CN116608450A - LED module heat radiation structure - Google Patents

Abstract

The invention discloses a heat dissipation structure of an LED module, which belongs to the technical field of lamps and lanterns, and comprises the following components: the lens comprises a connecting bracket, a lens, a heat dissipation connecting part and a heat radiator; a plurality of lenses are uniformly arranged in the connecting support; the heat dissipation connecting part is arranged between the connecting bracket and the radiator; the heat dissipation connecting parts are respectively in contact connection with the lens and the radiator. Because the traditional LED modules mainly use the heat dissipation device on the back of the lamp bead, the heat dissipation on the front of the LED modules is very little; the heat conducting bonding pad of the thermoelectric separation lamp bead is directly welded and connected onto the radiator, so that the heat dissipation of the LED module is split into an aluminum radiator by utilizing the back surface of the lamp bead and a lens on the front surface of the lamp bead is directly contacted with the radiator to transfer heat. Therefore, the LED module radiating structure solves the technical problem that the existing LED module is poor in radiating effect.

Description

A heat dissipation structure of an LED module

technical field

The invention relates to the technical field of lamps, in particular to a heat dissipation structure of an LED module.

Background technique

Because LED has excellent energy saving and stability, it has been well promoted. At the same time, there are many problems faced by LED modules, mainly focusing on heat generation. Although, with the continuous improvement of LED efficiency, the heat dissipation required by the module will decrease accordingly; when the heat generated by the LED module is so small that only one substrate is needed to dissipate it, the cost of heat dissipation is lowest. However, the heat generated by the high-power LED module far exceeds the heat dissipation efficiency of a single substrate; thus, its heating effect cannot be ignored. Specifically, as the LED chip is the basic component of the LED module, since the PN junction inside it is very sensitive to temperature, as the temperature of the LED rises, the luminous efficiency of the LED chip will decrease significantly. If the heat dissipation problem of the LED is not handled well, its actual working efficiency will be seriously restricted. For this reason, for LEDs with low power, it is also recommended to be equipped with a heat sink of considerable volume. The outside of the heat sink mainly includes heat dissipation fins, and the inside includes a heat conduction substrate attached to the bottom of the LED chip. However, since the current LED chips are all welded on the circuit board, the contact area between the heat-conducting substrate and the LED chip is very limited; moreover, the temperature of the heat-conducting substrate is higher than the temperature of the external cooling fins, resulting in a gap between the LED chip and the heat-conducting substrate. The heat transfer efficiency is very low.

Based on this, Chinese patent CN104747948A discloses a high heat dissipation LED, which includes a metal heat sink, the metal heat sink is a geometric rotating body, which includes a bottom surface and a side surface that is folded backward; A layer of heat insulation layer is laid on the rear surface of the bottom surface; an inner cavity is formed between the heat insulation layer and the side of the heat sink, and a circuit board is arranged in the inner cavity; the heat dissipation There is a central through hole in the center of the bottom surface of the radiator; with the center of the bottom surface as the center of the circle, the radiator is divided into even-numbered subsections in the circumferential direction, each subsection is separated by an insulating medium, and adjacent subsections are electrically connected to the Different electrodes at the output end of the circuit board; adjacent subsections form equal-width seams on the bottom surface; LED chips are evenly pasted along the seams on each of the seams, and the two patch pins of the LED chips are Span across the adjacent divisions on both sides of the seam. The high heat dissipation LED has good heat dissipation effect and low power consumption.

However, the LED heat dissipation structure solution disclosed above still has the technical problem of low heat dissipation efficiency. Specifically, with the rapid increase of LED categories, LED power solutions are also developing in a diversified direction. Among them, the high-voltage linear constant current drive power supply scheme has a simple circuit and can meet the requirements of EMC, Energy Star and dimming without adding any safety capacitors or inductors; it has attracted more and more attention from LED design manufacturers. In the circuit part of the high-voltage linear constant current drive power supply scheme, all solid components are used, so that the technical problem of vulnerability caused by long-term use of electrolytic capacitors at high temperatures can be better avoided. Therefore, the service life of the power supply in this solution is longer and more reliable; and, in this solution, the power supply and the lamp bead can be integrated to reduce the processing cost of the product. Therefore, in the case of also meeting the export safety standards and quality requirements, the solution cost of the power supply can be greatly reduced. In addition, the high-voltage linear constant-current driving power solution also has the functions of automatic over-temperature protection and over-voltage protection; therefore, it can better guarantee the life of the power supply and the whole lamp. However, the high-voltage power supply solution still has insulation problems, which leads to a thicker insulating layer on the aluminum substrate; and makes its thermal resistance higher than that of ordinary solutions, requiring a larger heat dissipation area and That is, its material cost is higher. For the LED module in the prior art, its heat dissipation efficiency is far from meeting the heat dissipation requirement of this high-voltage linear constant current driving solution. In addition, aluminum is a metal with high energy consumption, and each ton of electrolytic aluminum consumes about 21,000 kilowatt-hours of electricity; therefore, how to reduce the amount of aluminum used to achieve energy saving and emission reduction, thereby reducing the heat dissipation cost of LED modules is also a technical problem that needs to be solved urgently .

Contents of the invention

Based on this, in order to solve the technical problem of how to improve the heat dissipation effect of the LDE module, a heat dissipation structure of the LED module is provided.

A heat dissipation structure for an LED module, comprising: a connecting bracket, a lens, a heat dissipation connection part and a heat sink; a plurality of the lenses are evenly arranged in the connection bracket; the heat dissipation connection part is arranged between the connection bracket and the heat sink between the heat sinks; the heat dissipation connection parts respectively contact and connect the lens and the heat sink.

Further, a flexible circuit board and LED light-emitting elements are respectively arranged between the connecting bracket and the heat sink; the flexible circuit board is arranged below the connecting bracket; the flexible circuit board is uniformly electrically connected A plurality of the LED light emitting elements; the LED light emitting elements are arranged corresponding to the lens.

Further, the flexible circuit board is provided with a hollow structure and a heat dissipation avoidance structure; the LED light-emitting element is connected to the heat sink after passing through the hollow structure; the heat dissipation connection part passes through the heat dissipation avoidance structure. After the empty structure, the lens and the heat sink are respectively contacted and connected.

Furthermore, the LED light-emitting elements are thermoelectrically separated lamp beads; each of the LED light-emitting elements is provided with a light-emitting element body, a conductive pad, and a thermally conductive pad.

Furthermore, the main body of the light-emitting element is electrically connected to the flexible circuit board through the conductive pad.

Furthermore, the main body of the light-emitting element is in contact with the heat sink through the thermal pad.

Further, the heat dissipation connection part has a convex part and a concave part; the convex part is in contact with the lens; the concave part is arranged in the convex part at intervals, and the concave part It is coated with near-infrared radiation material.

Furthermore, after the heat dissipation connection part is connected to the heat sink, the top plane of the raised part is higher than the top plane of the flexible circuit board.

Further, the heat dissipation connection part is integrated with the heat sink.

Further, the heat dissipation connection part is detachably connected to the heat sink.

To sum up, the LED module heat dissipation structure of the present invention is respectively provided with a connection bracket, a lens, a heat dissipation connection part and a heat sink; a plurality of the lenses are uniformly arranged in the connection bracket; the heat dissipation connection part is arranged on the between the connecting bracket and the heat sink; the heat dissipation connection parts respectively contact and connect the lens and the heat sink. Because the traditional LED module is mainly based on the heat dissipation device on the back of the lamp bead, and the heat dissipation on the front is negligible; and in the present invention, the heat conduction pad of the thermoelectric separation lamp bead is directly welded and connected to the heat sink, so that the The heat dissipation of the LED module is divided into using the aluminum radiator on the back of the lamp bead and using the lens on the front of the lamp bead to directly contact the radiator to transfer heat. The traditional lens has pc material and glass, the thermal conductivity of glass is 1.03w/mk; the thermal conductivity of pc is 0.19w/mk; and the thermal emissivity of glass and pc is about 0.9, which is much higher than that of aluminum 0.3. Therefore, the heat dissipation structure of the LED module of the present invention solves the technical problem of poor heat dissipation effect existing in the existing LED module.

Description of drawings

Fig. 1 is the structure schematic diagram of a kind of LED module cooling structure of the present invention;

Fig. 2 is a schematic diagram of an explosion structure of an LED module heat dissipation structure of the present invention;

3 is a partial structural schematic diagram of an LED module heat dissipation structure of the present invention;

4 is a partial structural schematic diagram of an LED module heat dissipation structure according to the present invention;

5 is a schematic diagram of a partial explosion structure of an LED module heat dissipation structure according to the present invention;

6 is a partial structural schematic diagram of an LED module heat dissipation structure according to the present invention;

7 is a partial structural schematic diagram of an LED module heat dissipation structure according to the present invention;

8 is a schematic diagram of a partial exploded structure of an LED module heat dissipation structure according to the present invention;

9 is a schematic diagram of a partial exploded structure of an LED module heat dissipation structure according to the present invention;

FIG. 10 is a structural schematic diagram of another embodiment of an LED module heat dissipation structure according to the present invention.

Implementation

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise specified limit. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions are for the purpose of illustration only and are not intended to represent the only embodiments.

Please refer to Fig. 1 to Fig. 9 together. A specific embodiment of the LED module heat dissipation structure of the present invention includes: connecting bracket 1, lens 2, flexible circuit board 3, several LED light emitting elements 4, and several heat dissipation connecting parts 5. Radiator 6 and high-voltage driving power supply 7; several lenses 2 are evenly arranged in the connecting bracket 1; the flexible circuit board 3 is arranged under the connecting bracket 1; Each of the LED light-emitting elements 4 is electrically connected to the top respectively; the LED light-emitting elements 4 are arranged corresponding to the lens 2 . The flexible circuit board 3 is provided with a hollow structure 301 and a heat-dissipating hollow structure 302; the hollow structure 301 allows the LED light-emitting element 4 to be directly connected to the heat sink 6; a number of the LED light-emitting elements 4 are uniformly arranged Setting; the heat dissipation and air-avoiding structure 302 is set between the LED light-emitting elements 4 arranged in every two rows. Each of the heat dissipation connecting parts 5 passes through the heat dissipation structure 302, and each of the heat dissipation connecting parts 5 is arranged between the heat sink 6 and the lens 2; each of the heat dissipation connecting parts 5 each have a convex portion 501 and a concave portion 502; the convex portion 501 is in contact with the lens 2; the concave portion 502 is arranged in the convex portion 501 at intervals; 502 is coated with near-infrared radiation material. The heat sink 6 is connected to the connection bracket 1 to accommodate the flexible circuit board 3 , the LED light emitting element 4 and the heat dissipation connecting portion 5 therebetween. The high-voltage driving power supply 7 is embedded in the heat sink 6 , and the high-voltage driving power supply 7 is electrically connected to the flexible circuit board 3 .

Specifically, the material of the connecting bracket 1 is preferably a plastic material so as to meet the safety requirements of high-voltage driving; of course, other materials with insulation properties are also available, but the plastic material has a higher cost advantage. A plurality of the lenses 2 are pierced through the connecting bracket 1 so as to guide the light source of the LED light emitting element 4 . The flexible circuit board 3 is electrically connected to the LED light-emitting element 4 and the high-voltage driving power supply 7 respectively; a plurality of the heat dissipation connection parts 5 are arranged between the flexible circuit boards 3; each of the heat dissipation connections Part 5 is connected to the lens 2 and the heat sink 6; thus, the heat generated by each LED light-emitting element 4 can be directly dissipated by the heat sink 6; at the same time, the radiation generated at the lens 2 The heat can also be directly transferred to the radiator 6 through the heat dissipation connection part 5; the high-voltage driving power supply 7 can also be directly dissipated by the radiator 7; thus, the heat dissipation efficiency of the LED module can be significantly improved, In order to adapt to the requirements of the high-voltage driving power solution.

More specifically, the LED light-emitting elements 4 may be thermoelectrically separated lamp beads, that is, each of the LED light-emitting elements 4 is provided with a light-emitting element body 401, a conductive pad 402, and a heat-conductive pad 403; The component body 401 is electrically connected to the flexible circuit board 3 through the conductive pad 402 for emitting light; the thermal pad 403 is connected to the heat sink 6; for example, the thermal pad 403 can pass through The hollow structure 301 ; then, the heat conduction pad 403 can be directly connected to the heat sink 6 by soldering. Therefore, the heat generated when the light-emitting element 401 emits light can be directly transferred to the heat sink 6 through the heat-conducting pad 403 . Because, in the traditional LED lamp design scheme, the bottom side of the LED lamp is an aluminum substrate and a heat sink, and there are two layers of thermal resistance between them. This is because a relatively thick insulating layer is provided between the circuit board and the aluminum substrate, and there is a gap between the contact surface of the aluminum substrate and the heat sink. In the scheme of the heat dissipation structure of the LED module of the present invention, the LED light-emitting element 4 is a lamp bead separated from thermoelectricity, and the heat-conducting pad 403 provided on the LED light-emitting element 4 is directly connected to the heat sink 6 Above, thus avoiding the appearance of the aforementioned two-layer thermal resistance. As a result, the temperature difference between the heat conduction pad 403 provided on the LED light-emitting element 4 and the heat sink 6 is significantly reduced. Compared with the traditional LED lamp structure, under the same pad temperature, the temperature of the heat sink 6 is increased, and the heat exchange capacity between the heat sink 6 and the air is also improved accordingly, and the required heat dissipation area is also reduced. Can be reduced accordingly, so that the use of aluminum can be reduced.

Further, each of the heat dissipation connecting parts 5 is provided with the convex part 501 and the concave part 502; and the convex part 501 can directly contact the bottom of the lens 2; in order to compensate for the The convex part 501 is in direct incomplete contact with the lens 2, and the concave parts 502 can be arranged at intervals between the convex parts 501; and the near-infrared radiation material is coated in the concave parts 502 ; Because traditional far-infrared radiation materials cannot transmit glass. More specifically, the prior art discloses that AM ₃ (BO ₃ ) ₄ (A=rare earth element, M=Al, Ga, Fe, In, Sc) crystal has excellent physical and chemical stability, and its matrix simultaneously With A ³⁺ and M ³⁺ crystal sites, it is suitable for Cr ³⁺ ion/rare earth ion doping, and can be used to prepare broadband near-infrared radiation luminescent materials with high luminous efficiency and high fluorescence thermal stability. In addition, GdAl ₃ (BO ₃ ) ₄ :Cr ³⁺ , YAl ₃ (BO ₃ ) ₄ :Cr ³⁺ , LaGa ₃ (BO ₃ ) ₄ :Cr ³⁺ , LaSc ₃ (BO ₃ ) ₄ : Cr ³⁺ and a series of borate luminescent materials. And found that this kind of material can be effectively excited by blue light in the range of 430-470nm and red light in the range of 580-660nm, and different matrix materials can emit near-infrared light of different wavelengths, and the emission peak can be adjusted in the range of 730-850nm. The emission wavelength can cover 650~1100nm. Among them, GdAl ₃ (BO ₃ ) ₄ :Cr ³⁺ material has a luminescent internal quantum yield as high as 91%, and is one of the few efficient near-infrared luminescent materials at present. In addition, the heat dissipation connecting portion 5 can be integrally arranged with the heat sink or adopt a connection method of thinner glue and thermocompression. Moreover, after the heat dissipation connection part 5 is disposed on the heat sink 6 through the heat dissipation avoidance structure 302, the top surface of the heat dissipation connection part 5 is higher than the top surface of the flexible circuit board 3 by about 0.3 mm; thus, after the connection bracket 1 is locked and connected by the waterproof rubber ring, the bottom surface of the lens 2 can be in close contact with the raised portion 501 of the heat dissipation connection portion 5 . Further, the heat dissipation connection part 5 can be used as the self-structure of the heat sink 6 to be prepared by integral molding. In addition, the heat dissipation connection part 5 can also be provided as a separate component; specifically, the heat dissipation connection part 5 can be made of a thinner material and connected to the heat sink 6 by means of thermal compression bonding of glue; That is, the heat dissipation connecting portion 5 in this embodiment is a detachable structural form from the heat sink 6 .

Further, the heat sink 6 has a heat dissipation connection substrate 601 and a heat sink main body 602; the heat dissipation connection substrate 601 has a plane side 601a and a fin side 601b; the plane side 601a is opposite to the fin side 601b. The flexible circuit board 3 and the heat dissipation connecting portion 5 are connected on the plane side 601 a ; and the heat conduction pad 403 is also connected thereon. The radiator main body 602 has several air flow passages 602a; the bottom of the connecting bracket 1 is provided with several air guide openings 101; the air flow passages 602a are connected to the air guide openings 101. In addition, the outer surface of the heat sink body 602 is also uniformly provided with a number of cooling fins. Therefore, the heat sink 6 provided in the present invention also has a good heat dissipation effect.

Further, in the embodiments shown in Fig. 1 to Fig. 9, the LED modules are in the form of vertical arrangement and distribution; in some other embodiments, the LED modules can also be in the form of horizontal arrangement and distribution , as shown in Figure 10. In the embodiment disclosed in FIG. 10 , several LED light-emitting elements 4 are alternately arranged and distributed on the flexible circuit board 3 laterally, and the heat dissipation connection part 5 is arranged between every two rows of the LED light-emitting elements 4 . The horizontally arranged LED modules can also achieve the purpose of improving heat dissipation efficiency.

To sum up, the LED module heat dissipation structure of the present invention is respectively provided with a connection bracket 1, a lens 2, a heat dissipation connection part 5 and a heat sink 6; a plurality of the lenses 2 are uniformly arranged in the connection bracket 1; The heat dissipation connection part 5 is disposed between the connection bracket 1 and the heat sink 6 ; the heat dissipation connection part 5 is respectively in contact with the lens 2 and the heat sink 6 . Because the traditional LED module is mainly based on the heat dissipation device on the back of the lamp bead, and the heat dissipation on the front is negligible; and in the present invention, the heat conduction pad 403 of the thermoelectric separation lamp bead is directly welded and connected to the heat sink 6, The heat dissipation of the LED module can be divided into using the aluminum radiator on the back of the lamp bead and using the lens 2 on the front of the lamp bead to directly contact the radiator 6 to transfer heat. The traditional LED lens has pc material and glass, the thermal conductivity of glass is 1.03w/mk; the thermal conductivity of pc is 0.19w/mk; and the thermal emissivity of glass and pc is about 0.9, which is much higher than that of aluminum 0.3. Therefore, the heat dissipation structure of the LED module of the present invention solves the technical problem of poor heat dissipation effect existing in the existing LED module.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A heat dissipation structure for an LED module, characterized in that it comprises: a connection bracket, a lens, a heat dissipation connection part and a heat sink; a plurality of lenses are evenly arranged in the connection bracket; the heat dissipation connection part is arranged on the between the connecting bracket and the heat sink; the heat dissipation connection parts respectively contact and connect the lens and the heat sink. 2. The LED module heat dissipation structure according to claim 1, characterized in that: a flexible circuit board and an LED light-emitting element are respectively arranged between the connecting bracket and the heat sink; the flexible circuit board is arranged on Below the connection bracket; above the flexible circuit board, several LED light-emitting elements are evenly and electrically connected; the LED light-emitting elements are arranged corresponding to the lens. 3. A LED module heat dissipation structure according to claim 2, characterized in that: the flexible circuit board is provided with a hollow structure and a heat dissipation avoidance structure; The heat sink is contacted and connected; the heat dissipation connection part is connected to the lens and the heat sink respectively after passing through the heat dissipation structure. 4. A LED module heat dissipation structure according to claim 3, characterized in that: said LED light-emitting element is a lamp bead separated from thermoelectricity; each said LED light-emitting element is provided with a light-emitting element body and a conductive pad and thermal pads. 5 . The LED module heat dissipation structure according to claim 4 , wherein the main body of the light-emitting element is electrically connected to the flexible circuit board through the conductive pad. 6 . The LED module heat dissipation structure according to claim 5 , wherein the main body of the light-emitting element is in contact with the heat sink through the heat-conducting pad. 7 . 7. The LED module heat dissipation structure according to claim 1, characterized in that: the heat dissipation connection part has a convex part and a concave part; the convex part is in contact with the lens; The pits are arranged at intervals among the raised portions, and the near-infrared radiation material is coated in the pits. 8. The LED module heat dissipation structure according to claim 7, characterized in that: after the heat dissipation connection part is connected to the heat sink, the top plane of the raised part is higher than the flexible circuit The top plane of the board. 9 . The LED module heat dissipation structure according to claim 1 , wherein the heat dissipation connection part is integrated with the heat sink. 10 . The LED module heat dissipation structure according to claim 1 , wherein the heat dissipation connecting portion is detachably connected to the heat sink. 11 .