CN116772108A - Tongue and groove surface sealing structure and semiconductor container - Google Patents

Abstract

The invention discloses a tongue and groove surface sealing structure and a semiconductor container. The tongue and groove surface sealing structure includes: a first connecting mechanism, a second connecting mechanism and a sealing mechanism. The first connecting mechanism is provided with at least a first groove structure, and the second connecting mechanism is provided with at least a first protruding structure. The sealing mechanism is disposed in the first groove-like structure. When the first connecting mechanism and the second connecting mechanism are combined, at least part of the first protruding structure is disposed in the first groove-like structure. The sealing mechanism is located between the first protruding structure and the second connecting mechanism. Between the first groove-shaped structures, the sealing mechanism can deform under the pressure of external force, and the sealing mechanism fits the first groove surface of the first groove-shaped structure and the first tenon surface of the first protruding structure without gaps. The invention is suitable for vacuum working conditions, high pressure working conditions, and high temperature working conditions, and can prevent the sealing mechanism from being corroded and damaged by the semiconductor medium, resulting in sealing failure and contamination of the semiconductor medium in the container body.

Description

Tongue and groove surface sealing structure and semiconductor container

Technical field

The invention particularly relates to a tongue-and-groove surface sealing structure and a semiconductor container, belonging to the technical field of semiconductor containers.

Background technique

Figure 1 is a structural schematic diagram of the flange sealing structure of a semiconductor cylinder in the prior art; Figure 2 is a schematic structural diagram of the sealing ring in the flange sealing structure of a semiconductor cylinder in the prior art after it is corroded and damaged. Figure 1 shows the current semiconductor cylinder The sealing gasket in the flange sealing structure is mostly an O-ring. During the use of solid-state source semiconductor cylinders, continuous high-temperature heating is often required to vaporize the solid-state source and output it. Although the design temperature of the O-ring material (mostly rubber) can meet the working temperature, under the condition of continuous pressure and heating, the elasticity and high temperature resistance of the R-ring will urgently decrease, and carbonization or even melting will occur ( As shown in Figure 2), this situation will lead to: problems with the sealing of the cylinder, resulting in leakage; carbonization of the O-ring and melting of pollution sources, resulting in product problems and even damage to the machine, causing huge losses. In addition, Figure 1 The structure can basically only use O-ring gaskets, which limits the choice of gaskets. In some working conditions, soft gaskets can no longer meet the temperature requirements, and metal gaskets cannot be used to achieve sealing.

Contents of the invention

The main purpose of the present invention is to provide a tongue-and-groove surface sealing structure and a semiconductor container, thereby overcoming the deficiencies in the prior art.

In order to achieve the foregoing invention objectives, the technical solutions adopted by the present invention include:

In one aspect, the present invention provides a tongue-and-groove surface sealing structure, which includes: a first connecting mechanism, a second connecting mechanism and a sealing mechanism. The first connecting mechanism is provided with at least a first groove-shaped structure, and the second At least one first protruding structure is provided on the connecting mechanism, and the sealing mechanism is arranged in the first groove-shaped structure. When the first connecting mechanism is combined with the second connecting mechanism, at least the first connecting mechanism Part of the convex structure is disposed in the first groove-like structure, the sealing mechanism is located between the first convex structure and the first groove-like structure, and the sealing mechanism can deform under the pressure of external force. , the surface of the sealing mechanism forms a contour structure that mimics the first groove surface of the first groove-shaped structure and the first tenon surface of the first protruding structure, and the sealing mechanism and the first groove The first groove surface of the shaped structure and the first tenon surface of the first protruding structure fit together without any gap, wherein the external force is generated when the first connecting mechanism and the second connecting mechanism are combined.

Another aspect of the present invention provides a semiconductor container, which includes a container body and a container cover. The semiconductor container further includes the tongue-and-groove surface sealing structure, and the first connection mechanism is fixedly provided on the container body. The second connecting mechanism is fixedly provided on the container cover.

Compared with the existing technology, the advantages of the present invention include:

1) The tongue-and-groove surface sealing structure provided by the present invention has diversity in the selection of working conditions, and is suitable for vacuum working conditions, high-pressure working conditions, and high-temperature working conditions. The selection of the sealing mechanism can also select metal according to different working conditions. Gaskets and non-metallic gaskets prevent the sealing mechanism from being corroded and damaged by the semiconductor medium, resulting in sealing failure and contamination of the semiconductor medium in the container body.

2) The tongue and groove surface sealing structure provided by the present invention has better compatibility between the tenon surface and the groove surface. During operation, the first protruding structure and the first groove-shaped structure can not only play a sealing role, but also It can be used as a positioning structure for the first connection mechanism and the second connection mechanism, so that it is easier to confirm whether the first connection mechanism and the second connection mechanism are in place. The sealing mechanism is arranged in the first groove-shaped structure, and there will be no plane position repetition. The sealing structure may be damaged due to movement.

3) A tongue-and-groove surface sealing structure provided by the invention, the sealing mechanism is arranged in the first groove-shaped structure, the installation centering of the sealing mechanism is better, the thickness of the sealing mechanism is less than the depth of the first groove-shaped structure, and the sealing mechanism The mechanism is clamped between the first protruding structure and the first groove-shaped structure. When being compressed, the sealing mechanism will not be extruded, and the pressing area and force of the sealing structure are more uniform, thereby making the overall The sealing effect is better.

Description of drawings

Figure 1 is a schematic structural diagram of a semiconductor cylinder flange sealing structure in the prior art;

Figure 2 is a schematic structural diagram of a semiconductor cylinder flange sealing structure in the prior art after the sealing ring is corroded and damaged;

Figure 3 is a schematic structural diagram of a semiconductor container provided in Embodiment 1 of the present invention;

Figure 4 is a schematic structural diagram of a semiconductor container provided in Embodiment 2 of the present invention.

Detailed ways

In view of the deficiencies in the prior art, the inventor of this case was able to propose the technical solution of the present invention after long-term research and extensive practice. The technical solution, its implementation process and principles will be further explained below.

In one aspect, the present invention provides a tongue-and-groove surface sealing structure, which includes: a first connecting mechanism, a second connecting mechanism and a sealing mechanism. The first connecting mechanism is provided with at least a first groove-shaped structure, and the second At least one first protruding structure is provided on the connecting mechanism, and the sealing mechanism is arranged in the first groove-shaped structure. When the first connecting mechanism is combined with the second connecting mechanism, at least the first connecting mechanism Part of the convex structure is disposed in the first groove-like structure, the sealing mechanism is located between the first convex structure and the first groove-like structure, and the sealing mechanism can deform under the pressure of external force. , the surface of the sealing mechanism forms a contour structure that mimics the first groove surface of the first groove-shaped structure and the first tenon surface of the first protruding structure, and the sealing mechanism and the first groove The first groove surface of the shaped structure and the first tenon surface of the first protruding structure fit together without any gap, wherein the external force is generated when the first connecting mechanism and the second connecting mechanism are combined.

Further, the first groove-like structure includes a first part and a second part arranged sequentially along its own axial direction, the bottom of the first groove-like structure is located in the second part, and the bottom of the first groove-like structure is located in the second part. The notch is located in the first part, and the sealing mechanism is provided in the second part. When the first connecting mechanism is combined with the second connecting mechanism, the sealing mechanism is connected to the first groove-shaped structure. The tank bottom and tank wall are in close contact.

Further, the outline shape of the first protruding structure is the same as the outline shape of the first part.

Further, the outline shapes of the first protruding structure and the first groove-like structure are the same.

Further, in the radial direction of the first groove-shaped structure, the first protruding structure, the sealing mechanism and the first groove-shaped structure are all in clearance fit.

Further, when the first connection mechanism is combined with the second connection mechanism, there is a gap between the first connection mechanism, the second connection mechanism, the first protruding structure, the first groove structure and the sealing mechanism. Combined to form a closed air chamber.

Further, the first protruding structure, the sealing mechanism and the first groove-shaped structure are all prismatic structures, and the radial width of the first groove-shaped structure is greater than the radial width of the sealing mechanism. The radial width of the first protruding structure.

Further, the difference between the radial width of the first groove-shaped structure and the radial width of the sealing mechanism is 0.5 mm.

Further, the difference between the radial width of the first groove-shaped structure and the radial width of the first protruding structure is 1 mm.

Further, both the first protruding structure and the first groove-like structure are prism structures, the sealing mechanism is a prism structure, and the radial width of the first protruding structure is along the direction away from the second connection. The direction of the mechanism gradually decreases, the radial width of the first groove-like structure gradually increases in the direction away from the first connecting mechanism, and the maximum radial width of the first protruding structure is larger than the first groove. The minimum radial width of the first groove-like structure is equal to the radial width of the sealing mechanism and greater than the maximum radial width of the first groove-like structure. The minimum radial width of the structure.

Further, the difference between the average radial width of the first groove-shaped structure and the average radial width of the first protruding structure is 1 mm.

Further, a plurality of second protruding structures are provided on the bottom of the first groove-like structure and/or on the surface of the first protruding structure, and the sealing mechanism is in contact with the second protruding structure, When the first connection mechanism is combined with the second connection mechanism, the sealing mechanism deforms under the pressure of the external force, and forms a surface area corresponding to the second protrusion structure that is consistent with the second protrusion structure. A second trough-shaped structure that mimics the structure.

Furthermore, the sealing mechanism is a plastic metal gasket or a non-metallic gasket.

Further, the surface of the second protruding structure is a continuous arc surface.

Further, the second protruding structure is an annular structure continuously arranged along the circumferential direction of the first groove-shaped structure.

Further, the first connection mechanism has a first assembly surface, the first groove-like structure is provided on the first assembly surface, the second connection mechanism has a second assembly surface, and the first protrusion The structure is arranged on the second assembly surface.

Further, the first connecting mechanism is an annular member.

Further, both the first protruding structure and the first groove-shaped structure are annular structures.

Further, the first connecting mechanism is a flange, and the second connecting mechanism is a flange cover.

Furthermore, the axial cross-section of the sealing mechanism is a polygonal structure.

Further, the axial cross-section of the first protruding structure is a polygonal structure.

Further, the axial cross-section of the first groove-shaped structure is a polygonal structure.

Another aspect of the present invention provides a semiconductor container, which includes a container body and a container lid, and the semiconductor container further includes the tongue-and-groove surface sealing structure, and the first connection mechanism is fixedly provided on the container body, The second connecting mechanism is fixedly mounted on the container cover.

The technical solution, its implementation process and principles will be further explained below with reference to the accompanying drawings and specific implementation cases. Unless otherwise specified, the sealing mechanism, flange, and flange cover used in the embodiments of the present invention etc. can be obtained through processes known to those skilled in the art.

Example 1

Please refer to Figure 3. A semiconductor container includes a container body 100, a container lid, and a tongue-and-groove sealing structure. The tongue-and-groove sealing structure is mainly used to achieve a sealing fit between the container lid and the container body 100 to prevent the inside of the container body 100 from entering. leakage of semiconductor media.

In this embodiment, the tongue and groove surface sealing structure includes a first connection mechanism 210, a second connection mechanism 220 and a sealing mechanism 230. The first connection mechanism 210 is fixedly provided on the container body 100, and the second connection mechanism 220 is fixedly provided on the container body 100. The sealing mechanism 230 is disposed on the first connection mechanism 210. When the container cover is closed on the container body 100 and the first connection mechanism 210 is combined with the second connection mechanism 220, the sealing mechanism 230 is clamped on the first connection mechanism 210. between the connecting mechanism 210 and the second connecting mechanism 220, and the sealing mechanism 230 sealingly cooperates with the first connecting mechanism 210 and the second connecting mechanism 220, thereby achieving a sealed combination between the first connecting mechanism 210 and the second connecting mechanism 220, Thus, the sealing combination of the container lid and the container body 100 is achieved.

It should be noted that the first connection mechanism 210 is sealingly coupled to the container body 100 without gaps, and the second connection mechanism 220 is sealingly coupled to the container cover without gaps. The coupling structure and method between the connecting mechanism 220 and the container lid can adopt structures and methods known to those skilled in the art, and are not specifically limited here. Of course, as a typical preferred solution, the second connection mechanism 220 and the container cover may be integrally provided.

In this embodiment, the first connection mechanism 210 has a first assembly surface, the second connection mechanism 220 has a second assembly surface, the first assembly surface and the second assembly surface are arranged oppositely, and the sealing mechanism 230 is provided between the first assembly surface and the second assembly surface. The second assembly surface is in sealing contact with the first assembly surface and the second assembly surface, thereby achieving sealing cooperation between the sealing mechanism 230 and the first connection mechanism 210 and the second connection mechanism 220 .

In this embodiment, a first groove-shaped structure 211 is provided on the first assembly surface, and the first groove-shaped structure 211 has a first groove surface (it can be understood that the first groove surface is the surface of the first groove-shaped structure 211 The side wall and the bottom of the groove can also be collectively referred to as the groove wall). The sealing mechanism 230 is arranged in the first groove structure 211. The sealing mechanism 230 is in close contact with the groove surface of the first groove structure 211. When the first connection mechanism 210 When combined with the second connecting mechanism 220, the sealing mechanism 230 is clamped between the second assembly surface and the first groove surface.

In this embodiment, the sealing mechanism 230 is a plastic gasket or a non-metallic gasket. For example, the sealing mechanism 230 can be a copper gasket or an aluminum gasket; when the sealing mechanism 230 is clamped on the first groove surface and the second assembly surface, the sealing mechanism 230 can deform under the pressure of external force, so that the sealing mechanism 230 can contact and cooperate with the first groove surface and the second assembly surface without any gap, thereby achieving sealing between the two. It needs to be explained. What is important is that the external force is generated when the first connection mechanism 210 and the second connection mechanism 220 are combined.

In this embodiment, a first protruding structure 221 is also provided on the second assembly surface. The first protruding structure 221 has a first tenon surface, and the sealing mechanism 230 is provided between the first tenon surface and the first groove surface. The sealing mechanism 230 can deform under the pressure of external force, and the surface of the sealing mechanism 230 forms a contour structure that follows the first groove surface of the first groove-shaped structure 211 and the first tenon surface of the first protruding structure 221. The sealing mechanism 230 There is no gap between the first groove surface of the first groove structure 211 and the first tenon surface of the first protruding structure 221 .

It should be noted that the first groove-shaped structure 211 may be formed by the first assembly surface being recessed inward along the thickness direction of the first connecting mechanism 210 , and the first protruding structure 221 may be fixedly provided on the second connecting mechanism 220 On the second assembly surface, of course, the first protruding structure 221 can also be provided integrally with the second connecting mechanism 220 , that is, the first protruding structure 221 is formed by a partial protrusion of the second connecting mechanism 220 .

In this embodiment, the first groove-shaped structure and the first protruding structure 221 are both annular structures. It can be understood that, taking the first groove-shaped structure 211 as an example, the first groove-shaped structure 211 is formed along the diameter of the container body 100. It is provided around the periphery of the opening of the container body 100 in the direction.

In this embodiment, the first groove-like structure 211 includes a first part and a second part arranged sequentially along its own axial direction. The groove bottom of the first groove-like structure 211 is located in the second part, and the groove opening of the first groove-like structure 211 is located in the second part. Located in the first part, the sealing mechanism 230 is provided in the second part. When the first connection mechanism 210 and the second connection mechanism 220 are combined, the sealing mechanism 230 is connected to the bottom of the first groove structure 211 and The tank walls are in close contact.

In this embodiment, the outline shape of the first protruding structure 221 and the outline shape of the first groove-like structure 211 are the same, and in the radial direction of the first groove-like structure 211, the The first protruding structure 221, the sealing mechanism 230 and the first groove structure 211 are all clearance-fitted. When the first connecting mechanism 210 is combined with the second connecting mechanism 220, in the The first connection mechanism 210 , the second connection mechanism 220 , the first protruding structure 221 , the first groove structure 211 and the sealing mechanism 230 are enclosed to form a sealed air chamber, which can isolate the air chamber on both sides. space, thereby further improving the sealing effect between the first connection mechanism 210 and the second connection mechanism 220 .

In this embodiment, the first protruding structure 221, the sealing mechanism 230 and the first groove structure 211 are all prismatic structures, and the radial width of the first groove structure 211 is larger than the sealing structure. The radial width of the mechanism 230 is greater than the radial width of the first protruding structure 221. Specifically, the difference between the radial width of the first groove-shaped structure 211 and the radial width of the sealing mechanism 230 is 0.5. mm, the difference between the radial width of the first groove structure 211 and the radial width of the first protrusion structure 221 is 1 mm, that is, the side wall of the groove surface of the first groove structure in this embodiment Part of it is a vertical structure, and flat gaskets are used to achieve sealing. The difference between the radial width of the first groove-shaped structure 211 and the radial width of the sealing mechanism 230 is 0.5mm. This structure is conducive to the smooth operation of the gasket. Installed into the first groove structure, the difference between the radial width of the first groove structure 211 and the radial width of the first protrusion structure 221 is 1 mm, so that between the first connection mechanism and the second connection When the mechanism is assembled, it is easier to position, and the tenon surface of the first protruding structure is pressed on the gasket, so that it can fill the first groove-like structure and be in close contact with the groove surface of the first groove-like structure, thereby having better performance. sealing effect.

In this embodiment, the bottom of the first groove structure 211 and/or the surface of the first protrusion structure 221 is also provided with a plurality of second protrusions. The sealing mechanism 230 is in contact with the second protrusions. When the first connection mechanism 210 is combined with the second connection mechanism 220, the sealing mechanism 230 deforms under the pressure of external force, and forms a second groove-like structure that mimics the second protrusion structure in the surface area corresponding to the second protrusion structure. By arranging a plurality of second protruding structures, a labyrinth structure can be formed between the sealing mechanism 230 and the first groove surface, thereby reducing the surface processing accuracy (mainly surface flatness) of the first connecting mechanism 210 and the second connecting mechanism 220 ) requirements, and the uneven surface structure further improves the sealing combination effect between the first connection mechanism 210 and the sealing mechanism 230 .

In this embodiment, the surface of the second protruding structure is a continuous arc-shaped surface. For example, the surface of the second protruding structure may be a cylindrical surface or a spherical surface.

It can be understood that the second protruding structure is an annular structure continuously arranged along the circumferential direction of the first groove-shaped structure 211, and the plurality of second protruding structures are arranged at intervals along the radial direction of the first groove-shaped structure 211. It should be noted that the hardness or strength of the first connection mechanism 210 and the second connection mechanism 220 is greater than the hardness or strength of the sealing mechanism 230, so that the sealing mechanism 230 can be deformed when receiving external force. Thereby improving the sealing effect.

In this embodiment, the overall axial cross-section of the sealing mechanism 230, the first protruding structure 221, and the first groove-shaped structure 211 is a polygonal structure.

In this embodiment, please refer to FIG. 3 again. The first connection mechanism 210 and the second connection mechanism 220 can be tightened by cooperating with the threaded connector through the threaded hole 201. By screwing the threaded connector, the first connection mechanism 210 and the second connection mechanism 220 can be tightened. The connecting mechanism 210 and the second connecting mechanism 220 are tightly coupled along the axial direction of the threaded connection, thereby compressing the sealing mechanism 230. Of course, the first connecting mechanism 210 and the second connecting mechanism 220 can also be realized through other connecting structures and methods. A tight fit of the two.

Example 2

Please refer to Figure 4. The structure of a semiconductor container in this embodiment is basically the same as that in Embodiment 1. The difference is that in this embodiment, the first protruding structure 221 and the first The groove structures 211 are all prism structures, the sealing mechanism 230 is a prism structure, the radial width of the first protruding structure 221 gradually decreases in the direction away from the second connecting mechanism 220, and the first The radial width of the groove-shaped structure 211 gradually increases in the direction away from the first connecting mechanism 210 , and the maximum radial width of the first protruding structure 221 is greater than the minimum radial width of the first groove-shaped structure 211 And less than the maximum radial width of the first groove-like structure 211 , the minimum radial width of the first groove-like structure 211 is equal to the radial width of the sealing mechanism 230 but greater than the first protruding structure 221 . Minimum radial width. Specifically, the difference between the average radial width of the first groove-shaped structure 211 and the average radial width of the first protruding structure 221 is 1 mm. This structure forms a wide top and narrow bottom. The first protruding structure/first groove structure, at the same time, the minimum radial width of the first groove structure is equal to the radial width of the sealing mechanism, there is no situation where the sealing mechanism (such as a gasket, etc.) is difficult to assemble , and when the tenon surface of the first protruding structure is pressed down by force, the sealing mechanism can be deformed to fill the gap at the bottom of the first groove-shaped structure; and if the radial size of the first protruding structure is too large, the sealing mechanism will be increased. The requirements for machining accuracy lead to direct collision and friction between the tenon surface of the first raised structure and the groove surface of the first groove-like structure, resulting in damage to the sealing surface; and if the radial size of the first raised structure is too small, then This will lead to an increase in the amount of movement of the first protruding structure in the first groove-shaped structure, causing sliding deformation during the sealing fit process, which is not conducive to sealing.

The tongue-and-groove surface sealing structure provided by the invention has diversity in the selection of working conditions, and is suitable for vacuum working conditions, high-pressure working conditions, and high-temperature working conditions. The selection of the sealing mechanism can also select metal gaskets according to different working conditions. and non-metallic gaskets to avoid the problem that the sealing mechanism is corroded and damaged by the semiconductor medium, leading to sealing failure and contamination of the semiconductor medium in the container body. In addition, the tongue and groove surfaces in the tongue and groove surface sealing structure have better compatibility. During operation, the first protruding structure and the first groove-shaped structure can not only play a sealing role, but also serve as the first connection. The positioning structure of the first connection mechanism and the second connection mechanism makes it easier to confirm whether the cooperation between the first connection mechanism and the second connection mechanism is in place. The sealing mechanism is set in the first groove-shaped structure, so that repeated movement of the plane position will not damage the sealing structure. Case.

The invention provides a tongue and groove surface sealing structure. The sealing mechanism is arranged in the first groove structure. The installation centering of the sealing mechanism is better. The thickness of the sealing mechanism is less than the depth of the first groove structure, and the sealing mechanism is Clamped between the first protruding structure and the first groove-shaped structure, the sealing mechanism will not be squeezed out when being pressed, and the pressing area and force of the sealing structure are more uniform, thereby improving the overall sealing effect. better.

The invention provides a tongue-and-groove surface sealing structure. The sealing mechanism does not directly contact the semiconductor medium in the container body. The corrosion of the medium and the penetration of the pressure mechanism have little impact on the sealing mechanism, so that the tongue-and-groove surface sealing structure can be used for Vacuum, high pressure, flammable, explosive, toxic media and other occasions with strict sealing requirements.

It should be understood that the above embodiments are only to illustrate the technical concepts and characteristics of the present invention. Their purpose is to enable those familiar with the technology to understand the content of the present invention and implement it accordingly, and cannot limit the scope of protection of the present invention. All equivalent changes or modifications made based on the spirit and essence of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A tongue and groove surface sealing structure, characterized in that it includes: a first connecting mechanism, a second connecting mechanism and a sealing mechanism, the first connecting mechanism is provided with at least a first groove-shaped structure, the second At least one first protruding structure is provided on the connecting mechanism, and the sealing mechanism is provided in the first groove-shaped structure; When the first connecting mechanism is combined with the second connecting mechanism, at least part of the first protruding structure is disposed in the first groove-like structure, and the sealing mechanism is located in the first protruding structure. Between the first groove structure and the first groove structure, the sealing mechanism can deform under the pressure of external force, and the surface of the sealing mechanism is formed in contact with the first groove surface of the first groove structure and the first protrusion. The first tenon surface of the structure follows the contour structure, and the sealing mechanism fits the first groove surface of the first groove structure and the first tenon surface of the first protruding structure without gaps, wherein, The external force is generated when the first connecting mechanism and the second connecting mechanism are combined. 2. The tongue and groove surface sealing structure according to claim 1, characterized in that: the first groove-shaped structure includes a first part and a second part arranged sequentially along its own axial direction, and the groove of the first groove-shaped structure The bottom is located in the second part, the notch of the first groove-like structure is located in the first part, the sealing mechanism is provided in the second part, when the first connecting mechanism and the second connecting mechanism When combined, the sealing mechanism is in close contact with the groove bottom and groove wall of the first groove-shaped structure; And/or, the outline shape of the first protruding structure is the same as the outline shape of the first part. 3. The tongue-and-groove surface sealing structure according to claim 2, characterized in that: the outline shapes of the first protruding structure and the first groove-shaped structure are the same; And/or, in the radial direction of the first groove structure, the first protruding structure, the sealing mechanism and the first groove structure are all in clearance fit; And/or, when the first connecting mechanism is combined with the second connecting mechanism, between the first connecting mechanism, the second connecting mechanism, the first protruding structure, the first groove-like structure and the sealing mechanism Enclosed to form a sealed air chamber. 4. The tongue and groove surface sealing structure according to claim 3, characterized in that: the first protruding structure, the sealing mechanism and the first groove-shaped structure are all prismatic structures, and the first groove-shaped structure The radial width of the structure is greater than the radial width of the sealing mechanism, which is greater than the radial width of the first protruding structure; And/or, the difference between the radial width of the first groove-shaped structure and the radial width of the sealing mechanism is 0.5 mm; And/or, the difference between the radial width of the first groove-shaped structure and the radial width of the first protruding structure is 1 mm. 5. The tongue and groove surface sealing structure according to claim 3, characterized in that: the first protruding structure and the first groove-shaped structure are both prism structures, the sealing mechanism is a prism structure, and the The radial width of the first protruding structure gradually decreases in the direction away from the second connecting mechanism, and the radial width of the first groove-like structure gradually increases in the direction away from the first connecting mechanism. The maximum radial width of the first protruding structure is greater than the minimum radial width of the first groove-shaped structure and smaller than the maximum radial width of the first groove-shaped structure, and the minimum radial width of the first groove-shaped structure is Equal to the radial width of the sealing mechanism and greater than the minimum radial width of the first protruding structure; And/or, the difference between the average radial width of the first groove-shaped structure and the average radial width of the first protruding structure is 1 mm. 6. The tongue and groove surface sealing structure according to claim 1, characterized in that: the groove bottom of the first groove structure and/or the surface of the first protrusion structure are also provided with a plurality of second protrusions. structure, the sealing mechanism is in contact with the second protruding structure, and when the first connection mechanism is combined with the second connection mechanism, the sealing mechanism is deformed under the pressure of the external force, and the sealing mechanism is in contact with the second protruding structure. The surface area corresponding to the second protruding structure forms a second groove-like structure that mimics the second protruding structure; And/or, the sealing mechanism is a plastic metal gasket or a non-metallic gasket. 7. The tongue and groove surface sealing structure according to claim 6, characterized in that: the surface of the second protruding structure is a continuous arc surface; And/or, the second protruding structure is an annular structure continuously arranged along the circumferential direction of the first groove-shaped structure. 8. The tongue and groove surface sealing structure according to claim 1, characterized in that: the first connecting mechanism has a first assembly surface, the first groove-shaped structure is disposed on the first assembly surface, and the The second connection mechanism has a second assembly surface, and the first protruding structure is provided on the second assembly surface; And/or, the first connecting mechanism is an annular member; And/or, both the first protruding structure and the first groove-shaped structure are annular structures; And/or, the first connecting mechanism is a flange, and the second connecting mechanism is a flange cover. 9. The tongue and groove surface sealing structure according to claim 1 or 8, characterized in that: the axial cross-section of the sealing mechanism is a polygonal structure; and/or the axial cross-section of the first protruding structure is a polygonal structure. structure; and/or, the axial cross-section of the first groove-shaped structure is a polygonal structure. 10. A semiconductor container, including a container body and a container lid, characterized in that it also includes the tongue and groove surface sealing structure according to any one of claims 1 to 9, and the first connection mechanism is fixedly arranged on the container. On the main body, the second connecting mechanism is fixedly provided on the container cover.