CN116714124B - Back cutting device and back cutting method for monocrystalline silicon rod - Google Patents
Back cutting device and back cutting method for monocrystalline silicon rodInfo
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- CN116714124B CN116714124B CN202310889253.8A CN202310889253A CN116714124B CN 116714124 B CN116714124 B CN 116714124B CN 202310889253 A CN202310889253 A CN 202310889253A CN 116714124 B CN116714124 B CN 116714124B
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- cutting
- assembly
- silicon rod
- monocrystalline silicon
- sliding table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
一种单晶硅棒的返切装置及返切方法，包括矫正组件，滑台组件、切割组件；滑台组件包括滑轨、滑台和支撑轨，滑台可滑动的设置于滑轨的上方，支撑轨与滑轨平行；支撑轨设置于滑台两侧；滑台设有第一伸缩部，第一伸缩部用于控制滑台在竖直方向的运动；切割组件包括切割线锯，切割线锯设置于支撑轨的上方；矫正组件包括彼此配合的矫正气缸和定位板，矫正气缸和定位板分别设置于切割组件所在位置下端的支撑轨的两侧。本发明通过支撑轨对单晶硅棒的支撑以及矫正组件的定位，提高单晶硅棒的稳定性以及精度；通过滑台组件的顶升实现对单晶硅棒传输，配合切割组件，对单晶硅棒的切割料和余料进行分离和传输，从而实现返切效果。
A re-cutting device and method for monocrystalline silicon rods includes a straightening assembly, a sliding table assembly, and a cutting assembly. The sliding table assembly includes a slide rail, a sliding table, and a support rail. The sliding table is slidably disposed above the slide rail, and the support rail is parallel to the slide rail. The support rail is disposed on both sides of the sliding table. The sliding table has a first telescopic part for controlling the vertical movement of the sliding table. The cutting assembly includes a wire saw disposed above the support rail. The straightening assembly includes a straightening cylinder and a positioning plate that cooperate with each other. The straightening cylinder and the positioning plate are respectively disposed on both sides of the support rail at the lower end of the cutting assembly. This invention improves the stability and accuracy of the monocrystalline silicon rod by supporting it with the support rail and positioning it with the straightening assembly. The lifting of the sliding table assembly enables the transfer of the monocrystalline silicon rod, and in conjunction with the cutting assembly, the cut material and residual material of the monocrystalline silicon rod are separated and transferred, thereby achieving the re-cutting effect.
Description
Technical Field
The invention relates to the technical field of cutting of hard and brittle materials, in particular to a back cutting device and a back cutting method of a monocrystalline silicon rod.
Background
At present, with the development of new energy fields, green renewable energy is more and more emphasized, and the photovoltaic solar power generation field is more and more emphasized and developed. In the photovoltaic power generation field, a general crystalline silicon solar cell is manufactured on a silicon wafer of high quality monocrystalline silicon, which is cut by a wire saw after a silicon rod is pulled or cast, that is, a wire cutting technique.
In the prior art, the monocrystalline silicon rod needs to be corrected before slicing, the defective section is cut off in advance or the monocrystalline silicon rod is cut into sections with corresponding sizes according to slicing requirements, and excessive manpower is required for correcting the monocrystalline silicon rod in the market at present, so that the monocrystalline silicon rod is easily damaged, and waste is generated.
Disclosure of Invention
The invention aims to solve the technical problem of providing a back cutting device and a back cutting method for a monocrystalline silicon rod, which realize the back cutting operation of the monocrystalline silicon rod.
In order to solve the technical problems, the invention adopts the following technical scheme:
A back cutting device of a monocrystalline silicon rod comprises a correction component, a sliding table component and a cutting component;
The sliding table assembly comprises a sliding rail, a sliding table and a supporting rail, wherein the sliding table is slidably arranged above the sliding rail, and the supporting rail is parallel to the sliding rail;
The cutting assembly comprises a cutting wire saw, and the cutting wire saw is arranged above the supporting rail;
The correcting component comprises a correcting cylinder and a locating plate which are matched with each other, and the correcting cylinder and the locating plate are respectively arranged at the two sides of the supporting rail at the lower end or the front end of the position where the cutting component is located.
In order to solve the technical problems, the invention adopts another technical scheme that:
a method for back cutting a monocrystalline silicon rod is applied to a back cutting device of the monocrystalline silicon rod, and comprises the following steps:
s1, carrying out horizontal positioning correction on a monocrystalline silicon rod by using a correction assembly;
s2, cutting the monocrystalline silicon rod by using a cutting line of a cutting assembly;
S3, separating cutting materials and residual materials generated by the cut monocrystalline silicon rod by utilizing a sliding table assembly;
s4, controlling the cutting assembly to return.
The single crystal silicon rod back cutting device and the single crystal silicon rod back cutting method have the advantages that the stability and the precision of the single crystal silicon rod are improved through the support of the support rail on the single crystal silicon rod and the positioning of the correction assembly, the single crystal silicon rod is conveyed through the lifting of the sliding table assembly, and the cutting materials and the residual materials of the single crystal silicon rod are separated and conveyed through the cooperation of the cutting assembly, so that the back cutting effect is achieved.
Drawings
FIG. 1 is a schematic view of a back-cutting apparatus for a silicon single crystal rod according to an embodiment of the present invention;
FIG. 2 is a partial enlarged view A of FIG. 1;
FIG. 3 is an enlarged view B of a portion of FIG. 2;
FIG. 4 is a schematic diagram showing a structure of a back-cutting apparatus for a silicon single crystal rod according to an embodiment of the present invention;
FIG. 5 is a schematic view showing the structure of a suction cup assembly of a back-cutting apparatus for a silicon single crystal rod according to an embodiment of the present invention;
FIG. 6 is a side view of a back-cutting apparatus for a single crystal silicon rod according to an embodiment of the present invention;
FIG. 7 is a schematic view showing a structure of a slide table and a slide rail of a back cutting device for a silicon single crystal rod according to an embodiment of the present invention;
Description of the reference numerals:
2. a slipway assembly; 3, a cutting assembly, 4, a sensor assembly;
5. A suction cup assembly;
11. A correction cylinder 12, a positioning plate;
111. 112, a second correcting cylinder;
121. 122, a second positioning plate;
21. A slide rail; 22, a sliding table, 23, a supporting rail, 24, a first telescopic part;
231. a ball support rail; 232, flexible support rail, 233, ball fixing plate;
234. 235, ball fixing grooves;
31. cutting a wire saw;
41. a feeding sensor, a discharging sensor, a distance sensing sensor and a distance sensing sensor;
51. Negative pressure sucker 52, second telescopic part.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 7, a back cutting device for a single crystal silicon rod comprises a correction assembly, a sliding table assembly 2 and a cutting assembly 3;
The sliding table assembly 2 comprises a sliding rail 21, a sliding table 22 and a supporting rail 23, wherein the sliding table 22 is slidably arranged above the sliding rail 21, and the supporting rail 23 is parallel to the sliding rail 21;
the cutting assembly 3 comprises a cutting wire saw 31, the cutting wire saw 31 being arranged above the support rail 23;
The correcting component comprises a correcting air cylinder 11 and a positioning plate 12 which are matched with each other, and the correcting air cylinder 11 and the positioning plate 12 are respectively arranged on two sides of the supporting rail 23 at the lower end or the front end of the position of the cutting component 3.
From the description, the invention has the beneficial effects of providing the back cutting device and the back cutting method for the monocrystalline silicon rod, improving the stability and the precision of the monocrystalline silicon rod by supporting the monocrystalline silicon rod by the supporting rail and positioning the correcting component, realizing the transmission of the monocrystalline silicon rod by the lifting of the sliding table component, and realizing the back cutting effect by transmitting the cutting materials and the residual materials generated after the monocrystalline silicon rod is cut by matching with the cutting component.
Further, the support rail 23 includes a ball support rail 231 and a flexible support rail 232 which are assembled and connected in the axial direction of the slide rail 21;
The correcting cylinder comprises a first correcting cylinder 111 and a second correcting cylinder 112, the positioning plates comprise a first positioning plate 121 and a second positioning plate 122, the ball bearing support rail 231 is arranged between the first correcting cylinder 111 and the first positioning plate 121, and the flexible support rail 232 is arranged between the second correcting cylinder 112 and the second positioning plate 122.
As can be seen from the above description, in one embodiment of the present invention, in order to match with the smoothness of the operation of the correction assembly, the support rail 23 is divided into a ball support rail 231 and a flexible support rail 232 which are axially connected, the ball support rail 231 is disposed between the first correction cylinder 111 and the first positioning plate 121, and the flexible support rail 232 is disposed between the second correction cylinder 112 and the second positioning plate 122, so that the first correction cylinder 111 pushes the monocrystalline silicon rod to the first positioning plate 121 for preliminary positioning, the movement amplitude of the monocrystalline silicon rod is larger in the preliminary positioning process, in order to prevent the support rail from wearing the monocrystalline silicon rod, the ball support rail 231 is specially disposed, the friction force on the monocrystalline silicon rod in the movement process is reduced, the movement amplitude of the monocrystalline silicon rod in the preliminary positioning process is smaller, and in order to prevent the inertia force from causing adverse effects on the monocrystalline silicon rod in the movement process, the flexible support rail 232 cooperates with the second correction cylinder 112 and the second positioning plate 122, i.e. to prevent excessive inertia force on the monocrystalline silicon rod from being slowly moved.
Specifically, in order to facilitate the preliminary positioning of the single crystal silicon rod by the first correction cylinder and the first positioning plate 121, in one embodiment of the present invention, the starting point of the ball support rail 231 is set to a zero position, and a scale is set from the zero position.
Further, the ball support rail 231 includes a ball fixing plate 233 and balls 234, the ball fixing plate 233 has ball fixing grooves 235 on an upper surface thereof in a fixed interval in an axial direction, and the balls 234 are disposed in the ball fixing grooves 235 and protrude from the upper surface of the ball fixing plate 233.
As can be seen from the above description, the ball support rail 231 accommodates the balls 234 through the ball fixing grooves 235 on the ball fixing plate 233, wherein the ball fixing grooves 235 are uniformly distributed on the ball fixing plate 233 in the axial direction, and the balls 234 protrude from the upper surface of the ball fixing plate 233 to directly contact the single crystal silicon rod, thereby improving the smoothness of sliding between the single crystal silicon rod and the ball support rail 231.
Further, the device also comprises a sensor assembly 4, wherein the sensor assembly 4 comprises a feeding sensor 41, a discharging sensor 42 and a distance sensing sensor 43;
the feeding sensor 41 is opposite to the first correction cylinder 111;
the blanking sensor 42 is arranged at the rear of the cutting assembly 3;
the distance sensing sensor 43 is located between the first correction cylinder 111 and the second correction cylinder 112.
As can be seen from the foregoing description, in one embodiment of the present invention, the back cutting device is further provided with a sensor assembly 4 to implement automation of the back cutting device, wherein the back cutting device includes a feeding sensor 41, a discharging sensor 42 and a distance sensing sensor 43, the feeding sensor and the discharging sensor are used for detecting whether a single crystal silicon rod exists at corresponding positions, so as to start or transfer the single crystal silicon rod, the feeding sensor 41 is opposite to the first correction cylinder 111, preliminary positioning is performed only when the single crystal silicon rod is detected at the position of the first correction cylinder 111, the discharging sensor 42 is located at the rear of the cutting assembly 3 along the axial direction of the rail, so as to detect whether cut materials generated after cutting are transported to a discharging area, so as to perform subsequent discharging operations, and the distance sensing sensor 43 is used for sensing the transportation distance of the single crystal silicon rod in the axial direction of the sliding rail 21, so as to conveniently control stopping the single crystal silicon rod at a preset cutting position, and subsequently operating the second correction cylinder 112 to perform final positioning.
Further, the vacuum chuck assembly comprises a suction cup assembly 5, the suction cup assembly 5 is slidably arranged at the rear end of the sliding rail 21, a negative pressure suction cup 51 is arranged on the end face, perpendicular to the axis of the sliding rail 21, of the suction cup assembly 5, and a second telescopic part 52 is arranged on the negative pressure suction cup 51 along the axis direction of the sliding rail 21.
As is apparent from the above description, in order to prevent the size of the cut material generated after cutting from being too small, toppling over occurs after cutting, resulting in breakage of the silicon single crystal rod, the fly-back cutting apparatus is further provided with a suction cup assembly 5, the suction cup assembly 5 is provided at the end of the slide rail 21, and is moved toward the cut material during operation, and the end face of the cut material is sucked by the negative pressure suction cup 51, wherein the suction principle is that when the negative pressure suction cup 51 reaches a preset distance from the end face of the cut material, the suction cup is slowly pushed to the end face of the cut material by the second telescopic part 52, thereby completing the suction.
A method for back cutting a monocrystalline silicon rod is applied to a back cutting device of the monocrystalline silicon rod, and comprises the following steps:
s1, carrying out horizontal positioning correction on a monocrystalline silicon rod by using a correction assembly;
S2, cutting the monocrystalline silicon rod by using a cutting line of the cutting assembly 3;
s3, separating cutting materials and residual materials generated by the cut monocrystalline silicon rod by utilizing a sliding table assembly 2;
S4, controlling the cutting assembly 3 to return.
From the above description, the correction component is used for horizontally positioning and correcting the monocrystalline silicon rod, so that the cutting position of the monocrystalline silicon rod is determined, the cutting component 3 is controlled to cut the monocrystalline silicon rod, the cut materials and the residual materials are separated by the sliding table component 2 after cutting, and finally the cutting component 3 is controlled to return to the original position, so that the back cutting effect of the monocrystalline silicon rod is realized.
Further, the step S1 is specifically implemented;
S11, pushing the monocrystalline silicon rod against the first positioning plate 121 by using the first correction cylinder 111;
s12, controlling the first correction cylinder 111 to retract;
s13, simultaneously starting the sliding table assembly 2 and the sensor assembly 4, and stopping the sliding table assembly 2 after detecting that the monocrystalline silicon rod moves for a preset positioning distance;
s14, the monocrystalline silicon rod is propped against the second positioning plate 122 by using the second correcting air cylinder 112.
As can be seen from the above description, the correction positioning process of the correction assembly is divided into two steps, the first step is to initially position the silicon single crystal rod by the first correction cylinder 111, specifically to push the silicon single crystal rod by the first correction cylinder 111 until the side surface of the silicon single crystal rod contacts the first positioning plate 121 to complete the positioning, after the initial positioning is completed, the first correction cylinder 111 retracts, the silicon single crystal rod is lifted up by the sliding table assembly 2 and transported to the corresponding position of the second correction cylinder 112, the moving process is detected by the distance sensing sensor 43 in the sensor assembly 4, when the silicon single crystal rod is detected to reach the preset cutting distance, the sliding table assembly 2 is controlled to stop moving, the first telescopic part 24 of the sliding table assembly 2 is controlled to retract to the original position, the silicon single crystal rod is placed on the flexible supporting rail 232, and then the second correction cylinder 112 and the second positioning plate 122 are used to finally position the silicon single crystal rod, and the section of the silicon rod can be kept vertical according to the production requirement.
Further, the step S3 specifically includes:
S31, controlling the second correcting cylinder 112 to retract;
s32, lifting the excess materials by utilizing the sliding table assembly 2, backing the excess materials along the sliding rail 21 by a preset line backing distance, and then putting down the excess materials;
s33, lifting the cutting material by utilizing the sliding table assembly 2, and putting down the cutting material after the cutting material advances to a blanking area along the sliding rail 21.
As is apparent from the above description, the second rectification cylinder 112 maintains the clamping of the single crystal silicon rod during the cutting process, thereby preventing the shaking of the single crystal silicon rod, after the cutting is completed, the slide table assembly 2 lifts up the surplus material generated after the cutting and returns the preset wire withdrawal distance along the slide rail 21, then lowers the surplus material, leaves a wire withdrawal space for the wire saw in the cutting assembly 3, and then lifts up and conveys the cut material to the blanking area for blanking, thereby completing the separation process of the surplus material and the cut material.
Further, step S30 is further included between step S2 and step S3, and the step S30 specifically includes:
S301, when the length of the monocrystalline silicon rod is detected to be smaller than a preset size, controlling the sucker assembly 5 to approach the monocrystalline silicon rod from a blanking area along the sliding rail 21;
s302, when a sensor of the sucker assembly detects the end face of the monocrystalline silicon rod, controlling the sucker assembly to reduce the moving speed and continuously approaching to the monocrystalline silicon rod;
And S303, controlling the sucker to conduct negative pressure adsorption on the monocrystalline silicon rod when the sensor of the sucker assembly 5 detects that the distance between the sensor and the end face of the monocrystalline silicon rod is smaller than or equal to the preset adsorption distance.
As is apparent from the above description, in order to prevent the cut material from being excessively small in length, a toppling phenomenon occurs, and when it is detected that the cut length of the single crystal silicon rod is smaller than a preset size, the suction cup assembly 5 is controlled to suction-fix the cut material generated after the single crystal silicon rod is cut, preventing toppling.
Further, step S4 is followed by step S5:
S5, when the cutting requirement is detected, the sliding table assembly 2 sends the residual materials to the positioning position, the step S2 is returned, and otherwise, the residual materials are subjected to blanking treatment.
As can be seen from the above description, in one embodiment of the present invention, when the cutting requirement is detected, the residual material is returned to the positioning position under the detection of the sensor assembly 4, where the positioning position is the positioning position of the first correction cylinder 111 or the positioning position of the second correction cylinder 112, and then the subsequent step is continued in step S2, and if the cutting requirement is not met again, the residual material can be subjected to the blanking process.
The invention provides a back-cutting device and a back-cutting method of a monocrystalline silicon rod, which are mainly applied to the back-cutting field of the monocrystalline silicon rod, and specifically described below by combining with an embodiment:
Referring to fig. 1 to 7, a first embodiment of the present invention is as follows:
the back cutting device of the monocrystalline silicon rod comprises a correction component, a sliding table component 2 and a cutting component 3;
the sliding table assembly 2 comprises a sliding rail 21, a sliding table 22 and a supporting rail, wherein the sliding table 22 is slidably arranged above the sliding rail 21, and the supporting rail 23 is parallel to the sliding rail 21;
The cutting assembly 3 comprises a cutting wire saw 31, the cutting wire saw 31 being arranged above the support rail 23;
the straightening assembly comprises a straightening cylinder 11 and a positioning plate 12 which are matched with each other, and the straightening cylinder 11 and the positioning plate 12 are respectively arranged on two sides of a supporting rail at the lower end or the front end of the position where the cutting assembly 3 is arranged.
In the embodiment, the back cutting device and the back cutting method for the monocrystalline silicon rod are provided, the stability and the precision of the monocrystalline silicon rod are improved through the support of the support rail on the monocrystalline silicon rod and the positioning of the correction assembly, the monocrystalline silicon rod is conveyed through the lifting of the sliding table assembly 2, and the cutting materials and the residual materials of the monocrystalline silicon rod are separated and conveyed by matching with the cutting assembly 3, so that the back cutting effect is achieved.
Referring to fig. 1 to 7, in a second embodiment of the present invention, on the basis of the first embodiment, the support rail includes a ball support rail 231 and a flexible support rail 232 assembled and connected along the axial direction of the slide rail 21;
The correcting cylinder comprises a first correcting cylinder 111 and a second correcting cylinder 112, the positioning plates comprise a first positioning plate 121 and a second positioning plate 122, a ball bearing rail 231 is arranged between the first correcting cylinder 111 and the first positioning plate 121, a flexible bearing rail 232 is arranged between the second correcting cylinder 112 and the second positioning plate 122, the ball bearing rail 231 comprises a ball fixing plate 233 and balls 234, ball fixing grooves 235 are sequentially formed in the upper surface of the ball fixing plate 233 along the axis direction according to fixed intervals, and the balls are arranged in the ball fixing grooves 235 and protrude out of the upper surface of the ball fixing plate 233.
In this embodiment, in order to match the smoothness of the operation of the correction assembly, the support rail is divided into a ball support rail 231 and a flexible support rail 232 which are axially connected, the ball support rail 231 is disposed between the first correction cylinder 111 and the first positioning plate 121, the flexible support rail 232 is disposed between the second correction cylinder 112 and the second positioning plate 122, the purpose is that the first correction cylinder 111 pushes the monocrystalline silicon rod to the first positioning plate 121 for preliminary positioning, the movement amplitude of the monocrystalline silicon rod is larger in the preliminary positioning process, in order to prevent the support rail from wearing the monocrystalline silicon rod, the ball support rail 231 is specially arranged, the friction force on the monocrystalline silicon rod in the movement process is reduced, the movement amplitude of the monocrystalline silicon rod in the repositioning correction process is smaller after the preliminary positioning is performed, and in order to prevent the inertia force from causing adverse effects on the monocrystalline silicon rod in the movement process, the flexible support rail 232 is matched with the second correction cylinder 112 and the second positioning plate 122, namely, the slow movement of the monocrystalline silicon rod is satisfied, and excessive inertia force on the monocrystalline silicon rod is prevented. In addition, the ball support rail 231 accommodates the balls 234 through the ball fixing grooves 235 on the ball fixing plate 233, wherein the ball fixing grooves 235 are uniformly distributed on the ball fixing plate 233 along the axial direction, and the balls protrude out of the upper surface of the ball fixing plate 233 to directly contact with the single crystal silicon rod, thereby improving the smoothness of sliding between the single crystal silicon rod and the ball support rail 231.
Referring to fig. 1 to 7, a third embodiment of the present invention further includes a sensor assembly 4 based on the second embodiment, wherein the sensor assembly 4 includes a feeding sensor 41, a discharging sensor 42 and a distance sensing sensor 43;
The feeding sensor 41 is opposite to the first correction cylinder 111;
the blanking sensor 42 is arranged at the rear of the cutting assembly 3;
The distance sensing sensor 43 is located between the first correction cylinder 111 and the second correction cylinder 112.
Still include sucking disc subassembly 5, sucking disc subassembly 5 slidable sets up in the rear end of slide rail 21, and the terminal surface of sucking disc subassembly 5 perpendicular to slide rail 21 axis is equipped with negative pressure sucking disc 51, is equipped with second telescopic part 52 along slide rail 21 axis direction on the negative pressure sucking disc 51.
That is, in this embodiment, the back cutting device is further provided with a sensor assembly 4 to realize automation of the back cutting device, wherein the back cutting device comprises a feeding sensor 41, a discharging sensor 42 and a distance sensing sensor 43, the feeding sensor 42 and the discharging sensor 42 are used for detecting whether a monocrystalline silicon rod exists at corresponding positions so as to start or transfer the monocrystalline silicon rod, the feeding sensor 41 is opposite to the first correction cylinder 111 and performs preliminary positioning only when the monocrystalline silicon rod is detected at the position of the first correction cylinder 111, the discharging sensor 42 is located at the rear of the cutting assembly 3 along the axial direction of the rail and is used for detecting whether cut materials generated after cutting are transported to a discharging area so as to perform subsequent discharging operation, the distance sensing sensor 43 is used for sensing the transportation distance of the monocrystalline silicon rod in the axial direction of the sliding rail 21 so as to conveniently control the monocrystalline silicon rod to stop at a preset cutting position, and the second correction cylinder 112 is subsequently operated to perform final positioning. Specifically, when the blanking sensor detects that materials exist, a signal of blanking n (n is the cutting times) is transmitted, the number of the generated cutting materials is recorded, when no back cutting requirement exists, the blanking sensor transmits a signal of blanking n+1, the cutting materials and the residual materials are separated in the blanking time zone, data are provided for the upstream and downstream processes, and automation of the whole process flow is achieved.
In addition, in order to prevent the size of the cut material generated after cutting from being too small, the cut material is toppled down after cutting to cause breakage of the monocrystalline silicon rod, the back cutting device is further provided with a sucker assembly 5, the sucker assembly 5 is arranged at the tail end of the sliding rail 21, and moves towards the cut material during operation, the end face of the cut material is adsorbed by utilizing the negative pressure sucker 51, wherein the adsorption principle is that when the negative pressure sucker 51 and the end face of the cut material reach a preset distance, the sucker is slowly pushed to the end face of the cut material by utilizing the second telescopic part 52, so that the adsorption is completed.
Referring to fig. 1 to 7, a fourth embodiment of the present invention is a method for back cutting a silicon single crystal rod, which is applied to the back cutting apparatus of any one of the first to third embodiments, and includes the following steps:
s1, carrying out horizontal positioning correction on a monocrystalline silicon rod by using a correction assembly;
S2, cutting the monocrystalline silicon rod by using a cutting line of the cutting assembly 3;
s3, separating cutting materials and residual materials generated by the cut monocrystalline silicon rod by utilizing a sliding table assembly 2;
S4, controlling the cutting assembly 3 to return.
In this embodiment, the correction component is used for horizontally positioning and correcting the monocrystalline silicon rod, so that the cutting position of the monocrystalline silicon rod is determined, the cutting component 3 is controlled to cut the monocrystalline silicon rod, the cut materials and the residual materials are separated by the sliding table component 2 after cutting, and finally the cutting component 3 is controlled to return to a position, so that the back cutting effect of the monocrystalline silicon rod is realized.
Referring to fig. 1 to 7, in a fifth embodiment of the present invention, based on the fourth embodiment, step S1 is specifically performed;
S11, pushing the monocrystalline silicon rod against the first positioning plate 121 by using the first correction cylinder 111;
s12, controlling the first correction cylinder 111 to retract;
s13, simultaneously starting the sliding table assembly 2 and the sensor assembly 4, and stopping the sliding table assembly 2 after detecting that the monocrystalline silicon rod moves for a preset positioning distance;
The step S3 specifically comprises the following steps:
S31, controlling the second correcting cylinder 112 to retract;
s32, lifting the excess materials by utilizing the sliding table assembly 2, backing the excess materials along the sliding rail 21 by a preset line backing distance, and then putting down the excess materials;
s33, lifting the cutting material by utilizing the sliding table assembly 2, and putting down the cutting material after the cutting material advances to a blanking area along the sliding rail 21.
In this embodiment, the correcting and positioning process of the correcting assembly is divided into two steps, the first step is to initially position the monocrystalline silicon rod through the first correcting cylinder 111, specifically, the monocrystalline silicon rod is pushed by the first correcting cylinder 111 until the side surface of the monocrystalline silicon rod contacts the first positioning plate 121 to finish positioning, after the initial positioning is finished, the first correcting cylinder 111 retracts, the monocrystalline silicon rod is lifted up by the sliding table assembly 2 and transported to the corresponding position of the second correcting cylinder 112, the moving process is detected by the distance sensing sensor 43 in the sensor assembly 4, when the monocrystalline silicon rod is detected to reach the preset cutting distance, the sliding table assembly 2 is controlled to stop moving, the first telescopic part 24 of the sliding table assembly 2 is controlled to retract to the original position, the monocrystalline silicon rod is placed on the flexible supporting rail 232, and then the monocrystalline silicon rod is finally positioned by the second correcting cylinder 112 and the second positioning plate 122.
Meanwhile, the second correcting cylinder 112 keeps clamping the monocrystalline silicon rod in the cutting process, so that shaking of the monocrystalline silicon rod is prevented, after cutting is completed, the sliding table assembly 2 lifts up the residual materials generated after cutting and returns a preset wire withdrawal distance along the sliding rail 21, then the residual materials are put down, a wire withdrawal space is reserved for a wire saw in the cutting assembly 3, and then the cut materials are lifted up and conveyed to a blanking area for blanking, so that the separation process of the residual materials and the cut materials is completed.
Referring to fig. 1 to 7, a sixth embodiment of the present invention is that, on the basis of the fifth embodiment, step S30 is further included between step S2 and step S3, and step S30 is specifically:
S301, when the length of the monocrystalline silicon rod is detected to be smaller than a preset size, controlling the sucker assembly 5 to approach the monocrystalline silicon rod from a blanking area along the sliding rail 21;
s302, when a sensor of the sucker assembly detects the end face of the monocrystalline silicon rod, controlling the sucker assembly to reduce the moving speed and continuously approaching to the monocrystalline silicon rod;
And S303, controlling the sucker to conduct negative pressure adsorption on the monocrystalline silicon rod when the sensor of the sucker assembly 5 detects that the distance between the sensor and the end face of the monocrystalline silicon rod is smaller than or equal to the preset adsorption distance.
That is, in this embodiment, in order to prevent the cut material from being too small in length, a dumping phenomenon occurs, and when it is detected that the cut length of the single crystal silicon rod is smaller than the preset size, the suction cup assembly 5 is controlled to adsorb and fix the cut material generated after the single crystal silicon rod is cut, so as to prevent dumping.
Referring to fig. 1 to 7, in a seventh embodiment of the present invention, based on the sixth embodiment, S5, when it is detected that there is still a cutting requirement, the sliding table assembly 2 sends the remainder to the positioning position, and returns to step S2, otherwise, the remainder is subjected to blanking.
In this embodiment, when it is detected that there is still a cutting requirement, the surplus material is returned to the positioning position under the detection of the sensor assembly 4, where the positioning position is the positioning position of the first correction cylinder 111 or the positioning position of the second correction cylinder 112, and then the process returns to step S2 to continue with the subsequent steps, and if there is no requirement for cutting again, the surplus material can be subjected to blanking treatment.
Preferably, in this embodiment, a back-cutting device for a single crystal silicon rod is combined with a back-cutting method, and the specific steps are as follows:
1. before the device operates, the self-checking reset is firstly carried out, and comprises a sliding table component 2, a sucker component 5, a reset corresponding to the telescopic part, a self-checking of a cutting component 3 and a self-checking of a sensor component 4, and if the device is abnormal, a ready signal is sent out.
2. The monocrystalline silicon rod is placed in the feeding area, after the feeding sensor 41 sends out a signal, the first correction cylinder 111 is started, the monocrystalline silicon rod is propped against the first positioning plate 121 by matching with the ball support rail 231, and after preliminary positioning is completed, the first correction cylinder 111 is controlled to retract.
3. The first telescopic part 24 of the control sliding table 22 lifts the monocrystalline silicon rod by a certain distance, after the monocrystalline silicon rod is guaranteed to be separated from the ball supporting rail 231, the control sliding table assembly 2 moves the monocrystalline silicon rod to an action area of the second correcting cylinder 112, during the movement, the distance sensing sensor 43 monitors the movement distance of the monocrystalline silicon rod, after the monocrystalline silicon rod moves by a preset distance (namely reaches a preset cutting position), the first telescopic part 24 is controlled to retract, the flexible supporting rail 232 provides support for the monocrystalline silicon rod, and at the moment, the sliding table 22 returns to a zero position (the cutting is prevented from being influenced) and the second correcting cylinder 112 is controlled to finish secondary positioning for the monocrystalline silicon rod.
4. After the secondary correction is completed, the second correction cylinder 112 maintains a clamping state, and controls the wire saw in the cutting assembly 3 to drop in the vertical direction to cut the monocrystalline silicon rod, preferably, the cutting assembly 3 further comprises a spraying part and a purging part, the spraying part is arranged at the top end of the wire saw and used for cooling and cleaning the wire saw during cutting, and the purging part is arranged at the rear end of the wire saw and used for drying and cleaning the monocrystalline silicon rod to be discharged after cutting is completed.
5. After cutting is completed, the second correcting cylinder 112 is retracted, the sliding table 22 moves to the lower side of the residual material, the sliding table 22 is lifted up and then retreats by a preset distance, a wire withdrawing space of the wire saw is reserved, after the wire withdrawing space reaches the corresponding position, the residual material is put down, and after the blanking sensor 42 detects that the blanking area is free of the material, the sliding table 22 is controlled to lift up the cut material and move to the blanking area.
6. And controlling the wire saw of the cutting assembly 3 to withdraw the wire and returning to the initial position.
7. Detecting whether the subsequent cutting requirement exists on the residual materials, if the cutting requirement exists, sending the residual materials to a cutting position, clamping the residual materials by a second correcting cylinder 112, returning to the step 4, and if the cutting requirement is not detected, arranging the residual materials for blanking.
In addition, when the cut single crystal silicon rod is smaller than the first preset length, the suction cup assembly 5 is controlled to operate. The method comprises the following steps of controlling the sucker assembly 5 to gradually approach the cutting material along the slideway after cutting is completed, controlling the negative pressure sucker 51 to extend until the negative pressure sucker 51 contacts the end face of the cutting material after a sensor of the sucker assembly 5 detects that the cutting material reaches a preset position, and completing adsorption, wherein the follow-up sucker assembly 5 cooperates with the sliding table 22 to complete jacking and moving, and preferably, the first telescopic part 24 and the second telescopic part 52 are telescopic cylinders.
In summary, the device and the method for back cutting the monocrystalline silicon rod, provided by the invention, have the advantages that the stability and the precision of the monocrystalline silicon rod are improved through the support of the support rail on the monocrystalline silicon rod and the positioning of the correction component, the monocrystalline silicon rod is conveyed through the lifting of the sliding table component, and the cutting materials and the residual materials of the monocrystalline silicon rod are separated and conveyed by matching with the cutting component, so that the back cutting effect is realized.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent changes made by the specification and drawings of the present invention, or direct or indirect application in the relevant art, are included in the scope of the present invention.
Claims (9)
1. The back cutting device of the monocrystalline silicon rod is characterized by comprising a correction assembly, a sliding table assembly and a cutting assembly;
The sliding table assembly comprises a sliding rail, a sliding table and a supporting rail, wherein the sliding table is slidably arranged above the sliding rail, and the supporting rail is parallel to the sliding rail;
The cutting assembly comprises a cutting wire saw, and the cutting wire saw is arranged above the supporting rail;
the correcting assembly comprises a correcting air cylinder and a positioning plate which are matched with each other, and the correcting air cylinder and the positioning plate are respectively arranged at two sides of the supporting rail at the lower end or the front end of the position where the cutting assembly is positioned;
The support rail comprises a ball support rail and a flexible support rail which are assembled and connected along the axis direction of the sliding rail;
The correcting cylinder comprises a first correcting cylinder and a second correcting cylinder, the positioning plate comprises a first positioning plate and a second positioning plate, the ball bearing support rail is arranged between the first correcting cylinder and the first positioning plate, and the flexible support rail is arranged between the second correcting cylinder and the second positioning plate.
2. The back cutting device of the monocrystalline silicon rod as set forth in claim 1, wherein the ball support rail comprises a ball fixing plate and balls, the ball fixing plate is provided with ball fixing grooves on the upper surface thereof in sequence along the axis direction at fixed intervals, and the balls are disposed in the ball fixing grooves and protrude out of the upper surface of the ball fixing plate.
3. The back-cutting device of the monocrystalline silicon rod as recited in claim 1, further comprising a sensor assembly, wherein the sensor assembly comprises a feeding sensor, a discharging sensor and a distance sensing sensor;
the feeding sensor is relatively aligned with the first correcting cylinder;
the blanking sensor is arranged at the rear of the cutting assembly;
The distance sensing sensor is located between the first correcting cylinder and the second correcting cylinder.
4. The back cutting device of the monocrystalline silicon rod as recited in claim 1, further comprising a sucker assembly slidably disposed at the rear end of the sliding rail, wherein a negative pressure sucker is disposed on an end surface of the sucker assembly perpendicular to the axis of the sliding rail, and a second telescopic part is disposed on the negative pressure sucker along the axis direction of the sliding rail.
5. A method for back cutting a single crystal silicon rod, which is applied to the back cutting device of the single crystal silicon rod as set forth in any one of claims 1 to 3, and is characterized by comprising the following steps:
s1, carrying out horizontal positioning correction on a monocrystalline silicon rod by using a correction assembly;
s2, cutting the monocrystalline silicon rod by using a cutting line of a cutting assembly;
S3, separating cutting materials and residual materials generated by the cut monocrystalline silicon rod by utilizing a sliding table assembly;
s4, controlling the cutting assembly to return.
6. The method for back-cutting a silicon single crystal rod according to claim 5, wherein the step S1 is specifically;
s11, propping the monocrystalline silicon rod against a first positioning plate by using a first correction cylinder;
S12, controlling the first correcting cylinder to retract;
S13, simultaneously starting the sliding table assembly and the sensor assembly, and stopping the sliding table assembly after detecting that the monocrystalline silicon rod moves for a preset positioning distance;
s14, the monocrystalline silicon rod is propped against the second positioning plate by using the second correcting air cylinder.
7. The method for back cutting a silicon single crystal rod according to claim 6, wherein the step S3 is specifically:
s31, controlling the second correcting cylinder to retract;
S32, lifting the residual materials by utilizing the sliding table assembly, backing the residual materials along the sliding rail by a preset line backing distance, and then putting down the residual materials;
s33, lifting the cutting material by utilizing the sliding table assembly, advancing the cutting material to the blanking area along the sliding rail, and then putting down the cutting material.
8. The method for back-cutting a silicon single crystal rod according to claim 7, wherein:
The back cutting device of the monocrystalline silicon rod further comprises a sucker assembly, the sucker assembly is slidably arranged at the rear end of the sliding rail, a negative pressure sucker is arranged on the end face, perpendicular to the axis of the sliding rail, of the sucker assembly, and a second telescopic part is arranged on the negative pressure sucker along the axis direction of the sliding rail;
step S30 is further included between step S2 and step S3, and the step S30 specifically includes:
S301, when the length of the monocrystalline silicon rod is detected to be smaller than a preset size, controlling the sucker assembly to approach the monocrystalline silicon rod from the blanking area along the sliding rail;
s302, when a sensor of the sucker assembly detects the end face of the monocrystalline silicon rod, controlling the sucker assembly to reduce the moving speed and continuously approaching to the monocrystalline silicon rod;
S303, when the sensor of the sucker assembly detects that the distance between the sensor and the end face of the monocrystalline silicon rod is smaller than or equal to the preset adsorption distance, controlling the sucker to conduct negative pressure adsorption on the monocrystalline silicon rod.
9. The method for back-cutting a silicon single crystal rod according to claim 5, wherein the step S4 is followed by the step S5 of:
s5, when the cutting requirement is detected, the sliding table component sends the residual materials to the positioning position, the step S2 is returned, and otherwise, the residual materials are subjected to blanking treatment.
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| CN209580125U (en) * | 2018-12-26 | 2019-11-05 | 福州天瑞线锯科技有限公司 | A kind of positioning of silicon single crystal rod and Qu Pian mechanism |
| CN214773077U (en) * | 2021-06-15 | 2021-11-19 | 济南一刻数控科技有限公司 | Five cutting machines of assembly line |
| CN219163354U (en) * | 2022-12-22 | 2023-06-09 | 台晶(宁波)电子有限公司 | Quartz wafer feeder |
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| JPH07256632A (en) * | 1994-03-25 | 1995-10-09 | Sumitomo Sitix Corp | Wafer supporting method and wafer supporting device in slicing machine |
| CN209408987U (en) * | 2018-09-27 | 2019-09-20 | 天津众晶半导体材料有限公司 | A kind of tool cutting device of achievable vacuum suction |
| CN214266216U (en) * | 2020-12-04 | 2021-09-24 | 福州天瑞线锯科技有限公司 | Single crystal silicon rod waiting platform and single crystal silicon rod squaring machine |
| CN214898384U (en) * | 2021-03-24 | 2021-11-26 | 厦门云天半导体科技有限公司 | Bearing jig compatible with wafers of multiple specifications |
| CN113334597B (en) * | 2021-06-28 | 2024-07-12 | 福州天瑞线锯科技有限公司 | Cutter lifting and sheet taking mechanism |
| CN217862169U (en) * | 2022-06-23 | 2022-11-22 | 福州天瑞线锯科技有限公司 | Single crystal bar supporting mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209580125U (en) * | 2018-12-26 | 2019-11-05 | 福州天瑞线锯科技有限公司 | A kind of positioning of silicon single crystal rod and Qu Pian mechanism |
| CN214773077U (en) * | 2021-06-15 | 2021-11-19 | 济南一刻数控科技有限公司 | Five cutting machines of assembly line |
| CN219163354U (en) * | 2022-12-22 | 2023-06-09 | 台晶(宁波)电子有限公司 | Quartz wafer feeder |
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