CN116490745B - 三维测量系统 - Google Patents

三维测量系统

Info

Publication number
CN116490745B
CN116490745B CN202280007666.2A CN202280007666A CN116490745B CN 116490745 B CN116490745 B CN 116490745B CN 202280007666 A CN202280007666 A CN 202280007666A CN 116490745 B CN116490745 B CN 116490745B
Authority
CN
China
Prior art keywords
light
measurement
luminance
dimensional
receiving device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280007666.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN116490745A (zh
Inventor
桂正士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Wave Inc
Original Assignee
Denso Wave Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Wave Inc filed Critical Denso Wave Inc
Publication of CN116490745A publication Critical patent/CN116490745A/zh
Application granted granted Critical
Publication of CN116490745B publication Critical patent/CN116490745B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • G01B5/0004—Supports
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39543—Recognize object and plan hand shapes in grasping movements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40584—Camera, non-contact sensor mounted on wrist, indep from gripper
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45061—Measuring robot

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202280007666.2A 2021-02-24 2022-01-20 三维测量系统 Active CN116490745B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021027774 2021-02-24
JP2021-027774 2021-02-24
PCT/JP2022/001942 WO2022181128A1 (ja) 2021-02-24 2022-01-20 三次元計測システム

Publications (2)

Publication Number Publication Date
CN116490745A CN116490745A (zh) 2023-07-25
CN116490745B true CN116490745B (zh) 2026-01-02

Family

ID=83049082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280007666.2A Active CN116490745B (zh) 2021-02-24 2022-01-20 三维测量系统

Country Status (5)

Country Link
US (1) US12492892B2 (https=)
EP (1) EP4300035A4 (https=)
JP (1) JP7653039B2 (https=)
CN (1) CN116490745B (https=)
WO (1) WO2022181128A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003098120A (ja) * 2001-09-26 2003-04-03 Tokyo Weld Co Ltd 外観検査装置

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JPH0798213A (ja) * 1993-08-31 1995-04-11 Nippon Steel Corp 画像処理による対象物認識方法及び装置
JPH11251794A (ja) * 1998-03-02 1999-09-17 Sony Corp 電子部品実装機
JP3385579B2 (ja) 1998-08-18 2003-03-10 ダイハツ工業株式会社 黒色ワークの形状測定装置及び取出装置
JP4185604B2 (ja) * 1998-11-18 2008-11-26 株式会社日立製作所 試料解析方法、試料作成方法およびそのための装置
JP3063382U (ja) 1999-04-26 1999-10-29 株式会社アイアンドデイ 写真撮影装置に於ける背景体
JP4032603B2 (ja) * 2000-03-31 2008-01-16 コニカミノルタセンシング株式会社 ３次元計測装置
JP3600230B2 (ja) * 2003-02-21 2004-12-15 株式会社ファースト 建築および土木構造物計測・解析システム
US7359564B2 (en) * 2004-10-29 2008-04-15 Microsoft Corporation Method and system for cancellation of ambient light using light frequency
JP2007102718A (ja) 2005-10-07 2007-04-19 Saibuaasu:Kk 背景画像分離装置及び背景画像分離システム。
JP2008045883A (ja) * 2006-08-10 2008-02-28 I-Pulse Co Ltd 検査方法および検査装置
JP5252820B2 (ja) * 2007-03-27 2013-07-31 パナソニック株式会社 ３次元計測方法及びそれを用いた３次元形状計測装置
JP4872948B2 (ja) * 2008-02-27 2012-02-08 パルステック工業株式会社 ３次元形状測定装置および３次元形状測定方法
JP5633719B2 (ja) * 2009-09-18 2014-12-03 学校法人福岡工業大学 三次元情報計測装置および三次元情報計測方法
CN101865671B (zh) * 2010-06-03 2012-09-19 厦门思泰克光电科技有限公司 一种投影三维测量方法
KR101174676B1 (ko) * 2010-11-19 2012-08-17 주식회사 고영테크놀러지 표면형상 측정방법 및 측정장치
JP5588331B2 (ja) * 2010-12-09 2014-09-10 Ｊｕｋｉ株式会社 立体形状認識装置
JP5683002B2 (ja) * 2011-02-01 2015-03-11 Ｊｕｋｉオートメーションシステムズ株式会社 ３次元測定装置、３次元測定方法及びプログラム
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JP2014181995A (ja) * 2013-03-19 2014-09-29 3D Media Co Ltd 三次元形状計測装置
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JP2017138176A (ja) * 2016-02-03 2017-08-10 株式会社リコー 三次元情報取得システム、三次元情報取得方法及びピッキングシステム
JP6795993B2 (ja) * 2016-02-18 2020-12-02 株式会社ミツトヨ 形状測定システム、形状測定装置及び形状測定方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003098120A (ja) * 2001-09-26 2003-04-03 Tokyo Weld Co Ltd 外観検査装置

Also Published As

Publication number Publication date
EP4300035A1 (en) 2024-01-03
US12492892B2 (en) 2025-12-09
WO2022181128A1 (ja) 2022-09-01
JPWO2022181128A1 (https=) 2022-09-01
EP4300035A4 (en) 2024-08-07
JP7653039B2 (ja) 2025-03-28
CN116490745A (zh) 2023-07-25
US20240151518A1 (en) 2024-05-09

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