CN116810528A - Wafer grinding method and wafer grinding machine - Google Patents
Wafer grinding method and wafer grinding machine Download PDFInfo
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- CN116810528A CN116810528A CN202311109996.5A CN202311109996A CN116810528A CN 116810528 A CN116810528 A CN 116810528A CN 202311109996 A CN202311109996 A CN 202311109996A CN 116810528 A CN116810528 A CN 116810528A
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- 238000006073 displacement reaction Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 9
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- 230000003044 adaptive effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 209
- 238000005498 polishing Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
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Abstract
The invention belongs to the technical field of wafer grinding, and discloses a wafer grinding method and a wafer grinding machine, wherein the wafer grinding method comprises the following steps: the wafer carrying platform is positioned at the loading position, the wafer carrying platform and the grinding wheel positioned at the loading position are arranged at intervals along the first horizontal direction, the wafer is placed on the wafer carrying platform, and the center of the wafer is positioned on the axis of the wafer carrying platform; selecting an adaptive grinding wheel according to the size of the wafer; the carrier is driven to move along the first horizontal direction by a second preset distance, wherein the second preset distance is selected to be equal to the difference value of the distance between the axis of the carrier at the feeding position and the axis of the grinding wheel minus the radius of the grinding wheel. Because the stroke of the wafer carrying platform can be automatically adjusted according to the size of the grinding wheel without repeated debugging by a worker, the process of repeated debugging of the stroke of the wafer carrying platform by the worker is omitted, time and labor are saved, and the production efficiency can be improved.
Description
Technical Field
The present invention relates to wafer grinding technology, and more particularly, to a wafer grinding method and a wafer grinding machine.
Background
In semiconductor manufacturing processes, wafer grinding is typically performed by a wafer grinder. In the prior art, there are various wafer grinding processes, one of which is a TAIKO grinding process, specifically, when a wafer is ground, an annular area is preset on a grinding surface of the wafer, the annular area is located at an edge of the wafer along a circumferential direction of the wafer, and a grinding wheel grinds in the annular area to thin the wafer, after grinding is completed, a protrusion is formed on a surface of the wafer, and the protrusion is located at the edge of the wafer along the circumferential direction of the wafer.
Based on the above, the wafer grinding machine for performing TAIKO grinding on a wafer includes a spindle and a wafer carrying table, on which a grinding wheel is mounted, the diameter of the grinding wheel is equal to the radius of the wafer minus the width of the annular region, the wafer is placed on the wafer carrying table, and the center of the wafer is located on the axis of the wafer carrying table, the wafer carrying table can be moved from a loading position to a grinding position, when the wafer carrying table is located at the grinding position, the axis of the wafer carrying table is tangential to the outer edge of the grinding wheel, since the diameter of the grinding wheel is equal to the radius of the wafer minus the width of the annular region, the maximum distance between the outer edge of the grinding wheel and the outer edge of the wafer is equal to the radius of the wafer after the grinding wheel descends in the vertical direction and presses against the wafer, and the minimum distance between the outer edge of the grinding wheel and the outer edge of the wafer is equal to the radial width of the annular region of the wafer, after that, the grinding wheel and the wafer can both rotate around the respective axes, so that the wafer can be ground to form a bump of a preset width after grinding the wafer.
In the prior art, wafers have various sizes, and the widths of preset annular areas on the wafers with different sizes are consistent, so in order to grind the wafers with different sizes on the same wafer grinder, a step of replacing grinding wheels with different sizes is needed to be added in the grinding method of the wafer grinder, namely, after other wafers with different sizes are placed on a wafer bearing table, the matched grinding wheels are needed to be replaced according to the sizes of the wafers placed on the wafer bearing table, but if only the grinding wheels with different sizes are replaced to be matched with the wafers with different sizes, and the wafer bearing table is still moved to a grinding position from a loading position according to an original stroke, the axis of the wafer bearing table moved to the grinding position is offset relative to the outer edge of the grinding wheel, namely, the axis of the wafer bearing table moved to the grinding position is positioned on the inner side or the outer side of the outer edge of the grinding wheel, so that when the wafers are ground, the phenomenon of grinding wheels is leaked or overground, and meanwhile, the widths of protrusions formed after the wafers are ground are not in accordance with the requirements.
Therefore, in the prior art, after the wafer grinding machine changes the grinding wheel, the worker needs to repeatedly debug the travel of the wafer carrying platform, so that the axis of the wafer carrying platform moving to the grinding position is tangent to the outer edge of the grinding wheel, the process of repeatedly debugging the travel of the wafer carrying platform by the worker is complex, time and labor are wasted, and the production efficiency is affected.
Therefore, the above-described problems are to be solved.
Disclosure of Invention
The invention aims to provide a wafer grinding method and a wafer grinding machine, which are used for solving the problems that after the wafer grinding machine changes a grinding wheel, a worker needs to repeatedly debug the stroke of a wafer carrying table, the process of repeatedly debugging the stroke of the wafer carrying table by the worker is complex, time and labor are wasted, and the production efficiency is affected.
To achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a wafer grinding method, in which a grinding surface of a wafer is preset with an annular region, and the annular region is located at an edge of the wafer along a circumferential direction of the wafer, the wafer grinding method includes:
the wafer carrying platform is positioned at a feeding position, the wafer carrying platform and the grinding wheel positioned at the feeding position are arranged at intervals along a first horizontal direction, a wafer is placed on the wafer carrying platform, and the center of the wafer is positioned on the axis of the wafer carrying platform;
selecting an adapted grinding wheel according to the size of the wafer, wherein the diameter of the grinding wheel is equal to the difference of the radius of the wafer minus a first preset distance, and the first preset distance is selected to be equal to the width of the annular area along the radial direction of the wafer;
the wafer grinding method further comprises the following steps:
and driving the piece bearing platform to move along the first horizontal direction by a second preset distance, wherein the second preset distance is selected to be equal to the difference value of the distance between the axis of the piece bearing platform and the axis of the grinding wheel at the feeding position minus the radius of the grinding wheel.
Preferably, the servo motor drives the wafer carrying platform to move by the second preset distance.
Preferably, the angular displacement of the movable end of the servo motor is recorded by an encoder.
The invention also provides a wafer grinding machine, which adopts the wafer grinding method to grind wafers, and comprises the following steps:
a wafer stage configured to carry the wafer;
a main shaft, the end part of which is detachably provided with a grinding wheel, and the axis of the grinding wheel is coincident with the axis of the main shaft;
the first driving piece is configured to drive the wafer carrying platform to move along the first horizontal direction;
a second driving member configured to drive the spindle to rotate about an axis thereof;
and the third driving piece is configured to drive the main shaft and/or the piece bearing platform to move along the vertical direction.
Preferably, the first driving member is a servo motor.
Preferably, the wafer grinder further comprises an encoder configured to record the angular displacement of the movable end of the servo motor.
Preferably, the wafer bearing table is provided with a sucker, and the axis of the sucker coincides with the axis of the wafer bearing table.
Preferably, the wafer grinder further includes a photoelectric sensor configured to detect a moving distance of the wafer stage in the first horizontal direction.
Preferably, the wafer grinder further comprises:
the main shaft is connected to the first mounting frame in a sliding manner along the vertical direction;
and a buffer member mounted between the spindle and the first mounting frame, the buffer member configured to buffer the grinding wheel when the grinding wheel moves in a vertical direction to press against the wafer.
Preferably, the buffer member includes:
the first driving piece is configured to drive the first mounting plate to move along the vertical direction, and the main shaft is connected to the first mounting plate in a sliding manner along the vertical direction;
the lower end of the air spring is hinged to the main shaft, and the upper end of the air spring is hinged to the first mounting frame.
The invention has the beneficial effects that: according to the invention, the size of the grinding wheel for grinding the wafer is selected according to the size of the wafer placed on the wafer carrying platform, and the moving stroke of the wafer carrying platform is adjusted according to the size of the grinding wheel, so that the wafers with different sizes and the grinding wheel are ensured to be tangent to the outer edge of the grinding wheel after the wafer carrying platform moves along the first horizontal direction by a second preset distance from the loading position, the wafer grinding machine can grind wafers with different sizes in a compatible mode, the occurrence of central spots on the ground wafers can be avoided, and the width of the bulges formed by the ground wafers meets the requirements. Because the stroke of the wafer carrying platform can be automatically adjusted according to the size of the grinding wheel without repeated debugging by a worker, the process of repeated debugging of the stroke of the wafer carrying platform by the worker is omitted, time and labor are saved, and the production efficiency can be improved. The wafer grinding machine can grind wafers with different sizes in a compatible way, and meanwhile, the stroke of the wafer bearing table can be automatically adjusted according to the size of the grinding wheel without repeated debugging by staff, so that the production efficiency of the wafer grinding machine is higher.
Drawings
FIG. 1 is a schematic illustration of a grinding wheel grinding a wafer in accordance with an embodiment of the present invention;
FIG. 2 is a flow chart of a wafer grinding method in an embodiment of the invention;
fig. 3 is a schematic view of a wafer grinder according to an embodiment of the present invention.
In the figure:
100. a wafer; 110. an annular region;
1. a wafer carrying table; 11. a suction cup;
2. a main shaft;
3. grinding wheel;
41. a first driving member; 411. a first screw rod; 42. a second driving member; 43. a third driving member; 431. a second screw rod; 44. a fourth driving member;
5. a first mounting frame;
6. a buffer member; 61. a first mounting plate; 62. an air spring; 63. a third mounting plate; 64. a second mounting frame;
7. a base frame; 71. a slide rail;
8. and a second mounting plate.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Based on the above, in order to grind wafers of different sizes on the same wafer grinder, a step of replacing grinding wheels of different sizes is needed to be added in the grinding method of the wafer grinder, namely, after the wafers of different sizes are placed on the wafer bearing table, the matched grinding wheels are replaced according to the sizes of the wafers placed on the wafer bearing table, but if only the grinding wheels of different sizes are replaced to adapt to the wafers of different sizes, and the wafer bearing table still moves to the grinding position from the loading position according to the original stroke, the axis of the wafer bearing table moving to the grinding position is offset relative to the outer edge of the grinding wheel, namely, the axis of the wafer bearing table moving to the grinding position is positioned on the inner side or the outer side of the outer edge of the grinding wheel, so that when the grinding wheels grind the wafers, the grinding wheels are in the grinding of the wafers, the grinding wheels are leaked or the overground, particularly, if the center of the wafer bearing table moving to the grinding position is not in the grinding position, the center of the wafer bearing table is not in the grinding position, the grinding is not required, and the grinding is not carried out, so that the grinding of the wafer bearing table is in the grinding is not in the grinding position. In addition, the axis of the carrier moved to the grinding position may be offset relative to the outer edge of the grinding wheel, which may also result in an undesirable width of the protrusions formed by the wafer after it is ground.
Therefore, in the prior art, the process of repeatedly debugging the travel of the wafer carrying platform by the staff after the grinding wheel is replaced by the wafer grinding machine is generally complicated, time and labor are wasted, and the production efficiency is affected.
In order to solve the above-mentioned problems, as shown in fig. 1 to 3, the present embodiment provides a wafer polishing method, in which an annular region 110 is preset on a polishing surface of a wafer 100, the annular region 110 is located at an edge of the wafer 100 along a circumferential direction of the wafer 100, the wafer polishing method includes:
the wafer carrying platform 1 is positioned at a feeding position, the wafer carrying platform 1 and the grinding wheel 3 positioned at the feeding position are arranged at intervals along a first horizontal direction, the wafer 100 is placed on the wafer carrying platform 1, and the center of the wafer 100 is positioned on the axis of the wafer carrying platform 1;
the adapted grinding wheel 3 is selected according to the size of the wafer 100, the diameter of the grinding wheel 3 being equal to the radius of the wafer 100 minus a first preset distance selected to be equal to the width of the annular region 110 in the radial direction of the wafer 100.
In addition, the wafer grinding method in the present embodiment further includes:
the carrier 1 is driven to move along a first horizontal direction, namely the X-axis direction in fig. 3, by a second preset distance selected to be equal to the difference of the distance between the axis of the carrier 1 at the feeding position and the axis of the grinding wheel 3 minus the radius of the grinding wheel 3.
Based on the above, in this embodiment, the size of the grinding wheel 3 for grinding the wafer 100 is selected according to the size of the wafer 100 placed on the wafer carrying platform 1, and the moving stroke of the wafer carrying platform 1 is adjusted according to the size of the grinding wheel 3, so as to ensure that after the wafer carrying platform 1 moves along the first horizontal direction for a second preset distance from the loading position for wafers 100 and grinding wheels 3, the axis of the wafer carrying platform 1 is tangential to the outer edge of the grinding wheel 3, so that the wafer grinding machine can compatibly grind wafers 100 with different sizes, and meanwhile, the occurrence of central spots on the ground wafers 100 can be avoided, and the width of the protrusions formed by grinding the wafers 100 meets the requirements. Because the stroke of the wafer carrying platform 1 in the embodiment can be automatically adjusted according to the size of the grinding wheel 3 without repeated debugging by a worker, the process of repeated debugging of the stroke of the wafer carrying platform 1 by the worker is omitted, time and labor are saved, and the production efficiency can be improved.
Specifically, the axis of the wafer carrying platform 1 after moving a second preset distance along the first horizontal direction can be tangential to the outer edge of the grinding wheel 3 no matter the grinding wheel 3 with a larger size is replaced or the grinding wheel 3 with a smaller size is replaced, so that the phenomenon that the grinding wheel 3 leaks or overgrinds the wafer 100 when grinding the wafer 100 is avoided, the center spot on the ground wafer 100 is avoided, and the width of the protrusion formed by the ground wafer 100 meets the requirement.
Further, referring to fig. 3, the present embodiment further provides a wafer grinding machine for grinding a wafer 100 by using the wafer grinding method as described above, where the wafer grinding machine includes a wafer carrying table 1, a spindle 2, a first driving member 41, a second driving member 42, and a third driving member 43, the wafer carrying table 1 is configured to carry the wafer 100, an end portion of the spindle 2 is detachably mounted with a grinding wheel 3, an axis of the grinding wheel 3 coincides with an axis of the spindle 2, the first driving member 41 is configured to drive the wafer carrying table 1 to move in a first horizontal direction, the second driving member 42 is configured to drive the spindle 2 to rotate about its axis, thereby driving the grinding wheel 3 to rotate about its axis, and the third driving member 43 is configured to drive the spindle 2 to move in a vertical direction.
Specifically, in the present embodiment, the wafer 100 can be placed on the carrier table 1, the worker replaces the grinding wheel 3 according to the size of the wafer 100 placed on the carrier table 1 to adapt the size of the grinding wheel 3 mounted on the end of the spindle 2 to the size of the wafer 100, then the carrier table 1 is moved in the first horizontal direction by a second preset distance equal to the difference between the axis of the carrier table 1 at the feeding position and the axis of the grinding wheel 3 minus the radius of the grinding wheel 3, so that the axis of the carrier table 1 is tangential to the outer edge of the grinding wheel 3, then the grinding wheel 3 is lowered in the vertical direction to press the wafer 100, and after the grinding wheel 3 presses the wafer 100, the carrier table 1 is rotated about its axis at the same time, thereby grinding the wafer 100 is achieved.
It should be noted that, in other alternative embodiments, the third driving member 43 may be configured to drive the wafer carrier 1 to move in the vertical direction or drive the spindle 2 and the wafer carrier 1 to move in the vertical direction at the same time, and if the third driving member 43 is configured to drive the spindle 2 and the wafer carrier 1 to move in the vertical direction at the same time, the moving directions of the spindle 2 and the wafer carrier 1 in the vertical direction are opposite. The driving manner of the third driving member 43 in the present embodiment is not particularly limited.
Based on the above, the wafer grinder in this embodiment can grind wafers 100 of different sizes compatibly, and meanwhile, since the stroke of the wafer carrier 1 can be automatically adjusted according to the size of the grinding wheel 3 without repeated debugging by a worker, the wafer grinder in this embodiment has high production efficiency.
It should be noted that, the wafer grinding machine in this embodiment further includes a fourth driving member 44, where the fourth driving member 44 is configured to drive the wafer carrier 1 to rotate around its axis.
Preferably, the first driving member 41 is a servo motor, that is, the wafer grinding method in the present embodiment further includes: the wafer bearing table 1 is driven to move for a second preset distance through a servo motor. Compared with the air cylinder, the servo motor has higher control precision, so that the wafer bearing table 1 can be accurately controlled to move for a second preset distance.
It should be noted that, the wafer grinding machine in this embodiment further includes a first screw rod 411, the first screw rod 411 extends along a first horizontal direction, the wafer carrying platform 1 is screwed on the first screw rod 411 through the second mounting plate 8, and the first driving member 41 can drive the first screw rod 411 to rotate, so that the second mounting plate 8 can move along the first horizontal direction.
Besides the first screw rod 411, the wafer grinding machine further comprises a base frame 7 and two sliding rails 71 which are arranged at intervals along a second horizontal direction perpendicular to the first horizontal direction, wherein the two sliding rails 71 are fixedly connected to the base frame 7 and extend along the first horizontal direction, and the second mounting plate 8 is slidably connected to the sliding rails 71, and the second horizontal direction is the Y-axis direction in fig. 3.
It is to be understood that the second driving member 42 and the fourth driving member 44 may be selected from a driving structure such as a servo motor or a stepping motor, which is not particularly limited in this embodiment.
Further, the wafer grinder further includes an encoder (not shown in the figure) configured to record the angular displacement of the movable end of the servo motor, that is, the angular displacement of the movable end of the first driving member 41 is controlled by the encoder in this embodiment, so as to further precisely control the movement of the wafer carrier 1 by the second preset distance.
That is, the wafer grinding method in the present embodiment further includes: the angular displacement of the movable end of the servo motor is recorded by an encoder.
In addition, the wafer grinding machine in the present embodiment further includes a photoelectric sensor (not shown in the figure) configured to detect a moving distance of the wafer stage 1 in the first horizontal direction, thereby further precisely controlling the wafer stage 1 to move by a second preset distance.
It is to be understood that the photoelectric sensor may be selected from a laser photoelectric proximity sensor, an infrared photoelectric proximity sensor, an ultrasonic photoelectric proximity sensor, or the like, which is not particularly limited in this embodiment.
Preferably, the wafer carrier 1 is provided with the suction cup 11, and the axis of the suction cup 11 coincides with the axis of the wafer carrier 1, that is, the wafer 100 can be adsorbed on the wafer carrier 1, so as to avoid displacement of the wafer 100 in the grinding process.
Further, the wafer grinder further comprises a first mounting frame 5 and a buffer member 6, the first mounting frame 5 is fixedly connected to the base frame 7, the spindle 2 is slidably connected to the first mounting frame 5 along the vertical direction, the buffer member 6 is installed between the spindle 2 and the first mounting frame 5, and the buffer member 6 is configured to buffer the grinding wheel 3 when the grinding wheel 3 moves to the pressing wafer 100 along the vertical direction, so that damage to the wafer 100 when the grinding wheel 3 moves to the pressing wafer 100 along the vertical direction is avoided.
In this embodiment, the buffer member 6 preferably includes a first mounting plate 61 and an air spring 62, the first mounting plate 61 is slidably connected to the first mounting frame 5 in a vertical direction, the third driving member 43 is configured to drive the first mounting plate 61 to move in a vertical direction, the spindle 2 is slidably connected to the first mounting plate 61 in a vertical direction, specifically, the spindle 2 and the second driving member 42 are fixedly connected to the third mounting plate 63 through the second mounting frame 64, the third mounting plate 63 is slidably connected to the first mounting plate 61 in a vertical direction, a lower end of the air spring 62 is hinged to the spindle 2, an upper end of the air spring 62 is hinged to the first mounting frame 5, and the air spring 62 is capable of buffering the grinding wheel 3 when the grinding wheel 3 moves to press against the wafer 100 in a vertical direction, thereby avoiding damage to the wafer 100.
It should be understood that, in the present embodiment, the third driving member 43 is a motor, and the third driving member 43 drives the first mounting plate 61 to move in the vertical direction through the second screw rod 431, however, in other alternative embodiments, the third driving member 43 may be a linear driving structure such as an air cylinder or an electric cylinder, that is, the third driving member 43 directly drives the first mounting plate 61 to move in the vertical direction, which is not limited in this embodiment.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (7)
1. A wafer grinding method, in which a grinding surface of a wafer (100) is preset with an annular region (110), the annular region (110) being located at an edge of the wafer (100) along a circumferential direction of the wafer (100), the wafer grinding method comprising:
the wafer carrying platform (1) is positioned at a feeding position, the wafer carrying platform (1) and the grinding wheel (3) positioned at the feeding position are arranged at intervals along a first horizontal direction, a wafer (100) is placed on the wafer carrying platform (1), and the center of the wafer (100) is positioned on the axis of the wafer carrying platform (1);
-selecting an adapted grinding wheel (3) according to the size of the wafer (100), the diameter of the grinding wheel (3) being equal to the difference of the radius of the wafer (100) minus a first preset distance selected to be equal to the width of the annular region (110) in the radial direction of the wafer (100);
the wafer grinding method is characterized by further comprising the following steps:
the wafer carrying platform (1) is driven to move along the first horizontal direction by a second preset distance, wherein the second preset distance is selected to be equal to the difference value of the distance between the axis of the wafer carrying platform (1) and the axis of the grinding wheel (3) at the loading position minus the radius of the grinding wheel (3).
2. The wafer grinding method according to claim 1, wherein the wafer carrier (1) is driven to move by a servo motor by the second preset distance.
3. The wafer grinding method of claim 2, wherein the angular displacement of the movable end of the servo motor is recorded by an encoder.
4. Wafer lapping machine for lapping a wafer (100) by a wafer lapping method according to any one of claims 1-3, characterized in that the wafer lapping machine comprises:
a wafer carrier (1) configured to carry the wafer (100);
a main shaft (2) with an end part detachably provided with a grinding wheel (3), wherein the axis of the grinding wheel (3) coincides with the axis of the main shaft (2);
a first driving member (41) configured to drive the wafer carrier (1) to move along the first horizontal direction, the first driving member (41) being a servo motor;
a second drive (42) configured to drive the spindle (2) in rotation about its axis;
a third driving member (43) configured to drive the spindle (2) and/or the wafer carrier (1) to move in a vertical direction;
an encoder configured to record an angular displacement of a movable end of the servo motor;
a photoelectric sensor configured to detect a moving distance of the wafer stage (1) in the first horizontal direction.
5. Wafer grinding machine according to claim 4, characterized in that the wafer carrier (1) is provided with suction cups (11), the axis of the suction cups (11) being coincident with the axis of the wafer carrier (1).
6. The wafer grinder of claim 4, further comprising:
the main shaft (2) is connected to the first mounting frame (5) in a sliding manner along the vertical direction;
and a buffer member (6) mounted between the spindle (2) and the first mounting frame (5), the buffer member (6) being configured to buffer the grinding wheel (3) when the grinding wheel (3) moves in a vertical direction to press against the wafer (100).
7. Wafer grinder according to claim 6, characterized in that the buffer (6) comprises:
a first mounting plate (61), the third driving member (43) being configured to drive the first mounting plate (61) to move in a vertical direction, the spindle (2) being slidably connected to the first mounting plate (61) in the vertical direction;
and the lower end of the air spring (62) is hinged to the main shaft (2), and the upper end of the air spring (62) is hinged to the first mounting frame (5).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311109996.5A CN116810528A (en) | 2023-08-31 | 2023-08-31 | Wafer grinding method and wafer grinding machine |
| CN202380013652.6A CN118234597A (en) | 2023-06-21 | 2023-10-31 | Wafer grinding method and wafer grinding machine |
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| CN202311109996.5A CN116810528A (en) | 2023-08-31 | 2023-08-31 | Wafer grinding method and wafer grinding machine |
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| CN111660157A (en) * | 2020-06-08 | 2020-09-15 | 苏州辰轩光电科技有限公司 | Thinning machine |
| CN115194607A (en) * | 2021-04-07 | 2022-10-18 | 株式会社迪思科 | Method for processing workpiece |
| CN114161245A (en) * | 2021-11-19 | 2022-03-11 | 万华化学集团电子材料有限公司 | Silicon wafer thinning device and thinning processing technology for monocrystalline silicon wafer |
| CN116652767A (en) * | 2023-06-21 | 2023-08-29 | 江苏京创先进电子科技有限公司 | Thinning machine |
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