 3 hours, and the highest temperature of the LED equipment is recorded by characterization, so that the heat conduction and dissipation capacity of the LED equipment is verified;
the natural bending angle is characterized in that a high-heat-dissipation flexible LED circuit board with the width of 3 cm and the length of 15 cm is cut and taken as a standard sample, one end in the long direction is clamped (the clamping length is 2 cm) and then horizontally placed, the other end naturally sags, the bending radius of the natural bending angle of the bending part is characterized, and the smaller the bending radius is, the higher the natural flexibility is;
the folding resistance performance characterization means that the double-sided substrate is folded back and forth until the folding times are reached when the double-sided substrate is damaged, wherein the damage condition comprises separation of the double-sided substrate, edge warping, line deformation and the like;
the flame retardant property characterization cuts out a sample with the width of 3 cm and the length of 15 cm, the clamped sample is vertically fixed on the support, the burner is positioned below the sample, so that flame contacts the center of the edge of the bottom end of the sample, the distance between the top of the burner and the surface of the sample is 90 mm, and after 10 min of flame exposure, the gas supply is closed, and the ablation length of the flame is observed.
The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 21 ℃ | 57 ℃ | 2.6 mm | > 200 times | 19.2 mm |
From the characterization results, the heat generated in the electrifying working process of the circuit board is almost completely dispersed under the test condition of 20 ℃ and is close to the ambient temperature, and the circuit board also almost completely disperses working heat under the test condition of 55 ℃ and has the temperature close to the ambient temperature, so that the circuit board has good heat conduction and heat dissipation performance. The natural bending radius is extremely small, the flexibility is good, the breakage condition is not generated when the folding time reaches 200 times in the folding performance test, the circuit board has good flexibility and excellent toughness, and meanwhile, the heat conducting gel has good bonding effect. The ablation length is also smaller, indicating that the flame-retardant sheet has good flame-retardant effect.
Example 2
A high-heat-dissipation flexible LED circuit board is prepared by the following method:
step 1: the polytetrafluoroethylene glass fiber substrate with the thickness of 0.5 and mm is used as a carrier plate, the surface of the carrier plate is subjected to circuit design and arrangement by a conventional process to form a pretreatment plate, and the specific process is as follows:
cutting tetrafluoroethylene glass fiber substrate board, covering copper, printing on the tetrafluoroethylene glass fiber substrate board according to a designed circuit diagram by adopting white screen mesh with 77T and 195 meshes, printing circuit ink, and drying the ink;
removing redundant copper foil except copper material covered by circuit ink on the tetrafluoroethylene glass fiber substrate by using a silk screen printing etching process;
removing the circuit ink on the tetrafluoroethylene glass fiber substrate to expose the designed copper foil circuit;
drilling a positioning hole, polishing, cleaning and drying a copper foil circuit on a tetrafluoroethylene glass fiber substrate to obtain a pretreatment plate;
step 2: coating modified heat-conducting gel on the surface of the circuit;
the modified heat-conducting gel is prepared by the following method:
mixing alkyl phosphate 7 wt%, divinyl end-capped polydimethylsiloxane 57 wt% and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 45 min at 90 ℃, cooling the mixed solution to room temperature, and respectively adding a 4-aminobenzoic acid modified platinum catalyst accounting for 0.1 wt% of the mass of the silica gel matrix mixed solution, 0.07 wt% of 2-phenyl-3-butine-2-ol, 0.03 wt% of disilyl end-capped polydimethylsiloxane and 2.5 wt% of dodecyl trimethyl siloxane, and carrying out ultrasonic mixing until the mixture is gel-like, thus obtaining the heat-conducting gel;
after the lines of the two pretreatment plates are aligned in opposite directions, a modified epoxy resin flexible flame-retardant sheet is arranged between the two pretreatment plates;
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
gamma-glycidoxy trimethoxysilane was reacted with acetone at 1.8:1, adding industrial concentrated phosphoric acid (85 wt%) with the mass of gamma-glycidoxy trimethoxy silane of 0.05 to wt percent, stirring for 45 minutes, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3:2:5, mixing and dissolving in enough ethanol, regulating the pH to 5 by phosphoric acid after the mixture is completely dissolved, stirring the mixture at 20 ℃ for 2 h, and drying the mixture to obtain a powdery silicon-phosphorus hybrid, and mixing bisphenol A epoxy resin and the powdery silicon-phosphorus hybrid according to a ratio of 10:2.5 mass ratio, adding 0.6 times of the molar quantity of the 4, 4-diaminodiphenyl methane of the gamma-glycidoxy trimethoxy silane, uniformly mixing, and then placing into a mould for thermal curing for 20 min at 85 ℃ to prepare the modified epoxy resin flexible flame-retardant sheet with the thickness of 0.2 mm;
and (5) carrying out heat baking treatment at 60 ℃ for 15 min after lamination by a conventional lamination standard process to obtain the high-heat-dissipation flexible LED circuit board.
And performing performance characterization on the prepared high-heat-dissipation flexible LED circuit board. The characterization includes heat dissipation performance characterization, natural bending angle characterization, bending resistance performance characterization, flame retardant performance characterization and self-extinguishing performance characterization.
Wherein, the heat dispersion characterization process includes: in a test environment with good ventilation, the circuit board is respectively connected to electrify the circuit board under the conditions of room temperature (20 ℃) and high temperature (55 ℃), the working environment of the LED equipment is simulated, the LED equipment continuously works for 3 hours, and the highest temperature of the LED equipment is recorded by characterization, so that the heat conduction and dissipation capacity of the LED equipment is verified;
the natural bending angle is characterized in that a high-heat-dissipation flexible LED circuit board with the width of 3 cm and the length of 15 cm is cut and taken as a standard sample, one end in the long direction is clamped (the clamping length is 2 cm) and then horizontally placed, the other end naturally sags, the bending radius of the natural bending angle of the bending part is characterized, and the smaller the bending radius is, the higher the natural flexibility is;
the folding resistance performance characterization means that the double-sided substrate is folded back and forth until the folding times are reached when the double-sided substrate is damaged, wherein the damage condition comprises separation of the double-sided substrate, edge warping, line deformation and the like;
the flame retardant property characterization cuts out a sample with the width of 3 cm and the length of 15 cm, the clamped sample is vertically fixed on the support, the burner is positioned below the sample, so that flame contacts the center of the edge of the bottom end of the sample, the distance between the top of the burner and the surface of the sample is 90 mm, and after 10 min of flame exposure, the gas supply is closed, and the ablation length of the flame is observed.
The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 22 ℃ | 57 ℃ | 2.8 mm | > 200 times | 20.1 mm |
From the above characterization results, it can be seen that the circuit board prepared in this embodiment also has good flexibility, heat conduction and dissipation properties and flame retardant properties.
Example 3
A high-heat-dissipation flexible LED circuit board is prepared by the following method:
step 1: the polytetrafluoroethylene glass fiber substrate with the thickness of 0.5 and mm is used as a carrier plate, the surface of the carrier plate is subjected to circuit design and arrangement by a conventional process to form a pretreatment plate, and the specific process is as follows:
cutting tetrafluoroethylene glass fiber substrate board, covering copper, printing on the tetrafluoroethylene glass fiber substrate board according to a designed circuit diagram by adopting white screen mesh with 77T and 195 meshes, printing circuit ink, and drying the ink;
removing redundant copper foil except copper material covered by circuit ink on the tetrafluoroethylene glass fiber substrate by using a silk screen printing etching process;
removing the circuit ink on the tetrafluoroethylene glass fiber substrate to expose the designed copper foil circuit;
drilling a positioning hole, polishing, cleaning and drying a copper foil circuit on a tetrafluoroethylene glass fiber substrate to obtain a pretreatment plate;
step 2: coating modified heat-conducting gel on the surface of the circuit;
the modified heat-conducting gel is prepared by the following method:
mixing 10 wt% of alkyl phosphate, 60 wt% of divinyl-terminated polydimethylsiloxane and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 45 min at 90 ℃, cooling the mixed solution to room temperature, and respectively adding a 4-aminobenzoic acid modified platinum catalyst accounting for 0.3 wt% of the mass of the silica gel matrix mixed solution, 0.03 wt% of 2-phenyl-3-butine-2-ol, 0.07 wt% of disilyl-terminated polydimethylsiloxane and 3.5 wt% of dodecyl trimethyl siloxane, and carrying out ultrasonic mixing until the mixed solution is gel-like to obtain the heat-conducting gel;
after the lines of the two pretreatment plates are aligned in opposite directions, a modified epoxy resin flexible flame-retardant sheet is arranged between the two pretreatment plates;
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
gamma-glycidoxy trimethoxysilane was reacted with acetone at 2.2:1, adding industrial concentrated phosphoric acid (85 wt%) with the mass of 0.10 percent and wt percent of gamma-glycidoxy trimethoxy silane, stirring for 45 min, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3:2:5, mixing and dissolving in enough ethanol, regulating the pH to 5 by phosphoric acid after the mixture is completely dissolved, stirring the mixture at 20 ℃ for 2 h, and drying the mixture to obtain a powdery silicon-phosphorus hybrid, and mixing bisphenol A epoxy resin and the powdery silicon-phosphorus hybrid according to a ratio of 10: mixing in a mass ratio of 4, adding 1.0 times of the molar quantity of the gamma-glycidoxy trimethoxy silane and 4, 4-diaminodiphenyl methane, uniformly mixing, and then placing into a mould for thermal curing at 85 ℃ for 20 min to prepare a modified epoxy resin flexible flame-retardant sheet with the thickness of 0.2 mm;
and (5) carrying out heat baking treatment at 60 ℃ for 15 min after lamination by a conventional lamination standard process to obtain the high-heat-dissipation flexible LED circuit board.
And performing performance characterization on the prepared high-heat-dissipation flexible LED circuit board. The characterization includes heat dissipation performance characterization, natural bending angle characterization, bending resistance performance characterization, flame retardant performance characterization and self-extinguishing performance characterization.
Wherein, the heat dispersion characterization process includes: in a test environment with good ventilation, the circuit board is respectively connected to electrify the circuit board under the conditions of room temperature (20 ℃) and high temperature (55 ℃), the working environment of the LED equipment is simulated, the LED equipment continuously works for 3 hours, and the highest temperature of the LED equipment is recorded by characterization, so that the heat conduction and dissipation capacity of the LED equipment is verified;
the natural bending angle is characterized in that a high-heat-dissipation flexible LED circuit board with the width of 3 cm and the length of 15 cm is cut and taken as a standard sample, one end in the long direction is clamped (the clamping length is 2 cm) and then horizontally placed, the other end naturally sags, the bending radius of the natural bending angle of the bending part is characterized, and the smaller the bending radius is, the higher the natural flexibility is;
the folding resistance performance characterization means that the double-sided substrate is folded back and forth until the folding times are reached when the double-sided substrate is damaged, wherein the damage condition comprises separation of the double-sided substrate, edge warping, line deformation and the like;
the flame retardant property characterization cuts out a sample with the width of 3 cm and the length of 15 cm, the clamped sample is vertically fixed on the support, the burner is positioned below the sample, so that flame contacts the center of the edge of the bottom end of the sample, the distance between the top of the burner and the surface of the sample is 90 mm, and after 10 min of flame exposure, the gas supply is closed, and the ablation length of the flame is observed.
The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 22 ℃ | 59 ℃ | 2.5 mm | > 200 times | 18.8 mm |
From the above characterization results, it can be seen that the circuit board prepared in this embodiment also has good flexibility, heat conduction and dissipation properties and flame retardant properties.
Example 4
A high-heat-dissipation flexible LED circuit board is prepared by the following method:
step 1: the polytetrafluoroethylene glass fiber substrate with the thickness of 0.5 and mm is used as a carrier plate, the surface of the carrier plate is subjected to circuit design and arrangement by a conventional process to form a pretreatment plate, and the specific process is as follows:
cutting tetrafluoroethylene glass fiber substrate board, covering copper, printing on the tetrafluoroethylene glass fiber substrate board according to a designed circuit diagram by adopting white screen mesh with 77T and 195 meshes, printing circuit ink, and drying the ink;
removing redundant copper foil except copper material covered by circuit ink on the tetrafluoroethylene glass fiber substrate by using a silk screen printing etching process;
removing the circuit ink on the tetrafluoroethylene glass fiber substrate to expose the designed copper foil circuit;
drilling a positioning hole, polishing, cleaning and drying a copper foil circuit on a tetrafluoroethylene glass fiber substrate to obtain a pretreatment plate;
step 2: coating modified heat-conducting gel on the surface of the circuit;
the modified heat-conducting gel is prepared by the following method:
mixing 8 wt% of alkyl phosphate, 58 wt% of divinyl-terminated polydimethylsiloxane and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 45 min at 90 ℃, cooling the mixed solution to room temperature, and respectively adding a 4-aminobenzoic acid modified platinum catalyst accounting for 0.2 wt% of the mass of the silica gel matrix mixed solution, 0.05 wt% of 2-phenyl-3-butine-2-ol, 0.05 wt% of disilyl-terminated polydimethylsiloxane and 3.0 wt% of dodecyl trimethyl siloxane, and carrying out ultrasonic mixing until the mixture becomes gel, thus obtaining the heat-conducting gel;
after the lines of the two pretreatment plates are aligned in opposite directions, a modified epoxy resin flexible flame-retardant sheet is arranged between the two pretreatment plates;
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
gamma-glycidoxy trimethoxysilane was reacted with acetone at 2.2:1, adding industrial concentrated phosphoric acid (85 wt%) with the mass of 0.10 percent and wt percent of gamma-glycidoxy trimethoxy silane, stirring for 45 min, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3:2:5, mixing and dissolving in enough ethanol, regulating the pH to 5 by phosphoric acid after the mixture is completely dissolved, stirring the mixture at 20 ℃ for 2 h, and drying the mixture to obtain a powdery silicon-phosphorus hybrid, and mixing bisphenol A epoxy resin and the powdery silicon-phosphorus hybrid according to a ratio of 10: mixing in a mass ratio of 4, adding 1.0 times of the molar quantity of the gamma-glycidoxy trimethoxy silane and 4, 4-diaminodiphenyl methane, uniformly mixing, and then placing into a mould for thermal curing at 85 ℃ for 20 min to prepare a modified epoxy resin flexible flame-retardant sheet with the thickness of 0.2 mm;
and (5) carrying out heat baking treatment at 60 ℃ for 15 min after lamination by a conventional lamination standard process to obtain the high-heat-dissipation flexible LED circuit board.
And performing performance characterization on the prepared high-heat-dissipation flexible LED circuit board. The characterization includes heat dissipation performance characterization, natural bending angle characterization, bending resistance performance characterization, flame retardant performance characterization and self-extinguishing performance characterization.
Wherein, the heat dispersion characterization process includes: in a test environment with good ventilation, the circuit board is respectively connected to electrify the circuit board under the conditions of room temperature (20 ℃) and high temperature (55 ℃), the working environment of the LED equipment is simulated, the LED equipment continuously works for 3 hours, and the highest temperature of the LED equipment is recorded by characterization, so that the heat conduction and dissipation capacity of the LED equipment is verified;
the natural bending angle is characterized in that a high-heat-dissipation flexible LED circuit board with the width of 3 cm and the length of 15 cm is cut and taken as a standard sample, one end in the long direction is clamped (the clamping length is 2 cm) and then horizontally placed, the other end naturally sags, the bending radius of the natural bending angle of the bending part is characterized, and the smaller the bending radius is, the higher the natural flexibility is;
the folding resistance performance characterization means that the double-sided substrate is folded back and forth until the folding times are reached when the double-sided substrate is damaged, wherein the damage condition comprises separation of the double-sided substrate, edge warping, line deformation and the like;
the flame retardant property characterization cuts out a sample with the width of 3 cm and the length of 15 cm, the clamped sample is vertically fixed on the support, the burner is positioned below the sample, so that flame contacts the center of the edge of the bottom end of the sample, the distance between the top of the burner and the surface of the sample is 90 mm, and after 10 min of flame exposure, the gas supply is closed, and the ablation length of the flame is observed.
The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 20 ℃ | 57 ℃ | 2.7 mm | > 200 times | 18.5 mm |
From the above characterization results, it can be seen that the circuit board prepared in this embodiment also has good flexibility, heat conduction and dissipation properties and flame retardant properties.
Comparative example 1
The commercial PCB type LED circuit board (metal-based circuit board) was provided with the same experimental circuit as in example 1 on the surface, and the same performance characterization as in example 1 was performed.
The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 20 ℃ | 57 ℃ | / | / | / |
Comparative example 2
The four specifications of 0.2x2 mm (a specification), 0.35x2 mm (B specification, without flame retardant sheet), 0.5x2 mm (C specification, without flame retardant sheet) and 0.5x2 mm (D specification, with flame retardant tape, flame retardant tape is asbestos paper) were set up for the same performance characterization as in example 1.
The characterization results are shown in the following table.
| Dimensional specification of | (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| A specification | 21 ℃ | 59 ℃ | 1.6 mm | 32 | Complete ablation |
| B specification | 21 ℃ | 62 ℃ | 2.3 mm | 51 | 36.2 mm |
| C specification | 23 ℃ | 68 ℃ | 3.9 mm | 30 | 37.6 mm |
| D specification | 25 ℃ | 70 ℃ | 5.7 mm | 19 | 21.8 mm |
As can be seen from comparison of comparative examples 1 and 2 with example 1, the high heat dissipation flexible LED circuit board of the present invention can be substantially close to the heat conduction and dissipation performance of the existing aluminum-based commercial PCB circuit board, and at the same time, compared with the existing FPC circuit board, the heat dissipation performance is improved, but the heat dissipation performance is reduced due to the fact that the heat dissipation performance of the commercial FPC LED circuit board is poor along with the increase of the thickness, and the heat dissipation performance is difficult to be applied to a high temperature working environment, and in addition, the flexibility is gradually weakened along with the increase of the thickness, because the conventional adhesive is adopted by the commercial FPC circuit board, a certain hardening is caused along with the increase of the thickness and the increase of the adhesive consumption, and in addition, the problems of edge warpage, substrate separation and the like are very easy to occur due to the folding.
Comparative example 3
The specific preparation process of the high-heat-dissipation flexible LED circuit board is the same as that of the embodiment 2, except that the 4-aminobenzoic acid modified platinum catalyst used in the preparation process is replaced by a platinum catalyst (Pt 85 mark) purchased by the same company, and the high-heat-dissipation flexible LED circuit board is prepared.
The prepared samples were subjected to the same characterization as in example 1. The characterization results are shown in the following table.
| (20 ℃) maximum temperature | (55 ℃) maximum temperature | Natural bending radius | Number of folds | Ablation length |
| 22 ℃ | 58 ℃ | 5.9 mm | 63. Secondary times | 20.3 mm |
As can be seen by comparing with example 1, the samples prepared in this example are substantially comparable in thermal conductivity, but the circuit board is significantly brittle. The increase in natural bending radius first indicates a decrease in flexibility, and in the bending resistance test, the damage form is different from the common form, and is that irreversible bulge deformation is generated inside, and research and development personnel consider that the bulge deformation is caused by accumulation of part of embrittlement components in the bending part during bending and folding after embrittlement of the heat-conducting gel. And the flame retardant property is slightly weakened, and the modified platinum catalyst is also proved to be effective for improving the flame retardant effect of the heat-conducting gel coordinated flame retardant sheet.
In addition, the 4-aminobenzoic acid modified platinum catalyst used in the invention is replaced by a commercial tert-butylbenzoic acid modified platinum catalyst, a 3, 4-dicarboxybenzaldehyde modified platinum catalyst and a 2-hydroxy-1-naphthaldehyde modified platinum catalyst, and similar phenomena exist in the corresponding tests. This demonstrates that the modification of 4-aminobenzoic acid results in maintaining the flexibility of the gel and in a coordinated improvement of the flame retardant properties of the flame retardant sheet. Among the existing modified platinum catalysts, for example, the tert-butylbenzoic acid modified platinum catalyst loses the catalytic capability due to easy shift and even falling of metal platinum in the catalytic center, but the 3, 4-dicarboxybenzaldehyde modified platinum catalyst adopts a dicarboxyl structure, but does not obtain the expected doubling effect, but the space structure is crowded and cannot form stable coordination bonds with the metal platinum due to the dicarboxyl structure, even the catalytic effect is not excellent even if the effect of pure platinum is not good, and the 2-hydroxy-1-naphthaldehyde modified platinum catalyst reduces the substitution reaction of the exocyclic group to metal due to the electrophilic effect of the benzene ring to the ring group, so that the catalytic effect is also inferior to that of pure platinum.
Claims (6)
1. A preparation method of a high heat dissipation flexible LED circuit board is characterized in that,
the method comprises the following steps:
step 1: carrying out circuit design and arrangement on a polytetrafluoroethylene glass fiber substrate to form a pretreatment plate;
step 2: coating heat-conducting gel on the surface of the circuit, arranging a flame-retardant sheet between the two pretreatment plates after the circuits of the two pretreatment plates are aligned in opposite directions, and performing heat treatment after lamination to obtain a high-heat-dissipation flexible LED circuit board;
the heat conducting gel in the step 2 is modified heat conducting gel;
the modified heat-conducting gel is prepared by the following method:
mixing 7-10 wt% of alkyl phosphate, 57-60 wt% of divinyl end-capped polydimethylsiloxane and the balance of side chain polysilsesquioxane into a silica gel matrix mixed solution, stirring and reacting for 30-60 min at the temperature of 85-95 ℃, adding a platinum catalyst, 2-phenyl-3-butine-2-ol, disilyl end-capped polydimethylsiloxane and dodecyl trimethyl siloxane after the mixed solution is cooled to room temperature, and carrying out ultrasonic mixing until the mixed solution is gel-like, thus obtaining the heat-conducting gel;
the flame-retardant sheet is a modified epoxy resin flexible flame-retardant sheet.
2. The method for manufacturing a high heat dissipation flexible LED circuit board according to claim 1, wherein,
the polytetrafluoroethylene glass fiber substrate in the step 1 is a resin substrate made of glass fibers mixed when tetrafluoroethylene is subjected to free radical polymerization.
3. The method for manufacturing a high heat dissipation flexible LED circuit board according to claim 1, wherein,
the dosage of the platinum catalyst is 0.1-0.3 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the 2-phenyl-3-butine-2-alcohol is 0.03-0.07 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the disilyl hydrogen end-capped polydimethylsiloxane is 0.03-0.07 wt% of the total mass of the silica gel matrix mixed solution;
the dosage of the dodecyl trimethyl siloxane is 2.5-3.5-wt% of the total mass of the silica gel matrix mixed solution.
4. The method for manufacturing a high heat dissipation flexible LED circuit board according to claim 1, wherein,
the platinum catalyst is a 4-aminobenzoic acid modified platinum catalyst.
5. The method for manufacturing a high heat dissipation flexible LED circuit board according to claim 1, wherein,
the modified epoxy resin flexible flame-retardant sheet is prepared by the following method:
mixing gamma-glycidoxy trimethoxy silane with acetone (1.8-2.2): mixing according to the mass ratio of 1, adding phosphoric acid with the mass of 0.05-0.10 wt% of gamma-glycidoxy trimethoxy silane, stirring for 30-60 min, distilling off the organic solvent to obtain a phosphorus-containing silane coupling agent, and mixing tetraethoxysilane, methyltriethoxysilane and the phosphorus-containing silane coupling agent according to the following weight ratio of 3: (1.8-2.2): (4.8-5.2) mixing and dissolving in ethanol, regulating the pH value to 4-6 by phosphoric acid, stirring 1-3 h at normal temperature, and drying to obtain a powdery silicon-phosphorus hybrid, wherein the bisphenol A type epoxy resin and the powdery silicon-phosphorus hybrid are prepared by the following steps of: (2.5-4) mixing in mass ratio, adding 0.6-1.0 times of the gamma-glycidoxy trimethoxy silane and 4, 4-diamino diphenyl methane, uniformly mixing, and then placing into a mould for thermal curing to obtain the modified epoxy resin flexible flame-retardant sheet.
6. A high heat dissipation flexible LED circuit board is characterized in that,
the high-heat-dissipation flexible LED circuit board is prepared by the method of any one of claims 1 to 5.
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