CN116798741A - Electrical equipment and magnetic component module - Google Patents

Electrical equipment and magnetic component module Download PDF

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Publication number
CN116798741A
CN116798741A CN202310796681.6A CN202310796681A CN116798741A CN 116798741 A CN116798741 A CN 116798741A CN 202310796681 A CN202310796681 A CN 202310796681A CN 116798741 A CN116798741 A CN 116798741A
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CN
China
Prior art keywords
magnetic core
mounting
magnetic
plate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310796681.6A
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Chinese (zh)
Inventor
林晓锋
林镇煌
曾春保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Kehua Digital Energy Tech Co Ltd
Original Assignee
Xiamen Kehua Digital Energy Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Kehua Digital Energy Tech Co Ltd filed Critical Xiamen Kehua Digital Energy Tech Co Ltd
Priority to CN202310796681.6A priority Critical patent/CN116798741A/en
Publication of CN116798741A publication Critical patent/CN116798741A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/08Cooling; Ventilating
    • H01F27/22Cooling by heat conduction through solid or powdered fillings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/26Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266Fastening or mounting the core on casing or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065Mounting on printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The application provides an electrical device and a magnetic component module, which belong to the technical field of electronic power, and comprise a mounting plate, a magnetic component, a circuit board and a radiator; the mounting plate is provided with a mounting hole which is vertically communicated; the magnetic component is provided with a magnetic core and a coil wound on the magnetic core, the magnetic core is embedded and fixed in the mounting hole, and the lower surface of the magnetic core protrudes downwards from the mounting plate; the circuit board is arranged below the mounting plate and is in fit connection with the mounting plate, the leading-out end of the coil is electrically connected with the circuit board, a through hole corresponding to the magnetic core is formed in the circuit board, and the magnetic core penetrates through the hole; the radiator is arranged below the circuit board and connected with the circuit board, and the upper surface of the radiator is directly or indirectly attached to the lower surface of the magnetic core. According to the electrical equipment and the magnetic component module, an additional air cooling heat dissipation channel is not required to be designed, the layout difficulty of each device on the circuit board can be reduced, cold air introduced by an induced draft fan is not required to be split, and the overall heat dissipation efficiency of the circuit board is not influenced.

Description

Electrical equipment and magnetic component module
Technical Field
The application belongs to the technical field of electronic power, and particularly relates to an electrical device and a magnetic component module.
Background
The magnetic component is usually composed of windings and a magnetic core, is a power electronic device necessary for energy storage, energy conversion and electrical isolation, and mainly comprises two major categories of transformers and inductors. Almost all power circuits are free from magnetic components, and are one of the most important components of power electronics.
The existing magnetic components are generally directly installed on a circuit board, the heat dissipation mode is mainly air-cooled heat dissipation, a heat dissipation air duct is required to be additionally designed for the magnetic components in order to achieve the effect of air-cooled heat dissipation, and the induced draft fan is required to provide cold air for the heat radiator and also required to provide cold air for the magnetic components. Firstly, the positions of all devices on the circuit board need to be laid out according to the air cooling heat dissipation requirement of the circuit board so as to form an effective air channel structure, so that the overall design difficulty of the circuit board is increased, secondly, the cooling air introduced by the induced draft fan is split, the heat dissipation efficiency of the radiator is directly influenced, and the adverse effect on the overall heat dissipation efficiency of equipment is generated.
Disclosure of Invention
The embodiment of the application provides electrical equipment, which aims to solve the problems that in the prior art, a magnetic component adopts air cooling to dissipate heat, the design difficulty of a circuit board is increased, and the heat dissipation efficiency is influenced.
In order to achieve the above purpose, the application adopts the following technical scheme:
in a first aspect, there is provided an electrical device comprising:
the insulating mounting plate is provided with a mounting hole which is penetrated up and down;
the magnetic component is provided with a magnetic core and a coil wound on the magnetic core, the magnetic core is embedded and fixed in the mounting hole, and the lower surface of the magnetic core protrudes downwards from the mounting plate;
the circuit board is arranged below the mounting plate and is in fit connection with the mounting plate, the leading-out end of the coil is electrically connected with the circuit board, a through hole corresponding to the magnetic core is formed in the circuit board, and the magnetic core penetrates through the through hole; and
and the radiator is arranged below the circuit board and connected with the circuit board, and the upper surface of the radiator is directly or indirectly attached to the lower surface of the magnetic core.
In some embodiments, the magnetic core comprises a plurality of magnetic columns arranged side by side, a lower connector connected between the lower ends of two adjacent magnetic columns, and an upper connector connected between the upper ends of two adjacent magnetic columns;
be equipped with the limiting plate in the mounting hole, the limiting plate with the mounting panel is parallel to each other and an organic whole is connected, the lower face of limiting plate with the upper surface laminating of lower connector.
In some embodiments, each magnetic column comprises an upper column body and a lower column body which are sequentially spliced from top to bottom, the lower connector is connected between two adjacent lower column bodies, and the upper connector is connected between two adjacent upper column bodies.
In some embodiments, the limiting plates are provided in plurality and correspond to the lower connectors one by one, and the limiting plates are bridged at two opposite side edges of the mounting hole.
In some embodiments, the coil is disposed above the limiting plate, and the lead-out terminal of the coil penetrates through the mounting plate and forms a rigid binding post on the lower plate surface of the mounting plate, and the binding post is electrically connected with the circuit board.
In some embodiments, on the first path, a region between the mounting hole and an adjacent edge of the mounting plate is defined as a first region; on a second path, a region between the mounting hole and an adjacent edge of the mounting plate is defined as a second region; the width of the first region on the first path is smaller than the width of the second region on the second path; the first path and the second path are parallel to the plate surface of the mounting plate, and the first path and the second path are perpendicular to each other;
the leading-out end of the coil penetrates through the second area and forms a rigid binding post on the lower plate surface of the second area, and the binding post is electrically connected with the circuit board; and an assembly hole is formed in the second area, and the mounting plate is fixedly connected with the circuit board through a fastener penetrating through the assembly hole.
In some embodiments, the mounting plate includes first and second plates integrally connected along the first path, the first and second plates being flush with each other; on the second path, the width of the first plate body is larger than the width of the second plate body;
the first plate body and the second plate body are respectively provided with the mounting holes, the mounting holes on the first plate body are defined to be first mounting holes, the mounting holes on the second plate body are defined to be second mounting holes, the first mounting holes and the second mounting holes are arranged at intervals, and the edge of one side, close to the first mounting holes, of the second mounting holes is located in the contour line of the first plate body; the assembly holes are located in the second areas on both sides of the first plate body.
In some embodiments, the magnetic component includes a first component that is embedded in the first mounting hole and a second component that is embedded in the second mounting hole; defining the magnetic core in the first component as a first magnetic core, and defining the magnetic core in the second component as a second magnetic core; the lower surface of the first magnetic core is lower than the lower surface of the second magnetic core, a heat conducting pad is arranged on the upper surface of the radiator, and the heat conducting pad is attached to the lower surface of the second magnetic core.
In some embodiments, the coil in the first component is defined as a first coil and the coil in the second component is defined as a second coil;
the leading-out ends of the first coils are respectively arranged in the second areas at two sides of the first plate body;
one of the leading-out ends of the second coil is arranged in the second area on one side of the first plate body, the other leading-out end of the second coil is arranged in the second area on one side of the second plate body, and the two leading-out ends of the second coil are respectively positioned on two sides of the second mounting hole.
Compared with the prior art, the scheme of the embodiment of the application has the advantages that the mounting holes are designed on the mounting plate, the magnetic cores of the magnetic components can be embedded and fixed in the mounting holes, after the mounting plate is mounted above the circuit board, the lower parts of the magnetic cores can penetrate through the holes and then are in contact with the radiator below the circuit board, the magnetic cores with the most heat generation in the magnetic components are radiated through the radiator, an additional air cooling radiating channel is not required, the difficulty in arrangement of each component on the circuit board can be reduced, and cold air introduced by the induced draft fan is not required to be split, so that the overall radiating efficiency of the circuit board is not influenced.
The application also provides a magnetic component module, comprising:
the insulating mounting plate is provided with a mounting hole which is penetrated up and down;
the magnetic component is provided with a magnetic core and a coil wound on the magnetic core, the magnetic core is embedded and fixed in the mounting hole, and the lower surface of the magnetic core protrudes downwards from the mounting plate.
Compared with the prior art, the scheme of the embodiment of the application has the advantages that the mounting holes are designed on the mounting plate, the magnetic cores of the magnetic components can be embedded and fixed in the mounting holes, after the mounting plate is mounted above the circuit board, the lower parts of the magnetic cores can penetrate through the holes and then are in contact with the radiator below the circuit board, the magnetic cores with the most heat generation in the magnetic components are radiated through the radiator, an additional air cooling radiating channel is not required, the layout difficulty of each component on the circuit board can be reduced, and the integral radiating efficiency of the circuit board is not influenced.
Drawings
FIG. 1 is a schematic perspective view of a magnetic component module according to an embodiment of the present application;
FIG. 2 is an exploded view of a magnetic component module according to an embodiment of the present application;
FIG. 3 is a top view of a magnetic component module according to an embodiment of the present application;
FIG. 4 is a side view of a magnetic component module according to an embodiment of the present application;
FIG. 5 is a schematic perspective view of a magnetic component module according to a second embodiment of the present application;
FIG. 6 is an exploded view of a magnetic component module according to a second embodiment of the present application;
FIG. 7 is a top view of a magnetic component module according to a second embodiment of the present application;
FIG. 8 is a side view of a magnetic component module according to a second embodiment of the present application;
fig. 9 is a side view of an electrical device according to a second embodiment of the present application;
fig. 10 is a schematic diagram of a full-bridge LLC topology circuit in an electrical device according to a second embodiment of the application.
Reference numerals illustrate:
1. a mounting plate;
101. a mounting hole; 1011. a first mounting hole; 1012. a second mounting hole; 102. a first region; 103. a second region; 104. an assembly hole;
110. a first plate body; 120. a second plate body;
2. a magnetic component; 21. a transformer; 22. an inductance;
210. a magnetic core; 210-1, a first magnetic core; 210-2, a second magnetic core; 211. a magnetic column; 2111. an upper column; 2112. a lower column; 212. a lower connector; 213. an upper connector;
220. a coil; 220-1, a first coil; 220-2, a second coil; 221. binding posts;
3. a circuit board;
4. a heat sink;
5. a limiting plate;
6. a thermal pad;
7. a detector; 710. a magnetic conductive ring; 720. detecting a wire; 721. and detecting the binding post.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the claims, specification and drawings hereof, unless explicitly defined otherwise, the terms "first," "second," or "third," etc. are used for distinguishing between different objects and not for describing a particular sequential order.
In the claims, specification and drawings of the present application, unless explicitly defined otherwise, references to orientation words such as "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", "high", "low", etc. are based on the orientation and positional relationship shown in the drawings and are merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or element referred to must have a particular orientation or be constructed and operated in a particular orientation, nor should it be construed as limiting the specific scope of the application.
In the claims, specification and drawings of the present application, unless explicitly defined otherwise, the term "fixedly connected" or "fixedly connected" should be construed broadly, i.e. any connection between them without a displacement relationship or a relative rotation relationship, that is to say includes non-detachably fixedly connected, integrally connected and fixedly connected by other means or elements.
In the claims, specification and drawings of the present application, the terms "comprising," having, "and variations thereof as used herein, are intended to be" including but not limited to.
Referring to fig. 1 to 9, an electrical apparatus provided by the present application will be described. The electric equipment comprises a mounting plate 1, a magnetic component 2, a circuit board 3 and a radiator 4; the mounting plate 1 is an insulating plate and is provided with a mounting hole 101 which penetrates up and down; the magnetic component 2 has a magnetic core 210 and a coil 220 wound around the magnetic core 210, the magnetic core 210 is fitted and fixed in the mounting hole 101, and the lower surface protrudes downward from the mounting plate 1; the circuit board 3 is arranged below the mounting plate 1 and is in fit connection with the mounting plate 1, the lead-out end of the coil 220 is electrically connected with the circuit board 3, a through hole corresponding to the magnetic core 210 is formed in the circuit board 3, and the magnetic core 210 penetrates through the hole; the heat sink 4 is disposed below the circuit board 3 and connected to the circuit board 3, and an upper surface of the heat sink 4 is directly or indirectly attached to a lower surface of the magnetic core 210.
In this embodiment, the mounting hole 101 can limit the magnetic component 2 in a direction parallel to the board surface of the mounting board 1, so after the magnetic core 210 is inserted into the mounting hole 101, the magnetic core 210 and the mounting board 1 are adhered and fixed by insulating glue (e.g. room temperature cured silicone rubber, etc.) so as to prevent the magnetic component 2 from falling off the mounting board 1. In addition, the fit mode between the mounting hole 101 and the magnetic part 210 can be clearance fit, so that on one hand, the embedding and the assembly are convenient, and on the other hand, the problem of structural damage of the mounting plate 1 caused by overlarge extrusion acting force of the magnetic core 210 is avoided; of course, the fit between the mounting hole 101 and the magnetic element 210 may be an interference fit, so that the size of the mounting hole 101 and the thickness of the mounting plate 1 need to be controlled more precisely, so that the stress of the mounting plate 1 is controlled within a reasonable range.
In this embodiment, "bonding connection" between the mounting board 1 and the circuit board 3 means: the lower plate surface of the mounting plate 1 is mutually attached to and contacted with the upper plate surface of the circuit board 3, and then the lower plate surface is fixed by a fastener. Implementations of fasteners include, but are not limited to, threaded fasteners, in-line snaps, fastening pins, and the like, and are not limited solely herein.
In this embodiment, the heat spreader 4 and the magnetic core 210 may be bonded directly by the heat spreader 4 itself and the magnetic core 210 for heat transfer; another heat conductive member may be provided between the heat sink 4 and the magnetic core 210, and heat transfer may be performed between the heat sink 4 and the magnetic core 210 by the heat conductive member. Based on this, the assembled circuit board 3 and the upper surface of the heat sink 4, and the circuit board 3 and the mounting board 1 are generally parallel to each other, but it is not limited here whether the lower surface of the magnetic core 210 is parallel to the upper surface of the heat sink 4. If the lower surface of the magnetic core 210 and the upper surface of the heat sink 4 are parallel to each other, heat transfer between the two can be performed by direct bonding; if the lower surface of the magnetic core 210 is disposed at an angle with respect to the upper surface of the heat sink 4, a heat conductive member of a corresponding shape may be disposed therebetween.
It should be noted that, the inventor finds that the conventional magnetic components are mostly designed with a skeleton structure, and the coil lead-out ends are integrated on the skeleton structure, so that the conventional magnetic components are generally directly mounted on the circuit board, and the mounting mode leads to the realization of heat dissipation of the magnetic components through air cooling. In this embodiment, the whole of the magnetic component 2 is a structure design without framework, which has the advantages that: 1) The structure of the magnetic component 2 is more compact and small, and meets the design requirements of miniaturization and integration; 2) The number of turns of the coil 220 can be increased without the limitation of a framework structure, so that the working performance of the magnetic component 2 is improved; 3) Can be connected with the circuit board 3 through the mounting plate 1, be convenient for set up the leading-out end of coil 220 in a flexible way, provide the precondition for offering the via hole on the circuit board 3.
Compared with the prior art, the electric equipment provided by the embodiment has the advantages that the mounting hole 101 is designed on the mounting plate 1, the magnetic core 210 of the magnetic component 2 can be embedded and fixed in the mounting hole 101, after the mounting plate 1 is mounted above the circuit board 3, the lower part of the magnetic core 210 can penetrate through the hole and then be in contact with the radiator 4 below the circuit board 3, the magnetic core 210 with the greatest heat in the magnetic component 2 is radiated through the radiator 4, an additional air cooling radiating channel is not required, firstly, the difficulty in arrangement of each component on the circuit board 3 can be reduced, secondly, cold air introduced by a draught fan is not required to be split, and the overall radiating efficiency of the circuit board 3 is not influenced.
Referring to fig. 2 and 6, the magnetic core 210 includes a plurality of magnetic columns 211 arranged side by side, a lower connector 212 connected between lower ends of two adjacent magnetic columns 211, and an upper connector 213 connected between upper ends of two adjacent magnetic columns 211. Based on the arrangement of such magnetic cores 210, in some embodiments, a limiting plate 5 is disposed in the mounting hole 101, the limiting plate 5 is parallel to and integrally connected with the mounting plate 1, and the lower plate surface of the limiting plate 5 is attached to the upper surface of the lower connector 212.
In this embodiment, the magnetic column 211 and the upper connector 213, and the magnetic column 211 and the lower connector 212 may be integrally formed, or may be assembled and connected by other connectors. In addition, the lower link 212 and the upper link 213 are parallel to each other, that is, the upper and lower surfaces of the lower link 212 and the upper and lower surfaces of the upper link 213 are four planes parallel to each other. Wherein, the lower surface of the lower connector 212 and the lower surface of the magnetic column 211 are flush with each other and jointly form the lower surface of the magnetic core 210; the upper surface of the upper connector 213 and the upper surface of the magnetic post 211 are flush with each other and together constitute the upper surface of the magnetic core 210.
In this embodiment, the limiting plate 5 and the mounting plate 1 may be plates that are flush with each other in the up-down direction, or may be plates that are distributed in a staggered manner in the up-down direction, so as to meet the assembly and limiting requirements of the magnetic core 210. In this embodiment, the embodiment in which the limiting plate 5 and the mounting plate 1 are flush with each other is exemplarily shown, and it should be understood that if the limiting plate 5 and the mounting plate 1 are distributed in a vertically staggered manner, a connecting body extending vertically needs to be further disposed between the limiting plate 5 and the mounting plate 1, so as to realize connection between the limiting plate 5 and the mounting plate 1.
After the limiting plate 5 is in contact with the upper surface of the lower connector 213, the lower surface of the magnetic core 210 is parallel to the lower plate surface of the mounting plate 1, so that the lower surface of the magnetic core 210 is parallel to the upper surfaces of the circuit board 3 and the heat sink 4. Based on this, if the magnetism 210 is directly attached to the upper surface of the heat sink 4, the attaching effectiveness is ensured; if the magnetism 210 is indirectly attached to the upper surface of the heat sink 4 through the heat conductive member, the heat conductive member is also relatively simple to manufacture and install.
Referring to fig. 2 and 6, each magnetic pillar 211 includes an upper pillar 2111 and a lower pillar 2112 sequentially spliced from top to bottom, a lower connector 212 is connected between two adjacent lower pillars 2112, and an upper connector 213 is connected between two adjacent upper pillars 2111. In this embodiment, the magnetic core 210 is split and spliced, in fact, the magnetic core 210 is integrally divided into an upper split body and a lower split body, when the magnetic core is assembled, the lower split body is inserted into the mounting hole 101 upwards, and then the upper split body and the coil 220 are mounted, so that the limit plate 5 is prevented from affecting the assembly of the magnetic core 210 and the mounting hole 101, and the assembly difficulty is reduced.
In this embodiment, each of the splice bodies is exemplarily shown to have an E-shaped structure, but it should be understood that the shape of the splice body is related to the number of the magnetic columns 211, and in the case that the number of the magnetic columns 211 is three (as shown in fig. 2 and 6), the splice body has an E-shaped structure, and the case that the number of the magnetic columns 211 is four or more is also similar to the assembly principle, which is not described herein again.
In this embodiment, the splicing manner of the upper column 2111 and the lower column 2112 includes, but is not limited to: 1) The lower end surface of the upper column 2111 and the upper end surface of the lower column 2112 are bonded; 2) The lower end of the upper column 2111 and the upper end of the lower column 2112 are spliced through a mortise and tenon structure; 3) The lower end of the upper cylinder 2111 and the upper end of the lower cylinder 2112 are connected by a rivet pin. It should be understood that the splicing of the upper column 2111 and the lower column 2112 needs to meet the requirement of basic performance of the magnetic component, and at the same time, the structural requirement of making the lower connector 212 and the upper connector 213 parallel to each other after the splicing is also ensured, and the specific manner is not limited herein.
Based on the above-described splice design, not shown in the drawings, in some variant embodiments, the limiting plate 5 may be connected to the mounting plate 1 on only one side, and spaced from the mounting plate 1 on the other side opposite to the connection side.
Based on the above-mentioned spliced design, referring to fig. 2 and 6, in some modified embodiments, a plurality of limiting plates 5 are provided and are in one-to-one correspondence with the lower connectors 212, and the limiting plates 5 are bridged at two opposite side edges of the mounting hole 101. The embodiment has the following beneficial effects: firstly, the design of the limit plate 5 and the lower connector 212 in one-to-one correspondence increases the contact area of the limit plate 5 and the lower connector 212, improves the reliability of the attaching contact, improves the uniformity of stress, and avoids the problem that the magnetic core 210 inclines relative to the mounting plate 1; secondly, the bridging design of the limiting plate 5 enables the combination area of the limiting plate 5 and the mounting plate 1 to be increased, the structural stability of the limiting plate 5 relative to the mounting plate 1 is improved, the limiting plate 5 cannot shake, and the limiting effect on the magnetic core 210 is guaranteed.
On the basis of being provided with the limiting plate 5, referring to fig. 1, 4, 5, 8 and 9, the coil 220 is arranged above the limiting plate 5, and is supported and limited through the limiting plate 5, so that the overall structural stability of the magnetic component 2 is improved. Meanwhile, the lead-out terminal of the coil 220 penetrates through the mounting board 1, and a rigid post 221 is formed on the lower plate surface of the mounting board 1, and the post 221 is electrically connected to the circuit board 3. Wherein, the lead-out end of the coil 220 is adhered and fixed with the mounting plate 1 through insulating glue (such as room temperature curing silicone rubber, etc.), so as to prevent the wiring terminal 221 from separating from the mounting plate 1; the shape of the post 221 may be a variety of configurations, such as a cylindrical shape, a polygonal prism shape, etc., as long as it can meet the requirement of electrical conductivity, and is not limited only herein. The terminal 221 of the embodiment is generally directly fixed on the corresponding conductive point in the circuit board 3 by soldering or other methods, and the terminal 221 connects the magnetic component 2 with the three components of the mounting board 1 and the circuit board 3, so that the structural stability among the magnetic component 2, the mounting board 1 and the circuit board 3 is enhanced.
Referring to fig. 1-8, in some embodiments, the area between the mounting hole 101 and the adjacent edge of the mounting plate 1 on the first path is defined as a first area 102; on the second path, the area between the mounting hole 101 and the adjacent edge of the mounting board 1 is defined as a second area 103; the width of the first region 102 on the first path is smaller than the width of the second region 103 on the second path; the first path and the second path are parallel to the plate surface of the mounting plate 1, and the first path and the second path are perpendicular to each other. The lead-out end of the coil 220 penetrates through the second area 103, and a rigid wiring terminal 221 is formed on the lower plate surface of the second area 103, and the wiring terminal 221 is electrically connected with the circuit board 3; the second region 103 is further formed with an assembly hole 104, and the mounting board 1 is fixedly connected with the circuit board 3 by a fastener penetrating through the assembly hole 104. Wherein the width of the first region is 1-3 mm (e.g. 2 mm) and the width of the second region 103 is 2-5 mm (e.g. 3 mm).
The mounting plate 1 of the embodiment reserves certain positions around the mounting hole 101, so that the integrity and the continuity of the peripheral structure of the mounting hole 101 are ensured, the structural strength of the mounting plate 1 is ensured, and the risks of deformation and cracking of the mounting plate 1 are reduced; in addition, by dividing the first area 102 and the second area 103 and setting the binding posts 221 and the assembly holes 104 based on the area division, the size of the mounting board 1 can be effectively reduced on the first path, the compactness of the mounting board 1 is improved, and the board surface space of the circuit board 3 is further reduced; through setting up terminal 221, terminal 221 is connected these three components of magnetic components 2 and mounting panel 1, circuit board 3, and the connection of fastener to mounting panel 1 and circuit board 3 has again strengthened the structural stability between magnetic components 2, mounting panel 1 and the circuit board 3.
More specifically, in order to further reduce the size of the mounting board 1 on the second path, the plurality of magnetic pillars 211 on the magnetic core 210 are distributed along the first path, as shown in fig. 1 to 9.
More specifically, in order to further reduce the size of the mounting board 1 on the second path, the respective outlets on the same side are distributed along the first path.
Referring to fig. 5 to 9, the mounting plate 1 includes the first and second plates 110 and 120 integrally connected along the first path, the first and second plates 110 and 120 being flush with each other, on the basis of the above-described embodiment; on the second path, the width of the first plate 110 is greater than the width of the second plate 120. The first plate body 110 and the second plate body 120 are respectively provided with a mounting hole 101, the mounting holes 101 on the first plate body 110 are defined as first mounting holes 1011, the mounting holes 101 on the second plate body 120 are defined as second mounting holes 1012, the first mounting holes 1011 and the second mounting holes 1012 are arranged at intervals, and the edge of one side of the second mounting holes 1012 close to the first mounting holes 1011 is positioned in the contour line of the first plate body 110; the assembly holes 104 are located in the second regions 103 on both sides of the first plate body 110.
In this embodiment, the mounting board 1 is divided into the first board body 110 and the second board body 120, in fact, each board body can be provided with one magnetic component 2, compared with the design of the magnetic component 2 corresponding to the mounting board 1 one by one, the integration level of this design mode is higher, on one hand, because the edge of the second mounting hole 1012 adjacent to one side of the first mounting hole 1011 is located in the contour line of the first board body 110, the whole size of the mounting board 1 is very effectively compressed on the first path, the area occupying the circuit board 3 is reduced, the integration level is improved, and on the other hand, the plurality of magnetic components 2 on the same mounting board 1 are also guaranteed to have the same mounting standard. Secondly, in the present embodiment, the width dimensions of the first plate 110 and the second plate 120 are designed differently, so that the plate design with the assembly holes 104 is wider, the plate surface area of the second plate 120 is reduced as much as possible, and the overall compactness of the mounting plate 1 is further improved. And again, because the plurality of magnetic components 2 are integrated into the same module through the mounting plate 1, when the magnetic components are assembled with the circuit board 3, the plurality of magnetic components 2 are not required to be mounted one by one, the mounting points arranged on the circuit board 3 are fewer, the assembly efficiency can be improved, the influence of the mounting points on the circuit structure can be reduced, the design difficulty of the circuit structure can be reduced, and the wiring density can be improved.
In specific implementation, the number of the first plates 110 may be one or more, and the number of the second plates 120 may be one or more. However, it should be understood that, regardless of the number of arrangements, the first plate 110 and the second plate 120 are distributed along the first path; the specific distribution manner may be that the first plate body 110 and the second plate body 120 are alternately distributed one by one, or may be other orderly or unordered distribution manners, which is not limited herein. The present embodiment exemplarily shows an example in which one first plate body 110 and one second plate body 120 are provided.
Referring to fig. 5 to 9, in some embodiments, the magnetic component 2 includes a first component 21 and a second component 22, where the first component 21 is embedded in the first mounting hole 1011 and the second component 22 is embedded in the second mounting hole 1012, based on the embodiment provided with the first board 110 and the second board 120, so as to implement an integrated design of multiple magnetic components 2. Defining the magnetic core 210 in the first component 21 as a first magnetic core 210-1 and the magnetic core 210 in the second component 22 as a second magnetic core 210-2; since the size of the first component 21 is larger than that of the second component 22, after assembly, the lower surface of the first magnetic core 210-1 is lower than that of the second magnetic core 210-2, and in order to adapt to the structure that the lower surface has a surface difference, the upper surface of the radiator 4 is provided with the heat conducting pad 6, the heat conducting pad 6 is attached to the lower surface of the second magnetic core 210-2, and the upper surface of the radiator 4 is indirectly attached to the lower surface of the first magnetic core 210-1 through a heat conducting adhesive layer or a heat conducting cushion layer. Wherein, the heat conducting pad 6, the heat conducting glue layer or the heat conducting cushion layer all belong to the heat conducting piece, and the implementation mode of the heat conducting pad 6 includes but is not limited to a heat conducting silica gel pad. In this embodiment, the magnetic component 2 is mainly divided into a transformer and an inductor, and the types of the first component 21 and the second component 22 are not limited only, and fig. 5 to 9 exemplarily show an embodiment in which the first component 21 is a transformer and the second component 22 is an inductor.
More specifically, since the size of the first component 21 is larger than that of the second component 22, the length of the first board 110 is longer than that of the second board 120 in the first path, so as to further improve the structural compactness of the mounting board 1.
Referring to fig. 5-9, in some more specific embodiments, the coil 220 in the first component 21 is defined as a first coil 220-1, and the coil 220 in the second component 22 is defined as a second coil 220-2; the leading-out ends of the first coil 220-1 are respectively arranged in the second areas 103 at two sides of the first plate body 110; one of the lead-out terminals of the second coil 220-2 is disposed in the second region 103 on one side of the first plate 110, and the other lead-out terminal of the second coil 220-2 is disposed in the second region 103 on one side of the second plate 120, wherein the two lead-out terminals of the second coil 220-2 are respectively disposed at two sides of the second mounting hole 1012. Since the terminals of the first coil 220-1 and the second coil 220-2 form the terminal 221, respectively, the terminals promote the structure among the stable magnetic component 2, the mounting board 1 and the circuit board 2, and the positions of the terminals are reasonably arranged in this embodiment, so that the distribution of the assembly forces among the magnetic component 2, the mounting board 1 and the circuit board 2 is more uniform and balanced, and meanwhile, the electrical connection between the first component 21 and the second component 22 can be simplified.
In a specific implementation, based on the embodiment that the first component 21 is a transformer and the second component 22 is an inductor, the low-voltage lead-out terminal of the first coil 220-1 is disposed in the second region 103 at one side of the first board 110; the high voltage lead-out terminal of the first coil 220-1 and one of the lead-out terminals of the second coil 220-2 are both disposed in the second region 103 on the other side of the first plate 110; the other lead-out end of the second coil 220-2 is disposed in the second region 103 at one side of the second plate 120, wherein the two lead-out ends of the second coil 220-2 are respectively disposed at two sides of the second mounting hole 1012. It should be noted that, one high-voltage coil of the transformer has two high-voltage terminals and one low-voltage coil has two low-voltage terminals, so that for the same transformer, the high-voltage terminals and the low-voltage terminals are respectively provided with an even number.
In the embodiment, the leading-out ends are respectively arranged in the second areas 103 on the corresponding sides, so that the second areas 103 on one side are mainly provided with the high-voltage leading-out ends, and the second areas 103 on the other side are mainly provided with the low-voltage leading-out ends in a local mode, and the design and manufacturing difficulty of the conductive structure can be effectively reduced due to clear division of the high-voltage conductive areas and the low-voltage conductive areas; in addition, since the high-voltage side and the low-voltage side are clearly divided, the division of the layout areas of the peripheral components is clearly divided, and thus, the layout of the components on the circuit board 3 is positively promoted.
Based on the above embodiment, on the first plate body 110, the number of the posts 221 formed by the high voltage terminal and one of the terminals of the second coil 220-2 is N (odd number), while the number of the posts 221 formed by the low voltage terminal is N-1, and the numbers of both sides are unequal. In order to further consolidate the auxiliary fixing effect of the wiring terminal 221, it is ensured that the first board body 110 is stressed uniformly, the wiring terminal 221 formed by the high-voltage leading-out end and one of the leading-out ends of the second coil 220-2 is cylindrical, the wiring terminal 221 formed by the low-voltage leading-out end is a rectangular prism, and on the first path, the length of the rectangular prism is greater than the outer diameter of the cylinder, so that the contact areas between the wiring terminal 221 on two sides of the first board body 110 and the circuit board 3 are approximately converged, and the stress uniformity of the wiring terminal 221 on two sides is improved.
In addition, it should be noted that, because the direction of the side of one lead-out terminal of the second component 22 is opposite to the direction of the lead-out side of the lead-out terminal on the second component 22, when the specific arrangement is performed, the lead-out wire corresponding to the lead-out terminal needs to bypass the second component 22 to reach the second region 103 corresponding to the first lead-out terminal. The specific bypassing modes mainly comprise the following steps:
1) By-pass from the side of the second component 22 facing away from the first component 21 (not shown), in order to avoid the mutual intersection of the lead wires, the present embodiment is applicable to a lead-out design mode in which the lead wire corresponding to the lead-out terminal is located on the side facing away from the first component 21.
2) Bypassing the gap (not shown) between the second component 22 and the first component 21, in order to avoid the mutual intersection of the lead wires, the embodiment is applicable to a lead-out design mode in which the lead wire corresponding to the lead-out terminal is located at the side close to the first component 21. In addition, this method is related to the width of the slit, and if the slit width is too narrow, a sufficient gap cannot be reserved on both sides of the lead wire, and the design of the flying lead from the slit cannot be realized.
3) The present embodiment is applicable to the case where the lead wire corresponding to the lead terminal is located on the side far from the first component 21 or on the side close to the first component 21, by bypassing the second component 2 (as shown in fig. 4, 7 to 9). In order to meet the design of shortest flying lead length, the drawing exemplarily shows the lead design mode that the lead-out terminal corresponds to and is positioned at the side close to the first component 21.
Based on the embodiment that the first component 21 is a transformer and the second component 22 is an inductor, the first component 21 and the second component 22 are matched with surrounding components to form an LLC topology circuit, and taking the circuit shown in fig. 10 as an example, the LLC topology circuit is a full-bridge mos device with Q1, Q2 and Q3 surrounding Q4 being all high-voltage sides, and Q5, Q6 and Q7 surrounding Q8 being all low-voltage side full-bridge mos devices, T represents the transformer, L represents the inductor, and C represents the resonant capacitor.
In some embodiments, in order to improve the stress uniformity and reduce the number of openings on the circuit board 3, two assembly holes 104 are provided, and the two assembly holes 104 are diagonally distributed with respect to the first mounting hole 1011, as shown in fig. 1 to 9.
Referring to fig. 4 to 9, in some embodiments, the electrical apparatus further includes a detector 7, where the detector 7 includes a magnetic conductive ring 710 and a detection wire 720, the magnetic conductive ring 710 is sleeved on the periphery of the outgoing line corresponding to one of the outgoing ends of the second component 22, the detection wire 720 is wound around the magnetic conductive ring 710, and both outgoing ends of the detection wire 720 penetrate through the second area 103, and form a rigid detection terminal 721 below the second area 103, and the detection terminal 721 is electrically connected with the circuit board 3, so as to finally realize connection with the detection module. In this embodiment, the detecting wire 720 forms a detecting coil on the magnetic ring 710, and electromagnetic induction between the magnetic ring 710 and the outgoing line of the second component 22 generates a magnetic field, and the magnetic field generate electromagnetic induction before the detecting coil, so as to generate current in the detecting coil, thereby realizing current collection and detection. In addition, the detector 7 of the embodiment realizes a non-invasive acquisition mode through an electromagnetic induction principle, does not damage the structure of the second component 22, and avoids influencing the performance of the second component 22.
In this embodiment, the detection coil is shown to be located on the inner peripheral surface of the magnetic conductive ring 710, however, the detection coil may also be located on the outer peripheral surface of the magnetic conductive ring 710, and the working principles of the two cases are basically identical, which is not described herein.
In some more specific embodiments, to fix the magnetic ring 710, the magnetic ring 710 may be adhesively fixed to the main body of the second component 22 by an insulating adhesive (e.g., room temperature cured silicone rubber, etc.), and at the same time, the lead-out end of the detection wire 720 and the mounting board 1 are also adhesively fixed by an insulating adhesive (e.g., room temperature cured silicone rubber, etc.).
In some more specific embodiments, the area of the detection wire 720 located inside the magnetic conductive ring 710 is a bare wire (e.g. copper wire), and the area of the detection wire 720 located outside the magnetic conductive ring 710 is covered with an insulating layer.
Based on the same inventive concept, the application also provides a magnetic component module, referring to fig. 1 to 9, comprising a mounting plate 1 and a magnetic component 2; the mounting plate 1 is an insulating plate and is provided with a mounting hole 101 which penetrates up and down; the magnetic component 2 has a core 210 and a coil 220 wound around the core 210, and the core 210 is fitted and fixed in the mounting hole 101 with the lower surface protruding downward from the mounting board 1. After assembly, the circuit board 3 is arranged below the mounting plate 1 and is in joint connection with the mounting plate 1, the leading-out end of the coil 220 is electrically connected with the circuit board 3, the circuit board 3 is provided with a through hole corresponding to the magnetic core 210, and the magnetic core 210 penetrates through the hole; the heat sink 4 is disposed below the circuit board 3 and connected to the circuit board 3, and an upper surface of the heat sink 4 is directly or indirectly attached to a lower surface of the magnetic core 210.
Compared with the prior art, the magnetic component module provided by the embodiment has the advantages that the mounting hole 101 is designed on the mounting plate 1, the magnetic core of the magnetic component 2 can be embedded and fixed in the mounting hole 101, after the mounting plate 1 is mounted above the circuit board 3, the lower part of the magnetic core 210 can penetrate through the hole and then be in contact with the radiator 4 below the circuit board 3, the magnetic core 210 with the greatest heat in the magnetic component 2 is radiated through the radiator 4, an additional air cooling radiating channel is not required, the layout difficulty of each component on the circuit board 3 can be reduced, and the overall radiating efficiency of the circuit board 3 is not influenced.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims (10)

1. An electrical device, comprising:
the insulating mounting plate is provided with a mounting hole which is penetrated up and down;
the magnetic component is provided with a magnetic core and a coil wound on the magnetic core, the magnetic core is embedded and fixed in the mounting hole, and the lower surface of the magnetic core protrudes downwards from the mounting plate;
the circuit board is arranged below the mounting plate and is in fit connection with the mounting plate, the leading-out end of the coil is electrically connected with the circuit board, a through hole corresponding to the magnetic core is formed in the circuit board, and the magnetic core penetrates through the through hole; and
and the radiator is arranged below the circuit board and connected with the circuit board, and the upper surface of the radiator is directly or indirectly attached to the lower surface of the magnetic core.
2. The electrical device of claim 1, wherein said magnetic core includes a plurality of magnetic posts arranged side by side, a lower connector connected between lower ends of adjacent two of said magnetic posts, and an upper connector connected between upper ends of adjacent two of said magnetic posts;
be equipped with the limiting plate in the mounting hole, the limiting plate with the mounting panel is parallel to each other and an organic whole is connected, the lower face of limiting plate with the upper surface laminating of lower connector.
3. The electrical device of claim 2, wherein each of the magnetic posts comprises an upper post and a lower post that are sequentially spliced from top to bottom, the lower connector being connected between two adjacent lower posts, the upper connector being connected between two adjacent upper posts.
4. The electrical device of claim 3, wherein the limiting plates are provided in plurality and are in one-to-one correspondence with the lower connectors, and the limiting plates are bridged at opposite side edges of the mounting hole.
5. The electrical device of claim 2, wherein the coil is disposed above the limiting plate, and wherein the coil leads extend through the mounting plate and form rigid posts on the lower plate surface of the mounting plate, the posts being electrically connected to the circuit board.
6. The electrical device of claim 1, wherein, on the first path, a region between the mounting hole and an adjacent edge of the mounting plate is defined as a first region; on a second path, a region between the mounting hole and an adjacent edge of the mounting plate is defined as a second region; the width of the first region on the first path is smaller than the width of the second region on the second path; the first path and the second path are parallel to the plate surface of the mounting plate, and the first path and the second path are perpendicular to each other;
the leading-out end of the coil penetrates through the second area and forms a rigid binding post on the lower plate surface of the second area, and the binding post is electrically connected with the circuit board; and an assembly hole is formed in the second area, and the mounting plate is fixedly connected with the circuit board through a fastener penetrating through the assembly hole.
7. The electrical device of claim 6, wherein the mounting plate comprises first and second plates integrally connected along the first path, the first and second plates being flush with each other; on the second path, the width of the first plate body is larger than the width of the second plate body;
the first plate body and the second plate body are respectively provided with the mounting holes, the mounting holes on the first plate body are defined to be first mounting holes, the mounting holes on the second plate body are defined to be second mounting holes, the first mounting holes and the second mounting holes are arranged at intervals, and the edge of one side, close to the first mounting holes, of the second mounting holes is located in the contour line of the first plate body; the assembly holes are located in the second areas on both sides of the first plate body.
8. The electrical apparatus of claim 7, wherein the magnetic component comprises a first component and a second component, the first component being mounted in the first mounting hole and the second component being mounted in the second mounting hole; defining the magnetic core in the first component as a first magnetic core, and defining the magnetic core in the second component as a second magnetic core; the lower surface of the first magnetic core is lower than the lower surface of the second magnetic core, a heat conducting pad is arranged on the upper surface of the radiator, and the heat conducting pad is attached to the lower surface of the second magnetic core.
9. The electrical apparatus of claim 8, wherein the coil in the first component is defined as a first coil and the coil in the second component is defined as a second coil;
the leading-out ends of the first coils are respectively arranged in the second areas at two sides of the first plate body;
one of the leading-out ends of the second coil is arranged in the second area on one side of the first plate body, the other leading-out end of the second coil is arranged in the second area on one side of the second plate body, and the two leading-out ends of the second coil are respectively positioned on two sides of the second mounting hole.
10. A magnetic component module, comprising:
the insulating mounting plate is provided with a mounting hole which is penetrated up and down;
the magnetic component is provided with a magnetic core and a coil wound on the magnetic core, the magnetic core is embedded and fixed in the mounting hole, and the lower surface of the magnetic core protrudes downwards from the mounting plate.
CN202310796681.6A 2023-06-30 2023-06-30 Electrical equipment and magnetic component module Pending CN116798741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310796681.6A CN116798741A (en) 2023-06-30 2023-06-30 Electrical equipment and magnetic component module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310796681.6A CN116798741A (en) 2023-06-30 2023-06-30 Electrical equipment and magnetic component module

Publications (1)

Publication Number Publication Date
CN116798741A true CN116798741A (en) 2023-09-22

Family

ID=88044788

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310796681.6A Pending CN116798741A (en) 2023-06-30 2023-06-30 Electrical equipment and magnetic component module

Country Status (1)

Country Link
CN (1) CN116798741A (en)

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