CN116544200A - Chip radiator - Google Patents

Abstract

The invention relates to a chip radiator. The chip radiator comprises an application plate, wherein the application plate is applied to the surface of a chip and is tightly pressed on the surface of the chip; the heat dissipation fins are arranged in parallel, and are connected with the upper surface of the application plate; the heat dissipation column protrudes out of the lower end face of the attaching plate, is telescopic and is pressed on the surface of the chip, and a gap is reserved between the attaching plate and the supporting structure of the chip; the chip radiator has higher application stability with the chip, has good heat dissipation, high heat dissipation efficiency and is convenient to popularize and use.

Description

A chip radiator

technical field

The invention belongs to the technical field of chip heat dissipation, and in particular relates to a chip radiator.

Background technique

In the prior art, the non-embedded copper tube type non-fan active heat dissipation heat sink design of the existing PCB board card mainly includes the following types:

The first type is a small square radiator with fins. The method of using this type of radiator is to directly use thermal conductive silicone grease to directly attach it to the surface of the IC chip, so that the PCB board does not have a large external force. Under normal circumstances, it is used in the heat dissipation of SMT chips with most flat surfaces;

The second category is the heat sink with screw fixing. The use of this type of heat sink is to screw it on some in-line devices through the method of screw fixing, so that the natural convection speed of the in-line devices can be accelerated, and it can be used in some Directly plugged into MOS tubes with holes and some special IC chips;

The third category is a direct-pressure finned heat sink without screw holes. The method of using this type of heat sink is to attach a silicone grease pad or coat a thermally conductive silicon on the IC chip or MOS tube that needs to be dissipated. Grease, directly press the heat sink on the PCB board, so that the components that need heat dissipation are attached to the heat sink for heat dissipation, and can be used in situations where the height of the electronic components is similar and the PCB board does not have a large external force;

The fourth type, direct pressure finned heat sink with screw holes, the use of this type of heat sink is to stick a silicone grease pad or apply thermal conductive silicone grease on the IC chip or MOS tube that needs to be dissipated. The heat sink is directly pressed on the PCB board, and then tightened and fixed with screws or studs, so that the components that need heat dissipation are attached to the heat sink for heat dissipation. Compared with the third type heat sink, this heat sink can be used in electronic The height of components is not much different (it can be larger than the height difference of category 3, because it is fixed with screw holes, so it can be suspended to a certain height by studs or other methods), and the PCB board and radiator assembly It is allowed to withstand certain external forces, such as inclined/vertical placement, shaking, vibration, etc.;

The fifth category, copper-plug type sun-shaped fin radiators, the use of this type of radiator is to attach a silicone grease pad or coat a thermal conductive silicone grease on the IC chip or MOS tube that needs to be dissipated, and directly dissipate the heat The place where the device has copper pillars is pressed on the PCB board, so that the copper pillars and heat-generating components are fully bonded through the heat-conducting silicone grease/silicon grease pad, and then tightened and fixed with screws or studs, so that the components that need to dissipate heat and the radiator Bonding for heat dissipation, compared with the fourth type radiator, due to the addition of copper pillars (copper thermal conductivity: 409, aluminum thermal conductivity: 237), its thermal conductivity is higher, the use of this radiator is the same as that of the fourth type radiator The use occasions are almost the same, the main difference lies in the improvement of its heat conduction efficiency.

In the design based on the internal heat dissipation structure of the patrol robot, the heat dissipation problem of the chip soldered to the PCB board card inside the electric control box of the patrol robot cannot be solved well by referring to the existing chip heat sink. Therefore, a heat dissipation design that can be applied to other electronic devices is proposed.

Contents of the invention

The object of the present invention is to provide a chip heat sink with simple structure and reasonable design in order to solve the above problems.

The present invention achieves the above object through the following technical solutions:

A chip heat sink comprising,

An application board, the application board is attached to the surface of the chip and pressed tightly on the surface of the chip;

Heat dissipation fins, the number of the heat dissipation fins is several groups, the heat dissipation fins of several groups are arranged in parallel, and the heat dissipation fins are connected to the upper surface of the application board;

The heat dissipation column protrudes from the lower end surface of the cladding plate, and the heat dissipation column is a retractable heat dissipation column, and the heat dissipation column is pressed on the surface of the chip, so that the contact between the bonding plate and the support structure of the chip There is a gap between them.

As a further optimization solution of the present invention, the lower end surface of the application board is provided with a placement groove, the heat dissipation column is placed in the placement groove, and a spring member is also arranged in the placement groove, and the spring member is connected to the heat dissipation column .

As a further optimization solution of the present invention, the spring member is connected with a limiting plate, the surface of the heat dissipation column is provided with a limiting groove, and the limiting plate is inserted into the limiting groove.

As a further optimization solution of the present invention, the heat dissipation column is provided with a through hole.

As a further optimization solution of the present invention, the heat dissipation column is a copper column, which is square or rectangular.

As a further optimization solution of the present invention, the basic fixed position is set at the corner position of the application board.

As a further optimization solution of the present invention, the pressing and fastening positioning is arranged on the surface of the application board and is close to the heat dissipation column to block the heat dissipation fins.

As a further optimization solution of the present invention, both the basic fixing position and the pressing fastening position are provided with screw holes, and fastening components are used to fix the application plate.

As a further optimization solution of the present invention, the upper end surfaces of several groups of the heat dissipation fins all have the same gradual undulation, and the gradual undulation is the same or different continuous peaks and troughs.

As a further optimization solution of the present invention, an inclined surface is provided on the upper end surface of the heat dissipation fin.

The beneficial effect of the present invention is that: the present invention and the chip have high sticking stability, good heat dissipation, high heat dissipation efficiency, and are convenient for popularization and use.

Description of drawings

Fig. 1 is the overall structural representation of the present invention;

Fig. 2 is a structural schematic diagram of another perspective of the present invention;

Fig. 3 is the side structure schematic diagram of Fig. 1 of the present invention;

Fig. 4 is the structural representation of the bottom surface of the present invention;

Fig. 5 is another side structural schematic diagram of Fig. 1 of the present invention;

Fig. 6 is a top view structural schematic diagram of Fig. 1 of the present invention;

Fig. 7 is a side sectional structural schematic diagram of the present invention;

Fig. 8 is a schematic diagram of the side structure of the cooling fin of the present invention;

Fig. 9 is a structural schematic diagram of a cooling fin with a channel of the present invention;

Fig. 10 is a structural schematic diagram of another cooling fin with channels of the present invention;

Fig. 11 is a structural schematic diagram of a cooling fin with a moving sheet of the present invention;

Fig. 12 is a schematic diagram of the side structure of the moving sheet of the present invention.

In the figure: 1. Sticking plate; 11. Placement groove; 2. Basic fixed position; 21. Screw hole; 3. Heat dissipation fin; 31. Inclined surface; 32. Radiation arc piece; 33. Moving piece; 34. Driving column ; 35, limit buckle; 4, pressure fastening positioning; 5, heat dissipation column; 51, limit tank body; 52, limit plate;

Detailed ways

The application will be described in further detail below in conjunction with the accompanying drawings. It is necessary to point out that the following specific embodiments are only used to further illustrate the application, and cannot be interpreted as limiting the protection scope of the application. The above application content makes some non-essential improvements and adjustments to this application.

Example 1

As described in the background technology, in this embodiment, the following shortcomings in the prior art can be solved:

1. Non-screw-fixed heat sinks have limited application occasions, and PCB boards are often affected by more or less external forces, while conventional screw-fixed heat sinks, such as the fourth type of heat sink above, have fixed spaces all around. However, the heat dissipation IC chip may be in the center of the board, so the force point of the tightened screw is far away from the IC chip, resulting in unstable fixation and poor heat conduction effect;

2. Conventional finned radiators often use square/rectangular fins, which have a large optimization space in the case of the same volume, such as the heat dissipation area of the fin cross-section natural convection, the central position Natural convection paths on both sides of the fin pair, etc.;

3. For example, the fifth type of plugged copper finned radiator usually has a copper column corresponding to a heating element, which needs to be fixed separately with screw holes, which occupies more board positions. In addition, because the contact surface of the copper column needs to be in contact with The reason for the close fit of the heating components is that it is necessary to accurately measure the direct distance between the fins and the heating components after the radiator is fixed, so as to determine the height of the copper pillars. If the copper pillars are fixed before the measurement, it is necessary to There are high requirements on the fixed height to ensure that the radiator can fit accurately with the heating components;

4. For the types of radiators described above, the entire bottom of the fins is usually attached to the heating components, so the heat dissipation path is only above the fins, and the entire surface below the radiator is stuck to the PCB board. If it is tightly closed, an air film will be formed to prevent heat from flowing, and there will be no conditions for natural convection.

As shown in Figures 1 to 7, a chip heat sink includes,

An application board 1, the application board 1 is applied on the surface of the chip and pressed tightly on the surface of the chip;

The heat dissipation fins 3, the number of the heat dissipation fins 3 is several groups, the several groups of the heat dissipation fins 3 are arranged in parallel, and the heat dissipation fins 3 are connected to the upper surface of the application plate 1;

The heat dissipation column 5, the heat dissipation column 5 protrudes from the lower end surface of the cladding plate 1, and the heat dissipation column 5 is a retractable heat dissipation column 5, and the heat dissipation column 5 is pressed on the surface of the chip, so that the cladding plate 1 with a gap between the supporting structure of the chip.

In this solution, the telescopic form of the telescopic heat dissipation column 5 can adopt forms such as multi-stage telescopic rods in the prior art. In this embodiment, the following forms can be adopted:

The lower end surface of the application plate 1 is provided with a placement groove 11, and the heat dissipation column 5 is placed in the placement groove 11, and a spring member 53 is also arranged in the placement groove 11, and the spring member 53 is connected with the heat dissipation column 5 . Generally, the placement groove 11 and the heat dissipation column 5 are preferably in a state of bonding;

Specifically, the spring member 53 is connected with a limiting piece 52 , a limiting groove 51 is formed on the surface of the cooling column 5 , and the limiting piece 52 is inserted into the limiting groove 51 .

Further, the heat dissipation column 5 is provided with through holes.

Still further, the heat dissipation column 5 is a copper column, which is square or rectangular.

In actual use, or with the discovery of some heat-dissipating and heat-conducting materials in the future, the heat-dissipating column 5 can be prepared and used by selecting other materials; and when it is in a square structure, it can cope with the heat dissipation of square heating components such as square chips and ordinary MOS tubes. Use; when it has a rectangular structure, it can be used for heat dissipation of heating components such as routing chips and DDR memory chips.

In actual use, a corresponding limit piece can be added at the bottom of the application plate 1 to clamp the limit column 5 for use together.

It should be noted that when the above method is adopted, since the copper column is compressible and stretchable, the height margin of the copper column is relaxed, and the cooperation of the spring and the limit piece is used to fix the copper column and enable the copper column to be in contact with the heating IC. The chips are closely bonded, and compared to the shortcomings of the existing solutions, due to the scalability design of the copper pillars, the fins can be raised by the surrounding studs, so that there is a certain distance from the PCB board, and due to the retractable design The copper pillars ensure that the heat dissipation channels of the copper pillars are closely matched with the heat-generating IC chip while supporting the height of the radiator body, and provide a gap under the fins, which can provide additional air convection space for the heat dissipation of the chips except for the fins; It can well solve the problems of loose fit, cumbersome production, and difficult measurement caused by the high precision requirements of copper pillars, and optimize the problem of no air convection and no cooling space under the radiator.

Further, the application plate 1 is also provided with,

The basic fixing position 2 is set at the corner position of the application board 1 .

Press fastening positioning 4, the pressing fastening positioning 4 is arranged on the surface of the application plate 1, and is close to the position of the heat dissipation column 5, and isolates the heat dissipation fin 3.

Specifically, both the basic fixing position 2 and the press fastening position 4 are provided with screw holes 21, and cooperate with fastening components to fix the application board 1 .

As shown in Figure 6, the setting of the screw hole 21 is actually set based on the position of the heat dissipation chip. This application designs the rectangular and square heat dissipation columns 5 together. It can be seen that the chip is located in the rectangular heat dissipation column or the square heat dissipation column. 5, they are all pressed and fixed by four sets of screw holes 21; based on this, even if there is a heating device in the center, there is no need to drill holes again, and the two screw holes on the right of the left heat dissipation structure and the The two screw holes on the left side of the heat dissipation structure on the right are used to fix it, so as to achieve the purpose of sharing the screw hole 21 and reducing the space.

It should be noted that in the actual use of this solution, by setting up a heat sink with screw hole fixing positions, and the screw holes cover the positions except the basic fixing positions at the four corners, and leave screw holes near the IC chip that focuses on heat dissipation, Compared with the above-mentioned disadvantage 1, the force point of the screw that can be tightened optimally is far away from the IC chip, which leads to the problem that the fixation is not firm and the heat conduction effect is poor. Some of the holes are shared between the heating IC chips, so it is compared to Disadvantage 3 of the existing solution can optimize the problem of occupying more board positions, and can effectively solve the problems of insufficient fixation near the heating IC and occupation of board hole positions and space.

Further, the upper end surfaces of several groups of the heat dissipation fins 3 all have the same gradual undulation, and the gradual undulation is the same or different continuous peaks and troughs.

Specifically, a wave-shaped structure can be used, wherein the peaks and valleys cooperate to increase the cross-sectional area of the heat dissipation fins, and the concave grooves of the peaks and valleys are used when there are laminated PCB boards or structural parts on the top of the radiator ( It can also be used alone to improve heat dissipation efficiency) to provide a horizontal heat dissipation channel for the heat sink of this solution.

It should be noted that the upper end surfaces of several groups of heat dissipation fins 3 are provided with corresponding gradual undulations to facilitate the formation of air circulation channels and improve heat dissipation efficiency; meanwhile, the gradual undulations can be the same or different continuous peaks and troughs, different peaks The trough can adapt to the spatial layout and the position of the chip, and adopts a wave-shaped heat dissipation fin structure, which has the advantage of increasing the cross-sectional area of the fin to increase the heat dissipation area. The channel for air convection to the outside helps the heat in the inner position to flow horizontally to the outside, not limited to the vertical flow in the direction parallel to the fins. By increasing the heat dissipation cross-sectional area of the fins, the heat generated by the internal fins is solved. The problem that heat is difficult to circulate externally.

Example 2

As shown in FIG. 8 , based on the above-mentioned embodiment 1, on the basis of the above-mentioned embodiment 1, the heat dissipation area of the heat dissipation fin 3 is further increased, and the upper end surface of the heat dissipation fin 3 is provided with a slope 31 .

It should be noted that, the inclined surface 31 may be oppositely disposed with two groups of surfaces corresponding to one cooling fin 3 .

Example 3

As shown in Figure 9 and Figure 10, on the basis of the above-mentioned Embodiment 1 and Embodiment 2, the heat dissipation efficiency of the heat dissipation fin 3 is further improved:

The heat dissipation fins 3 are bent outwards in an arc shape at a set height position to form the heat dissipation arc 32. The heat dissipation arc 32 is a single arc or a double arc at a set height position. When it is a single arc , two groups of heat dissipation fins 3 form a pair of heat dissipation assemblies, and the heat dissipation fins 3 in a pair of said heat dissipation assemblies are arranged oppositely to form a channel; when it is a double arc, a group of said heat dissipation arcs 32 directly constitute a heat dissipation assembly ; The channels of the adjacent cooling components are misaligned.

In fact, the biggest difference between the above two schemes is whether the cooling fins 3 are connected except for the channels, that is, whether a channel is opened up in a group of cooling fins 3; by setting arc-shaped channels, the heat dissipation efficiency is further improved, and the air flow is facilitated. Effect on heat sink fin 3.

It should also be noted that, even if the entire cooling fin 3 is still undulating in undulations, the channel can also be set in undulations (or straight through).

As shown in Figure 11 and Figure 12, further, in the heat dissipation assembly composed of two groups of heat dissipation fins 3, a moving piece 33 that can move cyclically relative to the surface of the heat dissipation fin 3 is provided, and the moving pieces 33 are connected end to end, The surface of the heat dissipation fin 3 is fixedly connected with several sets of limit buttons 35, the moving piece 33 passes through the limit buttons 35, and circulates in the heat dissipation assembly, and the outside of the heat dissipation fin 3 is provided with a driving column 34. The moving piece 33 is sleeved on the surface of the driving column 34, and the driving column 34 rotates to drive the moving piece 33 to reciprocate.

The driving column 34 can be driven to rotate by a rotary drive device. The moving piece 33 can be a heat-conducting metal sheet, or it can be braided with copper wires. The driving column 34 can be kept at a certain distance from the cooling fins 3. The moving piece 33 can be arranged in sections and is not connected with The heat dissipation fins 3 are completely covered, and the driving column 34 itself can be set as an air-cooled water-cooled or heat-conducting metal rod body, so as to improve heat dissipation efficiency.

It should be noted that, when the chip heat sink is used, it has high bonding stability with the chip, and has good heat dissipation performance and high heat dissipation efficiency, which is convenient for popularization and use.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims (10)

1. A chip radiator, characterized in that, comprising, An application board (1), the application board (1) is attached to the surface of the chip and pressed tightly on the surface of the chip; The heat dissipation fins (3), the number of the heat dissipation fins (3) is several groups, and the heat dissipation fins (3) of several groups are arranged in parallel, and the heat dissipation fins (3) and the application plate (1) The upper surface connection; The heat dissipation column (5), the heat dissipation column (5) protrudes from the lower end surface of the cladding plate (1), and the heat dissipation column (5) is a telescopic heat dissipation column (5), the heat dissipation column (5) Pressing on the surface of the chip leaves a gap between the sticking board (1) and the supporting structure of the chip. 2. A chip heat sink according to claim 1, characterized in that: a placement groove (11) is opened on the lower end surface of the sticking board (1), and the heat dissipation column (5) is placed in the placement groove (11) ), and a spring piece (53) is also arranged in the placement groove (11), and the spring piece (53) is connected with the heat dissipation column (5). 3. A chip heat sink according to claim 2, characterized in that: the spring member (53) is connected to the limiting plate (52), and the surface of the cooling column (5) is provided with a limiting groove (51 ), the limiting piece (52) is inserted in the limiting groove (51). 4. A chip heat sink according to claim 3, characterized in that: the heat dissipation column (5) is provided with a through hole. 5. A chip heat sink according to any one of claims 1-4, characterized in that: the heat dissipation column (5) is a copper column, which is square or rectangular. 6. A chip heat sink according to claim 5, characterized in that: the basic fixing position (2) is arranged at a corner position of the sticking board (1). 7. A chip heat sink according to claim 6, characterized in that: press fastening positioning (4), said pressing fastening positioning (4) is set on the surface of the sticking plate (1), and is close to the heat dissipation The position of the post (5) cuts off the heat dissipation fins (3). 8. A chip heat sink according to claim 7, characterized in that: the basic fixing position (2) and the press fastening position (4) are both provided with screw holes (21), and the fastening parts are used to fix the Described sticking plate (1). 9. A chip heat sink according to claim 1, characterized in that: the upper end surfaces of several groups of the heat dissipation fins (3) all have the same gradual undulation, and the gradual undulation is the same or different continuous peaks and valleys . 10. The chip heat sink according to claim 9, characterized in that: the upper end surface of the heat dissipation fin (3) is provided with a slope (31).