CN116845060A - Infrared module and electronic equipment - Google Patents

Infrared module and electronic equipment Download PDF

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Publication number
CN116845060A
CN116845060A CN202310801496.1A CN202310801496A CN116845060A CN 116845060 A CN116845060 A CN 116845060A CN 202310801496 A CN202310801496 A CN 202310801496A CN 116845060 A CN116845060 A CN 116845060A
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CN
China
Prior art keywords
infrared
transmission area
transmission
circuit board
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310801496.1A
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Chinese (zh)
Inventor
许强
金豆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN202310801496.1A priority Critical patent/CN116845060A/en
Publication of CN116845060A publication Critical patent/CN116845060A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Communication System (AREA)

Abstract

The application discloses an infrared module and electronic equipment, the infrared module includes: the infrared transmitter comprises a circuit board, a flexible transmission layer, an infrared transmitter and an infrared receiver, wherein the flexible transmission layer comprises a first transmission area and a second transmission area which are connected with each other, the first transmission area and the second transmission area are relatively bent, the direction of the relative bending is adjustable, one side of the first transmission area is electrically connected with the circuit board, the other side of the first transmission area is electrically connected with the infrared receiver, and the second transmission area is electrically connected with the infrared transmitter. Thus, the light emitting effect and the light receiving effect of the infrared module can be enhanced.

Description

Infrared module and electronic equipment
Technical Field
The application belongs to the technical field of electronics, and particularly relates to an infrared module and electronic equipment.
Background
With the continuous development of infrared technology, the application range of the infrared module in the life of people is also becoming wider and wider. In the current use process, the light emitting direction and the light receiving direction of the infrared module are usually fixed, so that the light emitting effect and the light receiving effect of the infrared module are poor.
Disclosure of Invention
The application aims to provide an infrared module and electronic equipment, and solves the problem that the light emitting effect and the light receiving effect of the infrared module are poor.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application provides an infrared module, including: the infrared transmitter comprises a circuit board, a flexible transmission layer, an infrared transmitter and an infrared receiver, wherein the flexible transmission layer comprises a first transmission area and a second transmission area which are connected with each other, the first transmission area and the second transmission area are relatively bent, the direction of the relative bending is adjustable, one side of the first transmission area is electrically connected with the circuit board, the other side of the first transmission area is electrically connected with the infrared receiver, and the second transmission area is electrically connected with the infrared transmitter.
In a second aspect, an embodiment of the present application provides an electronic device, including: the infrared module.
In the embodiment of the application, the flexible transmission layer comprises a first transmission area and a second transmission area which are connected with each other, one side of the first transmission area is electrically connected with the circuit board, the other side of the first transmission area is electrically connected with the infrared receiver, the second transmission area is electrically connected with the infrared transmitter, the first transmission area and the second transmission area are relatively bent, and the relative bending direction is adjustable, so that the light emitting direction and the light receiving direction of the infrared module can be adjusted by adjusting the relative bending angle between the first transmission area and the second transmission area, namely adjusting the relative bending direction, and the light emitting effect and the light receiving effect of the infrared module are enhanced.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of an infrared module according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another infrared module according to an embodiment of the present application;
FIG. 3 is a schematic diagram of another infrared module according to an embodiment of the present application;
FIG. 4 is a schematic diagram of another infrared module according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of another infrared module according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an infrared module according to an embodiment of the present application, as shown in fig. 1, the infrared module includes: the infrared transmitter comprises a circuit board 10, a flexible transmission layer 20, an infrared transmitter 30 and an infrared receiver 40, wherein the flexible transmission layer 20 comprises a first transmission area 21 and a second transmission area 22 which are connected with each other, the first transmission area 21 and the second transmission area 22 are bent relatively, the bending direction is adjustable relatively, one side of the first transmission area 21 is electrically connected with the circuit board 10, the other side of the first transmission area 21 is electrically connected with the infrared receiver 40, and the second transmission area 22 is electrically connected with the infrared transmitter 30.
The working principle of the embodiment of the application can be seen in the following expression:
since the flexible transmission layer 20 includes the first transmission region 21 and the second transmission region 22 which are connected with each other, the first transmission region 21 and the second transmission region 22 have better flexibility, that is, the first transmission region 21 and the second transmission region 22 have better folding performance, while one side of the first transmission region 21 is electrically connected with the circuit board 10, the other side of the first transmission region 21 is electrically connected with the infrared receiver 40, the second transmission region 22 is electrically connected with the infrared emitter 30, and the first transmission region 21 and the second transmission region 22 are relatively bent, and the direction of the relative bending is adjustable, so that the light emitting direction and the light receiving direction of the infrared module can be adjusted by adjusting the relative bending angle between the first transmission region 21 and the second transmission region 22, thereby enhancing the light emitting effect and the light receiving effect of the infrared module.
It should be noted that, since only the relative bending angle between the first transmission area 21 and the second transmission area 22 needs to be adjusted, the light emitting direction and the light receiving direction of the infrared module can be adjusted, that is, the light emitting angle of the infrared emitter 30 and the light receiving angle of the infrared receiver 40 can be adjusted, so that when the infrared emitter 30 emits light or when the infrared receiver 40 receives light, compared with the mode that the light emitting direction and the light receiving direction of the infrared module need to be adjusted by depending on other components, the embodiment of the application can simplify the adjusting mode of the light emitting direction and the light receiving direction of the infrared module, improve the adjusting efficiency, and meanwhile, no other components need to be separately arranged, thereby reducing the use cost and the volume of the infrared module.
Note that, referring to fig. 1 to 5, A1 may be used to indicate the light emitting direction of the infrared emitter 30, and A2 may be used to indicate the light receiving direction of the infrared receiver 40.
The above manner of adjusting the light emitting direction and the light receiving direction of the infrared module according to other components may include at least one of the following: the refraction or reflection of other optical devices such as a prism is relied on, so that the light emitting direction and the light receiving direction of the infrared module are changed; alternatively, the infrared emitter 30 is attached to the substrate of the infrared module in a forward or side-attaching manner, so as to adjust the light emitting direction and the light receiving direction of the infrared module.
In addition, since the embodiment of the application does not need other optical devices such as a prism to perform secondary optical conversion, the signal loss of infrared light emitted by the infrared emitter 30 is reduced, the signal to noise ratio of the infrared light is increased, and meanwhile, the driving current of the infrared emitter 30 is reduced, and the power consumption is reduced.
It should be noted that, referring to fig. 1 to 5, the infrared emitter 30 may be located in the first package housing 31, the infrared receiver 40 may be located in the second package housing 41, and the first package housing 31 and the second package housing 41 may be made of transparent packaging materials, so that the waterproof and dustproof effects of the infrared emitter 30 and the infrared receiver 40 may be enhanced, and the protection effects of the infrared emitter 30 and the infrared receiver 40 may be enhanced. The specific kind of the transparent encapsulating material is not limited herein, and alternatively, the transparent encapsulating material may be a transparent resin.
In addition, the number of the infrared emitters 30 and the infrared receivers 40 is not limited herein, and alternatively, the number of the infrared emitters 30 and the infrared receivers 40 may be 1, or the number of the infrared emitters 30 and the infrared receivers 40 may be at least 2.
It should be noted that, the infrared emitters 30 and the infrared receivers 40 may be in one-to-one correspondence, or when the number of the infrared emitters 30 and the number of the infrared receivers 40 may be at least 2, 1 infrared emitter 30 may correspond to a plurality of infrared receivers 40, and 1 infrared receiver 40 may also correspond to a plurality of infrared emitters 30, which is not limited herein.
In addition, the types of infrared emitter 30 and infrared receiver 40 are not limited herein, and optionally, infrared emitter 30 includes at least one of: a light emitting diode (Light Emitting Diode, LED), a Vertical-cavity Surface-emitting Laser (VCSEL), a side-emitting Laser emitter (Edge Emitting Laser, EEL); the infrared receiver 40 includes at least one of the following: photodiodes (PD), avalanche diodes (Avalanche Photo Diode, APD), single photon avalanche diodes (Single Photon Avalanche Diode, SPAD).
In addition, the infrared module can be packaged by adopting wafer level packaging (Wafer Level Chip Scale Package, WLCSP) technology.
It should be noted that the specific structure of the flexible transmission layer 20 is not limited herein, and as an alternative embodiment, the flexible transmission layer 20 may be a flexible metal transmission layer, and the flexible metal transmission layer may include the first transmission region 21 and the second transmission region 22.
As another alternative embodiment, referring to fig. 1 to 5, the flexible transmission layer 20 includes a flexible insulation layer 201 and a signal transmission layer 202, the flexible insulation layer 201 is disposed on the signal transmission layer 202, and the signal transmission layer 202 includes the first transmission region 21 and the second transmission region 22.
Wherein the flexible insulating layer 201 is disposed on the signal transmission layer 202, it can be understood that: the flexible insulating layer 201 is sleeved on the signal transmission layer 202, or the signal transmission layer 202 is penetrated in the flexible insulating layer 201.
Wherein, the infrared emitter 30 and the infrared receiver 40 may be fixedly connected to the flexible insulating layer 201, so that a fixing effect may be achieved on the infrared emitter 30 and the infrared receiver 40, alternatively, the infrared receiver 40 may be fixedly connected to a first area on the flexible insulating layer 201 corresponding to the first transmission area 21, and the infrared emitter 30 may be fixedly connected to a second area on the flexible insulating layer 201 corresponding to the second transmission area 22.
Alternatively, referring to fig. 1 to 5, the infrared receiver 40 and the first region may be fixedly connected by a second adhesive layer 71.
In addition, the connection manner between the infrared receiver 40 and the first transmission area 21 and the connection manner between the infrared emitter 30 and the second transmission area 22 are not limited herein, alternatively, referring to fig. 1 to 5, a through hole is formed in the first area, a connection wire 42 is penetrated in the through hole, and the infrared receiver 40 is electrically connected with the first transmission area 21 through the connection wire 42, so that the electrical connection effect between the infrared receiver 40 and the first transmission area 21 is relatively stable, and the connection wire 42 may also be referred to as a binding wire.
It should be noted that, referring to fig. 1 to 5, the infrared receiver 40 may be provided with a photodiode 43, and the photodiode 43 may convert an optical signal into an electrical signal, so that by providing the photodiode 43, accuracy of a detection result of the infrared light received by the infrared receiver 40 may be improved.
Optionally, the infrared emitter 30 is electrically connected to the second transmission area 22 through a conductive silver adhesive layer, so that the conductive silver adhesive layer can simultaneously fix and conduct the infrared emitter 30, and no fixing member and no conductive member are required to be separately provided, thereby simplifying the structure and reducing the use cost.
In addition, the specific connection manner of the first transmission area 21 and the circuit board 10 is not limited herein, and as an alternative embodiment, the first transmission area 21 may be electrically connected to the circuit board 10 through an electrical connection wire.
As an alternative embodiment, referring to fig. 1 to 5, the first transmission area 21 may be electrically connected to the circuit board 10 through a plurality of solder balls 50, so that the solder balls 50 may enhance the stability of the electrical connection while the solder balls 50 may also serve as a support between the circuit board 10 and the first transmission area 21.
The bending angle between the first transmission region 21 and the second transmission region 22, and the positional relationship between the first transmission region 21 and the circuit board 10, and the positional relationship between the second transmission region 22 and the circuit board 10 are not limited herein.
As an alternative embodiment, referring to fig. 1 and 2, the circuit board 10 includes a first surface 101 and a second surface 102 connected to each other, the first transmission area 21 is disposed opposite to the first surface 101, and the first transmission area 21 is electrically connected to the first surface 101, the second transmission area 22 is disposed opposite to the second surface 102, and the second transmission area 22 is electrically connected to the second surface 102.
The first surface 101 and the second surface 102 may have a target angle therebetween, and the target angle may be greater than a preset threshold, alternatively, the preset threshold may be 0.
In the embodiment of the present application, since the first surface 101 and the second surface 102 are connected to each other, and the first transmission area 21 is disposed opposite to the first surface 101, and the second transmission area 22 is disposed opposite to the second surface 102, an included angle between the infrared emitter 30 and the infrared receiver 40 is increased, so that a phenomenon that infrared light emitted by the infrared emitter 30 directly enters the infrared receiver 40 can be reduced, and accuracy of a detection result of the infrared receiver 40 is improved.
It should be noted that, the infrared light emitted by the infrared emitter 30 may include a first portion of infrared light and a second portion of infrared light, where the first portion of infrared light is the infrared light that is transmitted out of the infrared module and then returns to the infrared receiver 40 when encountering the obstacle, and the second portion of infrared light is the infrared light that is directly transmitted from the infrared emitter 30 to the infrared receiver 40 in the infrared module, and according to the first portion of infrared light, the detection function of the infrared module may be implemented, and because of the existence of the second portion of infrared light, the detection result of the infrared module may be disturbed, so that the existence of the second portion of infrared light needs to be reduced as much as possible.
Optionally, the first transmission area 21 and the second transmission area 22 are perpendicular to each other, so that the infrared emitter 30 and the infrared receiver 40 are also perpendicular to each other, so that the included angle between the infrared emitter 30 and the infrared receiver 40 is increased as much as possible, and the amount of the second portion of infrared light is reduced, thereby improving the accuracy of the detection result of the infrared receiver 40.
The manner of reducing the second portion of infrared light is not limited herein.
As an alternative embodiment, referring to fig. 1 to 5, the infrared module further includes a light blocking member 60, and the light blocking member 60 is located between the infrared emitter 30 and the infrared receiver 40. Thus, the number of the above-described second portion of infrared light entering the infrared receiver 40 can be reduced as well by the light blocking member 60, thereby further improving the accuracy of the detection result of the infrared receiver 40.
The light blocking member 60 may also be referred to as a light shielding wall.
It should be noted that the specific structure of the light blocking member 60 is not limited herein, alternatively, the thickness of the light blocking member 60 may be greater than that of the infrared receiver 40, so that the blocking effect of the light blocking member 60 on the second portion of infrared light may be further enhanced.
As an alternative embodiment, referring to fig. 1 to 3, the circuit board 10 is provided with a groove 11, and the second transmission area 22 and the infrared emitter 30 are both located in the groove 11.
In the embodiment of the application, the groove 11 is formed on the circuit board 10, and the second transmission area 22 and the infrared emitter 30 are both positioned in the groove 11, so that no separate space is reserved for the second transmission area 22 and the infrared emitter 30, thereby reducing the volume of the infrared module.
Alternatively, the second transmission area 22 and the infrared emitter 30 are both located in the groove 11, and the second transmission area 22 and the infrared emitter 30 may be fixedly connected to the bottom wall of the groove 11 through the first adhesive layer 70, so that the fixing effect on the second transmission area 22 and the infrared emitter 30 may be enhanced.
As an alternative embodiment, referring to fig. 2 and 3, the bottom of the groove 11 is an inclined surface, and the second transmission area 22 is fixedly connected with the inclined surface.
In the embodiment of the application, since the bottom of the groove 11 is an inclined plane, the second transmission area 22 is fixedly connected with the inclined plane, and the light emitting direction and the light receiving direction of the infrared module can be further adjusted by selecting the inclined planes with different inclinations, so that the light emitting effect and the light receiving effect of the infrared module are enhanced.
Alternatively, referring to fig. 2, when the included angle between the second transmission area 22 and the first transmission area 21 is an obtuse angle, the light emitting direction of the infrared emitter 30 may deflect toward the near infrared receiver 40, and at this time, the light intensity of the infrared light received by the infrared receiver 40 may be enhanced, where the light intensity may also be understood as the intensity of the infrared light, and is applicable to a scene with a high signal requirement, but no requirement on the background noise, that is, primarily considering the receiving amount of the first portion of infrared light, and secondarily considering the interference problem of the second portion of infrared light on the detection result.
Optionally, referring to fig. 3, when the included angle between the second transmission area 22 and the first transmission area 21 is an acute angle, the light emitting direction of the infrared emitter 30 may deflect away from the infrared receiver 40, so that crosstalk between the infrared emitter 30 and the infrared receiver 40 may be reduced, which is suitable for a scene with enough signal quantity and less noise floor requirement, i.e. primarily consider the interference problem of the second portion of infrared light on the detection result, and secondarily consider the receiving quantity of the first portion of infrared light.
As an alternative embodiment, a first angle adjusting device 81 is provided on the bottom of the recess 11, and the second transmission area 22 and the infrared emitter 30 are fixedly connected to the bottom of the recess 11 by the first angle adjusting device 81.
In the embodiment of the application, the first angle adjusting device 81 is arranged on the bottom of the groove 11, and the second transmission area 22 and the infrared emitter 30 are fixedly connected with the bottom of the groove 11 through the first angle adjusting device 81, so that the angle between the infrared emitter 30 and the infrared receiver 40 can be further adjusted through the first angle adjusting device 81, thereby further adjusting the light emitting direction and the light receiving direction of the infrared module, and further enhancing the light emitting effect and the light receiving effect of the infrared module.
As an alternative embodiment, referring to fig. 4 and 5, a second angle adjusting device 80 is disposed on the circuit board 10, and the second transmission area 22 and the infrared emitter 30 are fixedly connected to the circuit board 10 through the second angle adjusting device 80.
The second angle adjustment device 80 can be bonded to the circuit board 10, and the second transmission region 22 and the infrared emitter 30 can be fixedly connected to the second angle adjustment device 80 by the first adhesive layer 70.
In the embodiment of the application, the circuit board 10 is provided with the second angle adjusting device 80, and the second transmission area 22 and the infrared emitter 30 are fixedly connected with the circuit board 10 through the second angle adjusting device 80, so that the angle between the infrared emitter 30 and the infrared receiver 40 can be further adjusted through the second angle adjusting device 80, and the light emitting direction and the light receiving direction of the infrared module can be further adjusted, so that the light emitting effect and the light receiving effect of the infrared module can be enhanced.
In addition, since the second angle adjusting device 80 is disposed on the circuit board 10, the groove 11 is not required to be formed on the circuit board 10, and the processing difficulty and the processing cost are reduced.
It should be noted that, the specific structures of the first angle adjusting device 81 and the second angle adjusting device 80 are not limited herein, and alternatively, the first angle adjusting device 81 and the second angle adjusting device 80 may be wedge blocks with adjustable inclination angles or triangle blocks with adjustable inclination angles; alternatively, the first angle adjusting device 81 and the second angle adjusting device 80 may be wedge blocks with fixed inclination angles or triangle blocks with fixed inclination angles, and when the inclination angles of the wedge blocks or triangle blocks are fixed, the purpose of angle adjustment can be achieved by replacing the wedge blocks or triangle blocks with different inclination angles.
As an alternative embodiment, referring to fig. 5, the infrared module further includes a circuit connection board 90, and the first transmission area 21 is electrically connected to the circuit board 10 through the circuit connection board 90.
The circuit connection board 90 may be also referred to as a raising module, and the circuit connection board 90 may be provided with a conductive via 91 therein, and the circuit in the first transmission area 21 may be electrically connected to the circuit board 10 through the conductive via 91, and the circuit connection board 90 may be provided with a target circuit without the conductive via 91, and the target circuit may be electrically connected to the circuit board 10.
In the embodiment of the present application, the circuit connection board 90 may be provided with a target circuit, and the target circuit may have a target function, so that the variety of functions of the infrared module may be further increased.
The specific content of the above target function is not limited herein, and alternatively, the target function may include a display function or the like.
The embodiment of the application also provides an electronic device, which comprises the infrared module, and the electronic device comprises the infrared module, so that the electronic device has the same beneficial technical effects as the infrared module, and the specific structure of the infrared module can be referred to the related expression in the embodiment, and the detailed description is omitted herein.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An infrared module, comprising: the infrared transmitter comprises a circuit board, a flexible transmission layer, an infrared transmitter and an infrared receiver, wherein the flexible transmission layer comprises a first transmission area and a second transmission area which are connected with each other, the first transmission area and the second transmission area are relatively bent, the direction of the relative bending is adjustable, one side of the first transmission area is electrically connected with the circuit board, the other side of the first transmission area is electrically connected with the infrared receiver, and the second transmission area is electrically connected with the infrared transmitter.
2. The infrared module of claim 1, wherein the circuit board comprises a first surface and a second surface that are connected to each other, the first transmission region is disposed on the first surface and is electrically connected to the first surface, the second transmission region is disposed opposite to the second surface and is electrically connected to the second surface.
3. The infrared module of claim 1, wherein the circuit board is provided with a groove, and the second transmission area and the infrared emitter are both positioned in the groove.
4. The infrared module of claim 1, wherein the first transmission region is electrically connected to the circuit board by a plurality of solder balls.
5. An infrared module according to claim 3, wherein a first angle adjusting device is arranged on the bottom of the groove, and the second transmission area and the infrared emitter are fixedly connected with the bottom of the groove through the first angle adjusting device.
6. The infrared module according to claim 1, wherein a second angle adjusting device is arranged on the circuit board, and the second transmission area and the infrared emitter are fixedly connected with the circuit board through the second angle adjusting device.
7. The infrared module of any one of claims 1 to 6, further comprising a light barrier positioned between the infrared emitter and the infrared receiver.
8. The infrared module of any one of claims 1-6, wherein the flexible transmission layer comprises a flexible insulating layer and a signal transmission layer, the flexible insulating layer disposed on the signal transmission layer, the signal transmission layer comprising the first transmission region and the second transmission region.
9. The infrared module of any one of claims 1 to 6, further comprising a circuit connection board having a conductive via disposed therein, the circuitry of the first transmission region being electrically connected to the circuit board through the conductive via.
10. An electronic device comprising an infrared module according to any one of claims 1 to 9.
CN202310801496.1A 2023-07-03 2023-07-03 Infrared module and electronic equipment Pending CN116845060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310801496.1A CN116845060A (en) 2023-07-03 2023-07-03 Infrared module and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310801496.1A CN116845060A (en) 2023-07-03 2023-07-03 Infrared module and electronic equipment

Publications (1)

Publication Number Publication Date
CN116845060A true CN116845060A (en) 2023-10-03

Family

ID=88166474

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310801496.1A Pending CN116845060A (en) 2023-07-03 2023-07-03 Infrared module and electronic equipment

Country Status (1)

Country Link
CN (1) CN116845060A (en)

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