CN116652790A - Multi-station semiconductor chemical mechanical polishing machine - Google Patents

Abstract

The invention discloses a multi-station semiconductor chemical mechanical polishing machine, which comprises a support frame, an installation block arranged on the support frame and provided with a sliding groove, and a cylinder arranged on the installation block and passing through the sliding groove As for the pressure plate mechanism, guide rails are arranged on the mounting block and on both sides of the sliding groove, and the direction of the guide rails is parallel to the diameter of the polishing disc. The cylinder pressure plate mechanism is provided with sliders, and the slide The block is arranged on the guide rail, and the driving mechanism is used to drive the cylinder pressure plate mechanism to move on the guide rail; the present invention sets the mounting block and slide rail on the mounting block, and the direction of the slide rail is consistent with the direction of the polishing disc. The diameter direction is parallel, so that the cylinder pressure plate mechanism can reciprocate along the diameter direction of the polishing disc, which can reduce the repeatability of the polishing track and help improve the polishing accuracy.

Description

A multi-station semiconductor chemical mechanical polishing machine

technical field

The invention relates to the technical field of semiconductor manufacturing, in particular to a multi-station semiconductor chemical mechanical polishing machine.

Background technique

Semiconductors refer to materials whose electrical conductivity is between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. A semiconductor refers to a material whose conductivity can be controlled and ranges from an insulator to a conductor. From the perspective of technology and economic development, the importance of semiconductors is very huge. Most of today's electronic products , such as computers, mobile phones, or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is among various semiconductor materials. It is widely used in commercial applications. One of the most influential in the world.

Polishing discs are used to polish and polish objects. There are many types, such as crystal polishing discs, wool polishing discs, flannelette polishing discs, etc. According to different hardness, you can choose according to your needs. When polishing, the line of sight should be concentrated on the edge of the polishing disc , Do not exceed the corners to prevent throwing through the corners. When throwing sub-boards, there are more corners and more planes with smaller areas, and the edges of the polishing disc can be used to polish these planes.

During the process of semiconductor processing, the semiconductor will be polished, but the existing semiconductor grinding equipment has the problems of poor grinding effect and low grinding precision.

Be that the semiconductor wafer polisher of publication number CN115674005A comprises polishing workbench, the table top of polishing workbench is provided with some wafer grooves, is provided with wafer in the wafer groove, and the wafer polishing device on the top of polishing workbench comprises some polishing units, polishing The unit includes a drive shaft cylinder, one end of the drive shaft cylinder is provided with a magnetostrictor A, the other end of the drive shaft cylinder is connected with a closed transmission of the polishing motor, and the magnetostrictor A is provided on one end of the drive shaft cylinder. Magnetostrictive ring armor, an electromagnetic ring armor arranged in one end of the drive shaft, the outer ring surface of the magnetostrictive ring armor is connected with a polishing disc arranged above the wafer groove, and multiple passes are arranged on the polishing surface of the polishing disc. The liquid hole is communicated with one end of the drive shaft cylinder through the liquid hole. In this technical solution, the polishing unit can only move up and down for polishing, the polishing angle is limited, and it cannot perform repeated polishing for polishing in other directions, resulting in poor polishing effect of the semiconductor.

In order to solve the above problems, the present invention provides a multi-station semiconductor chemical mechanical polishing machine to solve the problem of poor polishing effect of conventional polishing machines.

Contents of the invention

The object of the present invention is to provide a multi-station semiconductor chemical mechanical polishing machine to achieve the purpose of improving the polishing effect of the polishing machine.

To achieve the above object, the present invention provides the following scheme:

A multi-station semiconductor chemical mechanical polishing machine, comprising a support frame, an installation block arranged on the support frame and provided with a sliding groove, and a cylinder pressure plate mechanism arranged on the installation block and passing through the sliding groove, Guide rails are arranged on the mounting block and on both sides of the sliding groove, the direction of the guide rails is parallel to the diameter of the polishing disc, and a slider is arranged on the cylinder pressure plate mechanism, and the slider is arranged on the On the guide rail, the driving mechanism is used to drive the cylinder pressure plate mechanism to move on the guide rail.

Preferably, the cylinder pressure plate mechanism includes a pressure plate drive shaft assembly, a low-friction cylinder assembly, an adjustable pressure plate assembly, and a drive motor assembly arranged on the low-friction cylinder assembly, which are sequentially connected from top to bottom. The pressure plate drive shaft assembly includes a drive plate, a sliding rod that runs through the drive plate and is arranged on the drive plate, the low-friction cylinder assembly includes a cylinder barrel and a driven gear set on the cylinder barrel, the drive The motor assembly includes a first servo motor, a driving gear arranged at the output end of the first servo motor, and a first planetary reducer arranged on the first servo motor, the driving gear and the driven gear are meshed and connected, so The sliding rod is connected with the cylinder.

Preferably, the adjustable pressure disc assembly includes a disc body and at least three ring-shaped pressurized air films disposed on the bottom of the disc body.

Preferably, the drive mechanism includes a mounting plate sleeved on the outer wall of the cylinder and connected to the slider, a second servo motor, a second planetary reducer connected to the second servo motor, and the The ball screw connected to the second planetary reducer is connected to the mounting plate, and the ball screw drives the mounting plate to reciprocate on the guide rail.

Preferably, it also includes a central shaft passing through the support frame and a third servo motor for driving the central shaft up and down.

Preferably, the support frame is a door-type bracket, and the door-type bracket includes a beam and columns arranged at both ends of the beam, and the central axis and the mounting block are both arranged on the beam.

Preferably, there are four sets of mounting blocks, and they are evenly arranged on the circumference of the central axis with the central axis as the center.

Preferably, a workbench is also included, and the support frame is arranged on the workbench.

Compared with the prior art, the present invention has achieved the following technical effects:

1. The present invention is provided with mounting blocks, and slide rails are set on the mounting blocks. The trend of the slide rails is parallel to the diameter direction of the polishing disc, so that the cylinder pressure plate mechanism can reciprocate along the diameter direction of the polishing disc, which can reduce the friction of the polishing track. The repeatability is beneficial to improve the polishing precision.

2. The cylinder pressure plate mechanism in the present invention includes a pressure plate drive shaft assembly, a low-friction cylinder assembly, an adjustable pressure plate assembly, and a drive motor assembly arranged on the low-friction cylinder assembly, and the pressure plate drive shaft is sequentially connected from top to bottom. The assembly includes a drive plate, a slide rod that runs through the drive plate and is arranged on the drive plate, the low-friction cylinder assembly includes a cylinder barrel and a driven gear arranged on the cylinder barrel, the drive motor assembly includes a first servo motor, and a The driving gear at the output end and the first planetary reducer arranged on the first servo motor, the driving gear and the driven gear are meshed and connected, and the sliding rod is connected to the cylinder; the pressure plate mechanism in the present invention can be realized by driving the first servo reduction motor. Constant torque output, stable speed and no dust particle pollution.

3. The adjustable pressure plate assembly in the present invention includes a plate body and at least three ring-shaped pressurized air films on the bottom of the plate body; it can realize regional pressurization.

Description of drawings

In order to more clearly illustrate the present invention or the technical solutions in the prior art, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.

Accompanying drawing 1 is a structural representation of the present invention;

Accompanying drawing 2 is the structural representation of cylinder pressure plate mechanism of the present invention;

Accompanying drawing 3 is the structure diagram of adjustable pressure plate assembly of the present invention;

Among them, 1. Central shaft; 2. Sliding groove; 3. Second servo motor; 4. Installation block; 5. Column; 6. Slider; 7. Installation plate; 8. Workbench; 9. Guide rail; ; 11, cylinder pressure plate mechanism; 12, annular pressurized air film; 13, drive plate; 14, sliding rod; 15, driving gear; 16, passive gear; 17, cylinder barrel; , Adjustable pressure plate assembly.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The object of the present invention is to provide a multi-station semiconductor chemical mechanical polishing machine to achieve the purpose of improving the polishing effect of the polishing machine.

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Referring to FIGS. 1 to 3 , a multi-station semiconductor chemical mechanical polishing machine includes a support frame, a mounting block provided on the support frame and provided with a sliding groove 2, and a mounting block 4 arranged on the mounting block and passing through the The cylinder pressure plate mechanism 11 of the slide groove 2, on the mounting block and on both sides of the slide groove 2 are provided with guide rails 9, the direction of the guide rails 9 is parallel to the diameter of the polishing disc, the cylinder pressure plate The mechanism 11 is provided with a slide block 6, the slide block 6 is arranged on the guide rail 9, and the drive mechanism is used to drive the cylinder pressure plate mechanism 11 to move on the guide rail 9; the present invention sets the mounting block, and A slide rail is arranged on the mounting block 4, and the direction of the slide rail is parallel to the diameter direction of the polishing disc, so that the cylinder pressure plate mechanism can reciprocate along the diameter direction of the polishing disc, which can reduce the repetition of the polishing track and help improve the polishing accuracy.

Referring to Fig. 2, the cylinder pressure plate mechanism 11 includes a pressure plate drive shaft assembly, a low-friction cylinder assembly, an adjustable pressure plate assembly 19 and a drive motor assembly arranged on the low-friction cylinder assembly, which are sequentially connected from top to bottom. The disk drive shaft assembly includes a drive disk 13, a sliding rod 14 that runs through the drive disk and is arranged on the drive disk 13, and the low-friction cylinder assembly includes a cylinder barrel 17 and a driven gear 16 arranged on the cylinder barrel 17. The driving motor assembly includes a first servo motor 18, a driving gear 15 arranged at the output end of the first servo motor 18 and a first planetary reducer arranged on the first servo motor 18, the driving gear 15 and the The driven gear 16 is meshed and connected, and the sliding rod 14 is connected to the cylinder; the pressure plate mechanism in the present invention is driven by the first servo reduction motor to achieve constant torque output, and the speed is stable without causing dust particle pollution.

Referring to FIG. 3 , the adjustable pressure disc assembly 19 includes a disc body and at least three ring-shaped pressurized air films 12 arranged on the bottom of the disc body; it can realize subregional pressurization of the disc body.

Referring to Fig. 1, the drive mechanism includes a mounting plate 7 sleeved on the outer wall of the cylinder 17 and connected to the slider, a second servo motor 3, a second planetary reducer connected to the second servo motor 3, and a second planetary reducer The connected ball screw is connected to the mounting plate 7, and the ball screw drives the mounting plate 7 to reciprocate on the guide rail 9.

Referring to FIG. 1 , it also includes a central shaft 1 passing through the support frame and a third servo motor for driving the central shaft 1 up and down.

Referring to FIG. 1 , the support frame is a door-type bracket, and the door-type bracket includes a beam 10 and columns 5 arranged at both ends of the beam 10 , and the central axis 1 and the mounting block are both arranged on the beam 10 .

Referring to FIG. 1 , there are four sets of mounting blocks, and they are evenly arranged on the circumference of the central axis with the central axis as the center.

Referring to FIG. 1 , it also includes a workbench 8 on which the support frame is arranged.

Adaptive changes made according to actual needs are within the protection scope of the present invention.

It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. . Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. The utility model provides a multistation semiconductor chemical mechanical polisher, its characterized in that, is in including support frame, setting and has seted up the installation piece of sliding tray and setting on the support frame and run through on the installation piece the cylinder pressure disk mechanism of sliding tray, on the installation piece and be located be provided with the guide rail on the both sides of sliding tray, the trend of guide rail is parallel with the diameter of polishing disk, be provided with the slider on the cylinder pressure disk mechanism, the slider sets up on the guide rail, actuating mechanism is used for the drive cylinder pressure disk mechanism is in remove on the guide rail.

2. The multi-station semiconductor chemical mechanical polisher according to claim 1, wherein the cylinder pressure disc mechanism comprises a pressure disc driving shaft assembly, a low-friction cylinder assembly, an adjustable pressure disc assembly and a driving motor assembly arranged on the low-friction cylinder assembly, which are sequentially connected from top to bottom, the pressure disc driving shaft assembly comprises a driving disc, a sliding rod penetrating through the driving disc and arranged on the driving disc, the low-friction cylinder assembly comprises a cylinder barrel and a driven gear arranged on the cylinder barrel, the driving motor assembly comprises a first servo motor, a driving gear arranged at the output end of the first servo motor and a first planetary reducer arranged on the first servo motor, the driving gear is in meshed connection with the driven gear, and the sliding rod is connected with the cylinder barrel.

3. The multi-station semiconductor chemical mechanical polisher of claim 2 wherein the adjustable pressure plate assembly comprises a plate and at least three annular pressurized gas films disposed on the bottom of the plate.

4. The multi-station semiconductor chemical mechanical polisher according to claim 2, wherein the driving mechanism comprises a mounting plate sleeved on the outer wall of the cylinder and connected with the sliding block, a second servo motor, a second planetary reducer connected with the second servo motor and a ball screw connected with the second planetary reducer, the ball screw is connected with the mounting plate, and the ball screw drives the mounting plate to reciprocate on the guide rail.

5. The multi-station semiconductor chemical mechanical polisher according to claim 1 further comprising a central shaft extending through the support frame and a third servo motor for driving the central shaft to move up and down.

6. The multi-station semiconductor chemical mechanical polisher according to claim 5, wherein the support frame is a portal frame, the portal frame comprises a beam and upright posts arranged at two ends of the beam, and the central shaft and the mounting blocks are arranged on the beam.

7. The multi-station semiconductor chemical mechanical polisher according to claim 5, wherein the mounting blocks are arranged in four groups and are uniformly arranged in the circumferential direction of the central shaft around the central shaft.

8. The multi-station semiconductor chemical mechanical polisher of claim 7 further comprising a table with the support frame disposed thereon.