CN116723670A - Heat dissipation method and device, electronic equipment and storage medium - Google Patents
Heat dissipation method and device, electronic equipment and storage medium Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The embodiment of the invention provides a heat dissipation method, a heat dissipation device, electronic equipment and a storage medium, wherein temperature information of a server is obtained; generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information; the liquid flow rate control unit is used for controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal, so that the control of the liquid flow rate of the cooling liquid is completed on the basis of not increasing the disassembly difficulty, the operation and maintenance cost of the server is reduced, and the heat dissipation efficiency of the liquid cooling of the server is improved.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation method, a heat dissipation device, an electronic device, and a computer readable storage medium.
Background
In recent years, the power demand promotes the continuous increase of the power density of the data center, the heat productivity and the energy consumption are continuously increased, the traditional air cooling scheme is difficult to meet the heat dissipation demand of the data center IT (Internet Technology ) equipment, the liquid cooling technology is an industrial revolutionary solution with the advantage of high efficiency and low carbon, in various liquid cooling schemes, the immersed liquid cooling is directly contacted with a heat dissipation part by a refrigerant, so that the cooling effect is extremely high, and the immersed liquid cooling is divided into single-phase immersed liquid cooling and two-way immersed liquid cooling, wherein the single-phase immersed liquid cooling is relatively simple in principle and structural realization, and is widely and maturely applied in the data center at present.
Because components with different power consumption in IT equipment have different heat dissipation demands, and single-phase immersion liquid cooling is that fluid in the whole liquid cooling tank circulates, the components with high heat dissipation demands cannot be subjected to directional concentrated cooling, and therefore heat dissipation efficiency is reduced.
Therefore, how to improve the heat dissipation efficiency of single-phase immersion liquid cooling is a problem that needs to be overcome by those skilled in the art.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation method, a heat dissipation device, electronic equipment and a computer readable storage medium, so as to solve the problem of how to improve heat dissipation efficiency.
The embodiment of the invention discloses a heat dissipation method, which is applied to a server liquid cooling system, wherein the server liquid cooling system comprises a liquid cooling tank, the liquid cooling tank is provided with a main liquid inlet pipe, the main liquid inlet pipe is connected with a plurality of first auxiliary liquid inlet pipes, the plurality of first auxiliary liquid inlet pipes are in one-to-one correspondence with a plurality of servers positioned in the liquid cooling tank, the server liquid cooling system comprises a liquid flow rate control unit for independently controlling the flow rate of cooling liquid in the first auxiliary liquid inlet pipes, and the heat dissipation method can comprise the following steps:
acquiring temperature information of the server;
generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
And controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal by adopting the liquid flow rate control unit.
Optionally, the server liquid cooling system includes a flow rate calculation chip, and the step of generating the liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information may include:
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information by adopting the flow rate calculation chip.
Optionally, the server liquid cooling system includes a flow rate signal collecting unit for the first slave liquid inlet pipe, and the step of generating the liquid flow rate control signal for the first slave liquid inlet pipe by using the flow rate calculating chip based on the temperature information may include:
acquiring an actual liquid flow rate control signal for the first slave liquid inlet pipe by adopting the flow rate signal collecting unit;
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information and the actual liquid flow rate control signal by adopting the flow rate calculation chip.
Optionally, the server includes a motherboard, where the motherboard has a corresponding baseboard management controller, and the step of obtaining temperature information of the server may include:
And acquiring temperature information of the server by adopting the baseboard management controller.
Optionally, the motherboard is configured with a programmable logic device, the motherboard of the server is provided with a multiplexer for the baseboard management controller and the programmable logic device, the baseboard management controller and the programmable logic device are electrically connected with the multiplexer, the programmable logic device is used for determining channel selection for multiplexing, and the method further comprises:
when the baseboard management controller is judged to be unfinished or to be failed, acquiring temperature information of the server based on the multiplexer by adopting the programmable logic device;
and when the baseboard management controller is judged to finish initialization and normally run, acquiring temperature information of the server by adopting the baseboard management controller.
Optionally, the server may include a plurality of heat generating hardware devices, where the first slave liquid inlet pipe is connected with a plurality of second slave liquid inlet pipes, and the plurality of second slave liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices.
Optionally, the second slave feed-through tube end may be provided with a nozzle; the nozzle may be a single orifice nozzle or a multi-orifice nozzle.
Alternatively, the heat generating hardware device may be configured with a heat sink metal plate corresponding to the nozzle.
The embodiment of the invention also discloses a heat dissipating device, which is applied to a server liquid cooling system, wherein the server liquid cooling system comprises a liquid cooling tank, the liquid cooling tank is provided with a main liquid inlet pipe, the main liquid inlet pipe is connected with a plurality of first auxiliary liquid inlet pipes, the plurality of first auxiliary liquid inlet pipes are in one-to-one correspondence with a plurality of servers positioned in the liquid cooling tank, and the server liquid cooling system comprises a liquid flow rate control unit for independently controlling the flow rate of cooling liquid in the first auxiliary liquid inlet pipes, and the heat dissipating device can comprise:
the temperature information acquisition module is used for acquiring the temperature information of the server;
a liquid flow rate control signal generation module for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
and the liquid flow rate control module is used for controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal by adopting the liquid flow rate control unit.
Optionally, the server liquid cooling system includes a flow rate calculation chip, and the liquid flow rate control signal generating module may include:
and the liquid flow rate control signal generation submodule is used for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information by adopting the flow rate calculation chip.
Optionally, the server liquid cooling system includes a flow rate signal collecting unit for the first slave liquid inlet pipe, and the liquid flow rate control signal generating sub-module may include:
an actual liquid flow rate control signal acquisition unit configured to acquire an actual liquid flow rate control signal for the first slave liquid inlet pipe using the flow rate signal collection unit;
and the liquid flow rate control signal generating unit is used for generating a liquid flow rate control signal aiming at the first slave liquid inlet pipe by adopting the flow rate calculating chip based on the temperature information and the actual liquid flow rate control signal.
Optionally, the server includes a motherboard, the motherboard has a corresponding baseboard management controller, and the temperature information acquisition module may include:
and the first temperature information acquisition sub-module is used for acquiring the temperature information of the server by adopting the baseboard management controller.
Optionally, the motherboard is configured with a programmable logic device, the motherboard of the server is provided with a multiplexer for the baseboard management controller and the programmable logic device, the baseboard management controller and the programmable logic device are electrically connected with the multiplexer, the programmable logic device is used for determining channel selection for multiplexing, and the method further comprises:
a second temperature information obtaining sub-module, configured to obtain temperature information of the server based on the multiplexer by using the programmable logic device when it is determined that the baseboard management controller does not complete initialization or fails;
and the third temperature information acquisition sub-module is used for acquiring the temperature information of the server by adopting the baseboard management controller when the baseboard management controller is judged to finish initialization and normal operation.
Optionally, the server may include a plurality of heat generating hardware devices, where the first slave liquid inlet pipe is connected with a plurality of second slave liquid inlet pipes, and the plurality of second slave liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices.
Optionally, the second slave feed-through tube end may be provided with a nozzle; the nozzle may be a single orifice nozzle or a multi-orifice nozzle.
Alternatively, the heat generating hardware device may be configured with a heat sink metal plate corresponding to the nozzle.
The embodiment of the invention also discloses electronic equipment, which comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory are communicated with each other through the communication bus;
the memory is used for storing a computer program;
the processor is configured to implement the method according to the embodiment of the present invention when executing the program stored in the memory.
Embodiments of the present invention also disclose a computer-readable storage medium having instructions stored thereon, which when executed by one or more processors, cause the processors to perform the method according to the embodiments of the present invention.
The embodiment of the invention has the following advantages:
according to the embodiment of the invention, the temperature information of the server is obtained; generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information; the liquid flow rate control unit is used for controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal, so that the control of the liquid flow rate of the cooling liquid is completed on the basis of not increasing the disassembly difficulty, the operation and maintenance cost of the server is reduced, and the heat dissipation efficiency of the liquid cooling of the server is improved.
Drawings
FIG. 1 is a schematic diagram of a single phase immersion liquid cooling system of the prior art;
FIG. 2 is a flow chart of steps of a heat dissipation method according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a server liquid cooling system according to an embodiment of the present invention;
FIG. 4 is a schematic illustration of a single orifice nozzle provided in an embodiment of the present invention;
FIG. 5 is a schematic illustration of a multi-orifice nozzle provided in an embodiment of the present invention;
FIG. 6 is a schematic diagram of the principle of operation of an impingement jet provided in an embodiment of the present invention;
FIG. 7 is a schematic diagram of another server liquid cooling system according to an embodiment of the present invention;
FIG. 8 is a block diagram of a heat dissipating device according to an embodiment of the present invention;
FIG. 9 is a block diagram of the hardware architecture of an electronic device provided in various embodiments of the invention;
fig. 10 is a schematic diagram of a computer readable medium provided in an embodiment of the invention.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
In recent years, the start of "east-west algorithm" and the implementation of "two-carbon" strategy put forward more stringent demands on the data center PUE, PUE (Power Usage Effectiveness) being an index for evaluating the energy efficiency of the data center, is the ratio of all the energy consumed by the data center to the energy consumed by IT loads. Under the drive, the immersion liquid cooling in the liquid cooling technology has extremely high application prospect, can better meet the energy saving and consumption reduction requirements, becomes the first choice of a liquid cooling scheme of a data center, is divided into single-phase immersion liquid cooling and double-phase immersion liquid cooling according to whether the refrigerant is subjected to phase change, wherein the single-phase immersion liquid cooling is widely and maturely applied in the data center at present because of the relative simplicity in the aspects of the principle and the structure realization, referring to FIG. 1, a schematic diagram of an existing single-phase immersion liquid cooling system is shown, the single-phase immersion liquid cooling is realized in such a way that a plurality of IT equipment nodes are commonly positioned in one liquid cooling tank filled with cooling liquid, or a single IT equipment node corresponds to a single liquid cooling tank filled with cooling liquid, and then a plurality of liquid cooling tanks are integrated in a machine cabinet together, because chips with different power consumption in the IT equipment have different heat dissipation requirements, the single-phase immersion is characterized in that fluid in the whole liquid cooling tank is circulated, and the chips with high heat dissipation requirements cannot be directionally and intensively cooled, so that the problem of local hot spot concentration exists in the single-phase immersion liquid cooling, and the heat dissipation efficiency is further improved, at present, the problem of hot spot concentration of the single-phase immersion liquid cooling is generally solved by arranging a cold plate on a chip with higher power consumption, so that low-temperature fluid flows out of a heat exchanger and enters the liquid cooling tank, and then flows through the cold plate on the chip with high power consumption to dissipate heat of the chip with high power consumption, and then flows out of the cold plate to cool the chip with low power consumption, however, the problem of doing so is that more pipelines in an immersed liquid cooling server are caused, and when a certain server in the liquid cooling tank fails, the disassembly is difficult, so that the operation cost is increased, the fluid circulation in the liquid cooling tank is controlled by combining the temperature information and the liquid flow rate, so that the heat dissipation efficiency of the liquid cooling of the server is improved, and the operation and maintenance cost of the server is further reduced.
Referring to fig. 2, a step flowchart of a heat dissipation method provided in an embodiment of the present invention may specifically include the following steps:
step 201, obtaining temperature information of the server;
step 202, generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
and step 203, controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal by adopting the liquid flow rate control unit.
In practical application, in the field of heat transfer science, the impact jet flow is an extremely effective method for enhancing local heat transfer, and is one of the modes with highest heat transfer efficiency, and in the impact jet flow process, a medium directly impacts a material under the action of pressure difference, so that a cooling method for generating strong convection heat exchange on the surface of the material is provided.
In a specific implementation, the embodiment of the invention can be applied to a server liquid cooling system, the server liquid cooling system can comprise a liquid cooling tank, the liquid cooling tank can be provided with a main liquid inlet pipe, the main liquid inlet pipe can be connected with a plurality of first auxiliary liquid inlet pipes, the plurality of first auxiliary liquid inlet pipes can be in one-to-one correspondence with a plurality of servers positioned in the liquid cooling tank, the server liquid cooling system can comprise a liquid flow rate control unit for independently controlling the flow rate of cooling liquid in the first auxiliary liquid inlet pipes, and the embodiment of the invention can acquire the temperature information of the servers; generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information; by using the liquid flow rate control unit to control the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal, for example, the liquid cooling tank may be configured with one master liquid inlet pipe, 10 servers are respectively arranged in the liquid cooling tank, which are respectively servers 1 … …, then 10 first slave liquid inlet pipes can be connected to the server 1 … … server 10 in a one-to-one correspondence, the first slave liquid inlet pipe is marked as a first slave liquid inlet pipe 1 … …, the 10 first slave liquid inlet pipes are configured with a liquid control unit capable of independently controlling the flow rate of cooling liquid, for example, a pump capable of adjusting the flow rate of liquid is configured, after acquiring the temperature information of the server 1 … … server 10, the temperature information 1 … … temperature information 10 is marked, then the liquid flow rate control signal for the first slave liquid inlet pipe 1 … … corresponding to the server 1 … … server 10 can be generated based on the temperature information 1 … … temperature information 10, and the liquid flow rate control signal for the liquid in any first slave liquid inlet pipe is marked as a first slave liquid inlet pipe is independently adjustable, so as to control the flow rate of the liquid in the first slave liquid inlet pipe is marked as a first slave liquid inlet pipe 1 … ….
According to the embodiment of the invention, the temperature information of the server is obtained; generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information; the liquid flow rate control unit is used for controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal, so that the control of the liquid flow rate of the cooling liquid is completed on the basis of not increasing the disassembly difficulty, the operation and maintenance cost of the server is reduced, and the heat dissipation efficiency of the liquid cooling of the server is improved.
On the basis of the above embodiments, modified embodiments of the above embodiments are proposed, and it is to be noted here that only the differences from the above embodiments are described in the modified embodiments for the sake of brevity of description.
In an alternative embodiment of the present invention, the step of generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information comprises:
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information by adopting the flow rate calculation chip.
In practical applications, the server liquid cooling system in the embodiment of the present invention may include a flow rate calculating chip, and the flow rate calculating chip may be, for example, a chip for performing data calculation, and specifically may be configured to perform data processing on temperature information when the temperature information is acquired, so as to generate a liquid flow rate control signal for the liquid flow rate control unit based on the temperature information, and send the liquid flow rate control signal to the control liquid flow rate control unit, so as to control the liquid flow rate of the first slave liquid inlet pipe.
In a specific implementation, the embodiment of the present invention may use the flow rate calculating chip to generate the liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information, and, for example, assuming that the CPU temperature of the server is increased from 50 ℃ to 60 ℃, the current liquid flow rate of the first slave liquid inlet pipe is 2m/s, the flow rate calculating chip may obtain the CPU temperature information "CPU: at 60 ℃, the temperature information is subjected to data processing to generate a liquid flow rate control signal for the liquid flow rate control unit according to a preset calculation rule based on the temperature information, the cooling liquid flow rate is adjusted to 3m/s, and the liquid flow rate control signal is sent to the control liquid flow rate control unit so as to control the liquid flow rate of the first slave liquid inlet pipe corresponding to the CPU to be adjusted from 2m/s to 3m/s.
CPU: a central processing unit (Central Processing Unit, abbreviated as CPU) is used as an operation and control core of the computer system, and is a final execution unit for information processing and program running. Since the generation of the CPU, great development is made on the aspects of logic structure, operation efficiency and functional extension.
Of course, the foregoing is merely exemplary, and other calculation rules may be used by those skilled in the art to adjust the liquid flow rate control signal generated based on the temperature information, which is not limiting of the embodiments of the present invention.
According to the embodiment of the invention, the special flow rate calculation chip is configured for the server liquid cooling system, and the flow rate calculation chip is adopted to generate the liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information, so that the operation efficiency of the server liquid cooling system is improved, and the heat dissipation efficiency is further improved.
In an alternative embodiment of the present invention, the step of generating the liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information using the flow rate calculation chip includes:
acquiring an actual liquid flow rate control signal for the first slave liquid inlet pipe by adopting the flow rate signal collecting unit;
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information and the actual liquid flow rate control signal by adopting the flow rate calculation chip.
In practical application, the flow rate of liquid in the pipeline can be influenced by a plurality of factors to generate attenuation, such as pressure difference between the inner part and the outer part of the pipeline, smoothness of the pipe wall, pipeline length, pipeline shape and the like, if the flow rate of cooling liquid is reduced, the heat dissipation efficiency is reduced, and in order to ensure continuous stable and accurate heat dissipation of the server, the flow rate of the cooling liquid is required to be controlled, so that the cooling liquid flow rate is prevented from not meeting the cooling requirement.
In a specific implementation, the server liquid cooling system in the embodiment of the present invention may include a flow rate signal collecting unit for the first slave liquid inlet pipe, and in an exemplary embodiment, the flow rate signal collecting unit may be a device for collecting a liquid flow rate signal, and provides a data basis for subsequent calculation of the flow rate calculating chip by acquiring an actual liquid flow rate of the corresponding first slave liquid inlet pipe and sending an actual liquid flow rate control signal to the flow rate calculating chip.
In a specific implementation, the embodiment of the invention can acquire the actual liquid flow rate control signal aiming at the first slave liquid inlet pipe by adopting a flow rate signal collecting unit; the flow rate calculating chip is used for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information and the actual liquid flow rate control signal, the flow rate signal collecting unit can be a flow rate sensor with a data sending function, the flow rate sensor measures that the current liquid flow rate of the tail end of the first slave liquid inlet pipe corresponding to the CPU is 2m/s, the current liquid flow rate of the tail end is 2m/s as the actual liquid flow rate control signal, and the flow rate calculating chip acquires CPU temperature information: when the current liquid flow rate at the end of 60 ℃ and the actual liquid flow rate control signal is 2m/s, temperature information CPU is adopted: and (3) performing data processing on the temperature information and the actual liquid flow rate control signal at the end, wherein the current liquid flow rate is 2m/s, so as to generate a liquid flow rate control signal for the liquid flow rate control unit according to a preset calculation rule based on the temperature information and the actual liquid flow rate control signal, and sending the liquid flow rate control signal to the control liquid flow rate control unit to control the liquid flow rate of the first slave liquid inlet pipe corresponding to the CPU to be adjusted from 2m/s to 3m/s.
According to the embodiment of the invention, the flow rate signal collection unit is adopted to obtain an actual liquid flow rate control signal aiming at the first slave liquid inlet pipe; the flow rate calculating chip is adopted to generate a liquid flow rate control signal aiming at the first slave liquid inlet pipe based on the temperature information and the actual liquid flow rate control signal, so that the actual liquid flow rate is obtained through the flow rate signal collecting unit, the flow rate calculating chip is ensured to calculate and generate the liquid flow rate control signal according to the actual liquid flow rate and the temperature information, the process of obtaining the actual liquid flow rate control signal again based on the flow rate generated by the liquid flow rate control signal is circulated, the stable and reliable liquid flow rate of the first slave liquid inlet pipe is ensured, the heat dissipation requirement is met, and the heat dissipation efficiency is further improved.
In an alternative embodiment of the present invention, the step of obtaining temperature information of the server includes:
and acquiring temperature information of the server by adopting the baseboard management controller.
In a specific implementation, the server in the embodiment of the present invention may include a motherboard, and the motherboard may have a corresponding baseboard management controller.
A motherboard, also called a main board (main board), a system board (system board), or a motherboard (atherboard), is one of the most basic and important components of a computer. The motherboard is generally a rectangular circuit board on which the main circuitry that makes up the computer is mounted, and typically has elements such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light connector, an expansion slot, a direct current power supply connector for the motherboard and the card.
The baseboard management controller, also known as a baseboard management controller (baseboard management controller, BMC), is a specialized service processor that uses sensors to monitor the status of a computer, web server, or other hardware driven device and communicates with the system administrator via separate connection lines. BMCs are part of the intelligent platform control interface (IPMI, intelligent Platform Management Interface) and are typically contained within a motherboard or main circuit board of a device being monitored. The sensors of the BMC are used to measure internal physical variables such as: temperature, power supply voltage, fan speed, communication parameters, and Operating System (OS) functions. If any of these variables is outside the scope of the established limits, it will notify the administrator. The relevant technician can take the correct action with the remote control. The monitoring device may be power cycled or restarted when necessary. In this way, a single administrator can remotely control numerous servers and other devices simultaneously. This saves the overall cost of the network and ensures reliability.
I2C: the I2C bus is a simple, bi-directional two-wire synchronous serial bus. It requires only two wires to transfer information between devices connected to the bus. The master device is used to initiate the bus transfer of data and generate a clock to open the transfer device, where any addressed device is considered a slave device. If the host computer is to send data to the slave device, the host computer firstly addresses the slave device, then actively sends the data to the slave device, and finally the host computer terminates the data transmission; if the host is to receive data from the slave, the slave is addressed by the master first, then the host receives data sent from the slave, and finally the host terminates the receiving process. In this case, the host is responsible for generating the timing clock and terminating the data transfer.
In a specific implementation, the embodiment of the invention can acquire the temperature information of the server by adopting the baseboard management controller, and the server can be a CPU (central processing unit) by taking the temperature of the CPU as 60 ℃ acquired by the baseboard management controller, further, the temperature information 60 ℃ can be sent to the flow rate calculation chip by using an I2C data transmission protocol, and further, data support is provided for the flow rate calculation chip to generate a liquid flow rate control signal.
According to the embodiment of the invention, the temperature information of the server is acquired by adopting the baseboard management controller, so that the overall cost of a network is saved, the data reliability is ensured, and the data support is provided for the generation of the follow-up liquid flow rate control signal.
In an alternative embodiment of the present invention, further comprising:
when the baseboard management controller is judged to be unfinished or to be failed, acquiring temperature information of the server based on the multiplexer by adopting the programmable logic device;
and when the baseboard management controller is judged to finish initialization and normally run, acquiring temperature information of the server by adopting the baseboard management controller.
Referring to fig. 3, a schematic structural diagram of a server liquid cooling system according to an embodiment of the present invention is shown;
in practical application, the motherboard of the embodiment of the invention may be configured with a programmable logic device, the motherboard of the server is provided with a multiplexer for the baseboard management controller and the programmable logic device, the baseboard management controller and the programmable logic device are electrically connected with the multiplexer, the programmable logic device is used for determining channel selection for the multiplexer, and the programmable logic device is used for determining channel selection for the multiplexer.
A multiplexer MUX is a device that receives multiple input signals and synthesizes a single output signal in a recoverable manner for each input signal. A multiplexer is an integrated system that typically contains a number of data inputs and has a single output.
Programmable logic device: CPLD (Complex Programmable Logic Device) is simply referred to as Complex PLD, a more Complex logic element than PLD. A CPLD is a digital integrated circuit in which a user constructs logic functions by himself as required. The basic design method is to generate corresponding target files by means of an integrated development software platform and using methods such as schematic diagrams, hardware description languages and the like, and transmit codes to a target chip through a downloading cable (programming in a system) to realize a designed digital system.
In a specific implementation, when the substrate management controller is judged to be unfinished or to be failed, the embodiment of the invention can acquire the temperature information of the server based on the multiplexer by adopting the programmable logic device; when the baseboard management controller is judged to finish initialization and normally run, the baseboard management controller is adopted to acquire the temperature information of the server, and when the baseboard management controller is not initialized or fails, the temperature information of the hardware equipment cannot be accurately acquired, so that the baseboard management controller and the programmable logic device can be simultaneously configured for the main board, and the baseboard management controller and the programmable logic device are electrically connected with the multiplexer to realize multiplexing for saving pin occupation.
In a specific implementation, the programmable logic device may be used to determine channel selection for the multiplexer, and typically, the baseboard management controller BMC receives temperature information of the temperature sensor, and uses the flow rate calculation chip to dissipate heat for the high temperature server by adjusting the liquid flow rate of the cooling liquid based on the temperature information and the liquid flow rate control signal. However, when the server is just started to power on, under the condition that the baseboard management controller BMC is not initialized, or when the baseboard management controller BMC fails, the programmable logic device CPLD does not receive a heartbeat indication signal of the BMC, the programmable logic device CPLD can switch the channel selection of the I2CMUX by changing the SEL selection signal of the I2C MUX, and actively receive the temperature information of the temperature sensor, at this time, the programmable logic device CPLD is used as a host device on the I2C link of the bidirectional two-wire synchronous serial bus, and can send the temperature information of the server hardware to the control flow rate calculation chip through the synchronous serial bus I2C to generate a liquid flow rate control signal, so that the liquid flow rate control unit can adjust the flow rate of the cooling liquid in the second slave liquid inlet pipe based on the liquid flow rate control signal; when the baseboard management controller BMC is initialized and runs normally, the programmable logic device CPLD receives the heartbeat indication signal sent by the baseboard management controller BMC, and the programmable logic device CPLD can switch the acquisition control right for the temperature information back to the BMC, so that the BMC can acquire the temperature information of the hardware of the server.
According to the embodiment of the invention, when the baseboard management controller is judged to be unfinished or to be failed, the programmable logic device is adopted to acquire the temperature information of the server based on the multiplexer; when the baseboard management controller is judged to finish initialization and normally run, the baseboard management controller is adopted to acquire the temperature information of the server, so that data redundancy caused by hardware multiplexing is avoided, the problems that when the baseboard management controller BMC does not finish initialization or fails, the flow rate of cooling liquid is uncontrollable and the heat dissipation of the server cannot be guaranteed are solved, the reliability and the availability of the server can be improved, the safe and reliable running of the server is guaranteed, and the heat dissipation efficiency of the server is further improved.
In an optional embodiment of the present invention, the server includes a plurality of heat generating hardware devices, and the first slave liquid inlet pipe is connected with a plurality of second slave liquid inlet pipes, and the plurality of second slave liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices.
In a specific implementation, in an embodiment of the present invention, the server may include a plurality of heat generating hardware devices, where the first slave liquid inlet pipe is connected to a plurality of second slave liquid inlet pipes, where the plurality of second slave liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices, and in an exemplary case, when a plurality of servers are configured in one liquid cooling tank, each server corresponds to a plurality of high power consumption chips as the heat generating hardware devices, a cooling liquid may enter the liquid cooling tank through the master liquid inlet pipe, be distributed to different servers through a plurality of first slave liquid inlet pipes, and be distributed to each high power consumption chip through a plurality of second slave liquid inlet pipes corresponding to each first slave liquid inlet pipe.
According to the embodiment of the invention, the server comprises a plurality of heating hardware devices, the first auxiliary liquid inlet pipe is connected with a plurality of second auxiliary liquid inlet pipes, and the second auxiliary liquid inlet pipes are in one-to-one correspondence with the plurality of heating hardware devices, so that the flow rate of cooling liquid can be adjusted in a targeted manner for each high-power consumption chip, the impact jet cooling is performed, and the heat dissipation efficiency is further improved.
In an alternative embodiment of the invention, the second slave feed-through tube is provided with a nozzle at its end; the nozzle is a single-hole nozzle or a multi-hole nozzle.
In a specific implementation, in the embodiment of the present invention, the second slave liquid inlet pipe end may be configured with a nozzle, and the nozzle may be a single-hole nozzle or a multi-hole nozzle.
Referring to FIG. 4, a schematic diagram of a single orifice nozzle is shown provided in an embodiment of the present invention;
referring to FIG. 5, a schematic diagram of a multi-orifice nozzle provided in an embodiment of the invention is shown;
in practical application, the nozzle can be the high-flow single-hole nozzle directly, also can be formed by a plurality of low-flow nozzles jointly, can be according to heat dissipation demand and space setting demand to the nozzle size and arrange and carry out optimal design, for example, when the heat dissipation area that the high-power consumption chip corresponds is big, can adopt the high-flow single-hole nozzle when the heat dissipation demand is high, and when the space is narrow in the server, the heat dissipation area that the high-power consumption chip corresponds is little, when the heat dissipation demand is lower, in order to save the use of coolant liquid, keep the hydraulic pressure in the same main feed liquor pipe not produce invalid consumption, can adopt the porous nozzle of low-flow, slow but fine heat dissipation impact jet cooling.
According to the embodiment of the invention, the nozzle is arranged at the tail end of the second secondary liquid inlet pipe; the nozzle is a single-hole nozzle or a multi-hole nozzle, so that targeted impact jet flow aiming at servers with different heat dissipation areas, different space layouts and different heat dissipation requirements is realized, the heat dissipation efficiency is improved, and meanwhile, the occupied space of the nozzle is reduced.
In an alternative embodiment of the invention, the heat generating hardware device is configured with a heat sink metal plate corresponding to the nozzle.
In a specific implementation, the heat generating hardware device in the embodiment of the present invention may be configured with a heat sink metal plate corresponding to the nozzle, and the heat sink metal plate may be exemplified by a metal plate whose temperature does not change with the magnitude of thermal energy transferred thereto, and may be used as a cooling heat generating hardware device.
Referring to FIG. 6, a schematic diagram of the impingement jet operating principle provided in an embodiment of the present invention is shown;
in practical application, taking a single circular nozzle jet flow field as an example, the flow velocity of a jet outlet is generally nearly uniform, after the jet leaves the nozzle surface, the diameter of the jet is continuously expanded due to momentum exchange with surrounding static media, but a core area with uniform velocity is still kept at the center of the jet, the core area is continuously reduced along with forward movement of the fluid, finally the velocity on the whole section is unevenly distributed in a mode of being large in the middle and gradually decreasing towards the edge, the flow velocity is kept in a uniform area called a bit stream core of the jet, when the jet reaches the wall surface of an impacted object, the fluid is scattered along the wall surface along the periphery, and is written into a wall-attached jet area, the flow area before the jet reaches the wall surface is formed into free jet, the flow field is not disturbed and limited by the wall surface, the area of the impacted wall surface is called a stagnation area, the point corresponding to the jet center is called a stagnation point, the local heat transfer intensity is the highest, the place with particularly high cooling effect on the surface of the object, such as a high-power chip, is located in the area, therefore, the stagnation point is used as the center, when the heat is located in the area, the area corresponding to a single nozzle is configured with a metal heat sink, and a heat sink can be maintained in a certain area, and a heat-generating device can be maintained under the condition of a heat-generating device, and a heat-generating device is not required to be disassembled when a heat-generating device is required, and a heat-generating device is not required to be disassembled, when a heat device is required.
In the embodiment of the invention, the heat-generating hardware equipment is configured with the heat sink metal plate corresponding to the nozzle, so that the heat dissipation efficiency of the heat-generating hardware equipment is further improved and the operation and maintenance cost is reduced under the condition of not increasing the disassembly difficulty.
In order that those skilled in the art will better understand the embodiments of the present invention, a complete description of the embodiments of the present invention will be provided below.
With the improvement of heat dissipation requirements, the immersed liquid cooling is characterized in that a refrigerant directly contacts with a heat dissipation part, so that the heat dissipation device has extremely high cooling efficiency, extremely high application prospect, energy conservation and consumption reduction requirements can be better met, the heat dissipation device is a first choice of a data center liquid cooling scheme, the immersed liquid cooling is divided into single-phase immersed liquid cooling and double-phase immersed liquid cooling according to whether the refrigerant is subjected to phase change, wherein the single-phase immersed liquid cooling is widely and maturely applied in the data center at present because of relative simplicity in the aspects of single-phase immersed liquid cooling principle and structure, a plurality of IT equipment nodes are commonly arranged in a liquid cooling tank filled with cooling liquid, or a single IT equipment node corresponds to a single liquid cooling tank filled with cooling liquid, then a plurality of liquid cooling tanks are integrated in a cabinet together, namely a large liquid cooling tank is used for loading a server, cooling liquid and the like, the cooling liquid is upwards discharged after being heated, and when the hot liquid enters a CDU (Coolant Distribution Unit, also called a liquid cooling distribution unit refers to a system for distributing cooling liquid among liquid cooling electronic equipment, a secondary side flow distribution, pressure control, a physical condensation prevention function and the like) are provided, and the cooling liquid returns to the bottom of the liquid cooling tank. Thus, one of the problems that is currently widespread is: if the distribution design and optimization of the flow channel of the IT equipment are not performed in the liquid cooling tank, so that after the cold liquid enters the liquid cooling tank, limited lift and flow are ensured, the heat-generating device is preferentially given, and as chips with different power consumption in the IT equipment have different heat dissipation demands, single-phase immersion is fluid circulation in the whole liquid cooling tank and cannot be subjected to directional concentrated cooling aiming at the chips with high heat dissipation demands, the problem of local hot spot concentration exists in the single-phase immersion liquid, and the heat dissipation efficiency of the single-phase immersion liquid is further improved.
Referring to fig. 7, a schematic structural diagram of another server liquid cooling system provided in an embodiment of the present invention is shown, and specific steps are as follows:
based on the existing circulating pump in the single-phase immersed liquid cooling system, a main pipeline is led out from the circulating pump, the number of pipeline branch pipelines is set based on the number of server nodes, for example, 10 servers are arranged in a liquid cooling tank, the number of the branch pipelines is set to 10, on each branch pipeline, the number of the components is further set based on the requirement of key cooling, for example, 4 components are required to be key cooled, and each server branch pipeline is required to be divided into 4 branches;
a large-area metal plate heat sink is arranged on the surface of each high-power consumption chip, a vertical impact surface is provided for jet impact, copper plates can be selected as the metal plates, and in order to reduce the cost, aluminum plates can be also used on the premise that the jet impact can meet the heat dissipation requirement;
after cooling liquid is cooled through the CDU, the high-power consumption chip is cooled through each impact jet pipeline, the jet outlet faces to the chip position and sprays vertically, and then the cooling liquid flows into the liquid cooling tank to cool other components with smaller heat dissipation capacity;
The jet flow nozzle can be in various design forms, can be directly designed into a large-flow nozzle or a plurality of small-flow nozzles, and can be optimally designed according to the heat dissipation requirements in the follow-up process;
the jet impact technology is implemented for the high-power consumption chip through additionally leading out some pipelines, so that the problem of local hot spot concentration in single-phase immersion liquid cooling is solved, the heat dissipation efficiency can be effectively improved on the premise of simple structure and easy maintenance, and the current reachable PUE value of the single-phase immersion liquid cooling data center is reduced.
It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred embodiments, and that the acts are not necessarily required by the embodiments of the invention.
Referring to fig. 8, a block diagram of a heat dissipating device provided in an embodiment of the present invention is shown, which may specifically include the following modules:
A temperature information obtaining module 801, configured to obtain temperature information of the server;
a liquid flow rate control signal generation module 802 for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
a liquid flow rate control module 803 is configured to control a liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal using the liquid flow rate control unit.
Optionally, the server liquid cooling system includes a flow rate calculation chip, and the liquid flow rate control signal generating module may include:
and the liquid flow rate control signal generation submodule is used for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information by adopting the flow rate calculation chip.
Optionally, the server liquid cooling system includes a flow rate signal collecting unit for the first slave liquid inlet pipe, and the liquid flow rate control signal generating sub-module may include:
an actual liquid flow rate control signal acquisition unit configured to acquire an actual liquid flow rate control signal for the first slave liquid inlet pipe using the flow rate signal collection unit;
and the liquid flow rate control signal generating unit is used for generating a liquid flow rate control signal aiming at the first slave liquid inlet pipe by adopting the flow rate calculating chip based on the temperature information and the actual liquid flow rate control signal.
Optionally, the server includes a motherboard, the motherboard has a corresponding baseboard management controller, and the temperature information acquisition module may include:
and the first temperature information acquisition sub-module is used for acquiring the temperature information of the server by adopting the baseboard management controller.
Optionally, the motherboard is configured with a programmable logic device, the motherboard of the server is provided with a multiplexer for the baseboard management controller and the programmable logic device, the baseboard management controller and the programmable logic device are electrically connected with the multiplexer, the programmable logic device is used for determining channel selection for multiplexing, and the method further comprises:
a second temperature information obtaining sub-module, configured to obtain temperature information of the server based on the multiplexer by using the programmable logic device when it is determined that the baseboard management controller does not complete initialization or fails;
and the third temperature information acquisition sub-module is used for acquiring the temperature information of the server by adopting the baseboard management controller when the baseboard management controller is judged to finish initialization and normal operation.
Optionally, the server may include a plurality of heat generating hardware devices, where the first slave liquid inlet pipe is connected with a plurality of second slave liquid inlet pipes, and the plurality of second slave liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices.
Optionally, the second slave feed-through tube end may be provided with a nozzle; the nozzle may be a single orifice nozzle or a multi-orifice nozzle.
Alternatively, the heat generating hardware device may be configured with a heat sink metal plate corresponding to the nozzle.
For the device embodiments, since they are substantially similar to the method embodiments, the description is relatively simple, and reference is made to the description of the method embodiments for relevant points.
In addition, the embodiment of the invention also provides electronic equipment, which comprises: the processor, the memory, store the computer program on the memory and can run on the processor, this computer program realizes each process of the above-mentioned heat dissipation method embodiment when being carried out by the processor, and can reach the same technical result, in order to avoid repetition, will not be repeated here.
The embodiment of the invention also provides a computer readable storage medium, on which a computer program is stored, which when executed by a processor, realizes the processes of the above-mentioned embodiments of the heat dissipation method, and can achieve the same technical effects, and for avoiding repetition, the description is omitted here. Wherein the computer readable storage medium is selected from Read-Only Memory (ROM), random access Memory (Random Access Memory, RAM), magnetic disk or optical disk.
Fig. 9 is a schematic diagram of a hardware structure of an electronic device implementing various embodiments of the present invention.
The electronic device 900 includes, but is not limited to: radio frequency unit 901, network module 902, audio output unit 903, input unit 904, sensor 905, display unit 906, user input unit 907, interface unit 908, memory 909, processor 910, and power source 911. It will be appreciated by those skilled in the art that the electronic device structure shown in fig. 9 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than illustrated, or may combine certain components, or may have a different arrangement of components. In the embodiment of the invention, the electronic equipment comprises, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer and the like.
It should be understood that, in the embodiment of the present invention, the radio frequency unit 901 may be used for receiving and transmitting signals during the process of receiving and transmitting information or communication, specifically, receiving downlink data from a base station and then processing the downlink data by the processor 910; and, the uplink data is transmitted to the base station. Typically, the radio frequency unit 901 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 901 may also communicate with networks and other devices via a wireless communication system.
The electronic device provides wireless broadband internet access to the user via the network module 902, such as helping the user to send and receive e-mail, browse web pages, and access streaming media, etc.
The audio output unit 903 may convert audio data received by the radio frequency unit 901 or the network module 902 or stored in the memory 909 into an audio signal and output as sound. Also, the audio output unit 903 may also provide audio output (e.g., a call signal reception sound, a message reception sound, etc.) related to a specific function performed by the electronic device 900. The audio output unit 903 includes a speaker, a buzzer, a receiver, and the like.
The input unit 904 is used to receive an audio or video signal. The input unit 904 may include a graphics processor (Graphics Processing Unit, GPU) 9041 and a microphone 9042, the graphics processor 9041 processing image data of still pictures or video obtained by an image capturing device (such as a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 906. The image frames processed by the graphics processor 9041 may be stored in memory 909 (or other storage medium) or transmitted via the radio frequency unit 901 or the network module 902. The microphone 9042 may receive sound and may be capable of processing such sound into audio data. The processed audio data may be converted into a format output that can be transmitted to the mobile communication base station via the radio frequency unit 901 in the case of a telephone call mode.
The electronic device 900 also includes at least one sensor 905, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor and a proximity sensor, wherein the ambient light sensor can adjust the brightness of the display panel 9061 according to the brightness of ambient light, and the proximity sensor can turn off the display panel 9061 and/or the backlight when the electronic device 900 moves to the ear. As one of the motion sensors, the accelerometer sensor can detect the acceleration in all directions (generally three axes), and can detect the gravity and direction when stationary, and can be used for recognizing the gesture of the electronic equipment (such as horizontal and vertical screen switching, related games, magnetometer gesture calibration), vibration recognition related functions (such as pedometer and knocking), and the like; the sensor 905 may further include a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, etc., which are not described herein.
The display unit 906 is used to display information input by a user or information provided to the user. The display unit 906 may include a display panel 9061, and the display panel 9061 may be configured in the form of a liquid crystal display (Liquid Crystal Display, LCD), an Organic Light-Emitting Diode (OLED), or the like.
The user input unit 907 is operable to receive input numeric or character information, and to generate key signal inputs related to user settings and function controls of the electronic device. In particular, the user input unit 907 includes a touch panel 9071 and other input devices 9072. Touch panel 9071, also referred to as a touch screen, may collect touch operations thereon or thereabout by a user (such as operations of the user on touch panel 9071 or thereabout using any suitable object or accessory such as a finger, stylus, or the like). The touch panel 9071 may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch azimuth of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 910, and receives and executes commands sent by the processor 910. In addition, the touch panel 9071 may be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. The user input unit 907 may also include other input devices 9072 in addition to the touch panel 9071. In particular, other input devices 9072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein.
Further, the touch panel 9071 may be overlaid on the display panel 9061, and when the touch panel 9071 detects a touch operation thereon or thereabout, the touch operation is transmitted to the processor 910 to determine a type of touch event, and then the processor 910 provides a corresponding visual output on the display panel 9061 according to the type of touch event. Although in fig. 9, the touch panel 9071 and the display panel 9061 are two independent components for implementing the input and output functions of the electronic device, in some embodiments, the touch panel 9071 and the display panel 9061 may be integrated to implement the input and output functions of the electronic device, which is not limited herein.
The interface unit 908 is an interface to which an external device is connected to the electronic apparatus 900. For example, the external devices may include a wired or wireless headset port, an external power (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 908 may be used to receive input (e.g., data information, power, etc.) from an external device and transmit the received input to one or more elements within the electronic apparatus 900 or may be used to transmit data between the electronic apparatus 900 and an external device.
The memory 909 may be used to store software programs as well as various data. The memory 909 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs (such as a sound playing function, an image playing function, etc.) required for at least one function, and the like; the storage data area may store data (such as audio data, phonebook, etc.) created according to the use of the handset, etc. In addition, the memory 909 may include high-speed random access memory and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device.
The processor 910 is a control center of the electronic device, connects various parts of the entire electronic device using various interfaces and lines, and performs various functions of the electronic device and processes data by running or executing software programs and/or modules stored in the memory 909, and calling data stored in the memory 909, thereby performing overall monitoring of the electronic device. Processor 910 may include one or more processing units; preferably, the processor 910 may integrate an application processor that primarily handles operating systems, user interfaces, applications, etc., with a modem processor that primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 910.
The electronic device 900 may also include a power supply 911 (e.g., a battery) for powering the various components, and the power supply 911 may preferably be logically coupled to the processor 910 by a power management system, such as to perform charge, discharge, and power consumption management functions.
In addition, the electronic device 900 includes some functional modules that are not shown, and will not be described herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present invention.
In yet another embodiment provided by the present invention, as shown in fig. 10, there is also provided a computer-readable storage medium 1001 having instructions stored therein, which when run on a computer, cause the computer to perform the heat dissipation method described in the above embodiment.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a ROM, a RAM, a magnetic disk, or an optical disk, etc.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (11)
1. The utility model provides a heat dissipation method, its characterized in that, the method is applied to the server liquid cooling system, the server liquid cooling system includes the liquid cooling groove, the liquid cooling groove is furnished with the main feed liquor pipe, the main feed liquor pipe is connected with many first follow feed liquor pipes, many first follow feed liquor pipe and a plurality of servers that are located the liquid cooling inslot one-to-one, the server liquid cooling system includes the liquid velocity of flow control unit that is used for independently controlling the cooling liquid velocity of flow in the first follow feed liquor pipe, includes:
acquiring temperature information of the server;
generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
and controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal by adopting the liquid flow rate control unit.
2. The method of claim 1, wherein the server liquid cooling system includes a flow rate calculation chip, and wherein the step of generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information includes:
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information by adopting the flow rate calculation chip.
3. The method of claim 2, wherein the server liquid cooling system includes a flow rate signal collection unit for the first slave liquid inlet pipe, and wherein the step of generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information using the flow rate calculation chip includes:
acquiring an actual liquid flow rate control signal for the first slave liquid inlet pipe by adopting the flow rate signal collecting unit;
and generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information and the actual liquid flow rate control signal by adopting the flow rate calculation chip.
4. The method of claim 1, wherein the server comprises a motherboard having a corresponding baseboard management controller, and wherein the step of obtaining temperature information of the server comprises:
and acquiring temperature information of the server by adopting the baseboard management controller.
5. The method of claim 4, wherein the motherboard of the server is configured with a programmable logic device, the motherboard of the server is provided with a multiplexer for the baseboard management controller and the programmable logic device, the baseboard management controller and the programmable logic device are electrically connected with the multiplexer, the programmable logic device is used for determining channel selection for multiplexing, further comprising:
When the baseboard management controller is judged to be unfinished or to be failed, acquiring temperature information of the server based on the multiplexer by adopting the programmable logic device;
and when the baseboard management controller is judged to finish initialization and normally run, acquiring temperature information of the server by adopting the baseboard management controller.
6. The method according to any one of claims 1-5, wherein the server comprises a plurality of heat generating hardware devices, and the first secondary liquid inlet pipe is connected with a plurality of second secondary liquid inlet pipes, and the plurality of second secondary liquid inlet pipes are in one-to-one correspondence with the plurality of heat generating hardware devices.
7. The method of claim 6, wherein the second slave feed tube end is configured with a nozzle; the nozzle is a single-hole nozzle or a multi-hole nozzle.
8. The method of claim 7, wherein the heat generating hardware device is configured with a heat sink metal plate corresponding to the nozzle.
9. The utility model provides a heat abstractor, its characterized in that, the device is applied to the server liquid cooling system, the server liquid cooling system includes the liquid cooling groove, the liquid cooling groove is furnished with main feed liquor pipe, main feed liquor pipe is connected with many first follow feed liquor pipe, many first follow feed liquor pipe and a plurality of servers that are located the liquid cooling inslot one-to-one, the server liquid cooling system includes and is used for independent control the liquid velocity of flow control unit of cooling liquid velocity in the first follow feed liquor pipe includes:
The temperature information acquisition module is used for acquiring the temperature information of the server;
a liquid flow rate control signal generation module for generating a liquid flow rate control signal for the first slave liquid inlet pipe based on the temperature information;
and the liquid flow rate control module is used for controlling the liquid flow rate of the first slave liquid inlet pipe based on the liquid flow rate control signal by adopting the liquid flow rate control unit.
10. An electronic device comprising a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus;
the memory is used for storing a computer program;
the processor is configured to implement the method according to any one of claims 1-8 when executing a program stored on a memory.
11. A computer-readable storage medium having instructions stored thereon, which when executed by one or more processors, cause the processors to perform the method of any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310551448.1A CN116723670A (en) | 2023-05-16 | 2023-05-16 | Heat dissipation method and device, electronic equipment and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310551448.1A CN116723670A (en) | 2023-05-16 | 2023-05-16 | Heat dissipation method and device, electronic equipment and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116723670A true CN116723670A (en) | 2023-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310551448.1A Pending CN116723670A (en) | 2023-05-16 | 2023-05-16 | Heat dissipation method and device, electronic equipment and storage medium |
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| Country | Link |
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| CN (1) | CN116723670A (en) |
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2023
- 2023-05-16 CN CN202310551448.1A patent/CN116723670A/en active Pending
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