CN116854358A - Laser splitting method and device and main control equipment thereof - Google Patents

Abstract

The invention discloses a laser splitting method, which includes: controlling a laser transmitter to emit a laser beam, and the laser beam is incident on a galvanometer module through reflection of a reflective component. The galvanometer module includes a laser galvanometer and a focusing component; controlling the laser galvanometer Work to make the laser beam emitted from the galvanometer module move along the preset split path; and adjust the distance between the focusing component and the glass to be split so that the diameter of the spot formed by the laser beam on the surface of the glass to be split is maintained Consistently, the split glass has been Bezier cut. The laser splitting method disclosed in the present invention solves the problems of unstable glass splitting quality, low efficiency, and low yield rate. In addition, the invention also discloses a laser splitting device and main control equipment.

Description

Laser fragmentation method, device and main control equipment

Technical field

The invention relates to the technical field of glass processing, and in particular to a laser splitting method and its device and main control equipment.

Background technique

In the fields of architectural glass, automotive glass, electronic glass and other fields, the method of slicing large pieces of glass is usually to use a cutter wheel or emery with a certain hardness to apply a certain pressure and scratch the surface of the glass, thereby forming a V-shaped cutting groove on the surface. , and then separate the main body and waste materials through impact blocks, ejector pins, ultrasonic vibration or manual breaking.

However, during the cutting process of the cutter wheel, the size, smoothness, and pressure of the cutter wheel determine the quality of the cutting edge, thus increasing the instability of the cutting. Secondly, the cutter wheel cutting process has a large cutting chip, which requires more edge parts to be reserved for subsequent mechanical chamfering and grinding. This causes the chamfering process to take a long time, reduces the production capacity of the entire line, and increases the wear and tear of the grinding wheel and production. cost. Furthermore, the current chip breaking method is not suitable for small R-angle, C-angle, and U-shaped corners. It is difficult for the waste to separate from the main part, resulting in a low chip yield rate.

The existing technology usually uses a transfer device to drive the laser cleavage head to move to split glass products. During the splitting process, the laser splitting head is always perpendicular to the glass product, that is, the laser is perpendicular to the cutting line that runs through the entire glass product. Since the laser cleavage head needs to move along the cutting line of the glass product, which includes the main cutting line that forms the main body of the glass and the auxiliary cutting line that removes edge waste, the laser cleavage head has a longer moving path and a faster moving speed. Slow, resulting in less efficient splitting.

Contents of the invention

The main purpose of the present invention is to propose a laser splitting method, its device, and main control equipment, aiming to solve the problems of unstable glass splitting quality, low efficiency, and low yield.

In order to achieve the above object, the present invention proposes a laser splitting method, which includes:

Control the laser transmitter to emit a laser beam, and the laser beam is reflected by the reflective component and is incident on the galvanometer module. The galvanometer module includes a laser galvanometer and a focusing component;

Control the operation of the laser galvanometer so that the laser beam emitted from the galvanometer module moves along a preset split path; and

The distance between the focusing component and the glass to be split is adjusted so that the diameter of the light spot formed by the laser beam on the surface of the glass to be split is consistent, and the glass to be split has been Bessel cut.

Preferably, the focusing component includes a biconcave lens and a biconvex lens arranged at intervals along the emission direction of the laser beam. Adjusting the distance between the focusing component and the glass to be split includes:

Adjust the distance between the biconcave lens and the glass to be split; or

Adjust the distance between the lenticular lens and the glass to be split.

Preferably, when the number of the galvanometer module is one, before controlling the laser transmitter to emit the laser beam, the laser splitting method further includes:

Adjust the position of the glass to be split so that the galvanometer module is opposite to the center of the glass to be split.

Preferably, when there are multiple galvanometer modules, before controlling the laser emitter to emit the laser beam, the laser splitting method further includes:

Adjust the position of the glass to be split, the glass to be split includes a plurality of fixed points; and adjust the position of the galvanometer module so that each of the galvanometer modules corresponds to the fixed point one-to-one.

The present invention further proposes a main control device, which includes:

memory for storing program instructions; and

A processor configured to execute the program instructions to implement the laser fragmentation method as described above.

The invention further proposes a laser splitting device, which includes:

Laser transmitter for emitting laser beam;

reflective components;

Galvanometer module, including laser galvanometer and focusing components; and

A controller, electrically connected to the laser transmitter and the galvanometer module respectively, and the controller is configured to execute:

Control the laser transmitter to emit a laser beam, and the laser beam is incident on the galvanometer module through reflection by the reflective component;

Control the operation of the laser galvanometer so that the laser beam emitted from the galvanometer module moves along a preset split path; and

The distance between the focusing component and the glass to be split is adjusted so that the diameter of the light spot formed by the laser beam on the surface of the glass to be split is consistent, and the glass to be split has been Bessel cut.

Preferably, the focusing component includes a biconcave lens and a biconvex lens, and the biconcave lens and the biconvex lens are arranged at intervals along the emission direction of the laser beam; the controller is configured to perform:

Adjust the distance between the biconcave lens and the glass to be split; or

Adjust the distance between the lenticular lens and the glass to be split.

Preferably, the galvanometer module further includes an adjustment motor, at least one of the biconcave lens and the biconvex lens is provided on the adjustment motor; the controller is respectively connected to the laser galvanometer and the To adjust the electrical connection of the motor, the controller is further configured to perform:

The adjustment motor is controlled to move the biconcave lens or the biconvex lens in a direction closer to the glass to be split or in a direction away from the glass to be split.

Preferably, the laser splitting device includes at least one galvanometer module. When the laser splitting device includes a plurality of galvanometer modules, the plurality of galvanometer modules are arranged in an array at intervals.

Preferably, the laser fragmentation device further includes a correction platform and a fixed frame, the fixed frame is provided on the correction platform, and the laser emitter, the reflective component and the galvanometer module are provided on the fixed frame. , the galvanometer module is arranged opposite to the correction platform.

The beneficial effect of the technical solution of the present invention is that by controlling the operation of the laser galvanometer, the scanning range of the laser light is not limited by the maximum field of view of the lens, and a large-format scanning range can be achieved. At the same time, adjusting the distance between the focusing component and the glass to be split can adjust the size of the spot formed by the laser light on the surface of the glass to be split, thereby ensuring that no matter where the laser light moves to the surface of the glass to be split, The size of the spots formed remains consistent. The galvanometer module can achieve 3D dynamic focus scanning through the cooperation between the laser galvanometer and the focusing component. At the same time, the galvanometer module shapes the light spot into a large spot mode, taking advantage of the extremely fast jump speed and acceleration of the laser galvanometer. The deceleration characteristics greatly improve the splitting effect and efficiency, and can split ultra-large-format glass ultra-fast.

Description of the drawings

Figure 1 is a schematic diagram of a laser splitting device provided by an embodiment of the present invention.

Figure 2 is a schematic diagram of the internal structure of the laser splitting device provided by the first embodiment of the present invention.

FIG. 3 is a schematic diagram of the focusing assembly of the laser splitting device shown in FIG. 1 .

Figure 4 is a schematic diagram of the internal structure of the laser splitting device provided by the second embodiment of the present invention.

Figure 5 is a flow chart of a laser fragmentation method provided by an embodiment of the present invention.

Figure 6 is a sub-flow chart of the laser fragmentation method provided by the embodiment of the present invention.

FIG. 7 is a top view of the glass to be split shown in FIG. 5 .

Figure 8 is a diagram showing the distance relationship between the galvanometer module shown in Figure 6 and the glass to be split.

Figure 9 is a schematic structural diagram of a main control device provided by an embodiment of the present invention.

The realization of the purpose, functional features and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings.

Detailed ways

The solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiment of the present invention are only used to explain the relationship between components in a specific posture (as shown in the drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

It should also be noted that when an element is referred to as being "mounted" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is said to be "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

In addition, descriptions involving "first", "second", etc. in the present invention are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions in various embodiments can be combined with each other, but it must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions does not exist. , nor within the protection scope required by the present invention.

Please refer to FIGS. 1 and 2 in conjunction. FIG. 1 is a schematic diagram of a laser cleavage device provided by an embodiment of the present invention. FIG. 2 is a schematic diagram of the internal structure of a laser cleavage device provided by a first embodiment of the present invention. The laser splitting device 1 is used to split ultra-large format glass.

The laser splitting device 1 includes a laser transmitter 10 , a reflective component 20 , a galvanometer module 30 and a controller 40 . Among them, the controller 40 is electrically connected to the laser transmitter 10 and the galvanometer module 30 respectively. The galvanometer module 30 includes a laser galvanometer 31 and a focusing component 32 . The laser transmitter 10 is used to emit laser beams. In this embodiment, the controller 40 is configured to control the laser transmitter 10 to emit a laser beam, and the laser beam is incident on the galvanometer module 30 through the reflection of the reflective component 20; and controls the laser galvanometer 31 to work so that the laser beam is incident on the galvanometer module 30. The laser beam emitted from the module 30 moves along the preset splitting path; the distance between the focusing component 32 and the glass to be split is adjusted to keep the diameter of the spot formed by the laser beam on the surface of the glass to be split consistent. Among them, the glass to be split has been Bezier cut.

Specifically, the laser transmitter 10 is a CO2 laser, and the laser beam emitted by the laser transmitter 10 has a spot diameter of 9 mm and a wavelength of 10.6 microns.

The reflective assembly 20 includes a first reflective mirror 21 , a second reflective mirror 22 and a third reflective mirror 23 . Among them, the first reflecting mirror 21, the second reflecting mirror 22 and the third reflecting mirror 23 are all total reflection mirrors. The laser beam emitted by the laser transmitter 10 sequentially passes through the first reflector 21 , the second reflector 22 and the third reflector 23 and is incident on the laser galvanometer 31 , and then passes through the focusing assembly 32 and is emitted to the outside of the galvanometer module 30 .

After the glass is cut through the Bessel cutting process, the glass to be split is formed. Through the cooperation between the laser emitter 10, the reflection component 20 and the galvanometer module 30, the laser beam forms a circular focused spot on the surface of the glass to be split. The focused spot can ensure the uniformity and optimal distribution of laser energy on both sides of the cutting line of the glass to be split. The glass to be split strongly absorbs the 10.6um wavelength laser. Almost all the laser energy is absorbed by the surface of the glass to be split. The energy is transmitted along the cutting line and then inside the glass body to be split. Therefore, the laser heat forms a stress distribution on the cutting line. Stress relief causes the waste material to separate from the glass to be split, achieving the effect of splitting without melting the glass to be split.

The focusing component 32 can change the divergence angle of the laser beam in real time to achieve focus adjustment, thereby compensating for the optical path difference of the focus point outside the center of the glass to be split, and at the same time cooperates with the X galvanometer lens and Y galvanometer lens of the laser galvanometer 31 The lens enables the laser beam to scan any pattern within the entire working plane.

In this embodiment, the controller 40 adjusts the distance between the focusing component 32 and the glass to be split, so that when the laser beam moves along the preset splitting path, the diameter of the light spot formed on the surface of the glass to be split remains consistent. Specifically, the diameters of the light spots formed by the laser beam on the preset split path are the same. Due to the tilt of the laser beam, there will be slight differences in the roundness of the spots formed by the laser beam at different places on the surface of the glass to be cracked. For example, the roundness of the spot formed by the laser beam on the surface of the vertical glass to be split is slightly better than the roundness of the spot formed by the laser beam on the preset splitting path. It can be understood that when the laser beam irradiates the preset split path, the optical path changes as the laser beam moves, but through the action of the focusing component, the diameter of the spot is basically the same. Therefore, no matter where the laser beam moves on the preset split path, the diameter of the spot formed by the laser beam on the preset split path is the same.

In this embodiment, the controller 40 is used to perform the laser fragmentation method. The specific process of the laser fragmentation method will be described in detail below. Among them, the relevant functions of the controller 40 can be implemented by one device, or can be implemented by multiple devices together, or can be implemented by one or more functional modules in one device, which are not specifically limited here. It can be understood that the above functions can be either network elements in hardware devices, software functions running on dedicated hardware, or a combination of hardware and software, or instantiated on a platform (for example, a cloud platform) Virtualization capabilities.

The 3D dynamic focusing scanning galvanometer of the laser splitting device 1, that is, the galvanometer module 30 is a front-focusing galvanometer. Therefore, the scanning range of the laser beam emitted from the galvanometer module 30 is not limited by the maximum field of view angle of the lens. A large-format scanning range is achieved. At the same time, the spot of the laser beam is shaped into a large spot mode through the focusing component 32, and the extremely fast jump speed and acceleration and deceleration characteristics of the laser galvanometer 31 are used to greatly improve the splitting effect and efficiency, with high splitting accuracy and good stability. .

Please refer to FIG. 3 , which is a schematic diagram of a focusing assembly provided by an embodiment of the present invention. In some embodiments, the focusing component 32 includes a biconcave lens 321 and a biconvex lens 322, which are spaced apart in sequence along the exit direction of the laser beam. The controller 40 is further configured to adjust the distance between the biconcave lens 321 and the glass to be broken, or to adjust the distance between the biconvex lens 322 and the glass to be broken.

It can be understood that the controller 40 can adjust the distance between the biconcave lens 321 and the glass to be split, and the controller 40 can also adjust the distance between the biconvex lens 322 and the glass to be split. The laser beam first passes through the biconcave lens 321 and then passes through the biconvex lens 322. Among them, the biconcave lens 321 plays a role in expanding the laser beam, and the biconvex lens 322 plays a role in focusing the laser beam.

In this embodiment, the biconcave lens 321 is arranged adjacent to the laser galvanometer 31 , and the biconvex lens 322 is located on the side of the biconcave lens 321 away from the laser galvanometer 31 . In some feasible embodiments, the lenticular lens 322 is disposed adjacent to the laser galvanometer 31 , and the biconcave lens 321 is located on the side of the lenticular lens 322 away from the laser galvanometer 31 .

The specific adjustment process of the biconcave lens 321 or the biconvex lens 322 by the controller 40 will be described in detail below.

Please refer to FIG. 4 , which is a schematic diagram of the internal structure of a laser splitting device according to a second embodiment of the present invention. In some embodiments, the galvanometer module 30 further includes an adjustment motor 33 , and at least one of the biconcave lens 321 and the biconvex lens 322 is provided on the adjustment motor 33 . The controller 40 is electrically connected to the laser galvanometer 31 and the adjustment motor 33 respectively. The controller 40 is also configured to control the adjustment motor 33 to move the biconcave lens 321 or the biconvex lens 322 in a direction closer to the glass to be split or in a direction away from the glass to be split.

It can be understood that the controller 40 can control the biconcave lens 321 to move in a direction closer to the glass to be split, can control the biconcave lens 321 to move in a direction away from the glass to be split, and can also control the biconvex lens 322 to move in a direction close to the glass to be split. , the lenticular lens 322 can also be controlled to move away from the glass to be split.

In this embodiment, when the biconcave lens 321 is installed on the adjusting motor 33, the biconvex lens 322 is fixed; when the biconvex lens 322 is installed on the adjusting motor 33, the biconcave lens 321 is fixed. Specifically, the adjusting motor 33 can move the biconcave lens 321 or the biconvex lens 322 within a certain stroke, thereby adjusting the distance between the biconcave lens 321 and the biconvex lens 322, thereby changing the divergence angle of the laser beam to achieve focus adjustment.

In some feasible embodiments, both the biconcave lens 321 and the biconvex lens 322 can be disposed on the adjustment motor 33. The adjustment motor 33 can move the biconcave lens 321 and the biconvex lens 322 simultaneously according to the actual situation to adjust the relationship between the biconcave lens 321 and the biconvex lens 322. spacing between.

In some embodiments, the laser cleavage device 1 includes at least one galvanometer module 30 . When the laser splitting device 1 includes multiple galvanometer modules 30, the multiple galvanometer modules 30 are arranged in an array at intervals.

It can be understood that the number of galvanometer modules 30 can be set according to the size of the glass to be split. For example, when the glass to be split needs to split a main glass of 2000mm*2000mm, a galvanometer module 30 can be used to split; when the glass to be split needs to split four main glasses of 2000mm*2000mm, four main glasses of 2000mm*2000mm can be used. The galvanometer module 30 performs splitting. That is to say, multiple galvanometer modules 30 can be spliced together to meet the splitting requirements of larger-format glass to be split. When the laser splitting device 1 is provided with multiple galvanometer modules 30, the multiple galvanometer modules 30 are spaced apart and arranged in an array.

For different sizes of glass to be split, the laser splitting device 1 can flexibly select single or multiple galvanometer modules 30, and has very strong applicability.

Please refer to FIG. 1 again. In some embodiments, the laser splitting device 1 further includes a calibration platform 50 and a fixing bracket 60 . The fixing bracket 60 is disposed on the calibration platform 50 . The laser emitter 10 , the reflective component 20 and the galvanometer module 30 are arranged on the fixed frame 60 , and the galvanometer module 30 is arranged opposite to the calibration platform 50 .

Specifically, the fixing bracket 60 is disposed on one side of the calibration platform 50 , and the controller 40 is disposed on the calibration platform 50 . The first reflector 21 is disposed opposite to the laser transmitter 10 , the second reflector 22 is disposed opposite to the first reflector 21 , the third reflector 23 is disposed opposite to the second reflector 22 , the galvanometer module 30 is disposed opposite to the third reflector 22 . The mirrors 23 are arranged opposite each other. The light outlet (not shown) of the galvanometer module 30 faces the calibration platform 50 . When performing splitting, the glass to be split is placed on the plane of the correction platform 50 .

In this embodiment, the galvanometer module 30 is disposed above the laser transmitter 10 , and the laser beam emitted by the laser transmitter 10 propagates along the first direction parallel to the plane of the correction platform 50 and is incident on the first reflector 21 . The laser beam is reflected by the first reflecting mirror 21 and propagates along the second direction perpendicular to the plane of the correction platform 50 and is incident on the second reflecting mirror 22 . Wherein, the second direction is perpendicular to the first direction. The laser beam is reflected by the second reflector 22 and propagates along the third direction parallel to the plane of the correction platform 50 , and is incident on the third reflector 23 . Among them, the third direction is opposite to the first direction. The laser beam is reflected by the third mirror 23 and propagates along the fourth direction parallel to the plane of the correction platform 50 , and is incident on the galvanometer module 30 . Among them, the fourth direction is perpendicular to the third direction. The laser beam passes through the action of the galvanometer module 30 and propagates along the fifth direction of the vertical correction platform 50 plane. Wherein, the fifth direction is opposite to the second direction.

Please refer to FIG. 5 , which is a flow chart of a laser fragmentation method according to an embodiment of the present invention. The laser splitting method is applied to the laser splitting device 1 to split the glass to be split, so that the waste material is separated from the glass to be split, thereby obtaining the main glass. Among them, the glass to be split has been Bezier cut.

The laser fragmentation method specifically includes the following steps.

Step S102, control the laser transmitter to emit a laser beam.

The controller 40 controls the laser transmitter 10 to emit a laser beam. The laser beam is reflected by the reflective component 20 and is incident on the galvanometer module 30 .

Step S104, control the operation of the laser galvanometer so that the laser beam emitted from the galvanometer module moves along the preset split path.

In this embodiment, the laser galvanometer 31 includes an X galvanometer lens and a Y galvanometer lens (not shown). The controller 40 controls the cooperative cooperation between the X galvanometer lens and the Y galvanometer lens, so that the slave galvanometer module The laser beam emitted by 30° can scan any pattern in the entire working plane to obtain the main glass.

Specifically, the controller 40 controls the vibration of the X galvanometer lens and the Y galvanometer lens, so that the laser beam heats the main cutting line of the glass to be cut along the preset split path, and then heats the auxiliary cutting line. Under the action of thermal expansion and contraction, the stress is released from the direction of the cutting line, and the glass to be cut cracks, so that the edge waste is separated from the glass to be cut to obtain the main glass. The preset fragmentation path is a preset moving path of the laser beam on the surface of the glass to be fragmented.

Taking the glass to be split shown in Figure 7 as an example, the glass to be split is provided with a main cutting line ABCD (shown as a thick line in the figure) and auxiliary cutting lines located at the four corners A, B, C, and D (as shown in the figure). shown by the thin line). The laser beam first moves along the main cutting line, and then moves along the auxiliary cutting lines at the four corners. For example, the laser beam can move in the counterclockwise direction formed by ABCDA to complete the segmentation of the main cutting line; and then move along the auxiliary cutting lines of angle A, B, C, and D in order to complete the auxiliary cutting line. of division. It can be understood that since the laser galvanometer 31 can realize the rapid jump of the laser beam, and the jump speed is extremely fast, therefore, due to the extremely fast acceleration and deceleration speed of the laser galvanometer 31, the efficiency of the cutting line of the laser beam splitting body is reduced. It is 2 times higher than the existing technology; due to the extremely fast jumping speed of the laser galvanometer 31, when the laser beam splits to assist the cutting line, it can directly jump from A to B, and then jump to C and D in sequence. Angle, compared to the existing technology, the moving path of the laser beam reduces the circumference of a main cutting line, and the overall efficiency is 3-4 times higher than the existing technology.

Step S106: Adjust the distance between the focusing component and the glass to be split so that the diameter of the spot formed by the laser beam on the surface of the glass to be split remains consistent.

The controller 40 adjusts the distance between the focusing assembly 32 and the glass to be broken.

Adjusting the distance between the focusing component and the glass to be split specifically includes: the controller 40 adjusting the distance between the biconcave lens 321 and the glass to be split, or the controller 40 adjusting the distance between the biconvex lens 322 and the glass to be split.

In this embodiment, the controller 40 adjusts the distance between the biconcave lens 321 and the biconvex lens 322 by adjusting the motor 33, and can change the divergence angle of the laser beam in real time to achieve real-time focusing, thereby compensating for areas outside the center of the glass to be broken. The optical path difference of the focusing point ensures that no matter where the light spot moves along the preset split path, the size of the light spot on the surface of the glass to be split remains consistent, thereby ensuring the stability of the split. That is to say, the diameter of the light spot remains consistent along the preset split path.

In the above embodiment, by controlling the operation of the laser galvanometer, the scanning range of the laser light is not limited by the maximum field of view angle of the lens, and a large-format scanning range can be achieved. At the same time, adjusting the distance between the focusing component and the glass to be split can adjust the size of the spot formed by the laser light on the surface of the glass to be split, thereby ensuring that no matter where the laser light moves to the surface of the glass to be split, The size of the spots formed remains consistent. The galvanometer module can achieve 3D dynamic focus scanning through the cooperation between the laser galvanometer and the focusing component. At the same time, the galvanometer module shapes the light spot into a large spot mode, taking advantage of the extremely fast jump speed and acceleration of the laser galvanometer. The deceleration characteristics greatly improve the splitting effect and efficiency, and can split ultra-large-format glass ultra-fast.

In this embodiment, when the number of the galvanometer module 30 is one, before controlling the laser transmitter 10 to emit the laser beam, the controller 40 adjusts the position of the glass to be split so that the galvanometer module 30 is in contact with the glass to be split. The center is opposite.

Specifically, after the Bessel-cut glass to be split is transferred to the correction platform 50, the controller 40 can control an adjustment module (not shown) provided on the correction platform 50 to adjust the glass to be split, so that the galvanometer mold The light outlet of the group 30 is directly opposite to the center of the glass to be split. That is to say, during the adjustment process, the galvanometer module 30 has been pre-adjusted and fixed, and only the position of the glass to be split needs to be adjusted. Wherein, the line connecting the light outlet and the center is perpendicular to the plane of the glass to be split.

In some feasible embodiments, the controller 40 can also only adjust the position of the galvanometer module 30 after the glass to be broken is fixed. In other possible embodiments, the adjustment of the galvanometer module 30 can be performed by an executive, which is not limited here.

Before controlling the laser transmitter 10 to emit a laser beam, the operator needs to perform high-precision calibration on the galvanometer module 30 to adjust the scanning format, working distance, spot size, etc.

Specifically, the working distance between the galvanometer module 30 and the correction platform 50 is adjusted according to the required format of the main body glass. For example, when the width of the main glass, that is, the scanning width, is 2000mm*2000mm, the working distance can be set to 2400mm. That is to say, the distance between the galvanometer module 30 and the correction platform 50 is set to 2400 mm.

In addition, before controlling the laser transmitter 10 to emit a laser beam, the energy and frequency of the laser transmitter 10 need to be set as needed. For example, if the thickness of the glass to be split is 4 mm, the critical energy density of the glass to be split is about 0.2J/cm ² . Correspondingly, the power of the laser transmitter 10 is selected to be 85w@10kHz, and the laser beam quality M ² = 1.2. Of course, while ensuring the energy density, by increasing the power of the laser emitter 10, the spot can be adjusted to be larger, which is more conducive to improving the splitting efficiency.

In some embodiments, before controlling the laser emitter 10 to emit the laser beam, it is also necessary to use a dimming fixture to adjust the optical path so that the laser beam can pass through the center of the galvanometer module 30 and be perpendicular to the plane of the calibration platform 50 . Specifically, adjust the screw button of the laser splitting device 1 so that the focus of the laser beam is on the working surface. After adjusting the central focus, lock the screw button with a small internal hexagon.

In some embodiments, it is also necessary to calibrate the focal plane (BOX plane) before controlling the laser transmitter 10 to emit the laser beam. Specifically, the focus of the BOX surface is roughly aligned, so that when the BOX surface is corrected, the laser beam can be roughly focused on the working surface, and the laser beam can create a visible and measurable BOX frame on the working surface. Specifically, you can find the ideal focus by adjusting the Z value of the voice coil. After rough calibration of the BOX surface, a CCD image sensor (Charge coupled Device, CCD) is used for precise calibration. While maintaining the correction accuracy, rotate the screw button to adjust the light spot in the correction plane to an appropriate size. Among them, the size of the light spot is determined by the thickness of the glass to be split.

Specifically, in order to achieve the fastest splitting efficiency and the best splitting effect, the diameter of the light spot needs to cover the cutting line that runs through the entire thickness of the glass to be split. Then, the diameter d of the light spot and the thickness t of the glass to be split need to satisfy: d≥t*tanθ. Among them, θ represents the angle between the laser beam and the vertical direction.

As shown in Figure 8, as the laser beam moves along the preset split path, the size of θ will change. Among them, θ is the largest when the laser beam moves to the corner of the preset split path. Therefore, when the laser beam is moved to the four corners of the main body glass, the angle between the laser beam and the vertical direction serves as the maximum value of θ. Specifically, since the galvanometer module 30 is opposite to the center of the glass to be split, the scanning width has the following relationship with the distance between the galvanometer module 30 and the glass to be split: Among them, r represents half of the format length,/> represents the distance between the center of the glass to be split and the four corners of the main glass, and H represents the vertical distance between the galvanometer module 30 and the glass to be split.

From the above we can get,

For example, if the format of the main glass is 2000mm*2000mm, the thickness is 4mm, the distance H between the galvanometer module 30 and the glass to be split is 2400mm, then r is 1000mm, and the diameter of the light spot d is at least 2.33mm.

Correspondingly, the optical path from the center of the galvanometer module 30 to the four corners of the main body glass can be expressed as: L2=2r2+H2; the maximum optical path difference can be expressed as: Among them, L represents the optical path. It can be understood that the maximum optical path difference represents the difference between the distance between the galvanometer module 30 and the cutting line and the distance between the galvanometer module 30 and the glass to be split. Taking the above-mentioned format of the main glass as an example, the optical path L from the center of the galvanometer module 30 to the four corners of the main glass is 2785.6 mm, and the maximum optical path difference is 385.6 mm.

Please refer to FIG. 6 , which is a sub-flow chart of the laser splitting method provided by the embodiment of the present invention. When the number of galvanometer modules 30 is multiple, before step S102 is performed, the laser splitting method further includes the following steps.

Step S202, adjust the position of the glass to be broken.

The controller 40 adjusts the position of the glass to be broken. Specifically, after the Bessel-cut glass to be split is transferred to the correction platform 50, the controller 40 can control an adjustment module (not shown) provided on the correction platform 50 to adjust the glass to be split, so that the glass to be split is Accurate placement. In this embodiment, the glass to be split includes multiple fixed points. Among them, the number and size of fixed points are set according to the size of the glass to be split.

For example, when the glass to be split needs to be divided into four main glasses, the glass to be split is provided with four fixed points, and each fixed point is the center point of a main glass.

Step S204, adjust the position of the galvanometer module so that each galvanometer module corresponds to a fixed point one-to-one.

The controller 40 adjusts the positions of the galvanometer modules 30 one by one so that one galvanometer module 30 is directly opposite to a fixed point.

In the above embodiment, the splicing of multiple galvanometer modules can achieve larger-format glass slits. For products of different sizes, the number of galvanometer modules can be flexibly selected, and the applicability is very strong.

Please refer to FIG. 9 , which is a schematic structural diagram of a main control device provided by an embodiment of the present invention. The main control device 70 includes a memory 71 and a processor 72 . The memory 71 is used to store program instructions, and the processor 72 is used to execute the program instructions to implement the above-mentioned laser splitting method.

In some embodiments, the processor 72 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor or other data processing chips, and is used to run program instructions stored in the memory 71 .

The memory 71 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (eg, SD or DX memory, etc.), magnetic memory, magnetic disk, optical disk, etc. The memory 71 may in some embodiments be an internal storage unit of the computer device, such as a hard disk of the computer device. In other embodiments, the memory 71 may also be an external storage device of the computer device, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card equipped on the computer device, FlashCard, etc. Further, the memory 71 may also include both an internal storage unit of the computer device and an external storage device. The memory 71 can not only be used to store application software installed on the computer equipment and various types of data, such as codes for implementing the laser splitting method, etc., but can also be used to temporarily store data that has been output or is to be output.

What is described above is only part or preferred embodiments of the present invention. Neither the text nor the drawings can therefore limit the scope of protection of the present invention. All contents of the description and drawings of the present invention are used under the overall concept of the present invention. Equivalent structural transformations, or direct/indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims (10)

1. A laser cleaving method, the laser cleaving method comprising:

controlling a laser transmitter to emit a laser beam, wherein the laser beam is reflected by a reflecting component and is incident to a galvanometer module, and the galvanometer module comprises a laser galvanometer and a focusing component;

controlling the laser galvanometer to work so that laser beams emitted from the galvanometer module move along a preset lobe path; and

and adjusting the distance between the focusing assembly and the glass to be broken so as to ensure that the diameter of a light spot formed on the surface of the glass to be broken by the laser beam is kept consistent, wherein the glass to be broken is cut by Bessel.

2. The laser breaking method according to claim 1, wherein the focusing assembly includes a biconcave lens and a biconvex lens sequentially arranged at intervals along an outgoing direction of the laser beam, and adjusting a distance between the focusing assembly and glass to be broken includes:

adjusting the distance between the biconcave lens and the glass to be fractured; or alternatively

And adjusting the distance between the biconvex lens and the glass to be cracked.

3. The laser splitting method of claim 1, wherein when the number of galvanometer modules is one, before controlling the laser transmitter to emit the laser beam, the laser splitting method further comprises:

and adjusting the position of the glass to be cracked so that the vibrating mirror module is opposite to the center of the glass to be cracked.

4. The laser splitting method of claim 1, wherein when the number of galvanometer modules is plural, before controlling the laser emitter to emit the laser beam, the laser splitting method further comprises:

adjusting the position of the glass to be broken, wherein the glass to be broken comprises a plurality of fixed points; and

and adjusting the positions of the vibrating mirror modules so that each vibrating mirror module corresponds to the fixed point one by one.

5. A master device, the master device comprising:

a memory for storing program instructions; and

a processor for executing the program instructions to implement the laser splinter method according to any one of claims 1 to 4.

6. A laser cleaving apparatus, the laser cleaving apparatus comprising:

a laser emitter for emitting a laser beam;

a reflective assembly;

the galvanometer module comprises a laser galvanometer and a focusing assembly; and

and a controller electrically connected to the laser emitter and the galvanometer module, respectively, the controller configured to perform:

controlling the laser emitter to emit a laser beam, wherein the laser beam is reflected by the reflecting component and is incident to the vibrating mirror module;

controlling the laser galvanometer to work so that laser beams emitted from the galvanometer module move along a preset lobe path; and

and adjusting the distance between the focusing assembly and the glass to be broken so as to ensure that the diameter of a light spot formed on the surface of the glass to be broken by the laser beam is kept consistent, wherein the glass to be broken is cut by Bessel.

7. The laser splitting device according to claim 6, wherein the focusing assembly comprises a biconcave lens and a biconvex lens, which are sequentially arranged at intervals along the outgoing direction of the laser beam; the controller is configured to perform:

adjusting the distance between the biconcave lens and the glass to be fractured; or alternatively

And adjusting the distance between the biconvex lens and the glass to be cracked.

8. The laser splinter device of claim 7 wherein said galvanometer module further comprises an adjustment motor, at least one of said biconcave lens and said biconvex lens being disposed on said adjustment motor; the controller is respectively and electrically connected with the laser galvanometer and the adjusting motor, and the controller is further configured to execute:

and controlling the adjusting motor to move the biconcave lens or the biconvex lens to a direction approaching to the glass to be cracked or a direction separating from the glass to be cracked.

9. The laser splitting device of claim 6, comprising at least one galvanometer module, wherein when the laser splitting device comprises a plurality of galvanometer modules, the plurality of galvanometer modules are arranged in an array at intervals.

10. The laser splinter device of claim 6, further comprising a correction platform and a mount, wherein the mount is disposed on the correction platform, the laser transmitter, the reflection assembly, and the galvanometer module are disposed on the mount, and the galvanometer module is disposed opposite the correction platform.