CN116665973B - Self-adhesive insulating ultrafine wire, coil and electric and electronic equipment - Google Patents
Self-adhesive insulating ultrafine wire, coil and electric and electronic equipment Download PDFInfo
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- CN116665973B CN116665973B CN202310928416.9A CN202310928416A CN116665973B CN 116665973 B CN116665973 B CN 116665973B CN 202310928416 A CN202310928416 A CN 202310928416A CN 116665973 B CN116665973 B CN 116665973B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 239000012790 adhesive layer Substances 0.000 claims abstract description 44
- 239000000203 mixture Substances 0.000 claims abstract description 40
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 62
- 229920006122 polyamide resin Polymers 0.000 claims description 43
- 229920001568 phenolic resin Polymers 0.000 claims description 42
- 239000005011 phenolic resin Substances 0.000 claims description 42
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 41
- 239000012752 auxiliary agent Substances 0.000 claims description 37
- 239000002966 varnish Substances 0.000 claims description 29
- -1 monophenol compound Chemical class 0.000 claims description 9
- 239000003973 paint Substances 0.000 claims description 9
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 claims description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 4
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- 125000003944 tolyl group Chemical group 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 150000001896 cresols Chemical class 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 abstract description 5
- 229920002647 polyamide Polymers 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 23
- 229930003836 cresol Natural products 0.000 description 23
- 238000012360 testing method Methods 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- LCHYEKKJCUJAKN-UHFFFAOYSA-N 2-propylphenol Chemical compound CCCC1=CC=CC=C1O LCHYEKKJCUJAKN-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004312 hexamethylene tetramine Substances 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
- H01B7/1875—Multi-layer sheaths
- H01B7/188—Inter-layer adherence promoting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a self-adhesive insulating ultrafine wire, a coil and electric and electronic equipment. The self-adhesive insulated ultrafine wire comprises a conductor, and an insulating layer and a self-adhesive layer which are sequentially arranged outside the conductor, wherein the insulating layer is an insulating layer with a dielectric constant not more than 2.8, the self-adhesive layer is a thermosetting self-adhesive layer, and the thermosetting self-adhesive layer is obtained by coating a composition containing polyamide, a resin type curing agent and a solvent. The self-adhesive insulating superfine wire effectively reduces gaps among coils by arranging the self-adhesive layer, and solves the problem of large gaps after the traditional high heat-resistant grade copper flat wire is wound. The self-adhesive insulated ultrafine wire has higher heat resistance level, effectively improves the output power of products, and can also ensure the service life of electronic elements.
Description
Technical Field
The invention relates to an insulated wire, in particular to a self-adhesive insulated ultrafine wire, a coil and electric and electronic equipment.
Background
With the rapid progress and development of new energy industries, electronic components related to the new energy industries are also prosperous and developed, and the electronic components relate to self-adhesive insulated ultrafine wires. The self-adhesive insulated superfine wire has the characteristics of high effective rate, high current bearing capacity, high groove filling rate, miniaturization, low resistance and high power, and is widely applied to magnetic components. However, with the innovative development of electronic technology, the existing common enameled flat copper wire cannot meet the development requirement, and self-adhesive insulated ultrafine wires are generated. The self-adhesive insulated superfine wire has higher heat resistance level, excellent electrical performance and good self-adhesive forming capability, is a key basic material for development of high and new technical fields such as photoelectrons, microelectronics, aviation, aerospace and the like, and is also an important support for development of advanced equipment and information technical fields in China.
In particular, the insulation properties of insulated wires, in particular PDIV performance, are highly desirable in some specific applications. This requires that the self-adhesive insulated ultrafine wire be made of a low dielectric constant material to form the insulating layer. But low dielectric constant materials tend to have poor adhesion. When the self-adhesive layer is further arranged on the surface of the insulating layer made of the low dielectric constant material, the problems of poor adhesion of the self-adhesive layer, uneven thickness of the self-adhesive layer, influence on the PDIV performance of the whole wire material and the like are often caused.
Disclosure of Invention
In order to solve the technical problems, in particular to an ultra-fine wire self-adhesive insulated wire with low PDIV performance, which has the advantages of product stability and safety and long service life of wires.
In the present invention, the insulated ultrafine wire means, first, a conventional understanding of the ultrafine wire by a person skilled in the art based on common general knowledge or the prior art. In the present invention, the insulated ultra-fine wire specifically means an insulated wire having a maximum distance of not more than 2mm at any two points on a section perpendicular to the length direction of the ultra-fine wire, and in particular, the ultra-fine wire means an insulated wire having a maximum distance of not more than 1.5mm at any two points on a section perpendicular to the length direction of the ultra-fine wire.
More specifically, when the ultrafine wire is a round wire, the maximum distance of any two points on the cross section is the diameter of a cross-sectional circle perpendicular to the length direction; when the ultrafine line is rectangular or rounded rectangular, the maximum distance of any two points on the cross section is the length of the diagonal of the cross section perpendicular to the length direction.
In the invention, the insulated wire refers to a wire coated with an insulating layer or coated with an insulating layer and a self-adhesive layer.
The self-adhesive layer is a thermosetting self-adhesive layer, and the thermosetting self-adhesive layer is prepared from a self-adhesive varnish composition containing polyamide resin, a resin curing agent and a solvent.
In the present invention, the polyamide resin in the self-adhesive varnish composition for preparing the self-adhesive layer is a polyamide resin having a molecular weight of 5000 to 20000, and in a particularly preferred embodiment of the present invention, the polyamide resin is a polyamide resin having a molecular weight of 5000 to 15000.
In the present invention, the resin type curing agent in the self-adhesive varnish composition for preparing the self-adhesive layer is a phenolic resin, preferably a low molecular weight phenolic resin. The low molecular weight phenolic resin is a phenolic resin with a viscosity average molecular weight of 500-1000, preferably a phenolic resin with a viscosity average molecular weight of 700-800.
In the present invention, the resin type curing agent in the self-adhesive varnish composition for preparing the self-adhesive layer further includes a monophenol compound, preferably, the monophenol compound is selected from cresol, ethylphenol or a mixture thereof. The monophenol compound serves to regulate the crosslink density.
In the present invention, the solvent in the composition for preparing the self-adhesive layer is toluene, xylene, ethylbenzene, tetrahydrofuran, DMF, DMSO or a mixture thereof.
Specifically, the thermosetting self-adhesive layer is prepared from a self-adhesive varnish composition comprising the following components: the polyamide resin accounts for 5-10%, the phenolic resin accounts for 2-5%, the auxiliary agent accounts for 0.5-1%, the solvent accounts for 40-80%, and the monophenol compound accounts for 10-50%.
The thermosetting self-adhesive layer is prepared from self-adhesive paint with the following components: the polyamide resin accounts for 5-7%, the phenolic resin accounts for 2-4%, the auxiliary agent accounts for 0.5-1%, the solvent accounts for 42-45%, and the monophenol compound accounts for 43-45%.
Wherein the auxiliary agent is optionally a conventional auxiliary agent, including a leveling agent, a lubricant and/or a thixotropic agent.
In the invention, the conductor is a flat wire with a rectangular or rounded rectangular cross section perpendicular to the length direction of the wire. The thickness of the flat wire is 0.020-0.100 mm, and the width of the flat wire is 0.150-1.00 mm. The thickness of the flat wire is the length of the short side of the rectangle or the rounded rectangle. The width of the flat wire refers to the length of the long side of the rectangle or the rounded rectangle.
In the present invention, the preferred conductor cross section is rounded rectangle. The radius of the fillet inscribed circle of the fillet rectangle is not less than 1/4 of the side length of the short side of the rectangle.
In the present invention, the insulating layer is provided outside the conductor. The insulating layer is made of a material having a dielectric constant of not more than 2.8. And the thickness of the insulating layer is 3-20 mu m along the direction of the single side of the conductor.
In the invention, the thickness of the self-adhesive layer paint film is 1-4 mu m along the direction of the single side of the conductor outwards.
In the preferred embodiment of the invention, the conductor proportion of the groove body is further improved under the condition of keeping higher PDIV, and the total thickness of the insulating layer and the self-adhesive layer is 4-24 mu m on one side.
The second aspect of the invention provides a method for preparing self-adhesive insulated ultrafine wires.
Wherein, the insulating layer is formed on the surface of the metal conductor in a coating mode. The insulating layer is formed by coating polyimide or paint containing polyimide as a main component and curing.
After the insulating layer is cured, a self-adhesive layer is formed by further coating a paint containing polyamide or a polyamide as a main component on the surface of the insulating layer.
A third aspect of the present invention provides a coil and an electronic device made of the coil.
The self-adhesive layer effectively reduces gaps among coils, and solves the problem of large gaps after winding of the traditional high heat-resistant grade copper flat wire. The self-adhesive insulated superfine wire has higher heat resistance grade, and the highest heat resistance grade can meet 240-grade heat resistance, effectively improve the output power of the product and also ensure the service life of electronic elements.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
wherein 1 is a conductor, 2 is an insulating layer, and 3 is a self-adhesive layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, in the embodiment of the present invention, the self-adhesive insulated ultrafine wire includes a conductor 1, an insulating layer 2 and a self-adhesive layer 3 sequentially disposed outside the conductor. The conductor 1 is a conductor micro-thin wire, the thickness of the conductor micro-thin wire is 120 mu m, the width of the conductor micro-thin wire is 260 mu m, the cross section of the conductor is a round rectangle, and the radius of the round inscription of the round rectangle is 1/2 of the short side length of the rectangle. Wherein the insulating layer 2 is an insulating layer made of polyimide having a dielectric constant of 2.8, and the thickness of the insulating layer is 7 μm. After the insulating layer is cured, a self-adhesive layer is formed by further coating a self-adhesive varnish coated with a polyamide paint on the surface of the insulating layer.
In a specific embodiment of the present invention, the self-adhesive layer in this example is a thermosetting self-adhesive layer, and is cured from a self-adhesive varnish composition comprising polyamide and phenolic resin. More specifically, examples 1 to 8 give specific components of the thermosetting self-adhesive varnish, and by comparative examples 1 to 7 give exemplary embodiments which are outside the scope of the present invention.
For the self-adhesive insulated ultrafine wire obtained in this example, the following test was performed:
adhesion test: the insulating wire of 300mm was taken as a test piece, the test piece was placed between two jigs, the test piece and the jigs were placed on the same axis, both ends were clamped, 20% was pulled at a rate of 300mm/min, and the length of the test piece where the paint film lost adhesion was examined. The evaluation criteria were as follows:
a+:1.0mm or less;
a:1.0mm or more and 1.5mm or less
B:1.5mm or more and 2.5mm or less;
c:2.5mm or more.
Thickness and thickness uniformity of self-adhesive layer: and (3) taking the insulated wire with the insulating layer as a sample, randomly selecting 10 points at any position of the insulated wire, measuring the thickness of the self-adhesive layer based on the positions of the 10 selected points, taking a number average value as the thickness of the self-adhesive layer of the sample, further calculating the standard deviation of the thickness of the self-adhesive layer, and obtaining the variation coefficient (C.V) of the thickness of the self-adhesive layer. Where coefficient of variation (C.V) =standard deviation/average.
A+:5% or less;
a:5% to 10%;
b: more than 10% and less than 15%;
c:15% or more.
PDIV test: PDIV test (partial discharge initiation voltage): taking two wire samples with the length of about 300mm, removing an insulating layer with the length of 10-15mm at one end of each wire sample, molding, tightly winding the insulated wire back to back by using PI adhesive tape with the length of about 150mm at the linear part, applying sinusoidal voltage between two conductors of the sample according to the following specified conditions, testing and recording test values. Test conditions: 10V/S50 HZ 10PC. The evaluation criteria were as follows:
a+:400V or more;
a: 300V or more and less than 400V;
b: 200V or more and less than 300V;
c: less than 100V
And (3) adhesive force test: under the condition of no stretching and bending, taking 1 section of proper length as a sample, winding the sample into a coil, binding the coil tightly, putting the coil into a 170 ℃ oven for baking for 15 minutes to bond the coil together, cooling the coil at normal temperature, vertically hanging the coil, and tying weights on the lower end of the coil to test the adhesive force of the sample. The evaluation criteria were as follows:
a+:0.8N or more;
a: 0.6N or more and less than 0.8N;
b: 0.4N or more and less than 0.6N;
c: less than 0.4N
Softening breakdown resistance: and (5) testing by a heating method, and taking two about 300mm line samples. After the two ends of the sample are fixed after the instrument is inserted, the instrument is set according to the standard, and the insulation performance evaluation standard of the insulated wire after the paint film is softened in the hot state is as follows:
a+:450 ℃ or above;
a: 350 ℃ to less than 450 ℃;
b: 180 ℃ to less than 350 ℃;
c: less than 180 ℃.
Example 1
The thermosetting resin self-adhesive layer is prepared from a thermosetting self-adhesive varnish composition, wherein the thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low-molecular-weight phenolic resin, an auxiliary agent, dimethylbenzene and cresol, the polyamide resin with the molecular weight of 10000 accounts for 5%, the low-molecular-weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 45% and the cresol accounts for 45%;
in this embodiment the auxiliary agent consists of a leveling agent and a thixotropic agent. The following examples and comparative examples are identical to the auxiliaries used in example 1.
Example 2
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 10000 accounts for 7%, the low molecular weight phenolic resin accounts for 2%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 44% and the cresol accounts for 46%.
Example 3
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 10000 accounts for 7%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 42% and the cresol accounts for 46%.
Example 4
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 10000 accounts for 6%, the low molecular weight phenolic resin accounts for 3%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 40% and the cresol accounts for 50%.
Example 5
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 5000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 50% and the cresol accounts for 40%.
Example 6
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 15000 accounts for 6%, the low molecular weight phenolic resin accounts for 3%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 40% and the cresol accounts for 50%.
Example 7
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 15000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 45% and the cresol accounts for 45%.
Example 8
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and ethylphenol, wherein the polyamide resin with the molecular weight of 10000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 45% and the ethylphenol accounts for 45%.
Comparative example 1
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low molecular weight phenolic resin, an auxiliary agent and dimethylbenzene, wherein the polyamide resin with the molecular weight of 10000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1% and the dimethylbenzene accounts for 90%.
Comparative example 2
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and propyl phenol, wherein the polyamide resin with the molecular weight of 10000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 45% and the propyl phenol accounts for 45%.
Comparative example 3
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and phenol, wherein the polyamide resin with the molecular weight of 10000 accounts for 5%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 45% and the phenol accounts for 45%.
Comparative example 4
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, hexamethylenetetramine, an auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 10000 accounts for 5-10%, the hexamethylenetetramine accounts for 2-4%, the auxiliary agent accounts for 0.5-1%, the dimethylbenzene accounts for 42-46% and the cresol accounts for 42-46%.
Comparative example 5
The thermosetting self-adhesive varnish composition consists of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 2000 accounts for 7%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 43% and the cresol accounts for 45%.
Comparative example 6
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 25000 accounts for 7%, the low molecular weight phenolic resin accounts for 4%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 43% and the cresol accounts for 45%.
Comparative example 7
The thermosetting self-adhesive varnish composition consists of a composition of polyamide resin, low molecular weight phenolic resin, auxiliary agent, dimethylbenzene and cresol, wherein the polyamide resin with the molecular weight of 25000 accounts for 3%, the low molecular weight phenolic resin accounts for 5%, the auxiliary agent accounts for 1%, the dimethylbenzene accounts for 46% and the cresol accounts for 45%.
The low molecular weight phenolic data used in the examples and comparative examples of the present invention are phenolic resins having a viscosity average molecular weight of 750. The molecular weight description of the polyamide resin according to the invention is based on the number average molecular weight. The percentage proportion of each component in the invention is based on weight parts.
According to the above examples 1 to 8, the thermosetting self-adhesive varnish compositions of comparative examples 1 to 7 were applied to the wire coated on the outside and cured with the insulating layer, and self-adhesive layers having different compositions and thicknesses were obtained after controlling the application amount and removing the solvent, and further, the self-adhesive layer thickness test, the self-adhesive layer thickness uniformity test, the adhesion test, and the PDIV and adhesion, softening breakdown resistance were performed with respect to the self-adhesive insulating ultra fine wire, and the test results are shown in table 1.
TABLE 1 self-adhesive insulated ultra-fine linear energy test meter
The self-adhesive insulating ultrafine wire has the advantages that the insulating layer of the self-adhesive insulating ultrafine wire has low dielectric constant and higher PDIV, the lower the film breakdown probability of the coil in a variable frequency pulse environment is, the lower the softening breakdown resistance probability of the film is, the stability and safety of the product are effectively improved, and the service life of the wire is prolonged.
The specific embodiments of the present invention are to be construed as merely illustrative, and not restrictive of the current invention, and modifications to the embodiments may become apparent to those skilled in the art from a reading of the specification without the inventive contribution, but without the benefit of the patent statutes, as long as they come within the scope of the claims.
Claims (11)
1. The self-adhesive insulating ultrafine wire is characterized by comprising a conductor (1), and an insulating layer (2) and a self-adhesive layer (3) which are sequentially arranged outside the conductor, wherein the insulating layer (2) is an insulating layer with a dielectric constant not more than 2.8; the self-adhesive layer (3) is a thermosetting self-adhesive layer, and the thermosetting self-adhesive layer is obtained by coating a thermosetting self-adhesive varnish composition containing polyamide resin, a resin curing agent and a solvent;
the molecular weight of the polyamide resin is 5000-15000;
along the direction of the single side of the conductor outwards, the thickness of a paint film of the self-adhesive layer (3) is 1-4 mu m on a single side;
the resin type curing agent is a curing agent containing phenolic resin, and the resin type curing agent further comprises a monophenol compound;
the molecular weight of the phenolic resin is 500-1000;
the thermosetting self-adhesive layer is prepared from a thermosetting self-adhesive varnish composition with the following components: the self-adhesive varnish comprises, by weight, 5-10% of polyamide resin, 2-5% of phenolic resin, 0.5-1% of an auxiliary agent, 40-80% of a solvent, 10-50% of a monophenol compound and the weight percentage based on the total weight of the self-adhesive varnish.
2. The self-adhesive insulating ultrafine wire according to claim 1, wherein the phenolic resin has a low molecular weight of 700 to 800.
3. The self-adhesive insulating ultrafine wire according to claim 1, wherein the monophenol compound is selected from cresols, ethylphenol or mixtures thereof.
4. The self-adhesive insulated ultrafine wire according to claim 1, wherein the solvent is toluene, xylene, ethylbenzene, tetrahydrofuran, DMF, DMSO or a mixture thereof.
5. The self-adhesive insulating ultrafine wire according to claim 1, wherein the thermosetting self-adhesive layer is prepared from a self-adhesive paint of the following composition: the polyamide resin accounts for 5-7%, the phenolic resin accounts for 2-4%, the auxiliary agent accounts for 0.5-1%, the solvent accounts for 42-45%, and the monophenol compound accounts for 43-45%.
6. The self-adhesive insulating ultrafine wire according to claim 1, characterized in that the conductor (1) is a flat wire with a thickness of 0.020-0.100 mm and a width of 0.150-1.00 mm; and the thickness of the insulating layer (2) is 3-20 mu m along the direction of the single side of the conductor.
7. Self-adhesive insulating ultrafine wire according to claim 1, characterized in that the conductor (1) is rectangular with rounded corners in cross section.
8. The self-adhesive insulating ultrafine wire according to claim 7, wherein the rounded rectangle has a rounded inscribed radius of not less than 1/4 of the short side length of the rectangle.
9. Self-adhesive insulating ultrafine wire according to claim 1, characterized in that the total thickness of the insulating layer (2) and the self-adhesive layer (3) is 4-24 μm on one side.
10. A coil, characterized in that it is constituted by a self-adhesive insulated ultrafine wire according to any one of claims 1 to 9.
11. An electrical or electronic device comprising the coil of claim 10.
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| CN202310928416.9A CN116665973B (en) | 2023-07-27 | 2023-07-27 | Self-adhesive insulating ultrafine wire, coil and electric and electronic equipment |
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| CN202310928416.9A CN116665973B (en) | 2023-07-27 | 2023-07-27 | Self-adhesive insulating ultrafine wire, coil and electric and electronic equipment |
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| CN116665973B true CN116665973B (en) | 2023-11-17 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05163413A (en) * | 1991-12-12 | 1993-06-29 | Sumitomo Bakelite Co Ltd | Molding material |
| JPH08231933A (en) * | 1995-02-23 | 1996-09-10 | Shin Etsu Chem Co Ltd | Carrier tape for tab |
| EP2157149A2 (en) * | 2008-08-07 | 2010-02-24 | Arkema France | Use of a dispersion of carbon nanotubes in a copolyamide as a conductive adhesive composition |
| CN201689722U (en) * | 2010-05-18 | 2010-12-29 | 浙江长城电工科技有限公司 | Alcohol-soluble self-adhesive enamel wire |
| CN103421422A (en) * | 2012-05-22 | 2013-12-04 | 上海川叶电子科技有限公司 | Heat-resistant alcohol-soluble self-adhesive paint for self-adhesive insulated winding wires and preparation method thereof |
| CN204966094U (en) * | 2015-09-29 | 2016-01-13 | 佳腾电业（赣州）有限公司 | Flat enamelled copper wire of ultra tiny precision |
| CN113707370A (en) * | 2021-08-24 | 2021-11-26 | 恒亚电工(昆山)有限公司 | Self-adhesive enameled wire and production process thereof |
| CN115516037A (en) * | 2020-06-16 | 2022-12-23 | 住友电气工业株式会社 | Resin composition, self-adhesive insulated wire, and winding bundle |
-
2023
- 2023-07-27 CN CN202310928416.9A patent/CN116665973B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05163413A (en) * | 1991-12-12 | 1993-06-29 | Sumitomo Bakelite Co Ltd | Molding material |
| JPH08231933A (en) * | 1995-02-23 | 1996-09-10 | Shin Etsu Chem Co Ltd | Carrier tape for tab |
| EP2157149A2 (en) * | 2008-08-07 | 2010-02-24 | Arkema France | Use of a dispersion of carbon nanotubes in a copolyamide as a conductive adhesive composition |
| CN201689722U (en) * | 2010-05-18 | 2010-12-29 | 浙江长城电工科技有限公司 | Alcohol-soluble self-adhesive enamel wire |
| CN103421422A (en) * | 2012-05-22 | 2013-12-04 | 上海川叶电子科技有限公司 | Heat-resistant alcohol-soluble self-adhesive paint for self-adhesive insulated winding wires and preparation method thereof |
| CN204966094U (en) * | 2015-09-29 | 2016-01-13 | 佳腾电业（赣州）有限公司 | Flat enamelled copper wire of ultra tiny precision |
| CN115516037A (en) * | 2020-06-16 | 2022-12-23 | 住友电气工业株式会社 | Resin composition, self-adhesive insulated wire, and winding bundle |
| CN113707370A (en) * | 2021-08-24 | 2021-11-26 | 恒亚电工(昆山)有限公司 | Self-adhesive enameled wire and production process thereof |
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|---|---|
| CN116665973A (en) | 2023-08-29 |
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