CN116618335A - A chip incoming inspection system and an automatic inspection method based on the chip - Google Patents
A chip incoming inspection system and an automatic inspection method based on the chip Download PDFInfo
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- CN116618335A CN116618335A CN202310627622.6A CN202310627622A CN116618335A CN 116618335 A CN116618335 A CN 116618335A CN 202310627622 A CN202310627622 A CN 202310627622A CN 116618335 A CN116618335 A CN 116618335A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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Abstract
本发明公开了一种芯片来料检测系统及基于其芯片自动检测方法,芯片来料检测系统包括:直线输送设备、旋转输送设备、抓取机械手、芯片检测执行设备、残次品存储容器以及合格产品输出设备;直线输送设备包括:输送链条、链条驱动机构以及定位工装,输送链条上安装有定位工装,定位工装用于定位安放芯片,输送链条由链条驱动机构驱动,芯片的定位槽朝向输送链条输送方向,且芯片端部从定位工装边缘悬出;旋转输送设备包括:旋转台以及旋转驱动机构,旋转台能转动地安装在直线输送设备的输出端,旋转台由旋转驱动机构驱动旋转。该芯片来料检测系统及基于其芯片自动检测方法解决现有技术中不能实现自动将芯片残次品排出的问题。
The invention discloses a chip incoming material detection system and an automatic chip detection method based on the same. The chip incoming material detection system includes: linear conveying equipment, rotating conveying equipment, grabbing manipulators, chip detection execution equipment, defective product storage containers and qualified products. Product output equipment; linear conveying equipment includes: conveyor chain, chain drive mechanism and positioning tooling. The positioning tooling is installed on the conveyor chain. The positioning tooling is used to position and place chips. The conveyor chain is driven by the chain drive mechanism. The positioning groove of the chip faces the conveyor chain The conveying direction, and the end of the chip hangs out from the edge of the positioning tool; the rotary conveying device includes: a rotary table and a rotary drive mechanism, the rotary table is rotatably installed on the output end of the linear conveying device, and the rotary table is driven to rotate by the rotary drive mechanism. The chip incoming inspection system and the chip automatic inspection method based on the same solve the problem in the prior art that the automatic discharge of chip defective products cannot be realized.
Description
技术领域technical field
本发明涉及芯片生产用设备,具体涉及一种芯片来料检测系统及基于其芯片自动检测方法。The invention relates to equipment for chip production, in particular to a chip incoming material detection system and an automatic chip detection method based on the same.
背景技术Background technique
如图1所示,芯片包括:片本体11以及引脚12,片本体11内设置有内置电路,内置电路电连接至外部的引脚12,以供连接外部电路。片本体11上凹陷形成定位槽13,定位槽13为半圆柱体结构,由于每个引脚12都是不一样的,也就是远离定位槽13的引脚12和靠近定位槽13的引脚12功能很多都不一样,为了方便后续安装在外部电路中,定位槽13是必须的,以方便识别各个不同的引脚12。不同芯片类型,就有不同的芯片宽度,两侧引脚12之间的距离d也不一样。As shown in FIG. 1 , the chip includes: a chip body 11 and pins 12 , the chip body 11 is provided with a built-in circuit, and the built-in circuit is electrically connected to the external pin 12 for connecting to an external circuit. The chip body 11 is recessed to form a positioning groove 13, and the positioning groove 13 is a semi-cylindrical structure. Since each pin 12 is different, that is, the pin 12 far away from the positioning groove 13 and the pin 12 close to the positioning groove 13 Many functions are different. In order to facilitate the subsequent installation in the external circuit, the positioning groove 13 is necessary to facilitate the identification of different pins 12 . Different chip types have different chip widths, and the distance d between the pins 12 on both sides is also different.
随着科技的发展,芯片在我们生活中使用越来越频繁,很多电器设备均需要用到芯片,因此芯片生产量比较大。为了保证芯片质量,需要对芯片进行检测,如果单个检测芯片就会大大降低生产效率,不能满足快速的现代化生产要求,因此如何实现芯片自动输送后自动检测是本申请讨论的话题。With the development of science and technology, chips are used more and more frequently in our lives, and many electrical equipment need to use chips, so the production volume of chips is relatively large. In order to ensure the quality of the chip, it is necessary to test the chip. If a single chip is tested, the production efficiency will be greatly reduced, and it cannot meet the requirements of rapid modern production. Therefore, how to realize the automatic detection of the chip after automatic delivery is the topic discussed in this application.
中国专利公开了一种申请号为CN202120811911.8的芯片检测装置的上料机构,该芯片检测装置的上料机构包括支撑桌,所述支撑桌的顶部滑动连接有检测台,所述检测台上表面的一侧固定有插座,所述检测台上表面的中部固定有输料板,所述输料板的中部通过轴承转动连接有用于进行芯片上料工作的上料机构,所述支撑桌的一侧设置有芯片卷带,所述上料机构包括转轴、链轮、链条、电机、导向框、第一滑轨、移动块、连接柱、连接杆和真空吸嘴。The Chinese patent discloses a feeding mechanism of a chip detection device with an application number of CN202120811911.8. The feeding mechanism of the chip detection device includes a support table, and a detection platform is slidably connected to the top of the support table. One side of the surface is fixed with a socket, and the middle part of the upper surface of the detection table is fixed with a feeding plate. One side is provided with a chip tape, and the feeding mechanism includes a rotating shaft, a sprocket, a chain, a motor, a guide frame, a first slide rail, a moving block, a connecting column, a connecting rod and a vacuum suction nozzle.
上述芯片检测装置的上料机构,虽然能够实现将芯片定位输送,但是仍然存在的缺点为:不能实现自动将芯片残次品排出,排出芯片残次品需要手动,导致生产效率降低。Although the feeding mechanism of the above-mentioned chip detection device can realize positioning and conveying of chips, it still has the disadvantage that it cannot realize the automatic discharge of defective chips, and manual discharge of defective chips is required, resulting in a decrease in production efficiency.
发明内容Contents of the invention
本发明要提供一种芯片来料检测系统及基于其芯片自动检测方法,解决现有技术中不能实现自动将芯片残次品排出的问题。The present invention provides a chip incoming material detection system and an automatic chip detection method based on the same, which solves the problem in the prior art that the automatic discharge of defective chips cannot be realized.
为实现上述目的,本发明采用了如下的技术方案:To achieve the above object, the present invention adopts the following technical solutions:
本发明首先公开了一种芯片来料检测系统,包括:直线输送设备、旋转输送设备、抓取机械手、芯片检测执行设备、残次品存储容器以及合格产品输出设备;直线输送设备包括:输送链条、链条驱动机构以及定位工装,输送链条上安装有定位工装,定位工装用于定位安放芯片,输送链条由链条驱动机构驱动,芯片的定位槽朝向输送链条输送方向,且芯片端部从定位工装边缘悬出;旋转输送设备包括:旋转台以及旋转驱动机构,旋转台能转动地安装在直线输送设备的输出端,旋转台由旋转驱动机构驱动旋转;在旋转台周围安装有芯片检测执行设备、残次品存储容器以及合格产品输出设备,芯片检测执行设备位于残次品存储容器以及合格产品输出设备前方;在旋转台上安装有至少三抓取机械手,抓取机械手用于抓取芯片。The invention first discloses a chip incoming inspection system, including: linear conveying equipment, rotating conveying equipment, grasping manipulator, chip detection execution equipment, defective product storage container and qualified product output equipment; the linear conveying equipment includes: conveying chain , chain drive mechanism and positioning tooling, positioning tooling is installed on the conveyor chain, and the positioning tooling is used to position and place chips. Hanging out; the rotary conveying equipment includes: a rotary table and a rotary drive mechanism, the rotary table can be rotatably installed on the output end of the linear conveying equipment, and the rotary table is driven to rotate by the rotary drive mechanism; chip detection execution equipment, residual The defective product storage container and the qualified product output device, and the chip detection execution device are located in front of the defective product storage container and the qualified product output device; at least three grasping manipulators are installed on the rotary table, and the grasping manipulators are used to grasp chips.
优选的是,抓取机械手包括:抓取上臂、抓取下臂、臂驱动机构、抓取座、水平伸缩气缸以及竖直伸缩气缸,抓取上臂、抓取下臂均安装在抓取座上,抓取下臂能相对抓取座在竖直方向上运动,抓取下臂安装在臂驱动机构的输出端,臂驱动机构安装在抓取座内,抓取座连接至水平伸缩气缸的活塞杆,水平伸缩气缸驱动抓取座在旋转台的径向上运动,水平伸缩气缸外壳安装在竖直伸缩气缸的输出端,竖直伸缩气缸驱动水平伸缩气缸在竖直方向上运动,竖直伸缩气缸安装在水平旋转台边缘上。Preferably, the grabbing manipulator includes: a grabbing upper arm, a grabbing lower arm, an arm drive mechanism, a grabbing seat, a horizontal telescopic cylinder and a vertical telescopic cylinder, and the grabbing upper arm and the grabbing lower arm are all mounted on the grabbing seat , the grabbing lower arm can move in the vertical direction relative to the grabbing seat, the grabbing lower arm is installed at the output end of the arm driving mechanism, the arm driving mechanism is installed in the grabbing seat, and the grabbing seat is connected to the piston of the horizontal telescopic cylinder The rod, the horizontal telescopic cylinder drives the grab seat to move in the radial direction of the rotary table, the horizontal telescopic cylinder shell is installed on the output end of the vertical telescopic cylinder, the vertical telescopic cylinder drives the horizontal telescopic cylinder to move in the vertical direction, and the vertical telescopic cylinder Mounted on the edge of a horizontal turntable.
优选的是,定位工装包括:脚定位销以及中部支撑机构,脚定位销开设有定位孔,定位孔供芯片引脚插入,中部支撑机构用于支撑芯片中片本体底面。Preferably, the positioning tool includes: foot positioning pins and a middle support mechanism, the foot positioning pins are provided with positioning holes for inserting chip pins, and the middle support mechanism is used to support the bottom surface of the chip body.
优选的是,中部支撑机构包括:第一支撑块、第二支撑块以及调节定位组件,第一支撑块和第二支撑块安装在安装座上,第一支撑块和第二支撑块均能相对安装座在Z方向上移动,调节定位组件连接至第一支撑块和第二支撑块的安装处,调节定位组件用于将第一支撑块和第二支撑块定位在安装座上。Preferably, the middle support mechanism includes: a first support block, a second support block and an adjustment and positioning assembly, the first support block and the second support block are installed on the mounting seat, and the first support block and the second support block can be opposite The mounting base moves in the Z direction, the adjusting and positioning assembly is connected to the installation places of the first supporting block and the second supporting block, and the adjusting and positioning assembly is used to position the first supporting block and the second supporting block on the mounting base.
优选的是,第一支撑块和第二支撑块上可拆卸连接脚定位销。Preferably, the first support block and the second support block are detachably connected to the positioning pins of the feet.
优选的是,在第一支撑块和第二支撑块上均安装有升降限位组件,升降限位组件通过保持弹簧连接至所在的第一支撑块或第二支块,在安装座上安装有定位部,在保持弹簧弹力下升降限位组件与定位部配合限制所在的第一支撑座或第二支撑座相对安装座在Z方向上移动。Preferably, a lifting limit assembly is installed on the first support block and the second support block, and the lift limit assembly is connected to the first support block or the second support block by holding the spring, and a The positioning part, under the force of the spring, the lifting limit assembly cooperates with the positioning part to limit the movement of the first support seat or the second support seat relative to the installation seat in the Z direction.
优选的是,芯片检测执行设备包括:检测工作台、定位垫板、中部支撑台、内侧支撑机构、边缘压紧块、导电片、导线、压紧驱动机构以及检测控制箱,检测工作台顶面安装有定位垫板,定位垫板开设有伸入槽,伸入槽深度小于芯片引脚长度,伸入槽供芯片引脚伸入,定位垫板上安装有中间支撑机构和边缘压紧块,中间支撑机构和边缘压紧块有两对,两对中间支撑机构和边缘压紧块分别用于压紧芯片两侧引脚,中间支撑机构支撑引脚靠近芯片中心的一侧,边缘压紧块能相对检测工作台在远离或靠近芯片中心方向上移动,边缘压紧块连接至压紧驱动机构的输出端,压紧驱动机构用于驱动边缘压紧块远离或靠近中间支撑机构的方向上运动,边缘压紧块靠近中间支撑机构一侧安装有导电片,导电片用于与引脚接触,导电片通过导线连接至检测控制箱。Preferably, the chip detection execution equipment includes: a detection workbench, a positioning backing plate, a middle support platform, an inner support mechanism, an edge pressing block, a conductive sheet, a wire, a pressing drive mechanism and a detection control box, and the top surface of the detection workbench A positioning backing plate is installed, and the positioning backing plate is provided with a protruding groove, the depth of which is less than the length of the chip pins. There are two pairs of middle supporting mechanism and edge pressing block, and the two pairs of middle supporting mechanism and edge pressing block are respectively used to press the pins on both sides of the chip. The middle supporting mechanism supports the side of the pin close to the center of the chip, and the edge pressing block It can move away from or close to the center of the chip relative to the detection table. The edge pressing block is connected to the output end of the pressing drive mechanism, and the pressing driving mechanism is used to drive the edge pressing block to move away from or close to the middle support mechanism. A conductive sheet is installed on the side of the edge pressing block close to the middle support mechanism, the conductive sheet is used for contacting with the pins, and the conductive sheet is connected to the detection control box through wires.
优选的是,导电片包括:软性电线以及弹性垫,弹性垫上安装软性电线,软性电线与位于定位槽内的引脚垂直,软性电线与导线电连接,软心电线用于与引脚接触,弹性垫安装在边缘压紧块上。Preferably, the conductive sheet includes: flexible wires and elastic pads, flexible wires are installed on the elastic pads, the flexible wires are perpendicular to the pins located in the positioning grooves, the flexible wires are electrically connected to the wires, and the soft core wires are used to connect with the leads. For foot contact, elastic pads are mounted on edge compression blocks.
优选的是,中间支撑机构包括:中间支撑块以及双向驱动气缸,双向驱动气缸的两输出端分别连接至两中间支撑块,两中间支撑块分别与两边缘压紧块对应设置。Preferably, the intermediate support mechanism includes: an intermediate support block and a bidirectional drive cylinder, the two output ends of the bidirectional drive cylinder are respectively connected to the two intermediate support blocks, and the two intermediate support blocks are respectively arranged corresponding to the two edge pressing blocks.
本发明还公开了一种芯片自动检测方法,包括如下步骤:S1、人工将芯片放置在定位工装上;S2、直线输送设备上带动输送链条循环移动,继而将定位工装上芯片带动到直线输送设备的输出端;与此同时,旋转输送设备将抓取机械手旋转到与直线输送设备的输出端对准的位置;S3、抓取机械手抓取位于直线输送设备的输出端上的芯片;S4、旋转输送设备驱动抓取机械手旋转,将夹紧有芯片的抓取机械手旋转到与芯片检测执行设备对准的位置;S5、将抓取机械手释放芯片,芯片落在芯片检测执行设备上;S6、芯片检测执行设备对芯片通电后,对芯片进行检测,判断芯片是否合格,若芯片合格,则进行步骤S7以及S9,若不合格,则进行步骤S7以及S8;S7、抓取机械手抓取位于芯片检测执行设备上的芯片;S8、旋转输送设备驱动抓取机械手旋转,抓取机械手与残次品存储容器对准时释放芯片;S9、旋转输送设备驱动抓取机械手旋转,抓取机械手与合格产品输出设备对准时释放芯片。The invention also discloses an automatic chip detection method, which includes the following steps: S1, manually placing the chip on the positioning tool; S2, driving the conveyor chain to move circularly on the linear conveying device, and then driving the chip on the positioning tool to the linear conveying device At the same time, the rotary conveying equipment rotates the grasping manipulator to the position aligned with the output end of the linear conveying equipment; S3, the grasping manipulator grabs the chip on the output end of the linear conveying equipment; S4, rotates The conveying equipment drives the grasping manipulator to rotate, and rotates the grasping manipulator with the chip clamped to the position aligned with the chip detection execution device; S5, releases the chip from the grasping manipulator, and the chip falls on the chip detection execution device; S6, the chip After the detection execution device powers on the chip, it detects the chip and judges whether the chip is qualified. If the chip is qualified, then proceed to steps S7 and S9. If it is unqualified, proceed to steps S7 and S8; Execute the chip on the device; S8, the rotary conveying device drives the grabbing manipulator to rotate, and releases the chip when the grabbing manipulator is aligned with the defective product storage container; S9, the rotating conveying device drives the grabbing manipulator to rotate, and the grabbing manipulator and the qualified product output device Release the chip when aligned.
相比于现有技术,本发明具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
1)本申请中增加设置了旋转输送设备、抓取机械手、残次品存储容器以及合格产品输出设备,实现了抓取机械手将位于直线输送设备输出端的芯片抓取走,并且带到芯片旋转到芯片检测执行设备、残次品存储容器以及合格产品输出设备处,从而实现了检测芯片产品,并且检测后可以将残次品输送到残次品存储容器,合格产品输送到合格产品输出设备,从而实现了残次品和合格产品分开输出。整个过程中,不需要人工转移残次品,节约了人工成本,提高了分料效率,继而提高了生产效率。1) In this application, a rotary conveying device, a grasping manipulator, a storage container for defective products, and a qualified product output device are added, so that the grasping manipulator can grab the chip located at the output end of the linear conveying device and bring it to the Chip detection execution equipment, defective product storage container and qualified product output device, so as to realize the detection of chip products, and after the detection, the defective product can be transported to the defective product storage container, and the qualified product can be transported to the qualified product output device, so that Realized the separate output of defective products and qualified products. In the whole process, there is no need to manually transfer defective products, which saves labor costs, improves the efficiency of material distribution, and then improves production efficiency.
2)本申请中通过设置抓取机械手,将芯片从直线输送装置输出端转移到芯片检测执行设备上,芯片检测执行设备不对芯片引脚进行冲压,避免了引脚变形后损坏,保证了成品率,降低了材料的浪费,降低了生产成本。2) In this application, the chip is transferred from the output end of the linear conveying device to the chip detection execution equipment by setting the grabbing robot. The chip detection execution equipment does not punch the chip pins, avoiding the damage of the pins after deformation, and ensuring the yield , reducing the waste of materials and reducing production costs.
本发明的其它优点、目标和特征将部分通过下面的说明体现,部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。Other advantages, objectives and features of the present invention will partly be embodied through the following descriptions, and partly will be understood by those skilled in the art through the research and practice of the present invention.
附图说明Description of drawings
图1为芯片的结构示意图。Figure 1 is a schematic diagram of the structure of the chip.
图2为芯片来料检测系统的结构示意图。FIG. 2 is a schematic structural diagram of a chip incoming inspection system.
图3为图2中旋转输送设备的放大图。Fig. 3 is an enlarged view of the rotary conveying device in Fig. 2 .
图4为图3中A处的放大图。FIG. 4 is an enlarged view at point A in FIG. 3 .
图5为定位工装处的结构示意图。Fig. 5 is a schematic diagram of the structure of the positioning tool.
附图标记:片本体11、引脚12、定位槽13、直线输送设备2、输送链条21、定位工装22、脚定位销220、第一支撑块221、第二支撑块222、调节定位组件23、调节螺栓231、螺母232、升降限位组件24、保持弹簧25、安装座26、定位部260、旋转输送设备3、抓取机械手4、抓取上臂41、抓取下臂42、抓取座45、水平伸缩气缸46、竖直伸缩气缸47、朝向检测机构48、压入块481、升降杆482、下压弹簧483、检测块484、红外线传感器485、芯片检测执行设备5、检测工作台51、伸入槽510、定位垫板52、中部支撑台53、内侧支撑机构54、边缘压紧块55、导电片56、导线57、压紧驱动机构58、残次品存储容器6、合格产品输出设备7。Reference signs: sheet body 11, pin 12, positioning groove 13, linear conveying device 2, conveying chain 21, positioning tooling 22, foot positioning pin 220, first support block 221, second support block 222, adjustment and positioning assembly 23 , adjusting bolt 231, nut 232, lifting limit assembly 24, holding spring 25, mounting seat 26, positioning part 260, rotating conveying equipment 3, grabbing manipulator 4, grabbing upper arm 41, grabbing lower arm 42, grabbing seat 45. Horizontal telescopic cylinder 46, vertical telescopic cylinder 47, orientation detection mechanism 48, pressing block 481, lifting rod 482, pressing spring 483, detection block 484, infrared sensor 485, chip detection execution equipment 5, detection workbench 51 , extending into groove 510, positioning pad 52, middle support platform 53, inner support mechanism 54, edge pressing block 55, conductive sheet 56, wire 57, pressing drive mechanism 58, defective product storage container 6, qualified product output equipment7.
具体实施方式Detailed ways
为了使本发明实现的技术手段、创作特征、达成目的与作用更加清楚及易于了解,下面结合附图和具体实施方式对本发明作进一步阐述:In order to make the technical means, creative features, goals and functions achieved by the present invention clearer and easier to understand, the present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments:
实施例1:Example 1:
如图2至图5所示,本实施例公开了一种芯片来料检测系统,包括:直线输送设备2、旋转输送设备3、抓取机械手4、芯片检测执行设备5、残次品存储容器6以及合格产品输出设备7;直线输送设备2包括:输送链条21、链条驱动机构(图中未示)以及定位工装22,输送链条21上安装有定位工装22,定位工装22用于定位安放芯片,输送链条21由链条驱动机构驱动,芯片的定位槽13朝向输送链条21输送方向,且芯片端部从定位工装22边缘悬出;旋转输送设备3包括:旋转台以及旋转驱动机构,旋转台能转动地安装在直线输送设备2的输出端,旋转台由旋转驱动机构驱动旋转;在旋转台周围安装有芯片检测执行设备5、残次品存储容器6以及合格产品输出设备7,芯片检测执行设备5位于残次品存储容器6以及合格产品输出设备7前方;在旋转台上安装有至少三抓取机械手4,抓取机械手4用于抓取芯片。As shown in Figures 2 to 5, this embodiment discloses a chip incoming inspection system, including: linear conveying equipment 2, rotating conveying equipment 3, grasping manipulator 4, chip inspection execution equipment 5, and defective product storage container 6 and a qualified product output device 7; the linear conveying device 2 includes: a conveying chain 21, a chain drive mechanism (not shown in the figure) and a positioning tool 22, the conveying chain 21 is equipped with a positioning tool 22, and the positioning tool 22 is used for positioning and placing chips , the conveying chain 21 is driven by a chain drive mechanism, the positioning groove 13 of the chip faces the conveying direction of the conveying chain 21, and the end of the chip hangs out from the edge of the positioning tool 22; the rotary conveying device 3 includes: a rotary table and a rotary drive mechanism, and the rotary table can It is rotatably installed at the output end of the linear conveying device 2, and the rotary table is driven to rotate by the rotary drive mechanism; chip detection execution equipment 5, defective product storage container 6 and qualified product output device 7 are installed around the rotary table, and chip detection execution equipment 5 is located in front of the defective product storage container 6 and the qualified product output device 7; at least three grasping manipulators 4 are installed on the rotary table, and the grasping manipulators 4 are used to grasp chips.
抓取机械手4包括:抓取上臂41、抓取下臂42、臂驱动机构、抓取座45、水平伸缩气缸46以及竖直伸缩气缸47,抓取上臂41、抓取下臂42均安装在抓取座45上,抓取下臂42能相对抓取座45在竖直方向上运动,抓取下臂42安装在臂驱动机构的输出端,臂驱动机构安装在抓取座45内,抓取座45连接至水平伸缩气缸46的活塞杆,水平伸缩气缸46驱动抓取座45在旋转台的径向上运动,水平伸缩气缸46外壳安装在竖直伸缩气缸47的输出端,竖直伸缩气缸47驱动水平伸缩气缸46在竖直方向上运动,竖直伸缩气缸47安装在水平旋转台边缘上。抓取上臂41与抓取下臂42之间夹紧芯片中片本体11的端部,水平伸缩气缸46为了实现了在旋转台径向上有位置差异的时候能够抓取和释放芯片,竖直伸缩气缸47则为了在竖直方向上有位置差异的时候能够抓取或释放芯片。Grabbing manipulator 4 comprises: grabbing upper arm 41, grabbing lower arm 42, arm drive mechanism, grabbing seat 45, horizontal telescopic cylinder 46 and vertical telescopic cylinder 47, grabbing upper arm 41, grabbing lower arm 42 are all installed on On the grabbing seat 45, the lower arm 42 can move vertically relative to the grabbing seat 45, and the lower arm 42 is installed on the output end of the arm driving mechanism, and the arm driving mechanism is installed in the grabbing seat 45. Get seat 45 and be connected to the piston rod of horizontal telescopic cylinder 46, horizontal telescopic cylinder 46 drives grabbing seat 45 to move radially on the turntable, horizontal telescopic cylinder 46 shells are installed on the output end of vertical telescopic cylinder 47, vertical telescopic cylinder 47 drives the horizontal telescopic cylinder 46 to move in the vertical direction, and the vertical telescopic cylinder 47 is installed on the edge of the horizontal rotary table. The end of the chip body 11 is clamped between the grasping upper arm 41 and the grasping lower arm 42, and the horizontal telescopic cylinder 46 is vertically telescopic in order to realize the ability to grasp and release the chip when there is a position difference in the radial direction of the rotary table. The cylinder 47 is for grabbing or releasing chips when there are position differences in the vertical direction.
由于芯片需要通过定位槽13定位,因此本申请中,在抓取上臂41上安装有朝向检测机构48,朝向检测机构48用于检测芯片设置有定位槽13的端部的位置。Since the chip needs to be positioned through the positioning groove 13, in this application, an orientation detection mechanism 48 is installed on the grasping upper arm 41, and the orientation detection mechanism 48 is used to detect the position of the end of the chip provided with the positioning groove 13.
朝向检测机构48包括:压入块481、升降杆482、下压弹簧483、检测块484以及红外线传感器485,压入块481用于压入至芯片定位槽13内,压入块481位于抓取上臂41和抓取下臂42之间,压入块481固定至升降杆482,升降杆482穿过抓取上臂41,抓取上臂41用于导向升降杆482在竖直方向上运动,升降杆482顶端固定至检测块484,在检测块484下方安装有红外线传感器485,升降杆482穿过一下压弹簧483,下压弹簧483用于将压入块481压入到芯片定位槽13内。升降杆482不能相对抓取上臂41旋转,也就是升降杆482仅能相对抓取上臂41升降。The orientation detection mechanism 48 includes: a pressing block 481, a lifting rod 482, a pressing spring 483, a detection block 484, and an infrared sensor 485. The pressing block 481 is used to press into the chip positioning groove 13, and the pressing block 481 is located at the grab Between the upper arm 41 and the grasping lower arm 42, the pressing block 481 is fixed to the lifting rod 482, and the lifting rod 482 passes through the grasping upper arm 41, and the grasping upper arm 41 is used to guide the lifting rod 482 to move in the vertical direction, and the lifting rod 482 passes through the grasping upper arm 41 to move vertically. The top of 482 is fixed to the detection block 484, and an infrared sensor 485 is installed below the detection block 484. The lifting rod 482 passes through the pressing spring 483, and the pressing spring 483 is used to press the pressing block 481 into the chip positioning groove 13. The elevating rod 482 cannot rotate relative to the grasping upper arm 41 , that is, the elevating rod 482 can only be raised and lowered relative to the grasping upper arm 41 .
当抓取机械手4抓取位于直线输送设备2输出端的芯片时,首先,水平伸缩气缸46伸长,继而实现了将抓取上臂41和抓取下臂42延伸在芯片的端部上下方,此时,抓取上臂41和抓取下臂42之间的抓取座45侧壁与芯片端面紧贴,从而实现后续当定位槽13朝向正确的时候看压入块481是否能置入定位槽13内。然后,臂驱动机构驱动抓取下臂42上移,从而实现了抓取下臂42和抓取上臂41配合夹紧芯片,夹紧的时候,如果芯片该端部有定位槽13,则压入块481置入定位槽13内,检测块484到红外线传感器485之间的距离较小;如果芯片该端部没有定位槽13,则压入块481不能置入定位槽13内,压入块481压在片本体11的顶面上,检测块484到红外线传感器485之间的距离较大,从而实现了检测芯片的朝向,以方便定位芯片。When the grasping manipulator 4 grasps the chip located at the output end of the linear conveying device 2, first, the horizontal telescopic cylinder 46 is extended, and then the grasping upper arm 41 and the grasping lower arm 42 are extended above and below the end of the chip. , grasp the side wall of the grasping seat 45 between the upper arm 41 and the lower arm 42 and the end face of the chip, so as to realize whether the pressing block 481 can be inserted into the positioning groove 13 when the positioning groove 13 is oriented correctly. Inside. Then, the arm drive mechanism drives the grabbing lower arm 42 to move up, thereby realizing the cooperation of the grabbing lower arm 42 and the grabbing upper arm 41 to clamp the chip. When clamping, if there is a positioning groove 13 at the end of the chip, press it Block 481 is placed in the positioning groove 13, and the distance between the detection block 484 and the infrared sensor 485 is relatively small; Pressed on the top surface of the chip body 11, the distance between the detection block 484 and the infrared sensor 485 is relatively large, thereby realizing the detection of the orientation of the chip, so as to facilitate the positioning of the chip.
定位工装22包括:脚定位销220以及中部支撑机构,脚定位销220开设有定位孔,定位孔供芯片引脚12插入,中部支撑机构用于支撑芯片中片本体11底面。中部支撑机构仅仅起到的是支撑芯片的片本体11作用。脚定位销220则是为了定位芯片引脚12,从而定位芯片。The positioning tool 22 includes: a foot positioning pin 220 and a middle support mechanism. The foot positioning pin 220 is provided with a positioning hole for inserting the chip pin 12 , and the middle support mechanism is used to support the bottom surface of the chip body 11 . The middle support mechanism only plays the role of supporting the chip body 11 of the chip. The pin positioning pin 220 is for positioning the chip pin 12, thereby positioning the chip.
中部支撑机构包括:第一支撑块221、第二支撑块222以及调节定位组件23,第一支撑块221和第二支撑块222安装在安装座26上,第一支撑块221和第二支撑块222均能相对安装座26在Z方向上移动,调节定位组件23连接至第一支撑块221和第二支撑块222的安装处,调节定位组件23用于将第一支撑块221和第二支撑块222定位在安装座26上。由于芯片有不同型号,因此芯片宽度是不一样的,为了适应不同芯片,因此设置了调节定位组件23,调节第一支撑块221和第二支撑块222之间的距离,继而调节第一支撑块221和第二支撑块222形成的支撑面宽度,以适应不同宽度芯片。The middle support mechanism includes: a first support block 221, a second support block 222 and an adjustment positioning assembly 23, the first support block 221 and the second support block 222 are installed on the mounting seat 26, the first support block 221 and the second support block 222 can move in the Z direction relative to the mounting base 26, and the adjustment and positioning assembly 23 is connected to the installation place of the first support block 221 and the second support block 222, and the adjustment and positioning assembly 23 is used to connect the first support block 221 and the second support block Block 222 is positioned on mount 26 . Since the chips have different models, the chip widths are different. In order to adapt to different chips, an adjustment positioning assembly 23 is provided to adjust the distance between the first support block 221 and the second support block 222, and then adjust the first support block. 221 and the width of the supporting surface formed by the second supporting block 222 is adapted to chips with different widths.
第一支撑块221和第二支撑块222上可拆卸连接脚定位销220。由于芯片有不同类型,因此设置了定位销也有不同型号,不同型号的定位销中定位孔大小不一样,以适应不同型号芯片。The first support block 221 and the second support block 222 are detachably connected to the foot positioning pin 220 . Because the chips have different types, there are different types of positioning pins, and the positioning holes of different types of positioning pins have different sizes to adapt to different types of chips.
在第一支撑块221和第二支撑块222上均安装有升降限位组件24,升降限位组件24通过保持弹簧25连接至所在的第一支撑块221或第二支块,在安装座26上安装有定位部260,在保持弹簧25弹力下升降限位组件24与定位部260配合限制所在的第一支撑座或第二支撑座相对安装座26在Z方向上移动。升降限位组件24的设置,实现了当调节第一支撑块221和第二支撑块222的时候,只有脚定位销220安装到位,才能调节第一支撑块221和第二支撑块222之间的距离,保证了调节第一支撑块221和第二支撑块222之前必须安装好脚定位销220。Both the first support block 221 and the second support block 222 are equipped with a lifting limit assembly 24, and the lift limit assembly 24 is connected to the first support block 221 or the second support block where it is by holding the spring 25. A positioning part 260 is installed on it, and under the elastic force of the retaining spring 25, the lifting limit assembly 24 cooperates with the positioning part 260 to limit the movement of the first support base or the second support base relative to the installation base 26 in the Z direction. The setting of the lifting limit assembly 24 has realized that when the first support block 221 and the second support block 222 are adjusted, only the foot positioning pin 220 is installed in place, and the distance between the first support block 221 and the second support block 222 can be adjusted. The distance ensures that the foot positioning pin 220 must be installed before the first support block 221 and the second support block 222 are adjusted.
安装座26有两个,第一支撑块221安装在一个安装座26上,第二支撑块222安装座26在另一个安装座26上。安装座26直接通过螺杆和螺母232方式安装在输送链条21的链条节上。There are two mounting bases 26 , the first supporting block 221 is installed on one mounting base 26 , and the second supporting block 222 is mounting base 26 on the other mounting base 26 . The mounting seat 26 is directly mounted on the chain link of the conveying chain 21 through a screw rod and a nut 232 .
调节定位组件23包括:调节螺栓231、螺母232以及中间块(图中未示),中间块由两安装座26支撑,中间块被夹在第一支撑块221和第二支撑块222之间,调节螺栓231穿过第一支撑块221和第二支撑块222,调节螺栓231螺纹连接有螺母232,调节螺栓231大端和螺母232配合夹紧第一支撑块221和第二支撑块222。对应不同型号芯片,有不同宽度的中间块,从而定位第一支撑块221和第二支撑块222之间的距离,中间块底部插入至第一支撑块221和第二支撑块222之间。The adjustment and positioning assembly 23 includes: an adjustment bolt 231, a nut 232 and an intermediate block (not shown in the figure), the intermediate block is supported by two mounting seats 26, and the intermediate block is clamped between the first support block 221 and the second support block 222, The adjusting bolt 231 passes through the first supporting block 221 and the second supporting block 222 , the adjusting bolt 231 is threaded with a nut 232 , and the big end of the adjusting bolt 231 and the nut 232 cooperate to clamp the first supporting block 221 and the second supporting block 222 . Corresponding to different types of chips, there are middle blocks with different widths, so as to locate the distance between the first support block 221 and the second support block 222 , and the bottom of the middle block is inserted between the first support block 221 and the second support block 222 .
升降限位组件24包括:升降块,升降块位于安装座26内,升降块能相对安装座26升降,升降块通过保持弹簧25固定至所在的第一支撑块221和第二支撑块222,升降块能与定位部260啮合,定位部260为安装在安装座26上的齿条,保持弹簧25用于保持升降块与定位部260啮合。脚定位销220穿过所在的第一支撑块221和第二支撑块222,脚定位销220底端用于下压升降块远离定位部260。The lifting limit assembly 24 includes: a lifting block, the lifting block is located in the mounting seat 26, the lifting block can be lifted relative to the mounting seat 26, and the lifting block is fixed to the first supporting block 221 and the second supporting block 222 where it is by holding the spring 25. The block can engage with the positioning part 260 , the positioning part 260 is a rack mounted on the mounting base 26 , and the retaining spring 25 is used to keep the lifting block engaged with the positioning part 260 . The foot positioning pin 220 passes through the first support block 221 and the second support block 222 where it is located, and the bottom end of the foot positioning pin 220 is used to press the lifting block away from the positioning portion 260 .
芯片检测执行设备5包括:检测工作台51、定位垫板52、中部支撑台53、内侧支撑机构54、边缘压紧块55、导电片56、导线57、压紧驱动机构58以及检测控制箱(图中未示),检测工作台51顶面安装有定位垫板52,定位垫板52开设有伸入槽510,伸入槽510深度小于芯片引脚12长度,伸入槽510供芯片引脚12伸入,定位垫板52上安装有内侧支撑机构54和边缘压紧块55,内侧支撑机构54和边缘压紧块55有两对,两对内侧支撑机构54和边缘压紧块55分别用于压紧芯片两侧引脚12,内侧支撑机构54支撑引脚12靠近芯片中心的一侧,边缘压紧块55能相对检测工作台51在远离或靠近芯片中心方向上移动,边缘压紧块55连接至压紧驱动机构58的输出端,压紧驱动机构58用于驱动边缘压紧块55远离或靠近内侧支撑机构54的方向上运动,边缘压紧块55靠近中间支撑机构一侧安装有导电片56,导电片56用于与引脚12接触,导电片56通过导线57连接至检测控制箱。The chip detection execution equipment 5 comprises: a detection workbench 51, a positioning backing plate 52, a middle support platform 53, an inner support mechanism 54, an edge pressing block 55, a conductive sheet 56, a wire 57, a pressing driving mechanism 58 and a detection control box ( Not shown in the figure), the top surface of the detection workbench 51 is equipped with a positioning backing plate 52, and the positioning backing plate 52 is provided with a protruding groove 510, and the depth of the protruding groove 510 is less than the length of the chip pin 12, and the protruding groove 510 is provided for the chip pin 12 stretches in, on the positioning backing plate 52, the inside support mechanism 54 and the edge pressing block 55 are installed, and the inside support mechanism 54 and the edge pressing block 55 have two pairs, and two pairs of inside support mechanisms 54 and the edge pressing block 55 use respectively To compress the pins 12 on both sides of the chip, the inner support mechanism 54 supports the side of the pins 12 close to the center of the chip, and the edge pressing block 55 can move away from or close to the center of the chip relative to the detection workbench 51. 55 is connected to the output end of the compression drive mechanism 58, the compression drive mechanism 58 is used to drive the edge compression block 55 to move away from or near the direction of the inner support mechanism 54, and the edge compression block 55 is installed on the side near the middle support mechanism. The conductive sheet 56 is used to contact the pin 12 , and the conductive sheet 56 is connected to the detection control box through a wire 57 .
中间支撑机构支撑芯片后,芯片设置有定位槽13的端部靠近旋转台,且芯片该端部从中间支撑机构悬出,以供抓取机械手4抓取芯片。After the intermediate support mechanism supports the chip, the end of the chip provided with the positioning groove 13 is close to the rotary table, and the end of the chip hangs out from the intermediate support mechanism for the grasping manipulator 4 to grasp the chip.
伸入槽510深度较浅,且伸入槽510入口处为张开的喇叭状结构,这样当芯片被抓取机械手4释放的时候,伸入槽510入口内壁有一定的导向芯片引脚12作用,使得芯片引脚12能够充分落入伸入槽510,从而精准定位芯片。The depth of the insertion groove 510 is relatively shallow, and the entrance of the insertion groove 510 is an open trumpet-shaped structure, so that when the chip is released by the grasping robot 4, the inner wall of the insertion groove 510 has a certain function of guiding the chip pin 12 , so that the chip pins 12 can fully fall into the protruding groove 510, so as to accurately position the chip.
导电片56包括:软性电线以及弹性垫,弹性垫上安装软性电线,软性电线与位于定位槽13内的引脚12垂直,软性电线与导线57电连接,软心电线用于与引脚12接触,弹性垫安装在边缘压紧块55上。避免了导电片56压伤芯片引脚12,同时弹性垫能够使得软性电线更加紧密地与引脚12包裹。The conductive sheet 56 includes: flexible wires and elastic pads, flexible wires are installed on the elastic pads, the flexible wires are perpendicular to the pins 12 located in the positioning groove 13, the flexible wires are electrically connected to the wires 57, and the soft core wires are used to connect with the leads. The feet 12 are in contact, and the elastic pad is installed on the edge pressing block 55 . The conductive sheet 56 is prevented from crushing the chip pins 12 , and the elastic pad can make the flexible wires more tightly wrapped with the pins 12 .
中间支撑机构包括:中间支撑块以及双向驱动气缸,双向驱动气缸的两输出端分别连接至两中间支撑块,两中间支撑块分别与两边缘压紧块55对应设置。The intermediate support mechanism includes: an intermediate support block and a two-way drive cylinder, the two output ends of the two-way drive cylinder are respectively connected to the two intermediate support blocks, and the two intermediate support blocks are respectively arranged corresponding to the two edge pressing blocks 55 .
残次品存储容器6为能够承接芯片的桶体结构。合格产品输出设备7为输送带,抓取机械手4将芯片放置在输送带上后,输送带就能依次将每个芯片输送至打包工位。The defective product storage container 6 is a barrel structure capable of accepting chips. The qualified product output device 7 is a conveyor belt. After the chip is placed on the conveyor belt by the grasping manipulator 4, the conveyor belt can transport each chip to the packaging station in turn.
检测芯片的时候,首先,抓取机械手4释放芯片,芯片引脚12经过伸入槽510的入口导向,继而进入到伸入槽510中,对芯片机芯定位安装;然后,双向驱动气缸驱动中间支撑块,中间支撑块能从侧面支撑芯片引脚12内侧;再后,压紧驱动机构58(压紧驱动机构58可以为气缸)驱动边缘压紧块55,边缘压紧块55将导电片56压紧在芯片引脚12上,从而实现了为芯片接入电,从而控制芯片运行,实现对芯片进行检测。When detecting the chip, firstly, the grasping manipulator 4 releases the chip, the chip pin 12 is guided through the entrance of the insertion groove 510, and then enters the insertion groove 510, and the chip movement is positioned and installed; then, the bidirectional drive cylinder drives the middle Support block, middle support block can support chip pin 12 inner side from side; Then, compress drive mechanism 58 (compress drive mechanism 58 can be air cylinder) drive edge compress block 55, edge compress block 55 will conductive sheet 56 Pressing on the pin 12 of the chip realizes the connection of power to the chip, thereby controlling the operation of the chip and realizing the detection of the chip.
本申请中,首先,为了实现方便将不合格芯片自动抓取出来,因此设置了直线输送设备2,且设置了定位工装22输送芯片;然后,为了实现定位工装22定位芯片后芯片端部从定位工装22悬出,因此设置了脚定位销220中定位孔定位芯片引脚12,且中部支撑机构能够支撑芯片的片本体11,方便了抓取机械手4抓取;再后,为了适应不同型号芯片,设置了脚定位销220可以拆卸调节,中部支撑机构可以调节,内侧支撑机构54也能适应;再后,为了避免漏装脚定位销220,因此设置了脚定位销220安装好后才能调节中部支撑机构;再后,为了实现了连续检测,提高检测效率,实现了抓取机械手4在旋转输送设备3驱动下运行依次旋转到芯片检测执行设备5、残次品存储容器6以及合格产品输出设备7,多个抓取机械手4可以同时执行,提高了生产效率;再后,同时设置抓取机械手4上的朝向检测机构48,实现了抓取移动的过程中检测芯片定位槽13位置是否是需要的,保证了芯片朝向,抓取转移过程中时间足够检测,从而避免需要专门预留时间来检测芯片的朝向,提高了生产效率;最后,设计了芯片检测执行设备5中的结构,实现了配合夹紧芯片引脚12,继而电连接至检测控制箱,实现了检测控制箱通过夹紧芯片引脚12实现芯片功能检测,避免了需要冲压芯片引脚12处而导致引脚12变形,提高了芯片的合格率。In this application, at first, in order to realize the automatic capture of unqualified chips for convenience, a linear conveying device 2 is provided, and a positioning tool 22 is provided to transport the chips; The tooling 22 hangs out, so the positioning hole positioning chip pin 12 in the foot positioning pin 220 is set, and the middle support mechanism can support the chip body 11 of the chip, which facilitates the grabbing of the grabbing manipulator 4; and then, in order to adapt to different types of chips , the foot positioning pin 220 is set and can be disassembled and adjusted, the middle support mechanism can be adjusted, and the inner support mechanism 54 can also adapt; and then, in order to avoid missing the foot positioning pin 220, the middle part can only be adjusted after the foot positioning pin 220 is installed. Supporting mechanism; and then, in order to realize continuous detection and improve detection efficiency, the grasping manipulator 4 is driven by the rotating conveying device 3 and rotates to the chip detection execution device 5, the defective product storage container 6 and the qualified product output device in turn. 7. A plurality of grasping manipulators 4 can be executed at the same time, which improves production efficiency; and then, the orientation detection mechanism 48 on the grasping manipulator 4 is set at the same time, so as to realize whether the position of the chip positioning groove 13 is required during the process of grasping and moving The orientation of the chip is ensured, and the time in the grasping and transfer process is sufficient for detection, thereby avoiding the need to reserve time for detecting the orientation of the chip and improving production efficiency; finally, the structure in the chip detection execution device 5 is designed to realize cooperation Clamp the chip pin 12, and then electrically connect it to the detection control box, so that the detection control box realizes chip function detection by clamping the chip pin 12, avoiding the deformation of the pin 12 caused by the need to punch the chip pin 12, and improving the Chip pass rate.
实施例2:Example 2:
基于实施例1的芯片来料检测系统结构,本实施例公开了一种芯片自动检测方法,包括如下步骤:S1、人工将芯片放置在定位工装22上;S2、直线输送设备2上带动输送链条21循环移动,继而将定位工装22上芯片带动到直线输送设备2的输出端;与此同时,旋转输送设备3将抓取机械手4旋转到与直线输送设备2的输出端对准的位置;S3、抓取机械手4抓取位于直线输送设备2的输出端上的芯片;S4、旋转输送设备3驱动抓取机械手4旋转,将夹紧有芯片的抓取机械手4旋转到与芯片检测执行设备5对准的位置;S5、将抓取机械手4释放芯片,芯片落在芯片检测执行设备5上;S6、芯片检测执行设备5对芯片通电后,对芯片进行检测,判断芯片是否合格,若芯片合格,则进行步骤S7以及S9,若不合格,则进行步骤S7以及S8;S7、抓取机械手4抓取位于芯片检测执行设备5上的芯片;S8、旋转输送设备3驱动抓取机械手4旋转,抓取机械手4与残次品存储容器6对准时释放芯片;S9、旋转输送设备3驱动抓取机械手4旋转,抓取机械手4与合格产品输出设备7对准时释放芯片。Based on the structure of the chip incoming detection system in Embodiment 1, this embodiment discloses a chip automatic detection method, including the following steps: S1, manually placing the chip on the positioning tool 22; S2, driving the conveying chain on the linear conveying device 2 21 circular movement, and then drive the chip on the positioning tool 22 to the output end of the linear conveying device 2; at the same time, the rotating conveying device 3 rotates the grasping manipulator 4 to a position aligned with the output end of the linear conveying device 2; S3 1. The grasping manipulator 4 grasps the chip located on the output end of the linear conveying device 2; S4, the rotating conveying device 3 drives the grasping manipulator 4 to rotate, and rotates the grasping manipulator 4 clamped with the chip to the chip detection execution device 5 Aligned position; S5, release the chip by grabbing manipulator 4, and the chip falls on the chip detection execution device 5; S6, after the chip detection execution device 5 powers on the chip, detect the chip to determine whether the chip is qualified, if the chip is qualified , then proceed to steps S7 and S9, if unqualified, then proceed to steps S7 and S8; S7, the grasping manipulator 4 grasps the chip located on the chip detection execution device 5; S8, the rotating conveying device 3 drives the grasping manipulator 4 to rotate, The chip is released when the grasping manipulator 4 is aligned with the defective product storage container 6; S9, the rotating conveying device 3 drives the grasping manipulator 4 to rotate, and the chip is released when the grasping manipulator 4 is aligned with the qualified product output device 7.
S3运行的同时,进行如下步骤S3’,步骤S3’包括:步骤S31’、位于抓取机械手4处的朝向检测机构48检测芯片朝向是否合格,即是判断定位槽13是否在夹紧处,若是合格,则进行步骤S4;若不合格,则进行步骤S10、旋转输送设备3驱动抓取机械手4旋转到朝向错误输出设备(可以是传送带,位于合格产品输出设备7旁)的输入端,且抓取机械手4将该芯片释放到朝向错误输出设备的输入端。While S3 is running, the following step S3' is carried out. Step S3' includes: step S31', the orientation detection mechanism 48 located at the grasping manipulator 4 detects whether the orientation of the chip is qualified, that is, it is judged whether the positioning groove 13 is in the clamping position, and if If qualified, then proceed to step S4; if unqualified, then proceed to step S10, the rotary conveying device 3 drives the grasping manipulator 4 to rotate to the input end towards the wrong output device (which can be a conveyor belt, positioned beside the qualified product output device 7), and grabs Take manipulator 4 to release the chip to the input facing the error output device.
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的宗旨和范围,其均应涵盖在本发明的权利要求范围当中。Finally, it is noted that the above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be carried out Modifications or equivalent replacements without departing from the spirit and scope of the technical solution of the present invention shall be covered by the claims of the present invention.
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