CN116650869B - A fire extinguishing system and its working method that utilizes semiconductor power generation - Google Patents
A fire extinguishing system and its working method that utilizes semiconductor power generationInfo
- Publication number
- CN116650869B CN116650869B CN202310880666.XA CN202310880666A CN116650869B CN 116650869 B CN116650869 B CN 116650869B CN 202310880666 A CN202310880666 A CN 202310880666A CN 116650869 B CN116650869 B CN 116650869B
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- CN
- China
- Prior art keywords
- power generation
- heat
- semiconductor power
- temperature difference
- cabinet body
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Classifications
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C3/00—Fire prevention, containment or extinguishing specially adapted for particular objects or places
- A62C3/16—Fire prevention, containment or extinguishing specially adapted for particular objects or places in electrical installations, e.g. cableways
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C31/00—Delivery of fire-extinguishing material
- A62C31/02—Nozzles specially adapted for fire-extinguishing
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C31/00—Delivery of fire-extinguishing material
- A62C31/28—Accessories for delivery devices, e.g. supports
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C37/00—Control of fire-fighting equipment
- A62C37/04—Control of fire-fighting equipment with electrically-controlled release
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fire-Extinguishing By Fire Departments, And Fire-Extinguishing Equipment And Control Thereof (AREA)
Abstract
The invention provides a fire extinguishing system utilizing a semiconductor to generate electricity and a working method thereof, relating to the technical field of cabinets, comprising a cabinet body; the temperature difference semiconductor power generation device comprises a temperature difference semiconductor power generation piece with a hot end heating surface and a cold end radiating surface, a heat conductor and a radiator, wherein the temperature difference semiconductor power generation piece is clamped between the heat conductor and the radiator, the heat conductor is fixed in a cabinet body and is provided with a first contact plane in contact with the hot end heating surface, the radiator is fixed outside the cabinet body and is provided with a second contact plane in contact with the cold end radiating surface, the control circuit is arranged in or outside the cabinet body and is electrically connected with the control circuit, the fire extinguishing device is provided with a fire extinguishing agent nozzle in the cabinet body, the fire extinguishing agent nozzle is connected with the fire extinguishing device, and the fire extinguishing device is electrically connected with the control circuit. The invention has the advantage of ensuring the stable and reliable operation of the fire extinguishing system under the condition of fire disaster and the like.
Description
Technical Field
The invention relates to the technical field of cabinets, in particular to a fire extinguishing system utilizing a semiconductor to generate electricity and a working method.
Background
The cabinet is generally applied to various electrical products, ensures the safe application of the electrical products, is a continuous pursuit of the whole electrical industry, and is particularly important for the fire safety of the electrical products in various electrical safety. In the practical application process of the cabinet, the cabinet is easily subjected to fire disaster caused by overhigh temperature due to the influence of environmental factors, heat dissipation factors of various electrical products and the like, and meanwhile, the normal operation of various electrical products in the cabinet can be influenced due to overhigh temperature.
In order to avoid fire or influence on normal operation of electrical products, the existing cabinets are often provided with fire extinguishing devices for extinguishing fire and heat dissipation fans for dissipating heat, such as a fire extinguishing mechanism and heat dissipation fans of a computer cabinet disclosed in chinese patent application No. CN202310048018.8, and a cloud computing server cabinet device disclosed in chinese patent application No. CN202211170361.1, and also provided with a fire extinguishing mechanism and heat dissipation fans in the cabinet. However, the fire extinguishing mechanism or the heat dissipation fan of the existing cabinet is powered by an external power supply, so that once the external power supply is disconnected, the fire extinguishing or heat dissipation function cannot be realized. In view of the above problems, the present inventors have conducted intensive studies on the problems, and have produced the present invention.
Disclosure of Invention
The invention aims to solve the technical problem that the fire extinguishing mechanism of the existing cabinet is powered by an external power supply, so that the fire extinguishing function cannot be realized once the external power supply is disconnected.
The invention is realized in the following way:
In a first aspect, a fire suppression system for generating electricity using a semiconductor, the fire suppression system comprising:
A cabinet body;
the temperature difference semiconductor power generation device comprises a temperature difference semiconductor power generation piece with a hot end heating surface and a cold end radiating surface, a heat conductor and a radiator, wherein the temperature difference semiconductor power generation piece is clamped between the heat conductor and the radiator;
the control circuit is arranged inside the cabinet body or outside the cabinet body, and the temperature difference semiconductor power generation piece is electrically connected with the control circuit;
the fire extinguishing device is characterized in that a fire extinguishing agent nozzle is arranged in the cabinet body and connected with the fire extinguishing device, and the fire extinguishing device is electrically connected with the control circuit.
Further, the device also comprises a cooling device;
The cooling device comprises a cooling tower, a cooling pump and a cooling circulation pipeline, wherein the cooling tower and the cooling pump are arranged outside the cabinet body, the cooling circulation pipeline is arranged inside the cabinet body, the bottom of the cooling tower is connected with the cooling pump, the cooling pump is connected with one end of the cooling circulation pipeline, the other end of the cooling circulation pipeline is connected with the upper portion of the cooling tower, and the cooling pump is electrically connected with the control circuit.
Further, the temperature difference semiconductor power generation device further comprises a fan assembly;
The fan assembly comprises a driving motor, a driving shaft body and fan blades, wherein the driving shaft body penetrates through the radiator along the length direction of the radiator, one end of the driving shaft body is connected with the fan blades, the other end of the driving shaft body is connected with the driving motor, and the driving motor is electrically connected with the control circuit.
The temperature difference semiconductor power generation device comprises a temperature difference semiconductor power generation device, a power generation piece assembly through hole, a temperature difference semiconductor power generation device and a temperature difference semiconductor power generation device, wherein the temperature difference semiconductor power generation device further comprises an insulating heat insulation layer, the middle part of the insulating heat insulation layer is provided with a power generation piece assembly through hole in a penetrating mode, one end of the power generation piece assembly through hole is provided with a first step, and the other end of the power generation piece assembly through hole is provided with a second step;
The temperature difference semiconductor power generation piece is assembled in the power generation piece assembly through hole, the cold end radiating surface of the temperature difference semiconductor power generation piece is flush with the step surface of the first step, the second contact plane of the radiator is in contact with the step surface of the first step and the cold end radiating surface, the hot end heating surface of the temperature difference semiconductor power generation piece is flush with the step surface of the second step, and the first contact plane of the heat conductor is in contact with the step surface of the second step and the hot end heating surface.
Further, the temperature difference semiconductor power generation device further comprises an assembly component;
The assembly component comprises a first fixing piece, a second fixing piece, a plurality of fixing bolts and a plurality of fixing nuts, wherein the first fixing piece penetrates through the radiator along the length direction of the radiator, the second fixing piece penetrates through the heat conductor along the length direction of the heat conductor, and the two ends of the first fixing piece and the two ends of the second fixing piece are locked together through the fixing bolts and the fixing nuts;
the insulating layer is clung to the outer wall of the cabinet body, and the fixing bolts sequentially penetrate through the first fixing piece, the insulating layer, the cabinet wall of the cabinet body and the second fixing piece from top to bottom.
The heat conductor comprises a heat conductor body, wherein a first contact plane is formed at the top of the heat conductor body, inclined extension plates are arranged at two ends of the bottom of the heat conductor body in a downward extending mode, vertical heat collecting areas which are gradually enlarged from top to bottom are formed between the bottom of the heat conductor body and the two inclined extension plates, a plurality of first heat conducting blades are arranged in the vertical heat collecting areas at intervals, the first heat conducting blades are perpendicular to the first contact plane, horizontal heat collecting areas are formed at the outer sides of the two inclined extension plates, a plurality of second heat conducting blades are arranged in the horizontal heat collecting areas at intervals, the second heat conducting blades are parallel to the first contact plane, and the inclined extension plates, the first heat conducting blades and the second heat conducting blades extend to the end portions of the two ends of the heat conductor body along the length direction of the heat conductor body.
Further, the radiator comprises a radiating block body and a plurality of radiating pieces, wherein the bottom of the radiating block body forms the second contact plane;
Each radiating piece comprises a radiating fin main body, the lower ends of the radiating fin main bodies are fixedly connected with the arc-shaped convex surfaces, reinforcing radiating fins are uniformly formed on two sides of the upper ends of the radiating fin main bodies, and the radiating fin main bodies and the reinforcing radiating fins extend to the end parts of the two ends of the radiating fin main bodies along the length direction of the radiating fin main bodies.
In a second aspect, a method of operating a fire suppression system utilizing semiconductor power generation, the method of operating comprising the steps of:
the heat generated in the cabinet body is collected by the heat conductor, and the collected heat is used for heating the hot-end heating surface of the temperature difference semiconductor power generation piece;
When the temperature difference between the hot end heating surface and the cold end radiating surface of the temperature difference semiconductor power generation piece exceeds a preset power generation temperature, the temperature difference semiconductor power generation piece starts power generation, and the control circuit is powered through the temperature difference semiconductor power generation piece;
When the temperature difference between the hot end heating surface and the cold end radiating surface is detected to exceed a first temperature difference value or the temperature in the cabinet body is detected to exceed a first temperature value, the control circuit controls the fire extinguishing device to spray fire extinguishing agent into the cabinet body to extinguish fire.
Further, the working method further comprises the following steps:
When the temperature difference between the hot end heating surface and the cold end radiating surface is detected to exceed a second temperature difference value or the temperature in the cabinet body is detected to exceed a second temperature value, the control circuit controls the cooling pump to convey cooling liquid to the cooling circulation pipeline so as to cool the interior of the cabinet body, wherein the second temperature difference value is smaller than the first temperature difference value or the second temperature value is smaller than the first temperature value.
Further, the working method further comprises the following steps:
When the temperature difference semiconductor power generation piece starts to generate power, the control circuit controls the fan assembly to work, so that the cold end radiating surface of the temperature difference semiconductor power generation piece maintains low temperature.
By adopting the technical scheme of the invention, the invention has at least the following beneficial effects:
1. The fire extinguishing system is provided with the temperature difference semiconductor power generation device, the temperature difference semiconductor power generation device comprises the temperature difference semiconductor power generation piece with the hot end heating surface and the cold end radiating surface, the heat conductor and the radiator, the heat conductor is arranged in the cabinet body, and the radiator is arranged outside the cabinet body, so that when a large amount of heat is generated in the cabinet body due to the conditions of heat dissipation of electric products, fire and the like, the heat conductor can be utilized to collect the heat generated in the cabinet body and transfer the heat to the hot end heating surface of the temperature difference semiconductor power generation piece, and meanwhile, the radiator can radiate the cold end radiating surface of the temperature difference semiconductor power generation piece, so that the temperature difference between the hot end heating surface and the cold end radiating surface can be utilized to generate power, and a required working power supply is provided for equipment such as a control circuit, a fire extinguishing device, and the like, the equipment such as the control circuit, the fire extinguishing device and the like is not dependent on an external power supply any more, and the equipment such as the control circuit, the fire extinguishing device and the like can work normally due to the disconnection of the external power supply, the normal functions of the control circuit, the fire extinguishing device and the like can not be influenced due to the disconnection of the external power supply, and the stable fire and the reliable operation of the whole system under the conditions such as the fire and the fire extinguishing condition can be guaranteed.
2. The temperature difference semiconductor power generation device directly utilizes the heat generated in the cabinet body to generate power, can well recycle the heat generated in the cabinet body, avoids heat waste, and can also cause temperature rise around the cabinet body and influence the environment around the cabinet body if the heat in the cabinet body is directly discharged.
3. The fire extinguishing system is further provided with a cooling tower, a cooling pump and a cooling circulation pipeline, the cooling circulation pipeline is arranged in the cabinet body, the cooling tower and the cooling pump are arranged outside the cabinet body, when the condition that the temperature in the cabinet body is too high, the cooling pump can be controlled by the control circuit to suck cooling liquid from the cooling tower, the cooling liquid circularly flows in the cooling circulation pipeline, so that the interior of the cabinet body can be well subjected to heat exchange and temperature reduction, the fire disaster caused by the too high temperature of the cabinet body is reduced, and meanwhile, the cooling pump is powered by the temperature difference semiconductor power generation device without depending on an external power supply, so that the cooling device can be ensured to stably and reliably operate.
4. The temperature difference semiconductor power generation device further comprises an insulating heat insulation layer, a power generation piece assembly through hole is formed in the middle of the insulating heat insulation layer, and a first step and a second step are formed at two ends of the power generation piece assembly through hole respectively, so that when the temperature difference semiconductor power generation device is specifically used, the second contact plane of the temperature difference semiconductor power generation piece and the radiator and the first contact plane of the heat conductor can be coated in the insulating heat insulation layer, the insulating heat insulation layer can be utilized to play an insulating role, the insulating heat insulation layer can be utilized to play a role of blocking heat, and the heat collected by the heat conductor is guaranteed to be not to be lost easily.
5. The heat conductor comprises a heat conducting block body, a vertical heat collecting area is formed below the bottom of the heat conducting block body, a plurality of first heat conducting blades are arranged in the vertical heat collecting area and are perpendicular to a first contact plane, a horizontal heat collecting area is formed on two sides of the vertical heat collecting area, a plurality of second heat conducting blades are arranged in the horizontal heat collecting area, and the second heat conducting blades and the first contact plane are arranged in parallel to each other, so that when the heat conductor is in specific work, heat collection can be carried out on hot air flowing in the vertical direction by using the first heat conducting blades, heat collection can be carried out on hot air flowing in the horizontal direction by using the second heat conducting blades, and the collected heat is transferred to a hot end heating surface of the temperature difference semiconductor power generation sheet through the first contact plane for use.
6. Simultaneously, the radiating piece comprises a radiating fin main body, one end of the radiating fin main body is fixedly connected with the arc convex surface, the two sides of the other end of the radiating fin main body are integrally formed with reinforcing radiating fins, namely, the whole radiating piece is of a Y-shaped structure, the structural design can facilitate circulation of air flow, the whole radiating area is large, a large amount of heat can be taken away, and the radiating effect is improved.
7. Through the middle part at the radiating block body runs through and sets up a plurality of honeycomb hole, on the one hand the structure of honeycomb hole can enough guarantee that whole radiating block body has higher structural strength, on the other hand can increase the radiating area again, promote the radiating effect, simultaneously through still running through on the radiating block body and be provided with a plurality of coolant liquid filling hole for when specifically using, accessible coolant liquid filling hole fills the coolant liquid to the radiating block body internal packing to utilize the coolant liquid to cool down the radiator, this radiating effect that can further promote whole radiator.
Drawings
The invention will be further described with reference to examples of embodiments with reference to the accompanying drawings.
FIG. 1 is an overall block diagram of a fire suppression system utilizing semiconductor power generation in accordance with the present invention;
FIG. 2 is a perspective view of a fire extinguishing system using semiconductor power generation according to the present invention;
FIG. 3 is a front view of a thermoelectric semiconductor power generation device of the present invention;
FIG. 4 is a perspective view of a thermoelectric semiconductor power generation device of the present invention;
FIG. 5 is a schematic view of a thermoelectric semiconductor power generation chip according to the present invention;
FIG. 6 is a cross-sectional view of an insulating layer of the present invention;
FIG. 7 is a perspective view of a heat conductor in accordance with the present invention;
FIG. 8 is a front view of a heat conductor in accordance with the present invention;
FIG. 9 is a perspective view of a heat sink according to the present invention;
FIG. 10 is a front view of a heat sink according to the present invention;
FIG. 11 is a schematic view of the structure of the first fixing piece according to the present invention;
fig. 12 is a schematic structural view of a second fixing piece in the present invention.
Reference numerals illustrate:
a fire suppression system 100;
A cabinet body 1;
The thermoelectric semiconductor power generation device 2, the thermoelectric semiconductor power generation sheet 21, the hot-end heating surface 211, the cold-end heat radiation surface 212, the heat conductor 22, the first contact plane 221, the second fitting hole 222, the heat-conducting block body 223, the inclined extension plate 2231, the vertical heat collection area 2232, the first heat-conducting blade 2233, the horizontal heat collection area 2234, the second heat-conducting blade 2235, the heat radiator 23, the second contact plane 231, the first fitting hole 232, the heat-radiating block body 233, the heat-radiating member 234, the heat-radiating fin body 2341, the reinforcing heat-radiating blade 2342, the arc-shaped convex surface 235, the honeycomb hole 236, the cooling liquid filling hole 237, the shaft hole 238, the fan assembly 24, the driving motor 241, the driving shaft body 242, the fan blade 243, the insulating and heat-insulating layer 25, the power-generating-sheet fitting through hole 251, the first step 252, the second step 253, the fitting assembly 26, the first fixing piece 261, the first piece body 2611, the second piece body 2612, the first reinforcing rib 2613, the second fixing piece 262, the third 2621, the fourth piece 2621, the second reinforcing rib 2623, the fixing bolt 263, the fixing nut 264;
a control circuit 3, a signal antenna 31;
A fire extinguishing device 4, a fire extinguishing agent nozzle 41;
a cooling device 5, a cooling tower 51, a cooling pump 52, and a cooling circulation pipe 53.
Detailed Description
In order to better understand the technical scheme of the present invention, the following detailed description will refer to the accompanying drawings and specific embodiments.
It should be noted herein that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing these embodiments and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operate in a specific orientation. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.
Example 1
Referring to fig. 1 to 12, a fire extinguishing system 100 using semiconductor power generation according to a preferred embodiment of the present invention, the fire extinguishing system 100 includes:
The cabinet body 1 may be a cabinet used by various existing electrical products, and in a specific use process, heat is generated inside the cabinet body 1 due to the influence of environmental factors, heat dissipation factors of various electrical products and the like;
The thermoelectric semiconductor power generation device 2 comprises a thermoelectric semiconductor power generation sheet 21 with a hot end heating surface 211 and a cold end radiating surface 212, a heat conductor 22 and a radiator 23, wherein the thermoelectric semiconductor power generation sheet 1 is clamped between the heat conductor 22 and the radiator 23, the heat conductor 22 is fixed inside a cabinet body 1, the heat conductor 22 is provided with a first contact plane 221 contacted with the hot end heating surface 211, the radiator 23 is fixed outside the cabinet body 1, and the radiator 23 is provided with a second contact plane 231 contacted with the cold end radiating surface 212;
The control circuit 3 is arranged inside the cabinet body 1 or outside the cabinet body 1, namely the control circuit 3 is arranged inside or outside the cabinet body 1, the temperature difference semiconductor power generation sheet 21 is electrically connected with the control circuit 3, and the temperature difference semiconductor power generation sheet 21 can supply power to the control circuit 3 after generating power;
The fire extinguishing device 4 is arranged in the cabinet body 1, the fire extinguishing agent nozzle 41 is connected with the fire extinguishing device 4, the fire extinguishing device 4 is electrically connected with the control circuit 3, and when the temperature difference semiconductor power generation piece 21 starts to generate power and supplies power to the control circuit 3 in specific work, the control circuit 3 can provide a required working power supply for the fire extinguishing device 4, so that the cabinet body 1 can control the fire extinguishing device 4 to release fire extinguishing agent to extinguish fire when the temperature of the cabinet body 1 is too high or a fire disaster occurs.
By adopting the technical scheme provided by the invention, the method has at least the following beneficial effects:
1. The fire extinguishing system 100 is provided with the temperature difference semiconductor power generation device 2, the temperature difference semiconductor power generation device 2 comprises the temperature difference semiconductor power generation sheet 21 with the hot end heating surface 211 and the cold end cooling surface 212, the heat conductor 22 and the radiator 23, the heat conductor 22 is arranged in the cabinet body 1, and the radiator 23 is arranged outside the cabinet body 1, so that when a large amount of heat is generated in the cabinet body 1 due to the conditions of heat dissipation of electric products, fire and the like, the heat conductor 22 can be utilized to collect the heat generated in the cabinet body 1 and transfer the heat to the hot end heating surface 211 of the temperature difference semiconductor power generation sheet 21, and meanwhile, the radiator 23 can radiate the heat of the cold end cooling surface 212 of the temperature difference semiconductor power generation sheet 21, so that the temperature difference semiconductor power generation sheet 21 can utilize the temperature difference of the hot end heating surface 211 and the cold end cooling surface 212 to generate power, and provide required working power for equipment such as the control circuit 3, the fire extinguishing device 4 and the like, and the equipment such as the control circuit 3, the fire extinguishing device 4 and the like are not dependent on external power supply, when the external power is disconnected, the equipment such as the control circuit 3, the fire extinguishing device 4 and the like can work, the fire extinguishing system can not be guaranteed to work normally due to the fact that the fire extinguishing function can be normally influenced by the external power disconnection and the fire extinguishing system can be guaranteed.
2. The temperature difference semiconductor power generation device 2 directly utilizes the heat generated in the cabinet body 1 to generate power, can well recycle the heat generated in the cabinet body 1, avoids heat waste, and can also cause the temperature around the cabinet body 1 to rise and influence the environment around the cabinet body 1 if the heat in the cabinet body 1 is directly discharged.
In the preferred embodiment of the present invention, please refer to fig. 1, in order to facilitate cooling the interior of the cabinet body 1 when the temperature is too high, the fire extinguishing system 100 further includes a cooling device 5;
the cooling device 5 comprises a cooling tower 51, a cooling pump 52 and a cooling circulation pipeline 53, wherein the cooling tower 51 and the cooling pump 52 are arranged outside the cabinet body 1, the cooling circulation pipeline 53 is arranged inside the cabinet body 1, the bottom of the cooling tower 51 is connected with the cooling pump 52, the cooling pump 52 is connected with one end of the cooling circulation pipeline 53, the other end of the cooling circulation pipeline 53 is connected with the upper portion of the cooling tower 51, and the cooling pump 52 is electrically connected with the control circuit 3. When the cooling device 5 specifically works, the control circuit 3 can be used for controlling the cooling pump 52 to work, so that the cooling pump 52 sucks cooling liquid from the cooling tower 51 and conveys the cooling liquid to the cooling circulation pipeline 53, and the cooling circulation pipeline 53 is arranged in the cabinet body 1, so that the cooling liquid can exchange heat and cool the interior of the cabinet body 1 when passing through the cooling circulation pipeline 53.
The fire extinguishing system 100 is further provided with the cooling tower 51, the cooling pump 52 and the cooling circulation pipeline 53, the cooling circulation pipeline 53 is arranged in the cabinet body 1, the cooling tower 51 and the cooling pump 52 are arranged outside the cabinet body 1, when the temperature in the cabinet body 1 is too high, the control circuit 3 can be used for controlling the cooling pump 52 to suck cooling liquid from the cooling tower 51 and enable the cooling liquid to circulate in the cooling circulation pipeline 53, so that heat exchange and cooling can be well performed on the interior of the cabinet body 1, fire disasters caused by the fact that the temperature in the cabinet body 1 is too high are reduced, meanwhile, the cooling pump 52 also uses the temperature difference semiconductor power generation device 2 to supply power, no external power source is needed, and stable and reliable operation of the cooling device 5 is ensured.
In the preferred embodiment of the present invention, please refer to fig. 3 and 4, in order to improve the heat dissipation efficiency of the heat sink 23, the thermoelectric semiconductor power generation device 2 further includes a fan assembly 24;
The fan assembly 24 comprises a driving motor 241, a driving shaft 242 and fan blades 243, wherein the driving shaft 242 penetrates through the radiator 23 along the length direction of the radiator 23, one end of the driving shaft 242 is connected with the fan blades 243, the other end of the driving shaft 242 is connected with the driving motor 241, and the driving motor 241 is electrically connected with the control circuit 3. Specifically, the heat sink 23 is provided with a shaft hole 238 extending therethrough in the longitudinal direction, and the driving shaft 242 extends through the heat sink 23 via the shaft hole 238. When the fan assembly 24 is specifically working, after the thermoelectric semiconductor power generation sheet 21 starts to generate power and power the control circuit 3, the control circuit 3 controls the driving motor 241 to drive the driving shaft 242, and the driving shaft 242 drives the fan blades 243 to rotate, so as to blow cold air to the radiator 23, and improve the heat dissipation efficiency of the radiator 23.
In the preferred embodiment of the present invention, please refer to fig. 6 with emphasis on the description, the thermoelectric semiconductor power generation device 2 further comprises an insulating and heat-insulating layer 25, wherein the insulating and heat-insulating layer 25 is made of an insulating and heat-insulating material, a power generation piece assembling through hole 251 is arranged in the middle of the insulating and heat-insulating layer 25 in a penetrating way so as to mount the thermoelectric semiconductor power generation piece 21 into the insulating and heat-insulating layer 25, a first step 252 is formed at one end of the power generation piece assembling through hole 251, and a second step 253 is formed at the other end of the power generation piece assembling through hole 251;
The thermoelectric semiconductor power generation piece 21 is assembled in the power generation piece assembling through hole 251, the cold end radiating surface 212 of the thermoelectric semiconductor power generation piece 21 is flush with the step surface of the first step 252, the second contact plane 231 of the radiator 23 is in contact with the step surface of the first step 252 and the cold end radiating surface 212, the hot end heating surface 211 of the thermoelectric semiconductor power generation piece 21 is flush with the step surface of the second step 253, and the first contact plane 221 of the heat conductor 22 is in contact with the step surface of the second step 253 and the hot end heating surface 211.
The temperature difference semiconductor power generation device 2 further comprises the insulating and heat-insulating layer 25, the power generation piece assembly through hole 251 is formed in the middle of the insulating and heat-insulating layer 25, and the first step 252 and the second step 253 are formed at the two ends of the power generation piece assembly through hole 251 respectively, so that when the temperature difference semiconductor power generation device is specifically used, the temperature difference semiconductor power generation piece 21, the second contact plane 231 of the radiator 23 and the first contact plane 221 of the heat conductor 22 can be coated in the insulating and heat-insulating layer 25, and therefore the insulating and heat-insulating layer 25 can be utilized to play a role in insulating heat, the insulating and heat-insulating layer 25 can play a role in blocking heat, and the heat collected by the heat conductor 22 is not easy to dissipate.
In the preferred embodiment of the present invention, please refer to fig. 3, 4, 11 and 12, in order to achieve reliable assembly of the heat sink 23, the insulating layer 25, the thermoelectric semiconductor power generation sheet 21 and the heat conductor 22, the thermoelectric semiconductor power generation device 2 further comprises an assembly component 26;
The assembly component 26 comprises a first fixing piece 261, a second fixing piece 262, a plurality of fixing bolts 263 and a plurality of fixing nuts 264, wherein the first fixing piece 261 penetrates through the radiator 23 along the length direction of the radiator 23, the second fixing piece 262 penetrates through the heat conductor 22 along the length direction of the heat conductor 22, and two ends of the first fixing piece 261 and the second fixing piece 262 are locked together through the fixing bolts 263 and the fixing nuts 264, so that the temperature difference semiconductor power generation piece 21 can be clamped between the radiator 23 and the heat conductor 22;
The insulating layer 25 is tightly attached to the outer wall of the cabinet body 1, the fixing bolts 263 sequentially penetrate through the first fixing piece 261, the insulating layer 25, the cabinet wall of the cabinet body 1 and the second fixing piece 262 from top to bottom, and two ends of the first fixing piece 261 and two ends of the second fixing piece 262 are respectively provided with at least two fixing bolts 263 and at least two fixing nuts 264, so that the radiator 23, the thermoelectric semiconductor power generation piece 21 and the heat conductor 22 can be better and more reliably locked and fixed together.
More specifically, the surfaces of the first and second fixing plates 261 and 262 each have a heat conductive and insulating layer (not shown). Since the first and second fixing plates 261 and 262 are only used to lock and fix the heat sink 23, the thermoelectric semiconductor power generation plate 21, and the heat conductor 22 together, heat transfer to the first and second fixing plates 261 and 262 can be avoided by designing the surfaces of the first and second fixing plates 261 and 262 to have heat conductive insulating layers, thereby reducing heat loss.
More specifically, in order to better lock and fix the radiator 23, the thermoelectric semiconductor power generation piece 21 and the heat conductor 22 together and ensure the strength of the first fixing piece 261 and the second fixing piece 262, two first assembling holes 232 are formed in the radiator 23 in a penetrating manner, two second assembling holes 222 are formed in the heat conductor 22 in a penetrating manner, the first fixing piece 261 comprises a first sheet body 2611 and a second sheet body 2612, one ends of the first sheet body 2611 and the second sheet body 2612 are integrally and fixedly connected together, the other ends of the first sheet body 2611 and the second sheet body 2612 penetrate through the radiator 23 through the first assembling holes 232, meanwhile, first reinforcing ribs 2613 are arranged on the surfaces of the first sheet body 2611 and the second sheet body 2612, the second fixing piece 262 comprises a third sheet body 2621 and a fourth sheet body 2622, one ends of the third sheet body 2621 and the fourth sheet body 2622 are integrally and fixedly connected together, and the other ends of the third sheet body 2621 and the fourth sheet body 2622 penetrate through the second sheet body 2621 and the second sheet body 2622 through the second reinforcing ribs 2621 and the surfaces 2622.
In the preferred embodiment of the present invention, please refer to fig. 7 and 8, the heat conductor 22 includes a heat conducting block body 223, the top of the heat conducting block body 223 forms the first contact plane 221, two ends of the bottom of the heat conducting block body 223 are provided with inclined extending plates 2231 extending downward, specifically, the inclined extending plates 2231 are gradually arranged outwards from top to bottom, a vertical heat collecting area 2232 expanding gradually from top to bottom is formed between the bottom of the heat conducting block body 223 and the two inclined extending plates 2231, a plurality of first heat conducting blades 2233 are arranged in the vertical heat collecting area 2232 at intervals, each first heat conducting blade 2233 is arranged perpendicular to the first contact plane 221, and because the vertical heat collecting area 2232 expands gradually from top to bottom, more first heat conducting blades 2233 can be arranged in the vertical heat collecting area 2232, thereby improving the heat collecting effect;
The outer sides of the two inclined extending plates 2231 are respectively formed with a horizontal heat collecting area 2234, a plurality of second heat conducting blades 2235 are arranged in the horizontal heat collecting area 2234 at intervals, each second heat conducting blade 2235 is parallel to the first contact plane 221, and the inclined extending plates 2231, the first heat conducting blades 2233 and the second heat conducting blades 2235 extend to the end parts of the two ends of the heat conducting block body 223 along the length direction of the heat conducting block body 223, so that the areas of the first heat conducting blades 2233 and the second heat conducting blades 2235 can be increased, and the heat collecting effect is improved.
According to the invention, the heat conductor 22 comprises the heat conducting block body 223, the vertical heat collecting area 2232 is formed below the bottom of the heat conducting block body 223, the plurality of first heat conducting blades 2233 are arranged in the vertical heat collecting area 2232, the first heat conducting blades 2233 and the first contact plane 221 are mutually perpendicular, meanwhile, the horizontal heat collecting areas 2234 are formed on two sides of the vertical heat collecting area 2232, the plurality of second heat conducting blades 2235 are arranged in the horizontal heat collecting area 2234, and the second heat conducting blades 2235 and the first contact plane 221 are mutually parallel, so that in specific work, heat can be collected by utilizing the first heat conducting blades 2233 of each piece, heat can be collected by utilizing the second heat conducting blades 2235 of each piece to heat the hot air flowing in the vertical direction, and the collected heat can be transferred to the hot end 211 of the thermoelectric semiconductor power generation piece 21 through the first contact plane 221 for use, and therefore the heat generated in the heat conductor body 1 can be effectively collected by the heat conductor 22, and the thermoelectric power generation piece 21 can be provided for reliably generating heat by the thermoelectric power generation piece 21.
As a specific embodiment of the present invention, a part of the upper ends of the first heat-conducting blades 2233 are fixedly connected to the bottom of the heat-conducting block body 223, another part of the upper ends of the first heat-conducting blades 2233 are fixedly connected to the inner side of the inclined extension plate 2231, and the lower ends of the first heat-conducting blades 2233 are positioned on the same horizontal line, one end of each second heat-conducting blade 2235 is fixedly connected to the outer side of the inclined extension plate 2231, and the free ends of the second heat-conducting blades 2235 on the same side are positioned on the same vertical line, so that the appearance of the whole heat-conducting device 22 is more neat and attractive.
In the preferred embodiment of the present invention, please refer to fig. 9 and 10, the heat sink 23 includes a heat sink body 233 and a plurality of heat dissipation members 234, wherein the bottom of the heat sink body 233 forms the second contact plane 231, the top of the heat sink body 233 forms an arc convex surface 235, and the heat dissipation members 234 are disposed on the arc convex surface 235 at intervals;
Each heat dissipation member 234 includes a heat dissipation plate body 2341, wherein a lower end of the heat dissipation plate body 2341 is fixedly connected with the arc-shaped convex surface 235, reinforced heat dissipation blades 2342 are uniformly formed on both sides of an upper end of the heat dissipation plate body 2341, and the heat dissipation plate body 2341 and the reinforced heat dissipation blades 2342 extend to end portions of both ends of the heat dissipation plate body 233 along a length direction of the heat dissipation plate body 233.
According to the invention, the radiating block body 233 of the radiator 23 is provided with the second contact plane 231 which is in fit contact with the cold end radiating surface 212 of the temperature difference semiconductor power generation piece 21, the arc-shaped convex surface 235 is formed on one surface of the radiating block body 233 far away from the second contact plane 231, and the plurality of radiating pieces 234 are arranged on the arc-shaped convex surface 235 at intervals, so that the radiating surface can be effectively enlarged, the radiator 23 is ensured to have a better radiating effect, meanwhile, the radiating pieces 234 comprise radiating fin bodies 2341, one ends of the radiating fin bodies 2341 are fixedly connected with the arc-shaped convex surface 235, and reinforcing radiating fins 2342 are integrally formed on two sides of the other ends of the radiating fin bodies 2341, namely, the whole radiating piece 234 is of a Y-shaped structure.
More specifically, the middle part of the heat dissipating block body 233 is provided with a plurality of honeycomb holes 236 and a plurality of coolant filling holes 237, each honeycomb hole 236 penetrates through the heat dissipating block body 233 along the length direction of the heat dissipating block body 233, each coolant filling hole 237 penetrates through the heat dissipating block body 233 along the length direction of the heat dissipating block body 233, and each end of each coolant filling hole 237 is provided with a sealing plug (not shown), when the coolant filling hole 237 is filled with coolant, the end of the coolant filling hole 237 can be sealed by the sealing plug, so that the coolant is prevented from flowing out of the end of the coolant filling hole 237. According to the invention, the middle part of the radiating block body 233 is provided with the plurality of honeycomb holes 236 in a penetrating way, so that on one hand, the structure of the honeycomb holes 236 can ensure that the whole radiating block body 233 has higher structural strength, on the other hand, the radiating area can be increased, and the radiating effect can be improved, and on the other hand, the radiating block body 233 is provided with the plurality of cooling liquid filling holes 237 in a penetrating way, so that when the radiating block is particularly used, the cooling liquid can be filled into the radiating block body 233 through the cooling liquid filling holes 237, and the radiator 23 is cooled by using the cooling liquid, so that the radiating effect of the whole radiator 23 can be further improved.
In the embodiment of the present invention, the cooling liquid filling holes 237 do not penetrate through the heat dissipating block body 233, so that only one end of the cooling liquid filling holes 237 is required to be provided with a sealing plug, and no sealing plugs are required to be provided at both ends of the cooling liquid filling holes 237, and meanwhile, the number of the cooling liquid filling holes 237 can be set according to the needs, for example, 8 to 10 cooling liquid filling holes 237 can be set.
In the preferred embodiment of the present invention, the fire extinguishing device 4 may be an internal pressure storage fire extinguishing device or a non-pressure fire extinguishing device, wherein the internal pressure storage fire extinguishing device is started by electromagnetic and uses internal nitrogen as driving gas to drive the fire extinguishing agent to release, the non-pressure fire extinguishing device uses electricity to trigger hot aerosol to generate a large amount of pressure gas, and then uses the pressure gas to drive the fire extinguishing agent to release, and the starting energy of the internal pressure storage fire extinguishing device or the non-pressure fire extinguishing device is from the thermoelectric semiconductor power generation device 2.
In a preferred embodiment of the present invention, the control circuit 3 is a low power control circuit, and the control circuit 3 is configured with a storage capacitor (not shown). The invention adopts the low-power consumption control circuit as the control circuit 3 of the whole fire extinguishing system 100, so that the whole fire extinguishing system 100 can reduce the power consumption, the use requirement can be met by only utilizing the self power generation of the temperature difference semiconductor power generation sheet 21, and meanwhile, the control circuit 3 is also provided with the energy storage capacitor, and the electric energy generated by the power generation of the temperature difference semiconductor power generation sheet 21 can be stored in the energy storage capacitor. In addition, the control circuit 3 has NB communication function, and can communicate with a mobile phone or a web terminal, so as to display the temperature difference, current, voltage, whether the fan assembly 24 is operated or not, and output and feedback of signals, etc. at the same time, the control circuit 3 is further connected with a signal antenna 31, so that the signal antenna 31 is used to realize the receiving and transmitting of signals.
Example 2
Referring to fig. 1 to 12, the method for operating a fire extinguishing system 100 using semiconductor power generation according to the present invention, wherein the specific structure of the fire extinguishing system 100 is described in detail with reference to embodiment 1, and will not be described herein, and the method for operating the fire extinguishing system comprises the following steps:
The heat conductor 22 is used for collecting heat generated in the cabinet body 1 and heating a hot end heating surface 211 of the temperature difference semiconductor power generation piece 21, and the radiator 23 is used for radiating and cooling a cold end radiating surface 212 of the temperature difference semiconductor power generation piece 21, so that various electric products are placed in the cabinet body 1, and heat is generated in the cabinet body 1 due to self radiation of the various electric products in a specific operation process, particularly, when a protection area in the cabinet body 1 is out of control or a fire disaster occurs, a large amount of heat is generated in the cabinet body 1;
When the temperature difference between the hot end heating surface 211 and the cold end radiating surface 212 of the temperature difference semiconductor power generation sheet 21 exceeds a preset power generation temperature, the temperature difference semiconductor power generation sheet 21 starts power generation, and the control circuit 3 is powered through the temperature difference semiconductor power generation sheet 21, so that the control circuit 3 can stably and reliably work without depending on an external power supply;
When the temperature difference between the hot-end heating surface 211 and the cold-end radiating surface 212 is detected to exceed the first temperature difference value or the temperature in the cabinet body 1 is detected to exceed the first temperature value, the control circuit 3 controls the fire extinguishing device 4 to spray fire extinguishing agent into the cabinet body 1 for extinguishing fire, so that the loss caused by fire is reduced. In the embodiment of the invention, the first temperature difference value or the first temperature value can be set according to the actual situation, and when the first temperature difference value is adopted for judgment, a temperature sensor is not required to be additionally arranged in the cabinet body 1, so that the temperature difference between the hot end heating surface 211 and the cold end radiating surface 212 of the temperature difference semiconductor power generation piece 21 can be directly utilized for judgment, and when the first temperature value is adopted for judgment, a temperature sensor is required to be additionally arranged in the cabinet body 1, so that the temperature in the cabinet body 1 is monitored by the temperature sensor.
In a preferred embodiment of the present invention, the working method further comprises the steps of:
When it is detected that the temperature difference between the hot-end heating surface 211 and the cold-end radiating surface 212 exceeds a second temperature difference value or the temperature in the cabinet body 1 exceeds a second temperature value, the control circuit 3 controls the cooling pump 52 to deliver the cooling liquid to the cooling circulation pipeline 53, so as to cool the interior of the cabinet body 1, wherein the second temperature difference value is smaller than the first temperature difference value or the second temperature value is smaller than the first temperature value. In the embodiment of the invention, the second temperature difference value or the second temperature value can be set according to the actual situation, and when the second temperature difference value is adopted for judgment, a temperature sensor is not required to be additionally arranged in the cabinet body 1, so that the temperature difference between the hot end heating surface 211 and the cold end radiating surface 212 of the temperature difference semiconductor power generation piece 21 can be directly utilized for judgment, and when the second temperature value is adopted for judgment, a temperature sensor is required to be additionally arranged in the cabinet body 1, so that the temperature in the cabinet body 1 is monitored by the temperature sensor. For example, when monitoring with a temperature sensor, the first temperature value may be set at 75 ℃ and the second temperature value may be set at 95 ℃. When the temperature difference between the hot-end heating surface 211 and the cold-end radiating surface 212 exceeds the second temperature difference value or the temperature in the cabinet body 1 is detected to exceed the second temperature value, the cooling pump 52 is controlled to convey the cooling liquid to the cooling circulation pipeline 53, so that the interior of the cabinet body 1 is cooled, and the probability of fire occurrence caused by overhigh temperature can be effectively reduced.
In a preferred embodiment of the present invention, the working method further comprises the steps of:
When the thermoelectric semiconductor power generation piece 21 starts to generate power, the control circuit 3 controls the fan assembly 24 to work, so that the cold end radiating surface 212 of the thermoelectric semiconductor power generation piece 21 maintains low temperature, and the thermoelectric semiconductor power generation piece 21 can better utilize the temperature difference to generate power.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that the specific embodiments described are illustrative only and not intended to limit the scope of the invention, and that equivalent modifications and variations of the invention in light of the spirit of the invention will be covered by the claims of the present invention.
Claims (9)
1. A fire extinguishing system using semiconductor power generation, characterized in that the fire extinguishing system comprises:
A cabinet body;
The thermoelectric semiconductor power generation device comprises a thermoelectric semiconductor power generation piece with a hot end heating surface and a cold end radiating surface, a heat conductor and a radiator, wherein the thermoelectric semiconductor power generation piece is clamped between the heat conductor and the radiator; the temperature difference semiconductor power generation device further comprises an insulating and heat-insulating layer, a power generation piece assembly through hole is formed in the middle of the insulating and heat-insulating layer in a penetrating mode, a first step is formed at one end of the power generation piece assembly through hole, a second step is formed at the other end of the power generation piece assembly through hole, the temperature difference semiconductor power generation piece is assembled in the power generation piece assembly through hole, the cold end radiating surface of the temperature difference semiconductor power generation piece is flush with the step surface of the first step, the second contact surface of the radiator is flush with the step surface of the first step and the cold end radiating surface, the hot end radiating surface of the temperature difference semiconductor power generation piece is flush with the step surface of the second step, and the first contact surface of the heat conductor is flush with the step surface of the second step;
The radiator comprises a radiator block body, wherein the middle part of the radiator block body is provided with a plurality of honeycomb holes and a plurality of cooling liquid filling holes, and each honeycomb hole penetrates through the radiator block body along the length direction of the radiator block body;
the control circuit is arranged inside the cabinet body or outside the cabinet body, and the temperature difference semiconductor power generation piece is electrically connected with the control circuit;
the fire extinguishing device is characterized in that a fire extinguishing agent nozzle is arranged in the cabinet body and connected with the fire extinguishing device, and the fire extinguishing device is electrically connected with the control circuit.
2. A fire suppression system utilizing semiconductor power generation as recited in claim 1 further comprising a cooling device;
The cooling device comprises a cooling tower, a cooling pump and a cooling circulation pipeline, wherein the cooling tower and the cooling pump are arranged outside the cabinet body, the cooling circulation pipeline is arranged inside the cabinet body, the bottom of the cooling tower is connected with the cooling pump, the cooling pump is connected with one end of the cooling circulation pipeline, the other end of the cooling circulation pipeline is connected with the upper portion of the cooling tower, and the cooling pump is electrically connected with the control circuit.
3. A fire suppression system utilizing semiconductor power generation as recited in claim 1 wherein said thermoelectric semiconductor power generation device further comprises a fan assembly;
The fan assembly comprises a driving motor, a driving shaft body and fan blades, wherein the driving shaft body penetrates through the radiator along the length direction of the radiator, one end of the driving shaft body is connected with the fan blades, the other end of the driving shaft body is connected with the driving motor, and the driving motor is electrically connected with the control circuit.
4. A fire suppression system utilizing semiconductor power generation as recited in claim 1 wherein said thermoelectric semiconductor power generation device further comprises a mounting assembly;
The assembly component comprises a first fixing piece, a second fixing piece, a plurality of fixing bolts and a plurality of fixing nuts, wherein the first fixing piece penetrates through the radiator along the length direction of the radiator, the second fixing piece penetrates through the heat conductor along the length direction of the heat conductor, and the two ends of the first fixing piece and the two ends of the second fixing piece are locked together through the fixing bolts and the fixing nuts;
the insulating layer is clung to the outer wall of the cabinet body, and the fixing bolts sequentially penetrate through the first fixing piece, the insulating layer, the cabinet wall of the cabinet body and the second fixing piece from top to bottom.
5. A fire extinguishing system utilizing a semiconductor to generate electricity is characterized in that the heat conductor comprises a heat conducting block body, the top of the heat conducting block body forms a first contact plane, two ends of the bottom of the heat conducting block body are provided with inclined extending plates in a downward extending mode, a vertical heat collecting area which gradually expands from top to bottom is formed between the bottom of the heat conducting block body and the two inclined extending plates, a plurality of first heat conducting blades are arranged in the vertical heat collecting area at intervals, each first heat conducting blade is arranged perpendicular to the first contact plane, a horizontal heat collecting area is formed on the outer sides of the two inclined extending plates, a plurality of second heat conducting blades are arranged in the horizontal heat collecting area at intervals, each second heat conducting blade is arranged parallel to the first contact plane, and the inclined extending plates, the first heat conducting blades and the second heat conducting blades extend to the ends of the two ends of the heat conducting block body along the length direction of the heat conducting block body.
6. The fire extinguishing system utilizing semiconductor power generation of claim 1, wherein the heat sink further comprises a plurality of heat dissipation elements, wherein the bottom of the heat dissipation block body forms the second contact plane;
Each radiating piece comprises a radiating fin main body, the lower ends of the radiating fin main bodies are fixedly connected with the arc-shaped convex surfaces, reinforcing radiating fins are uniformly formed on two sides of the upper ends of the radiating fin main bodies, and the radiating fin main bodies and the reinforcing radiating fins extend to the end parts of the two ends of the radiating fin main bodies along the length direction of the radiating fin main bodies.
7. A method of operating a fire suppression system utilizing semiconductor power as recited in any one of claims 1-6, wherein the method of operating comprises the steps of:
the heat generated in the cabinet body is collected by the heat conductor, and the collected heat is used for heating the hot-end heating surface of the temperature difference semiconductor power generation piece;
When the temperature difference between the hot end heating surface and the cold end radiating surface of the temperature difference semiconductor power generation piece exceeds a preset power generation temperature, the temperature difference semiconductor power generation piece starts power generation, and the control circuit is powered through the temperature difference semiconductor power generation piece;
When the temperature difference between the hot end heating surface and the cold end radiating surface is detected to exceed a first temperature difference value or the temperature in the cabinet body is detected to exceed a first temperature value, the control circuit controls the fire extinguishing device to spray fire extinguishing agent into the cabinet body to extinguish fire.
8. A method of operating a fire suppression system utilizing semiconductor power generation as recited in claim 7, further comprising the steps of:
When the temperature difference between the hot end heating surface and the cold end radiating surface is detected to exceed a second temperature difference value or the temperature in the cabinet body is detected to exceed a second temperature value, the control circuit controls the cooling pump to convey cooling liquid to the cooling circulation pipeline so as to cool the interior of the cabinet body, wherein the second temperature difference value is smaller than the first temperature difference value or the second temperature value is smaller than the first temperature value.
9. A method of operating a fire suppression system utilizing semiconductor power generation as recited in claim 7, further comprising the steps of:
When the temperature difference semiconductor power generation piece starts to generate power, the control circuit controls the fan assembly to work, so that the cold end radiating surface of the temperature difference semiconductor power generation piece maintains low temperature.
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| JP2005345146A (en) * | 2004-05-31 | 2005-12-15 | Tdk Corp | Measuring instrument of concentration of carbon dioxide, method for measuring concentration of carbon dioxide and combustion device |
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| CN205026735U (en) * | 2015-09-07 | 2016-02-10 | 天津市天楚科技有限公司 | Portable electricity generation faggots stove |
| CN205882488U (en) * | 2016-06-23 | 2017-01-11 | 菲亿频电气集团有限公司 | Reducing fever cubical switchboard |
| CN106621150A (en) * | 2016-10-11 | 2017-05-10 | 山东科技大学 | Automatic fire extinguishing monitoring system based on thermoelectric power generation |
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