CN116723634A - Routing method for circuit board without positioning holes - Google Patents
Routing method for circuit board without positioning holes Download PDFInfo
- Publication number
- CN116723634A CN116723634A CN202310602454.5A CN202310602454A CN116723634A CN 116723634 A CN116723634 A CN 116723634A CN 202310602454 A CN202310602454 A CN 202310602454A CN 116723634 A CN116723634 A CN 116723634A
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- circuit board
- routing
- sides
- circuit
- positioning holes
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 230000008569 process Effects 0.000 claims abstract description 34
- 238000003801 milling Methods 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 14
- 230000009471 action Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a routing method of a circuit board without a positioning hole, which comprises the following steps: s1, providing a circuit board to be processed, wherein the circuit board comprises a plurality of circuit single boards, the opposite short sides of the circuit board are respectively provided with a process side, and a plurality of positioning holes are formed in each of the two process sides; s2, fixing the circuit board on a milling machine workbench by inserting locating pins into locating holes on the process sides, milling the long sides opposite to each other and the long connecting sides between the circuit boards by using a milling machine for the first time, and finishing milling the long sides of the circuit boards; s3, adding a plurality of peripheral holes which are distributed at intervals on the long side of each circuit board, and inserting positioning pins to position the circuit board; s4, performing secondary routing by using a routing machine, routing short connecting edges of the circuit veneers off, and finishing routing short edges of the circuit veneers. The application can solve the problems of low efficiency, complex action and the like in the existing circuit board forming method without the positioning holes.
Description
Technical Field
The application relates to the technical field of circuit board processing, in particular to a routing method of a circuit board without positioning holes.
Background
With the development of the versatility of electronic products, the application of PCBs is becoming more and more widespread, and printed circuit boards tend to be small in size, high in precision and intelligent, and more customers have not only required the performance of PCBs, but also the size requirements on the board surfaces.
The routing is a preferred mode of the appearance processing technology of the circuit board, in order to ensure the dimensional accuracy in the routing process, the whole circuit board is required to be fixed, and in general, positioning holes are formed in the upper, lower, left and right edges of the whole circuit board and are fixed by positioning pins. However, some circuit boards designed at present have no positioning holes, and for routing such circuit boards, the following modes are generally adopted to implement fixation: (1) by using the electroplating holes in the plates as positioning holes, the method is easy to cause the problems of hole wall pulling, pad scraping, hole copper fracture and the like when the plates are arranged on the upper plate and the lower plate; (2) the adhesive paper is adopted for fixing, residual adhesive can be left on the plate, the welding surface is affected, and the problems of unstable size control, easiness in exceeding tolerance, low production efficiency and the like exist.
Disclosure of Invention
The application aims to provide a routing method for a circuit board without a positioning hole, which aims to solve the problems of low efficiency, complex action and the like in the existing circuit board forming method without the positioning hole.
In order to achieve the above purpose, the technical scheme adopted by the application is as follows:
a routing method of a circuit board without positioning holes comprises the following steps:
s1, providing a circuit board to be processed, wherein the circuit board comprises a plurality of circuit single boards, the opposite short sides of the circuit board are respectively provided with a process side, and a plurality of positioning holes are formed in each of the two process sides;
s2, fixing the circuit board on a milling machine workbench by inserting locating pins into locating holes on the process sides, milling the long sides opposite to each other and the long connecting sides between the circuit boards by using a milling machine for the first time, and finishing milling the long sides of the circuit boards;
s3, adding a plurality of peripheral holes which are distributed at intervals on the long side of each circuit board, and inserting positioning pins to position the circuit board;
s4, performing secondary routing by using a routing machine, firstly routing one of the process sides of the circuit board, then routing the other process side of the circuit board, and finally routing the short connecting sides between the circuit veneers to finish routing of the short sides of the circuit veneers.
Further, the number of the positioning holes is four, and two process edges are arranged at intervals.
Further, one of the positioning holes is arranged in a staggered manner.
Further, the distance between the positioning hole and the short side of the circuit board is 2mm.
Further, the number of peripheral holes added on the long side of the circuit board is 6, and the peripheral holes are uniformly arranged at intervals.
Further, the aperture of the peripheral holes is 3.0-3.1mm, and the interval is 20mm.
The application has the following beneficial effects:
according to the routing method for routing the circuit board without the positioning holes, disclosed by the application, the routing manufacture is completed by reasonably utilizing the area between the circuit single boards and the board edge formed after one-time routing, and the whole board is free of a fenestration, NPTH holes and positioning holes, so that the positioning is simple, the operation is convenient, the routing size and periphery meeting the requirements are completed on the basis of not changing the design of a customer, reworking is avoided, and the customer requirements are met.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
Fig. 1 is a schematic structural diagram of a circuit board according to a second embodiment of the present application;
fig. 2 is a schematic structural diagram of a circuit board after the first routing of the present application;
fig. 3 is a schematic diagram of circuit board positioning before the second routing of the present application;
fig. 4 is a schematic structural view of the second gong process according to the present application after one gong;
fig. 5 is a schematic structural diagram after two gongs in the second gong forming process of the present application;
fig. 6 is a schematic structural diagram after three gons in the second gong process of the present application;
fig. 7 is a schematic structural diagram of a circuit board obtained after the second routing of the present application;
fig. 8 is a schematic structural diagram of a circuit board according to a third embodiment of the present application;
wherein:
1-a circuit board; 2-line veneer; 3-positioning holes; 4-peripheral holes.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the routing process of the circuit board, in order to ensure the dimensional accuracy, the circuit board is required to be fixed, and in general, positioning holes are formed in the upper, lower, left and right edges of the whole circuit board and are fixed by positioning pins. However, some circuit boards designed at present have no positioning holes, and for the routing of the circuit boards, the existing routing method has the problems of low efficiency, complex actions and the like
To this end, the present application provides a routing method without locating holes to solve one or more of the above problems. The routing method of the circuit board without the positioning holes provided by the application is exemplified by the following with reference to the accompanying drawings.
Example 1
A routing method of a circuit board without positioning holes comprises the following steps:
s1, providing a circuit board to be processed, wherein the circuit board comprises a plurality of circuit single boards, the opposite short sides of the circuit board are respectively provided with a process side, and a plurality of positioning holes are formed in each of the two process sides;
s2, fixing the circuit board on a milling machine workbench by inserting locating pins into locating holes on the process sides, milling the long sides opposite to each other and the long connecting sides between the circuit boards by using a milling machine for the first time, and finishing milling the long sides of the circuit boards;
s3, adding a plurality of peripheral holes which are distributed at intervals on the long side of each circuit board, and inserting positioning pins to position the circuit board;
s4, performing secondary routing by using a routing machine, firstly routing one of the process sides of the circuit board, then routing the other process side of the circuit board, and finally routing the short connecting sides between the circuit veneers to finish routing of the short sides of the circuit veneers.
The number of the present application is two or more and includes two, and the number of the present application is two or more and includes two.
Example two
The routing method of the circuit board without positioning holes of the present embodiment will be described with reference to fig. 1 to 7.
Specifically, the routing method of the circuit board without the positioning holes mainly comprises the following steps:
s1, providing a circuit board 1 to be processed, wherein the circuit board 1 is rectangular as shown in FIG. 1, and comprises 4 rectangular circuit single boards 2, wherein two opposite short sides of the circuit board 1 are respectively provided with a process side, two process sides are respectively provided with two positioning holes 3, alternatively, the distance between the outer diameter of each positioning hole 3 and the short side of the circuit board 1 is 2mm, and the positioning holes 3 positioned at the right upper corner are staggered by 1mm and are used as fool-proofing devices;
s2, fixing the circuit board 1 on a milling machine workbench by inserting locating pins into locating holes 3 on the technological side, milling the circuit board 1 for the first time by using a milling machine, milling off two opposite long sides of the circuit board 1 and long connecting sides between the circuit single boards 2, and finishing milling of the long sides of the circuit single boards 2, as shown in FIG. 2;
s3, adding 6 peripheral holes 4 distributed at intervals on the long side of each circuit veneer 2, and inserting positioning pins to position the circuit board 1, wherein the aperture of each peripheral hole 4 is 3.0-3.1mm, and the interval is 20mm as shown in FIG. 3.
S4, performing secondary routing by using a routing machine, and firstly routing off the process edge on the left side of the circuit board 1, as shown in FIG. 4; the process edge on the right side of the circuit board 1 is turned off as shown in fig. 5; finally, the short connecting edges between the circuit single boards 2 are turned off, and as shown in fig. 6, the turning of the short edges of the circuit single boards 2 is completed; the routing circuit board 2 is shown in fig. 7.
Example III
The routing method of the circuit board without positioning holes of the present embodiment will be described with reference to fig. 2 to 8.
Specifically, the routing method of the circuit board without the positioning holes mainly comprises the following steps:
s1, providing a circuit board 1 to be processed, wherein the circuit board 1 is rectangular as shown in FIG. 8, and comprises 4 rectangular circuit single boards 2, wherein two opposite short sides of the circuit board 1 are respectively provided with a process side, two process sides are respectively provided with two positioning holes 3, alternatively, the distance between the outer diameter surface of each positioning hole 3 and the short side of the circuit board 1 is 2mm, wherein the positioning holes 3 positioned at the upper right corner are staggered by 1mm and are used as fool-proofing devices;
s2, fixing the circuit board 1 on a milling machine workbench by using a locating pin to insert a locating hole 3 on a process side, and milling the circuit board 1 for the first time by using a milling machine, wherein the difference from the first embodiment is that the milling of the long sides of the circuit board 2 can be completed only by milling the long connecting sides between the circuit boards 2 as shown in fig. 2 because the milling amount of the two opposite long sides of the circuit board 1 is not reserved during cutting, that is, the long sides of the circuit board 1 are overlapped with the long sides of the circuit boards 2;
s3, adding 6 peripheral holes 4 distributed at intervals on the long side of each circuit veneer 2, and inserting positioning pins to position the circuit board 1, wherein the aperture of each peripheral hole 4 is 3.0-3.1mm, and the interval is 20mm as shown in FIG. 3.
S4, performing secondary routing by using a routing machine, and firstly routing off the process edge on the left side of the circuit board 1, as shown in FIG. 4; the process edge on the right side of the circuit board 1 is turned off as shown in fig. 5; finally, the short connecting edges between the circuit single boards 2 are turned off, and as shown in fig. 6, the turning of the short edges of the circuit single boards 2 is completed; the routing circuit board 2 is shown in fig. 7.
The routing method of the circuit board without the locating holes can solve the routing problem without the locating holes, effectively avoid the abnormality of poor size, unsmooth and unable die, repeated complaints of clients, reworking and the like caused by routing, and can reach the following economic and technical indexes:
at a monthly yield of 3000m 2 Price 250 yuan/m 2 The calculation can save the cost:
3000m 2 *250 yuan/m 2 =75 ten thousand/month
The annual cost saving is as follows:
75 ten thousand/month 12 months = 900 ten thousand yuan.
In summary, the routing method for the circuit board without the positioning holes, disclosed by the application, has the advantages that the routing method is used for fixing the circuit boards by reasonably utilizing the area between the circuit boards and the board edges formed after one routing, the whole board is free of open windows and NPTH holes (Non-Platting Through Hole, namely Non-electroplating holes) and positioning holes, so that the routing board manufacturing is finished, the positioning is simple, the operation is convenient, the routing size and the periphery meeting the requirements are finished on the basis of not changing the design of customers, reworking is avoided, and the customer requirements are met.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures. In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (6)
1. The routing method for the circuit board without the positioning holes is characterized by comprising the following steps of:
s1, providing a circuit board to be processed, wherein the circuit board comprises a plurality of circuit single boards, the opposite short sides of the circuit board are respectively provided with a process side, and a plurality of positioning holes are formed in each of the two process sides;
s2, fixing the circuit board on a milling machine workbench by inserting locating pins into locating holes on the process sides, milling the long sides opposite to each other and the long connecting sides between the circuit boards by using a milling machine for the first time, and finishing milling the long sides of the circuit boards;
s3, adding a plurality of peripheral holes which are distributed at intervals on the long side of each circuit board, and inserting positioning pins to position the circuit board;
s4, performing secondary routing by using a routing machine, firstly routing one of the process sides of the circuit board, then routing the other process side of the circuit board, and finally routing the short connecting sides between the circuit veneers to finish routing of the short sides of the circuit veneers.
2. The routing method without positioning holes according to claim 1, wherein the number of the positioning holes is four, and two positioning holes are arranged at intervals on each process side.
3. The routing method without positioning holes according to claim 2, wherein one of the positioning holes is offset.
4. The routing method without positioning holes according to claim 1, wherein a distance between the positioning holes and a short side of the routing board is 2mm.
5. The routing method without positioning holes according to claim 1, wherein the number of peripheral holes added on the long side of the routing veneer is 6 and the peripheral holes are uniformly spaced.
6. The routing method without positioning holes according to claim 5, wherein the diameter of the peripheral holes is 3.0-3.1mm and the interval is 20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310602454.5A CN116723634A (en) | 2023-05-25 | 2023-05-25 | Routing method for circuit board without positioning holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310602454.5A CN116723634A (en) | 2023-05-25 | 2023-05-25 | Routing method for circuit board without positioning holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116723634A true CN116723634A (en) | 2023-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310602454.5A Pending CN116723634A (en) | 2023-05-25 | 2023-05-25 | Routing method for circuit board without positioning holes |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118890785A (en) * | 2024-08-15 | 2024-11-01 | 奥士康科技股份有限公司 | A forming method for single PCS shipment of circuit boards without internal positioning |
-
2023
- 2023-05-25 CN CN202310602454.5A patent/CN116723634A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118890785A (en) * | 2024-08-15 | 2024-11-01 | 奥士康科技股份有限公司 | A forming method for single PCS shipment of circuit boards without internal positioning |
| CN118890785B (en) * | 2024-08-15 | 2025-09-26 | 奥士康科技股份有限公司 | A molding method for single PCS shipment of circuit boards without internal positioning |
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