CN116481102A - Multifunctional semiconductor refrigerating device adopting water cooling circulation heat dissipation - Google Patents
Multifunctional semiconductor refrigerating device adopting water cooling circulation heat dissipation Download PDFInfo
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- CN116481102A CN116481102A CN202310470892.0A CN202310470892A CN116481102A CN 116481102 A CN116481102 A CN 116481102A CN 202310470892 A CN202310470892 A CN 202310470892A CN 116481102 A CN116481102 A CN 116481102A
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- water
- heat dissipation
- cooling
- semiconductor refrigeration
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 209
- 238000001816 cooling Methods 0.000 title claims abstract description 129
- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 87
- 238000005057 refrigeration Methods 0.000 claims abstract description 112
- 230000005494 condensation Effects 0.000 claims abstract description 46
- 238000009833 condensation Methods 0.000 claims abstract description 46
- 238000005192 partition Methods 0.000 claims description 16
- 238000009423 ventilation Methods 0.000 claims description 15
- 238000004321 preservation Methods 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 43
- 238000007791 dehumidification Methods 0.000 abstract description 29
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 230000005484 gravity Effects 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/24—Means for preventing or suppressing noise
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
- F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to the technical field of semiconductor refrigeration, in particular to a multifunctional semiconductor refrigeration device adopting water cooling circulation to dissipate heat. The utility model provides an adopt water-cooling circulation radiating multi-functional semiconductor refrigerating plant, includes the casing and set up in baffle, semiconductor refrigeration device, water-cooling circulation radiating component and the condensation subassembly in the casing, the baffle will space separation in the casing is cold junction wind channel and hot junction wind channel, semiconductor refrigeration device with water-cooling circulation radiating component all set up in the hot junction wind channel. The multifunctional semiconductor refrigerating device adopting the water cooling circulation heat dissipation can realize the cooling fan function and the dehumidification function in the same device, has good heat dissipation effect, effectively improves the cooling effect of the cooling fan function and the dehumidification amount of the dehumidification function, and solves the technical problem that the cooling effect or the dehumidification effect is poor as the cooling fan function and the dehumidification function and the heat dissipation effect are not simultaneously realized by the existing household appliance.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a multifunctional semiconductor refrigeration device adopting water cooling circulation to dissipate heat.
Background
With the improvement of life quality of people, various electric products in the home are more and more, meanwhile, most of urban commodity houses are compact houses, and a plurality of household appliances are placed in insufficient space, so that with the increasing number of the required household appliances, how to save the placement space of the household appliances becomes a great problem. With the rapid development of semiconductor refrigeration technology, the semiconductor refrigeration technology has entered into household electrical appliances in the field of daily life. However, in the current semiconductor refrigeration device, only a single cooling fan function or a dehumidification function can be realized, so that consumers need to purchase two household electrical appliances at the same time, the indoor storage space is occupied, in the existing product using semiconductor refrigeration, a heat dissipation mechanism usually adopts an aluminum profile radiator to be matched with a heat dissipation fan for heat dissipation, a semiconductor refrigeration device conducts heat to the aluminum profile radiator, the heat dissipation fan blows air to the radiator, the heat dissipation fan dissipates heat by utilizing an air channel formed by fins of the radiator, the heat dissipation effect is poor, and the refrigeration and cooling effect or the dehumidification effect is poor.
Disclosure of Invention
The invention aims to solve the problems of the prior art, and provides a multifunctional semiconductor refrigeration device adopting water cooling circulation heat dissipation, which can realize a cooling fan function and a dehumidification function in the same device, has good heat dissipation effect by adopting water cooling heat dissipation, effectively improves the refrigeration cooling effect during the cooling fan function and the dehumidification amount during the dehumidification function, and solves the technical problems that the existing household appliance cannot realize the cooling fan function, the dehumidification function and the heat dissipation effect simultaneously, so that the refrigeration cooling effect is poor or the dehumidification effect is poor.
To achieve the purpose, the invention adopts the following technical scheme:
the multifunctional semiconductor refrigeration device comprises a shell, a baffle plate, a semiconductor refrigeration device, a water-cooling circulation heat dissipation assembly and a condensation assembly, wherein the baffle plate, the semiconductor refrigeration device, the water-cooling circulation heat dissipation assembly and the condensation assembly are arranged in the shell;
the water cooling circulation heat dissipation assembly comprises a water cooling head, a heat dissipation water row, a water tank, a water pump and a heat dissipation fan, wherein the water cooling head, the heat dissipation water row, the water tank and the water pump are sequentially connected along the flowing direction of circulating water to form a closed circulation waterway, and the heat dissipation fan is arranged on one side of the heat dissipation water row;
the condensing assembly comprises a cold air fan, a condenser and a water receiving box, the cold air fan is arranged above the condenser, the water receiving box is arranged below the condenser, the cold end surface of the semiconductor refrigerating device is connected with the condenser, and the hot end surface of the semiconductor refrigerating device is connected with the water cooling head;
the shell is provided with a first air inlet and a first air outlet, the first air inlet is arranged corresponding to the lower part of the condenser, and the first air outlet is arranged corresponding to the air outlet end of the cold air fan.
Further stated, the water-cooling circulation heat dissipation assembly further comprises a plurality of connecting pipes, wherein the water outlet end of the water cooling head is connected with the water inlet end of the heat dissipation water drain, the water outlet end of the heat dissipation water drain is connected with the water inlet end of the water tank, the water outlet end of the water tank is connected with the water inlet end of the water pump, and the water outlet end of the water pump is connected with the water inlet end of the water cooling head through connecting pipes.
Further stated, the said body includes the first end cap and second end cap, the said first end cap encloses and closes with said second end cap to form and hold the holding cavity to hold said baffle, semiconductor refrigeration device, water-cooling cycle heat-dissipating component and condensation assembly;
the first end cover is provided with the first air inlet and the first air outlet, and the first air inlet is arranged below the first air outlet;
the second end cover is provided with a second air inlet and a second air outlet, the second air outlet is formed in the rear side wall of the second end cover, the left side wall and the right side wall of the second end cover are respectively provided with the second air inlet, the cooling fan corresponds to the second air outlet, and the cooling water row is arranged on one side, far away from the second air outlet, of the cooling fan.
Further stated, the said body includes the first end cap and second end cap, the said first end cap encloses and closes with said second end cap to form and hold the holding cavity to hold said baffle, semiconductor refrigeration device, water-cooling cycle heat-dissipating component and condensation assembly;
the first end cover is provided with the first air inlet and the first air outlet, and the first air inlet is arranged below the first air outlet;
the second end cover is provided with a second air inlet and a second air outlet, the second air outlet is formed in the top wall of the second end cover, the rear side wall, the left side wall and the right side wall of the second end cover are respectively provided with the second air inlet, the cooling fan corresponds to the second air outlet, and the cooling water is arranged on one side, far away from the second air outlet, of the cooling fan.
Further, the condenser comprises a plurality of condensing fins with lengths extending along the up-down direction, the plurality of condensing fins are arranged at intervals along the horizontal direction, a condensing channel is formed between two adjacent condensing fins, and the air inlet end of the cold air fan is positioned above the condensing channel;
the cold air fan is a cross-flow fan, and the heat radiation fan is an axial flow fan.
The refrigerator further comprises a cold guide device, wherein the cold guide device comprises a first heat-preserving gasket and a cold guide piece, the first heat-preserving gasket is provided with a first mounting through hole, the cold guide piece is clamped at the first mounting through hole, the partition plate is provided with a cold guide hole, and the first heat-preserving gasket is clamped at the cold guide hole;
the condenser also comprises a condensing plate, a plurality of condensing fins are arranged on the condensing plate at intervals, one end of the cold guide plate is connected with the cold end surface of the semiconductor refrigerating device, and the other end of the cold guide plate is connected with the condensing plate.
Still further illustrate, still include the second heat preservation gasket, the second heat preservation gasket set up in the baffle with between the water-cooling head, the second heat preservation gasket is equipped with the second installation opening, the semiconductor refrigeration device card is located the second installation opening, just the semiconductor refrigeration device corresponds the setting of cold mouth is led.
The semiconductor refrigeration device comprises a condensation plate, a first heat preservation gasket, a second heat preservation gasket, a semiconductor refrigeration device and a control module, wherein the condensation plate is provided with a mounting hole, the condensation plate is provided with an avoidance cavity for avoiding the temperature sensor, one end of the temperature sensor is connected with the first heat preservation gasket, the other end of the temperature sensor is inserted into the avoidance cavity after passing through the mounting hole, and the semiconductor refrigeration device and the temperature sensor are respectively electrically connected with the control module;
the baffle includes vertical portion and kink, the kink set up in the top of vertical portion, the kink with vertical portion looks perpendicular setting, cold wind fan install in the lower terminal surface of kink, control module install in the up end of kink.
Further stated, the water receiving box comprises a box cover and a box body, the box cover is arranged on the upper end face of the box body, a water collecting groove which is sunken downwards is arranged on the upper end face of the box cover, and a water discharging opening is formed in the position, corresponding to the water collecting groove, of the box cover in a penetrating mode.
Still further illustrate, still include the wind channel baffle, the wind channel baffle encloses to be located the outside of condenser, just the wind channel baffle extends to the air inlet end of cold wind fan, be provided with the ventilation wind channel in the wind channel baffle, the vent has been seted up to the wind channel baffle, the vent with the ventilation wind channel is linked together, the vent corresponds the setting of first air intake.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. through setting up semiconductor refrigeration device, water-cooling circulation radiator unit and condensation subassembly, cold wind fan sets up in the top of condenser, adopts the structure of induced drafting from bottom to top, and when using the thermantidote function, cold wind fan induced drafts from bottom to top, and wind is inhaled from first air intake, then through the condenser after being refrigerated by semiconductor refrigeration device, blows out cold wind from first air outlet through cold wind fan at last, realizes the cooling to the people. When the dehumidification function is used, the cold air fan sucks external high-temperature and high-humidity gas from the first air inlet, the condenser after the high-temperature and high-humidity gas is refrigerated generates condensed water, the condensed water is collected into the water receiving box under the action of gravity, and dehumidified dry gas is blown out from the first air outlet through the cold air fan and returns to the external air. Can realize thermantidote function and dehumidification function in same device, and the cold wind that blows out cooling effect is good, and is effectual to the condensation dehumidification of high temperature high humidity gas, has solved the technical problem that current household electrical appliances can't realize thermantidote function and dehumidification function simultaneously.
2. Through adopting water cooling heat dissipation, radiating efficiency is high, can take away the heat fast, under the condition of the same electric power, adopt the water cooling circulation heat dissipation to beat than the refrigerating output that directly adopts radiator to add radiator fan heat radiation structure, simultaneously because water cooling radiating effect is good for semiconductor refrigeration device's hot junction temperature is low, can realize bigger refrigerating output through increasing semiconductor refrigeration device's power or increasing semiconductor refrigeration device's quantity, realize bigger refrigerating output and refrigerating efficiency at less product size, the refrigeration cooling effect when effectively promoting the thermalization fan function and the dehumidification volume when dehumidification function. In addition, through setting up radiator fan, radiator fan is used for dispelling the heat to the heat dissipation water row for in confined circulation water route, the heat can be constantly taken away, and need not constantly supply the running water that the temperature is lower, has effectively avoided the temperature in the circulation water route to be higher and higher, has practiced thrift the water consumption.
3. Through with cold wind fan set up in the top of condenser, adopt the structure of induced drafting from bottom to top, effectively avoided the comdenstion water on the condenser to get into cold wind fan's problem, guarantee cold wind fan's normal operating to guarantee multi-functional semiconductor refrigerating plant's normal operating.
4. Through setting up the baffle, the baffle is cold junction wind channel and hot junction wind channel with the space separation in the casing, and independent wind channel structure makes the heat that the hot junction of semiconductor refrigeration device gives off can not influence the work of the condensation subassembly in the cold junction wind channel, guarantees the refrigeration effect of semiconductor refrigeration device to the condenser to and the effect that the condenser carries out the cooling to external inspiratory wind for under the effect of cold wind fan, the cooling effect of the cold wind that blows out from first air outlet is better.
Drawings
Fig. 1 is a schematic perspective view of a multifunctional semiconductor refrigeration device employing water-cooling circulation heat dissipation according to an embodiment of the present invention;
fig. 2 is a schematic perspective view (with a housing removed) of a multifunctional semiconductor refrigeration device employing water-cooled circulation heat dissipation according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a multi-functional semiconductor refrigeration device employing water-cooled circulating heat dissipation according to an embodiment of the present invention (with the housing and the air duct baffles removed);
fig. 4 is a schematic perspective view of a multifunctional semiconductor refrigeration device employing water-cooled circulation heat dissipation according to an embodiment of the present invention (excluding a case and a wind channel barrier);
fig. 5 is an exploded view (with connection pipes removed) of a multifunctional semiconductor refrigeration device employing water-cooled circulation heat dissipation according to an embodiment of the present invention;
fig. 6 is an exploded view (with connection pipes removed) of a multifunctional semiconductor refrigeration device employing water-cooled circulation heat dissipation according to an embodiment of the present invention;
fig. 7 is a schematic perspective view of a multifunctional semiconductor refrigeration device using water-cooling circulation heat dissipation according to another embodiment of the present invention;
fig. 8 is a schematic perspective view of a multifunctional semiconductor refrigeration device using water-cooled circulation heat dissipation according to another embodiment of the present invention (excluding a case and a wind channel barrier);
in the accompanying drawings: the air conditioner comprises a shell 1, a cold-end air duct 11, a hot-end air duct 12, a first end cover 13, a first air inlet 131, a first air outlet 132, a third mounting port 133, a fourth mounting port 134, a second end cover 14, a second air inlet 141, a second air outlet 142, a partition plate 2, a cold-guide port 21, a vertical part 22, a bending part 23, a semiconductor refrigeration device 3, a water-cooling circulation heat dissipation assembly 4, a water-cooling head 41, a heat-dissipating water row 42, a water tank 43, a water pump 44, a heat-dissipating fan 45, a connecting pipe 46, a condensation assembly 5, a cold-air fan 51, a condenser 52, a condensation fin 521, a condensation channel 522, a condensation plate 523, a mounting hole 5231, a water receiving box 53, a box cover 531, a water collecting tank 5311, a water drain 5312, a box 532, a cold-guide 6, a first heat-preserving gasket 61, a first mounting port 611, a cold-guide plate 62, a second heat-preserving gasket 7, a second mounting port 71, a temperature sensor 8, a control module 9, a baffle 10, an air duct 101, and a ventilation opening 102.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly, for distinguishing between the descriptive features, and not sequentially, and not lightly.
As shown in fig. 1 to 6, a multifunctional semiconductor refrigeration device adopting water-cooling circulation heat dissipation comprises a shell 1, a baffle plate 2, a semiconductor refrigeration device 3, a water-cooling circulation heat dissipation component 4 and a condensation component 5, wherein the baffle plate 2 is arranged in the shell 1, the space in the shell 1 is divided into a cold end air channel 11 and a hot end air channel 12 by the baffle plate 2, the semiconductor refrigeration device 3 and the water-cooling circulation heat dissipation component 4 are both arranged in the hot end air channel 12, and the condensation component 5 is arranged in the cold end air channel 11;
the water-cooling circulation heat dissipation assembly 4 comprises a water cooling head 41, a heat dissipation water row 42, a water tank 43, a water pump 44 and a heat dissipation fan 45, wherein the water cooling head 41, the heat dissipation water row 42, the water tank 43 and the water pump 44 are sequentially connected along the flowing direction of circulating water to form a closed circulation water path, and the heat dissipation fan 45 is arranged at one side of the heat dissipation water row 42;
the condensation assembly 5 comprises a cold air fan 51, a condenser 52 and a water receiving box 53, wherein the cold air fan 51 is arranged above the condenser 52, the water receiving box 53 is arranged below the condenser 52, a cold end face of the semiconductor refrigeration device 3 is connected with the condenser 52, and a hot end face of the semiconductor refrigeration device 3 is connected with the water cooling head 41;
the casing 1 is provided with a first air inlet 131 and a first air outlet 132, the first air inlet 131 is arranged corresponding to the lower part of the condenser 52, and the first air outlet 132 is arranged corresponding to the air outlet end of the cold air fan 51.
The working principle of the invention is as follows: through setting up semiconductor refrigeration device 3, water-cooling circulation radiator unit 4 and condensation subassembly 5, cold wind fan 51 set up in the top of condenser 52 adopts the structure of induced drafting from bottom to top, when using the thermantidote function, cold wind fan 51 induced drafts from bottom to top, and the wind is followed first air intake 131 is inhaled, then passes through by the semiconductor refrigeration device 3 after the condenser 52, finally passes through cold wind fan 51 is followed first air outlet 132 blows out, realizes the cooling to the people. When the dehumidification function is used, the cold air fan 51 sucks the external high temperature and high humidity gas from the first air inlet 131, the condenser 52 after the high temperature and high humidity gas is cooled generates condensed water, the condensed water is collected into the water receiving box 53 under the action of gravity, and the dehumidified dry gas is blown out from the first air outlet 132 back into the external air through the cold air fan 51.
According to the invention, the water cooling head 41, the radiating water row 42, the water tank 43 and the water pump 44 are sequentially connected to form a closed circulating water path, heat is generated after the semiconductor refrigerating device 3 is electrified, the water pump 44 works, the whole closed circulating water path operates, the heat of the semiconductor refrigerating device 3 is firstly conducted to the water cooling head 41 and then is quickly conducted to the radiating water row 42 through circulating water, and if the heat is not radiated, the water temperature of the circulating water path is higher and higher, so that the radiating fan 45 is arranged at one side of the radiating water row 42, the heat transported to the radiating water row 42 is blown away through the radiating fan 45, the cooled circulating water enters the water tank 43, and the cooled water is pumped into the water cooling head 41 under the action of the water pump 44 to continuously take away the heat of the hot end face of the semiconductor refrigerating device 3. The invention utilizes the advantages of high water cooling heat dissipation efficiency and capability of rapidly taking away heat, under the condition of the same electric power, the refrigeration capacity of adopting water cooling circulation heat dissipation is larger than that of adopting a heat dissipation structure of a radiator and a heat dissipation fan directly, meanwhile, the temperature of the hot end of the semiconductor refrigeration device 3 is low due to good water cooling heat dissipation effect, larger refrigeration capacity can be realized by increasing the power of the semiconductor refrigeration device 3 or the number of the semiconductor refrigeration devices, larger refrigeration capacity and refrigeration efficiency can be realized in smaller product size, and the refrigeration cooling effect in the function of the cooling fan and the dehumidification capacity in the function of dehumidification can be effectively improved. In addition, through setting up radiator fan 45, radiator fan 45 is used for to the heat dissipation is arranged 42 to the heat dissipation water for in closed circulation water route, the heat can be taken away constantly, and need not constantly to supplement the lower running water of temperature, has effectively avoided the temperature in the circulation water route to be higher and higher, has practiced thrift the water consumption.
It should be noted that, in the multifunctional semiconductor refrigeration device, the cold air fan 51 is disposed above the condenser 52, and a bottom-up air suction structure is adopted, so that the problem that condensed water on the condenser 52 enters the cold air fan 51 is effectively avoided, and the normal operation of the cold air fan 51 is ensured.
Further, by setting the partition plate 2, the space in the shell 1 is divided into the cold end air duct 11 and the hot end air duct 12 by the partition plate 2, the independent air duct structure ensures that the heat emitted by the hot end of the semiconductor refrigeration device 3 does not affect the work of the condensation component 5 in the cold end air duct 11, the refrigeration effect of the semiconductor refrigeration device 3 on the condenser 52 is ensured, and the cooling effect of the condenser 52 on the outside inhaled air is ensured, so that the cooling effect of the cold air blown from the first air outlet 132 is better under the action of the cold air fan 51.
The multifunctional semiconductor refrigerating device adopting the water cooling circulation heat dissipation can realize the cooling fan function and the dehumidification function in the same device, adopts the water cooling heat dissipation, has good heat dissipation effect, effectively improves the cooling effect of the cooling fan function and the dehumidification amount of the dehumidification function, and solves the technical problem that the cooling effect or the dehumidification effect is poor due to the fact that the cooling fan function and the dehumidification function and the heat dissipation effect are not simultaneously realized by the existing household appliance.
To further illustrate, the water-cooling circulation heat dissipation assembly 4 further includes a plurality of connection pipes 46, wherein the water outlet end of the water-cooling head 41 is connected with the water inlet end of the heat dissipation water row 42, the water outlet end of the heat dissipation water row 42 is connected with the water inlet end of the water tank 43, the water outlet end of the water tank 43 is connected with the water inlet end of the water pump 44, and the water outlet end of the water pump 44 is connected with the water inlet end of the water-cooling head 41 through the connection pipes 46.
The water cooling head 41, the radiating water row 42, the water tank 43 and the water pump 44 are sequentially connected along the flowing direction of circulating water through the connecting pipe 46 to form a closed circulating water path, so that the closed circulation of the circulating water in the water cooling head 41, the radiating water row 42, the water tank 43 and the water pump 44 is realized, after the heat of the semiconductor refrigerating device 3 is conducted to the water cooling head 41, the heat is quickly transferred to the radiating water row 42 through the circulating water, and then the radiating water row 42 is radiated through the radiating fan 45, so that the radiating efficiency is high.
Specifically, the water cooling heads 41 and the heat dissipating water rows 42 are respectively provided with a water channel, and the heat dissipating water rows 42 have two ports for water to flow in and out, so that water channel circulation is realized.
As shown in fig. 1, 4 and 6, in one embodiment of the present invention, the housing 1 includes a first end cap 13 and a second end cap 14, and the first end cap 13 and the second end cap 14 enclose a containing cavity that contains the partition plate 2, the semiconductor refrigeration device 3, the water-cooled circulation heat dissipation assembly 4 and the condensation assembly 5;
the first end cover 13 is provided with the first air inlet 131 and the first air outlet 132, and the first air inlet 131 is arranged below the first air outlet 132;
the second end cover 14 is provided with a second air inlet 141 and a second air outlet 142, the second air outlet 142 is arranged on the rear side wall of the second end cover 14, the left side wall and the right side wall of the second end cover 14 are respectively provided with the second air inlet 141, the cooling fan 45 is arranged corresponding to the second air outlet 142, and the cooling water row 42 is arranged on one side, far away from the second air outlet 142, of the cooling fan 45.
In this embodiment, the cold air fan 51 adopts a bottom-up air suction structure, the first air inlet 131 is disposed below the first air outlet 132, the hot end air duct 12 is air-intake from both sides and air-exhaust from the back, because the water-cooling circulation is adopted to dissipate heat, the temperature of the hot end of the semiconductor refrigeration device 3 is lower when the cooling fan 45 sucks air (i.e. when absorbing the heat of the cooling water drain 42), and the temperature of the hot end of the semiconductor refrigeration device 3 is relatively higher when the cooling fan 45 blows air (i.e. when blowing the heat of the cooling water drain 42), so that the air is sucked from both sides, passes through the cooling water drain 42, and is blown out from the back (back).
As shown in fig. 7 and 8, in another embodiment of the present invention, the housing 1 includes a first end cap 13 and a second end cap 14, and the first end cap 13 and the second end cap 14 enclose a containing cavity that contains the partition plate 2, the semiconductor refrigeration device 3, the water-cooling circulation heat dissipation assembly 4 and the condensation assembly 5;
the first end cover 13 is provided with the first air inlet 131 and the first air outlet 132, and the first air inlet 131 is arranged below the first air outlet 132;
the second end cover 14 is provided with a second air inlet 141 and a second air outlet 142, the second air outlet 142 is arranged on the top wall of the second end cover 14, the second air inlet 141 is respectively arranged on the rear side wall, the left side wall and the right side wall of the second end cover 14, the cooling fan 45 is arranged corresponding to the second air outlet 142, and the cooling water row 42 is arranged on one side, far away from the second air outlet 142, of the cooling fan 45.
If the second air inlet 141 and the second air outlet 142 are both on the back and the side, two pain points exist: 1. if the air outlet is on the side surface, people on the side are easily affected after hot air is blown out; 2. if the air outlet is at the back (back), the air outlet or the air inlet is easy to be blocked when the product is placed against the wall, and the product cannot dissipate heat. In this embodiment, the cold air fan 51 adopts a bottom-up air suction structure, the first air inlet 131 is disposed below the first air outlet 132, the second air outlet 142 is disposed at the top of the second end cover 14, the second air inlet 141 is disposed on the rear side wall and the left and right side walls of the second end cover 14, and at this time, the hot end air duct 12 is air-in from two sides to three directions (back) and air-out from the top, thereby not only solving the two pain points well, but also satisfying thermodynamics and improving the heat dissipation efficiency again.
Preferably, the condenser 52 includes a plurality of condensing fins 521 having lengths extending in an up-down direction, the plurality of condensing fins 521 are arranged at intervals in a horizontal direction, a condensing channel 522 is formed between two adjacent condensing fins 521, and an air inlet end of the cold air fan 51 is located above the condensing channel 522;
the cool air fan 51 is a cross flow fan, and the heat radiation fan 45 is an axial flow fan.
By arranging the condensation fins 521, since the length of the condensation fins 521 extends in the vertical direction, the first air inlet 131 is arranged corresponding to the lower part of the condenser 52, when the cooling fan function is used, the cooling fan 51 sucks air from bottom to top, external hot air flows upward from the lower part of the condensation channel 522, cooling of the hot air is realized, when the dehumidifying function is used, high-temperature and high-humidity air flows upward from the lower part of the condensation channel 522, condensed water is generated on the condensation fins 21 after cooling, the condensed water drops down into the water receiving box 53 under the action of gravity, and the dried air is blown out from the first air outlet 132 under the action of the cooling fan 51 and returns to the external air. The plurality of condensation channels 522 can effectively increase the contact area between the condenser 52 and the high-temperature and high-humidity gas, and improve the condensation efficiency.
Preferably, the cold air fan 51 is a through-flow fan, so that the cooled cold air can be blown out from the first air outlet 132 while the air suction from bottom to top can be realized, and the heat dissipation fan 45 is an axial-flow fan, so that the forced heat dissipation effect on the heat dissipation water row 42 is good.
Preferably, the lower end surface of the condensing fin 521 is disposed obliquely downward from an end near the partition plate 2 to an end far from the partition plate 2. By arranging the lower end surfaces of the condensation fins 521 obliquely downwards, condensed water on all the condensation fins 521 can be condensed to the sharp corner positions at the bottom ends of the condensation fins 21, water drops are formed rapidly, the water drop forming and dropping speeds are increased, the condensation speed of each condensation fin 521 is increased, and the dehumidifying capacity is improved; in addition, all the condensed water on the condensing fins 21 can be condensed to the sharp corner positions at the bottom ends of the condensing fins 521, which is beneficial to the condensed water to be collected and fall into the water receiving box 53, so as to ensure the collection effect of the condensed water.
Further, the refrigerator further comprises a cold guide 6, the cold guide 6 comprises a first heat-preserving gasket 61 and a cold guide piece 62, the first heat-preserving gasket 61 is provided with a first mounting through hole 611, the cold guide piece 62 is clamped in the first mounting through hole 611, the partition plate 2 is provided with a cold guide hole 21, and the first heat-preserving gasket 61 is clamped in the cold guide hole 21;
the condenser 52 further includes a condensing plate 523, a plurality of condensing fins 521 are arranged on the condensing plate 523 at intervals, one end of the cold guide plate 62 is connected with the cold end surface of the semiconductor refrigeration device 3, and the other end of the cold guide plate 62 is connected with the condensing plate 523.
By providing the cold guide plate 62, the cold guide plate 62 can rapidly transfer the cold of the semiconductor refrigeration device 3 to the condensing plate 523 and then transfer the cold to the respective condensing fins 521 through the condensing plate 523. Further, the first heat-preserving pad 61 is made of a sponge material, the cold-conducting port 21 is provided to fix the first heat-preserving pad 61, the first heat-preserving pad 61 is provided to fix the cold-conducting sheet 62, and the heat-preserving effect is achieved to prevent the cold of the cold-conducting sheet 62 from being lost, so that the cold is effectively transferred to the condenser 52. Specifically, the condensing plate 523 and the condensing fins 521 are aluminum profiles, so as to facilitate cold energy conduction.
Further, the semiconductor refrigerator further comprises a second heat insulation gasket 7, the second heat insulation gasket 7 is arranged between the partition board 2 and the water cooling head 41, the second heat insulation gasket 7 is provided with a second mounting through hole 71, the semiconductor refrigerator 3 is clamped in the second mounting through hole 71, and the semiconductor refrigerator 3 is arranged corresponding to the cold guiding hole 21.
Specifically, the second heat preservation gasket 7 uses the sponge material to make, through setting up the second heat preservation gasket 7, realizes the installation of semiconductor refrigeration device 3 is fixed, and can play thermal-insulated effect, avoids the cold volume of semiconductor refrigeration device 3 is lost, guarantees the refrigeration effect of semiconductor refrigeration device 3, further guarantees to the cooling effect of condenser 52. In addition, by arranging the semiconductor refrigeration device 3 corresponding to the cold guide opening 21, the cold end surface of the semiconductor refrigeration device 3 can be connected with the cold guide plate 62 through the cold guide opening 21, and only the cold guide opening 21 is arranged between the cold end air duct 11 and the hot end air duct 12 for cold energy conduction, so that the influence of heat emitted by the semiconductor refrigeration device 3 on the cooling and dehumidifying effects in the cold end air duct 11 is effectively avoided.
Further, one or more semiconductor refrigeration devices 3 may be provided, in the present invention, because the water cooling and heat dissipation effects are good, the temperature of the hot end of the semiconductor refrigeration device 3 is low, and by increasing the number of the semiconductor refrigeration devices 3, a larger refrigeration capacity can be achieved, so that the refrigeration cooling effect during the cooling fan function and the dehumidification capacity during the dehumidification function are effectively improved, and in this embodiment, two semiconductor refrigeration devices 3 are provided, so that the refrigeration effect is effectively ensured.
Further, the semiconductor refrigeration device further comprises a temperature sensor 8 and a control module 9, wherein the condensation plate 523 is provided with a mounting hole 5231, the condensation fin 521 is provided with an avoidance cavity for avoiding the temperature sensor 8, one end of the temperature sensor 8 is connected with the first heat-preserving gasket 61, the other end of the temperature sensor 8 is inserted into the avoidance cavity after passing through the mounting hole 5231, and the semiconductor refrigeration device 3 and the temperature sensor 8 are respectively electrically connected with the control module 9;
the partition plate 2 comprises a vertical portion 22 and a bending portion 23, the bending portion 23 is arranged at the top of the vertical portion 22, the bending portion 23 is perpendicular to the vertical portion 22, the cold air fan 51 is mounted on the lower end face of the bending portion 22, and the control module 9 is mounted on the upper end face of the bending portion 23.
By providing the temperature sensor 8, the temperature sensor 8 can monitor the temperature of the condenser 52 at the cold end in real time. For a multifunctional semiconductor refrigeration device with only one semiconductor refrigeration device 3, the control module 9 can adjust the power of the semiconductor refrigeration device 3 according to the cold end temperature monitored by the temperature sensor 8, and for a multifunctional semiconductor refrigeration device with a plurality of semiconductor refrigeration devices 3, the semiconductor refrigeration devices 3 can be controlled in groups, for example, according to the actual refrigeration capacity requirement, the semiconductor refrigeration devices with corresponding quantity can be started to work, and the adjustment range of the refrigeration capacity is improved. In fact, an external temperature sensor can be further arranged to detect external environment temperature, a communication networking module can be further arranged in the control module 9, external environment temperature data acquired by the external temperature sensor are acquired through the communication networking module, then based on the condensation principle (namely that effective condensation can be achieved after a certain temperature difference is achieved), the temperature difference between the external environment temperature and the cold end temperature is calculated, whether the calculated temperature difference and the theoretical temperature difference are in an allowable error range or not is calculated, the target cold end temperature is further determined, and the power of the semiconductor refrigeration device 3 is adjusted, so that the actual cold end temperature reaches the target cold end temperature, and then the refrigeration cold air temperature adjustment and the efficient condensation dehumidification effect are achieved. Further, the partition board 2 can surround the cold-end air duct 11 by arranging the vertical portion 22 and the bending portion 23, so that the cold-air fan 51 is convenient to install.
To further illustrate, the first end cover 13 is provided with a third mounting opening 133, the control module 9 is clamped in the third mounting opening 133, and the control module 9 may be provided with an operation screen for a user to perform a function selection operation.
Further, the water receiving box 53 includes a box cover 531 and a box body 532, the box cover 531 is disposed on an upper end surface of the box body 532, a water collecting groove 5311 recessed downward is disposed on the upper end surface of the box cover 531, and a water outlet 5312 is formed in the box cover 531 corresponding to the water collecting groove 5311.
Through setting up lid 531 with box body 532 condensed water on the condenser 52 drops under the effect of gravity to the up end of lid 531, and gather and follow under the effect of water trap 5311 in the lower mouth of a river 5312 gets into in the box body 532, the box body 532 can collect the comdenstion water, and avoids the comdenstion water reentrant air in, water trap 5311 can assemble the comdenstion water, avoid the comdenstion water to follow the upper surface of lid 531 drops to the outside of water receiver 53 guarantees multi-functional semiconductor refrigerating plant's normal work.
Preferably, the sharp angle formed by the downward inclination of the lower end surface of the condensation fin 521 is located right above the water collecting tank 5311, the water collecting tank 5311 is elliptical, so that the condensed water can be conveniently collected, and the box 532 is a drawer type box, so that the condensed water in the box 532 can be conveniently drawn and cleaned in time.
Further, the first end cover 13 is provided with a fourth mounting opening 134, and the water receiving box 53 is clamped in the fourth mounting opening 134, so that the water receiving box 53 can be conveniently drawn out for condensate water treatment.
Further, the air duct baffle 10 is disposed around the condenser 52, the air duct baffle 10 extends to the air inlet end of the cold air fan 51, a ventilation air duct 101 is disposed in the air duct baffle 10, a ventilation opening 102 is disposed in the air duct baffle 10, the ventilation opening 102 is communicated with the ventilation air duct 101, and the ventilation opening 102 is disposed corresponding to the first air inlet 141.
Through setting up the wind channel baffle 10, wind channel baffle 10 encloses and locates the outside of condenser 52, makes follow the wind that first air intake 131 got into through vent 102 gets into in the ventilation duct 101, through become cold wind after the condenser 52, at last follow the air inlet end of cold wind fan 51 gets into and follows first air outlet 132 discharges, wind channel baffle 10 can form relatively independent ventilation duct 101 makes the wind energy that gets into first air intake 131 can concentrate the condenser 52 department and cool down condensation treatment, effectively improves cooling condensation efficiency.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (10)
1. The multifunctional semiconductor refrigeration device is characterized by comprising a shell, a baffle plate, a semiconductor refrigeration device, a water-cooling circulation heat dissipation assembly and a condensation assembly, wherein the baffle plate, the semiconductor refrigeration device, the water-cooling circulation heat dissipation assembly and the condensation assembly are arranged in the shell;
the water cooling circulation heat dissipation assembly comprises a water cooling head, a heat dissipation water row, a water tank, a water pump and a heat dissipation fan, wherein the water cooling head, the heat dissipation water row, the water tank and the water pump are sequentially connected along the flowing direction of circulating water to form a closed circulation waterway, and the heat dissipation fan is arranged on one side of the heat dissipation water row;
the condensing assembly comprises a cold air fan, a condenser and a water receiving box, the cold air fan is arranged above the condenser, the water receiving box is arranged below the condenser, the cold end surface of the semiconductor refrigerating device is connected with the condenser, and the hot end surface of the semiconductor refrigerating device is connected with the water cooling head;
the shell is provided with a first air inlet and a first air outlet, the first air inlet is arranged corresponding to the lower part of the condenser, and the first air outlet is arranged corresponding to the air outlet end of the cold air fan.
2. The multifunctional semiconductor refrigeration device adopting water-cooling circulation heat dissipation according to claim 1, wherein the water-cooling circulation heat dissipation assembly further comprises a plurality of connecting pipes, and the water outlet end of the water-cooling head is connected with the water inlet end of the heat dissipation water row, the water outlet end of the heat dissipation water row is connected with the water inlet end of the water tank, the water outlet end of the water tank is connected with the water inlet end of the water pump, and the water outlet end of the water pump is connected with the water inlet end of the water-cooling head through the connecting pipes.
3. The multifunctional semiconductor refrigeration device adopting water-cooling circulation heat dissipation according to claim 1, wherein the shell comprises a first end cover and a second end cover, and the first end cover and the second end cover are enclosed to form a containing cavity for containing the partition plate, the semiconductor refrigeration device, the water-cooling circulation heat dissipation component and the condensation component;
the first end cover is provided with the first air inlet and the first air outlet, and the first air inlet is arranged below the first air outlet;
the second end cover is provided with a second air inlet and a second air outlet, the second air outlet is formed in the rear side wall of the second end cover, the left side wall and the right side wall of the second end cover are respectively provided with the second air inlet, the cooling fan corresponds to the second air outlet, and the cooling water row is arranged on one side, far away from the second air outlet, of the cooling fan.
4. The multifunctional semiconductor refrigeration device adopting water-cooling circulation heat dissipation according to claim 1, wherein the shell comprises a first end cover and a second end cover, and the first end cover and the second end cover are enclosed to form a containing cavity for containing the partition plate, the semiconductor refrigeration device, the water-cooling circulation heat dissipation component and the condensation component;
the first end cover is provided with the first air inlet and the first air outlet, and the first air inlet is arranged below the first air outlet;
the second end cover is provided with a second air inlet and a second air outlet, the second air outlet is formed in the top wall of the second end cover, the rear side wall, the left side wall and the right side wall of the second end cover are respectively provided with the second air inlet, the cooling fan corresponds to the second air outlet, and the cooling water is arranged on one side, far away from the second air outlet, of the cooling fan.
5. The multifunctional semiconductor refrigeration device adopting water cooling circulation to dissipate heat according to claim 1, wherein the condenser comprises a plurality of condensing fins with lengths extending in the up-down direction, the plurality of condensing fins are arranged at intervals in the horizontal direction, a condensing channel is formed between two adjacent condensing fins, and an air inlet end of the cold air fan is positioned above the condensing channel;
the cold air fan is a cross-flow fan, and the heat radiation fan is an axial flow fan.
6. The multifunctional semiconductor refrigeration device adopting water-cooling circulation heat dissipation according to claim 5, further comprising a cold guide device, wherein the cold guide device comprises a first heat preservation gasket and a cold guide piece, the first heat preservation gasket is provided with a first installation through hole, the cold guide piece is clamped in the first installation through hole, the partition plate is provided with a cold guide hole, and the first heat preservation gasket is clamped in the cold guide hole;
the condenser also comprises a condensing plate, a plurality of condensing fins are arranged on the condensing plate at intervals, one end of the cold guide plate is connected with the cold end surface of the semiconductor refrigerating device, and the other end of the cold guide plate is connected with the condensing plate.
7. The multifunctional semiconductor refrigeration device adopting water cooling circulation to dissipate heat according to claim 6, further comprising a second heat insulation gasket, wherein the second heat insulation gasket is arranged between the partition plate and the water cooling head, the second heat insulation gasket is provided with a second mounting through hole, the semiconductor refrigeration device is clamped in the second mounting through hole, and the semiconductor refrigeration device is arranged corresponding to the cold guide hole.
8. The multifunctional semiconductor refrigeration device adopting water cooling circulation heat dissipation according to claim 6, further comprising a temperature sensor and a control module, wherein the condensing plate is provided with a mounting hole, the condensing fin is provided with an avoidance cavity for avoiding the temperature sensor, one end of the temperature sensor is connected with the first heat preservation gasket, the other end of the temperature sensor is inserted into the avoidance cavity after being inserted through the mounting hole, and the semiconductor refrigeration device and the temperature sensor are respectively electrically connected with the control module;
the baffle includes vertical portion and kink, the kink set up in the top of vertical portion, the kink with vertical portion looks perpendicular setting, cold wind fan install in the lower terminal surface of kink, control module install in the up end of kink.
9. The multifunctional semiconductor refrigeration device adopting water cooling circulation to dissipate heat according to claim 1, wherein the water receiving box comprises a box cover and a box body, the box cover is arranged on the upper end face of the box body, a water collecting groove which is sunken downwards is arranged on the upper end face of the box cover, and a water outlet is formed in the position, corresponding to the water collecting groove, of the box cover in a penetrating mode.
10. The multifunctional semiconductor refrigeration device adopting water cooling circulation heat dissipation according to claim 1, further comprising an air duct baffle, wherein the air duct baffle is arranged outside the condenser in a surrounding mode, the air duct baffle extends to an air inlet end of the cold air fan, a ventilation air duct is arranged in the air duct baffle, a ventilation opening is formed in the air duct baffle, the ventilation opening is communicated with the ventilation air duct, and the ventilation opening is arranged corresponding to the first air inlet.
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| CN202310470892.0A CN116481102A (en) | 2023-04-27 | 2023-04-27 | Multifunctional semiconductor refrigerating device adopting water cooling circulation heat dissipation |
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| CN202310470892.0A CN116481102A (en) | 2023-04-27 | 2023-04-27 | Multifunctional semiconductor refrigerating device adopting water cooling circulation heat dissipation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116481101A (en) * | 2023-04-27 | 2023-07-25 | 广东富信科技股份有限公司 | A multifunctional semiconductor refrigeration device with efficient heat dissipation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116481101A (en) * | 2023-04-27 | 2023-07-25 | 广东富信科技股份有限公司 | A multifunctional semiconductor refrigeration device with efficient heat dissipation |
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