CN116723125A - Vehicle communication chip test system - Google Patents

Abstract

The application provides a vehicle-mounted communication chip test system which comprises a first upper computer, a second upper computer, a first singlechip, a second singlechip, a first power module, a second power module, a first communication chip, a second communication chip, a first to-be-tested non-wake-up chipset and a second to-be-tested non-wake-up chipset, wherein the first to-be-tested non-wake-up chipset is respectively connected with the first upper computer, the first singlechip, the first power module and the second to-be-tested non-wake-up chipset, the second to-be-tested non-wake-up chipset is respectively connected with the second upper computer, the second singlechip and the second power module, the first singlechip is connected with the first power module, the second singlechip is connected with the second power module, the first communication chip is arranged in the first to-be-tested non-wake-up chipset, and the second communication chip is arranged in the second to-be-tested non-wake-up chipset; the system can rapidly and effectively perform batch test on the vehicle-mounted communication chips, shortens the test period, reduces the test workload and reduces the test cost.

Description

Vehicle communication chip test system

Technical field

This application relates to the field of vehicle electronic technology, and specifically to a vehicle communication chip testing system.

Background technique

Vehicle communication chips refer to the transceiver chips of vehicle communication networks, also called interface chips, such as CAN (Controller Area Network) chips, LIN (Local Interconnect Network, local Internet) chips, Ethernet chips, etc., on the vehicle side. The communication between components and ECU (Electronic Control Unit, also known as controller) is inseparable from the transceiver chip. The vehicle communication chip is a key component for the underlying communication between vehicle and industry. The domestic market has long been dominated by foreign chip manufacturers. With the rapid development of automobile intelligence, the number of ECUs is increasing, and the demand for in-vehicle communication chips is increasing, which also promotes the development of localized chips.

At present, in order to expand the market, domestic chip manufacturers are switching from industrial standards to vehicle standards. There is still a gap between the design, production, manufacturing and testing of domestic chips and foreign semiconductors. The market recognition of domestic chips in terms of quality and function is not high. Before the vehicle is configured, it is necessary to For testing, due to the large number of in-vehicle communication chips, it will cause a long test cycle, a large test workload and high test costs. How to quickly and effectively test domestic chips in batches has become a problem faced by current automobile companies.

Contents of the invention

In view of the above shortcomings of the existing technology, this application provides a vehicle communication chip testing system to solve the above technical problem of how to quickly and effectively test domestic chips in batches.

This application provides a vehicle-mounted communication chip testing system. The vehicle-mounted communication chip testing system includes: a first host computer, a second host computer, a first single-chip computer, a second single-chip computer, a first power module, a second power module, A communication chip, a second communication chip, a first non-wakeup chipset to be tested, and a second non-wakeup chipset to be tested; the first non-wakeup chipset to be tested is connected to the first host computer and the first non-wakeup chipset respectively. The microcontroller, the first power module and the second non-wakeup chipset to be tested are connected; the second non-wakeup chipset to be tested are respectively connected to the second host computer, the second microcontroller and the second The power module is connected; the first microcontroller is connected to the first power module; the second microcontroller is connected to the second power module; the first communication chip is configured in the first non-wakeup chipset to be tested , the second communication chip is configured in the second non-wakeup chipset to be tested.

In an embodiment of the present application, if the communication function test is performed on the first non-wakeup chipset to be tested and the second non-wakeup chipset to be tested, the first host computer passes the first communication chip Send a first power-on control instruction to the first single-chip computer, and the first single-chip computer performs enable control on the first power module through the first power-on control instruction, so that the first power module is the The first non-wake-up chipset to be tested supplies power; the second host computer sends a second power-on control instruction to the second microcontroller through the second communication chip, and the second microcontroller passes through the second upper computer. The electrical control instructions enable and control the second power module so that the second power module supplies power to the second non-wakeup chipset to be tested; the first host computer transmits the first test message to the first non-wakeup chipset to be tested, and control the first non-wakeup chipset to be tested to send the first test message; the second host computer controls the second non-wakeup chipset to be tested The message is received to obtain the first message reception result; the second host computer determines the communication function test result according to the first message reception result.

In one embodiment of the present application, the vehicle communication chip testing system further includes a first wake-up chipset to be tested and a second wake-up chipset to be tested; the first wake-up chipset to be tested is connected to the first single chip microcomputer respectively. , the first power module and the second wake-up chipset to be tested are connected; the second wake-up chipset to be tested are connected to the second microcontroller and the second power module respectively; if the first wake-up chipset is connected to the The wake-up chipset to be tested performs a local wake-up function test, and the first host computer controls the first microcontroller through the first communication chip, so that the first microcontroller sends signals to the first wake-up chipset to be tested. Send a local wake-up signal to locally wake up the first wake-up chipset to be tested; the first host computer transmits the second test message to the first microcontroller through the first communication chip, and the first The microcontroller transmits the second test message to the first wake-up chipset to be tested, and controls the first wake-up chipset to be tested to send the second test message; the second wake-up chipset to be tested Perform message reception to obtain a second message reception result and transmit it to the second single-chip computer, and the second single-chip computer transmits the second message result to the second host computer through the second communication chip; The second host computer determines the local wake-up function test result according to the second message reception result.

In an embodiment of the present application, the vehicle communication chip testing system further includes a connector; the first wake-up chipset to be tested is connected to the second wake-up chipset to be tested through the connector; the third wake-up chipset to be tested is connected to the connector. A non-wakeup chipset to be tested is connected to the second non-wakeup chipset to be tested through the connector; the connector includes a first connector and a second connector, and the first connector and the third A wire harness is used to connect the two connectors, and the parameters of the wire harness meet the preset conditions; if the remote wake-up function test is performed on the first wake-up chipset to be tested, the second host computer uses the second communication chip to The second microcontroller controls the second microcontroller to send a remote wake-up signal to the first wake-up chipset to be tested through the second wake-up chipset to be tested, and the first wake-up chipset to be tested is , the first power module and the first single-chip computer perform remote wake-up; the first single-chip computer receives messages through the first wake-up chipset to be tested, obtains the third message reception result and transmits it to the third message A host computer; the first host computer determines the remote wake-up function test result based on the third message reception result.

In an embodiment of the present application, the second host computer determines the communication function test result according to the first message reception result, including: if the first message reception result is empty, the communication function test The result is abnormal. If the first message reception result is not empty, the communication function test result is normal; or if the first message reception result is different from the preset message, the communication function test result is normal. The test result is abnormal. If the first message reception result is the same as the preset message, then the communication function test result is normal and the first test message is a preset message.

In an embodiment of the present application, if the communication function test result, the local wake-up function test result and the remote wake-up function test result are all normal, the communication rate is adjusted to enable the first non-wake-up function to be tested. The chipset, the second non-wakeup chipset to be tested, the first wakeup chipset to be tested, and the second wakeup chipset to be tested perform a first communication quality test, and the message reception results after adjusting the communication rate are Determine the first communication quality test result.

In an embodiment of the present application, if the first communication quality test result is good, the first non-wakeup chipset to be tested, the second non-wakeup chipset to be tested, and the The first wake-up chipset to be tested and the second wake-up chipset to be tested perform a second communication quality test, and the second communication quality test result is determined based on the message reception results at different temperatures.

In an embodiment of the present application, if the second communication quality test result is good, the first non-wakeup chipset to be tested, the second non-wakeup chipset to be tested, and the The first wake-up chipset to be tested and the second wake-up chipset to be tested perform a communication anti-interference capability test, and the communication anti-interference capability test results are determined based on the message reception results under different electromagnetic intensities.

In an embodiment of the present application, the first power module includes a first power supply, a first PMOS tube, a first inductor and a first system basis chip; the first power supply is connected to the first PMOS tube, The first PMOS tube is connected to the first inductor, the first inductor is connected to the first system basic chip, and the first system basic chip is respectively connected to the first microcontroller and the first The non-wake-up chipset to be tested is connected to the first wake-up chipset to be tested; the second power supply module includes a second power supply, a second PMOS tube, a second inductor and a second system basis chip; the second power supply module Connected to the second PMOS tube, the second PMOS tube is connected to the second inductor, the second inductor is connected to the second system basic chip, and the second system basic chip is respectively connected to the The second microcontroller, the second non-wake-up chipset to be tested, and the second wake-up chipset to be tested are connected; the first system base chip includes a first power converter, and the second system base chip includes a third 2. Power converter.

In an embodiment of the present application, the chips in the chipset to be tested include at least one of a CAN chip and a LIN chip, and the chipset to be tested includes the first non-wakeup chipset to be tested, the second chip to be tested. Test the non-wake-up chipset, the first wake-up chipset to be tested, and the second wake-up chipset to be tested.

In an embodiment of the present application, the vehicle communication chip test system further includes a first circuit board and a second circuit board; the first system basic chip, the first single chip microcomputer, the first non-wake-up circuit to be tested A chipset and the first wake-up chipset to be tested are configured in the first circuit board; the second system base chip, the second microcontroller, the second non-wakeup chipset to be tested, and the third The second wake-up chipset to be tested is configured in the second circuit board.

Beneficial effects of the present invention: The present invention provides a vehicle-mounted communication chip testing system. The vehicle-mounted communication chip testing system includes a first host computer, a second host computer, a first single-chip computer, a second single-chip computer, a first power module, and a second power supply. module, the first communication chip, the second communication chip, the first non-wakeup chipset to be tested and the second non-wakeup chipset to be tested; by connecting the first non-wakeup chipset to be tested with the first host computer and the first single chip microcomputer respectively , the first power module and the second non-wakeup chipset to be tested are connected, so that the first power module can supply power to the first non-wakeup chipset to be tested, and the first host computer can send and receive messages to the first non-wakeup chipset to be tested. control, and the communication function between the first non-wakeup chipset to be tested and the second non-wakeup chipset to be tested; through the second non-wakeup chipset to be tested, it communicates with the second host computer, the second microcontroller and the second power module respectively. The connection enables the second power module to supply power to the second non-wakeup chipset to be tested, and the second host computer to control the sending and receiving of messages to the second non-wakeup chipset to be tested; the vehicle communication chip test system can realize rapid and effective testing of Batch testing of vehicle communication chips not only shortens the test cycle, reduces the test workload, but also reduces the test cost.

It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and do not limit the present application.

Description of the drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts. In the attached picture:

Figure 1 is a system architecture diagram of a vehicle communication chip testing system according to an exemplary embodiment of the present application;

Figure 2 is a schematic diagram of data interaction for testing the communication function of a vehicle communication chip according to an exemplary embodiment of the present application;

Figure 3 is a system architecture diagram of a vehicle communication chip testing system according to another exemplary embodiment of the present application;

Figure 4 is a schematic structural diagram of a vehicle communication chip testing system according to a specific embodiment of the present application;

FIG. 5 is a test flow chart of the vehicle communication chip test system shown in the embodiment shown in FIG. 4 .

Detailed ways

The implementation of the present application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of this application. It should be understood that the preferred embodiments are only for illustrating the present application and are not intended to limit the protection scope of the present application.

It should be noted that the illustrations provided in the following embodiments only illustrate the basic concept of the present application in a schematic manner, and the drawings only show the components related to the present application and do not follow the actual implementation of the component numbers, shapes and components. Dimension drawing, in actual implementation, the type, quantity and proportion of each component can be arbitrarily changed, and the component layout type may also be more complex.

It should be noted that in this application, "first", "second", etc. are only used to distinguish similar objects, and are not intended to limit the order or sequence of similar objects. The "include", "have" and other variations described in the description indicate that the scope covered by the subject of the word is not exclusive except for the examples shown by the word.

It can be understood that the various numerical numbers, step numbers and other labels described in this application are for convenience of description and are not used to limit the scope of this application. The size of the labels in this application does not mean the order of execution. The order of execution of each process should be determined by its function and internal logic.

In the following description, numerous details are discussed in order to provide a more thorough explanation of the embodiments of the present application, however, it will be apparent to those skilled in the art that the embodiments of the present application may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail in order to avoid obscuring the embodiments of the present application.

It should be noted that because the current vehicle ECU is based on the traditional EE (Electrical/Electronic, electronic and electrical) distribution architecture, vehicle controllers are scattered and controlled by communication between controllers through communication chips and wiring harnesses. The vehicle's power, chassis, body, etc. may have dozens or even hundreds of controllers depending on the low-end to high-end vehicle. Therefore, vehicles will also have dozens or even hundreds of communication chips. According to the traditional vehicle parts verification method, parts verification and complete vehicle verification will be performed. Each controller goes through a long verification cycle, which requires high time and labor costs. Moreover, the entire verification process can only verify a small number of one or two communication chips. The quality of communication is closely related to the wiring harness. The experimental wiring harness of parts may It will be inconsistent with the vehicle communication harness, causing inconsistent experimental results and other effects.

In order to solve these problems, embodiments of the present application propose a vehicle communication chip testing system, and these embodiments will be described in detail below.

Please refer to FIG. 1 , which is a system architecture diagram of a vehicle communication chip testing system according to an exemplary embodiment of the present application.

As shown in Figure 1, the system architecture of the vehicle communication chip test system may include a first host computer 1, a second host computer 2, a first single-chip computer 3, a second single-chip computer 4, a first power supply module 5, a second power supply module 6, The first communication chip 7 , the second communication chip 8 , the first non-wakeup chipset to be tested 9 and the second non-wakeup chipset to be tested 10 . Among them, the first non-wakeup chipset 9 to be tested is respectively connected to the first host computer 1, the first single-chip computer 3, the first power module 5 and the second non-wakeup chipset 10 to be tested; the second non-wakeup chipset 10 to be tested are respectively connected to the second host computer 2, the second single-chip computer 4 and the second power module 6; the first single-chip computer 3 is connected to the first power module 5; the second single-chip computer 4 is connected to the second power module 6; the first communication chip 7 is configured In the first non-wakeup chipset 9 to be tested, the second communication chip 8 is configured in the second non-wakeup chipset 10 to be tested.

In one embodiment of the present application, the chips to be tested are classified according to the characteristics of vehicle communication chips (chips for short) to obtain non-wakeup chips to be tested and wake-up chips to be tested. The non-wakeup chips to be tested refer to vehicle-mounted communication chips without a wake-up function. Communication chip, the wake-up chip to be tested refers to a vehicle-mounted communication chip with a wake-up function. Multiple non-wake-up chips to be tested are divided into two groups, namely the first non-wake-up chipset to be tested 9 and the second non-wake-up chipset to be tested 10 . A group of reserved CANs is introduced in the first non-wakeup chipset 9 to be tested as the first communication chip 7, and a group of reserved CANs is introduced in the second non-wakeup chipset 10 to be tested as the second communication chip 8, The host computer controls the microcontroller to send and receive messages by reserving CAN, observes whether there are error frames in the sent and received messages, and adjusts the rate of sending and receiving messages.

In this embodiment, the chip to be tested includes at least one of a CAN chip and a LIN chip, and a single-chip microcomputer with rich CAN and/or LIN communication interfaces is selected as the first single-chip computer 3 and the second single-chip computer 4 respectively, where the first single-chip computer 3 and the second microcontroller 4 respectively reserve JTAG (Joint Test Action Group, joint test working group) debugging interface. Each host computer (the first host computer 1 or the second host computer 2) facilitates the corresponding debugging interface by reserving the JTAG debugging interface. The interface of the single-chip computer (the first single-chip computer 3 or the second single-chip computer 4) is configured. The power modules (the first power module 5 and the second power module 6) provide point power for the entire system architecture.

The vehicle communication chip testing system of the embodiment of the present application supplies power to the non-wakeup chipset to be tested (the first non-wakeup chipset to be tested 9 and the second non-wakeup chipset to be tested 10) through the power module. The chipset controls sending and receiving messages and can realize the communication function between the first non-wakeup chipset to be tested and the second non-wakeup chipset to be tested, and quickly and effectively conduct batch testing of vehicle communication chips, which not only shortens the test cycle, but also shortens the test cycle. It also reduces the testing workload and reduces the testing cost.

In one embodiment of the present application, if the communication function test is performed on the first non-wakeup chipset 9 to be tested and the second non-wakeup chipset 10 to be tested, the first host computer 1 transmits a signal to the first microcontroller through the first communication chip 7 3. Send the first power-on control command, and the first microcontroller 3 performs enable control on the first power module 5 through the first power-on control command, so that the first power module 5 supplies power to the first non-wake-up chipset 9 to be tested. ; The second host computer 2 sends a second power-on control instruction to the second single-chip computer 4 through the second communication chip 8, and the second single-chip computer 4 enables the second power supply module 6 through the second power-on control instruction, so that the second power-on control instruction is enabled. The second power module 6 supplies power to the second non-wakeup chipset 10 to be tested; the first host computer 1 transmits the first test message to the first non-wakeup chipset 9 to be tested, and controls the first non-wakeup chipset 9 to be tested. 9. Send the first test message; the second host computer 2 controls the second non-wakeup chipset 10 to be tested to receive the message and obtain the first message reception result; the second host computer 2 determines the communication according to the first message reception result. Functional test results.

Please refer to Figure 2. Figure 2 is a schematic diagram of data interaction for testing the communication function of a vehicle communication chip according to an exemplary embodiment of the present application. As shown in Figure 2, the tester operates the first host computer 1, the first host computer 1 transmits the first test message to the first non-wakeup chipset 9 to be tested, and the first non-wakeup chipset 9 to be tested Carry out message sending control so that the first non-wakeup chipset 9 to be tested sends a first test message to operate the second host computer 2, and the second host computer 2 reports to the second non-wakeup chipset 10 to be tested. Message reception control is performed so that the second non-wakeup chipset 10 to be tested receives the message, obtains the first message reception result and returns it to the second host computer 2 . When the second non-wakeup chipset 10 under test receives a message, the received message is regarded as the first message reception result; when the second non-wakeup chipset 10 under test does not receive a message, a null value is used as the first message reception result. A message reception result.

Before the above test, the power module (the first power module 5 and the second power module 6) needs to power on the vehicle communication chip test system. The first host computer 1 sends a first power-on control command, and the first communication chip 7 will The first power-on control instruction is transmitted to the first single-chip computer 3. In response to the first power-on control instruction, the first single-chip computer 3 performs enable control on the first power module 5 and wakes up the first power module 5 to enable the first power module 5. 5 provides normal power supply to the first non-wake-up chipset 9 to be tested. Correspondingly, the second host computer 2 sends a second power-on control instruction, the second communication chip 8 transmits the first power-on control instruction to the second single-chip computer 4, and the second single-chip computer 4 responds to the second power-on control instruction. The second power module 6 performs enable control and wakes up the second power module 6 so that the second power module 6 provides normal power supply to the second non-wakeup chipset 10 to be tested.

In this embodiment, the first single-chip computer 3 and the first power module 5 are connected by hard wires, and the second single-chip computer 4 and the second power module 6 are connected by hard wires.

The technical solution of this embodiment uses the host computer to control the non-wakeup chipset to be tested (including the first non-wakeup chipset to be tested 9 and the second non-wakeup chipset to be tested 10) to send and receive messages to the non-wakeup chipset to be tested. Carry out communication function testing of vehicle communication chips, which can quickly and effectively batch test vehicle communication chips, which not only shortens the test cycle, reduces the test workload, but also reduces the test cost.

In one embodiment of the present application, the second host computer 2 determines the communication function test result based on the first message reception result, including: if the first message reception result is empty, the communication function test result is abnormal, and if the first message reception result is empty, the communication function test result is abnormal. If the message reception result is not empty, the communication function test result is normal.

In this embodiment, the second non-wakeup chipset to be tested 10 can receive the message only when all chips in the non-wakeup chipset to be tested are normal. Therefore, after receiving the first message reception result returned by the second non-wakeup chipset 10 to be tested, the second host computer 2 judges the first message reception result. If the first message reception result is not empty, At this time, it can be determined that the communication function test result is normal. If the first message reception result is empty, it can be determined that the communication function test result is abnormal.

In another embodiment of the present application, the second host computer 2 determines the communication function test result based on the first message reception result, which further includes: if the first message reception result is different from the preset message, the communication function test result is abnormal. If the first message reception result is the same as the preset message, the communication function test result is normal and the first test message is the preset message.

In this embodiment, since the chip to be tested may also have normal transceiver functions but abnormal messages sent and received, if only whether the first message received result is empty is used as the basis for whether the communication function test result is normal, it will be accurate. Sex may not be high. Therefore, the preset message is used as the first test message. Only when the second non-wakeup chipset 10 to be tested receives the correct message, that is, when the first message reception result is the same as the preset message, the communication function test The result is normal. If the second non-awakening chipset 10 under test receives an incorrect message or does not receive a message, that is, when the first message reception result is different from the preset message, the communication function test result is abnormal.

In another embodiment of the present application, the communication function test result can also be determined based on whether the first host computer 1 receives an error frame. If the first host computer 1 receives an error frame, the communication function test result is determined to be abnormal. If If the first host computer 1 does not receive the error frame, it is determined that the communication function test result is normal.

The above embodiment tests the text sending function of the first non-wakeup chipset 9 to be tested and the text reception function of the second non-wakeup chipset 10 to be tested. Correspondingly, the text reception function of the first non-wakeup chipset 9 to be tested can also be tested. The function and the sending function of the second non-wakeup chipset 10 to be tested are tested. The testing principle is consistent with the above embodiment and will not be described again here.

In one embodiment of the present application, the vehicle communication chip testing system also includes a first wake-up chipset to be tested 11 and a second wake-up chipset to be tested 12; the first wake-up chipset to be tested 11 is connected to the first single-chip computer 3 and the second single-chip microcomputer 3 respectively. A power module 5 is connected to the second wake-up chipset 12 to be tested; the second wake-up chipset 12 to be tested is connected to the second microcontroller 4 and the second power module 6 respectively; if the first wake-up chipset 11 to be tested is locally woken up For functional testing, the first host computer 1 controls the first microcontroller 3 through the first communication chip 7, so that the first microcontroller 3 sends a local wake-up signal to the first wake-up chipset 11 to be tested, and wakes up the first chipset to be tested. 11 performs local wake-up; the first host computer 1 transmits the second test message to the first single-chip computer 3 through the first communication chip 7, and the first single-chip computer 3 transmits the second test message to the first wake-up chipset to be tested 11, And control the first wake-up chipset 11 to be tested to send the second test message; the second wake-up chipset 12 to be tested receives the message, obtains the second message reception result and transmits it to the second single-chip computer 4, and the second single-chip computer 4 passes The second communication chip 8 transmits the second message result to the second host computer 2; the second host computer 2 determines the local wake-up function test result according to the second message reception result.

Please refer to FIG. 3 , which is a system architecture diagram of a vehicle communication chip testing system according to another exemplary embodiment of the present application. As shown in Figure 3, the system architecture may include a first host computer 1, a second host computer 2, a first microcontroller 3, a second microcontroller 4, a first power module 5, a second power module 6, and a first communication chip 7 , the second communication chip 8, the first non-wakeup chipset 9 to be tested, the second non-wakeup chipset 10 to be tested, the first wakeup chipset 11 to be tested, and the second wakeup chipset 12 to be tested. Among them, the first non-wakeup chipset 9 to be tested is respectively connected to the first host computer 1, the first single-chip computer 3, the first power module 5 and the second non-wakeup chipset 10 to be tested; the second non-wakeup chipset 10 to be tested They are respectively connected to the second host computer 2, the second microcontroller 4 and the second power module 6; the first communication chip 7 is configured in the first non-wake-up chipset 9 to be tested, and the second communication chip 8 is configured in the second non-wakeup chipset 9 to be tested. In the wake-up chipset 10, the first wake-up chipset 11 to be tested is connected to the first single chip microcomputer 3, the first power module 5 and the second wake-up chipset 12 to be tested respectively; the second wake-up chipset 12 to be tested is connected to the second single chip microcomputer respectively. 4 and the second power module 6 are connected; the first single-chip computer 3 is connected with the first power module 5; the second single-chip computer 4 is connected with the second power module 6.

In addition to testing the communication function of the chip to be tested, this system architecture can also test the local wake-up function of the chip to be tested. For the test process of the communication function, please refer to the records in the aforementioned embodiments, which will not be described again here. After it is determined that the communication function test results of the first wake-up chipset to be tested 11 and the second wake-up chipset to be tested 12 are normal, if a local wake-up function test is performed on the first wake-up chipset to be tested 11, in the vehicle communication chip test system After powering on, the tester does not perform any operation on the first host computer 1 so that the first wake-up chipset 11 to be tested and the first power module 5 enter the sleep state. After the first wake-up chipset 11 to be tested enters the sleep state, the tester operates the first host computer 1. The first host computer 1 sends a local wake-up control command to the first single-chip computer 3 through the first communication chip 7. The first single-chip computer 3 In response to the local wake-up control instruction, a local wake-up signal is sent to the first wake-up chipset 11 to be tested, and the first wake-up chipset 11 to be tested is locally woken up. After the first wake-up chipset 11 to be tested is awakened, the first power module 5 is enabled and controlled to wake up the first power module 5 so that the first power module 5 can provide normal power supply to the first wake-up chipset 11 to be tested.

In addition, the second host computer 2 sends a second power-on control instruction, the second communication chip 8 transmits the first power-on control instruction to the second single-chip computer 4, and the second single-chip computer 4 responds to the second power-on control instruction. The power module 6 performs enable control and wakes up the second power module 6 so that the second power module 6 provides normal power supply to the second non-wakeup chipset 10 to be tested and the second wakeup chipset 12 to be tested.

The first host computer 1 uses the preset message as the first test message, generates a sending control instruction including the second test message and sends it to the first communication chip 7, so that the first communication chip 7 transmits the sending control instruction to The first single-chip computer 3; in response to the sending control command, the first single-chip computer 3 transmits the second test message to the first wake-up chipset to be tested 11, and controls the first wake-up chipset to be tested 11 to send the second test message; The second test wakes up the chipset 12 to receive the message, generates the second message reception result and transmits it to the second single-chip computer 4. The second single-chip computer 4 transmits the second message result to the second host computer 2 through the second communication chip 8. ; After receiving the second message reception result, the second host computer 2 compares the second message result with the preset message to determine the local wake-up function test result. If the second message result is the same as the preset message , then the local wake-up function test result is normal, otherwise, the local wake-up function test result is abnormal.

By analogy, the local wake-up function of the second wake-up chipset 12 to be tested can also be tested.

The technical solution of this embodiment enables batch testing of the local wake-up function of the chip to be tested, further shortening the test cycle and reducing test costs.

In one embodiment of the present application, the vehicle communication chip testing system also includes a connector 13; the first wake-up chipset 11 to be tested is connected to the second wake-up chipset 12 to be tested through the connector 13; the first non-wakeup chip to be tested Group 9 is connected to the second non-wakeup chipset 10 to be tested through connector 13; connector 13 includes a first connector 131 and a second connector 132, and a wire harness is used to connect the first connector 131 and the second connector 132. , the parameters of the wire harness meet the preset conditions. If the remote wake-up function test is performed on the first wake-up chipset 11 to be tested, the second host computer 2 controls the second single-chip microcomputer 4 through the second communication chip 8 so that the second single-chip microcomputer 4 wakes up the second single-chip microcomputer 4 through the second wake-up chipset 12 to be tested. Send a remote wake-up signal to the first wake-up chipset to be tested 11 to remotely wake up the first wake-up chipset to be tested 11, the first power module 5 and the first single chip microcomputer 3; the first single chip microcomputer 3 wakes up the first chipset to be tested through the first wake-up chipset to be tested 11 receives the message, obtains the third message reception result and transmits it to the first host computer 1; the first host computer 1 determines the remote wake-up function test result based on the third message reception result.

In this embodiment, in order to simulate vehicle communication, two connectors are configured in the vehicle communication chip test system, namely the first connector 131 and the second connector 132; They are connected by wire harnesses, and the parameters of the wire harness meet the preset conditions. The parameters of the wire harness meeting the preset conditions mean that the length, impedance and material of the wire harness must be the same or similar to the network wire harness for vehicle communication. And the point-to-point connection should be specifically distinguished, and the one-to-many connection should arrange the wiring harness network between the first connector 131 and the second connector 132 according to the communication network of the actual vehicle. The first non-wake-up chipset 9 to be tested and the first wake-up chipset 11 to be tested are respectively connected to the first connector 131 to achieve external communication. The second non-wake-up chipset 10 to be tested and the second wake-up chipset 12 to be tested are respectively connected to the second connector 132 to achieve external communication.

Since the vehicle communication chip test system is similar to the vehicle communication, the accuracy of the communication function test and local wake-up function test of the chip to be tested is also higher. In addition, the vehicle communication chip test system can also test the remote wake-up function of the chip to be tested. After it is determined that the communication function test results of the first wake-up chipset to be tested 11 and the second wake-up chipset to be tested 12 are normal, if the remote wake-up function test is performed on the first wake-up chipset to be tested 11, in the vehicle communication chip test system After powering on, the tester does not perform any operation on the first host computer 1 so that the first wake-up chipset 11 to be tested, the first power module 5 and the first microcontroller 3 enter the sleep state. When the three enter the sleep state, the tester operates the second host computer 2. The second host computer 2 sends a remote wake-up control instruction to the second single-chip computer 4 through the second communication chip 8. The second single-chip computer 4 responds to the remote wake-up control command. Instructions to generate a remote wake-up signal and transmit the second wake-up chipset 12 to be tested, so that the second wake-up chipset 12 to be tested sends a remote wake-up signal to the first wake-up chipset 11 to be tested, and to the first wake-up chipset 11 to be tested. Perform remote wake-up. Illustratively, the remote wake-up model can be an arbitrary frame or a fixed frame. After the first wake-up chipset to be tested 11 is awakened, the first power module 5 is enabled and controlled to wake up the first power module 5 so that the first power module 5 can activate the first wake-up chipset 11 to be tested and the first microcontroller. 3 performs normal power supply and wakes up the first microcontroller 3. After the first microcontroller 3 is awakened, it obtains the remote wake-up message received by the first wake-up chipset 11 to be tested as the third message reception result and sends it to the first host computer 1 . The first host computer 1 judges the third message reception result. If there is no error frame in the third message reception result, the remote wake-up function test result is normal; otherwise, the remote wake-up function test result is abnormal.

By analogy, the remote wake-up function of the second wake-up chipset 12 to be tested can also be tested.

The technical solution of this embodiment enables batch testing of the remote wake-up function of the chip to be tested, further shortening the test cycle and reducing the test cost. At the same time, because the communication method of the system is more similar to the vehicle communication, the remote wake-up function of the chip to be tested is The local wake-up function and communication function tests are also more accurate.

In one embodiment of the present application, the first power module 5 includes a first power supply 51, a first PMOS tube 52, a first inductor 53 and a first system basis chip 54; the first power supply 51 is connected to the first PMOS tube 52 , the first PMOS tube 52 is connected to the first inductor 53, the first inductor 53 is connected to the first system basic chip 54, and the first system basic chip 54 is respectively connected to the first microcontroller 3 and the first non-wakeup chipset to be tested. 9 is connected to the first wake-up chipset 11 to be tested; the second power module 6 includes a second power supply 61, a second PMOS transistor 62, a second inductor 63 and a second system basis chip 64; the second power supply 61 and the second PMOS The tube 62 is connected, the second PMOS tube 62 is connected to the second inductor 63, the second inductor 63 is connected to the second system basic chip 64, the second system basic chip 64 is respectively connected to the second microcontroller 4 and the second non-wakeup to be tested. The chipset 10 and the second wake-up chipset 12 to be tested are connected; the first system basis chip 54 includes a first power converter, and the second system basis chip 64 includes a second power converter.

In this embodiment, the power supply (the first power supply 51 or the second power supply 61) provides 12V normal power, simulating the small battery power supply of the whole vehicle, and the 12V normal power passes through the PMOS tube (the first PMOS tube 52 or the second PMOS tube 62) to prevent Reverse design, then smooth the power impact through the inductor (the first inductor 53 or the second inductor 63), and finally smoothly reach the SBC (System Basis Chip, system basic chip) system chip (the first system basic chip 54 or the second System Basis Chip 64). The SBC system chip includes a switching power supply DC-DC (DC to DC power converter) and a linear regulator LDO (Low Dropout Regulator, low voltage dropout linear regulator), and has CAN, LIN and reset functions. The SBC system chip has passed The switching power supply DC-DC and the linear regulator LDO provide different, stable voltages to the microcontroller and the chipset under test, and are mainly responsible for providing point power for the entire system. In addition, the SBC system chip is also used to wake up the microcontroller.

In one embodiment of the present application, the chips in the chipset to be tested include at least one of a CAN chip and a LIN chip, and the chipset to be tested includes a first non-wakeup chipset to be tested 9 and a second non-wakeup chipset to be tested. 10. The first wake-up chipset to be tested 11 and the second wake-up chipset to be tested 12 .

In one embodiment of the present application, the vehicle communication chip testing system also includes a first circuit board and a second circuit board; a first system basic chip 54, a first microcontroller 3, a first non-wake-up chipset to be tested 9 and a first The wake-up chipset 11 to be tested is configured on the first circuit board; the second system basic chip 64, the second microcontroller 4, the second non-wake-up chipset 10 to be tested, and the second wake-up chipset 12 to be tested are configured on the second circuit board. middle.

In this embodiment, the overall architecture of the vehicle communication chip test system is mainly composed of two boards. The SBC chip (SBC system chip), microcontroller and chipset to be tested are installed on the circuit board to facilitate connection and testing, and can be quickly and conveniently , Flexibly replace the chipset to be tested.

In one embodiment of the present application, if the communication function test results, the local wake-up function test results, and the remote wake-up function test results are all normal, the communication rate is adjusted to adjust the first non-wake-up chipset 9 to be tested, the second to-be-tested non-wake-up chipset 9 The non-wake-up chipset 10, the first wake-up chipset to be tested 11, and the second wake-up chipset to be tested 12 perform a first communication quality test, and determine the first communication quality test result based on the message reception result after adjusting the communication rate.

In this embodiment, if the communication function test results, local wake-up function test results, and remote wake-up function test results of the chipset to be tested are all normal, the communication rate can also be adjusted to test the first communication quality of the chipset to be tested. For example, the communication rate between the first non-wakeup chipset to be tested 9 and the second non-wakeup chipset to be tested 10 can be changed through the host computer to adjust it to the highest rate, and the host computer can be observed again to see if there are error frames or if there are no error frames. Then the first communication quality test result is good.

In one embodiment of the present application, if the first communication quality test result is good, the first non-wakeup chipset 9 to be tested, the second non-wakeup chipset 10 to be tested, and the first wakeup chip to be tested are tested based on different temperatures. Group 11 and the second wake-up chipset 12 to be tested perform a second communication quality test, and determine the second communication quality test result based on the message reception results at different temperatures.

In this embodiment, if the first communication quality test result is good, the ambient temperature can also be changed to test the second communication quality of the chipset to be tested. For example, the communication rate of each communication chip to be tested in the chipset to be tested can be adjusted to its maximum allowable limit through the host computer. Place the system in a thermostat to conduct a series of extreme environmental experiments such as high temperature, low temperature, and temperature cycles. If communication packets are sent and received normally, the second communication quality test result is good.

In one embodiment of the present application, if the second communication quality test result is good, the first non-wakeup chipset 9 to be tested, the second non-wakeup chipset 10 to be tested, and the first wakeup to be tested are tested based on different electromagnetic strengths. The chipset 11 and the second wake-up chipset 12 to be tested perform a communication anti-interference capability test, and determine the communication anti-interference capability test results based on the message reception results under different electromagnetic intensities.

In this embodiment, if the second communication quality test result is good, the communication anti-interference capability test of the communication chip to be tested in the chipset to be tested may also be performed. For example, the host computer can be used to adjust the communication rate of each communication chip to be tested in the chipset to be tested to its maximum allowable limit, conduct EMC (Electro Magnetic Compatibility, electromagnetic compatibility) testing on the system, and test the resistance of the entire system communication network. Interference ability.

Please refer to FIG. 4 , which is a schematic structural diagram of a vehicle communication chip testing system according to a specific embodiment of the present application. As shown in Figure 4, the vehicle communication chip testing system shown in this specific embodiment includes: computer 1 (first host computer 1), computer 2 (second host computer 2), single-chip computer 3 (first single-chip computer 3), single-chip computer 4 (Second microcontroller 4), power supply 51 (first power supply 51), PMOS transistor 52 (first PMOS transistor 52), inductor 53 (first inductor 53), SBC54 (first system basis chip 54), power supply 61 (second power supply 61), PMOS tube 62 (second PMOS tube 62), inductor 63 (second inductor 63), SBC64 (second system basis chip 64), reserved CAN7 (first communication chip 7), Reserved CAN8 (second communication chip 8), CAN LIN chipset without wake-up 9 (first non-wake-up chipset to be tested 9), CAN LIN chipset without wake-up 10 (second non-wake-up chipset to be tested) 10), CAN LIN chipset with wake-up 11 (the first wake-up chipset to be tested 11), CANLIN chipset with wake-up 12 (the second wake-up chipset to be tested 12), J1 connector 131 (the first connector 131 ), J2 connector 132 (second connector 132). Among them, the CAN LIN chipset 9 without wake-up is respectively connected to the computer 1, the microcontroller 3, SBC54 and the J1 connector 131; the CAN LIN chipset 10 without the wake-up is respectively connected to the computer 2, the microcontroller 4, SBC64 and the J2 connector 132. ; The CAN LIN chipset 11 with wake-up is connected to the single-chip computer 3, SBC54 and J1 connector 131 respectively; the CAN LIN chipset 12 with wake-up is connected to the single-chip computer 4, SBC64 and J2 connector 132 respectively; the J1 connector 131 is connected to J2 Device 132 is connected; SBC54 is connected to MCU 3; SBC64 is connected to MCU 4; a set of reserved CAN7 is derived from the CAN LIN chipset 9 without wake-up, and a set of reserved CAN is led from the CAN LIN chipset 10 without wake-up CAN8.

The vehicle communication chip testing system shown in this specific embodiment can quickly and effectively conduct communication function tests, local wake-up function tests and remote wake-up tests in batches on the chips to be tested, shortening the test cycle and reducing test costs.

Please refer to Figure 5. Figure 5 is a test flow chart of the vehicle communication chip test system shown in the embodiment shown in Figure 4. As shown in Figure 5, the test process of the vehicle communication chip by the vehicle communication chip test system is as follows:

1) Provide the actual communication harness length between J1 connector 131 and J2 connector 132 based on vehicle CAN and LIN communication.

Between the J1 connector 131 and the J2 connector 132, select a wire harness of the same length, impedance, material, etc. that is close to the network wire harness length of the vehicle's CAN and LIN communications.

2) Arrange direct connection or cross connection between the J1 connector 131 and the J2 connector 132 .

The point-to-point connection should be specifically distinguished, and the one-to-many connection should be arranged according to the communication network of the actual vehicle. The wiring harness network between the J1 connector 131 and the J2 connector 132 is arranged. And a set of reserved CANs are introduced in the CAN LIN chipset 9 without wake-up and the CAN LIN chipset 10 without wake-up, respectively as reserved CAN7 and reserved CAN8. The function of the reserved CAN is to carry out processing on the microcontroller. Control the sending and receiving of messages and observe whether there are error frames in the sent and received messages, and adjust the rate of sending and receiving messages.

3) Turn on the power supply of the circuit board, and the communication chip can send and receive messages normally.

After completing the wiring harness arrangement between J1 connector 131 and J2 connector 132, the two circuit boards are connected to normal power. The reserved CAN is connected to the computer respectively. Through the JTAG interface, the microcontroller enables the SBC, and the SBC turns on the power supply to the CAN chipset and LIN chipset.

4) Change the communication chip working mode, verify wake-up, low power consumption mode, etc.

The communication chip performs normal message sending and receiving, and is connected to the computer through a reserved CAN communication channel of the microcontroller. The host computer software on the left computer configures CAN and LIN without wake-up to enable it to send messages. The host computer on the right receives messages from CAN and LIN without wake-up, and observes the host computer to see if there are error frames in the messages it sends and receives. If there are no error frames, the CAN and LIN chipset communication functions are normal. Then change its communication rate through the host computer to adjust it to the highest rate, and observe again whether there are error frames in the host computer. If there are no error frames, the chip communication quality is better.

The host computer on the left operates the microcontroller through reserved CAN communication, sends local wake-up signals to the CAN and LIN chipsets with wake-up, and observes whether the host computer has an error frame and whether the right computer receives the message. If there is no error frame and reception report The text is normal, and the local wake-up function with wake-up CAN and LIN chipsets is normal. The host computer on the right operates the microcontroller by reserving CAN communication, sends arbitrary frames and fixed frames to the CAN and LIN chipsets on the left to wake up the CAN and LIN chipsets on the left, and observes whether the host computer has error frames and reception reports. Check whether the text is normal. If it is normal, the chip's remote wake-up communication function is normal.

5) Conduct DV (Design Validation, design verification) environmental experiments and EMC experiments.

After simulating that the vehicle communication is under normal conditions, adjust the communication rate of each communication chip to its maximum allowable limit. Carry out corresponding thermostats to conduct environmental experiments under a series of extreme conditions such as high temperature, low temperature, temperature cycle, etc. In high and low temperature environments, it is simulated whether the vehicle communication is normal under extreme weather. If communication messages are sent and received normally, the communication quality of the chip is good.

Adjust the communication rate of the chip to the highest level, conduct an EMC test on the entire set of analog communication devices, and test the anti-interference ability of the entire communication network.

The technical solution of the embodiment of the present application can not only complete the communication function test, local wake-up function test and remote wake-up function test of the communication chip to be tested in batches, but can also test the communication quality of the communication chip to be tested by adjusting the communication rate, temperature and electromagnetic intensity.

It should be noted that in actual applications of the vehicle communication chip test system provided in the above embodiments, the above function allocation can be completed by different functional modules as needed, that is, the internal structure of the system is divided into different functional modules to complete the All or part of the functions described above are not limited here.

The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the system according to various embodiments of the present application. Each block in the flow chart or block diagram may represent a module, program segment, or part of the code. The above-mentioned module, program segment, or part of the code includes one or more executable components for implementing the specified logical function. instruction. It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown one after another may actually execute substantially in parallel, or they may sometimes execute in the reverse order, depending on the functionality involved. It will also be noted that each block in the block diagram or flowchart illustration, and combinations of blocks in the block diagram or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or may be implemented by special purpose hardware-based systems that perform the specified functions or operations. Achieved by a combination of specialized hardware and computer instructions.

The units involved in the embodiments of this application can be implemented in software or hardware, and the described units can also be provided in a processor. Among them, the names of these units do not constitute a limitation on the unit itself under certain circumstances.

The above embodiments only illustrate the principles and effects of the present application, but are not used to limit the present application. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application shall still be covered by the claims of this application.

Claims (11)

1. A vehicle-mounted communication chip testing system, characterized in that the vehicle-mounted communication chip testing system includes a first host computer, a second host computer, a first single-chip computer, a second single-chip computer, a first power module, a second power module, a first communication chip, a second communication chip, a first non-wakeup chipset to be tested, and a second non-wakeup chipset to be tested; The first non-wakeup chipset to be tested is connected to the first host computer, the first microcontroller, the first power module and the second non-wakeup chipset to be tested respectively; the second non-wakeup chipset to be tested The non-wake-up chipset is connected to the second host computer, the second microcontroller and the second power module respectively; the first microcontroller is connected to the first power module; the second microcontroller is connected to the second power module. Two power modules are connected; the first communication chip is configured in the first non-wakeup chipset to be tested, and the second communication chip is configured in the second non-wakeup chipset to be tested. 2. The vehicle communication chip testing system according to claim 1, characterized in that, if the first non-wake-up chipset to be tested and the second non-wake-up chipset to be tested are tested for communication functions, the first non-wake-up chipset to be tested will be A host computer sends a first power-on control instruction to the first single-chip computer through the first communication chip, and the first single-chip computer performs enable control on the first power module through the first power-on control instruction, So that the first power module supplies power to the first non-wake-up chipset to be tested; the second host computer sends a second power-on control instruction to the second microcontroller through the second communication chip, so The second microcontroller enables the second power module to be controlled through the second power-on control instruction, so that the second power module supplies power to the second non-wakeup chipset to be tested; A host computer transmits the first test message to the first non-wakeup chipset to be tested, and controls the first non-wakeup chipset to be tested to send the first test message; the second host computer controls The second non-awakening chipset to be tested performs message reception to obtain a first message reception result; the second host computer determines the communication function test result based on the first message reception result. 3. The vehicle communication chip testing system according to claim 2, characterized in that the vehicle communication chip testing system further includes a first wake-up chipset to be tested and a second wake-up chipset to be tested; The first wake-up chipset to be tested is respectively connected to the first microcontroller, the first power module and the second wake-up chipset to be tested; the second wake-up chipset to be tested is connected to the second wake-up chipset respectively. The microcontroller is connected to the second power module; If a local wake-up function test is performed on the first wake-up chipset to be tested, the first host computer controls the first microcontroller through the first communication chip, so that the first microcontroller sends a signal to the third microcontroller. A wake-up chipset to be tested sends a local wake-up signal to locally wake up the first wake-up chipset to be tested; the first host computer transmits the second test message to the first through the first communication chip A single-chip microcomputer, the first single-chip computer transmits the second test message to the first wake-up chipset to be tested, and controls the first wake-up chipset to be tested to send the second test message; The second to-be-tested wake-up chipset performs message reception, obtains the second message reception result and transmits it to the second microcontroller, and the second microcontroller transmits the second message result to the second microcontroller through the second communication chip. The second host computer; the second host computer determines the local wake-up function test result according to the second message reception result. 4. The vehicle communication chip testing system according to claim 3, characterized in that the vehicle communication chip testing system further includes a connector; The first wake-up chipset to be tested is connected to the second wake-up chipset to be tested through the connector; the first non-wakeup chipset to be tested is connected to the second non-wakeup chipset to be tested through the connector. Chip set connection; the connector includes a first connector and a second connector, a wire harness is used to connect the first connector and the second connector, and the parameters of the wire harness meet preset conditions; If the remote wake-up function test is performed on the first wake-up chipset to be tested, the second host computer controls the second single-chip computer through the second communication chip, so that the second single-chip computer controls the second single-chip computer through the second communication chip. The second wake-up chipset to be tested sends a remote wake-up signal to the first wake-up chipset to be tested, and remotely wakes up the first wake-up chipset to be tested, the first power module and the first microcontroller; The first single-chip computer receives a message through the first wake-up chipset to be tested, and obtains a third message reception result and transmits it to the first host computer; the first host computer receives the third message according to the third message reception result. Determine the remote wake function test results. 5. The vehicle communication chip testing system according to claim 3, characterized in that the second host computer determines the communication function test result according to the first message reception result, including: If the first message reception result is empty, the communication function test result is abnormal; if the first message reception result is not empty, the communication function test result is normal; or, If the first message reception result is different from the preset message, the communication function test result is abnormal. If the first message reception result is the same as the preset message, the communication function test result is abnormal. The result is normal, and the first test message is a preset message. 6. The vehicle communication chip testing system according to claim 4, characterized in that if the communication function test result, the local wake-up function test result and the remote wake-up function test result are all normal, the communication rate is adjusted, To perform a first communication quality test on the first non-wakeup chipset to be tested, the second non-wakeup chipset to be tested, the first wakeup chipset to be tested, and the second wakeup chipset to be tested, The first communication quality test result is determined according to the message reception result after adjusting the communication rate. 7. The vehicle communication chip testing system according to claim 6, characterized in that if the first communication quality test result is good, the first non-wake-up chipset to be tested and the third non-wake-up chipset to be tested are tested based on different temperatures. The two non-wake-up chipsets to be tested, the first wake-up chipset to be tested, and the second wake-up chipset to be tested perform a second communication quality test, and the second communication quality test results are determined based on the message reception results at different temperatures. . 8. The vehicle communication chip testing system according to claim 7, characterized in that, if the second communication quality test result is good, the first non-awakening chipset to be tested and the first non-awakening chipset to be tested are tested based on different electromagnetic intensities. The second non-wake-up chipset to be tested, the first wake-up chipset to be tested, and the second wake-up chipset to be tested perform communication anti-interference capability testing, and the communication anti-interference capability is determined based on the message reception results under different electromagnetic intensities. Test Results. 9. The vehicle communication chip testing system according to any one of claims 3 to 8, characterized in that the first power module includes a first power supply, a first PMOS tube, a first inductor and a first system basis Chip; the first power supply is connected to the first PMOS tube, the first PMOS tube is connected to the first inductor, the first inductor is connected to the first system basic chip, and the first PMOS tube is connected to the first PMOS tube. A system basic chip is connected to the first single chip microcomputer, the first non-wake-up chipset to be tested, and the first wake-up chipset to be tested respectively; The second power module includes a second power supply, a second PMOS tube, a second inductor and a second system basis chip; the second power supply is connected to the second PMOS tube, and the second PMOS tube is connected to the A second inductor is connected, and the second inductor is connected to the second system basis chip. The second system basis chip is respectively connected to the second microcontroller, the second non-wakeup chipset to be tested, and the The second test is to wake up the chipset connection; The first system basis chip includes a first power converter, and the second system basis chip includes a second power converter. 10. The vehicle communication chip testing system according to any one of claims 3-8, wherein the chips in the chipset to be tested include at least one of a CAN chip and a LIN chip, and the chipset to be tested includes The first non-wakeup chipset under test, the second non-wakeup chipset under test, the first wakeup chipset under test and the second wakeup chipset under test. 11. The vehicle communication chip testing system according to claim 9, characterized in that the vehicle communication chip testing system further includes a first circuit board and a second circuit board; The first system basic chip, the first microcontroller, the first non-wake-up chipset to be tested, and the first wake-up chipset to be tested are configured in the first circuit board; The second system basic chip, the second microcontroller, the second non-wake-up chipset to be tested, and the second wake-up chipset to be tested are configured in the second circuit board.