Detailed Description
The present application will be described in further detail with reference to fig. 1 to 7.
The 3.5MM infrared receiving wire interfaces circulated in the market are defined in various ways, and the wire interfaces are not only divided into 5V and 12V power supplies, but also connected in different wire sequences under the same power supply voltage. As shown in part a of fig. 1, the infrared receiving wire interfaces are typically TRS interfaces, corresponding to the names TIP, RING and SLEEVE. Under the TRS interface structure, there may be different interface definitions of the receive wires produced by different manufacturers. For a non-standard 5V interface, the TIP terminal is the signal line, the RING is the 5V power line, and the SLEEVE terminal is the ground, as described in section B of fig. 1. For a standard 5V interface, the TIP end is a 5V power line, the RING RING is a signal line, and the SLEEVE end is a ground line. For a standard 12V interface, the TIP end is a signal line, the RING RING is a ground line, and the SLEEVE end is a 12V power line.
In addition, the default level state and the trigger level state of the signal line are different for different types of interfaces. As shown in part C of fig. 1, when the interface supplies power to the 5V power supply, the default level of the signal line is high, and the trigger is low. When the interface supplies power for the 12V power supply, the default level of the signal line is low level, and the trigger level is high level.
The embodiment of the application discloses an infrared receiving head circuit supporting multiple standards, which can supply power to infrared receiving heads with different interface types for use, simultaneously receives infrared trigger signals, and carries out level transition on the trigger signals to form uniform detection trigger signals, thereby realizing that a back-end chip can decode infrared signals generated by infrared generating devices with all interface types when decoding.
Referring to fig. 2, an infrared receiver head circuit supporting various standards includes a control module 1, a line sequence matching module 3, and a signal level conversion module 4. The infrared receiving head is connected with the line sequence matching module 3 through the infrared input seat 2, and after the interface type of the infrared receiving head is determined, the control module 1 outputs a first control signal and a second control signal together. At this time, the wire sequence matching module 3 changes the type between the corresponding wire sequences in the infrared input seat 2 after receiving the first control signal and the second control signal, so as to be applicable to the interface type of the infrared wire. Then, the signal level conversion module 4 carries out level conversion on the infrared signals received in the infrared input seat 2, and converts different high and low level trigger detection into low level trigger detection, so that unified decoding of subsequent chips is realized.
The line sequence matching module 3 is connected to the infrared input base 2 and the control module 1, and the line sequence matching module 3 includes a line sequence switching unit 31, a first power supply switching unit 32, and a second power supply switching unit 33. The first power supply switching unit 32 is used for determining whether to provide 12V power according to the first control signal, and the second power supply switching unit 33 is used for determining whether to provide 5V power according to whether the first power supply switching unit 32 outputs the third control signal.
The line sequence switching unit 31 and the first power supply switching unit 32 are both connected to the infrared input seat 2, the second power supply switching unit 33 is respectively connected to the line sequence power supply unit and the first power supply unit, the first power supply switching unit 32 is configured to receive the first control signal and then change one pin voltage of the infrared input seat 2 and simultaneously output the third control signal, the second power supply switching unit 33 is configured to receive the first control signal and the third control signal and then output the standard voltage, and the line sequence switching unit 31 is configured to receive the second control signal and the standard voltage and then change the other two pin voltages of the infrared input seat 2.
Specifically, under the condition that the first power supply switching unit 32 controls the voltage of one pin of the infrared input seat 2 to be 0, namely, the pin is grounded, the first power supply switching unit 32 outputs a third control signal, the second power supply switching unit 33 is controlled to output 5V voltage, and meanwhile, the second control signal controls the line sequence switching unit 31 to change the line sequence, so that the type between other two wires in the infrared input seat 2 is switched between a signal wire and a power wire, and the interface type is switched between nonstandard 5V and standard 5V.
When the first power supply switching unit 32 controls the voltage of one pin of the infrared input seat 2 to be 12V, the second power supply switching unit 33 receives the first control signal, directly locks the output voltage of the second power supply switching unit 33 to be 0, namely, to be grounded, and controls the line sequence between other two wires in the infrared input seat 2 by the second control signal, so that the interface type is standard 12V.
The signal level conversion module 4 is respectively connected with the infrared input seat 2 and the control module 1, and the signal level conversion module 4 is configured to perform level conversion on the received infrared signals under various line sequence standards according to the received first control signals so as to obtain detection trigger signals with low level trigger modes.
The signal level conversion module comprises a NAND gate unit 41 and a level trigger unit 42, wherein the NAND gate unit 41 is connected with the infrared input seat 2, and the level trigger unit 42 is connected with the NAND gate unit 41. The nand gate unit 41 performs level transition on the received infrared signal in the infrared input seat 2, and the level trigger unit 42 processes the received transition level signal and outputs a detection trigger signal with a uniform trigger pattern.
Referring to fig. 3 and 4, the line-sequence switching unit 31 includes a first resistor R1, a second resistor R2, a first transistor B1, a first schottky diode D1, and a first analog switching chip U1. The first resistor R1 is connected in series between a first pin of the infrared input socket 2 and an emitter of the first triode B1, the emitter of the first triode B1 also being connected to a second pin of the infrared input socket 2. The second resistor R2 is connected in series between the third pin of the infrared input socket 2 and the base of the first triode B1, and the collector of the first triode B1 is grounded. The first pin of the infrared input seat 2 is a TIP pin, the second pin is a RING pin, and the third pin is a SLEEVE pin.
The first analog switch chip U1 is provided with an input end, a control end and two output ends, and after the control end of the first analog switch chip U1 receives a control signal, the conduction relation between the two output ends and the input end is switched inside the chip. Specifically, as shown in fig. 3, the a end of the first analog switch chip U1 is an input end, the S end is a control end, and the B0 and B1 ends are output ends, so that the first analog switch chip U1 is used as a controllable switch. One output end of the first analog switch chip U1 is connected with the second pin of the infrared input seat 2, the first pin of the infrared input seat 2 is connected with the other output end of the first analog switch chip U1, the first Schottky diode D1 is connected in series between the first pin of the infrared input seat 2 and the other output end of the first analog switch chip U1, and the cathode of the first Schottky diode D1 is connected with the first pin of the infrared input seat 2. The first analog switch chip U1 is powered by 5V.
The first power supply switching unit 32 includes a 12V power supply, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first capacitor C1, a first MOS transistor Q1, a second MOS transistor Q2, and a third MOS transistor Q3. The third resistor R3 is connected in series between the 12V power supply and the source electrode of the first MOS tube Q1, the drain electrode of the first MOS tube Q1 is connected with the drain electrode of the second MOS tube Q2, and the source electrode of the second MOS tube Q2 is grounded. The connection node between the drain electrode of the first MOS tube Q1 and the drain electrode of the second MOS tube Q2 is connected with the third pin of the infrared input seat 2. The first MOS tube Q1 is a PMOS tube, and the second MOS tube Q2 is an NMOS tube.
The first capacitor C1 is connected in series between the 12V power supply and the grid electrode of the first MOS tube Q1, and the fourth resistor R4 is connected in parallel with the first capacitor C1. The fifth resistor R5 is connected in series between the grid electrode of the first MOS tube Q1 and the drain electrode of the third MOS tube Q3, the sixth resistor R6 is connected in series between the grid electrode of the second MOS tube Q2 and the drain electrode of the third MOS tube Q3, and the source electrode of the third MOS tube Q3 is grounded. The seventh resistor R7 is connected with the grid electrode of the third MOS tube Q3, the seventh resistor R7 receives the first control signal, and the drain electrode of the third MOS tube Q3 outputs the third control signal.
When the TRS interface type is nonstandard 5V and standard 5V, the SLEEVE pin is in a grounding state correspondingly. That is, at this time, the first MOS transistor Q1 is turned off, the second MOS transistor Q2 is turned on, the third MOS transistor Q3 is turned off, and the first control signal (i.e., 12v_ctrl in the drawing) received by the seventh resistor R7 is a low level signal. At this time, the drain electrode of the third MOS transistor Q3 outputs a third control signal, and the third control signal is a high level signal.
Referring to fig. 4 and 5, the second power supply switching unit 33 includes a 5V power supply, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a fourth MOS transistor Q4, and a fifth MOS transistor Q5. The eighth resistor R8 is connected in series between the 5V power supply and the drain electrode of the fourth MOS tube Q4, the drain electrode of the fourth MOS tube Q4 is connected with the drain electrode of the fifth MOS tube Q5, and the source electrode of the fifth MOS tube Q5 is grounded. The ninth resistor R9 is connected to the gate of the fourth MOS transistor Q4, the ninth resistor R9 is configured to receive the third control signal, the tenth resistor R10 is connected to the gate of the fifth MOS transistor Q5, and the tenth resistor R10 is configured to receive the first control signal. The connection node between the drain electrode of the fourth MOS transistor Q4 and the drain electrode of the fifth MOS transistor Q5 outputs a standard voltage.
When the first control signal is a low level signal, the fifth MOS transistor Q5 is turned off. Because the third control signal is at a high level at this time, the fourth MOS transistor Q4 is turned on, and a 5V voltage is output from a connection node between the drain of the fourth MOS transistor Q4 and the drain of the fifth MOS transistor Q5. At this time, the first analog switch chip U1 inputs 5V voltage, and the relationship between the input terminal and the two output terminals of the first analog switch chip U1 is changed by the second control signal (i.e., 5v_ctrl), so that the 5V voltage is changed to switch back and forth between the TIP pin and the RING pin in the infrared input socket 2, and after the 5V pin position is determined, the other pin of the TIP pin and the RING pin is used as a signal line.
Specifically, when the second control signal is at a low level, the input terminal a and the output terminal B0 of the first analog switch chip U1 are turned on at this time, that is, the RING pin is a 5V pin, and the interface type is a non-standard 5V type at this time. When the second control signal is at a high level, the input terminal a and the output terminal B1 of the first analog switch chip U1 are turned on at this time, that is, the T1P pin is a 5V pin, and the interface type is a standard 5V type.
Referring to fig. 6, the nand gate unit 41 includes a power supply terminal, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a fifteenth resistor R15, a sixteenth resistor R16, a seventeenth resistor R17, a second transistor B2, a third transistor B3, a fourth transistor B4, a second schottky diode D2, a third schottky diode D3, a second capacitor C2, and a third capacitor C3.
The second capacitor C2 is connected in series between the first pin of the infrared input socket 2 and the ground, the eleventh resistor R11 is connected in series between the first pin of the infrared input socket 2 and the base of the second triode B2, the twelfth resistor R12 is connected in series between the power supply terminal and the emitter of the second triode B2, and the collector of the second triode B2 is grounded. When the first pin is at high level, the second triode B2 is conducted, and the emitter of the second triode B2 is at low level.
The third capacitor C3 is connected in series between the second pin of the infrared input socket 2 and the ground, the thirteenth resistor R13 is connected in series between the third pin of the infrared input socket 2 and the base of the third triode B3, the fourteenth resistor R14 is connected in series between the second pin of the infrared input socket 2 and the base of the third triode B3, the fifteenth resistor R15 is connected in series between the power supply terminal and the emitter of the third triode B3, and the collector of the third triode B3 is grounded. When the second pin or the third pin is at high level, the third triode B3 is conducted, and the emission of the third triode B3 is at low level.
The second schottky diode D2 and the sixteenth resistor R16 are connected in series, and the anode of the second schottky diode D2 is connected to the emitter of the second triode B2, and the sixteen resistor is grounded. The positive pole of third schottky diode D3 is connected the projecting pole of third triode B3, and the negative pole of third schottky diode D3 and the negative pole of second schottky diode D2 are all connected in the base of fourth triode B4, and the collector ground of fourth triode B4, seventeenth resistor R17 establish ties between power end and the projecting pole of fourth triode B4, and the projecting pole of fourth triode B4 outputs the conversion level signal.
Referring to fig. 1 and 6, under the standard 12V interface type, the TIP pin is a signal line at this time, and the second triode B2 is triggered to turn off in a default state, the third triode B3 is turned on under power trigger, the base of the fourth triode B4 is in a high level state at this time, the fourth triode B4 is turned on, and the emitter of the fourth triode B4 is in a low level. When the infrared trigger is carried out, the state of the signal line is changed from low level to high level, the second triode B2 is conducted, the base electrode of the fourth triode B4 is low level, and the emitting electrode of the fourth triode B4 is high level so as to realize the level transition of the output signal.
Under the non-standard 5V type, the second triode B2 is conducted in a default state, the third triode B3 is also conducted, at the moment, the base electrode of the fourth triode B4 is at a low level, and the emission electrode of the fourth triode B4 is at a high level. When the infrared trigger is carried out, the state of the signal line is changed from high level to low level, the second triode B2 is turned off, the base electrode of the fourth triode B4 is high level, and the emission electrode of the fourth triode B4 is low level so as to realize the level transition of the output signal.
Under the standard 5V type, the second triode B2 is conducted in a default state, the third triode B3 is also conducted, at the moment, the base electrode of the fourth triode B4 is at a low level, and the emitter electrode of the fourth triode B4 is at a high level. When the infrared trigger is carried out, the state of the signal line is changed from high level to low level, the third triode B3 is turned off, the base electrode of the fourth triode B4 is high level, and the emission electrode of the fourth triode B4 is low level so as to realize the level transition of the output signal.
Referring to fig. 7, the level triggering unit 42 includes an eighteenth resistor R18, a nineteenth resistor R19, a twentieth resistor R20, a fifth transistor B5, and a second analog switch chip U2. The second analog switch chip U2 has an input terminal, a control terminal and two output terminals, wherein the input terminal corresponds to the terminal a in fig. 7, the control terminal corresponds to the terminal S in fig. 7, and the two output terminals correspond to the terminals B0 and B1 in fig. 7.
After the second analog switch chip U2 receives the first control signal at the control end, the conduction relation between the two output ends and the input end is switched. The eighteenth resistor R18 is connected to the control terminal of the second analog switch chip U2, receives the transition level signal at the input terminal of the second analog switch chip U2, and combines with the received first control signal to jointly control the voltage at the output terminal.
The twenty-first resistor R20 is connected in series with one output end of the second analog switch chip U2, the base electrode of the fifth triode B5 is connected with the other output end of the second analog switch chip U2, the collector electrode of the fifth triode B5 is grounded, two ends of the nineteenth resistor R19 are respectively connected with the base electrode and the collector electrode of the fifth triode B5, the emitter electrode of the fifth triode B5 is connected with the twenty-first resistor R20, and the emitter electrode of the fifth triode B5 outputs a detection trigger signal with unified trigger mode.
Specifically, when the first control signal is at the low level, the interface type is at the non-standard 5V or the standard 5V, and the trigger level of the non-standard 5V or the standard 5V is at the low level after the level transition of the nand gate unit 41. And at this time, the second analog switch chip U2 conducts the input end A and the output end B0, and the non-standard 5V or standard 5V is directly output through the B0 end of the second analog switch chip U2 after the low-level trigger signal output by the NAND gate, so as to realize the effective low-level trigger.
When the interface type is standard 12V, the first control signal is at high level. The standard 12V interface type is active for high level triggering after level transition by the nand gate unit 41. At this time, the second analog switch chip U2 conducts the input end a and the output end B1, and the high-level signal directly triggers the fifth triode B5 to conduct, so as to finally realize that the B0 end of the second analog switch chip U2 is low-level, and also realize that the low-level triggering is effective.
The above embodiments are not intended to limit the scope of the application, so that the equivalent changes of the structure, shape and principle of the application are covered by the scope of the application.